Abstract: An apparatus for handling or transferring a semiconductor component. The apparatus comprises a first structure and a second structure coupled thereto. The first structure and the second structure define a vacuum chamber therebetween. The second structure comprises at least one module coupled thereto. Each module comprises a passageway defined therethrough. Vacuum is applied through the passageway for facilitating pick up of the semiconductor component at a first position and for securing the semiconductor component to the module during displacement of the module from the first position to a second position. The apparatus comprises a plunger. Displacement of the plunger from a retracted position to an extended position impedes fluid communication between the passageway of the module and the chamber. Displacement of the plunger to the extended position further causes purging of air through the passageway of the module to thereby detach the semiconductor component from the module.

Abstract: Productivity is improved by ensuring reliability of palette holding and reliability of operations.

Abstract: A substrate support apparatus which inserts a substrate holding portion into a center hole formed in a substrate, and supports the substrate in a vertical orientation by the substrate holding portion, comprises a first connecting plate connected to the substrate holding portion, a second connecting plate which faces the first connecting plate and is connected to a transport robot that transports the substrate to a substrate holder, at least three linear support members configured to connect the first connecting plate to the second connecting plate, and an elastic shock absorbing member inserted between the first connecting plate and the second connecting plate.

Abstract: A placement device is described comprising a gripper (110) and a holder (120), wherein the gripper is movable relative to the holder along a first axis. The placement device is characterized in that the gripper and the holder are mutually coupled by a tilting member (160) allowing the gripper to tilt away from the first axis.

Abstract: A device for handling containers of a collapsible type, including one or more stations and a transport unit. The device is arranged to receive the containers oriented in a first direction and the transport unit is arranged to transport the containers to at least one of the stations by moving the containers in a second direction along a curved path, the second direction being perpendicular to the first direction. The device has a holding device provided for at least one station and located in a stationary position adjacent to the station and a transfer device, which is provided for the at least one station and carried by the transport unit and which is cyclically movable along an endless path between a pick-up position and a delivery position located adjacent to the station. The transfer device is arranged to pick up at least one container in the pick-up position and transfer the at least one container, in the delivery position, to the holding device.

Abstract: Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.

Abstract: The present disclosure relates to methods and apparatuses for manufacturing absorbent articles, and more particularly, apparatuses and methods utilizing multiple processing stations for processing absorbent articles and being configurable to move along various predetermined travel paths defined by radii that may be constant or variable. Particular embodiments of apparatuses and methods of manufacture include a processing wheel having a plurality of processing stations which orbit around a rotation axis. The processing stations may be configured to perform various types of operations associated with the manufacture of absorbent articles while the processing stations orbit around the rotation axis. The processing wheel can be configured to adjust the path along which the processing stations orbit as the processing wheel rotates around the rotation axis.

Abstract: A semiconductor handler subassembly is provided. The semiconductor handler subassembly includes an adjustment apparatus with a floating lock that is configured to adjust and lock in place to a desired position, and a tip attached to the floating lock and configured to engage a part.

Abstract: A transporting carrier for transporting a transported object and for transferring it to a bringing-in/bringing-out part, which projects from a station and which brings in or out the transported object to or from the station or for transferring the transported object from the bringing-in/bringing-out part, the transporting carrier comprising: a main body part which has loading and accommodating parts and a lateral opening, the loading part being a space to load the transported object, the accommodating part being located under the loading part, the accommodating part being a space to accommodate the bringing-in/bringing-out part such that the bringing-in/bringing-out part is at least partially surrounded from lateral sides; a traveling device on the main body part; and a transferring device above the loading part of the main body part, for transferring the transported object between the loading part and the bringing-in/bringing-out part, with the bringing-in/bringing-out part in the accommodating part.

Abstract: A transport apparatus for a tire building core assembly includes a jig assembly support frame; first and second spreader mechanisms; first and a second arm mechanisms, each arm mechanism having a first arm and a second arm coupled to the support frame and to a respective spreader mechanism. The first and second arms of each arm mechanism move between an open divergent position defining an opening sized to admit a respective spindle mechanism of the core assembly therein and a convergent closed position capturing the respective spindle mechanism therebetween. First and second releasable latch mechanisms selectively locking the first and second arms of the first and second arm mechanisms in the open and closed positions. A weigh scale is coupled to a hoist that raises and lowers the jig assembly and captured core assembly, the weigh scale indicating when the weight supported by the hoist includes the core assembly.

Abstract: The present invention relates to a test tray for a test handler. According to this invention, there is disclosed a technique that an insert loaded in a loading part which is arranged in a matrix pattern in a frame of the test tray allows an amount and direction of free movement thereof to be determined in accordance with a location of the loading part, where the insert is loaded, on the matrix, thereby enabling a thermal expansion or contraction of a match plate or the test tray to be compensated.

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history. In one embodiment, non-orthogonal robot trajectories are used to assure reliable and high speed substrate transfer. In another embodiment, at least one buffering station is used to avoid collision and improve throughput. In another embodiment, optimal positioning of the robots are used to improve throughput.

Abstract: Provided are manufacturing facilities capable of manufacturing many kinds of products efficiently in a small lot without increasing their cost. The manufacturing facilities comprise working cells (21 and 22) having at least two machine tools (11 and 12) arranged for working a workpiece (W), a rinsing cell (23) having at least two rinsing devices (13) arranged for rinsing the workpiece worked, an inspecting cell (24) having at least two inspecting devices (14) arranged for inspecting leakage of the workpiece rinsed, and a robot arm (15) capable of gripping the workpiece and transferring the workpiece between the individual cells (21, 22, 23 and 24). The individual cells (21, 22, 23 and 24) are arranged around the robot arm (15).

Abstract: A transfer apparatus has a vertical guide rod, on which a vertical carriage slides, which is integrated with a horizontal carriage, both of which support a transfer bar and gripping members that are responsible for the automatic handling of stamped parts in process. The transfer apparatus has a shaft limiter, below which there is a right angle lever with a stop, and a horizontal guide rod where the horizontal carriage slides. The transfer apparatus has a drive lever to drive a connecting rod which is connected to the right angle lever and has an adjustable stop toward a fixed stop, which limits the travel of the horizontal carriage in the Y-axis direction. The transfer apparatus in question has a continuous operating cycle and is controlled by a central processing unit.

Abstract: The fetching device has an arm which captures die-cut blanks located in the magazine of an erecting machine for erecting these blanks to form boxes or the like. The extractor arm is provided with suckers and these suckers are supplied by circuits and. The circuits and are connected to each end of the arm and they are also provided with dispenser-type devive and, respectively, so that they can be active together or separately. The suckers are wholly or partly provided with multifunction three-way valves. These valves are able to allow as many suckers as possible to be selected and used for the operation of extracting each die-cut blank and to isolate the circuits from each other in order to deactivate any suckers which are to be shunted in order to erect said die-cut blanks, for example.

Abstract: A substrate processing apparatus includes a substrate processing section that processes a plurality of substrates assuming a vertical posture in a batch manner; a first traversing mechanism that laterally moves a first traverse holding portion along a first traversing path between a substrate transfer position and a substrate delivery position; a second traversing mechanism that laterally moves a second traverse holding portion along a second traversing path disposed below the first traversing path between the substrate transfer position and the substrate delivery position; an elevation mechanism that raises and lowers an elevation holding portion in the substrate transfer position; and a main transfer mechanism that conveys a plurality of substrates assuming a vertical posture in a batch manner between the substrate delivery position and the substrate processing section, the first and second traverse holding portions, and the elevation holding portion each holds a plurality of substrates assuming a vertical

Abstract: An OHT conveyer vehicle places a FOUP on first and second on platforms. A third platform can move to a position overlapping with the first and second platform by a moving device, and then to a position at which an upper surface of the third platform is above upper surfaces of the first and second platforms by an elevation device. Therefore, the FOUP is placed on the third platform. Subsequently, the third platform can move to a position overlapping with fourth and fifth platforms by the moving device, and then to a position at which the third platform is lower than the fourth and fifth platforms by the elevation device. Therefore, the FOUP is placed on the fourth and fifth platforms.

Abstract: When a bottle 4 made of resin is irradiated with an electron beam while it is being held by a gripper 2, an area of the bottle 4 which is shielded from the electron beam by the gripper 2 is minimized. The gripper has a pair of supports 22A, 22B positioned on opposite sides of the bottle made of resin, and abutments 24A, 24B disposed respectively on the supports 22A, 22B for holding the bottle 4 made of resin, each of the abutments 24A, 24B comprising two thin plates 26A, 28A, 26B, 28B which are vertically spaced from each other. The abutments 24A, 24B hold the bottle 4 by gripping a neck 4a of the bottle 4 on its opposite sides. While holding the bottle 4, the supports 22A, 22B are held out of contact with an outer surface of the bottle 4, allowing the electron beam to travel around the neck 4a to sterilize the entire surface of the bottle 4.

Abstract: The invention relates to a device and a method for processing flat substrates (2), such as circuit boards or the like to be printed, wherein the substrate (2) can be fed resting on a transport device on two opposite side edge regions (4), can be first lifted from below for the purpose of processing by means of supports (7) and pressed against corresponding hold-down pieces (10) in the side edge regions (4), and can be clamped on the corresponding side edges (11) of the substrate (2) in this position, resting on the supports (7), between two clamping strips (13), whereupon the hold-down piece (10) can be lowered to the side away from the substrate (2) and the clamping strip (13) and further below the region of the upper side (16) of the substrate (2) thus located, whereupon full-surface processing can take place.

Abstract: A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.

Abstract: A transfer chamber for a flat display device manufacturing apparatus is provided. The transfer chamber may combine functions of a transfer chamber and a load-lock chamber. A robot may be provided aside from a center of the transfer chamber, and a buffer may be provided so as to avoid interference with the robot. An aligner may adjust a position of a substrate mounted on the buffer.

Abstract: A substrate transfer apparatus comprising: a plurality of floating-transfer guide plates adjacent to each other, each of guide plates having a plurality of floating gas ejecting holes; a gas supplying source; a tray to mount a substrate to be transferred, and that is floated by the floating gas; and a transfer arm for transferring the floated tray from the guide plate to the adjacent other guide plate, wherein the tray includes both side edges, and a contact/engagement portion formed at the respective both side edges for the transfer arm, each of the transfer arms including a base portion that can horizontally reciprocate along a rail provided so as to be parallel to the transfer direction, a guide portion provided to the base portion, that can horizontally reciprocate in a direction orthogonal to the transfer direction, and an arm portion provided to the guide portion, that can horizontally reciprocate in the direction parallel to the transfer direction.

Abstract: A robot is provided which comprises a wafer blade (105) having a pocket (109) therein for receiving a semiconductor wafer, and a retractable protrusion (107) which is movable from a first position in which said protrusion prevents the removal of said wafer from said pocket, to a second position in which said protrusion permits the removal of said wafer from said pocket.

Abstract: A pressure-heating apparatus includes: a stage configured to place an object to be pressure-heated thereon; a pressure-heating head arranged to oppose to the stage; and a pressure drive mechanism configured to movably support the pressure-heating head relative to said stage. The pressure-heating head includes: a plurality of pressure-heating tools; a holder configured to independently accommodate each of the pressure-heating tools; a single heater block configured to contact with ends of the pressure-heating tools to transmit a heat; and a plurality of supporters configured to independently and movably support the pressure-heating tools relative to the holder, respectively.

Abstract: A device for providing support to an LCD and its corresponding components during various manufacturing steps. A first carrier section is positioned on a work surface and is then loaded with an LCD as well as drivers to be bonded to the tabs of the LCD. Once the desired work has been performed a second carrier section is mated with the first carrier section and a closing means is utilized to position the two carrier sections in a closed position. Once the two carrier sections have been placed in a closed position about the LCD and other components, the entire piece may be safely removed from its position on the work surface for further processing, storage, etc. Exemplary embodiments also relate to a method of providing support to an LCD and its corresponding components during various manufacturing steps.

Abstract: A frame and vacuum expansion chuck are used in combination for stretching a tape carrying a plurality of singulated devices to facilitate removal of the devices with reduced risk of contact between a device being removed from the tape and an adjacent device on the tape. The combination includes a frame for holding edges of a tape carrying a plurality of singulated devices, and a vacuum chuck having upper surfaces for contacting an underside of a tape carrying a plurality of singulated devices. The vacuum chuck extends along a perimeter circumscribing the singulated devices, and at least one groove is defined in the upper surface of the vacuum chuck. Conduit for providing fluid communication between the groove and a vacuum source are provided. Upon evacuation of the volume defined between the groove and the tape, the tape is drawn down into the groove and stretched, thereby increasing the separation or gap between adjacent dice and reducing the risk of damage upon removal of the dice.

Abstract: In stacking tray supplying for receiving in a stacked state a plurality of trays that are received in a state in which components to be mounted onto a board are aligned, two tray stages are provided rotationally transferably on a concentric circle. In a state in which one is positioned in a feeding tray placement position and the other is positioned in a standby tray placement position, components are fed from the tray stage positioned in the feeding tray placement position. When a component depletion state occurs, the tray stages are rotationally transferred to switchover the mutual placement positions, by which waste of time required to component feeding is reduced.

Abstract: A rotary device for supporting, clamping and locating or arranging multiple-size vessels, comprises a first substantially like star element and second star element, each star element having a substantially fretted circumferential rim, defining a plurality of circumferential adjoining notches, said first and second elements being adapted to be axially overlapped and to intermittently mutually turn to define variable width recesses, each said recess being adapted to receive and firmly hold therein a respective variable cross size or width vessel.

Abstract: An apparatus for processing microelectronic topographies, a method of use of such an apparatus, and a method for passivating hardware of microelectronic processing chambers are provided. The apparatus includes a substrate holder configured to support a microelectronic topography and a rotatable case with sidewalls arranged on opposing sides of the substrate holder. The method of using such an apparatus includes positioning a microelectronic topography upon a substrate holder of a processing chamber, exposing the microelectronic topography to a fluid within the processing chamber, and rotating a case of the processing chamber. The rotation is sufficient to affect movement of the fluid relative to the surface of the microelectronic topography. A method for passivating hardware of a microelectronic processing chamber includes exposing the hardware to an organic compound and subsequently exposing the hardware to an agent configured to form polar bonds with the organic compound.

Abstract: Various apparatus and methods are provided for handling and transporting pairs of disks. A transfer tool engages a pair of disks in gap merge orientation along the outer perimeter edge of the disks and maintains the orientation while transferring the pair of disks to a second location where the disks are transferred to other equipment or subjected to processing. Various disks carriers are also provided for handling and transporting multiple pairs of disks in gap merge orientation.

Abstract: An apparatus for transferring and securing a substrate is shown. A pressure source is provided that is adapted to provide positive and negative pressure. A vacuum chuck is provided having a top side with a plurality of vacuum chuck portals formed therein. Each vacuum chuck portal is in fluid communication with the pressure source. The substrate is secured to the top side of the vacuum chuck when the pressure source provides negative pressure to the vacuum chuck portals. An intermediate member that selectively cooperates with the vacuum chuck to support and transfer the substrate between the vacuum chuck and the intermediate member is provided. The intermediate member has a plurality of receiving spaces and a plurality of transfer members. The receiving spaces and transfer members are adjacent to one another in an alternating pattern, and each transfer member has a top side with a plurality of transfer member portals formed therein.

Abstract: An apparatus for dispensing substances, specifically powders and liquids, into a container, is designed as a compact module containing a weighing device with a load receiver, a holder device which is attached to the load receiver and serves to receive and loosely hold the container while the substances are dispensed into the container, and a liquid-dispensing device for dispensing a liquid into the container while the latter is seated in the holder device. The apparatus includes a clamping device for firmly gripping and immobilizing the container, so that a capping device that is not part of the apparatus can put a cap on the container or remove the cap from the container while the latter is seated in the holder device.

Abstract: In order to ensure reliable feeding in particular of a clinch nut (M) from a ready position (16) into a processing position, the processing tool designed as a press-in tool (2) has a guide element (14), through which the clinch nut (M) is pressed into the processing position by means of a punch (8) against an elastic holding force exerted by the guide element (14). The guide element (14) is designed in particular as a slotted bush and is arranged as an insert in a hold-down (12).

Abstract: Regarding predetermined positioning criteria (M1, M2), ((G1, G2), (N1, or N2), (K1, K2)), there is provided image processing means (40B) for obtaining by image processing, measured values (CD1, CD2) ((GD1, GD2), (ND1, or ND2), (KD1, KD2)) and reference values (CR1, CR2) ((GR1, GR2), (NR1, or NR2), (KR1, KR2)), and for moving a work (W) in a manner that the measured values (CD1, CD2) ((GD1, GD2), (ND1, or ND2), (KD1, KD2)) and the reference values (CR1, CR2) ((GR1, GR2), (NR1, or NR2), (KR1, KR2)) coincide with each other, thereby positioning the work (W) at a predetermined position.

Abstract: The present invention provides a plate material conveying device including a compact traveling member to enable an increase in plate material conveyance speed and a reduction in time required for acceleration and deceleration and to allow small plate materials to be more efficiently conveyed, the plate material conveying device further enabling one of a gripper and a suction type plate material holder to be selected for conveyance of a plate material. Traveling members 13, 14 are provided on respective tracks 11, 12 so as to travel freely along the respective tracks 11, 12. Each of the traveling members 13, 14 has a plate material holder support frame 21, 22 supporting suction type plate material holders 23A, 23B, 23C.

Abstract: One of reverse passing parts provided in a substrate passing part comprises a first holding mechanism and a second holding mechanism. The first holding mechanism and the second holding mechanism are arranged in vertically symmetry with respect to a rotary central axis and rotate 180 degrees about the rotary central axis, to replace each other in position. A transport robot on the loading side passes a substrate to a third holding mechanism or a fourth holding mechanism at a first vertical position. The substrate reversed in the reverse passing part is passed to a transport robot on the unloading side from the third holding mechanism or the fourth holding mechanism at a second vertical position. Before a reverse process on the preceding substrate is finished, the transport robot on the loading side can start the transfer of the following substrate.

Abstract: A wafer lift-out apparatus for lifting out, from a container in which a plurality of semiconductor wafers and a spacer are housed in such a manner that the semiconductor wafers and the spacer are alternately stacked and that a part of the spacer is exposed from between the semiconductor wafers, one of the semiconductor wafers includes: a wafer suction mechanism for sucking the semiconductor wafers; a carrying mechanism for carrying the wafer suction mechanism; and a spacer retaining mechanism for retaining the part of the spacer. The spacer retaining mechanism retains the part of the spacer when the carrying mechanism lifts up the wafer suction mechanism while the wafer suction mechanism sucks one of the semiconductor wafers housed in the container.

Abstract: An alignment device to align a plate for electronic circuits comprises transport members able to transport the plate along a transport axis, at least from an entrance position to an alignment position defining an alignment plane. The device also comprises mobile members provided with: first movement members able to move the mobile members in a first direction directed along a first axis substantially perpendicular to the alignment plane so as to associate the mobile members with the plate; second movement members able to rotate the plate, associated with the mobile members, around the first axis; and at least third movement members able to move the plate, associated with the mobile members, in a second direction, directed along a second axis substantially transverse to the first axis and substantially co-planar with the transport axis.

Abstract: According to the invention, a transport box ‘1) may be connected to an interface (2) and contain a basket ‘3) in which the substrates (4) may be placed. The basket (3) consists of a set of plates (3a-3f), stacked one after the other and individually replaceable. The basket (3) is entirely shifted to the interior of the interface (2), then the means of movement isolating a selected plate by moving the adjacent places, allowing the robot (5) to come and extract the selected substrate. When in a transport position, the plates (3a-3f) are in contact with each other, therefore reducing the amount of space taken up by the substrates (4).

Abstract: An insert for a carrier board of a test handler is disclosed. The insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch apparatus is installed to the insert pocket, so that the damaged latch apparatus can be easily replaced. The insert has a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes in the lower direction. Thus, the insert can load semiconductor devices regardless of the sizes of the semiconductor devices.

Abstract: A holding apparatus for holding a semiconductor wafer comprises a pneumatic cylinder, a plunger movably connected to the pneumatic cylinder, an inlet pipe connected to the pneumatic cylinder, and a relief valve connected to the inlet pipe. Clean dry air is pumped into the pneumatic cylinder through the inlet pipe to impel the plunger in a first direction to contact the wafer. A part of the air in the inlet pipe is discharged through the relief valve to regulate air pressure to the pneumatic cylinder.

Abstract: A system and a method of installing an instrument panel in a motor vehicle. The system includes a decking arm assembly having a support structure for supporting the instrument panel, an actuator, a cradle disposed proximate the actuator, and a sensor assembly. The cradle engages a steering shaft assembly of the instrument panel when the actuator is in the advanced position and the sensor assembly does not indicate that the instrument panel is in a desired installation position.

Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.

Abstract: Embodiments of the present invention relate to a solar simulator module of a solar cell production line. In one embodiment the solar simulator receives a solar cell module in a horizontal position and reorients the module into a vertical position. A light source is oriented to emit a flash of light in a substantially horizontal orientation toward the vertically oriented solar cell module. In one embodiment, an automated labeling device affixes a label including the electrical characteristics measured onto a back surface of the solar cell module. In one embodiment, a plurality of solar cell modules are received and tested simultaneously.

Abstract: A device for stabilizing an elongated steel sheet when continuously transporting the steel sheet in a transport direction along a predetermined transport path. The device includes at least a first pair, a second pair and a third pair of electromagnets with at least one electromagnet on each side of the steel sheet. The electromagnets are adapted to stabilize the steel sheet with respect to the predetermined transport path. The first and second electromagnets are elongated in a direction essentially perpendicular to the transport direction. The first and second electromagnets are substantially arranged on each side of a longitudinal center line for the steel sheet. The center line is essentially parallel to the transport direction. The third electromagnet is arranged adjacent to the center line.

Abstract: A carrier blade for transferring a semiconductor wafers into and out of a deposition chamber may include transition surfaces sloping downward from ledge surfaces. The transition surfaces slope from the corresponding ledges at angles that are greater than about 90 degrees so that the edges between the ledge surfaces and the transition surfaces are not sharp. The carrier blade may include bevels extending from the ledge surface(s) to upper lateral edges of the carrier blade.

Abstract: A test handler is disclosed in the present invention. The test handler may include a test tray on which a plurality of inserts are arrayed for loading at least one semiconductor device, at least one opening unit for simultaneously opening one part of the plurality of inserts which are arrayed on one part of the test tray, and a test tray transfer apparatus for allowing the opening unit to simultaneously open other parts of the plurality of inserts which are arrayed on another part of the test tray as the test tray is transferred. Therefore, although semiconductor devices to be tested change their sizes, the replaced parts of the test handler are reduced in number, thereby reducing manufacturing cost and replacement work time. The inventive test handler reduces semiconductor devices loading time, reduces jamming, increases teaching efficiency and improves space utilization efficiency. Furthermore, the test handler can be applied to various types of testers.

Abstract: A pick and place apparatus is provided for picking up an electronic component from one location and placing it at another location, which comprises a pick up tool having an opening at which electronic components are configured to be held by vacuum suction. An air channel extends through the pick up tool from the opening and is connectable for fluid communication with an air supply source which is operative to blow a quantity of air out from the opening towards the electronic component for removing any debris located thereon. The air channel is also connectable for fluid communication with a vacuum suction source which is operative to generate vacuum suction force at the opening for picking up the electronic component by vacuum suction.

Abstract: A disk drive handling apparatus includes a manifold, one or more vacuum suction elements in fluid communication with the manifold, and one or more tips. Each tip is coupled to an end of a corresponding one of the vacuum suction elements. Each tip is compliant in one or more axes of motion.

Abstract: A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.