Abstract: Embodiments disclosed herein generally relate to methods, systems and apparatuses configured to form and/or configure hydrophobic and/or hydrophilic surface features on the workpieces to enhance a brazing process. The hydrophilic and/or the hydrophobic surface features can be arranged to facilitate directing a melted filler material to where the filler material may be desired, and may also help prevent/reduce the filler material flowing to where the filler material may not be desired. The surface features can be micro milled on a surface of the workpiece.

Abstract: A method is described for assembling at least two parts made of silicon carbide based materials by non-reactive brazing in an oxidizing atmosphere, each of the parts comprising a surface to be assembled, wherein the parts are placed in contact with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient for completely or at least partially melting the brazing composition, or rendering the brazing composition viscous, and the parts and the brazing composition are cooled so as to form, after cooling the latter to ambient temperature, a moderately refractory joint.

Abstract: Provided is joint part capable of suppressing diffusion of carbon and nitrogen contained in the steel member to the TiAl-based alloy member and suppressing formation of voids, titanium carbide or a nitride due to diffusion of carbon and nitrogen contained in the steel member, and thereby suppressing decrease in the brazing strength. A joint part comprises a steel member containing alloy elements including C and Cr, a TiAl-based alloy member, and a Ni-based brazing filler metal via which the steel member and the TiAl-based alloy member are joined to each other, wherein the steel member has a carbide and a nitride each forming a bond with at least one of the alloy elements at least on a side of a boundary with the Ni-based brazing filler metal, and diffusion of C and N to the Ni-based brazing filler metal adjacent to the TiAl-based alloy member is suppressed by the carbide and the nitride.

Abstract: A joint structure includes: a ceramic member; a metallized layer formed on a surface of the ceramic member; and a metal member joined to the metallized layer via a brazing material. The metal member includes a base part erected on the metallized layer, and an extended part extended from the base part to define a predetermined gap with respect to the metallized layer. The base part includes an end joined to the metallized layer by a brazing material layer including the brazing material, and a side joined to the metallized layer around the base part by a fillet including the brazing material formed on the metallized layer around the base part. The extended part defines a recess at a position facing the metallized layer on which the fillet is formed.

Abstract: Provided are a welding method and a weld joint with which the fatigue strength of the box-welded joint of a gusset plate and a high-tensile steel can be dramatically improved. A welding method whereby a gusset plate is welded to high-tensile steel by means of box-welding, with a bead having a length of 17 mm or greater being formed at the ends of the gusset plate in the lengthwise direction using a welding material for which the martensite transformation starting temperature of the weld metal is 350° C. or less. In addition, a weld joint formed by welding a gusset plate to high-tensile steel using the aforementioned method; a method for repairing or reinforcing a box-welded part.

Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.

Abstract: A vehicle, such as a missile, is disclosed. The vehicle includes an optically transparent dome, a vehicle body, and a brazed joint directly coupling the dome to the vehicle body. The dome is formed of a Nanocomposite Optical Ceramic (NCOC) material comprising two or more different types of nanograins dispersed in one another. Each nanograin type has a coefficient of thermal expansion (CTE), and an aggregate CTE of the NCOC material is based on the CTE of each nanograin type.

Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.

Abstract: An austenitic steel welded joint is produced by gas tungsten arc welding an austenitic steel base metal with a welding material of austenitic steel having a composition comprising: C?0.1%; Si?0.8%; Mn: 1.5 to 5.5%; Ni: 8 to 15%; Cr: 18 to 24%; Al<0.05%; N: 0.15 to 0.35%; and one or more of V?0.5%, Nb?0.5%, and Mo?4.5% if necessary, the balance being Fe and impurities that contain O?0.02%, P?0.05%, and S?0.03%. The chemical composition satisfies [413?462(C+N)?9.2Si?8.1 Mn?13.7Cr?9.5Ni?18.5Mo??70]. The amount of ferrite of the weld metal is 20% or less in area ratio. The welded joint has high strength and excellent hydrogen embrittlement resistance and is useful in high-pressure hydrogen gas piping where no postweld heat treatment is performed.

Abstract: A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and brazing composition are cooled to that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is an alloy comprising, in atomic percentages, 45% to 65% silicon, 28% to 45% nickel and 5% to 15% aluminium. A brazing composition as defined above is provided. A brazing paste, suspension comprising a powder of said brazing composition and an organic binder as well as a joint and assembly obtained the foregoing method are also provided.

Abstract: A solder joint structure includes a metal pin in the shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other. The at least one portion of the wound portion includes a deformed surface resulting from a partial disappearance or elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly and closely adhered to the deformed surface.

Abstract: A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.

Abstract: A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.

Abstract: A bicycle having a first tube with a first tube portion and a first weld portion. The first tube portion has a first tube portion thickness and the first weld portion has a first weld portion thickness. The first weld portion has a first mating surface. A second tube having a second tube portion and a second weld portion. The second tube portion has a second tube portion thickness and the second weld portion has a second weld portion thickness. The second weld portion has a second mating surface. The first mating surface is positioned adjacent to the second mating surface, forming a weld interface between the first tube and the second tube. A weld bead formed along the weld interface coupling the first weld portion and the second weld portion.

Abstract: A joint structure by welding includes a butted part between facing surfaces of a first member and a second member and two-stepped clearances adjacent to the butted part, and a weld bead that is melted from a joint of the butted part which is positioned on an opposite side of the two-stepped clearances into the two-stepped clearances is formed in the butted part by welding. Other parts than the butted part are spaced apart from each other between the facing surfaces, and when a width of the weld bead is assumed to be “A”, a width of a first level clearance of the two-stepped clearances that is adjacent to the butted part is assumed to be “B”, and a width of a second level clearance of the two-stepped clearances that is adjacent to the first level clearance is assumed to be “C”, the relation of “B<A/2<C” is determined.

Abstract: Provided are a joint of a metal material and a ceramic-carbon composite material which can be used at high temperatures, a method for producing the same, a novel carbon material joint, a jointing material for a carbon material joint, and a method for producing a carbon joint. A joint 6 of a metal material 4 and a ceramic-carbon composite material 1 is a joint of a metal material 4 made of metal and a ceramic-carbon composite material 1. The ceramic-carbon composite material 1 includes a plurality of carbon particles 2 and a ceramic portion 3 made of ceramic. The ceramic portion 3 is formed among the plurality of carbon particles 2. The metal material 4 and the ceramic-carbon composite material 1 are joined through a joining layer 5. The joining layer 5 contains a carbide of the metal and the ceramic.

Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

Abstract: According to an embodiment, a joint structure of package members housing or holding an electronic component includes a first member, a second member joined to the first member, and a joint portion provided between the first member and the second member. The joint portion contains a metal element with a melting point of 400° C. or more and the metal element of 98 percent by weight or more.

Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.

Abstract: The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.

Abstract: Ferritic stainless steel excellent in corrosion resistance of the weld zone, in particular the corrosion resistance to crevice corrosion, even if eliminating the Ar gas shield at the time of TIG welding and, furthermore, excellent in weld zone strength and a structure of the same are provided. By making the ingredient system one satisfying the following formula (1) in ferritic stainless steel which has predetermined contents of ingredients by mass % under a usual corrosive environment, it is possible to raise the corrosion resistance. Furthermore, under a severely corrosive environment, by making the relationship between the back surface exposed width of the weld bead and the steel sheet thickness satisfy the formula (2) in addition to the relationship of the ingredients prescribed in formula (1), it is possible to obtain a welded structure strong in crevice corrosion.

Abstract: A sleeve is placed between a first body and second body, where the first body and the second body are different materials. The sleeve is a third material that is at least similar to the material of the first body, and a mechanical connection is made between the sleeve and the second body. The mechanical connection has a locking abutment where the surface of the sleeve is angled toward the end of the second body that is in the union, and this angled surface of the sleeve abuts the second body. A first connection substance is positioned between the sleeve and the first body, and a second connection substance is positioned between the sleeve and the second body.

Abstract: A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%.

Abstract: A monolithic, substantially hermetic joining or bonding of two or more aluminum nitride (“AlN”) ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AlN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y2O3) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together. In a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing. Such processes can be used to form complex ceramic structures such as a ceramic susceptor used in integrated circuit fabrication.

Abstract: A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0?[Cu]?3.6×[Si]?67.5. In addition, the area fraction of the ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of the ? phase “?”%, and the area fraction of a ? phase “?”% satisfy 30?“?”?84, 15?“?”?68, “?”+“?”?92, 0.2?“?”/“?”?2, “?”?3, “?”?5, “?”+“?”?6, 0?“?”?7, and 0?“?”+“?”+“?”?8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.

Abstract: This weld metal has a predetermined chemical composition, controls the number of oxides in accordance with size, and has an A value stipulated by the belowmentioned formula of no greater than 5.0. A value=(100×[C]?6×[insol.Cr]?2×[insol.Mo]?24×[insol.V]?13×[insol.Nb])×([Mo]?[insol.Mo]), where [insol.Cr], [insol.Mo], [insol.Nb], and [insol.V] are contents (in mass percent) of Cr, Mo, Nb, and V, respectively, present as a compound after stress-relief heat treatment, and [C] and [Mo] are contents (in mass percent) of C and Mo, respectively, contained in the weld metal.

Abstract: A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes nickel, silicon, boron, and an active metal element. The braze alloy includes nickel in an amount greater than about 50 weight percent, and the active metal element in an amount less than about 10 weight percent. An electrochemical cell using the braze alloy for sealing a ceramic component to a metal component in the cell is also provided.

Abstract: A braze alloy composition is disclosed, containing nickel, about 5% to about 40% of at least one refractory metal selected from niobium, tantalum, or molybdenum; about 2% to about 32% chromium; and about 0.5% to about 10% of at least one active metal element. An electrochemical cell that includes two components joined to each other by such a braze composition is also described. A method for joining components such as those within an electrochemical cell is also described. The method includes the step of introducing a braze alloy composition between a first component and a second component to be joined, to form a brazing structure. In many instances, one component is formed of a ceramic, while the other is formed of a metal or metal alloy.

Abstract: A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.

Abstract: Provided are a flux cored arc welding wire able to improve low-temperature toughness of a weld joint and a weld joint using the same, in which the flux cored arc welding wire includes 0.01 wt % to 0.1 wt % of carbon (C), 0.3 wt % to 1.4 wt % of silicon (Si), 1.0 wt % to 3.0 wt % of manganese (Mn), 4.0 wt % to 7.5 wt % of titanium (Ti)+TiO, 0.01 wt % to 3.0 wt % of nickel (Ni), 0.01 wt % to 0.2 wt % of boron (B), 0.02 wt % to 0.42 wt % of yttrium (Y) or 0.02 wt % to 0.56 wt % of a rare earth metal (REM), and iron (Fe) as well as other unavoidable impurities as a remainder.

Abstract: The present joined product is a joined product with a cemented carbide sintered compact serving as a first material to be joined and a cBN sintered compact serving as a second material to be joined, wherein: the first material to be joined and the second material to be joined are joined together via a joining material disposed therebetween and containing titanium (Ti); and a titanium nitride (TiN) compound layer having a thickness of 10-300 nm is produced at an interface between the second material to be joined and the joining material.

Abstract: The gap between first and second bonding portions is filled with a disperse solution obtained by dispersing copper micro-particles into a solution for copper oxide elution, so as to elute copper oxide configured as the outermost layer of the first bonding portion and copper oxide configured as the outermost layer of the second bonding portion, and copper oxide formed on the surface of each copper micro-particle. Pressure is applied to the first and second bonding portions using a press machine so as to raise the pressure of the disperse solution. At the same time, heat is applied under a relatively low temperature condition of 200° C. to 300° C., so as to remove the components contained in the disperse solution except for copper, thereby depositing copper. Thus, a first base portion and a second base portion are bonded via a copper bonded portion containing copper derived from the copper micro-particles.

Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece and one or more second metal workpieces are brought into proximity to one another such that a first portion of the first workpiece is in general overlying relationship with a second portion of the one or more second workpieces. A suitable material is provided between said first portion and said second portion, said material being in the form of particles or foil. At least a first part of said first workpiece comprising said first portion is forced toward said a part of the one or more second workpiece comprising said second portion by means of any one of a suitable high pressure joining process and a high speed joining process, such as to cause the said first metal workpiece and said one or more second metal workpieces to become joined or welded to one another to form a metallurgical bond therebetween.

Abstract: A method of joining, e.g., by fusion welding, titanium, and titanium-based alloys to ferrous metals, and the intermetallic weld pool created by practice of the method is described. The instant invention involves the use, inclusion or deployment of tantalum into the weld pool and upon cooling a weld, to create a surprisingly strong intermetallic bond, weld, or joint.

Abstract: A 3N copper wire with trace additions for bonding in microelectronics contains 3N copper and one or more corrosion resistance addition materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance addition materials is between about 90 wt. ppm and about 980 wt. ppm.

Abstract: A doped 4N copper wire for bonding in microelectronics contains one or more corrosion resistance dopant materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance dopant materials is between about 10 wt. ppm and about 80 wt. ppm.

Abstract: An ultrahigh-strength welded joint with superior strength and toughness, and a method for producing the ultrahigh-strength welded joint by means of single-pass welding by using laser hybrid welding, are provided, wherein the welded joint comprising a steel plate having a plate thickness of 4 mm to 12 mm and including weld metal of almost full martensite structure, wherein, in a cross-section of the welded joint in a direction perpendicular to a welding direction, a cross-sectional shape of the weld metal has a width W1 of 2.0 to 7.0 mm at a surface of the steel plate and a width W2 of 0.5 to 2.4 mm at a position where is separated from the surface by three-quarters of the plate thickness, wherein the weld metal comprises, by mass %, C: over 0.09% to 0.24%; Si: 0.2% to 1.0%; Mn: 0.5% to 2.5%; P: 0.02% or less; S: 0.02% or less; Al: 0.004% to 0.08%; Ti: 0.005% to 0.15%; O: 0.005% to 0.05%; and Ni: 1.0% to 9%, and wherein a carbon equivalent (Ceq) is 0.40% to 1.

Abstract: A method for joining, assembling, at least two parts comprising silicon carbide-based materials is provided. The parts are contacted with a non-reactive brazing composition, the assembly having the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition, and the parts and the brazing composition are cooled so that, after solidification of the brazing composition, a moderately refractory joint is formed. The brazing composition is a binary alloy consisting, in atomic percentages, of 60% to 66% silicon and 34% to 40% nickel. Prior to contacting the parts with the brazing composition, a reinforcement is added. A composition comprising the brazing composition and a reinforcement is provided. A brazing paste, suspension comprising a powder of the brazing composition, a reinforcement, and an organic liquid cement, binder, or an organic viscous gel is provided. A joint and assembly obtained by the foregoing method is provided.

Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

Abstract: The invention is a welding method capable of controlling an arc heat distribution on a groove face of a base metal, which comprises increasing or decreasing the melting rate of a welding wire relative to the feeding rate of the welding wire by changing the characteristic of an arc current to thereby change an arc generating position of a fusing end of the welding wire, wherein an AC arc welding operation is performed by changing the polarity of the welding wire as the characteristic of the arc current; and a welded joint structure formed by the welding method.

Abstract: The invention relates to an apparatus and to a process for cohesively joining two plates (1 and 2) having differing melting points, one of which plates, the end plate (1), includes a light metal material, in particular aluminum material, and the other of which plates, the connecting plate (2), includes an iron and/or titanium material, wherein a coating (9) preferably on the basis of zinc or aluminum is provided at least partially on at least one of the abutting faces (3?, 3?) of the abutting edge (3) of the connecting plate (2) which extend inclined with respect to one another, in which process both plates (1 and 2) are joined together by braze welding so as to abut against one another along their common joint using an additional material (5) on the basis of light metal, in particular on the basis of aluminum.

Abstract: A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and the brazing composition are cooled so that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is a binary alloy consisting in atomic percentages, of 60% to 66% silicon and 34 to 40% nickel. A brazing composition as defined above is also provided. A paste, suspension of braze alloy comprising a powder of the brazing composition and an organic binder is provided. In addition, a joint and assembly obtained with the foregoing method is provided.

Abstract: A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and brazing composition are cooled to that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is an alloy comprising, in atomic percentages, 45% to 65% silicon, 28% to 45% nickel and 5% to 15% aluminium. A brazing composition as defined above is provided. A brazing paste, suspension comprising a powder of said brazing composition and an organic binder as well as a joint and assembly obtained the foregoing method are also provided.

Abstract: A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt. % Mn; and a remainder of Sn.

Abstract: Dissimilar metal welds including a buttering portion with a small variation in strength distribution in a plate thickness direction are formed by welding two parent materials having at least one of different compositions and different refining conditions through a buttering for alleviating mismatch between one of the different compositions and the different refining conditions of the two members and through a welded metal for joining one of the parent materials and the buttering. The buttering is formed of welding metals laminated in a plate thickness direction, and a dilution ratio of the buttering with the parent materials is 50% or less. The manufacturing method includes performing butt welding on a dummy material formed by increasing a groove depth by providing a member on a bottom side of a welding groove and on parent materials by using the buttering; and processing a groove within a welding metal formed of the buttering.

Abstract: A kit for preparing a two-dimensional or a three-dimensional framing for a plant pre-assembly includes a plurality of metallic prefabricated standard segments. Each of the standard segments has a hollow or solid profile section and plug-in socket system components such that the standard segments are connectable to each other, directly or indirectly and in a bearable manner via the plug-in socket system components, by at least one of screwing, soldering and welding to prepare or adapt the framing to a pre-assembly requirement of a plant or a component of the plant.

Abstract: A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

Abstract: A hydrogen purifier utilizing a hydrogen-permeable membrane to purify hydrogen from mixed gases containing hydrogen is disclosed. Improved mechanical support for the permeable membrane is described, enabling forward or reverse differential pressurization of the membrane, which further stabilizes the membrane from wrinkling upon hydrogen uptake.

Abstract: In an assembly including a tubular member made of steel and a structure made of aluminum, the tubular member has an end portion for engagement in a recess of the structure. At least one receptacle is provided between the end portion of the tubular member and the structure and filled with a welding filler containing aluminum as base material for effecting a connection between the tubular member and the structure.