Including Lens Patents (Class 385/93)
  • Patent number: 10756824
    Abstract: A system includes a first free-air optical interconnect of a first electrical component, the first free-air optical interconnect configured to mechanically couple to a second free-air optical interconnect of a second electrical component to communicate optical signals between the first and second electrical components. When coupled, an attach mechanism of the first free-air optical interconnect can retain the second free-air optical interconnect a fixed distance from the communication interface of the first free-air communication interface, including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of a laser emitter configured to transmit laser energy across an air gap to a separate device, or a photodiode configured to detect laser energy received across the air gap from the separate device.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: August 25, 2020
    Assignee: Intel Corporation
    Inventor: Arvind Sundaram
  • Patent number: 10746944
    Abstract: A laser device includes: a plurality of collimating lenses collimate light emitted from the plurality of light sources; a plurality of holders each hold a pair of light sources and the collimating lens and which adjust emission positions and emission angles of the collimated light of the collimating lenses; a housing which holds the plurality of holders; a light condensing part which condenses each of the collimated light whose emission position and emission angle are adjusted; a heat exhausting member which exhausts heat generated from the plurality of light sources; and a heat transfer member which is disposed between the heat exhausting surfaces of the light sources and a heat absorbing surface of the heat exhausting member, includes an elastic part abutting against the heat exhausting surfaces and the heat absorbing surface, has heat conductivity, and transfers the heat from the heat exhausting surfaces to the heat absorbing surface.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: August 18, 2020
    Assignee: Shimadzu Corporation
    Inventors: Naoya Ishigaki, Koji Tojo
  • Patent number: 10678003
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 9, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Xuxia Liu, Yongliang Huang, Qian Shao
  • Patent number: 10656349
    Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axi
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: May 19, 2020
    Inventors: Jacob Hasharoni, Ben Rubovitch, Mordechai Cabessa, Amir Geron
  • Patent number: 10582611
    Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: March 3, 2020
    Assignee: Finisar Corporation
    Inventors: Cindy H. Hsieh, Frank J. Flens, Ziv Lipkin
  • Patent number: 10535571
    Abstract: Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: January 14, 2020
    Assignee: Acacia Communications, Inc.
    Inventors: Diedrik Vermeulen, Long Chen, Christopher Doerr
  • Patent number: 10522924
    Abstract: An electrical receptacle connector includes a insulated block, first receptacle terminals, second receptacle terminals, an insulated housing, and a metallic shell. A first surface of the insulated block includes a plurality of first engaging grooves for holding the first receptacle terminals, and a second surface of the insulated block includes a plurality second engaging grooves. Accordingly, when the insulated block is formed in a first molding procedure, the first receptacle terminals and the second receptacle terminals are respectively positioned on the insulated block. Next, a second molding procedure is applied to form the insulated housing out of the insulated block. Therefore, the difficulties in manufacturing the components of the connector and the cost for manufacturing the connector can be reduced, while the manufacturing efficiency of the connector can be improved.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: December 31, 2019
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Fan-Cheng Huang, Ying-Te Lin
  • Patent number: 10459177
    Abstract: Provided are an optical alignment device applied to an assembly process of an optical transmitter and an optical receiver that include multi-channel optical elements and optical waveguide elements for optical communication, and an optical alignment method thereof. The optical alignment device includes an element fixing case with a mounting space formed thereinside and an element insertion hole communicating with the mounting space formed at an upper side thereof, and a light source mounted in the mounting space of the element fixing case and configured to emit light toward a lower side of an optical element or an optical waveguide element which is inserted into the element insertion hole to check a position of a core.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: October 29, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS REASEARCH INSTITUTE
    Inventors: Jeong Eun Kim, Jong Jin Lee, Eun Kyu Kang, Won Bae Kwon, Soo Yong Jung
  • Patent number: 10359575
    Abstract: A ferrule for an optical fiber connector has an external surface for alignment with a complementary surface of an alignment sleeve (i.e., the inside surface of a generally cylindrical or tubular sleeve). The external surface of the ferrule is generally cylindrical, having a sectional contact surface profile that is generally oval in shape. More specifically, a plurality of points of contact between the ferrule and the sleeve are defined along a curve in cross-section, wherein the center of curvature at each of the contact points along this contact point curve (i.e., the curve containing contact points that contribute to alignment) does not lie in the plane of the axis of the array of optical fibers.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: July 23, 2019
    Assignee: NANOPRECISION PRODUCTS, INC.
    Inventors: Shuhe Li, Robert Ryan Vallance, Michael K. Barnoski
  • Patent number: 10162135
    Abstract: The invention relates to an optical transmitter assembly (OTA) for vertical coupling of light into a chip, and to a method for manufacturing the OTA. The OTA includes a laser diode, a microlens and a turning mirror mounted at a top face of a supporting substrate within a sealed enclosure, and an optical component, such as an optical isolator, a polarizer, or a microlens disposed in a substrate cavity that opens to the back face of the substrate. The optical component may be placed into the cavity after the enclosure is sealed.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: December 25, 2018
    Assignee: Lumentum Operations LLC
    Inventors: Claude Gamache, Nicolas Belanger, Scott Cameron
  • Patent number: 9983365
    Abstract: A modified MT fiber optic ferrule has optical fiber receiving holes by the front end to receive the ends of optical fibers inserted into and through the ferrule. The optical fiber receiving holes are aligned with optical fiber openings in the center of the ferrule and have lenses formed in the optical fiber receiving holes to collimate from or focus light into the optical fibers in the fiber optic ferrules. The front end of the fiber optic ferrule may also have integral mating surfaces.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: May 29, 2018
    Assignee: US Conec, Ltd.
    Inventor: Darrell R. Childers
  • Patent number: 9946028
    Abstract: A guide pin wafer may include a base wafer that includes multiple dies. Each die may include a corresponding lens cutout. The guide pin wafer may also include multiple guide pins mounted on the base wafer. Each die of the base wafer may be mounted with two or more corresponding guide pins that may be configured to engage a parallel fiber connector to the corresponding die.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: April 17, 2018
    Assignee: Finisar Corporation
    Inventors: Jiashu Chen, Steve Macica, Idan Mizrahi
  • Patent number: 9939595
    Abstract: A multi-channel laser device with a fiber array includes a housing and a ferrule. In the housing, laser components are arranged side by side, and each of the laser components is connected to a fiber array module through an optical isolator. The fiber array module includes thermal expanded fibers, and fibers out of the fiber array module are collected by the ferrule. The laser components are disposed on the same module board, and laser light radiated from the front end of a laser chip in each of the laser components is projected onto the optical isolator through a convex lens and then enters into the thermal expanded fiber. Such a structure may reach a relatively-high coupling efficiency and implement the coupling of arrayed laser components.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: April 10, 2018
    Assignee: Global Technology Inc.
    Inventors: Jian-Hong Luo, Chao-Hung Tsai, Peng Nie, Hua Liu
  • Patent number: 9912437
    Abstract: An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: March 6, 2018
    Assignee: Finisar Corporation
    Inventors: Tao Wu, Hongyu Deng, Maziar Amirkiai, Shanshan Zeng, Tengda Du, Yunpeng Song
  • Patent number: 9905548
    Abstract: A an optical module integrated package includes a substrate, a light-receiving chip mounted in a light-receiving region of the substrate, an electronic component mounted in the substrate, a cover mounted on the substrate and having a light-receiving chip disposed above the light-receiving hole, and a lens fixedly mounted in the light-receiving hole of the cover. Thus, the optical module integrated package not only have the chip and the electronic component integrated therein to reduce the packaging cost and to improve the yield but also provide a light filtering, focusing or diffusing effect to enhance optical recognition accuracy.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: February 27, 2018
    Assignee: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventors: Ming-Te Tu, Yao-Ting Yeh, Yu-Chen Lin
  • Patent number: 9851521
    Abstract: A connectorized optical chip assembly connectable to an external optical fiber having a fiber connector is provided. The connectorized optical chip assembly includes a substrate, an optical chip having an on-chip optical waveguide and a connectorized interface. The connectorized interface includes an optical coupling element mounted in optical alignment with the on-chip optical waveguide. The connectorized interface includes a chip connector engaging the optical coupling element and configured for mating with the fiber connector of the external optical fiber, so as to provide an optical coupling of light between the optical coupling element and the external optical fiber. The connectorized optical chip assembly also includes a mechanical support structure supporting the connectorized interface onto the substrate. Preferably, the components of the connectorized optical assembly are made of materials heat resistant to temperatures used to melt solder in surface mount processes.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: December 26, 2017
    Assignee: Ciena Corporation
    Inventors: Francois Pelletier, Christine Latrasse, Marie-Josée Picard, Michel Poulin, Yves Painchaud
  • Patent number: 9837588
    Abstract: A light-emitting device package and a lighting apparatus including the light-emitting device package are provided. The light-emitting device package may include a body, a light-emitting device provided on the body, a phosphor layer provided on the body and the light-emitting device, and a lens provided on the phosphor layer that refracts and reflects light discharged from the light-emitting device and having a lens body. The lens body may include a side portion, a recess having a curved surface and provided at a center of an upper surface of the lens body, and an edge portion having a convex rounded shape and provided between the recess and the side portion.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: December 5, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yang Hyun Joo, Sang Jun Park
  • Patent number: 9804345
    Abstract: An optical module-member is provided, including: a layer-shaped optical waveguide; a light-emitting unit substrate including an insulating substrate, light-emitting element-mounting portions where light-emitting elements are configured to be mounted so as to be optically connected to the optical waveguide, and driving element-mounting portions which are electrically connected to the light-emitting element-mounting portions where driving elements for driving the light-emitting elements are configured to be mounted; and a light-receiving unit substrate which is separated from the light-emitting unit substrate, the light-receiving unit substrate including: an insulating substrate, light-receiving element-mounting portions where light-receiving elements are configured to be mounted so as to be optically connected to the optical waveguide, and signal amplification element-mounting portions which are electrically connected to the light-receiving element-mounting portions and where signal amplification elements for
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: October 31, 2017
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Makoto Fujiwara, Shinya Arai
  • Patent number: 9773765
    Abstract: Compact optoelectronic modules are described that, in some implementations, can have reduced heights, while at the same time having very little optical crosstalk or detection of stray light. An optoelectronic module having optical channel can include a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths. The module has a cover including an optically transmissive portion over the optoelectronic device. The optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths. A passive optical element is present on a surface of the optically transmissive portion. A spacer separates the support from the cover. The cover can be relatively thin so that the overall height of the module is relatively small.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: September 26, 2017
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventor: Jens Geiger
  • Patent number: 9746625
    Abstract: The embodiments of the present disclosure disclose an optical module, comprising a housing, an adaptor and an optical sub-module being provided inside the housing, the adaptor being fixed with the optical sub-module, wherein an optical port component is also provided inside the housing, the optical port component is located at one side of the adaptor far away from the optical sub-module, and an opening is formed at one end of the optical port component far away from the adaptor; a through hole for the optical port component is formed on an end surface of the optical port component close to the adaptor, the adaptor can pass through the through hole for the optical port component to be fixed with the optical port component, and an optical fiber can be inserted into the adaptor from the opening.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 29, 2017
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA, CORP., HISENSE INTERNATIONAL CO., LTD.
    Inventors: Wei Zhao, Wei Cui, Hongchao Pan, Yinlong Liu, Lin Yu
  • Patent number: 9742972
    Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: August 22, 2017
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Chin-Ding Lai, Ta-Sheng Yu, Han-Kai Wang
  • Patent number: 9638879
    Abstract: An adapter panel arrangement including a chassis and a panel of adapters. The adapters defining open rearward cable connections and open forward cable connections of the panel arrangement. The adapters being arranged in arrays that slide independently of other adapter arrays to provide access to the open rearward and open forward cable connections.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: May 2, 2017
    Assignee: COMMSCOPE TECHNOLOGIES LLC
    Inventors: Mark Smrha, Hutch Coburn, Chad J. Sjodin
  • Patent number: 9601896
    Abstract: The method comprises: detecting the positions (uo, vo) and (u1, v1) of said photonic beam (L) according to the coordinate axes X, Y on a first and second plane XY, which cut an optical axis X at a first and second point, respectively; comparing the results of said positional detections (uo, vo) and (u1, v1), and: if there are discrepancies which lie outside the margin of error (p), adjusting the angle of the photonic beam (L) according to the angle ? and/or the angle ? in order to overcome said discrepancies; or if there are no discrepancies which lie outside said margin of error (p), considering the angle of said photonic beam (L) as being properly adjusted. The system is adapted to implement the method set out by the invention.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: March 21, 2017
    Assignee: Jeanologia, S.L.
    Inventors: Sebastian R. De Echaniz, José M. Ibánez Barón, Ramon Sans Ravellat
  • Patent number: 9559493
    Abstract: A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: January 31, 2017
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Vincent Wai Hung, Wei Ma, Xiaoming Yu
  • Patent number: 9500822
    Abstract: There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: November 22, 2016
    Assignee: SONY CORPORATION
    Inventors: Hirohito Miyazaki, Tsuyoshi Ogawa, Kazuyoshi Yamada
  • Patent number: 9449955
    Abstract: A an optical module integrated package includes a substrate, a light-receiving chip mounted in a light-receiving region of the substrate, an electronic component mounted in the substrate, a cover mounted on the substrate and having a light-receiving chip disposed above the light-receiving hole, and a lens fixedly mounted in the light-receiving hole of the cover. Thus, the optical module integrated package not only have the chip and the electronic component integrated therein to reduce the packaging cost and to improve the yield but also provide a light filtering, focusing or diffusing effect to enhance optical recognition accuracy.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: September 20, 2016
    Assignee: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventors: Ming-Te Tu, Yao-Ting Yeh, Yu-Chen Lin
  • Patent number: 9429715
    Abstract: An optical connector (1) for transferring light sent by fibers (2) and comprises a resin body (10) and a plurality of first lenses (11) and second lenses (12), the resin body (10) includes a bottom surface (102), a top surface (101) opposite to the bottom surface (102), a front surface (103) connecting the top surface (101) and the bottom surface (102), a first slant surface (106) and a second slant surface (105) form an angle with the bottom surface (102), the first lenses (11) are set on the first slant surface (106), the second lenses (121) are set on the second slant surface (105), the projections of the first lenses (11) and second lenses (12) that projected on the bottom surface (102) are not aligned with each other.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: August 30, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chun-Yi Chang, Jia-Hau Liu
  • Patent number: 9400360
    Abstract: A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications than known TO-can assemblies. The modified TO-can assembly has a receptacle that has been modified to receive an optical fiber through its side instead of through its end. Within the TO-can assembly, the optical path is folded in order to couple the light between the optoelectronic component of the TOSA or ROSA and the end of the optical fiber. The combination of these features provides the modified TO-can assembly with a compact profile that makes it more versatile with respect to spatial constraints and therefore suitable for use in a wider range of applications.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: July 26, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Laurence R. McColloch
  • Patent number: 9379518
    Abstract: The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: June 28, 2016
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventor: Zhenqiu Gao
  • Patent number: 9372315
    Abstract: A BOSA package comprising only one cylindrical TO package comprising a ROSA and a TOSA, and an optical port in optical communication with the ROSA and the TOSA. Also disclosed is a TO package comprising a TOSA for transmitting a first optical signal, a ROSA for receiving a second optical signal, an optical communication window, and a TFF positioned such that the first optical signal transmitted from the TOSA is reflected by the TFF toward the optical communication window and the second optical signal received from the optical communication window passes through the TFF and to the ROSA.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: June 21, 2016
    Assignee: Futurewei Technologies, Inc.
    Inventors: Rongsheng Miao, Yu Sheng Bai
  • Patent number: 9291783
    Abstract: An optical fiber attaching section, a photoelectric conversion device attaching section, and a lens are integrally formed by a light-transmitting resin material. The optical fiber attaching section is formed concentrically with an optical axis OA of the lens. A contact surface for the photoelectric conversion device in the photoelectric conversion device attaching section is formed having a tilt in relation to a plane that is perpendicular to the optical axis OA. As the photoelectric conversion device, a photoelectric conversion device is attached in which a contact surface for the photoelectric conversion device attaching section is formed in parallel with a light-receiving surface of a light-receiving element.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: March 22, 2016
    Assignee: ENPLAS CORPORATION
    Inventor: Kazutaka Shibuya
  • Patent number: 9274290
    Abstract: Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses and an array of optical fiber ferrules held into alignment by a lens holder sub-assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub-assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror or prism used to direct light into the lens holder sub-assembly.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: March 1, 2016
    Assignee: Cisco Technology, Inc.
    Inventors: Ravinder Kachru, Chris Togami, Kishor Desai
  • Patent number: 9268105
    Abstract: An optical connector includes a printed circuit board, at least one emitter, at least one receiver, a coupler, and a number of positioning poles. The printed circuit board includes an assembling surface defining a number of first positioning recesses therein. The emitter and the receiver are electrically connected to the assembling surface of the printed circuit board. The coupler includes a bottom surface facing toward to the printed circuit board and at least two first lenses corresponding to the emitter and the receiver. The coupler defining a number of second positioning recesses in the bottom surface corresponding to the first positioning recesses. The positioning poles are positioned between the printed circuit board and the coupler, with one end of each positioning pole inserting and being fixed into a first positioning recess and the other end of each positioning pole inserting and being fixed into a second positioning recess.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: February 23, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Li-Ying Wang He, Yi Hung
  • Patent number: 9250400
    Abstract: An optical receptacle includes a cylindrical optical fiber attaching section for attaching an end portion of an optical fiber by insertion; a cylindrical photoelectric conversion device attaching section that includes an inner circumferential surface into which a photoelectric conversion device having a light-receiving element is inserted and for attaching the photoelectric conversion device with an adhesive that is interposed within an annular adhesion space; and a lens for optically coupling the end portion of the optical fiber and the light-emitting element, and the lens is a Fresnel lens in which a second face that faces the light-receiving element includes a convex face.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: February 2, 2016
    Assignee: ENPLAS CORPORATION
    Inventor: Kazutaka Shibuya
  • Patent number: 9207411
    Abstract: A fiber connector includes a case, a light emitting element, and a fiber. The case includes a lower seat and a fiber receiving portion connected to one end of the lower seat. The lower seat defines a receiving recess with an end surface. An optical coupling portion protrudes downward from the end surface. The fiber receiving portion defines a blind hole. The light emitting element is received in the receiving recess and faces the optical coupling portion. The fiber is received in the blind hole. Light rays emitted from the light emitting element are converged to the fiber by the optical coupling portion.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: December 8, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Yi Hung
  • Patent number: 9182559
    Abstract: A light-receiving package for flat-plate mounting which can make monitor reception sensitivity of an optical signal constant without increasing the size of a module.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: November 10, 2015
    Assignees: NTT ELECTRONICS CORPORATION, NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Yuji Mitsuhashi, Toshiki Nishizawa, Ikuo Ogawa, Ryoichi Kasahara
  • Patent number: 9170385
    Abstract: The present invention provides a plug for mounting on at least one cable having at least one optical conductor, the plug comprising a body and including at least one optoelectronic converter provided with connection means arranged inside the body in a manner that is removable and interchangeable.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: October 27, 2015
    Assignee: RADIALL
    Inventors: Marnix Van Der Mee, Benoit Dupeux, Roxane Valentin, Renaud Durand
  • Patent number: 9160130
    Abstract: In an optical/electrical composite connector including a male connector and a female connector, the male connector includes a ferrule provided at an end portion of an optical fiber on a side of the male connector which is connected to the female connector, and an electrode terminal. The female connector includes a core to transmit an optical signal, a cladding to cover the core, an electric wiring provided on an outer wall surface of the cladding, a sleeve in which the ferrule is fitted, the sleeve provided at an end portion of the cladding on a side of the female connector which is connected to the male connector, and a lens provided in the sleeve. When the ferrule and the sleeve are fitted together, the electrode terminal and the electric wiring are electrically connected and the optical fiber and the core are optically connected through the lens.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: October 13, 2015
    Assignee: FUJITSU COMPONENT LIMITED
    Inventor: Osamu Daikuhara
  • Patent number: 9157792
    Abstract: A photoelectric conversion device includes a circuit board, a light emitting module, a light receiving module, and an optical coupling lens. The circuit board includes two protrusions apart from each other. The light emitting module and the light receiving module are mounted on the circuit board and are apart from each other. The optical coupling lens includes a light incident surface, a first converging lens, a second converging lens and two through holes are defined therein for locating purposes. The first converging lens and the second converging lens are formed on the light incident surface. Centers of the through holes are aligned with centers of the protrusions to ensure the perfect alignment of the light emitting module with the first converging lens, and the perfect alignment of the light receiving module with the second converging lens.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: October 13, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Yi Hung
  • Patent number: 9151911
    Abstract: A photoelectric coupling module includes a holding module and a lens module. The holding module includes a base defining a receiving recess and a cover having a protruding portion. The protruding portion is received in the receiving recess, and the protruding portion and the receiving recess cooperatively define a receiving room for holding optical fibers. The lens module is coupled to the holding module, and includes a reflective surface, a plurality of first lenses, and a plurality of second lenses. Optical axes of the first lenses cross optical axes of the second lenses on the reflective surface. The optical fibers are coupled to the second lenses.
    Type: Grant
    Filed: August 21, 2013
    Date of Patent: October 6, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: I-Thun Lin
  • Patent number: 9151925
    Abstract: Since the lens (10) includes the alignment portions (14), the lens (10) is positioned with high precision with respect to the second mold (61) during molding of the holder member (40), and the holder member (40) and the lens (10) are positioned with each other with high precision. Further, since the positioning of the lens (10) with respect to the second mold (61) may be performed using the alignment portions (14) provided outside the second optical surface (13e), influence of the heat and pressure produced by the second mold (61) and the resin during molding of the holder member (40) on the second optical surface (13e) of the lens (10) may be reduced. Therefore, occurrence of degradation, such as distortion, in the second optical surface (13e) of the lens (10) during molding of the holder member (40) may be prevented.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: October 6, 2015
    Assignee: Konica Minolta, Inc.
    Inventors: Dai Akutsu, Kazuhiro Wada, Hajime Mori
  • Patent number: 9146154
    Abstract: A photoelectric conversion device includes a circuit board, light-emitting modules, light-receiving modules, an optical coupling module, and a protecting member. The light-emitting modules and the light-receiving modules are mounted on the circuit board. The optical coupling module is mounted on the circuit board, and includes first and second optical surfaces, a reflection surface, first converging lenses formed on the first optical surface and corresponding to the light-emitting modules and the light-receiving modules, and second converging lenses formed on the second optical surface and corresponding to the first converging lenses. The protecting member is mounted on the circuit board to shield the optical coupling module, the light-emitting modules, and the light-receiving modules, and only exposes the second converging lenses.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: September 29, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: I-Thun Lin
  • Patent number: 9134483
    Abstract: An optical coupling system having an optical coupler and a light-transmissive external medium, the optical coupler comprising a light guide which extends parallel to a main plane of the optical coupler, a mirror surface which is inclined relative to the main plane by an angle of inclination and an outer surface of the coupler which abuts on the medium, the waveguide.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: September 15, 2015
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventor: Hans-Hermann Oppermann
  • Patent number: 9110246
    Abstract: An improved high power spatial filter, system and method. In the system, an optical fiber is disposed inside a ferrule channel structure, and the channel structure is aligned with a focusing lens system. The end of the fiber is at a distance D from the channel opening that faces the focusing lens system, and D is determined by the system's numeric aperture factor and the cladding thickness of the optical fiber.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: August 18, 2015
    Assignee: IPG PHOTONICS CORPORATION
    Inventors: Igor Berishev, Vadim Chuyanov, Alexey Komissarov, Nikolai Strougov
  • Patent number: 9063311
    Abstract: An optical fiber connector includes a body, a photoelectric conversion module received in the body, a receiving member, and two L-shaped optical fibers. The photoelectric conversion module includes a base, a light emitting unit, and a light receiving unit. The light emitting unit and the light receiving unit are mounted on the base. The receiving member is disposed over the light emitting unit and the light receiving unit and defines two L-shaped receiving holes. The optical fibers are received in the respective receiving holes. One end of one of the two optical fibers is optically aligned and coupled with the light emitting unit. One end of the other optical fiber is optically aligned and coupled with the light receiving unit.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: June 23, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Kai-Wen Wu, Yi-Zhong Sheu
  • Patent number: 9039304
    Abstract: A connection port provides electrical and/or optical interface capability. The combined electrical and optical interface port may include an optical communication light engine within the connection port itself. The connection port includes a connector housing, an electrical interface assembly, and an optical interface assembly incorporated together. One implementation of the optical communication light engine includes a laser diode to generate optical signals, a photo diode to receive optical signals, and an optical integrated circuit (IC) to control optical interface.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: May 26, 2015
    Inventors: Jamyuen Ko, Hengju Cheng, Simon S. Lee
  • Patent number: 9039299
    Abstract: An optical-electric converting module includes a printed circuit board (PCB) and an optical-electric coupling element. The PCB includes a supporting surface, laser diodes and photo diodes. The laser diodes and the photo diodes are positioned on the supporting surface. The optical-electric coupling element includes a lower surface. The lower surface defines a cavity. A bottom portion of the first cavity forms light-receiving coupling lenses and light-emitting coupling lenses. The optical-electric coupling element is positioned on the supporting surface, with each light-receiving coupling lens being aligned with a laser diode, and each light-emitting coupling lens being aligned with a photo diode. A distance between the light-receiving coupling lenses and the laser diodes is equal to a distance between the light-emitting coupling lenses and the photo diodes in a direction perpendicular to the support surface.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: May 26, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chang-Wei Kuo
  • Patent number: 9033593
    Abstract: An optical module which includes a housing having a placing portion and an optical input-output portion facing an optical input-output surface of a ferrule; a first fixing portion for fixing the ferrule to the housing in the direction of the Z-axis perpendicular to the placing portion; and a second fixing portion for fixing the ferrule to the housing in the direction of the Y-axis perpendicular to the optical input-output surface, wherein the second fixing portion can change states from the first state to the second state; the first fixing portion fixes the ferrule in the direction of the Z-axis, and does not fix the ferrule in the Z-axis direction when the first fixing portion is at a second position; and the first fixing portion moves from the second position to the first position when the second fixing portion changes its state to a specific state.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: May 19, 2015
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yozo Ishikawa, Hideyuki Nasu, Toshinori Uemura
  • Publication number: 20150131947
    Abstract: A surface (3a?) having light of a light emitting element (10) inputted thereto and monitor light outputted therefrom is formed as a part of an optical plate (3), and an output surface (12) having coupling light outputted therefrom is formed as a part of an optical block (4), thereby simply and highly accurately forming the optical surfaces (3a?, 12). Then, the optical plate (3) and the optical block (4) are simply and highly accurately combined by being fitted together by means of fitting sections (21, 25).
    Type: Application
    Filed: June 3, 2013
    Publication date: May 14, 2015
    Applicant: Enplas Corporation
    Inventors: Shimpei Morioka, Kazutaka Shibuya, Masahiro Tanazawa
  • Publication number: 20150131948
    Abstract: A method of forming a fiber optic device includes securing one or more optical fibers to a support. The support is coupled to a base that includes one or more optoelectronic devices. After one or more of the fibers are secured to the support, and the support is secured to the base, one or more of the fibers are cleaved. A portion of the one or more optical fibers that is in contact with the support may be bent. This method, and fiber optic devices made using this method are more easily aligned and may be produced at lower costs than existing manufacturing processes.
    Type: Application
    Filed: January 23, 2015
    Publication date: May 14, 2015
    Inventors: Raman K. Selli, Brian M. Cole, Donald G. Doss