Abstract: An apparatus for reducing residual stress of a semiconductor includes a stage configured to support a semiconductor wafer having the residual stress generated by a semiconductor manufacturing process. The apparatus includes an intense pulsed light (IPL) irradiation unit configured to irradiate IPL to the semiconductor wafer to reduce the residual stress of the semiconductor wafer, the IPL radiation unit being separated from the stage. The apparatus further includes at least one alignment unit configured to adjust relative positions of the stage and the IPL irradiation unit.

Abstract: A heating body is provided. The heating body includes a tube, a heating member disposed in the tube, and a supporting unit disposed along a length of the tube to maintain a predetermined space between the tube and the heating member.

Abstract: In certain embodiments, the present technique provides a system for curing a surface material disposed on a vehicle. The system includes an electrically actuated arm having an arm structure, a motorized drive coupled to the arm structure, and an actuator communicatively coupled to the motorized drive. The system also has a radiative curing device coupled to the arm structure, and a curing controller communicatively coupled to the radiative curing device.

Abstract: A device for thermally treating semiconductor wafers having at least one silicon layer to be oxidized and a metal layer, preferably a tungsten layer, which is not to be oxidized. The inventive device comprises the following: at least one radiation source; a treatment chamber receiving the substrate, with at least one wall part located adjacent to the radiation sources and which is substantially transparent for the radiation of said radiation source; and at least one cover plate between the substrate and the wall part of the treatment chamber located adjacent to the radiation sources, the dimensions of said cover plate being selected such that it fully covers the transparent wall part of the treatment chamber in relation to the substrate in order to prevent material, comprising a metal, metal oxide or metal hydroxide such as tungsten, tungsten oxide or tungsten hydroxide, from said substrate from becoming deposited on or evaporating onto the transparent wall part of the treatment chamber.

Abstract: An object of the present invention is to provide a repair device for vehicle capable of reducing the labor of an operator in paint and putty drying operation, facilitating the operation of the device, and providing a high quality paint surface. The repair device of the present invention includes a drying apparatus for drying a coating material coated on a panel surface, a distance detection sensor installed in the drying apparatus and detecting a distance between the drying apparatus and the panel surface coated with the coating material, and a moving device for moving the drying apparatus along the panel surface. The moving device moves the drying apparatus along the panel surface so that a value detected by the distance detection sensor comes within a specified range.

Abstract: A hair treatment promoting apparatus in which a reflector provided with a heater for radiating infrared rays is rotated by a motor so that the infrared rays are radiated to the top, back and both sides of a head of a subject. The heater and reflecting plate form a heating device rotated by the motor and a disk is provided which rotates with the motor. The disk is provided with a slit for a home position and slits for stopping arranged on both sides thereof, and energization of the motor is interrupted when the slit for the home position is detected within a prescribed time elapsed from when the slit for stopping is detected in the direction of rotating the heating device, thereby stopping the heating device at the home position.

Abstract: A system for heating a patient using a radiant heater is disclosed. In order to ensure optimum positioning of the patient various location and indication embodiments are included. The present invention either adjusts the energization of the heater to provide optimum heating, provides an indicator of the optimum position for the patient, indicates that the patient is not correctly positioned or any combination thereof.

Abstract: The present technique provides a system and method for finishing and curing a desired material applied to a surface of a target object, such as a vehicle. An adjustable arm assembly is used to position a curing device, such as a radiative curing mechanism, adjacent the surface having the desired material. The adjustable arm assembly has an arm structure, which is rotatable between minimum and maximum vertical positions. At a head of the arm structure, the adjustable arm assembly has an adjustable height mechanism to adapt the vertical range of the arm structure to a particular target object, such as a large-sized or small-sized object. The head may support any suitable finishing or curing device, such as an infrared lamp. The adjustable height mechanism may have a reversible coupling assembly, mutually exclusive high and low couplings, a pivotal offset coupling, a rail assembly, or any other suitable coupling having at least two different height options.

Abstract: A system and method for isothermally distributing a temperature across a semiconductor device. A furnace assembly is provided, which includes a processing tube configured to removably receive a wafer carrier having a full compliment of semiconductor wafers. A heating assembly is provided which can include a heating element positioned to heat air or other gases allowed to enter the process tube. The furnace assembly and process tube are capable of being vertically raised and lowered into a position enclosing the heating assembly within the process tube. Once the heating assembly forms a seal with the process tube, the process tube is exhausted and purged of air. Gas is then allowed to flow into the process tube and exchange heat with the heating element. The heated gas circulates through the process tube to convectively change the temperature of the wafers.

Abstract: A system and method for isothermally distributing a temperature across a semiconductor device. A furnace assembly is provided, which includes a processing tube configured to removably receive a wafer carrier having a full compliment of semiconductor wafers. A heating assembly is provided which can include a resistive heating element positioned to heat air or other gases allowed to enter the process tube. The wafer carrier and heating assembly are vertically raised into a position within the process tube. Once the heating assembly forms a seal with the process tube, the process tube is exhausted and purged of air. Gas is then allowed to flow into the process tube and exchange heat with the heating element. The heated gas circulates through the process tube to convectively raise the temperature of the wafers.

Abstract: Disclosed is a thermal treatment apparatus radiating low and high temperature, which includes a low-temperature radiating section and a high-temperature radiating section, and can rotatably scan affected parts. Both the low and the high temperature radiating sections are rotatable. The thermal treatment apparatus according to the present invention further includes a controller, with which a user can adjust the period of time for radiating low and high temperature as well as for rotation of the low-temperature radiating section and the high-temperature radiating section. The low-temperature radiating section is connected to a cryo-pump, while the high-temperature radiating section comprises an infrared ray lamp or a far infrared ray lamp. The present invention is applicable to medical treatment, physical therapy, sterilization of cosmetics or pharmaceuticals, or to tests of critical temperature for survival of cells.

Abstract: Apparatus and method for heating at a distance by light radiance includes a support and narrow-beam lamps mounted on the support in a matrix of lines and columns. Each of the lamps produce a luminous beam having a central axis of projection. The lamps in each column can be oriented to make their central axes converge to a first focal area. The lamps in each line can be oriented to make their central axes converge to a second focal area.

Abstract: A method and device for heating silicon carrier bodies in a deposition reactor are by means of radiated heat. In this method, the carrier bodies are irradiated by means of a heat radiation device which emits radiation having a color temperature of at least 2000.degree. C.

Abstract: An oven for use be in heating stations of thermoforming apparatus, comprises a heating panel constituted by panel portions which can be mutually opened or separated by a controlled falling operation or by gravity. Thus, in an emergency condition, the panel can be immediately removed from the plastic material being deformed, even in a case of a malfunction of the driving mechanism controlling the operation of the oven.

Abstract: A device for removing layers of paint from a surface including layers of paint which may comprise a base layer of oil paint. The paint is softened by radiation by means of at least one heating source. Immediately thereafter, the paint is removed mechanically from the surface. The apparatus comprises a carrier which may retain one or more sources of infrared radiation, a device for guided travel of the carrier in the horizontal plane along the painted surface and a device for guided travel of the carrier in the vertical plane along the painted surface.

Abstract: In order to simplify mounting and rearrangement of the infra-red lamps, and to minimize the size of unheated zones, an assembly plate (1) is formed with a pattern of assembly apertures (3) having at least three-fold symmetry. The bases (2) of the lamps (6) are formed with electrical passages (4) and fastening holes (5) whose spacing is compatible with the assembly aperture pattern. The electrical terminals are formed as contact pins (17) which project perpendicular to the quartz glass tube axis, set back from the ends (8,9) thereof, and make contact with a power supply in the electrical passages (4) in the bases (2). Multiple infra-red lamps (6) can thus be mounted closely adjacent to each other on the assembly plate (1), and the mounting configuration can be changed, e.g. by 90.degree. rotation of a lamp, with minimal rewiring effort. The completed system is suitable for surface heating or drying of products passing by on a conveyor belt or other production line.

Abstract: An apparatus for heat treating the surface of a body includes an infrared heat source carried on a stand. A circuit controls the energization of the lamp. The circuit includes a heat detector for detecting a targeted area temperature. The apparatus includes a sighting mechanism to permit an operator to accurately sight the heat detector against the surface to be heat treated.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes an array of IR lamps and associated lamp envelopes and lenses, together with control apparatus for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is configured to provide a desired line pattern of energy which is directed onto the leads of a device being soldered. The perimeter of the energy pattern is programmably alterable to suit particular device lead sizes and configurations.

Abstract: A portable resin curing apparatus is used for curing or drying materials printed on a screen press which has rotatable platens carrying screen printed sheets from a printing station to a curing station. The portable curing apparatus is located at the curing station and has electrical resistance heating elements alternating between low voltage and high voltage in conjunction with a forced air flow between the heating elements and printed material being cured. A controller is employed which sends an electrical signal upon advancement of the printed materials. Full curing voltage with no forced air flow is supplied to the heating elements during curing operations, whereas a lower voltage in combination with forced air flow is employed during the intervals between successive curing operations to prevent heat from continuing to be imparted to the printed material while still allowing for rapid re-attainment of full curing upon resumption of production.

Abstract: A control for the electrical curing elements on screen printing apparatus which applies full power to the elements during a heat-up period, and upon attaining a preselected temperature the control switches to a selected lower percentage of full power which continues as long as the apparatus continues to index through its printing cycles.

Abstract: A portable resin curing apparatus is used for curing or drying materials printed on a screen press which has rotatable platens carrying screen printed sheets from a printing station to a curing station. The portable curing apparatus is located and the curing station has electrical resistance heating elements alternating between low voltage and high voltage in conjunction with a forced airflow between the heating elements and printed material being cured. A controller is employed which sends an electrical signal upon advancement of the printed materials. Full curing voltage with no forced airflow is supplied to the heating elements during curing operations, whereas a lower voltage in combination with forced airflow is employed during the intervals between successive curing operations to prevent heat from continuing to be imparted to the printed material while still allowing for rapid re-attainment of full curing upon resumption of production.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby.

Abstract: An apparatus for heat treating the surface of a body includes at least one infrared lamp carried on a stand. A circuit is provided for controlling the energization of the lamp. The circuit includes a parameter input mechanism for permitting an operator to input at least one operating parameter to the circuit. The circuit also includes a proportional control software responsive to a temperature of the body being heat treated and responsive to a parameter inputted by the input mechanism.