With Housing Patents (Class 385/92)
  • Patent number: 11476637
    Abstract: A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: October 18, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Tatsuya Kanazawa, Kazuma Kozuru
  • Patent number: 11430752
    Abstract: LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: August 30, 2022
    Assignee: Scientific Components Corporation
    Inventor: Aaron Vaisman
  • Patent number: 11420293
    Abstract: Methods of reshaping ferrules used in optical fiber cables assemblies are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a true center of the ferrule, wherein the true center is based on an outer surface of the ferrule; and reshaping at least a portion of the ferrule to change the true center of the ferrule, wherein the reshaping includes enlarging a portion of the ferrule. A variety of reshaping techniques are also disclosed.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: August 23, 2022
    Assignee: Corning Optical Communications LLC
    Inventors: Dana Craig Bookbinder, Boyang Lin, Garrett Andrew Piech, Steven Ross Sims, James Scott Sutherland, Michael Brian Webb, Elvis Alberto Zambrano
  • Patent number: 11415763
    Abstract: Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. Pluggable optical transceiver modules implement a rigid-plane jumper that provides an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in a manner that does not require the fiber jumper, while ensuring reduced optical loss. In some embodiments one or more rigid waveguide plates act as an opto-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, the rigid waveguide plates are coupled to a faceplate connector, and a CWDM block that is in turn optically coupled to the optical socket. In some embodiments, the CWDM block is directly attached to the rigid waveguide plates. In some embodiments, the CWDM block is indirectly attached to the rigid waveguide plates using a half periscope.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: August 16, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Sagi Varghese Mathai, Michael Renne Ty Tan
  • Patent number: 11416048
    Abstract: First event information that is associated with an event that corresponds to a temperature of a memory sub-system is received. Whether the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies a first threshold condition is determined. Responsive to determining that the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies the first threshold condition, a thermoelectric component (TEC) is caused to change from an inactive state to an active state by decreasing a temperature at a bottom surface of the TEC that is coupled to the memory sub-system as a temperature at a top surface of the TEC increases.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: August 16, 2022
    Assignee: Micron Technology, Inc.
    Inventor: Michael R. Spica
  • Patent number: 11411650
    Abstract: The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: August 9, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Kevin Liu, Hao-Chiang Cheng
  • Patent number: 11327258
    Abstract: This optical module comprises a stem; lead pins extending through the stem; glasses filled between the stem and the lead pins; elements (photodiode, amplifier) disposed on a first main surface of the stem, and connected to the lead pins; FPC in contact with a second main surface of the stem; a cap attachable to the stem; and an aligning-fixing parts (metal-made flange, Z-sleeve) that aligns an optical fiber stub with the cap and fix the optical fiber stub to the cap.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: May 10, 2022
    Assignee: YOKOWO CO., LTD.
    Inventors: Hideki Kamitsuna, Akira Ohki
  • Patent number: 11320601
    Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 3, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, John Cheng, Ziliang Cai
  • Patent number: 11309439
    Abstract: A package structure comprises a metal plate (20) where a slot is formed, a ceramic piece (60), and a metal heat sink (70) welded onto the back surface of the ceramic piece (60). The ceramic piece (60) and the metal heat sink (70) are vertically inserted into the slot and welded to the metal plate (20). A semiconductor and a matching circuit may be disposed on the metal heat sink (70). The ceramic piece (60) replaces a glass seal; metalized interconnection is provided inside the ceramic piece (60) for fabricating a metalized pattern having complex connection relations, and the electrical interconnection is more flexible. In the package structure, metalized wiring is carried out by using the ceramic piece. Compared with round lead machining, higher precision is achieved.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: April 19, 2022
    Assignee: He Bei Sinopack Electronic Tech Co., Ltd.
    Inventors: Yao Liu, Jun Li, Jing Zhao, Jing Sun, Bin Liang, Lin Feng Zhou, Di Gao
  • Patent number: 11265087
    Abstract: The present disclosure provides a compact-optic-connecting device for mounting on a motherboard of a computer, which includes an optic-receiving unit, an optic-launching unit, two flexible-circuit plates, a circuit board and a connecting interface. The optic-receiving unit and the optic-launching unit are connected to the bottom surface of the circuit board respectively via flexible-circuit plates. The connecting interface is connected to the bottom surface of the circuit board, and also connected to an external motherboard via the connecting interface. By virtue of such structure, the compact optic-connecting device can have a small length and size, and meanwhile to maintain a safety distance between the connecting interface and the optic-receiving unit, or the connecting interface and optic-launching unit, to prevent faulty conduction therebetween.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: March 1, 2022
    Assignee: OPTOMEDIA TECHNOLOGY INC.
    Inventors: Hui-Tsuo Chou, Pei-Hsiang Hsu
  • Patent number: 11256046
    Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: February 22, 2022
    Assignee: Nokia Solutions and Networks Oy
    Inventors: Michael J. Hochberg, Ari Jason Novack, Peter D. Magill
  • Patent number: 11245474
    Abstract: An object is to output an optical signal accurately corresponding to a data signal. A pluggable optical module (100) includes a pluggable electric connector (11), a control unit (12), an optical signal output unit (13), and a pluggable optical receptor (14). The pluggable electric connector (11) can communicate a modulation signal (MOD) and a control signal (CON1) with an optical communication apparatus (92). The optical signal output unit (13) outputs an optical signal (LS) modulated by the modulation scheme by the control signal (CON1) in response to the modulation signal (MOD). The pluggable optical receptor (14) is configured in such a manner that an optical fiber (91) is insertable into and removable from the pluggable optical receptor (14). The pluggable optical receptor (14) can output the optical signal (LS) output from the optical signal output unit (13).
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: February 8, 2022
    Assignee: NEC CORPORATION
    Inventor: Hirokazu Komatsu
  • Patent number: 11209608
    Abstract: An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: December 28, 2021
    Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Xuxia Liu, Yan Zhong
  • Patent number: 11177095
    Abstract: A wall grazer apparatus is provided. The wall grazer apparatus has a heat sink platform, a light source, a lens, a driver and a main housing. The heat sink platform has a main portion and a tilt portion. The light source is mounted on the tilt portion. The lens is disposed above the light source to convert an original light emitted from the light source to an output light. The driver converts an external power to a driving current. The driving current is supplied to the light source. The main housing disposes the heat sink platform, the light source, the lens and the driver. When the main housing is fixed to a first surface, the output light is projected on a second surface for forming a visual effect.
    Type: Grant
    Filed: April 18, 2020
    Date of Patent: November 16, 2021
    Assignee: XIAMEN ECO LIGHTING CO. LTD.
    Inventors: Jinhui Liang, Yongzhe Dong, Xiaoliang Wen, Shouqiang Hou
  • Patent number: 11166371
    Abstract: A system package module is provided. The system package module includes a module substrate, a plurality of first pins and a plurality of second pins. The module substrate includes a module substrate surface. The module substrate surface includes a first pin arrangement area and a second pin arrangement area. The second pin arrangement area surrounds the first pin arrangement area. The first pins are disposed in the first pin arrangement area. A first pin gap is formed between the two adjacent first pins. The second pins are disposed in the second pin arrangement area. A second pin gap is formed between the two adjacent second pins. The first pin gap is greater than the second pin gap.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: November 2, 2021
    Assignee: WISTRON NEWEB CORP.
    Inventors: Chen-An Hsieh, Jui-Hua Hu, Shih-Wei Chang
  • Patent number: 11156857
    Abstract: An initial change and a secular change in an optical characteristic and a high frequency characteristic in a case where an optical modulator is mounted in a package of an optical transmission apparatus are suppressed while improving a space utilization rate in the package of the optical transmission apparatus. An optical modulator that is electrically connected to an electric circuit configured on a circuit board, includes a package that houses an optical modulation element, in which the package has, on a bottom surface facing the circuit board, a plurality of first protruding bodies protruding from the bottom surface.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: October 26, 2021
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Norikazu Miyazaki, Toru Sugamata
  • Patent number: 11101611
    Abstract: An I/O connector assembly configured for making a cabled connection to an interior portion of a printed circuit board for at least some signals passing through the I/O connector. The I/O connector assembly may be assembled by mounting a cage to a printed circuit board. A receptacle connector, including cables extending from a rear of the connector, may be inserted through an opening in the top or rear of the cage. The receptacle connector may be positioned in the cage by at least one retention member on the cage. A plug, mating to the receptacle connector, also may be positioned by a retention member on the cage. Positioning both the plug and receptacle relative to the cage reduces the tolerance stackup of the assembly and enables the connectors to be designed with shorter wipe length, which enables higher frequency operation.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: August 24, 2021
    Assignee: FCI USA LLC
    Inventors: Jordan Winey, Arkady Y. Zerebilov, Michael Scholeno, Jeremy Shober
  • Patent number: 11075446
    Abstract: A communication device for wireless communication includes a housing having a front dielectric cover, a back dielectric cover and a metal frame circumferentially arranged between the front dielectric cover and the back dielectric cover. The metal frame forms a first antenna that is configured to radiate in a first set of frequency bands. The communication device further includes a circuit arranged inside the housing, where the circuit is electrically isolated from the metal frame and includes at least one first feed line coupled to the metal frame and configured to feed the first antenna with a first set of radio frequency signals in the first set of frequency bands. The communication device further includes a second antenna arranged inside the housing.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: July 27, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Alexander Khripkov, Linsheng Li, Ruiyuan Tian
  • Patent number: 11067764
    Abstract: An optical transceiver includes a receptacle, a ferrule and a ferrule fastening component. The receptacle includes a supporting portion and an inset portion connected with each other. The ferrule is disposed within the inset portion. The ferrule fastening component is disposed on the receptacle. The ferrule fastening component includes a first holding portion, a cap and a second holding portion connected together. The cap is located between the first holding portion and the second holding portion. The first holding portion touches the supporting portion, the second holding portion touches the ferrule, and the cap covers a first area of a top surface of the receptacle.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: July 20, 2021
    Assignee: Prime World International Holdings Ltd.
    Inventors: Ting-Jhang Liao, YI-Ju Wang, Ming-You Lai
  • Patent number: 11054592
    Abstract: The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.
    Type: Grant
    Filed: November 24, 2019
    Date of Patent: July 6, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Ziliang Cai
  • Patent number: 11057112
    Abstract: The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: July 6, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, Hao-Chiang Cheng, Hang Xie
  • Patent number: 11051394
    Abstract: An optical module with enhanced heat-dissipating properties and a method for manufacturing the optical module discloses an optical module which includes a substrate, a printed circuit, a component mounting block, an active device, and a lens. The printed circuit is formed on the substrate. The component mounting block is provided on the substrate, and the component mounting block has a recess. The active device, including a laser or a photodetector, is disposed in the recess. The lens is disposed on the active device.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: June 29, 2021
    Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
    Inventor: Han-Biao Zheng
  • Patent number: 11022766
    Abstract: We generally describe an optical transceiver connector (100) comprising: a first portion (102) comprising a first port (101) configured to releasably receive an optical connector (202); and a second portion (104) comprising a second port (103) configured to releasably receive an optical converter element (205), wherein an opening of the first port (101) faces towards a first direction opposite to a second direction towards which an opening of the second port (103) faces, and wherein the first port (101) is aligned with the second port (103) for establishing a releasable, light-coupling-capable connection between a said optical connector (202) to be received by the first port (101) and a said optical converter element (205) to be received by the second port (103).
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 1, 2021
    Assignee: Leoni Kabel GMBH
    Inventors: Bolin Jiang, Juntao Deng, Marcus Bloom-Pflug, Qi Huang
  • Patent number: 11022768
    Abstract: An opto-electric hybrid board includes an optical waveguide and an electric circuit board. The opto-electric hybrid board has an electrode at one end portion in a first direction perpendicular to the thickness direction, and optically and electrically connects an optical element emitting light from a space between the one end portion and the other end portion. The electric circuit board includes a terminal portion electrically connected to the electrode and a support portion that supports the other end portion. The optical waveguide includes a light receiving portion for receiving light emitted from the optical element, which is positioned between the terminal portion and the support portion, when projected in the thickness direction, and a one-side surface in the thickness direction of the terminal portion is positioned at the other side in the thickness direction with respect to a one-side surface in the thickness direction of the support portion.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: June 1, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoto Konegawa, Yuichi Tsujita, Naoyuki Tanaka
  • Patent number: 10980145
    Abstract: Provided is a patch panel, comprising: a circuit board; and an SFP, SFP+, or QSFP+ connector connected to a plurality of radio frequency coaxial (RF coaxial) connections via conductive traces of the circuit board, the RF coaxial connections configured to extend functionality of the SFP, SFP+, or QSFP+ socket of a computing device coupled to the patch panel from a rear end of the computing device to a front end of the computing device.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: April 13, 2021
    Assignee: Vapor IO, Inc.
    Inventor: Steven White
  • Patent number: 10978826
    Abstract: An electrical connector assembly includes an insulative housing, a plurality of terminals mounted on the insulative housing, a cable electrically connected with the terminals, a magnet disposed on the insulative housing, and an inner mold integrally formed on the insulative housing and the cable, wherein the electrical connector assembly also includes a heat insulation member disposed between the magnet and the inner mold to prevent the magnet from heat of the inner mold during molding.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: April 13, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Yong-Qi Li, Jian-Hui Tan, Jun Chen, Yang-Tsun Hsu, Jerry Wu
  • Patent number: 10948672
    Abstract: A material for blocking crosstalk, an optical assembly, and a method for preparing the material are provided. The optical assembly includes an optical receive assembly, where a periphery of the optical receive assembly includes a transparent region and a non-transparent region; the transparent region is made of the material, where a first layer of film is located on a side opposite to an optical receiving direction, and a second layer of film is located on a side opposite to the optical receive assembly; and the non-transparent region is of an electrical-signal shielding structure.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: March 16, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Min Zhou, Ning Cheng, Zhenxing Liao, Huafeng Lin
  • Patent number: 10942324
    Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: March 9, 2021
    Assignee: Corning Optical Communications LLC
    Inventors: Alan Frank Evans, Andreas Matiss, Michael Wimmer
  • Patent number: 10908371
    Abstract: A transistor outline (TO) package including a header with at least one optoelectronic device. The header is bonded to a pot-shaped metal cap, which has a window that is transmissive to electromagnetic radiation, such that the at least one optoelectronic device is arranged in a hermetically sealed interior. The wall of the metal cap has at least one lateral wall portion and/or end wall portion which is thickened towards the interior compared to a portion of the lateral wall of the metal cap adjacent to the header.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: February 2, 2021
    Assignee: Schott AG
    Inventors: Robert Hettler, Georg Mittermeier
  • Patent number: 10886700
    Abstract: An optical module control method is a method for controlling an optical module that includes a semiconductor light emitting element and an electronic cooling module configured to adjust a temperature of the semiconductor light emitting element. The optical module control method includes a step of detecting a temperature of a light emitting unit including the semiconductor light emitting element, and outputting temperature information of the semiconductor light emitting element; a step of detecting an environmental temperature and outputting temperature information of the environmental temperature, the environmental temperature being a temperature of environment where the light emitting unit is placed; and a step of controlling an output of the electronic cooling module on the basis of the temperature information of the semiconductor light emitting element and the temperature information of the environmental temperature, and adjusting the temperature of the light emitting unit.
    Type: Grant
    Filed: September 4, 2017
    Date of Patent: January 5, 2021
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yohei Enya, Hiromi Nakanishi
  • Patent number: 10886695
    Abstract: Improve semiconductor device performance. The wiring WL1A on which the semiconductor chip CHP1 in which the semiconductor lasers LD is formed is mounted has a stub STB2 in the vicinity of the mounting area of the semiconductor chip CHP1.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: January 5, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kazuaki Tsuchiyama, Motoo Suwa, Hidemasa Takahashi
  • Patent number: 10884205
    Abstract: An optical conversion module having a printed circuit board having a proximate and a distal end and including an electrical interface at the distal end. The optical conversion module also having a faceplate modularly connected to the proximate end of the printed circuit board, the faceplate having at least one retention device. The optical conversion module further having an optical transceiver disposed on and electrically connected to the printed circuit board, a chip optical connector disposed on and optically connected to the optical transceiver, and a faceplate optical connector modularly disposed through the faceplate and modularly connected to the chip optical connector through an optical fiber jumper.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: January 5, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin Leigh, John Norton
  • Patent number: 10816739
    Abstract: A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: October 27, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Frank Lei Ding, Maziar Amirkiai, Jianwei Mu, Hongyu Deng, Tao Wu
  • Patent number: 10795091
    Abstract: An example adaptor for passively aligning an optical component of an optical connector with a ferrule of the optical connector. The adaptor may include first alignment feature and second alignment features. The first alignment features may be to, when the adaptor is connected to the ferrule, cooperate with alignment features of the ferrule to passively force the adaptor into a first configuration relative to the ferrule. The second alignment features may be arranged such that, when the optical component is held in contact with the second alignment features and the adaptor is in the first configuration relative to the ferrule, the optical component is in an aligned position relative to the ferrule.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: October 6, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Sagi Mathai, Michael Tan
  • Patent number: 10788631
    Abstract: This disclosure relate to power control of an optical module. In one implementation, an optical module is disclosed. The optical module comprises a first edge connector pin, a microcontroller unit (MCU), and a power supply control unit disposed on a circuit board, wherein the first edge connector pin is configured to receive a control signal sent by a main-unit device during power up of the optical module; the MCU is electrically connected to the first edge connector pin and the power supply control unit, and is configured to read the control signal using the first edge connector pin, and when the control signal is a first-type control signal, send a corresponding type indication information to the power supply control unit; and the power supply control unit is configured to receive the type indication information sent by the MCU, and stop, according to the type indication information, supplying power.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 29, 2020
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventor: Long Zheng
  • Patent number: 10782443
    Abstract: A device. At least some example embodiments are a device including a filter element configured to receive optical energy from a first optical fiber. The filter element is reflective in a preselected band of optical wavelengths. A first lens is configured to receive optical energy transmitted through the filter element. A shell is disposed about the optical filter and the first lens; surfaces of the first lens, the filter element and the shell form a first boundary portion of an internal volume of an interior of the shell. A fluid is sealably disposed within the internal volume.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: September 22, 2020
    Assignee: Geospace Technologies Corporation
    Inventor: Willard Womack
  • Patent number: 10782474
    Abstract: Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: September 22, 2020
    Assignee: Corning Research & Development Corporation
    Inventors: Lars Martin Otfried Brusberg, Douglas Llewellyn Butler, Michael de Jong, Alan Frank Evans, Andreas Matiss, James Scott Sutherland
  • Patent number: 10765032
    Abstract: The present disclosure relates to an apparatus and a method for cooling electronic components. An apparatus of the presently claimed invention includes a connector and an electronic component that plugs into the connector. The electronic component contacts a heat sink, where the heat sink moves in an upward direction as the electronic component is plugged into the connector. Soft thermal pads located between the heat sink and liquid cooling tubes/pipes compress as the heat sink moves upward. When compressed, the thermal pads contact the heat sink and the liquid cooling tubes/pipes. Heat is then transferred from the electronic component through the heat sink, through the thermal pads, through the coolant tubes, and into liquid contained within the liquid coolant tubes.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: September 1, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey John Lunsman, Russell Eric Stacy
  • Patent number: 10712514
    Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: July 14, 2020
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Long Chen, Yuzhou Sun, Xiongfei Zhai, Donghan Wang, Zhenzhong Wang, Meng Fang, Chao Zhang, Xigui Fang, Xiangzhong Wang
  • Patent number: 10697810
    Abstract: A sensor housing assembly for enclosing an electrical interface circuit, a sensor or sensor input, and a connector for interfacing with a data unit. The sensor housing assembly generally includes a housing containing a circuit board and interface circuitry to condition a sensor input signal, and a connector mounted on the circuit board, the assembly being insertable into a data unit. The housing can include a protrusion that prevents the assembly from being inserted into the data unit incorrectly, which also allows a symmetrical connector to be used. The sensor housing assembly is adapted to be inserted into a receptacle in the data unit, which has blocking tabs that act with the protrusion to ensure that the assembly can only be inserted one way.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: June 30, 2020
    Assignee: Dickson/Unigage, Inc.
    Inventors: Dean A. Tjaden, Jr., Denise A. Alexander, Steven J. Thompson, James D. Springer
  • Patent number: 10695578
    Abstract: A vascular optical fiber guidewire includes an optical fiber guidewire and a plug connected to the optical fiber guidewire. The plug may be a memory alloy plug including a handle, a fixing groove and a sleeve which are sequentially connected. A radius of a segment of the fixing groove is larger than a radius of a segment of the fixing groove. The fixing groove cooperates with an external connector to provide a locking effect. The sleeve is provided with an elastically deformable spiral structure. The memory alloy plug is sleeved on a metal tube sleeved outside the optical fiber guidewire and connected with the optical fiber guidewire. A part of the metal tube extending from the memory alloy plug forms a spiral shape by spirally cutting to protect and support the optical fiber guidewire. The insertion and extraction operations and rotating operations can be facilitated.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: June 30, 2020
    Inventor: Hua Shang
  • Patent number: 10656355
    Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: May 19, 2020
    Assignee: LUXNET CORPORATION
    Inventors: Pi-Cheng Law, Po-Chao Huang, Hsing-Yen Lin, Ya-Hsin Deng, Hua-Hsin Su
  • Patent number: 10644478
    Abstract: Provided are: a light source module capable of having a reduced packaging area size while ensuring wavelength precision; and a method for manufacturing this light source module. This light source module is provided with a light amplifying means, a wavelength monitoring means for detecting a change in wavelength of light outputted from the light amplifying means, and a reflecting means which is disposed between the light amplifying means and the wavelength monitoring means, and which is for reflecting the light outputted from the light amplifying means toward the wavelength monitoring means.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 5, 2020
    Assignee: NEC CORPORATION
    Inventor: Isao Tomita
  • Patent number: 10644472
    Abstract: A communication device includes a mechanical frame, which is configured to be inserted into a multi-channel Small Form-Factor Pluggable (SFP) receptacle that is compliant with a first SFP standard and to receive inside the frame an SFP connector that is compliant with a second SFP standard, which is different from the first SFP standard. First electrical terminals, held by the mechanical frame, are configured to mate with respective first pins of the SFP receptacle, and second electrical terminals, electrically coupled within the mechanical frame to the first electrical terminals, are configured to mate with respective second pins of the SFP connector. A heat sink is mounted on the mechanical frame and configured to make a positive contact with the SFP connector when the SFP connector is inserted into the mechanical frame and to be contained completely within the SFP receptacle when the mechanical frame is inserted into the SFP receptacle.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: May 5, 2020
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Yaniv Kazav, Andrey Ger
  • Patent number: 10612948
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: April 7, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
  • Patent number: 10591683
    Abstract: The present invention relates generally to a passive optical network (PON)-based video overlay pluggable type optical network device that is easily connected and detached from an indoor optical network terminal (ONT) at a subscriber side, which transmits and receives an optical signal in which a video RF optical signal and a PON optical signal are overlaid, wherein a PON board for receiving and processing the PON optical signals and a video RF board for receiving and processing the video RF optical signals are easily removed for replacement from a housing including an optical sub-assembly (OSA), which separates the PON optical signal and the video RF optical signal, and the PON board and the video RF board are individually designed and configured in a removable manner so that interference between the signals is minimized and selective combinations and production are possible according to various types of PONs and video services.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: March 17, 2020
    Assignee: LIGHTRON FIGER-OPTIC DEVICES INC.
    Inventors: Hyun-Won Cha, Keun-Jae Park, Jeong-Hwan Cho, Oh-Sang Kwon, Hyun-Jong Youm, Seong-Seok Seo, Young-Un Heo
  • Patent number: 10578854
    Abstract: [Object] To provide an optical connector and an optical connector set which are excellent in environment resistance and suitable for the use in medical instruments, an image pickup unit and an image pickup system that use the optical connector, and an optical transmission module. [Solving Means] An optical connector according to the present technology includes a lens support, a fiber ferrule, a lens, and a lens retainer. The lens support includes a through-hole. An optical fiber is connected to the fiber ferrule. The fiber ferrule is press-fitted in the through-hole. The lens is inserted into the through-hole. The lens retainer is press-fitted in the lens support and sandwiches the lens between the lens retainer and the fiber ferrule.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: March 3, 2020
    Assignee: SONY CORPORATION
    Inventors: Terukazu Naruse, Tsuyoshi Ogawa, Kazuyoshi Yamada
  • Patent number: 10574360
    Abstract: A pluggable optical module includes a pluggable electric connector, a control unit, an optical signal output unit, and a pluggable optical receptor. The pluggable electric connector can communicate a modulation signal and a control signal with an optical communication apparatus. The optical signal output unit outputs an optical signal modulated by the modulation scheme by the control signal in response to the modulation signal. The pluggable optical receptor is configured in such a manner that an optical fiber is insertable into and removable from the pluggable optical receptor. The pluggable optical receptor can output the optical signal output from the optical signal output unit. The control unit controls the optical signal output unit to output the optical signal of a modulation amplitude set corresponding to the modulation signal in the modulation scheme specified by the control signal.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: February 25, 2020
    Assignee: NEC Corporation
    Inventor: Hirokazu Komatsu
  • Patent number: 10566363
    Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: February 18, 2020
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Peter Riel, Markus Rossi, Daniel PĂ©rez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
  • Patent number: RE48778
    Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: October 19, 2021
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Xian Zhou, Kewu Wang