Abstract: A laser microscope is provided which includes a laser light source, a first optical fiber through which the ultrashort pulse laser light propagates while being positively chirped, a negative dispersion optical system that negatively chirps this propagated laser light, a second optical fiber through which the laser light that has passed through the negative dispersion optical system propagates while being positively chirped, a microscope body that further positively chirps this propagated laser light and irradiates a specimen with the resultant non-chirped ultrashort pulse laser light. The negative dispersion optical system includes a negative dispersion adjuster that adjusts the amount of negative dispersion according to the change in wavelength of the ultrashort pulse laser light outputted from the laser light source or the change in the amount of positive dispersion in the microscope body.

Abstract: A photonic connection includes a first fiber and a second fiber. The first fiber has a core with a first predetermined pattern defined on or in a facet thereof, and the second fiber has a core with a second predetermined pattern defined on or in a facet thereof. The second predetermined pattern is complementary to the first predetermined pattern such that the first fiber or the second fiber fits into another of the second fiber or the first fiber at a single orientation and position.

Abstract: Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.

Abstract: An integrated optical waveguide circuit apparatus having an optical processing area, waveguide ports for optical processing, and at least one waveguide structure, the at least one waveguide structure going around the optical processing area. Methods for making the integrated optical waveguide circuit apparatus are also disclosed.

Abstract: In a system and method, the emitted beams of multiple diode bar array assemblies are combined to achieve an increase in the resulting power density in the combined output beam, while addressing the need for heat distribution in each of the individual assemblies. The present invention enables the combination of output planes of illumination, to form a single, merged beam of area Ag having intensity IM˜M*Istack and brightness BM˜M*Bstack, where Istack and Bstack refer respectively to the intensity and brightness of the output plane of illumination of a single stacked array, and where IM and BM refer respectively to the intensity and brightness of the combined output plane of illumination of M stacked arrays. In this manner, the present invention is useful in applications where there is a need for high-intensity, high-brightness light energy.

Abstract: Provided is a silicon photonics chip that is thermally separated from a light emitting device. The silicon photonics chip includes photoelectric devices integrated on a silicon substrate. The photoelectric devices include an optical connection device optically guiding at least one signal light incident from a signal light generation device to transmit the signal light into the silicon substrate. The signal light generation device is thermally separated from the photoelectric devices, and is optically connected to the photoelectric devices.

Abstract: The invention provides a method of manufacturing an optical printed circuit board and an optical printed circuit board. The method comprises providing a support layer; on the support layer, providing an optical core layer; forming optical channels from the optical core layer and surrounding the optical channels with cladding thereby forming optical waveguides; and during said step of forming the optical channels, forming one or more alignment features, e.g. projections, on the optical printed circuit board.

Abstract: An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a sh ape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 ?m or more.

Abstract: Apparatuses and methods for the passive alignment of an optical fiber over an optical element on a substrate are disclosed. An optical element and at least one gripper element may be provided on the substrate, wherein the at least one gripper element is positioned in an axial path defined by the optical element. Thus, when an optical fiber is moved along the axial path until an end of the optical fiber makes contact with the at least one gripper element, the optical fiber is aligned with the optical element. In addition, methods of aligning an optical fiber over an optical element on a substrate are disclosed. Further, the optical fibers may be laser angle-cleaved optical fibers with shaped fiber ends, such as laser angle-cleaved wedge or taper structures, as examples.

Abstract: A method for producing an optical fiber element provided with several optical fibers disposed in a matrix, including: a) placing and maintaining the several optical fibers in grooves formed in a mould plate, said grooves being in different planes, b) injecting a hardenable material adhering to the several optical fibers, c) solidifying the hardenable material to maintain the several optical fibers in a position set by the grooves, and d) removing at least the mould plate to p.

Abstract: A method for aligning an opto-electronic component assembly (OECA) on a substrate includes positioning a substrate on an assembly surface and positioning an OECA on the substrate such that a first OECA alignment face projects from a first substrate alignment face. The substrate and the OECA are advanced towards a contact face of a first assembly alignment mechanism such that the first substrate alignment face contacts the contact face of the first assembly alignment mechanism after the first OECA alignment face contacts the contact face. The OECA is displaced relative to the first substrate alignment face when the first OECA alignment face contacts the contact face and the substrate continues to move towards the contact face thereby aligning the OECA on the substrate relative to the first substrate alignment face.

Abstract: A manufacturing method of an optical waveguide device which is capable of easily and precisely aligning the optical axis of a light receiving and emitting element and the optical axis of an optical waveguide and capable of shortening manufacturing time, and to provide an optical waveguide device obtained thereby. An under cladding layer 11 is formed on an upper surface of a substrate 10. A core layer 16 is formed on an upper surface of the under cladding layer 11. Horizontal alignment guides 17 made of the same material as the above-mentioned core layer 16 are formed on the above-mentioned substrate 10. A light emitting element 19 is installed on the substrate 10 along the horizontal alignment guides 17.

Abstract: An optical fiber structure includes a first fiber array and a second fiber array, which are placed one on the other. For example, the first fiber array includes a substrate having four V-shaped grooves and four first optical fibers, the output ends of which are linearly arranged and fixed to the substrate, and the second fiber array includes a substrate having four V-shaped grooves and four second optical fibers, the output ends of which are linearly arranged and fixed to the substrate. The first optical fiber is a multimode fiber having a core and a cladding, and the core diameter is 60 ?m and the outer diameter of the fiber is 80 ?m. The second optical fiber is a multimode fiber having a core and a cladding, and the core diameter is 105 ?m and the outer diameter of the fiber is 125 ?m.

Abstract: An optical fiber structure includes a first fiber array and a second fiber array, which are placed one on the other. For example, the first fiber array includes a substrate having four V-shaped grooves and four first optical fibers, the output ends of which are linearly arranged and fixed to the grooves. The second fiber array includes a substrate having four V-shaped grooves and four second optical fibers, the output ends of which are linearly arranged and fixed to the grooves. The first optical fiber has a taper portion, in which the core diameter decreases along an optical axis, and the core diameter and the outer diameter of the first optical fiber at the tip of the taper portion thereof are 60 ?m and 80 ?m, respectively. The core diameter and the outer diameter of the second optical fiber are 105 ?m and 125 ?m, respectively.

Abstract: Disclosed is a method of fabricating a molded structure including both micro lenses and metallic pins. The method comprises the steps of providing a mold apparatus having a set of first cavities and a set of second cavities, depositing a first material in the first cavities to form a set of metallic pins, and depositing a second material in the second cavities to form a set of micro lenses. The formed molded structure comprises a substrate, a set of molded microlenses on said substrate, and a set of molded metallic pins on that same substrate. The metallic pins may be formed as alignment pins or as electrical connectors. The invention enables the micro lenses and metallic pins to be manufactured by way of molding on a common substrate for the first time.

Abstract: A miniature mechanical transfer (MT) optical coupler (“MMTOC”) for optically connecting a first plurality of optical fibers with at least one other plurality of optical fibers. The MMTOC may comprise a beam splitting element, a plurality of collimating lenses, and a plurality of alignment elements. The MMTOC may optically couple a first plurality of fibers disposed in a plurality of ferrules of a first MT connector with a second plurality of fibers disposed in a plurality of ferrules of a second MT connector and a third plurality of fibers disposed in a plurality of ferrules of a third MT connector. The beam splitting element may allow a portion of each beam of light from the first plurality of fibers to pass through to the second plurality of fibers and simultaneously reflect another portion of each beam of light from the first plurality of fibers to the third plurality of fibers.

Abstract: An apparatus includes an optical wave guide and a ferrule. The optical wave guide has a prespecified horizontal-positioning surface and a prespecified vertical-positioning surface. The ferrule is to precisely couple with the optical wave guide. The ferrule defines a first datum plane mating with the prespecified vertical-positioning surface of the optical wave guide to precisely mechanically vertically position the optical wave guide within the ferrule. The ferrule defines a second datum plane mating with the prespecified horizontal-positioning surface of the optical wave guide to precisely mechanically horizontally position the optical wave guide within the ferrule.

Abstract: The invention relates to a method for adjusting an optical rotating data transmission device having two units that are rotatable with respect to each other about a rotation axis, and that each have a coaxial collimator for coupling light in or out, and relates also to an optical rotating data transmission device that is adjustable by means of the method. For an adjustment, a deviation of a light beam from the rotation axis is determined by means of two detectors at different distances, and from this a positional deviation and also a tilt of the light beam is calculated and suitably compensated.

Abstract: A simply constructed and economical optical connector, wherein a fiber ribbon or waveguide ribbon cable incorporates a plurality of projecting fiber or waveguide ends adapted to engage into a guiding feature in a structure that incorporates an array of microlenses, upon said structure being aligned with and attached to a ferrule housing the ribbon cable. The guiding feature enables apertures in the ferrule within which the projecting fiber or waveguide ends are guides towards engagement with guiding feature in the microlens containing structure, to be formed or dimensioned with relaxed tolerances relative to the fiber or waveguide ends, thereby considerable reducing manufacturing costs for the ferrule.

Abstract: To obtain an optical waveguide device capable of improving mounting accuracy and productivity for correcting misalignment of alignment marker caused by distortion due to a substrate stressed and distorted. An optical waveguide device includes an optical waveguide section, including a waveguide core formed on a substrate, and an optical device (LD) mounted on the substrate to correspond the optical waveguide section, both of which are coupled at a light end face and mounted by hybrid mounting. LD side alignment markers are provided in both sides of an active line in the optical device. Substrate side alignment markers are provided at positions where centers thereof and those of the optical device side markers are matched when the optical device is mounted on the corresponding substrate. Fiducial markers are provided and a relative positional relationship with the waveguide core on the substrate becomes stably. Thus, a misalignment amount is detected.

Abstract: In one embodiment, a fiber assembly is provided. The fiber assembly has a first fiber having at least one core. The core has a length, a first end, and a second end, and light may be transmitted along the core. The second end has an obtusely angled end surface. The assembly also has a second fiber having at least one core having a first end. Light may be transmitted along the core. The second end of the first fiber is optically coupled to the first end of the second fiber such that light emitted from the first fiber may be transmitted to the second fiber.

Abstract: A three-dimensional optical waveguide is formed by laminating planar substrates such as a plurality of lens substrates and, an isolator substrate and a wavelength division multiplexing filter, the optical substrates at least include a waveguide substrate having a waveguide and a reflecting surface. In the three-dimensional optical waveguide, the planar substrates are positioned by markers integrally formed on at least two of the planar substrates. Light directed into the waveguide is reflected by a reflecting surface and passes through the lens substrates and the isolator substrate.

Abstract: An integrated optical circuit including an operational submicronic waveguide associated with an operational grating intended for the coupling with an optical fiber, further including an alignment grating, identical to the operational grating, associated with a blind waveguide and arranged at a known distance from the operational grating.

Abstract: A system and method for advanced device specific knowledge based modeling as well as intelligent control to yield high performance, low cost automation for optoelectronic design, packaging and assembly. The control loop design is based on knowledge based model predictive control. A knowledge model, specific to the assembled package's characteristics, is used to set the initial “feed-forward” conditions of an automation system. In addition to this feed-forward model for setting the initial set point, the controller is designed with feedback components, along with the inclusion of a built in sensor. This system and method increases the efficiency of the automation process and the number of assembly steps can be greatly reduced. A method for the design, assembly and packaging of optoelectronic devices is also described.

Abstract: An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane. A method of alignment is also provided.

Abstract: To provide an optical module capable of improving the workability for a circuit substrate, in the rear of a shield case (22), a pressing portion (27) for holding an FOT (6) is formed to press a back surface of a package portion (9) of the FOT (6). In the rear of the shield case (22), a stress countermeasure portion (28) is formed to distribute or mitigate a stress occurring due to deformation and displacement of the pressing portion (27). The stress countermeasure portion (28) is formed between the pressing portion (27) and a substrate connection portion (16). The stress countermeasure portion (28) is formed in the vicinity of the pressing portion (27). In a small space between a base (or bend portion) of the pressing portion (27) and the stress countermeasure portion (28), the force in a twist direction acts due to the occurred stress. This force is distributed or absorbed according to presence and shape of the stress countermeasure portion (28).

Abstract: A ferrule assembly for terminating at least one fiber of a ribbon cable in a ferrule, where the ferrule assembly is disposable in a housing of an optical connector, is provided. The ferrule assembly includes the ferrule having a mating face, at least one groove for receiving the fiber and at least one through-hole. The ferrule assembly also includes an alignment member holder having at least one alignment member and providing a first channel for the ribbon cable, the alignment member being insertable in the through-hole of the ferrule and having a first length such that an end of the alignment member extends beyond the mating face of the ferrule when the ferrule assembly is assembled.

Abstract: In an optical transceiver module, the bottom surface of the lid is temporarily attached to the top surface of the submount assembly in a pre-alignment position prior to performing the solder flowing process in order to prevent the lid from shifting position during the solder flowing process. The solder flowing process is then performed to melt the solder. When the solder melts, the surface tension of the melted solder pulls the lid into its ultimate, or permanent, aligned position. The solder is then cooled, causing it to harden, thereby securing the lid to the submount assembly in its ultimate, permanently aligned position. The hardened solder between the top surface of the submount assembly and the bottom surface of the lid forms a hermetic seal that encloses components on the transmit side of the transceiver module in a hermetically-sealed environment.

Abstract: Optical connector assemblies suitable for use in harsh environments such as down hole oil and gas well applications and methods for fabricating the same are provided. In one embodiment, an optical connector assembly suitable for down hole oil field applications comprises a first and second optical waveguide urged by a biasing member against a bracket. Each of the waveguides has at least one base surface formed on the exterior of the waveguide that is disposed against at least one of a plurality of reference surfaces of the bracket. In another embodiment, flats comprise two of the base surfaces on each optical waveguide.

Abstract: An active alignment method for a multi-channel optical transmitter and receiver is disclosed. The active alignment method for a multi-channel optical transmitter includes actively aligning an optical signal generator with an optical multiplexer based on optical outputs of a plurality of wavelengths from the optical signal generator and an optical output of the optical multiplexer, and actively aligning the optical multiplexer with a fiber optic coupler based on an optical output of the optical multiplexer and an optical output of the fiber optic coupler.

Abstract: An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.

Abstract: Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication.

Abstract: An optical waveguide structure comprises a substrate (12) having first and second groove arrays (8, 10), including grooves (8a-8g, 10a-10h), and an optical waveguide (14), having cladding and core (14b) layered on the substrate between the groove arrays to vertically align the core with cores (2a, 4a) of optical fibers (2, 4) positioned on the grooves. The waveguide has at least one first port (20) aligned with a groove (8d) of the first groove array and at least one second port (22) aligned with a groove (10e) of the second groove array. The number of second ports is equal to or greater than that of the first ports. A ratio of the number of grooves of the second groove array relative to the number of grooves of the first groove array is less than a ratio of the number of the second ports relative to the number of first ports.

Abstract: A mechanical nanomover for optical elements alignment comprises a platform; a front supporting block and a rear supporting block; a left metal sheet and a right metal sheet installed between the two supporting blocks; a movable block installed between the two metal sheets; a weak spring and a strong spring which are interacted with the movable block. A translation stage serves to drive the weak spring to drive the movable block. The elastic coefficient of the strong spring is much greater than that of the weak spring so that the larger displacement of the weak spring will induce only a small displacement of the movable block due to the interaction of the strong spring. No electric power is needed to drive the structure of the nanomover. The mechanical nanometer can provide a sufficient precision to the operation, while it is very inexpensive.

Abstract: An optical plug connection for optical waveguides including a plug and a matching socket, and also a method for adjusting the plug connection. In the case of such a plug connection, the plug has at least one planar, smoothed contact area oriented with respect to a propagation direction of a light beam passing from or into the plug, for bearing on a corresponding planar, smoothed mating contact area of the socket that is oriented with respect to the propagation direction of the light beam.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: An optical wiring member according to the present invention includes: a substrate on which a light-emitting device and a light-receiving device are mounted; and an optical waveguide comprising a communication optical waveguide core and an optical waveguide clad that entirely covers the communication optical waveguide core, the optical waveguide being mounted on the substrate, in which the optical waveguide is equipped with a position-aligning light guiding portion for introducing position-aligning light into the communication optical waveguide core. By using, as a target light, the position-aligning light that is introduced into the communication optical waveguide core 3 and exits from the substrate, at least either the light-emitting device or the light-receiving device can be positioned.

Abstract: A bent optical fiber coupler (100) that employs at least one optical fiber (10) is disclosed. The coupler includes a curved optical fiber guide channel (200) having a strong curve. The optical fiber(s) held within the optical fiber guide channel have a bend corresponding to the guide channel curve. The fiber end portions are optionally disposed within a straight fiber guide (160) at a coupler input/output end, which is preferably configured to have a standard connector geometry. Use of nanostructured fibers for the at least one optical fiber allows for strong bends having tight radii of curvature without imparting significant attenuation. Coupler assemblies that include the coupler optically coupled to at least one opto-electronic device (310) are also disclosed.

Abstract: An apparatus includes an optical wave guide and a ferrule. The optical wave guide has a prespecified horizontal-positioning surface and a prespecified vertical-positioning surface. The ferrule is to precisely couple with the optical wave guide. The ferrule defines a first datum plane mating with the prespecified vertical-positioning surface of the optical wave guide to precisely mechanically vertically position the optical wave guide within the ferrule. The ferrule defines a second datum plane mating with the prespecified horizontal-positioning surface of the optical wave guide to precisely mechanically horizontally position the optical wave guide within the ferrule.

Abstract: Printed circuit boards that include optical interconnects include a flexible optical waveguide embedded or locally attached to the board having at least one end mechanically decoupled from the board during fabrication that can be fitted with a mechanical connector. Also disclosed are processes for fabricating the circuit board.

Abstract: A method for manufacturing an optical assembly comprises providing a first substrate having a first surface, providing a second substrate having a second surface facing the first surface, and forming a patterned microbump on at least a select one of the first surface and the second surface. The method further comprises applying an adhesive to the at least select one of the first surface and the second surface in a region proximate the patterned microbump, and attaching the first substrate to the second substrate by placing the first surface and the second surface in close proximity to one another such that the adhesive contacts both the first surface and the second surface, and wherein the adhesive is held within a preselected area by the patterned microbump.

Abstract: A detector assembly for analysis of light emitted form a fluorescent material, an optical alignment assembly for introducing an output beam into a detector array or demultiplexer, and methods of demultiplexing a beam of light into wavelength bands. The detector assembly generally includes an optical alignment assembly to introduce an output beam having a projected optical axis into an array of filters. The optical alignment assembly is mounted substantially orthogonally to a plane of reflective light defined by the path of the output beam through the filter array. The array includes filters arranged in two rows in parallel. Each filter transmits a particular band of the output beam and reflects the remaining bands to the next filter in the opposite row of filters. The array further includes a plurality of detectors mounted in detector ports.

Abstract: A suspension board with circuit includes a metal supporting board including a board trench portion, an insulating base layer formed on a surface of the metal supporting board, a conductive pattern formed on a surface of the insulating base layer, and an optical waveguide provided to overlap the board trench portion when projected in a thickness direction of the metal supporting board. At least a part of the optical waveguide is positioned closer to the conductive pattern than to a back surface of the metal supporting board.

Abstract: Consistent with the present disclosure, a package is provided in which the PLC substrate, for example, is bonded to the underyling carrier though a limited contact area. The rest of the substrate is detached from the carrier so that stresses are applied to a limited portion of the PLC substrate. The PLC itself, however, is provided over that portion of the substrate that is detached from the carrier, and thus experiences reduced stress. Accordingly, high modulus adhesives, as well as solders, may be used to bond the PLC substrate to the carrier, thereby resulting in a more robust mechanical structure.

Abstract: A method of aligning a polarization-maintaining optical fiber by image profile analysis is provided. The method of aligning a polarization-maintaining optical fiber may include analyzing the polarization-maintaining optical fiber by illuminating a side of the optical fiber; rotating the optical fiber at incremental rotation angles; obtaining an image profile of the optical fiber at each rotation angle such that a focal plane of the image profile is positioned within the optical fiber; measuring an image parameter at each rotation angle based on the respective image profile; and constructing a measured image parameter profile of the optical fiber as a function of rotation angle based on the measured image parameters. The method may also include constructing an approximated image parameter profile of the optical fiber as a function of rotation angle by curve-fitting a mathematical function to the measured image parameter profile.

Abstract: The present invention provides a fiber optic jack for routing optical signals.

Abstract: A communications coupling for a low bandwidth fiber optic cable and a high bandwidth fiber optic cable, includes: a guiding ferrule adapted for coupling to a surrogate fiber optic cable comprised of one of the low bandwidth fiber optic cable and the high bandwidth fiber optic cable, the guiding ferrule including at least one mounting feature for aligning the guiding ferrule with an optical axis of the surrogate cable; the guiding ferrule further including at least one guiding feature for aligning the optical axis of the surrogate fiber optic cable with an optical axis of a connecting fiber optic cable, the connecting fiber optic cable comprised of the other one of the low bandwidth fiber optic cable and the high bandwidth fiber optic cable. A method and a communications infrastructure are provided.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: In positioning or aligning ends of optical fibers in relation to each other an offset distance between the fiber ends, the offset distance e.g. being the distance between predetermined reference positions in the fiber ends, is stepwise adjusted using a cascade technique. The method can be executed accurately and fast and be used e.g. in a procedure for core alignment, the predetermined reference positions then being the positions of the cores of the fiber ends such as the positions of the center lines or axes of the cores. Also, the method can be used in a procedure in which the self-focusing effect of optical fibers is used for finding the reference positions, which in this case are the positions of the center lines or axes of the total fiber ends, i.e. center lines or axes of the surfaces of the claddings of the optical fiber ends. Finally, the method can be used for the longitudinal positioning of the fiber ends in which the gap between end surfaces of the fiber ends is set to a desired value.

Abstract: In an optoelectronic conversion header, a ferrule holds an optical waveguide in a predetermined position so that an end face of the optical waveguide protrudes from an mounting surface of the ferrule. An electric wire is provided on the mounting surface of the ferrule, a optical semiconductor device is mounted on the mounting surface of the ferrule and electrically connected to the electric wire. From the end face of the optical waveguide, an optical signal is transferred in a transfer direction and the mounting surface of the ferrule is so arranged as to be deviated two degrees or more from a plane vertical to the transfer direction.