Added Bonding Material, E.g., Solder, Braze, Etc. Patents (Class 403/272)
  • Patent number: 10343238
    Abstract: Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: July 9, 2019
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Masayuki Suzuki, Naoko Izumita, Shunsaku Yoshikawa, Ken Tachibana, Rei Fujimaki, Hikaru Nomura
  • Patent number: 10293172
    Abstract: One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: May 21, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert Dittmer, Senthil Kumar Balasubramanian, Leoni Wilhelm, Thomas Schmitt, Thorsten Kaiser, Tim Asmus
  • Patent number: 10163579
    Abstract: Disclosed is a glass composition for sealing a large-area dye-sensitized solar cell, and more particularly, to a glass composition which may be uniformly bonded to a large-area without reacting with an electrolyte.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: December 25, 2018
    Assignees: Kongju National University Industry-University Cooperation Foundation, Orion Co., Ltd.
    Inventors: Woon Jin Chung, Han Sol Lee, Jae Kwun Hwang, Jae Hyoung Park
  • Patent number: 9994489
    Abstract: Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: June 12, 2018
    Assignee: The Boeing Company
    Inventors: Tab Hunter Crooks, MaryAnn S. Muench
  • Patent number: 9796054
    Abstract: Disclosed herein is a high-temperature lead-free Au—Sn—Ag-based solder alloy that is excellent in sealability, joint reliability, and wet-spreadability, that can be kept at a high quality level for a long period of time, and that is provided at a relatively low cost. The lead-free Au—Sn—Ag-based solder alloy contains 27.5 mass % or more but less than 33.0 mass % of Sn, 8.0 mass % or more but 14.5 mass % or less of Ag, and a balance being Au except for elements inevitably contained therein during production. When having a plate- or sheet-like shape, the Au—Sn—Ag-based solder alloy has a surface whose L*, a*, and b* in an L*a*b* color system in accordance with JIS Z8781-4 are 41.1 or more but 57.1 or less, ?1.48 or more but 0.52 or less, and ?4.8 or more but 9.2 or less, respectively. When having a ball-like shape, the Au—Sn—Ag-based solder alloy has a surface whose L*, a*, and b* are 63.9 or more but 75.9 or less, 0.05 or more but 0.65 or less, and 1.3 or more but 11.3 or less, respectively.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: October 24, 2017
    Assignee: SUMITOMO METAL MINING CO., LTD.
    Inventor: Takashi Iseki
  • Patent number: 9345895
    Abstract: Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: May 24, 2016
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Michael G. Marinkov, Lea A. Nygren, Brad C. Tischendorf
  • Patent number: 9248863
    Abstract: A vehicle body superstructure includes a roof side rail having a rail flange upon which a roof panel is mounted, a vertical rail wall that hangs down from the outer end of the rail flange in the vehicle width direction, a bottom rail wall that extends from the lower end of the vertical rail wall to the outside in the vehicle width direction, and a bulging section formed by allowing the bottom rail wall and the vertical rail wall to bulge toward the center in the vehicle width direction, in order to accommodate a slide rail for a sliding door. The outer end of a roof arch in the vehicle width direction is joined to the bulging section. First arch flanges are joined on the lower surface side of the rail flange. Second arch flanges are joined to the lower surface side of the of the bottom rail wall.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: February 2, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Hirokazu Matsuura, Masami Yaguchi
  • Publication number: 20150135844
    Abstract: An assembly, comprising two ceramic bodies, which are connected by means of a joint, which contains an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced from the ceramic bodies, in each case, by at least 1 ?m, especially at least 2 ?m, and wherein the joint has bounding layers, which border on the ceramic body. The the core volume, which includes at least 50% of the volume of the joint, is free of crystalline phases of size greater than 6 ?m, especially greater than 4 ?m, preferably greater than 2 ?m.
    Type: Application
    Filed: June 7, 2013
    Publication date: May 21, 2015
    Inventors: Nils Ponath, Andreas Rossberg, Elke Schmidt
  • Publication number: 20150140738
    Abstract: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.
    Type: Application
    Filed: March 6, 2013
    Publication date: May 21, 2015
    Inventor: Hironobu Moriyama
  • Publication number: 20150132143
    Abstract: A weld joint (30) having asymmetric sides and providing reduced restraint of weld metal shrinkage and a reduced propensity for weld centerline cracking. The weld joint may have a first side (38) formed at an angle (A1) of 35-60° relative to the component surface (36), and a second side (40) formed at an angle (A2) of 10-35° relative to the surface. The sides may be extended to intersect (44) without the necessity for a flat bottom surface (20) as is typical for prior art weld joints (10). The inventive weld joint may be formed by moving an end mill tool (60) into and along the surface with its axis of rotation (64) being transverse to the surface.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 14, 2015
    Inventors: Gerald J. Bruck, Ahmed Kamel
  • Publication number: 20150125281
    Abstract: A multi-component braze filler alloy comprising at least 70% by weight MarM509A superalloy with the remainder MarM509B superalloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. It is shown that generally higher braze temperatures lead to improved results including the possibility of re-welding such a brazed component, resulting in a re-repaired brazed component capable of continued commercial service.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 7, 2015
    Inventors: Petya M. Georgieva, James A. Yarbrough
  • Publication number: 20150125282
    Abstract: A multi-component braze filler alloy comprising 60-70% by weight CM247 superalloy and BRB braze alloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. The substrate/braze interface may be subsequently weld-repaired without de-melting and migrating the braze alloy from the interface. The weld zone and surrounding area are solidification crack resistant. After the alloy composition is brazed to the base substrate the component may be returned to service. Thereafter the component remains repairable by welding or re-brazing, if needed to correct future in-service defects.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 7, 2015
    Inventors: Petya M. Georgieva, James A. Yarbrough
  • Publication number: 20150117937
    Abstract: In a flux-cored wire for welding an ultrahigh tensile strength steel, one or more of CaF2, BaF2, SrF2, and MgF2 are included in the wire and, when a total amount thereof is defined as ?, the ? is more than 2.0% and equal to or less than 8.0% in terms of mass % with respect to a total mass of the wire, one or more of Ti oxide, Si oxide, Mg oxide, and Al oxide are included in the wire and, when a total amount thereof is defined as ?, the ? is 0.01% to 1.20% in terms of mass % with respect to the total mass of the wire, a ratio of an amount of the CaF2 with respect to the ? is 0.50 or more, a ratio of the ? with respect to the ? is 2.0 to 800.0, and Ceq defined in following Expression a is 0.60% to 1.20%, Ceq=[C]+[Si]/24+[Mn]/6+[Ni]/40+[Cr]/5+[Mo]/4+[V]/14??(a).
    Type: Application
    Filed: May 2, 2013
    Publication date: April 30, 2015
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shuichi Nakamura, Kazuhiro Kojima, Yasuhito Totsuka, Ryuichi Shimura
  • Publication number: 20150110548
    Abstract: The present disclosure provides compositions and methods for forming three-dimensional structures atop substrates. These structures may be formed and processed so as to braze together two substrates. The structures may be controllably formed in three dimensions so as to accommodate virtually any substrate geometry or configuration. The structures may also be disposed so as to maintain spacing between two surfaces.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 23, 2015
    Inventor: Aarne H. Reid
  • Patent number: 8997606
    Abstract: An assembly that includes a tube mount, a tube, a first fillet weld, and a second fillet weld. The tube mount has a tubular side wall, a plurality of circumferentially spaced apart notches formed on a first end of the tubular side wall, and a securing aperture formed through the tubular side wall. The notches form a plurality of teeth. The tube is received into the tube mount. The first fillet weld couples the tube to the tube mount. The first fillet weld is formed about a perimeter the first end such that each of the first welds is formed substantially completely over the entirety of the teeth. The second fillet weld couples the tube to the tube mount. The second fillet weld is formed about a perimeter of the securing aperture such that the second fillet weld is formed substantially completely over an inside perimeter of the securing aperture.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: April 7, 2015
    Assignee: American Axle & Manufacturing, Inc.
    Inventors: Zugang Huang, James P. Downs, Gregory A. Marsh
  • Publication number: 20150093188
    Abstract: The present invention relates to a method for providing a braze alloy layered product comprising the following steps: —applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; —heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product.
    Type: Application
    Filed: March 27, 2013
    Publication date: April 2, 2015
    Applicant: ALFA LAVAL CORPORATE AB
    Inventors: Per Sjödin, Kristian Walter
  • Publication number: 20150086263
    Abstract: A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.
    Type: Application
    Filed: April 17, 2013
    Publication date: March 26, 2015
    Inventors: Hikaru Nomura, Shunsaku Yoshikawa
  • Publication number: 20150078810
    Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 19, 2015
    Inventors: Paul Joseph Koep, Ellen S. Tormey, Girard Sidone
  • Patent number: 8979416
    Abstract: In a panel joint structure, a first joint portion and first load transfer portions are formed on an end portion of a first panel, and a second joint portion and second load transfer portions are formed on an end portion of a second panel. A first joint surface of the first joint portion and a second joint surface of the second joint portion are welded and adhered to each other, and first load transfer surfaces of the first load transfer portions and second load transfer surfaces of the second load transfer portions are adhered to each other. The first load transfer surfaces are contained in the range of the plate thickness of a first panel body portion, and the second load transfer surfaces are contained in the range of the plate thickness of a second panel body portion.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: March 17, 2015
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Daisuke Itoh
  • Publication number: 20150056006
    Abstract: A welding wire formed of a trace boron titanium base alloy is provided, along with welds formed from the wire and articles comprising one or more of such welds. A method may include forming such a weld or welds from such a welding wire, and may also include non-destructively inspecting titanium alloy articles comprising one or more of such welds using ultrasonic waves to detect internal flaws.
    Type: Application
    Filed: November 5, 2014
    Publication date: February 26, 2015
    Inventors: Jeffrey J. Bernath, Sesh A. Tamirisakandala
  • Publication number: 20150056005
    Abstract: Provided is a process for producing a welded joint which includes a weld metal having high strength and high toughness, and containing fewer blowholes. The process for producing a welded joint according to the present embodiment includes the steps of: preparing a base material containing, by mass %, not less than 10.5% of Cr; and subjecting the base material to GMA welding using a shielding gas containing 1 to 2 volume % or 35 to 50 volume % of CO2 gas, and the balance being inert gas, thereby forming a weld metal includes, by mass %, C: not more than 0.080%, Si: 0.20 to 1.00%, Mn: not more than 8.00%, P: not more than 0.040%, S: not more than 0.0100%, Cu: not more than 2.0%, Cr: 20.0 to 30.0%, Ni: 7.00 to 12.00%, N: 0.100 to 0.350%, O: 0.02 to 0.11%, sol. Al: not more, than 0.040%, at least one of Mo: 1.00 to 4.00% and W: 1.00 to 4.00%, and the balance being Fe and impurities.
    Type: Application
    Filed: March 27, 2013
    Publication date: February 26, 2015
    Applicant: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Kenta Yamada, Masahiko Hamada, Daisuke Motoya, Shinjiro Nakatsuka, Hisashi Amaya, Hideki Takabe
  • Publication number: 20150037088
    Abstract: A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Ken Tachibana, Yoshie Yamanaka, Hikaru Nomura, Kyu-oh Lee
  • Publication number: 20150037087
    Abstract: A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. It can form solder joints with high reliability even when used for soldering to electrodes having a Ni coating which contains P, since the growth of a P-rich layer is suppressed so that the shear strength of the joints is improved and the alloy has a high ductility and a high tensile strength.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Ken Tachibana, Hikaru Nomura, Kyu-oh Lee
  • Publication number: 20150030382
    Abstract: The invention relates principally to a welded steel part with a very high mechanical strength characteristics obtained by heating followed by hot forming, then cooling of at least one welded blank obtained by butt welding of at least one first and one second sheet consisting at least in part of a steel substrate and a pre-coating which is constituted by an intermetallic alloy layer in contact with the steel substrate, topped by a metal alloy layer of aluminum or aluminum-based alloy.
    Type: Application
    Filed: July 23, 2012
    Publication date: January 29, 2015
    Applicant: ARCELORMITTAL INVESTIGACION Y DESARROLLO, S.L.
    Inventors: Laurent Cretteur, Qingdong Yin, Francis Schmit, Wolfram Ehling
  • Patent number: 8932519
    Abstract: A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: January 13, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Seiko Ishibashi, Shunsaku Yoshikawa, Tsukasa Ohnishi
  • Publication number: 20140363221
    Abstract: A first joining object and a second joining object are joined to each other using an insert material. The first joining object and/or the second joining object has a first metal composed of Sn or an alloy containing Sn. The insert material contains, as a main component, a second metal which is an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu, and is located between the first joining object and the second joining object. When subjected to heat treatment to produce an intermetallic compound of the first metal and the second metal, the first joining object and the second joining object are joined to each other.
    Type: Application
    Filed: August 27, 2014
    Publication date: December 11, 2014
    Inventors: Kosuke Nakano, Hidekiyo Takaoka
  • Publication number: 20140356056
    Abstract: A hybrid diffusion-brazing process and hybrid diffusion-brazed article are disclosed. The hybrid diffusion-brazing process includes providing a component having a temperature-tolerant region and a temperature-sensitive region, brazing a braze material to the temperature-tolerant region during a localized brazing cycle, then heating the component in a furnace during a diffusion cycle. The brazing and the heating diffusion-braze the braze material to the component, and the localized brazing cycle is performed independent of the diffusion cycle in the hybrid diffusion-brazing process. The hybrid diffusion-brazed article includes a component, and a braze material diffusion-brazed to the component with a filler material. The filler material has a melting temperature that is above a tolerance temperature of the component.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 4, 2014
    Inventors: Liangde XIE, Ronald Lee SOUTHER, Mark Lawrence HUNT, Steven Charles WOODS
  • Publication number: 20140356681
    Abstract: A brazing structure for an electrochemical cell is described. It includes a nickel or nickel alloy component; a ceramic component; a braze alloy layer, containing an active metal element, between the nickel and the ceramic component, and a barrier layer disposed between the nickel layer and the braze alloy layer. The barrier layer is capable of preventing or minimizing the diffusion of the active metal element into the nickel or nickel alloy component. Electrochemical cells that include such a brazing structure are also described, as are related methods for joining nickel components to ceramic components in the manufacture of thermal batteries.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 4, 2014
    Applicant: General Electric Company
    Inventors: Sundeep Kumar, Mohamed Rahmane, Vipin Raju Suddala
  • Publication number: 20140348576
    Abstract: In joining members to be joined (1, 1) by heating the members to be joined (1, 1) that are mated with intervening an insert (2) while applying opposing loads to the members to be joined (1, 1), so as to allow eutectic reaction to occur between the members to be joined (1, 1) and the insert (2) to discharge a eutectic melt from a joining plane along with an oxide film (1a) of the members to be joined, the members to be joined (1) are brought into contact with the insert (2) so that the oxide film (1a) is broken by a stress concentrating means previously provided at least one of joining portions breaks to produce a starting point of the eutectic reaction.
    Type: Application
    Filed: July 10, 2012
    Publication date: November 27, 2014
    Inventors: Shigeyuki Nakagawa, Yoshitaka Uehara, Chika Yamamoto, Kenji Miyamoto, Toshikazu Nanbu
  • Publication number: 20140348571
    Abstract: Provided in one embodiment is a method of joining one or more articles together using pressurized fluid to deform a bulk-solidifying amorphous alloy material and form a mechanical interlock between the respective surfaces joined together.
    Type: Application
    Filed: October 21, 2011
    Publication date: November 27, 2014
    Inventors: Christopher D. Prest, Joseph C. Poole, Matthew S. Scott, Dermot J. Stratton, Stephen P. Zadesky, Richard W. Heley
  • Publication number: 20140332192
    Abstract: Embodiments disclosed herein generally relate to methods, systems and apparatuses configured to form and/or configure hydrophobic and/or hydrophilic surface features on the workpieces to enhance a brazing process. The hydrophilic and/or the hydrophobic surface features can be arranged to facilitate directing a melted filler material to where the filler material may be desired, and may also help prevent/reduce the filler material flowing to where the filler material may not be desired. The surface features can be micro milled on a surface of the workpiece.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 13, 2014
    Applicant: TRANE INTERNATIONAL INC.
    Inventors: Ronald Maurice COSBY, II, William Burgess FOX
  • Publication number: 20140328615
    Abstract: A method is described for assembling at least two parts made of silicon carbide based materials by non-reactive brazing in an oxidizing atmosphere, each of the parts comprising a surface to be assembled, wherein the parts are placed in contact with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient for completely or at least partially melting the brazing composition, or rendering the brazing composition viscous, and the parts and the brazing composition are cooled so as to form, after cooling the latter to ambient temperature, a moderately refractory joint.
    Type: Application
    Filed: December 20, 2012
    Publication date: November 6, 2014
    Applicant: COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES AL TERNATIVES
    Inventors: Valérie Chaumat, Jean-François Henne, Fiqiri Hodaj
  • Publication number: 20140321905
    Abstract: Provided is joint part capable of suppressing diffusion of carbon and nitrogen contained in the steel member to the TiAl-based alloy member and suppressing formation of voids, titanium carbide or a nitride due to diffusion of carbon and nitrogen contained in the steel member, and thereby suppressing decrease in the brazing strength. A joint part comprises a steel member containing alloy elements including C and Cr, a TiAl-based alloy member, and a Ni-based brazing filler metal via which the steel member and the TiAl-based alloy member are joined to each other, wherein the steel member has a carbide and a nitride each forming a bond with at least one of the alloy elements at least on a side of a boundary with the Ni-based brazing filler metal, and diffusion of C and N to the Ni-based brazing filler metal adjacent to the TiAl-based alloy member is suppressed by the carbide and the nitride.
    Type: Application
    Filed: November 19, 2012
    Publication date: October 30, 2014
    Inventor: Takashi Arai
  • Publication number: 20140301776
    Abstract: Provided are a welding method and a weld joint with which the fatigue strength of the box-welded joint of a gusset plate and a high-tensile steel can be dramatically improved. A welding method whereby a gusset plate is welded to high-tensile steel by means of box-welding, with a bead having a length of 17 mm or greater being formed at the ends of the gusset plate in the lengthwise direction using a welding material for which the martensite transformation starting temperature of the weld metal is 350° C. or less. In addition, a weld joint formed by welding a gusset plate to high-tensile steel using the aforementioned method; a method for repairing or reinforcing a box-welded part.
    Type: Application
    Filed: October 26, 2012
    Publication date: October 9, 2014
    Applicant: Osaka University
    Inventors: Chiaki Shiga, Kazuo Hiraoka
  • Publication number: 20140299983
    Abstract: A joint structure includes: a ceramic member; a metallized layer formed on a surface of the ceramic member; and a metal member joined to the metallized layer via a brazing material. The metal member includes a base part erected on the metallized layer, and an extended part extended from the base part to define a predetermined gap with respect to the metallized layer. The base part includes an end joined to the metallized layer by a brazing material layer including the brazing material, and a side joined to the metallized layer around the base part by a fillet including the brazing material formed on the metallized layer around the base part. The extended part defines a recess at a position facing the metallized layer on which the fillet is formed.
    Type: Application
    Filed: April 8, 2014
    Publication date: October 9, 2014
    Applicant: NGK SPARK PLUG CO., LTD
    Inventors: Sadahiro NISHIMURA, Naoki TSUDA
  • Publication number: 20140219711
    Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.
    Type: Application
    Filed: August 2, 2012
    Publication date: August 7, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Publication number: 20140212208
    Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.
    Type: Application
    Filed: January 31, 2013
    Publication date: July 31, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: David Edward SCHICK, Srikanth Chandrudu KOTTILINGAM, Johnie Franklin McCONNAUGHHAY, Brian Lee TOLLISON, Yan CUI
  • Publication number: 20140205370
    Abstract: A vehicle, such as a missile, is disclosed. The vehicle includes an optically transparent dome, a vehicle body, and a brazed joint directly coupling the dome to the vehicle body. The dome is formed of a Nanocomposite Optical Ceramic (NCOC) material comprising two or more different types of nanograins dispersed in one another. Each nanograin type has a coefficient of thermal expansion (CTE), and an aggregate CTE of the NCOC material is based on the CTE of each nanograin type.
    Type: Application
    Filed: July 31, 2012
    Publication date: July 24, 2014
    Inventors: Wayne L. Sunne, Christopher E. Pentland, Christopher D. Marr
  • Publication number: 20140199115
    Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
    Type: Application
    Filed: August 2, 2012
    Publication date: July 17, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi
  • Publication number: 20140186101
    Abstract: An austenitic steel welded joint is produced by gas tungsten arc welding an austenitic steel base metal with a welding material of austenitic steel having a composition comprising: C?0.1%; Si?0.8%; Mn: 1.5 to 5.5%; Ni: 8 to 15%; Cr: 18 to 24%; Al<0.05%; N: 0.15 to 0.35%; and one or more of V?0.5%, Nb?0.5%, and Mo?4.5% if necessary, the balance being Fe and impurities that contain O?0.02%, P?0.05%, and S?0.03%. The chemical composition satisfies [413?462(C+N)?9.2Si?8.1 Mn?13.7Cr?9.5Ni?18.5Mo??70]. The amount of ferrite of the weld metal is 20% or less in area ratio. The welded joint has high strength and excellent hydrogen embrittlement resistance and is useful in high-pressure hydrogen gas piping where no postweld heat treatment is performed.
    Type: Application
    Filed: June 20, 2012
    Publication date: July 3, 2014
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Hiroyuki Hirata, Tomohiko Omura, Yusaku Tomio, Jun Nakamura
  • Publication number: 20140186102
    Abstract: A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and brazing composition are cooled to that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is an alloy comprising, in atomic percentages, 45% to 65% silicon, 28% to 45% nickel and 5% to 15% aluminium. A brazing composition as defined above is provided. A brazing paste, suspension comprising a powder of said brazing composition and an organic binder as well as a joint and assembly obtained the foregoing method are also provided.
    Type: Application
    Filed: March 7, 2014
    Publication date: July 3, 2014
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Valérie Chaumat, Jean-Francois Henne, Nadia Miloud-Ali
  • Publication number: 20140126956
    Abstract: A solder joint structure includes a metal pin in the shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other. The at least one portion of the wound portion includes a deformed surface resulting from a partial disappearance or elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly and closely adhered to the deformed surface.
    Type: Application
    Filed: September 12, 2013
    Publication date: May 8, 2014
    Applicant: NIDEC CORPORATION
    Inventor: Tomoyoshi YOKOGAWA
  • Publication number: 20140126955
    Abstract: A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.
    Type: Application
    Filed: February 27, 2013
    Publication date: May 8, 2014
    Applicant: YUAN ZE UNIVERSITY
    Inventors: Cheng-En Ho, Shih-Ju Wang, Yu-Hui Wu
  • Publication number: 20140112710
    Abstract: A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.
    Type: Application
    Filed: February 27, 2012
    Publication date: April 24, 2014
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Hans-Jurgen Albrecht, Klaus Wilke, Katsuaki Suganuma, Minoru Ueshima
  • Patent number: 8684388
    Abstract: A bicycle having a first tube with a first tube portion and a first weld portion. The first tube portion has a first tube portion thickness and the first weld portion has a first weld portion thickness. The first weld portion has a first mating surface. A second tube having a second tube portion and a second weld portion. The second tube portion has a second tube portion thickness and the second weld portion has a second weld portion thickness. The second weld portion has a second mating surface. The first mating surface is positioned adjacent to the second mating surface, forming a weld interface between the first tube and the second tube. A weld bead formed along the weld interface coupling the first weld portion and the second weld portion.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: April 1, 2014
    Assignee: Specialized Bicycle Components, Inc.
    Inventor: Chuck Teixeira
  • Publication number: 20140083191
    Abstract: A joint structure by welding includes a butted part between facing surfaces of a first member and a second member and two-stepped clearances adjacent to the butted part, and a weld bead that is melted from a joint of the butted part which is positioned on an opposite side of the two-stepped clearances into the two-stepped clearances is formed in the butted part by welding. Other parts than the butted part are spaced apart from each other between the facing surfaces, and when a width of the weld bead is assumed to be “A”, a width of a first level clearance of the two-stepped clearances that is adjacent to the butted part is assumed to be “B”, and a width of a second level clearance of the two-stepped clearances that is adjacent to the first level clearance is assumed to be “C”, the relation of “B<A/2<C” is determined.
    Type: Application
    Filed: June 1, 2011
    Publication date: March 27, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shingo Iwatani, Keisuke Uchida
  • Publication number: 20140086670
    Abstract: Provided are a joint of a metal material and a ceramic-carbon composite material which can be used at high temperatures, a method for producing the same, a novel carbon material joint, a jointing material for a carbon material joint, and a method for producing a carbon joint. A joint 6 of a metal material 4 and a ceramic-carbon composite material 1 is a joint of a metal material 4 made of metal and a ceramic-carbon composite material 1. The ceramic-carbon composite material 1 includes a plurality of carbon particles 2 and a ceramic portion 3 made of ceramic. The ceramic portion 3 is formed among the plurality of carbon particles 2. The metal material 4 and the ceramic-carbon composite material 1 are joined through a joining layer 5. The joining layer 5 contains a carbide of the metal and the ceramic.
    Type: Application
    Filed: May 22, 2012
    Publication date: March 27, 2014
    Applicant: TOYO TANSO CO., LTD.
    Inventors: Tomoyuki Ohkuni, Weiwu Chen, Yoshinari Miyamoto, Tetsuro Tojo
  • Publication number: 20140079472
    Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.
    Type: Application
    Filed: February 28, 2012
    Publication date: March 20, 2014
    Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FOEDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Hermann Oppermann, Matthias Hutter, Christian Ehrhardt
  • Publication number: 20140063757
    Abstract: According to an embodiment, a joint structure of package members housing or holding an electronic component includes a first member, a second member joined to the first member, and a joint portion provided between the first member and the second member. The joint portion contains a metal element with a melting point of 400° C. or more and the metal element of 98 percent by weight or more.
    Type: Application
    Filed: April 26, 2013
    Publication date: March 6, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Kazutaka TAKAGI
  • Publication number: 20140044479
    Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 13, 2014
    Inventors: Minoru Ueshima, Rei Fujimaki