With Housing Patents (Class 385/92)
  • Patent number: 11177095
    Abstract: A wall grazer apparatus is provided. The wall grazer apparatus has a heat sink platform, a light source, a lens, a driver and a main housing. The heat sink platform has a main portion and a tilt portion. The light source is mounted on the tilt portion. The lens is disposed above the light source to convert an original light emitted from the light source to an output light. The driver converts an external power to a driving current. The driving current is supplied to the light source. The main housing disposes the heat sink platform, the light source, the lens and the driver. When the main housing is fixed to a first surface, the output light is projected on a second surface for forming a visual effect.
    Type: Grant
    Filed: April 18, 2020
    Date of Patent: November 16, 2021
    Assignee: XIAMEN ECO LIGHTING CO. LTD.
    Inventors: Jinhui Liang, Yongzhe Dong, Xiaoliang Wen, Shouqiang Hou
  • Patent number: 11166371
    Abstract: A system package module is provided. The system package module includes a module substrate, a plurality of first pins and a plurality of second pins. The module substrate includes a module substrate surface. The module substrate surface includes a first pin arrangement area and a second pin arrangement area. The second pin arrangement area surrounds the first pin arrangement area. The first pins are disposed in the first pin arrangement area. A first pin gap is formed between the two adjacent first pins. The second pins are disposed in the second pin arrangement area. A second pin gap is formed between the two adjacent second pins. The first pin gap is greater than the second pin gap.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: November 2, 2021
    Assignee: WISTRON NEWEB CORP.
    Inventors: Chen-An Hsieh, Jui-Hua Hu, Shih-Wei Chang
  • Patent number: 11156857
    Abstract: An initial change and a secular change in an optical characteristic and a high frequency characteristic in a case where an optical modulator is mounted in a package of an optical transmission apparatus are suppressed while improving a space utilization rate in the package of the optical transmission apparatus. An optical modulator that is electrically connected to an electric circuit configured on a circuit board, includes a package that houses an optical modulation element, in which the package has, on a bottom surface facing the circuit board, a plurality of first protruding bodies protruding from the bottom surface.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: October 26, 2021
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Norikazu Miyazaki, Toru Sugamata
  • Patent number: 11101611
    Abstract: An I/O connector assembly configured for making a cabled connection to an interior portion of a printed circuit board for at least some signals passing through the I/O connector. The I/O connector assembly may be assembled by mounting a cage to a printed circuit board. A receptacle connector, including cables extending from a rear of the connector, may be inserted through an opening in the top or rear of the cage. The receptacle connector may be positioned in the cage by at least one retention member on the cage. A plug, mating to the receptacle connector, also may be positioned by a retention member on the cage. Positioning both the plug and receptacle relative to the cage reduces the tolerance stackup of the assembly and enables the connectors to be designed with shorter wipe length, which enables higher frequency operation.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: August 24, 2021
    Assignee: FCI USA LLC
    Inventors: Jordan Winey, Arkady Y. Zerebilov, Michael Scholeno, Jeremy Shober
  • Patent number: 11075446
    Abstract: A communication device for wireless communication includes a housing having a front dielectric cover, a back dielectric cover and a metal frame circumferentially arranged between the front dielectric cover and the back dielectric cover. The metal frame forms a first antenna that is configured to radiate in a first set of frequency bands. The communication device further includes a circuit arranged inside the housing, where the circuit is electrically isolated from the metal frame and includes at least one first feed line coupled to the metal frame and configured to feed the first antenna with a first set of radio frequency signals in the first set of frequency bands. The communication device further includes a second antenna arranged inside the housing.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: July 27, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Alexander Khripkov, Linsheng Li, Ruiyuan Tian
  • Patent number: 11067764
    Abstract: An optical transceiver includes a receptacle, a ferrule and a ferrule fastening component. The receptacle includes a supporting portion and an inset portion connected with each other. The ferrule is disposed within the inset portion. The ferrule fastening component is disposed on the receptacle. The ferrule fastening component includes a first holding portion, a cap and a second holding portion connected together. The cap is located between the first holding portion and the second holding portion. The first holding portion touches the supporting portion, the second holding portion touches the ferrule, and the cap covers a first area of a top surface of the receptacle.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: July 20, 2021
    Assignee: Prime World International Holdings Ltd.
    Inventors: Ting-Jhang Liao, YI-Ju Wang, Ming-You Lai
  • Patent number: 11054592
    Abstract: The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.
    Type: Grant
    Filed: November 24, 2019
    Date of Patent: July 6, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
  • Patent number: 11057112
    Abstract: The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: July 6, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Hang Xie
  • Patent number: 11051394
    Abstract: An optical module with enhanced heat-dissipating properties and a method for manufacturing the optical module discloses an optical module which includes a substrate, a printed circuit, a component mounting block, an active device, and a lens. The printed circuit is formed on the substrate. The component mounting block is provided on the substrate, and the component mounting block has a recess. The active device, including a laser or a photodetector, is disposed in the recess. The lens is disposed on the active device.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: June 29, 2021
    Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
    Inventor: Han-Biao Zheng
  • Patent number: 11022768
    Abstract: An opto-electric hybrid board includes an optical waveguide and an electric circuit board. The opto-electric hybrid board has an electrode at one end portion in a first direction perpendicular to the thickness direction, and optically and electrically connects an optical element emitting light from a space between the one end portion and the other end portion. The electric circuit board includes a terminal portion electrically connected to the electrode and a support portion that supports the other end portion. The optical waveguide includes a light receiving portion for receiving light emitted from the optical element, which is positioned between the terminal portion and the support portion, when projected in the thickness direction, and a one-side surface in the thickness direction of the terminal portion is positioned at the other side in the thickness direction with respect to a one-side surface in the thickness direction of the support portion.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: June 1, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoto Konegawa, Yuichi Tsujita, Naoyuki Tanaka
  • Patent number: 11022766
    Abstract: We generally describe an optical transceiver connector (100) comprising: a first portion (102) comprising a first port (101) configured to releasably receive an optical connector (202); and a second portion (104) comprising a second port (103) configured to releasably receive an optical converter element (205), wherein an opening of the first port (101) faces towards a first direction opposite to a second direction towards which an opening of the second port (103) faces, and wherein the first port (101) is aligned with the second port (103) for establishing a releasable, light-coupling-capable connection between a said optical connector (202) to be received by the first port (101) and a said optical converter element (205) to be received by the second port (103).
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 1, 2021
    Assignee: Leoni Kabel GMBH
    Inventors: Bolin Jiang, Juntao Deng, Marcus Bloom-Pflug, Qi Huang
  • Patent number: 10980145
    Abstract: Provided is a patch panel, comprising: a circuit board; and an SFP, SFP+, or QSFP+ connector connected to a plurality of radio frequency coaxial (RF coaxial) connections via conductive traces of the circuit board, the RF coaxial connections configured to extend functionality of the SFP, SFP+, or QSFP+ socket of a computing device coupled to the patch panel from a rear end of the computing device to a front end of the computing device.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: April 13, 2021
    Assignee: Vapor IO, Inc.
    Inventor: Steven White
  • Patent number: 10978826
    Abstract: An electrical connector assembly includes an insulative housing, a plurality of terminals mounted on the insulative housing, a cable electrically connected with the terminals, a magnet disposed on the insulative housing, and an inner mold integrally formed on the insulative housing and the cable, wherein the electrical connector assembly also includes a heat insulation member disposed between the magnet and the inner mold to prevent the magnet from heat of the inner mold during molding.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: April 13, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Yong-Qi Li, Jian-Hui Tan, Jun Chen, Yang-Tsun Hsu, Jerry Wu
  • Patent number: 10948672
    Abstract: A material for blocking crosstalk, an optical assembly, and a method for preparing the material are provided. The optical assembly includes an optical receive assembly, where a periphery of the optical receive assembly includes a transparent region and a non-transparent region; the transparent region is made of the material, where a first layer of film is located on a side opposite to an optical receiving direction, and a second layer of film is located on a side opposite to the optical receive assembly; and the non-transparent region is of an electrical-signal shielding structure.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: March 16, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Min Zhou, Ning Cheng, Zhenxing Liao, Huafeng Lin
  • Patent number: 10942324
    Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: March 9, 2021
    Assignee: Corning Optical Communications LLC
    Inventors: Alan Frank Evans, Andreas Matiss, Michael Wimmer
  • Patent number: 10908371
    Abstract: A transistor outline (TO) package including a header with at least one optoelectronic device. The header is bonded to a pot-shaped metal cap, which has a window that is transmissive to electromagnetic radiation, such that the at least one optoelectronic device is arranged in a hermetically sealed interior. The wall of the metal cap has at least one lateral wall portion and/or end wall portion which is thickened towards the interior compared to a portion of the lateral wall of the metal cap adjacent to the header.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: February 2, 2021
    Assignee: Schott AG
    Inventors: Robert Hettler, Georg Mittermeier
  • Patent number: 10886700
    Abstract: An optical module control method is a method for controlling an optical module that includes a semiconductor light emitting element and an electronic cooling module configured to adjust a temperature of the semiconductor light emitting element. The optical module control method includes a step of detecting a temperature of a light emitting unit including the semiconductor light emitting element, and outputting temperature information of the semiconductor light emitting element; a step of detecting an environmental temperature and outputting temperature information of the environmental temperature, the environmental temperature being a temperature of environment where the light emitting unit is placed; and a step of controlling an output of the electronic cooling module on the basis of the temperature information of the semiconductor light emitting element and the temperature information of the environmental temperature, and adjusting the temperature of the light emitting unit.
    Type: Grant
    Filed: September 4, 2017
    Date of Patent: January 5, 2021
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yohei Enya, Hiromi Nakanishi
  • Patent number: 10886695
    Abstract: Improve semiconductor device performance. The wiring WL1A on which the semiconductor chip CHP1 in which the semiconductor lasers LD is formed is mounted has a stub STB2 in the vicinity of the mounting area of the semiconductor chip CHP1.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: January 5, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kazuaki Tsuchiyama, Motoo Suwa, Hidemasa Takahashi
  • Patent number: 10884205
    Abstract: An optical conversion module having a printed circuit board having a proximate and a distal end and including an electrical interface at the distal end. The optical conversion module also having a faceplate modularly connected to the proximate end of the printed circuit board, the faceplate having at least one retention device. The optical conversion module further having an optical transceiver disposed on and electrically connected to the printed circuit board, a chip optical connector disposed on and optically connected to the optical transceiver, and a faceplate optical connector modularly disposed through the faceplate and modularly connected to the chip optical connector through an optical fiber jumper.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: January 5, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin Leigh, John Norton
  • Patent number: 10816739
    Abstract: A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: October 27, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Frank Lei Ding, Maziar Amirkiai, Jianwei Mu, Hongyu Deng, Tao Wu
  • Patent number: 10795091
    Abstract: An example adaptor for passively aligning an optical component of an optical connector with a ferrule of the optical connector. The adaptor may include first alignment feature and second alignment features. The first alignment features may be to, when the adaptor is connected to the ferrule, cooperate with alignment features of the ferrule to passively force the adaptor into a first configuration relative to the ferrule. The second alignment features may be arranged such that, when the optical component is held in contact with the second alignment features and the adaptor is in the first configuration relative to the ferrule, the optical component is in an aligned position relative to the ferrule.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: October 6, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Sagi Mathai, Michael Tan
  • Patent number: 10788631
    Abstract: This disclosure relate to power control of an optical module. In one implementation, an optical module is disclosed. The optical module comprises a first edge connector pin, a microcontroller unit (MCU), and a power supply control unit disposed on a circuit board, wherein the first edge connector pin is configured to receive a control signal sent by a main-unit device during power up of the optical module; the MCU is electrically connected to the first edge connector pin and the power supply control unit, and is configured to read the control signal using the first edge connector pin, and when the control signal is a first-type control signal, send a corresponding type indication information to the power supply control unit; and the power supply control unit is configured to receive the type indication information sent by the MCU, and stop, according to the type indication information, supplying power.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 29, 2020
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventor: Long Zheng
  • Patent number: 10782443
    Abstract: A device. At least some example embodiments are a device including a filter element configured to receive optical energy from a first optical fiber. The filter element is reflective in a preselected band of optical wavelengths. A first lens is configured to receive optical energy transmitted through the filter element. A shell is disposed about the optical filter and the first lens; surfaces of the first lens, the filter element and the shell form a first boundary portion of an internal volume of an interior of the shell. A fluid is sealably disposed within the internal volume.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: September 22, 2020
    Assignee: Geospace Technologies Corporation
    Inventor: Willard Womack
  • Patent number: 10782474
    Abstract: Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: September 22, 2020
    Assignee: Corning Research & Development Corporation
    Inventors: Lars Martin Otfried Brusberg, Douglas Llewellyn Butler, Michael de Jong, Alan Frank Evans, Andreas Matiss, James Scott Sutherland
  • Patent number: 10765032
    Abstract: The present disclosure relates to an apparatus and a method for cooling electronic components. An apparatus of the presently claimed invention includes a connector and an electronic component that plugs into the connector. The electronic component contacts a heat sink, where the heat sink moves in an upward direction as the electronic component is plugged into the connector. Soft thermal pads located between the heat sink and liquid cooling tubes/pipes compress as the heat sink moves upward. When compressed, the thermal pads contact the heat sink and the liquid cooling tubes/pipes. Heat is then transferred from the electronic component through the heat sink, through the thermal pads, through the coolant tubes, and into liquid contained within the liquid coolant tubes.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: September 1, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey John Lunsman, Russell Eric Stacy
  • Patent number: 10712514
    Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: July 14, 2020
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Long Chen, Yuzhou Sun, Xiongfei Zhai, Donghan Wang, Zhenzhong Wang, Meng Fang, Chao Zhang, Xigui Fang, Xiangzhong Wang
  • Patent number: 10695578
    Abstract: A vascular optical fiber guidewire includes an optical fiber guidewire and a plug connected to the optical fiber guidewire. The plug may be a memory alloy plug including a handle, a fixing groove and a sleeve which are sequentially connected. A radius of a segment of the fixing groove is larger than a radius of a segment of the fixing groove. The fixing groove cooperates with an external connector to provide a locking effect. The sleeve is provided with an elastically deformable spiral structure. The memory alloy plug is sleeved on a metal tube sleeved outside the optical fiber guidewire and connected with the optical fiber guidewire. A part of the metal tube extending from the memory alloy plug forms a spiral shape by spirally cutting to protect and support the optical fiber guidewire. The insertion and extraction operations and rotating operations can be facilitated.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: June 30, 2020
    Inventor: Hua Shang
  • Patent number: 10697810
    Abstract: A sensor housing assembly for enclosing an electrical interface circuit, a sensor or sensor input, and a connector for interfacing with a data unit. The sensor housing assembly generally includes a housing containing a circuit board and interface circuitry to condition a sensor input signal, and a connector mounted on the circuit board, the assembly being insertable into a data unit. The housing can include a protrusion that prevents the assembly from being inserted into the data unit incorrectly, which also allows a symmetrical connector to be used. The sensor housing assembly is adapted to be inserted into a receptacle in the data unit, which has blocking tabs that act with the protrusion to ensure that the assembly can only be inserted one way.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: June 30, 2020
    Assignee: Dickson/Unigage, Inc.
    Inventors: Dean A. Tjaden, Jr., Denise A. Alexander, Steven J. Thompson, James D. Springer
  • Patent number: 10656355
    Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: May 19, 2020
    Assignee: LUXNET CORPORATION
    Inventors: Pi-Cheng Law, Po-Chao Huang, Hsing-Yen Lin, Ya-Hsin Deng, Hua-Hsin Su
  • Patent number: 10644472
    Abstract: A communication device includes a mechanical frame, which is configured to be inserted into a multi-channel Small Form-Factor Pluggable (SFP) receptacle that is compliant with a first SFP standard and to receive inside the frame an SFP connector that is compliant with a second SFP standard, which is different from the first SFP standard. First electrical terminals, held by the mechanical frame, are configured to mate with respective first pins of the SFP receptacle, and second electrical terminals, electrically coupled within the mechanical frame to the first electrical terminals, are configured to mate with respective second pins of the SFP connector. A heat sink is mounted on the mechanical frame and configured to make a positive contact with the SFP connector when the SFP connector is inserted into the mechanical frame and to be contained completely within the SFP receptacle when the mechanical frame is inserted into the SFP receptacle.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: May 5, 2020
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Yaniv Kazav, Andrey Ger
  • Patent number: 10644478
    Abstract: Provided are: a light source module capable of having a reduced packaging area size while ensuring wavelength precision; and a method for manufacturing this light source module. This light source module is provided with a light amplifying means, a wavelength monitoring means for detecting a change in wavelength of light outputted from the light amplifying means, and a reflecting means which is disposed between the light amplifying means and the wavelength monitoring means, and which is for reflecting the light outputted from the light amplifying means toward the wavelength monitoring means.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 5, 2020
    Assignee: NEC CORPORATION
    Inventor: Isao Tomita
  • Patent number: 10612948
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: April 7, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
  • Patent number: 10591683
    Abstract: The present invention relates generally to a passive optical network (PON)-based video overlay pluggable type optical network device that is easily connected and detached from an indoor optical network terminal (ONT) at a subscriber side, which transmits and receives an optical signal in which a video RF optical signal and a PON optical signal are overlaid, wherein a PON board for receiving and processing the PON optical signals and a video RF board for receiving and processing the video RF optical signals are easily removed for replacement from a housing including an optical sub-assembly (OSA), which separates the PON optical signal and the video RF optical signal, and the PON board and the video RF board are individually designed and configured in a removable manner so that interference between the signals is minimized and selective combinations and production are possible according to various types of PONs and video services.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: March 17, 2020
    Assignee: LIGHTRON FIGER-OPTIC DEVICES INC.
    Inventors: Hyun-Won Cha, Keun-Jae Park, Jeong-Hwan Cho, Oh-Sang Kwon, Hyun-Jong Youm, Seong-Seok Seo, Young-Un Heo
  • Patent number: 10578854
    Abstract: [Object] To provide an optical connector and an optical connector set which are excellent in environment resistance and suitable for the use in medical instruments, an image pickup unit and an image pickup system that use the optical connector, and an optical transmission module. [Solving Means] An optical connector according to the present technology includes a lens support, a fiber ferrule, a lens, and a lens retainer. The lens support includes a through-hole. An optical fiber is connected to the fiber ferrule. The fiber ferrule is press-fitted in the through-hole. The lens is inserted into the through-hole. The lens retainer is press-fitted in the lens support and sandwiches the lens between the lens retainer and the fiber ferrule.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: March 3, 2020
    Assignee: SONY CORPORATION
    Inventors: Terukazu Naruse, Tsuyoshi Ogawa, Kazuyoshi Yamada
  • Patent number: 10574360
    Abstract: A pluggable optical module includes a pluggable electric connector, a control unit, an optical signal output unit, and a pluggable optical receptor. The pluggable electric connector can communicate a modulation signal and a control signal with an optical communication apparatus. The optical signal output unit outputs an optical signal modulated by the modulation scheme by the control signal in response to the modulation signal. The pluggable optical receptor is configured in such a manner that an optical fiber is insertable into and removable from the pluggable optical receptor. The pluggable optical receptor can output the optical signal output from the optical signal output unit. The control unit controls the optical signal output unit to output the optical signal of a modulation amplitude set corresponding to the modulation signal in the modulation scheme specified by the control signal.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: February 25, 2020
    Assignee: NEC Corporation
    Inventor: Hirokazu Komatsu
  • Patent number: 10566363
    Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: February 18, 2020
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Peter Riel, Markus Rossi, Daniel PĂ©rez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
  • Patent number: 10566489
    Abstract: A photosensor includes a light emitting element that radiates light onto an object to be detected and a light receiving element that has a light-receiving surface for receiving light radiated from the light emitting element. An incident light regulation portion covering the light-receiving surface is provided on a path along which the light radiated from the light emitting element directed toward the light-receiving surface, and the incident light regulation portion transmits light having an incident angle less than a predetermined value and blocks light having the incident angle greater than or equal to the predetermined value among light incident on the light receiving element.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: February 18, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Kazuhiro Natsuaki, Takahiro Takimoto, Masayo Uchida
  • Patent number: 10558002
    Abstract: There are provided an optical receiver module with an improvement in high frequency characteristic and reduction in size. The optical receiver module includes a substrate, an IC provided with two or more IC terminals, a light receiving element disposed in front of the IC, provided with two or more PD terminals and having a light receiving window, and a first optical component disposed in front of the IC provided with two bridge footing sections, and a lens main body section located between upper portions of the two bridge footing sections, the lens main body section is provided with a lens and a mirror, and a distance L1 between a position A of the lens and a position B of the light receiving window is longer than a distance L2 between the position B and a position C of an end part of the two bridge footing sections.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: February 11, 2020
    Assignee: Lumentum Japan, Inc.
    Inventors: Koki Iemura, Michihide Sasada
  • Patent number: 10520362
    Abstract: A spectroscopic measurement device emits light to a measurement target and measures the measurement light output from the measurement target in accordance with the light emission. A spectroscopic measurement device includes: a first housing having a light shielding property and configured to house a light source that emits light and having a first opening through which the light emitted from the light source passes; a second housing having a light shielding property and having a second opening through which the measurement light passes and configured to house a spectrometer that receives the measurement light that has passed through the second opening; and a junction configured to join the first housing and the second housing such that relative positions of the first housing and the second housing can be changed.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: December 31, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Makoto Kono
  • Patent number: 10514508
    Abstract: In example implementations, an optical connector is provided. The optical connector includes a jumper holder, a base bracket, and an optical ferrule. The jumper holder holds a plurality of ribbon fibers. The base bracket is coupled to an electrical substrate to mate with the jumper holder. The optical ferrule is coupled to an end of each one of the plurality of ribbon fibers. The optical ferrule is laterally inserted into a corresponding orthogonal socket that is coupled to a silicon interposer on the electrical substrate to optically mate the optical ferrule to the orthogonal socket.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: December 24, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Paul Kessler Rosenberg, Sagi Mathai, Mir Ashkan Seyedi, Michael Renne Ty Tan, Wayne Victor Sorin, Marco Fiorentino
  • Patent number: 10488607
    Abstract: An optical transceiver housing structure comprising a first latch arm, a second latch arm, a fixing mechanism, and a release mechanism is provided. The first and the second latch arms have a first and a second guide slot disposed on bottom ends thereof, respectively. The fixing mechanism is attached to the first latch arm and second latch arm at a top end thereof and the release mechanism is attached to the first latch arm and second latch arm at a bottom end thereof. Two side guide lugs of an optical transceiver are moveable in the first guide slot and the second guide slot, respectfully. When the release mechanism moves toward the optical transceiver, the first and the second latch arms slide along the first and second guide slots to move the fixing mechanism in an opposite direction away from the optical transceiver.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: November 26, 2019
    Assignee: EZconn Corporation
    Inventor: Pin-Chen Yeh
  • Patent number: 10481355
    Abstract: An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: November 19, 2019
    Assignee: Sicoya GmbH
    Inventors: Thorsten Kettler, Moritz Grehn, Christoph Theiss, Stefan Meister
  • Patent number: 10485123
    Abstract: A double-lever handle includes a main handle and an assisting handle. The main handle is rotationally mounted to a support body to form a first rotating pair. The assisting handle includes a power arm portion. The power arm portion is rotationally coupled to an end of the main handle away from the first rotating pair to form a second rotating pair. An end of the main handle adjacent to the first rotating pair defines a first latching slot. The main handle rotates about a first latching pin latched in the first latching slot. An end of the power arm adjacent to the second rotating pair defines a second latching slot. The power arm rotates about a second latching pin latched in the second latching slot.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: November 19, 2019
    Assignee: HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.
    Inventors: Jia-Feng Lin, Chieh-Hsiang Lin
  • Patent number: 10429599
    Abstract: A plug connector includes: a metallic enclosure enclosing a printed circuit board; a heat sink member exposed to an exterior surface of the metallic enclosure; and a set of electronic components assembled upon the printed circuit board, wherein the heat sink member is to dissipate heat from at least one of the set of electronic components, and the heat sink member is detachably attached upon the metallic enclosure.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 1, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, An-Jen Yang, Jim Zhao, Yuan Zhang
  • Patent number: 10381799
    Abstract: An optical module includes a semiconductor laser with an active layer disproportionately positioned closer to the first surface. The semiconductor laser includes a reflector for reflecting the light outgoing from the active layer in a direction along the first surface toward another direction. The active layer and the reflector are monolithically integrated in the semiconductor laser. The optical module includes a carrier formed from a light transmissive material and having a third surface and a fourth surface opposite to each other. The semiconductor laser is mounted on the carrier so as for the light to enter the third surface. The carrier has a lens integrally on the fourth surface. The optical module includes a substrate having an optical waveguide and an optical coupler for guiding the light to the optical waveguide. The optical waveguide and the optical coupler are integrated in the substrate.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: August 13, 2019
    Assignee: Oclaro Japan, Inc.
    Inventors: Takanori Suzuki, Shigehisa Tanaka
  • Patent number: 10374387
    Abstract: An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: August 6, 2019
    Assignee: FINISAR CORPORATION
    Inventors: Brent Stapleton, Pritha Khurana, Nathan Lye
  • Patent number: 10361533
    Abstract: An optical module that provides a feedthrough to carry an electrical signal output from and/or provided to a semiconductor optical device is disclosed. The feedthrough has a signal pad that carries the electrical signal thereon and at least two ground pads sandwiching the signal pad therebetween. The feedthrough further provides a cavity provided under the signal pad and spaces each between the signal pad and the ground pads.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: July 23, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Shunsuke Sato
  • Patent number: 10355371
    Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: July 16, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: James David Holbery, Siyuan Ma, Flavio Protasio Ribeiro, Michael David Dickey, Collin Alexander Ladd, Andrew Lewis Fassler
  • Patent number: 10355783
    Abstract: An optical-to-optical (O2O) signal path, O2O and hybrid transceivers including the same, a network system or device including one or more of the transceivers, and methods of making and using the same are disclosed. The O2O signal path generally includes first and second ports and an optical amplifier configured to receive an optical signal from a host or a network through the first port and provide an amplified optical signal for the other of the host and the network through the second port. In some examples, the O2O signal path further includes one or more optical isolators and/or clock and data recovery functions. The optical signals in the O2O signal path are processed entirely in the optical domain. The transceiver includes the O2O signal path and may include an optoelectronic signal path, a pass-through connector, or a second O2O signal path.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: July 16, 2019
    Assignee: Source Photonics (Chengdu) Co., Ltd.
    Inventor: Mark Heimbuch
  • Patent number: RE48778
    Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: October 19, 2021
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Xian Zhou, Kewu Wang