Fiber Permanently Fixed After Adjustment Patents (Class 385/91)
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Patent number: 6074104Abstract: A conventional optical fiber not coated with a metal layer is provided. A solder layer is filled into between a case, for an optical module wherein an optical element is optically coupled with the optical fiber within the case, and a cover conforming to the shape of the case, thereby simply conducting hermetical sealing. Thereafter, a resin, such as a silicone resin, is potted in the optical fiber introducing section. The two-layer hermetical sealing can realize a method for hermetically sealing an optical fiber introducing section which can maintain airtightness high enough to ensure long-term reliability of an optical module. This can facilitate the hermetical sealing of an optical device particularly in its optical fiber introducing section.Type: GrantFiled: April 16, 1998Date of Patent: June 13, 2000Assignee: NEC CorporationInventor: Kimikazu Higashikawa
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Patent number: 6068411Abstract: A semiconductor laser module of the present invention comprises a semiconductor laser, a pig tail optical fiber, a optical part, and a transition metal doped optical fiber. The optical part optically couples the semiconductor laser and the pig tail optical fiber to each other. The transition metal doped optical fiber is formed in a length corresponding to an attenuation amount with which desired distortion characteristics and desired noise characteristics are realized, and is connected to the side of the pig tail optical fiber opposite to the side which faces the semiconductor laser. The distortion characteristics of the semiconductor laser is improved by the action of the transition metal doped optical fiber. Consequently, the yield of semiconductor laser modules is improved.Type: GrantFiled: June 9, 1998Date of Patent: May 30, 2000Assignee: NEC CorporationInventor: Haruyasu Ando
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Patent number: 6067393Abstract: A light generating apparatus includes: a submount; a semiconductor laser chip mounted on the surmount; a substrate which is mounted on the submount and includes an optical waveguide; and a substance having a predetermined thickness which is disposed between the semiconductor laser chip and the substrate. In an oscillation wavelength stabilizing apparatus for a light source, the light source is a semiconductor laser which includes: an active region for providing gain; and a distributed Bragg reflection (DBR) region for controlling an oscillation wavelength. The apparatus includes a control section which monotonously varies, in a first direction, a DBR current to be input to the DBR region while detecting the oscillation wavelength of an output light of the semiconductor laser so as to detect a DBR current value I.sub.0 corresponding to a predetermined wavelength value, and then monotonously varies the DBR current in a second direction which is opposite the first direction beyond the detected value I.sub.Type: GrantFiled: August 21, 1998Date of Patent: May 23, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuo Kitaoka, Kazuhisa Yamamoto, Makoto Kato, Tomoaki Uno, Kiminori Mizuuchi, Kenichi Nishiuchi
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Patent number: 6062741Abstract: A light-receptive module according to the present invention includes a board, a light-receptive element disposed with a light input face thereof facing toward the surface of the board, and an optical fiber disposed in a slot formed on the surface of the board and coupled with the light-receptive element. The optical fiber has an end face formed obliquely to the surface of the board so that light is emitted toward a light receive face thereof. The end of the slot has a recession formed in parallel with the surface of the board so that it contacts partially with the end face. The end face is formed at a total internal reflection angle so that light emitted from the optical fiber is subjected to total internal reflection. On the board is formed a slot in which the optical fiber is disposed. The optical fiber is secured to the slot in such a way that the end is thrust into a recession formed in the end of the slot.Type: GrantFiled: July 2, 1998Date of Patent: May 16, 2000Assignee: NEC CorporationInventor: Masashi Tachigori
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Patent number: 6024500Abstract: The invention is a transceiver package with reduced overall width and optical pitch. Separate circuit boards are provided for the laser with its associated circuitry and the photodetector with its associated circuitry. The boards are mounted to the sidewalls of the package housing so that they are essentially perpendicular to the base of the package and to the major surface of the mother board.Type: GrantFiled: April 29, 1998Date of Patent: February 15, 2000Assignee: Lucent Technologies Inc.Inventor: Robert Karl Wolf
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Patent number: 6012855Abstract: A parallel optical data link using multimode optical components. The invention includes an array of photonic optical sources and an array of multimode waveguides optically coupled adjacent to the array of sources. Similarly, the invention further includes an array of photonic optical detectors and an array of multimode waveguides optically coupled adjacent to the array of detectors. The invention further includes a multimode optical fiber ribbon having a longitudinal dimension and first and second opposing extremities for transmission of light there through. The source coupled waveguide array is in optical communication with the first extremity of the fiber ribbon, while the detector coupled waveguide array is in optical communication with the second extremity of the fiber ribbon.Type: GrantFiled: March 28, 1995Date of Patent: January 11, 2000Assignee: Hewlett-Packard Co.Inventor: Kenneth H. Hahn
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Patent number: 5966486Abstract: A technique for passive alignment of an opto-electronic device, such as laser, by alignment fiducials to a silicon wafer board utilizes a tilted notch in the opto-electronic device. This system overcomes limitations using standard etched notches for previous passive alignment systems. Specifically, the tilted notch presents a range of offset distances between the edge of the notch and the active light-emitting spot of the laser. Depending on the location at which the wafer is diced or cleaved, the distance from the notch on the laser to the laser stripe can be adjusted after the laser wafer is fabricated.Type: GrantFiled: August 27, 1997Date of Patent: October 12, 1999Assignees: The Whitaker Corporation, Lasertron IncorporatedInventors: Robert Addison Boudreau, Dennis Bowler, Hongtao Han, Daniel Pulver, John Woodhouse, Ping Zhou
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Patent number: 5963696Abstract: The end of an optical fiber is slantingly cut at an angle .theta.. A beam propagating refracts on the end surface at a slanting angle .alpha.. A Laser chip should ideally be mounted at a spot deviating by x.sub.0 =Ltan .alpha. from the center on the package, where L is the distance between the lens center plane and the laser surface. The fiber should be deviating in the reverse direction of the deviation of the laser. The deviation of the fiber should ideally be a product of x.sub.0 and the multiplying ratio of the lens. The orientation of the fiber should be in the direction where the lowest point of the end surface of the fiber is the closest to the lens axis. In practice, the fiber end should be aligned for maximizing the light power by moving the fiber end parallel in xy-plane and by moving axially in z-axis without rotation. The deviation of the laser alleviates the cost and the time of alignment in the laser module.Type: GrantFiled: September 19, 1997Date of Patent: October 5, 1999Assignee: Sumitomo Electric Industries, Ltd.Inventors: Kazunori Yoshida, Hiromi Nakanishi, Naoyuki Yamabayashi
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Patent number: 5938951Abstract: Method and apparatus for bonding a contact element (17) on a substrate (20), in which the contact element is held by a connecting device designed, in particular, as a bonding head (11) and the contact element or the substrate or both are loaded with thermal energy, whereinthe contact element rests on the substrate when loaded with energy and a relative movement takes place between the contact element and the substrate,reference energy issuing from an emission surface (28) and transmitted to the contact element (17) is measured during the relative movement as a reference value for the quality of the relative position of the contact element (17), andthe relative movement and the energy loading are interrupted when an adequate reference value is measured.Type: GrantFiled: December 14, 1995Date of Patent: August 17, 1999Assignee: Fraunhofer-Gesellschaft zur Forschung E.V.Inventor: Ghassem Azdasht
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Patent number: 5896481Abstract: An optical subassembly comprises a micro-optical bench and a corresponding molded device submount having an optical detector, LED, or laser diode mounted thereon. The optical bench is a semiconductor wafer having one or more grooves etched therein. A submount groove is designed to receive a cooperating ridge on a bottom surface of the molded device submount so as to limit the movement of the submount on the optical bench. An optical fiber is secured in an alignment groove and secured to the optical bench. To complete the subassembly, it is only necessary to set the axial distance between the optical detector, LED, or laser diode and a distal end of the optical fiber. A fiber stop incorporated into the micro-optical bench automatically adjusts the axial positioning of the distal end of the fiber to the optical detector, LED, or laser diode. In addition, a hermetically sealed package is provided with a faceplate that is secured to the package.Type: GrantFiled: May 30, 1997Date of Patent: April 20, 1999Assignee: The Boeing CompanyInventors: Mark William Beranek, Harold Edward Hager, Eric Yuen-Jun Chan
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Patent number: 5857049Abstract: An optoelectronic module is disclosed in which an optoelectronic device is precisely aligned with an optical fiber. The optoelectronic module comprises a first member, a second member for supporting an end of the optical fiber in a fixed position relative the first member along an axis, and a third member for mounting at least one optoelectronic device. A plurality of positioning members are adjustably positioned on the first member for supporting the third member to maintain aligned relation of the optoelectronic device with the axis.Type: GrantFiled: May 5, 1997Date of Patent: January 5, 1999Assignees: Lucent Technologies, Inc.,, Motorola, Inc.,, The Boeing CompanyInventors: Mark W. Beranek, George E. Charles, Barbara M. Foley, Peter F. Lilienthal, II, Muhammed A. Shahid
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Patent number: 5850495Abstract: A method of aligning a bi-refringent optical fiber with a polarisation sensitive component positioned within a package so that the bi-refrigence axes of the fiber are set in a pre-defined relation to a light guide within the component. The fiber is inserted through an aperture in the package and is approximately aligned with the light guide of the component. An optical probe having a tip provided with an optical polariser is positioned with the tip between the end of the fiber and the component, to collect light from the fiber. The free end of the fiber is manipulated and the output from the probe is monitored until the desired polarisation alignment is achieved whereafter the probe is removed from the package whilst the rotational relationship between the fiber and the component is maintained. Then, the fiber end is moved to optically couple wish the component and the fiber is secured in position. The package may thereafter be completed in the usual way.Type: GrantFiled: March 13, 1997Date of Patent: December 15, 1998Assignee: Integrated Optical Components LimitedInventor: Adrian Charles O'Donnell
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Patent number: 5841565Abstract: It is an object of the invention to provide a light-receiving module, in which characteristic of a semiconductor amplifier unit mounted thereon is inspected on the course of fabrication and an outside photosensor do not come to nothing, and a method for fabricating the same. In the package of the light-receiving module, a semiconductor chip, which comprises an amplifier and a inside photosensor for inspecting it, and an outside photosensor for receiving a light signal are allocated. First, the inside photosensor is irradiated with a light for inspecting amplifier, and the output of the amplifier is investigated. In case that the amplifier is recognized as normal, an Al pattern communicated with the input port of the amplifier is cut, and the output port of the outside photosensor is connected with the input port of the amplifier by a bonding wire. Thus, the light-receiving is completed.Type: GrantFiled: March 20, 1998Date of Patent: November 24, 1998Assignee: NEC CorporationInventor: Tatsuo Kanai
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Patent number: 5802230Abstract: An optical semiconductor module including a housing (54), an optical semiconductor assembly (56), a movable ferrule (84), and a sleeve (60). The housing (54) has a hole (80) into which a connector ferrule (76) is inserted. The optical semiconductor assembly (56) is accommodated in the housing (54). An optical fiber (74,82) having a first end (82a) and a second end (82b) is fixed in the movable ferrule (84). The movable ferrule (84) has a thin hole (84a) in which the second end (82b) of the optical fiber (82) is inserted and fixed. The first end (82a) of the optical fiber (82) is supported so as to be optically coupled to the optical semiconductor assembly (36). The sleeve (60) is accommodated in the hole (80) of the housing (54), so as to align the movable ferrule (84) and the connector ferrule (76) with each other. The movable ferrule (84) is biased so as to be pressed against the connector ferrule (76) in the sleeve (60).Type: GrantFiled: August 12, 1997Date of Patent: September 1, 1998Assignee: Fujitsu LimitedInventors: Masaki Kuribayashi, Kazuhiko Kobayashi, Shunichi Sato, Hironao Hakogi
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Patent number: 5793915Abstract: A module which holds an optical fiber and a laser in alignment to couple light energy emitted from the laser to an end of the fiber. The fiber is held within a metal ferrule. The fiber and the laser are aligned by means of a metal platform to which both the ferrule and the laser are secured. The ferrule is secured to the platform by means of thin flexible washers which compensate for thermal expansion mismatch along the axis of the fiber. In addition, by using dissimilar metals to form the platform, transverse thermal expansion matching is attained.Type: GrantFiled: July 3, 1997Date of Patent: August 11, 1998Assignee: Lucent Technologies Inc.Inventor: William B. Joyce
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Patent number: 5764836Abstract: A passively aligned high performance optoelectronic package in pigtail form which has a reduced cost over the conventional techniques of packaging by virtue of materials and alignment techniques is disclosed. The package of the present disclosure has a ferrule made of material which substantially matches the thermal characteristics of the optical bench, with the ferrule having a flat portion on one end for securing an optical fiber on a receiving group of the optical bench. The material of the ferrule is preferably kovar. Finally, passive alignment of the optoelectronic device to the fiber is effected by way of the ferrule with the flat portion of the ferrule being partially disposed in a second ferrule or sleeve prior to commitment of the sub-assembly into the final package.Type: GrantFiled: June 11, 1996Date of Patent: June 9, 1998Assignee: The Whitaker CorporationInventor: Robert Wallace Roff
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Patent number: 5745624Abstract: A method and apparatus for aligning an optical fiber (120) with an optoelectronic hybrid device (112) and locking the optical fiber in the aligned position are disclosed. A fiber coated with an external layer of gold is threaded through a solder preform (130). The optical fiber (120) rests upon a ceramic substrate (104). The ceramic substrate also supports a device submount (108) that houses the optoelectronic device (112). The ceramic substrate (104) supports a resistor/heater formed of a thin film of nickel-chromium alloy (604). The resistor/heater supports a pad (609) formed of a layer of nickel (610) and a layer of gold (612). Located atop the pad (609) is the solder preform (130). Precise control of heating is provided by applying a predetermined voltage to the resistor/heater (122) for precise time periods, thereby eliminating the necessity of making temperature measurements during heating. As the resistor/heater (122) is energized, the solder preform is liquefied.Type: GrantFiled: August 23, 1996Date of Patent: April 28, 1998Assignee: The Boeing CompanyInventors: Eric Yuen-Jun Chan, Mark William Beranek
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Patent number: 5727105Abstract: An optical element-optical fiber composite structure having a high resistance of the optical fiber to breakage due to cyclical change in temperature, includes a package structure having a main container, side containers attached to the main container and sleeves through which a main chamber of the main container is connected to side chambers of the side containers; an optical element housed in the main chamber; and optical fibers introduced into the main chamber through the side chambers and the sleeves and connected to the optical element.Type: GrantFiled: June 11, 1996Date of Patent: March 10, 1998Assignee: Sumitomo Osaka Cement Co., Ltd.Inventors: Hirotoshi Nagata, Masaru Shiroishi, Tsutomu Saito, Takashi Tateyama, Mithuru Sakuma
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Patent number: 5719979Abstract: An optical semiconductor module comprises an optical semiconductor element, an optical fiber, a monocrystalline substrate, an airtight sealing member and a reinforcing plate. Light is transmitted through the optical semiconductor element and the optical fiber. The optical semiconductor element and the optical fiber are mounted on the monocrystalline substrate. The optical semiconductor element is sealed airtight by the airtight sealing member. An optical axis aligning mechanism for aligning the optical axis of the optical semiconductor element with the optical axis of the optical fiber is arranged on the monocrystalline substrate. The reinforcing body is welded with metal on the rear surface of the monocrystalline substrate.Type: GrantFiled: September 21, 1995Date of Patent: February 17, 1998Assignee: Kabushiki Kaisha ToshibaInventor: Hideto Furuyama
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Patent number: 5692085Abstract: The invention relates to a radiation source unit for supplying shortwave optical radiation, and to a method of assembling such a unit. The radiation source unit comprises a diode laser and a waveguide of a non-linear optical material for converting the diode laser radiation into radiation having a smaller wavelength. The diode laser is provided in a bush having a first end and a second, open end. The second end is adapted to accommodate a first holder in which a lens system is arranged for imaging the exit plane of the diode laser on the entrance plane of the waveguide. At a side of the first holder remote from the diode laser a second holder is secured in which the waveguide is arranged. Said holders are aligned and fixed with respect to each other in such a way that the chief ray of the diode laser beam, the optical axis of the lens system and the axis of the waveguide are in alignment, and that the diode laser beam is focused on the entrance aperture of the waveguide.Type: GrantFiled: August 15, 1995Date of Patent: November 25, 1997Assignee: U.S. Philips CorporationInventors: Michiel J. Jongerius, Ronald R. Drenten
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Patent number: 5692083Abstract: The present invention discloses a substantially co-linear header 100 for the alignment and packaging of an optoelectronic device 503 on an optical header with an optical fiber mounted in an optical fiber sleeve 101. The substantially co-linear arrangement of the optical sleeve with the integrally molded lens member 102 and the optoelectronic device 503, enables good performance characteristics through the elimination of reflective and refractive surfaces as disclosed in the prior art. Furthermore, the overall cost of assembly as well as of the materials required to effect the package of the present disclosure is substantially reduced over conventional design. The final result is a packaged optoelectronic device which is passively aligned to an optical fiber to effect optical communication therebetween a substantially reduced cost and improved performance characteristics.Type: GrantFiled: March 13, 1996Date of Patent: November 25, 1997Assignee: The Whitaker CorporationInventor: Christopher K. Bennett
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Patent number: 5687270Abstract: In a photodetector module including a photodetector element and an optical coupling member comprising a ferrule and an optical fiber inserted into the ferrule at a center thereof, a first transparent resin member integrates the photodetector element and the one end of the optical fiber so that the photodetector element and the one end of the optical fiber are embedded therein. A second resin member integrates the optical coupling member and the first transparent resin member so that a part of the optical coupling member and the first transparent resin member are embedded therein. Alternatively, the optical coupling member may comprise a lens member and a lens holder for holding the lens member. In this event, a transparent resin member integrates the photodetector element and the optical coupling member so that the photodetector element and a part of the optical coupling member are embedded therein.Type: GrantFiled: October 26, 1995Date of Patent: November 11, 1997Assignee: NEC CorporationInventor: Teruo Takizawa
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Patent number: 5675684Abstract: In order to position an optical semiconductor chip with high accuracy and without adjustment, a recess for controlling the displacement of the optical semiconductor chip is formed in a position in which the optical semiconductor chip on an optical element mounting substrate having an optical waveguide formed in the surface thereof is fixed.Type: GrantFiled: January 19, 1996Date of Patent: October 7, 1997Assignee: Hitachi, Ltd.Inventors: Toshinori Hirataka, Satoru Kikuchi
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Patent number: 5673350Abstract: The present invention relates to an accurate method using laser welding for mounting an optical focusing lens utilized in a semi-conductor laser module for optical transmission and optical amplification through an optical fiber and a laser module so produced. The laser module includes an aligned laser diode, a lens fixture mounting the laser diode, a focusing lens mounted within a lens housing which in turn is mounted by a lens ring to the lens fixture. In the method, the steps include aligning mutual positions between the laser diode and the optical focusing lens in the vertical and horizontal directions so that the magnitude of the optical signal output from the optical fiber is maximized after the distance between the optical focusing lens and the optical fiber is adjusted and fixed to obtain a maximum optical coupling efficiency between the laser diode and the optical fiber. Next a laser-welding step is performed at an interval between the lens housing and the lens ring.Type: GrantFiled: December 15, 1995Date of Patent: September 30, 1997Assignee: Electronics and Telecommunications Research InstituteInventors: Min-Kyu Song, Seung-Goo Kang, Hee-Tae Lee, Nam Hwang, Seong-Su Park, Dong-Goo Kim
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Patent number: 5666450Abstract: Alignment between an optical fiber and a laser diode is carried out by the steps of fixing a position sensitive detector and an optical fiber on a common supporting device, arranging a position sensitive detector opposite the laser diode, measuring the converging point of the light beams from the laser, calculating the difference between the converging point and the optical fiber, displacing the optical fiber relative to the laser diode by the calculated difference for harmonizing the converging point with the center of the optical fiber within a tolerance, moving minutely the optical fiber with the laser in the direction for increasing the light power emitted from the other end of the optical fiber and fixing the optical fiber at the point which gives the maximum power to the optical fiber.Type: GrantFiled: August 21, 1996Date of Patent: September 9, 1997Assignee: Sumitomo Electric Industries,Ltd.Inventors: Yasushi Fujimura, Yoshiki Kuhara, Naoyuki Yamabayashi
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Patent number: 5631989Abstract: A connector assembly for coupling an optical fiber to an active optical device has a metal sleeve and an L-shaped alignment block having perpendicularly disposed reference surfaces. A resilient member on the sleeve biases an optical fiber terminating plug against the reference surfaces. The active optical device is attached to a ceramic sub-mount and the sub-mount is placed on one of the reference surfaces. The sub-mount is sized so that an optical port for the active optical device will become aligned with the central axis of the plug. To couple the optical fiber with the active optical device, the plug is slid into contact with the active optical device and is rotated until the fiber is substantially registered with the optical port. The sleeve may have a second resilient member for receiving another plug from the opposite end of the sleeve with a fiber in the other plug being coupled to a second optical port.Type: GrantFiled: November 22, 1995Date of Patent: May 20, 1997Assignee: Lucent Technologies Inc.Inventors: Uziel Koren, Henry H. Yaffe, Norman R. Lampert
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Patent number: 5625735Abstract: In a method for fixing a polarization-preserving optical fiber the fiber is illuminated transversely and orientation of the polarization-preserving plane of the fiber is monitored by direct visual examination of internal components of the fiber rendered visible by such illumination. The illumination is effected through the wall of a transparent ferrule holding the fiber. The method has applications in fiber optical telecommunications systems.Type: GrantFiled: October 13, 1995Date of Patent: April 29, 1997Assignee: Alcatel N.V.Inventors: Michel Di Maggio, Christian Brot, Christian Duchet
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Patent number: 5623337Abstract: In a method of adjusting an optical axis of an optical fiber to a beam axis of a light beam of an optical element, light power values are measured at a plurality of positions to define a specific function which is determined by the light power values and the positions and which has a specific maximum value at a specific maximum position. The optical fiber and the optical element are relatively moved to the specific maximum position to measure a measured light value at the specific maximum position. The specific function is modified by the use of the measured light value to relatively move the optical fiber and the optical element to a final position. Such adjustment may be made three-dimensionally and/or rotatably. On rotatable adjustment, a predetermined value may be set instead of the specific maximum value.Type: GrantFiled: September 27, 1995Date of Patent: April 22, 1997Assignee: NEC CorporationInventors: Hiroko Iori, Akio Ukita
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Patent number: 5613026Abstract: An optical element-optical fiber composite structure having a high resistance of the optical fiber to breakage due to cyclical change in temperature, includes a package structure having a main container, side containers attached to the main container and sleeves through which a main chamber of the main container is connected to side chambers of the side containers; an optical element housed in the main chamber; and optical fibers introduced into the main chamber through the side chambers and the sleeves and connected to the optical element.Type: GrantFiled: December 22, 1994Date of Patent: March 18, 1997Assignee: Sumitomo Osaka Cement Co., Ltd.Inventors: Hirotoshi Nagata, Masaru Shiroishi, Tsutomu Saito, Takashi Tateyama, Mithuru Sakuma, Naoki Kougo, Susumu Murata, Ryosuke Kaizu, Nobuhide Miyamoto
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Patent number: 5596664Abstract: Transmitter module for optical interconnections, comprising a metal container housing an optical emitting device, an integrated circuit containing the driving circuit of the emitting device and an optical fibre extending outside the container, the emitting device being mounted on a metallic ground area realized on the integrated circuit. The cathode is electrically connected to the ground area and the anode is connected to a second metal area, connected with the output of the driving circuit. The module uses a type of assembly which minimises problems due to the length of the connecting wires, to parasitic effects and to the effects of signal reflections due to impedance mismatching. It also requires reduced power for its operation and it is provided with a structure facilitating dissipation.Type: GrantFiled: September 20, 1995Date of Patent: January 21, 1997Assignee: CSELT-Centro E Laboratori Telecomunicazioni S.p.A.Inventors: Bruno Bostica, Franco Delpiano, Luca Pesando
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Patent number: 5594826Abstract: A nose adapter for use with light boxes that illuminate fiberoptic light bundles. A retaining member is provided with a mounting aperture having predetermined standardized interior dimensions. One or more insert members are each provided with standardized exterior dimensions which are approximately equal to those of the mounting aperture, and with interior dimensions which are approximately equal to those of the end of a particular light bundle. First fastening means allows the light bundle to be easily inserted into and removed from its insert. Second fastening means allows the nose adapter as a whole to be easily attached to and detached from the light box.Type: GrantFiled: July 19, 1995Date of Patent: January 14, 1997Assignee: Welch Allyn, Inc.Inventors: Robert J. Wood, Terrence L. Salisbury, Connie R. Walts, Michael J. Pileski
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Patent number: 5586208Abstract: An analog photodiode (PD) module converts light including many AM signals of different frequencies into electric signals. It is desirable to suppress the distortion caused by the non-linearlity of the light-current conversion in the PD module as completely as possible. Extreme convergence of beams enhances the sensitivity but raises the distortion. Prior modules suppressed the distortion at an expense of the sensitivity. The present invention overcomes this problem by positioning the end of the fiber at a point which is closer to the lens than the maximum sensitivity range, thereby providing a distortion that is smaller than the predetermined value. The high sensitivity and the low distortion are compatible at the point.Type: GrantFiled: February 3, 1995Date of Patent: December 17, 1996Assignee: Sumitomo Electric Industries, Ltd.Inventor: Naoki Nishiyama
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Patent number: 5572614Abstract: A method and apparatus for aligning a fiber tip of an optic fiber in position with respect to a fiber communications circuit disposed on a carrier having a planar surface. In the method, the steps include supporting the optic fiber with a block having a planar surface such that a movement of the block causes a corresponding movement of the fiber tip. The steps further include placing the planar surface of the block in contact with the planar surface of the carrier, thereby defining a reference plane between the block and the carrier. Finally, after the placing step, there is the steps of automatically establishing a first relative position between the block and the carrier along a first dimension of the reference plane, and automatically establishing a second relative position between the block and the carrier along a second dimension of the reference plane, wherein the second dimension is orthogonal to the first dimension.Type: GrantFiled: November 4, 1994Date of Patent: November 5, 1996Assignee: Alcatel Network Systems, Inc.Inventor: Richard E. Lucas, Jr.
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Patent number: 5570444Abstract: The end of an optical fibre is held in alignment with an injection laser by securing the fibre to an elongate support member whose end nearer the injection laser is then laser beam welded to a pair of slide members that have previously been secured by laser beam welding to leave a precisely dimensioned small gap between the support and slide members. The smallness of the gap minimises displacement of the fibre during the welding process. The end of the support member remote from the injection laser is secured by laser beam welding to a plastically deformable saddle.Type: GrantFiled: December 12, 1995Date of Patent: October 29, 1996Assignee: Northern Telecom LimitedInventors: Adrian P. Janssen, Alan Donaldson
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Patent number: 5555331Abstract: Device for connecting at least one optical fiber to at least one integrated-optics waveguide which is formed within a substrate at a predetermined distance from one of the faces of the substrate constituting a reference plane, including a receptacle (2) capable of receiving the terminal portion of the optical fiber (8) and a planar support (3) capable of receiving the substrate (9) applied against said support (3) through its reference plane (9a), the receptacle (2) and the support (3) being arranged in such a manner that the axis of the waveguide (10) and the axis of the optical fiber (8) are situated in one and the same plane parallel to the reference plane (9a) of the substrate (9).Type: GrantFiled: May 9, 1995Date of Patent: September 10, 1996Assignee: RadiallInventors: Gilles Billet, Huan B. Yin
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Patent number: 5553182Abstract: An optical fiber alignment assembly including an alignment fixture for controllably positioning an optical fiber including an optical fiber carrier defining at least one channel extending inwardly from a first surface of the optical fiber carrier which is adapted for receiving an optical fiber. The optical fiber carrier also defines at least one passageway from a second surface of the optical fiber carrier, opposite the first surface, to each channel. The passageway is at least partially filled with a thermal transfer material and an optical fiber bonding material is disposed within the channel and is adapted to bond an optical fiber to the optical fiber carrier. The optical fiber bonding material has a predetermined melting temperature such that by applying heat to the thermal transfer material, the optical fiber bonding material becomes at least partially malleable.Type: GrantFiled: February 14, 1995Date of Patent: September 3, 1996Assignee: McDonnell Douglas CorporationInventor: John M. Haake
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Patent number: 5537503Abstract: An optical semiconductor module for holding an optical fiber inserted in a ferrule and for coupling light into the optical fiber, including: a semiconductor light-emitting device; a lens for converging light emitted from the semiconductor light-emitting device; a holder having a cylindrical part for holding the semiconductor light-emitting device and the lens therein and for allowing the adjustment of a position where the semiconductor light-emitting device is to be fixed and thereby enabling the spacing between the semiconductor light-emitting device and the lens to be adjusted, the lens being fixed inside the cylindrical part and the semiconductor light-emitting device also fixed inside the cylindrical part with the optical axis thereof aligned with the lens; and a receptacle having an inner cylinder for holding the ferrule therein, and joined to one end of the holder by butting end to end so as to allow the joining ends to be adjusted in directions perpendicular to the optical axis of the lens so that theType: GrantFiled: August 1, 1994Date of Patent: July 16, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaaki Tojo, Noboru Kurata
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Patent number: 5535297Abstract: A light coupler comprises a light source and a light conductor coupled together by a housing. The housing is permanently deformed to increase light coupling between the light source and the light conductor.Type: GrantFiled: December 16, 1993Date of Patent: July 9, 1996Assignee: Honeywell Inc.Inventor: Randy P. Goettsche
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Patent number: 5522001Abstract: An optical device, e.g. a signal generator adapted to provide an optical signal to a fibre tail or to a socket adapted to receive a fibre tail, is assembled by two thin films of adhesive. One film is normal to the beam path and, preferably 50-200.mu. thick. The other film is parallel to the beam path, e.g. surrounding the beam path, and preferably 30-90.mu. thick. Conveniently the device includes an intermediary component and end of said film adheres one of said components to said intermediary component.Type: GrantFiled: January 12, 1995Date of Patent: May 28, 1996Assignee: Hewlett-Packard CompanyInventor: Simon G. P. Meadowcroft
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Patent number: 5499312Abstract: A method and apparatus for automatic passive alignment of optical waveguides with photonic devices to provide for high volume production of optical components at low cost. The invention includes an optical waveguide having an extremity for transmission of light there through. A first wetable pad is mechanically coupled with the waveguide and is arranged at a selected lateral distance from the extremity of the waveguide. The invention further includes a photonic device having a central region on a surface of the photonic device. A second wetable pad is mechanically coupled with the photonic device and is arranged at a selected lateral distance from the central region of the photonic device. A suitable material, for example solder, is chosen and used in a bond for holding the first pad in alignment with the second pad, so as to substantially provide a desired optical alignment of the extremity of the waveguide with the central region of the photonic device.Type: GrantFiled: August 31, 1994Date of Patent: March 12, 1996Assignee: Hewlett-Packard CompanyInventors: Kenneth H. Hahn, Ronald T. Kaneshiro
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Patent number: 5469456Abstract: A laser device includes a glass optical fiber secured in position to capture light output from the laser. The fiber is secured in position with solder directly to the glass of the fiber without any metallization of the fiber. The solder-only technique satisfies the critical requirement for preventing fiber movement over the lifetime standard for laser device with multimade lasers and multimode fibers.Type: GrantFiled: March 31, 1994Date of Patent: November 21, 1995Assignee: Opto Power CorporationInventors: Lesley Rogers, Michael M. Ung
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Patent number: 5434940Abstract: An optical connection for connecting an active optical device (6,52) or a passive optical device (41,63) to an optical fiber (3), having a thick metal coating (2) deposited circumferentially around the fiber. In this optical connection the device (6,52,41,63) is bonded to the polished endface of the fiber (5), with particular use being made of the thick metal surface (7) on the endface of the fiber. In another embodiment, the optical fiber (3) is etched to form various surfaces (31,32,33) for optical coupling. This etching also allows for accurate passive alignment of an etched active device (52) or a passive device (42,63) with the optical fiber.Type: GrantFiled: March 24, 1994Date of Patent: July 18, 1995Assignee: The Whitaker CorporationInventors: Robert W. Roff, Randall B. Wilson
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Patent number: 5400176Abstract: Illuminating apparatus for a microscope comprising a light source and fil changer which is arranged in a beam path between the light source and a specimen location of the microscope. The light source and the filter changer are arranged in a unit spatially and mechanically separate from the microscope and the beam path between the filter changer and the microscope includes a flexible fiber light guide.Type: GrantFiled: August 31, 1992Date of Patent: March 21, 1995Assignee: Max-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V.Inventors: Jorg Dreessen, Arthur Konnerth
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Patent number: 5381494Abstract: A packaged optical device with an integrated optical component mounted within a housing which includes an end wall confronting a cheek of the component to which an optical fiber is to be connected to communicate with an internal structure of the component. The wall has an aperture in which is mounted an elongate rigid ferrule through which the optical fiber extends, so that the end faces of the fibre and ferrule are co-planar. After the ferrule has been manipulated externally of the housing to align the fibre with the component structure, the ferrule is secured in position by a UV setting adhesive. The end face of the ferrule may be adhered to the cheek of the component to maintain the alignment.Type: GrantFiled: July 2, 1993Date of Patent: January 10, 1995Assignee: Integrated Optical Components Ltd.Inventors: Adrian C. O'Donnell, Jake D. Dodson
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Patent number: 5351331Abstract: A method of splicing a pair of optical fibers including, molding a base with a groove therein extending from a first inlet to a second inlet with a tapered portion at each inlet to act as a guide during the positioning of the fibers. Positioning the ends of the optical fibers in the inlets of the groove and introducing an index matching fluid into the groove. A cover having a hole therethrough may be positioned over the groove and the fluid introduced through the hole. The fluid is cured to hold the fibers fixedly in the groove and form an optical link therebetween. The cover may be molded with a perpendicular groove therein and photonic devices mounted in the cover groove.Type: GrantFiled: September 17, 1993Date of Patent: September 27, 1994Assignee: Motorola, Inc.Inventors: Christopher K. Y. Chun, Davis H. Hartman, Shun-Meen Kuo, Michael S. Lebby
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Patent number: 5347604Abstract: A sub-assembly containing an optical element and having a holder portion into which a ferrule that is attached to the end portion of an optical fiber can be inserted with sufficient gap, an electronic circuit electrically connected to the optical element, and a lead frame are molded with a transfer mold resin to produce a molded sub-assembly. The ferrule is inserted into the holder portion of the molded subassembly, and the optical coupling efficiency between the optical fiber and the optical element is adjusted while moving the ferrule in the ferrule insertion direction, a direction perpendicular thereto or by rotating the ferrule.Type: GrantFiled: June 7, 1993Date of Patent: September 13, 1994Assignee: Sumitomo Electric Industries, Ltd.Inventors: Hisao Go, Mitsuaki Nishie, Keiichi Imamura
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Patent number: 5343548Abstract: An apparatus for aligning a substantially co-linear array of optical devices with a substantially co-linear array of optical fibers comprising; a carrier having a slot for receiving the array of devices and the array of optical fibers; a first support plate having a first holder for holding the array of devices in place with respect to the first support plate, and electrical connections for electrically connecting to selected ones of the devices in the array of devices; a second support plate having a second holder for holding the array of fibers in rough alignment with the array of devices; and a positioner for positioning the carrier with respect to the first holder and the second holder so that when the holders are activated, the array of devices and the array of fibers are held in approximate alignment without the presence of the carrier.Type: GrantFiled: December 15, 1992Date of Patent: August 30, 1994Assignee: International Business Machines CorporationInventors: Shawn A. Hall, Ramon Lane, Han-chung Wang
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Patent number: 5319729Abstract: The material similarity of all-silica waveguides or other devices and optical fibers is utilized to establish an epoxy-free fusion interfacing between optical fibers and integrated-optic devices by using laser welding techniques. This is uniquely applicable to all-silica integrated devices since they have virtually identical material properties to those of optical fibers. The method comprises the steps of machining a locating groove in a silica block, fixing a prepared length of the optical fiber in the locating groove, bringing the block and the device into juxtaposition and aligning the block and the device to provide maximum transmission of a signal from the fiber to the device and laser welding the block and the device together.Type: GrantFiled: February 25, 1993Date of Patent: June 7, 1994Assignee: GPT LimitedInventors: James J. Allen, Noorallah Nourshargh
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Patent number: 5307434Abstract: Disclosed is a laser/fiber mount that can advantageously be used in laser transmitter packages for a variety of purposes, including pump laser packages for optically amplified optical fiber transmission systems and fiber-to-the-home systems. Both laser and fiber are attached to the same unitary body, preferably a Si body. An integral heater serves to melt a quantity of solder that serves to bond the fiber to the body after alignment of the fiber to the laser. A relatively thick dielectric layer underneath the heater provides a large thermal impedance, insuring that the temperature of the unitary body is at least 50.degree. C. (preferably 150.degree. C.) less than that of the solder.Type: GrantFiled: July 16, 1992Date of Patent: April 26, 1994Assignee: AT&T Bell LaboratoriesInventors: Greg E. Blonder, William M. MacDonald
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Patent number: RE36157Abstract: The present invention is directed to a heat shrink clad core optical conduit and to an optical conduit having either a thermoplastic, thermoset or liquid, light transmitting core surrounded by, preferably a fluoropolymer cladding which is in turn surrounded by a tight-fitting, finish polymer jacket which may be either transparent or translucent, and is preferably made of a polyvinyl chloride, polycarbonate, acrylic or silicone material. Numerous fillers and inserts may be used in the finish jacket polymer and the finish jacket polymer may be formed into various shapes. Bondable jacket materials may be used. The preferred method of forming the manufacturing jacket around a heat shrinkable fluoropolymer cladding is by extruding a low extrusion temperature polymer over a heat shrink clad in its expanded form into which an increased interior pressure is maintained to prevent shrinkage during the extrusion process.Type: GrantFiled: August 21, 1996Date of Patent: March 23, 1999Assignee: Lumenyte International Corp.Inventors: John A. Robbins, James R. Zarian, Sandford R. Willford