With Housing Patents (Class 385/92)
  • Patent number: 11909447
    Abstract: An optical transceiver module includes a first housing, a second housing, an engagement component, a conductive body, and a circuit board. The first housing has a first sidewall and a first groove. The first groove is closer to a central line of a major axis of the first housing than the first sidewall. The second housing is assembled with the first housing. The second housing has a second sidewall. The second sidewall is extended into the first groove. The engagement component has a first engagement portion. The first engagement portion is extended between the first sidewall and the second sidewall. The conductive body is disposed between the first groove and the second sidewall. The circuit board is disposed between the first housing and the second housing to perform photoelectric conversion. Therefore, the stroke of the engagement component can be fixed, and the electromagnetic interference can be reduced.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: February 20, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chia-Lun Ku, Tun-Chuan Chen, Chen-Mao Lu
  • Patent number: 11835772
    Abstract: The present invention provides an optical receptacle comprising a first side wall having a first series connecting structure, and a second side wall opposite to the first side wall and having a second series connecting structure. The first series connecting structure of one optical receptacle is coupled to the second assembling element of another optical receptacle along a first direction and is moved to an assembly position so as to form an optical receptacle module. Alternatively, the first series connecting structure of one optical receptacle is coupled to the second series connecting structure of another optical receptacle along a second direction and is moved to the assembly position so as to form the optical receptacle module. Alternatively, the optical receptacle module may be coupled to the different kinds of optical connectors to form an optical connector module.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: December 5, 2023
    Assignee: ACSUPER TECHNOLOGIES INC.
    Inventor: Chung-Ming Tseng
  • Patent number: 11828993
    Abstract: An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: November 28, 2023
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Mengbo Fu, Yifan Xie, Qinhao Fu
  • Patent number: 11821787
    Abstract: The light detection element includes a magnetic element and an optical waveguide. The magnetic element includes a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer sandwiched between the first ferromagnetic layer and the second ferromagnetic layer. The optical waveguide includes at least a core and a cladding covering at least a part of the core. Light that has propagated through the optical waveguide is applied to the magnetic element.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: November 21, 2023
    Assignee: TDK CORPORATION
    Inventors: Takeshi Nojiri, Hideaki Fukuzawa, Tetsuya Shibata, Tomohito Mizuno, Susumu Aoki
  • Patent number: 11811190
    Abstract: A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: November 7, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Tatsuya Kanazawa, Kazuma Kozuru
  • Patent number: 11789223
    Abstract: An optical transceiver module includes a package containing a light receiving element, a light emitting element, and an optical modulator configured to modulate light that is output from the light emitting element, a rigid circuit board including a control circuit provided on the rigid circuit board, the control circuit being configured to control at least one of the light receiving element, the light emitting element, or the optical modulator, and a flexible circuit board including a plurality of signal wires, wherein the rigid circuit board is connected to the package via the flexible circuit board, with a first surface of the rigid circuit board facing a first surface of the package, and the at least one of the light receiving element, the light emitting element, or the optical modulator is electrically connected to the control circuit via the plurality of signal wires.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: October 17, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yasutaka Mizuno
  • Patent number: 11733467
    Abstract: An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: August 22, 2023
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasushi Fujimura, Tomoya Saeki, Munetaka Kurokawa, Masato Furukawa
  • Patent number: 11728895
    Abstract: Related to an optical communication module, the optical communication module comprises a main body, an optical communication assembly and a second circuit board. The main body comprises a housing and a first circuit board disposed on the housing. The housing and the first circuit board together form an airtight cavity of the main body, and the first circuit board comprises two first electric interfaces. The optical communication assembly is accommodated in the airtight cavity and comprises a substrate, an optical communication element and a second electric interface. The optical communication element disposed on the substrate. One of the two first electric interfaces of the first circuit board is electrically connected to the second electric interface. The second circuit board comprises a third electric interface and the other one of the two first electric interfaces of the first circuit board is electrically connected to the third electric interface.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: August 15, 2023
    Assignee: Global Technology Inc.
    Inventors: Jian-Hong Luo, Dong-Biao Jiang, Qilin Hong, Taotao Ye
  • Patent number: 11674824
    Abstract: A measurement device has a sensor and includes a cylindrical housing, an optical fiber that is disposed along the long-side direction of the housing and that has one end disposed in the housing and the other end disposed outside the housing, a first substrate including a light receiving unit disposed on an extension of the one end in the housing, and a second substrate that is electrically connected to the first substrate via a flexible part having flexibility and is disposed at an acute angle or a right angle with respect to the first substrate.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: June 13, 2023
    Assignee: Biologging Solutions Inc.
    Inventors: Takuya Koizumi, Takuji Noda
  • Patent number: 11651635
    Abstract: A system for securing contents in a container that can include a housing, at least one electromechanically operated security door securing access to the housing and a control panel for receiving input to release the electromechanically secured door from the housing. Communications components, alarms and cameras can also be associated with the housing to facilitate its security and operation and can also adapt it for access and/or package receipt (delivery) by a third party, and overall preservation and security of contents stored therein. Heating and cooling system components can maintain contents of valuable contents held within the housing at a select temperatures.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: May 16, 2023
    Inventors: Marc T Arellano, Luis M Ortiz, Thomas Romero
  • Patent number: 11624881
    Abstract: A host device configured to receive a pluggable optical module, the host device includes circuitry configured to, subsequent to insertion of the pluggable optical module, access an early management interface on the pluggable optical module, prior to the pluggable optical module being fully booted, and, subsequent to the pluggable optical module being fully booted, access a complete management interface on the pluggable optical module. The early management interface provides responses to simple queries, allowing access to one or more registers on the pluggable optical module.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: April 11, 2023
    Assignee: Ciena Corporation
    Inventors: Michael J. Wingrove, David Peter Johnson, Eric Maniloff, Munjeen Khan, Fenggao Xu
  • Patent number: 11605968
    Abstract: A charging device that includes (a) a DC to DC converter (“converter”) that includes a converter control input and a converter output for outputting a charging voltage to the supercapacitor, (b) an adjustable voltage divider, (c) a controller that is configured to (i) sense a supercapacitor voltage, (ii) determine a first target value of the supercapacitor voltage, based on an internal impedance of the supercapacitor and on a nominal supercapacitor voltage that is lower than the first target value of the supercapacitor voltage, and (iii) during a first phase of a charging process, output a control signal via the control output and to the converter control input, to set the charging voltage to one or more values that once provided to the supercapacitor cause the supercapacitor voltage to reach, at the end of the first phase of the charging process, the first target value of the supercapacitor voltage.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: March 14, 2023
    Assignee: PLIOPS LTD.
    Inventor: Naseem Jamal
  • Patent number: 11604318
    Abstract: An optical fiber sub-assembly includes: a handle, a rear retainer, an optical cable, a field mountable connector (FMC) assembly, a spindle, and a protection hood fixedly connected to the spindle. An end of the optical cable is connected to the FMC assembly, the optical cable protrudes from a first end of the FMC assembly. The FMC assembly includes a ferrule provided at a second end of the FMC assembly. The spindle is sleeved outside the first end of the FMC assembly, and the protection hood is sleeved outside the second end of the FMC assembly. An end of the spindle that is away from the protection hood is connected to the rear retainer and is used to fasten the optical cable. The handle is sleeved outside the protection hood and the spindle.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: March 14, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wei Xiong, Xiupeng Li, Jianxiong Yu, Shangjun Peng, Boyong He
  • Patent number: 11604322
    Abstract: An optical transceiver according to an embodiment includes: a housing having inner sides defining an inner space inside the housing; an optical module including a package, a semiconductor device, and a sleeve, the package being configured to house the semiconductor device, the semiconductor device generating a Joule heat, the sleeve being attached to an outside of the package, the sleeve being fixed to the housing with keeping the package away from the inner sides; a heat-conducting material filled between the package and one of the inner sides, the heat-conducting material including an oily component; and a sheet member being placed between the heat-conducting material and the package, the sheet member covering the heat-conducting material to prevent the oily component from reaching the optical module. The Joule heat is conducted from the package to the housing through the sheet member and the heat-conducting material.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: March 14, 2023
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Kazushige Oki
  • Patent number: 11600976
    Abstract: A cable gland and methods for earthing, grounding, bonding, and electromagnetic capability with armored, metal-clad, and metallic-sheathed cable types. The cable gland comprises a gland body, a plurality of extensions, an elastomer seal, a compression member configured to rotate the plurality of extensions towards to the elastomer seal, and an earthing insert mounted in the gland body configured to electrically connect a cable to a neutral and/or grounded conductor. The cable gland is configured to provide an air-tight seal between the exterior of the cable and the elastomer seal through rotation of the plurality of extension upon the elastomer seal. The cable gland may include an o-ring and nut to secure the cable gland to a planar body. The earthing insert comprises a grounding spring in electrical communication with a metallic portion of the cable and a neutral and/or grounded conductor.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: March 7, 2023
    Inventors: Allen Todd Gibson, Melissa A. Ver Meer, Solomon Otto Whitaker
  • Patent number: 11561351
    Abstract: An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: January 24, 2023
    Assignee: InnoLight Technology Pte. Ltd.
    Inventors: Yuzhou Sun, Long Chen, Dengqun Yu, Weilong Lee
  • Patent number: 11556047
    Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a first portion and a matrix structure. The first portion is connected to a first optical member and corresponds to a first light. The matrix structure is disposed on the first portion and corresponds to a second light, wherein the first light is different from the second light.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: January 17, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: Chih-Wei Weng, Juei-Hung Tsai, Shu-Shan Chen, Mao-Kuo Hsu, Sin-Jhong Song
  • Patent number: 11476637
    Abstract: A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: October 18, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Tatsuya Kanazawa, Kazuma Kozuru
  • Patent number: 11430752
    Abstract: LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: August 30, 2022
    Assignee: Scientific Components Corporation
    Inventor: Aaron Vaisman
  • Patent number: 11420293
    Abstract: Methods of reshaping ferrules used in optical fiber cables assemblies are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a true center of the ferrule, wherein the true center is based on an outer surface of the ferrule; and reshaping at least a portion of the ferrule to change the true center of the ferrule, wherein the reshaping includes enlarging a portion of the ferrule. A variety of reshaping techniques are also disclosed.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: August 23, 2022
    Assignee: Corning Optical Communications LLC
    Inventors: Dana Craig Bookbinder, Boyang Lin, Garrett Andrew Piech, Steven Ross Sims, James Scott Sutherland, Michael Brian Webb, Elvis Alberto Zambrano
  • Patent number: 11415763
    Abstract: Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. Pluggable optical transceiver modules implement a rigid-plane jumper that provides an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in a manner that does not require the fiber jumper, while ensuring reduced optical loss. In some embodiments one or more rigid waveguide plates act as an opto-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, the rigid waveguide plates are coupled to a faceplate connector, and a CWDM block that is in turn optically coupled to the optical socket. In some embodiments, the CWDM block is directly attached to the rigid waveguide plates. In some embodiments, the CWDM block is indirectly attached to the rigid waveguide plates using a half periscope.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: August 16, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Sagi Varghese Mathai, Michael Renne Ty Tan
  • Patent number: 11416048
    Abstract: First event information that is associated with an event that corresponds to a temperature of a memory sub-system is received. Whether the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies a first threshold condition is determined. Responsive to determining that the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies the first threshold condition, a thermoelectric component (TEC) is caused to change from an inactive state to an active state by decreasing a temperature at a bottom surface of the TEC that is coupled to the memory sub-system as a temperature at a top surface of the TEC increases.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: August 16, 2022
    Assignee: Micron Technology, Inc.
    Inventor: Michael R. Spica
  • Patent number: 11411650
    Abstract: The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: August 9, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Kevin Liu, Hao-Chiang Cheng
  • Patent number: 11327258
    Abstract: This optical module comprises a stem; lead pins extending through the stem; glasses filled between the stem and the lead pins; elements (photodiode, amplifier) disposed on a first main surface of the stem, and connected to the lead pins; FPC in contact with a second main surface of the stem; a cap attachable to the stem; and an aligning-fixing parts (metal-made flange, Z-sleeve) that aligns an optical fiber stub with the cap and fix the optical fiber stub to the cap.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: May 10, 2022
    Assignee: YOKOWO CO., LTD.
    Inventors: Hideki Kamitsuna, Akira Ohki
  • Patent number: 11320601
    Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 3, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, John Cheng, Ziliang Cai
  • Patent number: 11309439
    Abstract: A package structure comprises a metal plate (20) where a slot is formed, a ceramic piece (60), and a metal heat sink (70) welded onto the back surface of the ceramic piece (60). The ceramic piece (60) and the metal heat sink (70) are vertically inserted into the slot and welded to the metal plate (20). A semiconductor and a matching circuit may be disposed on the metal heat sink (70). The ceramic piece (60) replaces a glass seal; metalized interconnection is provided inside the ceramic piece (60) for fabricating a metalized pattern having complex connection relations, and the electrical interconnection is more flexible. In the package structure, metalized wiring is carried out by using the ceramic piece. Compared with round lead machining, higher precision is achieved.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: April 19, 2022
    Assignee: He Bei Sinopack Electronic Tech Co., Ltd.
    Inventors: Yao Liu, Jun Li, Jing Zhao, Jing Sun, Bin Liang, Lin Feng Zhou, Di Gao
  • Patent number: 11265087
    Abstract: The present disclosure provides a compact-optic-connecting device for mounting on a motherboard of a computer, which includes an optic-receiving unit, an optic-launching unit, two flexible-circuit plates, a circuit board and a connecting interface. The optic-receiving unit and the optic-launching unit are connected to the bottom surface of the circuit board respectively via flexible-circuit plates. The connecting interface is connected to the bottom surface of the circuit board, and also connected to an external motherboard via the connecting interface. By virtue of such structure, the compact optic-connecting device can have a small length and size, and meanwhile to maintain a safety distance between the connecting interface and the optic-receiving unit, or the connecting interface and optic-launching unit, to prevent faulty conduction therebetween.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: March 1, 2022
    Assignee: OPTOMEDIA TECHNOLOGY INC.
    Inventors: Hui-Tsuo Chou, Pei-Hsiang Hsu
  • Patent number: 11256046
    Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: February 22, 2022
    Assignee: Nokia Solutions and Networks Oy
    Inventors: Michael J. Hochberg, Ari Jason Novack, Peter D. Magill
  • Patent number: 11245474
    Abstract: An object is to output an optical signal accurately corresponding to a data signal. A pluggable optical module (100) includes a pluggable electric connector (11), a control unit (12), an optical signal output unit (13), and a pluggable optical receptor (14). The pluggable electric connector (11) can communicate a modulation signal (MOD) and a control signal (CON1) with an optical communication apparatus (92). The optical signal output unit (13) outputs an optical signal (LS) modulated by the modulation scheme by the control signal (CON1) in response to the modulation signal (MOD). The pluggable optical receptor (14) is configured in such a manner that an optical fiber (91) is insertable into and removable from the pluggable optical receptor (14). The pluggable optical receptor (14) can output the optical signal (LS) output from the optical signal output unit (13).
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: February 8, 2022
    Assignee: NEC CORPORATION
    Inventor: Hirokazu Komatsu
  • Patent number: 11209608
    Abstract: An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: December 28, 2021
    Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Xuxia Liu, Yan Zhong
  • Patent number: 11177095
    Abstract: A wall grazer apparatus is provided. The wall grazer apparatus has a heat sink platform, a light source, a lens, a driver and a main housing. The heat sink platform has a main portion and a tilt portion. The light source is mounted on the tilt portion. The lens is disposed above the light source to convert an original light emitted from the light source to an output light. The driver converts an external power to a driving current. The driving current is supplied to the light source. The main housing disposes the heat sink platform, the light source, the lens and the driver. When the main housing is fixed to a first surface, the output light is projected on a second surface for forming a visual effect.
    Type: Grant
    Filed: April 18, 2020
    Date of Patent: November 16, 2021
    Assignee: XIAMEN ECO LIGHTING CO. LTD.
    Inventors: Jinhui Liang, Yongzhe Dong, Xiaoliang Wen, Shouqiang Hou
  • Patent number: 11166371
    Abstract: A system package module is provided. The system package module includes a module substrate, a plurality of first pins and a plurality of second pins. The module substrate includes a module substrate surface. The module substrate surface includes a first pin arrangement area and a second pin arrangement area. The second pin arrangement area surrounds the first pin arrangement area. The first pins are disposed in the first pin arrangement area. A first pin gap is formed between the two adjacent first pins. The second pins are disposed in the second pin arrangement area. A second pin gap is formed between the two adjacent second pins. The first pin gap is greater than the second pin gap.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: November 2, 2021
    Assignee: WISTRON NEWEB CORP.
    Inventors: Chen-An Hsieh, Jui-Hua Hu, Shih-Wei Chang
  • Patent number: 11156857
    Abstract: An initial change and a secular change in an optical characteristic and a high frequency characteristic in a case where an optical modulator is mounted in a package of an optical transmission apparatus are suppressed while improving a space utilization rate in the package of the optical transmission apparatus. An optical modulator that is electrically connected to an electric circuit configured on a circuit board, includes a package that houses an optical modulation element, in which the package has, on a bottom surface facing the circuit board, a plurality of first protruding bodies protruding from the bottom surface.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: October 26, 2021
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Norikazu Miyazaki, Toru Sugamata
  • Patent number: 11101611
    Abstract: An I/O connector assembly configured for making a cabled connection to an interior portion of a printed circuit board for at least some signals passing through the I/O connector. The I/O connector assembly may be assembled by mounting a cage to a printed circuit board. A receptacle connector, including cables extending from a rear of the connector, may be inserted through an opening in the top or rear of the cage. The receptacle connector may be positioned in the cage by at least one retention member on the cage. A plug, mating to the receptacle connector, also may be positioned by a retention member on the cage. Positioning both the plug and receptacle relative to the cage reduces the tolerance stackup of the assembly and enables the connectors to be designed with shorter wipe length, which enables higher frequency operation.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: August 24, 2021
    Assignee: FCI USA LLC
    Inventors: Jordan Winey, Arkady Y. Zerebilov, Michael Scholeno, Jeremy Shober
  • Patent number: 11075446
    Abstract: A communication device for wireless communication includes a housing having a front dielectric cover, a back dielectric cover and a metal frame circumferentially arranged between the front dielectric cover and the back dielectric cover. The metal frame forms a first antenna that is configured to radiate in a first set of frequency bands. The communication device further includes a circuit arranged inside the housing, where the circuit is electrically isolated from the metal frame and includes at least one first feed line coupled to the metal frame and configured to feed the first antenna with a first set of radio frequency signals in the first set of frequency bands. The communication device further includes a second antenna arranged inside the housing.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: July 27, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Alexander Khripkov, Linsheng Li, Ruiyuan Tian
  • Patent number: 11067764
    Abstract: An optical transceiver includes a receptacle, a ferrule and a ferrule fastening component. The receptacle includes a supporting portion and an inset portion connected with each other. The ferrule is disposed within the inset portion. The ferrule fastening component is disposed on the receptacle. The ferrule fastening component includes a first holding portion, a cap and a second holding portion connected together. The cap is located between the first holding portion and the second holding portion. The first holding portion touches the supporting portion, the second holding portion touches the ferrule, and the cap covers a first area of a top surface of the receptacle.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: July 20, 2021
    Assignee: Prime World International Holdings Ltd.
    Inventors: Ting-Jhang Liao, YI-Ju Wang, Ming-You Lai
  • Patent number: 11054592
    Abstract: The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.
    Type: Grant
    Filed: November 24, 2019
    Date of Patent: July 6, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
  • Patent number: 11057112
    Abstract: The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: July 6, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Hang Xie
  • Patent number: 11051394
    Abstract: An optical module with enhanced heat-dissipating properties and a method for manufacturing the optical module discloses an optical module which includes a substrate, a printed circuit, a component mounting block, an active device, and a lens. The printed circuit is formed on the substrate. The component mounting block is provided on the substrate, and the component mounting block has a recess. The active device, including a laser or a photodetector, is disposed in the recess. The lens is disposed on the active device.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: June 29, 2021
    Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
    Inventor: Han-Biao Zheng
  • Patent number: 11022766
    Abstract: We generally describe an optical transceiver connector (100) comprising: a first portion (102) comprising a first port (101) configured to releasably receive an optical connector (202); and a second portion (104) comprising a second port (103) configured to releasably receive an optical converter element (205), wherein an opening of the first port (101) faces towards a first direction opposite to a second direction towards which an opening of the second port (103) faces, and wherein the first port (101) is aligned with the second port (103) for establishing a releasable, light-coupling-capable connection between a said optical connector (202) to be received by the first port (101) and a said optical converter element (205) to be received by the second port (103).
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 1, 2021
    Assignee: Leoni Kabel GMBH
    Inventors: Bolin Jiang, Juntao Deng, Marcus Bloom-Pflug, Qi Huang
  • Patent number: 11022768
    Abstract: An opto-electric hybrid board includes an optical waveguide and an electric circuit board. The opto-electric hybrid board has an electrode at one end portion in a first direction perpendicular to the thickness direction, and optically and electrically connects an optical element emitting light from a space between the one end portion and the other end portion. The electric circuit board includes a terminal portion electrically connected to the electrode and a support portion that supports the other end portion. The optical waveguide includes a light receiving portion for receiving light emitted from the optical element, which is positioned between the terminal portion and the support portion, when projected in the thickness direction, and a one-side surface in the thickness direction of the terminal portion is positioned at the other side in the thickness direction with respect to a one-side surface in the thickness direction of the support portion.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: June 1, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoto Konegawa, Yuichi Tsujita, Naoyuki Tanaka
  • Patent number: 10978826
    Abstract: An electrical connector assembly includes an insulative housing, a plurality of terminals mounted on the insulative housing, a cable electrically connected with the terminals, a magnet disposed on the insulative housing, and an inner mold integrally formed on the insulative housing and the cable, wherein the electrical connector assembly also includes a heat insulation member disposed between the magnet and the inner mold to prevent the magnet from heat of the inner mold during molding.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: April 13, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Yong-Qi Li, Jian-Hui Tan, Jun Chen, Yang-Tsun Hsu, Jerry Wu
  • Patent number: 10980145
    Abstract: Provided is a patch panel, comprising: a circuit board; and an SFP, SFP+, or QSFP+ connector connected to a plurality of radio frequency coaxial (RF coaxial) connections via conductive traces of the circuit board, the RF coaxial connections configured to extend functionality of the SFP, SFP+, or QSFP+ socket of a computing device coupled to the patch panel from a rear end of the computing device to a front end of the computing device.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: April 13, 2021
    Assignee: Vapor IO, Inc.
    Inventor: Steven White
  • Patent number: 10948672
    Abstract: A material for blocking crosstalk, an optical assembly, and a method for preparing the material are provided. The optical assembly includes an optical receive assembly, where a periphery of the optical receive assembly includes a transparent region and a non-transparent region; the transparent region is made of the material, where a first layer of film is located on a side opposite to an optical receiving direction, and a second layer of film is located on a side opposite to the optical receive assembly; and the non-transparent region is of an electrical-signal shielding structure.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: March 16, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Min Zhou, Ning Cheng, Zhenxing Liao, Huafeng Lin
  • Patent number: 10942324
    Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: March 9, 2021
    Assignee: Corning Optical Communications LLC
    Inventors: Alan Frank Evans, Andreas Matiss, Michael Wimmer
  • Patent number: 10908371
    Abstract: A transistor outline (TO) package including a header with at least one optoelectronic device. The header is bonded to a pot-shaped metal cap, which has a window that is transmissive to electromagnetic radiation, such that the at least one optoelectronic device is arranged in a hermetically sealed interior. The wall of the metal cap has at least one lateral wall portion and/or end wall portion which is thickened towards the interior compared to a portion of the lateral wall of the metal cap adjacent to the header.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: February 2, 2021
    Assignee: Schott AG
    Inventors: Robert Hettler, Georg Mittermeier
  • Patent number: 10884205
    Abstract: An optical conversion module having a printed circuit board having a proximate and a distal end and including an electrical interface at the distal end. The optical conversion module also having a faceplate modularly connected to the proximate end of the printed circuit board, the faceplate having at least one retention device. The optical conversion module further having an optical transceiver disposed on and electrically connected to the printed circuit board, a chip optical connector disposed on and optically connected to the optical transceiver, and a faceplate optical connector modularly disposed through the faceplate and modularly connected to the chip optical connector through an optical fiber jumper.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: January 5, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin Leigh, John Norton
  • Patent number: 10886700
    Abstract: An optical module control method is a method for controlling an optical module that includes a semiconductor light emitting element and an electronic cooling module configured to adjust a temperature of the semiconductor light emitting element. The optical module control method includes a step of detecting a temperature of a light emitting unit including the semiconductor light emitting element, and outputting temperature information of the semiconductor light emitting element; a step of detecting an environmental temperature and outputting temperature information of the environmental temperature, the environmental temperature being a temperature of environment where the light emitting unit is placed; and a step of controlling an output of the electronic cooling module on the basis of the temperature information of the semiconductor light emitting element and the temperature information of the environmental temperature, and adjusting the temperature of the light emitting unit.
    Type: Grant
    Filed: September 4, 2017
    Date of Patent: January 5, 2021
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yohei Enya, Hiromi Nakanishi
  • Patent number: 10886695
    Abstract: Improve semiconductor device performance. The wiring WL1A on which the semiconductor chip CHP1 in which the semiconductor lasers LD is formed is mounted has a stub STB2 in the vicinity of the mounting area of the semiconductor chip CHP1.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: January 5, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kazuaki Tsuchiyama, Motoo Suwa, Hidemasa Takahashi
  • Patent number: RE48778
    Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: October 19, 2021
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Xian Zhou, Kewu Wang