Abstract: An optical module that is easy to manufacture and may arrange and position an optical element mounting substrate and a package with high precision is provided. A substrate side positioning groove portion is formed in an optical element mounting surface of the optical element mounting substrate on which an optical element is mounted, and a package side positioning groove portion is formed in the package on which the optical element mounting substrate is arranged. The optical element mounting substrate and the package are overlapped with each other with the substrate side positioning groove portion and the package side positioning groove portion facing each other. An optical fiber that is a positioning member is inserted between the positioning groove portions. Thus, the optical element mounting substrate and the package are positioned relative to each other. The respective positioning groove portions on the substrate side and on the package side may readily be formed with high precision.

Abstract: An optical lens device assembly containing an optical lens device and an optical device sealed without causing complication of optical module configurations is provided. In the optical lens device assembly, a resin member having light transmittance is used to fill in space between the optical lens device and the optical device to be optically coupled to the optical lens device. The resin member is made from a resin material having a refractive index being different from that of the optical lens device. The resin member is used to seal a clearance between optical planes, which face each other, of the optical lens device and the optical device, and to mechanically couple the optical lens device to the optical device.

Abstract: The invention relates to an optical assembly for opto-electronic packages comprising an optical fibre secured on the underside of an elongated support member in optical alignment with an opto-electronic device, wherein said support member is affixed to an aligning member, which in turn is affixed, e.g., by laser welding, to a welding platform. In a preferred embodiment, the elongated support member is a planar parallelepiped. In a further preferred embodiment, the elongated support member is a parallelepiped with an axially extended slot, in which the optical fibre is secured with its longitudinal axis substantially parallel to the axially extended slot.

Abstract: An opto-electronic semiconductor microcircuit chip package where the chip is mounted upon a substrate or boat which in turn is mounted to the floor of the package upon a pool of reflowable solder. Actuator wires connect from package pads to pads on the boat. When the solder is liquefied, the entire package is placed in a magnetic field and current runs through actuator wires in order to force rotation of the boat according to Maxwell's equations for electric current in a magnetic field. The current is adjusted to obtain the proper torque on the boat to move it into alignment with an impinging fiber optic cable. Once in alignment, the solder is cooled to lock the boat in place and in alignment.

Abstract: An improved optical module mounted body is disclosed. The optical module mounted body comprising: a mounting board having a mounting surface with a plurality of holes formed thereon; an optical module placed on the mounting surface; and a securing member configured to secure the optical module, the securing member including an upper portion, a plurality of legs extending from the upper portion and a plurality of engagement portions formed at ends of the plurality of legs, wherein the optical module is held between the mounting board and the securing member such that the upper portion of the securing member abuts on an upper surface of the optical module, and wherein the plurality of legs are inserted in the plurality of holes, the plurality of engagement portion engaging with the mounting board.

Abstract: An optical system includes a cavity having a semiconductor light-emitting device, and an optical fiber having a first terminal optically coupled to the semiconductor light-emitting device, the cavity having a cavity length defined between a first facet of the semiconductor light-emitting device and second terminal of the optical fiber, wherein a length of the optical fiber is such that a mode-locking oscillation frequency is not more than 1 GHz.

Abstract: The invention provides a method for efficiently performing the alignment work of a laser diode chip with an optical fiber. A laser diode chip is faced to a coupling end face of a lensed fiber. According to algorisms stored inside an algorism storage part, X, Y and Z stages move the lensed fiber for alignment. The lensed fiber takes in laser light as it is moved in the optical axis direction (Z-axis direction) of the laser light from the laser diode chip. The lensed fiber is moved in the Z-axis direction by every movement, a half of a wavelength of the laser light, on the basis of the reference position thereof. Every time at the step moving, a light power of the laser light incident into the lensed fiber is measured. A position where the measured value becomes the maximum or a neighboring position thereof is defined as the optimum position of the optical fiber in the Z-axis direction.

Abstract: A method of fabricating an optical module includes attaching a lens to a platform of the optical module such that the lens remains in precise alignment with a light source (e.g., a laser diode) and a target optical fiber even after the lens is attached or fixed to the platform. The optical module includes a micro-lens assembly, comprising a bridge and a micro-lens holder holding a micro-lens. The micro-lens holder is initially to the light source to substantially optimize coupling of light into the input aperture of the optical fiber. Next, the bridge is inserted beneath the micro-lens holder on the platform. Subsequently, the bridge is fixedly attached to the platform. The micro-lens holder is realigned to the light source to substantially optimize coupling of light into the input aperture of the optical fiber and then the micro-lens holder is fixedly attached to the bridge.

Abstract: The enhanced folded flexible cable packaging for use in optical transceivers of the present invention provides a 90 degree transition between an optical signal input/output at a communication chassis bulkhead, and folds 180 degrees around a horizontal heat spreader to provide the capability to wire electrical components to the flexible cable while maintaining the upper surface of the electrical components in close proximity to a heat sink. This allows signals to be processed through a multi-layer flexible cable providing electrical performance without the mechanical stiffness associated with the bends that occur in the package. The multiple array transceiver makes the 90 degree transition within a narrow gap established by industry and manufacturing standards. The multiple array transceiver also provides cooling to the internal electronics through a heat sink attached to the flexible cable and the heat spreader, which concurrently mounts and locates the transceiver to a common host board.

Abstract: The invention relates to a device for transmitting optical signals between at least two components disposed for rotation.

Abstract: An optical subassembly for aligning an optical fiber with a light emitting device includes a fiber optic stub mounted in a ferrule and a v-groove device coupled to the ferule with a loose end of the fiber optic stub lying in the v-groove device. The other end of the fiber optic stub is polished. According to methods contemplated by the invention, the ferrule is mounted in a ring which is welded to a light emitting subassembly. The unpolished loose end of the fiber optic stub self-aligns with a mating fiber in the v-groove device. According to the presently preferred embodiment, the v-groove device is provided with s-bends which aid in self-alignment between the loose fibers.

Abstract: A method and apparatus for maintaining an alignment of a laser diode with an optical fiber is disclosed. A mounting plate is made of a first material, and mounted on the mounting plate is a first substrate made of a second material. A semiconductor laser, with a light emitting side, is mounted on the first substrate. Separated from the first substrate by a predetermined distance is a second substrate made of a third material, and mounted on the second substrate is an optical fiber. The optical fiber is mounted, such that, the optical fiber is adjacent to and aligned with the light emitting side of the semiconductor laser. The first, second, and third materials making up the mounting plate, the first substrate, and the second substrate respectively, facilitate maintenance of the alignment between the optical fiber and the light emitting side of the semiconductor laser.

Abstract: A method of constructing an optoelectronic module for use in fiber optic communication systems. The module is adapted for mechanically and optically interconnecting with a ferrule supporting a set of optical communications fibers. The module supports an optoelectronic device comprised of a set of photoactive components for use in communicating with the fibers. The module also includes a carrier adapted for supporting the optoelectronic device and a set of guide pins used for alignment with the ferrule. The module is constructed in steps. First, the carrier constructed as a silicon substrate. Structures such as alignment apertures may then be fabricated on the surface of the substrate using photolithography techniques. Guide pins are inserted in an alignment ferrule. The carrier is placed on the ferrule the guide pins engaged with the alignment apertures. The guide pins and carrier are aligned and held in position by the alignment ferrule.

Abstract: A multi-fiber alignment system is provided for actively aligning optical fibers to an optical waveguide base on alignment status between each optical fiber and a corresponding optical device. Each of the optical fibers is held by bonding agent on a thermal pad from which radiation melts the bonding agent during adjustment of the optical fiber, and the optical fiber is fixed in its position by solidifying the bonding agent when being accurately aligned to a corresponding optical device.

Abstract: A method of aligning an optical fiber to a light source (e.g., a laser diode) in an optical assembly includes inserting a weld clip over a ferrule holding the optical fiber so that there is no gap between the ferrule and the weld clip, initially aligning the optical fiber to the laser diode, fixedly attaching the weld clip to a platform, realigning the optical fiber to the laser diode, and fixedly attaching the weld clip to the ferrule.

Abstract: In an optical device manufacturing method according to the present invention, a metal film is formed on a side surface of a bare fiber, a film is formed on an end face of the bare fiber, and, thereafter, the bare fiber is inserted into a ferrule until the end face of the bare fiber on which the film was formed is protruded from an end face of the ferrule, and then, the bare fiber is secured to the ferrule. In an optical device according to the present invention, a bare fiber having a side surface on which a metal film was formed is inserted into and secured to a ferrule, and an end face of the bare fiber is protruded from an end face of the ferrule, and a distance L between the end faces satisfies a relationship L<4×d (outer diameter of the bare fiber), and a film is formed on the end face of the bare fiber.

Abstract: In-situ and post-cure methods of joining optical fibers and optoelectronic components are provided. An in situ method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that signal strength of light signals passing between the optical fiber and the optoelectronic component is substantially maximized, and irradiating the interface with non-ionizing radiation in RF/microwave energy to rapidly cure the resin.

Abstract: An optical networking unit includes a plurality of optical components mounted on a substrate composed of a material transparent to radiation in a frequency range. At least one of the optical components is secured to the substrate by a curable bonding material of a type curable in response to exposure to radiation in said frequency range. One optical component preferably comprises an optical fiber secured to an optical fiber holder holding the optical fiber and secured to the substrate. An active optical component is optically aligned with the optical fiber and is secured to an active optical component holder holding the active optical component and secured to the substrate.

Abstract: Locally heated low temperature solder glass is used to permanently fix an optical fiber with sub-micron precision to a glass ceramic submount inside a high power pump laser module. The fiber is manipulated into a predetermined alignment while the solder glass is still molten and the solder glass is then cooled to its solidified state. The predetermined alignment may include an offset to compensate for subsequent thermally related dimensional changes as the solder glass cools and solidifies. If necessary, the solder glass can be remelted and the fiber realigned with a different offset if the first alignment attempt is less than optimal. This alignment process has been demonstrated to provide reliable and efficient coupling of an optical fiber to a high power pump laser within very tight tolerances. A similar process can also be applied to other micro-optics assemblies where high precision, high reliability fiber fixing is required.

Abstract: A method of aligning an optical fiber to a light source (e.g., a laser diode) in an optical assembly includes inserting a weld clip over a ferrule holding the optical fiber so that there is no gap between the ferrule and the weld clip, initially aligning the optical fiber to the laser diode, fixedly attaching the weld clip to a platform, realigning the optical fiber to the laser diode, and fixedly attaching the weld clip to the ferrule.

Abstract: A method of fabricating an optical module includes attaching a lens to a platform of the optical module such that the lens remains in precise alignment with a light source (e.g., a laser diode) and a target optical fiber even after the lens is attached or fixed to the platform. The optical module includes a micro-lens assembly, comprising a bridge and a micro-lens holder holding a micro-lens. The micro-lens holder is initially to the light source to substantially optimize coupling of light into the input aperture of the optical fiber. Next, the bridge is inserted beneath the micro-lens holder on the platform. Subsequently, the bridge is fixedly attached to the platform. The micro-lens holder is realigned to the light source to substantially optimize coupling of light into the input aperture of the optical fiber and then the micro-lens holder is fixedly attached to the bridge.

Abstract: A method of forming a hybrid optical component includes the steps of masking and etching a pattern on a core layer of a planar optical component to define at least one alignment element and an optical element and subsequently overcladding the optical element such that a passive platform is formed which exposes a surface of the optical element such as a waveguide and an alignment element for receiving a mirror image alignment element formed on an active platform including an active device, such as a laser. Hybrid components include a passive platform having an alignment element formed therein and a waveguide for receiving an active platform with a mating mirror image alignment element and an active device which aligns with the waveguide when the platforms are mated.

Abstract: An apparatus for aligning a fiber to an optical device includes a base, a fiber holder mounted on the base, the fiber holder holding the fiber during operation of the apparatus, a first movable stage mounted on the base, the first movable stage holding the optical device during operation of the apparatus, a second movable stage mounted on the base, wherein the second movable stage is configured to move parallel to the first movable stage, a fiber positioner attached to the second movable stage, and a processor programmed to control the movement of the first movable stage and the second movable stage, wherein, during operation of the apparatus, the processor moves the first movable stage and the second movable stage towards the fiber.

Abstract: An optical transceiver utilizes a stiffener including a surface adapted for attachment of a portion of a flexible circuit having electrical components that protrude from the flexible circuit. The surface of the stiffener includes one or more cavities configured for receiving the electrical components that protrude from the flexible circuit. The stiffener may also include solder posts for mounting the stiffener on a rigid circuit board of an electronic device incorporating the transceiver, with the solder posts having a shoulder for spacing the stiffener at a predetermined distance from the circuit board of the electronic device. The stiffener may also include provisions for attaching a heat sink. The optical transceiver may include the flexible circuit, heat sink, and rigid circuit board.

Abstract: A clip to align a fiber optic cable with a light source within a fiber module. The clip may have a pair of sidewalls that are separated by a channel. The fiber optic cable can be located within the channel of the clip and attached to the sidewalls. The sidewall are adjoined by a pair of joining segments. The joining segments are separated by a space which allows a ferrule of the fiber optic cable to be welded to a center location of the clip.

Abstract: The present invention is related to a laser diode module and a fabricating method therefor, which facilitate the fabrication and enable fabrication in a short time with a low cost and high long-range reliability. With a lens formed fiber (8) and a laser diode element (LD element) (3) aligned with each other, the front side edge portion of the ferule 4 near the LD element 3 are fixedly sandwiched on the both sides thereof by means of a ferule supporting part (6) to form a sandwiched portion (9). By a fulcrum at sandwiched portion (9), the rear side edge portion of the ferule (4) is displaced to re-align the lens formed fiber (8) with the LD element (3). On the both sides for sandwiching the rear edge side of the ferule (4), ferule fixing parts (10) guided by means of a guide portion (11) with a spacing interposed against the ferule (4) are disposed with a spacing within a range of approximately 0 to 5 &mgr;m relative to a side surface of the ferule (4).

Abstract: A multi-fiber alignment system is provided for actively aligning optical fibers to an optical waveguide base on alignment status between each optical fiber and a corresponding optical device. Each of the optical fibers is held by bonding agent on a thermal pad from which radiation melts the bonding agent during adjustment of the optical fiber, and the optical fiber is fixed in its position by solidifying the bonding agent when being accurately aligned to a corresponding optical device.

Abstract: A ferrule assembly includes a ferrule having a through-hole, a first end portion, a second end portion, and an intermediate portion between the first and second end portions, and an optical fiber inserted and fixed in the through-hole. The ferrule has at the intermediate portion a cutaway flat portion allowing the optical fiber inserted in the through-hole to be semi-exposed, and the optical fiber has its entire circumference held by the ferrule at least at the first and second end portions of the ferrule.

Abstract: A semiconductor laser and an optical waveguide device with an optical waveguide formed at a surface of its substrate are provided on a submount. The semiconductor laser and the optical waveguide device are mounted with an active layer and a surface at which the optical waveguide is formed facing the submount, respectively. The submount is combined with the semiconductor laser or the optical waveguide device to form one body using an adhesive with a spacer, which maintains a substantially uniform distance therebetween, being interposed therebetween, so that position adjustment in the height direction can be made automatically and mounting can be carried out with high-precision optical coupling. Thus, an optical waveguide device integrated module and a method of manufacturing the same are provided, in which a semiconductor laser and a planar optical waveguide device are mounted with their positions in the height direction controlled with high precision.

Abstract: An optical wiring device providing characteristics of optical connection leads while having substantially the same mountability as that of electrical wiring devices. According to the present invention, an optical axis of a photoelectric conversion element is made consistent with an optical axis of an optical terminal having a spherical shape through a tapered hole provided in a package substrate. An optical wiring substrate includes a concave portion attached to the package substrate with the optical terminal at the position of the concave portion. The optical terminal serves as a fitting part between the package substrate and the optical wiring substrate. By putting the focal point of the optical terminal within the optical wiring substrate, an optical wiring is not exposed to the external atmosphere.

Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser.

Abstract: A module essentially includes a module housing, into which is introduced a lead frame. An electro-optical transducer is mounted on the lead frame. The interior of the module housing is filled with a transparent potting compound. A plug receptacle part is moulded onto the outer housing wall and has a defined outer contour. Situated in the interior of the plug receptacle part is an optical waveguide piece, which proceeding from the surroundings of an outer area of the plug receptacle part, extends through the interior of the plug receptacle part and through a housing opening right into the housing interior. The optical waveguide piece is optically coupled to the electro-optical transducer. An optical waveguide plug interacting with the module has a sleeve-shaped plug section corresponding to the plug receptacle part.

Abstract: One aspect of the present invention is a positioner for an optical element. The positioner includes a base having a receptacle and a substantially planar surface slidably engageable with a substrate. The positioner also includes a mounting platform disposed in the receptacle. The receptacle constrains the mounting platform to translation in a direction substantially perpendicular to the substantially planar surface and the mounting platform is configured so as to be free to rotate about three orthogonal axes within the receptacle. The optical element is coupled to the mounting platform. The optical element is aligned with a second optical element by selectively positioning the mounting platform.

Abstract: Disclosed is a device for aligning an optical source and an optical fiber in an optical source module. The optical source module has a substrate, an optical source mounted on the substrate, an optical fiber for receiving lights emitted by the optical source, an optical fiber ferrule for supporting the optical fiber, and a saddle mounted on the substrate for holding the optical fiber ferrule.

Abstract: The present invention provides methods for aligning a fiber optic cable with an optical component on a device carrier using a fiber optic lens assembly. One method provides that movement of the lens assembly is fixed with respect to the fiber optic cable. Light is sent through the lens assembly. The fixed lens assembly and fiber optic cable are moved with respect to the device carrier. The light sent though the fixed lens assembly is monitored, and movement of the fixed lens assembly is fixed with respect to the device carrier according to the monitored light. Another method provides that movement of the lens assembly is fixed with respect to the device carrier. Light is sent through the lens assembly. The fixed lens assembly and device carrier are moved with respect to the fiber optic cable. The light sent though the fixed lens assembly is monitored, and movement of the fixed lens assembly is fixed with respect to the fiber optic cable according to the monitored light.

Abstract: This invention relates to a device and method for alignment of an optical fiber (6) with the output facet of a laser diode (3) which are to be co-located on a mount (4), to obtain a substantially optimum coupling efficiency. The invention is particularly applicable to assemblies to be used for submarine use.

Abstract: Methods of bonding optical components are disclosed. Bonding is achieved without use of adhesives or high temperature fusion. The invention is useful for bonding optical fibers together and for bonding optical fiber arrays to lens arrays.

Abstract: Automated manufacturing in the fiber optics industry has introduced a series of new problems due to the small size of the parts being assembled and the precise optical alignments required. However, processes requiring the manual assembly of parts using glue are slowly being replaced by automated processes involving the laser welding of metallically encased optical parts. Unfortunately, almost every step in the process causes a small degree of misalignment, which may cause the device to fall below transmission standards. The present invention provides a method of assembling an optical device which includes special steps that involve re-aligning the elements in the optical device after other steps in the method have caused a misalignment. In particular, the method of the present invention includes testing the alignment of the optical elements at several stages throughout the assembly process, and applying addition asymmetric welds to the finished product to improve the transmission results.

Abstract: A coupling arrangement includes a vertical cavity surface emitting laser. A carrier has the vertical cavity surface emitting laser affixed thereto. An optical coupler is coupled to the vertical cavity surface emitting laser, and has a plurality of optical fibers which receive light emitted from the vertical cavity surface emitting laser. The vertical cavity surface emitting laser is separated from the optical coupler by a gap and is free of direct contact with the optical coupler. The gap is less than about 50 microns, and is greater than zero microns. A curable adhesive is disposed in the gap for coupling the vertical cavity surface emitting laser to the optical coupler. The adhesive has a viscosity that defines a size of the gap.

Abstract: Apparatuses, systems, and methods which compensate for distortion of optical and electrical signals being transmitted by communications systems and components by changing the effective length of communications cables and waveguides.

Abstract: An optoelectronic module and a method for stabilizing its temperature are disclosed wherein the measurement of the reference temperature for the temperature sensor takes place on the substrate surface for the optoelectronic component, so that high temperature stability is ensured.

Abstract: A semiconductor laser module comprises a semiconductor laser having a front end facet from which output light is emitted, and an optical fiber on which the output light emitted from the semiconductor laser is incident, where the optical fiber has a light feedback portion for reflecting light at a predetermined wavelength. The semiconductor laser is accommodated in a package together with one end side of the optical fiber. The light feedback portion includes a first light feedback portion set at a predetermined reflection center wavelength for determining an oscillating wavelength of the semiconductor laser, and at least one second light feedback portion.

Abstract: An optical communication device which has an optical module including an optical element and a lens system optically coupled through a space and housed in a package, a supporting member for supporting the optical module, and a fixing member directly placed over the optical module for removably fixing the optical module on the supporting member, wherein the optical module is securely sandwiched between the supporting member and the fixing member, and a method of fixing the optical module for use in the optical communication device.

Abstract: An optical module comprises a platform, an optical element having an optical section and mounted on the platform, an optical fiber attached and positioned with respect to the optical section, and dummy bumps holding an end surface of the optical fiber in a state of non-contact with the optical section.

Abstract: An optical wiring device providing characteristics of optical connection leads while having substantially the same mountability as that of electrical wiring devices. According to the present invention, an optical axis of a photoelectric conversion element is made consistent with an optical axis of an optical terminal having a spherical shape through a tapered hole provided in a package substrate. An optical wiring substrate includes a concave portion attached to the package substrate with the optical terminal at the position of the concave portion. The optical terminal serves as a fitting part between the package substrate and the optical wiring substrate. By putting the focal point of the optical terminal within the optical wiring substrate, an optical wiring is not exposed to the external atmosphere.

Abstract: A clip to align a fiber optic cable with a light source within a fiber module. The clip may have a pair of sidewalls that are separated by a channel. The fiber optic cable can be located within the channel of the clip and attached to the sidewalls. The sidewall are adjoined by a pair of joining segments. The joining segments are separated by a space which allows a ferrule of the fiber optic cable to be welded to a center location of the clip.

Abstract: A package for optical components and a method for making the package are disclosed. The package comprises a quasi-planar substrate having a positioning floor, a platform and an optional ring frame of precisely determined height. Optical components picked and placed on a substrate floor, a raised platform and frame. A flexure assembly allows fine positioning of components requiring critical optical alignment.

Abstract: The present disclose provides methods and systems for positioning a fiber end of an optical fiber. A block is provided having an opening for receiving the optical fiber. The optical fiber is positioned in the opening to constrain the optical fiber in at least one direction. The optical fiber has a first portion with a free end which is cantilevered or extends from the block. The optical fiber is moved against the at least one direction which is constrained. The movement is provided from a position on a second portion of the optical fiber, which is opposite the first portion relative to the block. This movement causes a lateral displacement of the free end.

Abstract: Optical or optoelectronic array with an assembly holder and an optical or optoelectronic assembly located on it to position the assembly holder on an assembly surface of an optical bench in a way that is movable only in a first plane of adjustment parallel to the assembly surfacewhere the assembly holder has an assembly base for positioning the assembly holder on the assembly surface as well as a seat which is open the entire distance from one outside surface of the assembly holder to the opposite outside surface of the assembly holder, in which the optical or optoelectronic assembly is located and which is formed in such a way that the optical or optoelectronic assembly can be moved relative to the assembly holder only in a second plane of adjustment which is non-parallel to the first plane of adjustment, extending parallel to the directional passage of the seat.

Abstract: An integrated and modular coupling module for coupling light between optical devices, such as an optical fiber connector and optoelectronic device, is presented. In this invention, beam-shaping elements and alignment elements are integrated on a single alignment plate in such a way that they maintain a precise physical relationship. The relative physical arrangement between the beam-shaping elements and the alignment elements are configured such that once the alignment elements are engaged with the peripheral devices, accurate optical alignment between the peripheral devices and the coupling module is also attained. The optical coupling module of the present invention enables it to withstand temperatures of 220° C. or higher while maintaining its integrity and performance. The principle of the present invention can also be extended to constructing coupling modules for coupling other types of electromagnetic radiation.