Abstract: A windshield heating system includes a vehicle that has a windshield. A heat lamp unit is provided and the heat lamp unit is selectively coupled to a support and the heat lamp unit is pointed toward the windshield of the vehicle. The heat lamp unit selectively emits electromagnetic radiation to melt frozen precipitation from the windshield. A remote control is provided and the remote control may be manipulated to turn the heat lamp unit on and off.

Abstract: A heater comprising a radiative heating element disposed beneath a housing, in a recess formed therein; the recess having a heat reflective surface for reflecting heat radiation from the radiative heating element in a downwards direction. A heat deflecting member is located between the heating element and the reflective surface of the housing to prevent heat emitted from heating element from directly reaching the reflective surface.

Abstract: A novel flexible infrared device is provided for heating surfaces in a uniform manner not available previously. The heater is designed in a manner so as to allow “hugging” of the surface by attaching the heater module to at least two swivel points located above the heating plane. In this manner the common problems encountered with heating dies by IR heaters is overcome.

Abstract: An apparatus for thermally processing a substrate includes a first radiation source configured to heat a substrate and emit radiation at a heating wavelength, focusing optics configured to direct radiation from the first radiation source to the substrate, and a second radiation source configured to emit radiation at a second wavelength different from the heating wavelength and at a lower power than the first radiation source. Radiation from the second radiation source is directed onto the substrate. The apparatus further includes a first detector configured to receive reflected radiation at the second wavelength and a computer system configured to receive an output from the first detector and adjust a focus plane of the first radiation source relative to the substrate. The second radiation source is configured to have substantially the same focus plane as the first radiation source.

Abstract: Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which a light irradiation treatment is applied to the target substrate a plurality of times such that adjacent light irradiated regions on the target substrate partially overlap with each other and that the adjacent light irradiated regions do not overlap with each other in the light irradiating periods.

Abstract: A hair processing accelerator which can uniformly irradiate heat to a hairline of the whole circumference of hair includes first and second heater units having first and second heaters of a generally semicircular shape connected to a top portion of a head top unit supporting part 3 which is positioned in the head top of hair. While moving through multiple positions and by swinging and rotating around hair so as to separate from each other to right and left or approach each other from right and left by a heater unit driving part 50 contained in a body supporting part 5, the first and second heater units irradiate heat to all the areas of hair from the head top of hair to each of right and left sides.

Abstract: A hair processing accelerator having a first heater unit with a semicircular shape for irradiating hair upon the top of a person's head and second and third heater units each having a semicircular shape for irradiating a hairline on the person's head. The top portion of the second and third units being connected to the first unit by a body supporting part having rotating shafts so that the second and third heater units can rotate within a given range. The hair processing accelerator is mounted in a mobile floor stand.

Abstract: Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which a light irradiation treatment is applied to the target substrate a plurality of times such that adjacent light irradiated regions on the target substrate partially overlap with each other and that the adjacent light irradiated regions do not overlap with each other in the light irradiating periods.

Abstract: The present invention provides a hair processing accelerator which can uniformly irradiate heat to a hairline of all circumferences of a head of hair.

Abstract: Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which a light irradiation treatment is applied to the target substrate a plurality of times such that adjacent light irradiated regions on the target substrate partially overlap with each other and that the adjacent light irradiated regions do not overlap with each other in the light irradiating periods.

Abstract: A device for removing layers of paint from a surface including layers of paint which may comprise a base layer of oil paint. The paint is softened by radiation by means of at least one heating source. Immediately thereafter, the paint is removed mechanically from the surface. The apparatus comprises a carrier which may retain one or more sources of infrared radiation, a device for guided travel of the carrier in the horizontal plane along the painted surface and a device for guided travel of the carrier in the vertical plane along the painted surface.

Abstract: A high-performance multi-zone illuminator module (130) for directing optical energy onto a semiconductor wafer (60) in a device fabrication reactor to improve overall semiconductor wafer processing uniformity comprises a housing connectable to the wafer processing reactor and having a bottom side and a reflector mounted to the bottom side. The reflector comprises a plurality of concentric circular zones (190, 192, 194 or 270, 262, 266, 264) for reflecting optical energy that include a plurality of circularly distributed lamp sockets (185). Engaged within the lamp sockets (185) are a plurality of point-source lamps (196) for directing optical energy to the semiconductor wafer (60) surface. The point-source lamps (196) are associated with the reflector (184 and 186 or 276 and 277) for directing light toward the wafer. The lamps are associated within each circular zone to provide an approximately continuous and diffused light ring at the semiconductor wafer (60).

Abstract: The present invention relates to a surface processing apparatus which performs heating processing of an object of heating which is mounted on a mounting device provided inside a process container, and which includes a plural number of lamps provided so as to oppose a rear surface of a processing surface of an object of processing, a rotating unit which has the plural number of lamps mounted to it in a ring shape, and a drive unit which drives the rotating unit. Also, the present invention relates to a processing apparatus for leading a process gas from a gas supply tube to a gas chamber partitioned inside a process container, and which blows process gas from an outlet of the gas chamber and onto an object of processing which is mounted on a mounting device provided inside the process container, and which includes a plural number of partition plates each provided with a plural number of through holes, being provided at required intervals in a direction of gas flow and inside the gas chamber.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes an array of IR lamps and associated lamp envelopes and lenses, together with control apparatus for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is configured to provide a desired line pattern of energy which is directed onto the leads of a device being soldered. The perimeter of the energy pattern is programmably alterable to suit particular device lead sizes and configurations.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby.