Abstract: A wiring board includes a signal line, a shield member whose main surface extends along the signal line, and a branch line that is electrically connected to the shield member, that includes a leading end that is opened, and that extends in a direction parallel with the main surface of the shield member.

Abstract: A coupled optic system configured for collimation of light. The coupled optic system includes an optic system. The optic system includes a shelf. The shelf includes one or more optic alignment surfaces. The optic system includes one or more interface lenses coupled to the shelf. The coupled optic system includes an optical connector. The optical connector includes one or more connector lenses. The optical connector includes one or more connector alignment surfaces.

Abstract: The invention discloses a novel packaging structure of a power semiconductor module, which mainly comprises an insulating radiating fin, a metal lead frame unit and a chip unit. The insulating radiating fin comprises an insulating layer, and an inner metal conducting layer and an outer metal conducting layer which are respectively arranged on two sides of the insulating layer; the metal lead frame unit mainly comprises a frame pin input portion, a frame pin output portion and a frame pin signal portion, the frame pin input portion is arranged on an upper side of the inner metal conducting layer in a solder welding mode, and the chip unit is welded to the middle of the inner metal conductive layer. The frame pin output portion is provided with an inner concave portion.

Abstract: An adaptor for use with a colour measuring device is provided where the colour measuring device has a cavity, a sensor positioned at a closed end of the cavity for measuring colour of a surface, and a rim surrounding an open end of the cavity. The adaptor includes a plate for contacting the surface and covering the rim of the colour measuring device, the plate having a portion for occluding the cavity that is transparent, referred to as the transparent portion, and a releasable coupling mechanism fixed to the plate for coupling the plate to the colour measuring device such that the transparent portion of the plate covers the sensor of the colour measuring device.

Abstract: A light-emitting device includes: a light-emitting element; a package in which the light-emitting element is arranged; an optical member fixed to the package, the optical member having a lens portion having a lens surface including a first lens, and a non-lens portion that is a portion that does not overlap the lens surface in a top view; and one or more adhesives fixing the optical member to the package. The package has an emission surface through which light from the light-emitting element exits the package. The optical member has an incidence surface on which the light exiting the package enters the optical member, and the lens surface from which the light that has entered the optical member exits the optical member.

Abstract: A system includes a cage and a first coil. The cage includes a first end and a second end opposite the first end. The first end is arranged to receive an electrical connector. The second end is arranged to receive a pluggable module such that the electrical connector forms an electrical connection with the pluggable module. The first coil is positioned on or in the cage such that the first coil is arranged to deliver electric power to the pluggable module by inducing an electric current in a second coil positioned in or on the pluggable module when the pluggable module is connected to the electrical connector in the cage.

Abstract: A rotating equipment system with in-line drive-sense circuit (DSC) electric power signal processing includes rotating equipment, in-line drive-sense circuits (DSCs), and one or more processing modules. The in-line DSCs receive input electrical power signals and generate motor drive signals for the rotating equipment. An in-line DSC receives an input electrical power signal, processes it to generate and output a motor drive signal to the rotating equipment via a single line and simultaneously senses the motor drive signal via the single line. Based on the sensing of the motor drive signal via the single line, the in-line DSC provides a digital signal to the one or more processing modules that receive and process the digital signal to determine information regarding one or more operational conditions of the rotating equipment, and based thereon, selectively facilitate one or more adaptation operations on the motor drive signal via the in-line DSC.

Abstract: A network access card switching method is performed by an electronic device on which a first network access card and a second network access card are installed. The first network access card is a default network access card of the electronic device. The network access card switching method includes determining that a user enables an intelligent network access card switching function, activating, by the electronic device, the first network access card, transmitting the data service using the first network access card, monitoring a network state of the first network access card in real time, and when determining that the network state of the first network access card meets a first preset condition, disconnecting the data service transmitted using the first network access card, activating the second network access card, and transmitting the data service by using the second network access card.

Abstract: Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.

Abstract: Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

Abstract: An optical electrical connector includes a casing, a printed circuit board, an electronic chip, a photoelectric conversion component, and a heat sink device. The casing includes an electrical port and an optical port. A receiving space is defined between the electrical port and the optical port. The printed circuit board extends longitudinally along a first direction. The printed circuit board includes a main body portion located in the receiving space and a front end portion exposed in the electrical port. The electronic chip, the photoelectric conversion component and the heat sink device are all accommodated in the receiving space. The electronic chip and the photoelectric conversion component are not only disposed on the printed circuit board, but also electrically connected to the printed circuit board. The heat sink device is disposed on the casing and faces the electronic chip for conducting the heat accumulated on the electronic chip.

Abstract: An optical or optoelectronic transceiver and methods of making the same are disclosed. The transceiver comprises a connector configured to receive an optical fiber array, a filter that is (i) configured to reflect first optical signals having a first wavelength and (ii) transparent to second optical signals having a second wavelength, wherein each of the first and second optical signals independently has an optical path to or from the optical fiber array, a mirror in the optical path of the second optical signals configured to reflect the second optical signals, a plurality of photodiodes configured to receive a subset of the first and/or second optical signals and generate a corresponding plurality of received electrical signals therefrom, and a plurality of laser diodes configured to transmit a remainder of the first and/or second optical signals from a corresponding plurality of transmitted electrical signals.

Abstract: A ferrule includes a ferrule matrix, an optical fiber, and a dielectric reflective film. The optical fiber is disposed in an accommodating through hole of the ferrule matrix, and the dielectric reflective film covers an optical transmission surface of the optical fiber and a surface that is of the ferrule matrix and that faces a matching ferrule. The dielectric reflective film has a through hole, such that the dielectric reflective film does not shield a main optical path area of the optical transmission surface of the optical fiber. A reflective band of the dielectric reflective film includes at least a part of a communication band of the optical fiber. In this way, when light from the matching ferrule is transmitted to the ferrule matrix and the optical fiber, the dielectric reflective film reflects the light.

Abstract: Ferrules, alignment frames and connectors having at least one flexing element are provided. A ferrule or an alignment frame may include a body and first and second flexible arms, and a connector may include the ferrule or the alignment frame. A ferrule may have a first flexible arm that has a first fixed end attached to a first side of the body of the ferrule and an opposite first free end, and may have a second flexible arm having a second fixed end attached to a second side of the body, opposite the first side, and an opposite second free end. When the ferrule is mated with a mating ferrule, the first and second flexible arms are flexed away from the respective first and second sides of the body, and the first and second free ends contact the mating ferrule.

Abstract: This optical device includes at least one magnetic element including a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer sandwiched between the first ferromagnetic layer and the second ferromagnetic layer, a laser diode, and a waveguide, in which the waveguide includes at least one input waveguide optically connected to the laser diode and an output waveguide connected to the input waveguide, and at least some of light propagating in at least one of the input waveguide and the output waveguide is applied to the magnetic element.

Abstract: An optical transceiver module includes a first housing, a second housing, an engagement component, a conductive body, and a circuit board. The first housing has a first sidewall and a first groove. The first groove is closer to a central line of a major axis of the first housing than the first sidewall. The second housing is assembled with the first housing. The second housing has a second sidewall. The second sidewall is extended into the first groove. The engagement component has a first engagement portion. The first engagement portion is extended between the first sidewall and the second sidewall. The conductive body is disposed between the first groove and the second sidewall. The circuit board is disposed between the first housing and the second housing to perform photoelectric conversion. Therefore, the stroke of the engagement component can be fixed, and the electromagnetic interference can be reduced.

Abstract: The present invention provides an optical receptacle comprising a first side wall having a first series connecting structure, and a second side wall opposite to the first side wall and having a second series connecting structure. The first series connecting structure of one optical receptacle is coupled to the second assembling element of another optical receptacle along a first direction and is moved to an assembly position so as to form an optical receptacle module. Alternatively, the first series connecting structure of one optical receptacle is coupled to the second series connecting structure of another optical receptacle along a second direction and is moved to the assembly position so as to form the optical receptacle module. Alternatively, the optical receptacle module may be coupled to the different kinds of optical connectors to form an optical connector module.

Abstract: An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.

Abstract: The light detection element includes a magnetic element and an optical waveguide. The magnetic element includes a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer sandwiched between the first ferromagnetic layer and the second ferromagnetic layer. The optical waveguide includes at least a core and a cladding covering at least a part of the core. Light that has propagated through the optical waveguide is applied to the magnetic element.

Abstract: A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.

Abstract: An optical transceiver module includes a package containing a light receiving element, a light emitting element, and an optical modulator configured to modulate light that is output from the light emitting element, a rigid circuit board including a control circuit provided on the rigid circuit board, the control circuit being configured to control at least one of the light receiving element, the light emitting element, or the optical modulator, and a flexible circuit board including a plurality of signal wires, wherein the rigid circuit board is connected to the package via the flexible circuit board, with a first surface of the rigid circuit board facing a first surface of the package, and the at least one of the light receiving element, the light emitting element, or the optical modulator is electrically connected to the control circuit via the plurality of signal wires.

Abstract: An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.

Abstract: Related to an optical communication module, the optical communication module comprises a main body, an optical communication assembly and a second circuit board. The main body comprises a housing and a first circuit board disposed on the housing. The housing and the first circuit board together form an airtight cavity of the main body, and the first circuit board comprises two first electric interfaces. The optical communication assembly is accommodated in the airtight cavity and comprises a substrate, an optical communication element and a second electric interface. The optical communication element disposed on the substrate. One of the two first electric interfaces of the first circuit board is electrically connected to the second electric interface. The second circuit board comprises a third electric interface and the other one of the two first electric interfaces of the first circuit board is electrically connected to the third electric interface.

Abstract: A measurement device has a sensor and includes a cylindrical housing, an optical fiber that is disposed along the long-side direction of the housing and that has one end disposed in the housing and the other end disposed outside the housing, a first substrate including a light receiving unit disposed on an extension of the one end in the housing, and a second substrate that is electrically connected to the first substrate via a flexible part having flexibility and is disposed at an acute angle or a right angle with respect to the first substrate.

Abstract: A system for securing contents in a container that can include a housing, at least one electromechanically operated security door securing access to the housing and a control panel for receiving input to release the electromechanically secured door from the housing. Communications components, alarms and cameras can also be associated with the housing to facilitate its security and operation and can also adapt it for access and/or package receipt (delivery) by a third party, and overall preservation and security of contents stored therein. Heating and cooling system components can maintain contents of valuable contents held within the housing at a select temperatures.

Abstract: A host device configured to receive a pluggable optical module, the host device includes circuitry configured to, subsequent to insertion of the pluggable optical module, access an early management interface on the pluggable optical module, prior to the pluggable optical module being fully booted, and, subsequent to the pluggable optical module being fully booted, access a complete management interface on the pluggable optical module. The early management interface provides responses to simple queries, allowing access to one or more registers on the pluggable optical module.

Abstract: An optical transceiver according to an embodiment includes: a housing having inner sides defining an inner space inside the housing; an optical module including a package, a semiconductor device, and a sleeve, the package being configured to house the semiconductor device, the semiconductor device generating a Joule heat, the sleeve being attached to an outside of the package, the sleeve being fixed to the housing with keeping the package away from the inner sides; a heat-conducting material filled between the package and one of the inner sides, the heat-conducting material including an oily component; and a sheet member being placed between the heat-conducting material and the package, the sheet member covering the heat-conducting material to prevent the oily component from reaching the optical module. The Joule heat is conducted from the package to the housing through the sheet member and the heat-conducting material.

Abstract: A charging device that includes (a) a DC to DC converter (“converter”) that includes a converter control input and a converter output for outputting a charging voltage to the supercapacitor, (b) an adjustable voltage divider, (c) a controller that is configured to (i) sense a supercapacitor voltage, (ii) determine a first target value of the supercapacitor voltage, based on an internal impedance of the supercapacitor and on a nominal supercapacitor voltage that is lower than the first target value of the supercapacitor voltage, and (iii) during a first phase of a charging process, output a control signal via the control output and to the converter control input, to set the charging voltage to one or more values that once provided to the supercapacitor cause the supercapacitor voltage to reach, at the end of the first phase of the charging process, the first target value of the supercapacitor voltage.

Abstract: An optical fiber sub-assembly includes: a handle, a rear retainer, an optical cable, a field mountable connector (FMC) assembly, a spindle, and a protection hood fixedly connected to the spindle. An end of the optical cable is connected to the FMC assembly, the optical cable protrudes from a first end of the FMC assembly. The FMC assembly includes a ferrule provided at a second end of the FMC assembly. The spindle is sleeved outside the first end of the FMC assembly, and the protection hood is sleeved outside the second end of the FMC assembly. An end of the spindle that is away from the protection hood is connected to the rear retainer and is used to fasten the optical cable. The handle is sleeved outside the protection hood and the spindle.

Abstract: A cable gland and methods for earthing, grounding, bonding, and electromagnetic capability with armored, metal-clad, and metallic-sheathed cable types. The cable gland comprises a gland body, a plurality of extensions, an elastomer seal, a compression member configured to rotate the plurality of extensions towards to the elastomer seal, and an earthing insert mounted in the gland body configured to electrically connect a cable to a neutral and/or grounded conductor. The cable gland is configured to provide an air-tight seal between the exterior of the cable and the elastomer seal through rotation of the plurality of extension upon the elastomer seal. The cable gland may include an o-ring and nut to secure the cable gland to a planar body. The earthing insert comprises a grounding spring in electrical communication with a metallic portion of the cable and a neutral and/or grounded conductor.

Abstract: An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a first portion and a matrix structure. The first portion is connected to a first optical member and corresponds to a first light. The matrix structure is disposed on the first portion and corresponds to a second light, wherein the first light is different from the second light.

Abstract: A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.

Abstract: LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.

Abstract: Methods of reshaping ferrules used in optical fiber cables assemblies are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a true center of the ferrule, wherein the true center is based on an outer surface of the ferrule; and reshaping at least a portion of the ferrule to change the true center of the ferrule, wherein the reshaping includes enlarging a portion of the ferrule. A variety of reshaping techniques are also disclosed.

Abstract: Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. Pluggable optical transceiver modules implement a rigid-plane jumper that provides an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in a manner that does not require the fiber jumper, while ensuring reduced optical loss. In some embodiments one or more rigid waveguide plates act as an opto-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, the rigid waveguide plates are coupled to a faceplate connector, and a CWDM block that is in turn optically coupled to the optical socket. In some embodiments, the CWDM block is directly attached to the rigid waveguide plates. In some embodiments, the CWDM block is indirectly attached to the rigid waveguide plates using a half periscope.

Abstract: First event information that is associated with an event that corresponds to a temperature of a memory sub-system is received. Whether the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies a first threshold condition is determined. Responsive to determining that the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies the first threshold condition, a thermoelectric component (TEC) is caused to change from an inactive state to an active state by decreasing a temperature at a bottom surface of the TEC that is coupled to the memory sub-system as a temperature at a top surface of the TEC increases.

Abstract: The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.

Abstract: This optical module comprises a stem; lead pins extending through the stem; glasses filled between the stem and the lead pins; elements (photodiode, amplifier) disposed on a first main surface of the stem, and connected to the lead pins; FPC in contact with a second main surface of the stem; a cap attachable to the stem; and an aligning-fixing parts (metal-made flange, Z-sleeve) that aligns an optical fiber stub with the cap and fix the optical fiber stub to the cap.

Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.

Abstract: A package structure comprises a metal plate (20) where a slot is formed, a ceramic piece (60), and a metal heat sink (70) welded onto the back surface of the ceramic piece (60). The ceramic piece (60) and the metal heat sink (70) are vertically inserted into the slot and welded to the metal plate (20). A semiconductor and a matching circuit may be disposed on the metal heat sink (70). The ceramic piece (60) replaces a glass seal; metalized interconnection is provided inside the ceramic piece (60) for fabricating a metalized pattern having complex connection relations, and the electrical interconnection is more flexible. In the package structure, metalized wiring is carried out by using the ceramic piece. Compared with round lead machining, higher precision is achieved.

Abstract: The present disclosure provides a compact-optic-connecting device for mounting on a motherboard of a computer, which includes an optic-receiving unit, an optic-launching unit, two flexible-circuit plates, a circuit board and a connecting interface. The optic-receiving unit and the optic-launching unit are connected to the bottom surface of the circuit board respectively via flexible-circuit plates. The connecting interface is connected to the bottom surface of the circuit board, and also connected to an external motherboard via the connecting interface. By virtue of such structure, the compact optic-connecting device can have a small length and size, and meanwhile to maintain a safety distance between the connecting interface and the optic-receiving unit, or the connecting interface and optic-launching unit, to prevent faulty conduction therebetween.

Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.

Abstract: An object is to output an optical signal accurately corresponding to a data signal. A pluggable optical module (100) includes a pluggable electric connector (11), a control unit (12), an optical signal output unit (13), and a pluggable optical receptor (14). The pluggable electric connector (11) can communicate a modulation signal (MOD) and a control signal (CON1) with an optical communication apparatus (92). The optical signal output unit (13) outputs an optical signal (LS) modulated by the modulation scheme by the control signal (CON1) in response to the modulation signal (MOD). The pluggable optical receptor (14) is configured in such a manner that an optical fiber (91) is insertable into and removable from the pluggable optical receptor (14). The pluggable optical receptor (14) can output the optical signal (LS) output from the optical signal output unit (13).

Abstract: An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.

Abstract: A wall grazer apparatus is provided. The wall grazer apparatus has a heat sink platform, a light source, a lens, a driver and a main housing. The heat sink platform has a main portion and a tilt portion. The light source is mounted on the tilt portion. The lens is disposed above the light source to convert an original light emitted from the light source to an output light. The driver converts an external power to a driving current. The driving current is supplied to the light source. The main housing disposes the heat sink platform, the light source, the lens and the driver. When the main housing is fixed to a first surface, the output light is projected on a second surface for forming a visual effect.

Abstract: A system package module is provided. The system package module includes a module substrate, a plurality of first pins and a plurality of second pins. The module substrate includes a module substrate surface. The module substrate surface includes a first pin arrangement area and a second pin arrangement area. The second pin arrangement area surrounds the first pin arrangement area. The first pins are disposed in the first pin arrangement area. A first pin gap is formed between the two adjacent first pins. The second pins are disposed in the second pin arrangement area. A second pin gap is formed between the two adjacent second pins. The first pin gap is greater than the second pin gap.

Abstract: An initial change and a secular change in an optical characteristic and a high frequency characteristic in a case where an optical modulator is mounted in a package of an optical transmission apparatus are suppressed while improving a space utilization rate in the package of the optical transmission apparatus. An optical modulator that is electrically connected to an electric circuit configured on a circuit board, includes a package that houses an optical modulation element, in which the package has, on a bottom surface facing the circuit board, a plurality of first protruding bodies protruding from the bottom surface.

Abstract: An I/O connector assembly configured for making a cabled connection to an interior portion of a printed circuit board for at least some signals passing through the I/O connector. The I/O connector assembly may be assembled by mounting a cage to a printed circuit board. A receptacle connector, including cables extending from a rear of the connector, may be inserted through an opening in the top or rear of the cage. The receptacle connector may be positioned in the cage by at least one retention member on the cage. A plug, mating to the receptacle connector, also may be positioned by a retention member on the cage. Positioning both the plug and receptacle relative to the cage reduces the tolerance stackup of the assembly and enables the connectors to be designed with shorter wipe length, which enables higher frequency operation.

Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.