Abstract: A wafer transfer system is operable with a front or side loading wafer carrier to move one or more horizontally oriented wafers out of the carrier and to rotate the wafers to a vertical orientation in which the wafers are accessible for further processing. The transfer system provides a wafer extractor which employs a plurality of paired fingers of a size and configuration to fit between the spaced, stacked wafers in the carrier for lifting the wafers off the shoulders of the carrier. The fingers are then movable generally horizontally to remove the wafers from the carrier into two angled combs having ledges for receiving wafers. The fingers and combs are rotated to a vertical orientation in which the wafers are supported along their edges by the combs. The fingers are shifted horizontally a small amount relative to the combs to disengage from the wafers, either by a translation following the rotation or by rotating the fingers and combs about different axes.

Abstract: An orientation apparatus for aligning indexing notches of disk-shaped members, such as semiconductor wafers, includes a flexible alignment rod that imparts rotation of the disk-shaped members until the indexing notches are registered with the alignment rod. The alignment rod is captured by a displaceable comb member that exposes regions of the rod between adjacent teeth. The teeth ensure that the disk-shaped members are properly aligned. The comb member has a raised operation position in which the disk-shaped members are spaced apart from rollers and has a lowered retracted position in which the weight of the disk-shaped members is transferred to the rollers. A camming mechanism may be used to raise and lower the comb member and alignment rod between the two positions.

Abstract: A loader for a machine for printing objects presented in a stack includes a lifting device which lifts a stack of objects to be printed stepwise as objects are taken from the stack and a reciprocating transfer device having at least one take-up unit taking an object from the stack on each cycle to convey it to the printing machine. The loader has a retaining clamp with two branches moveable between an away position and a close position in which they can hold a specific number of objects. Level compensating arrangements operate between the retaining clamp and the associated take-up unit. The printing machine can be a machine for printing compact discs, for example.

Abstract: A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto trays for processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

Abstract: A waiting space is provided below a processing vessel for processing objects to be processed. An objects to be processed mount which is movable up and down into the processing vessel is disposed in the waiting space for mounting objects to be processed. There is provided a natural oxide film generation suppressing gas supply system which supplies a natural oxide film generation suppressing gas for suppressing generation of natural oxide films on the surfaces of the objects to be processed, and a dried gas with a low dew point is supplied as a natural oxide film generation suppressing gas by the natural oxide film generation suppressing gas supply system. The processing apparatus can suppress generation of natural oxide films inexpensively and efficiently.

Abstract: According to this invention, there is provided a notch position aligning mechanism and a process for using the mechanism including a base which can be vertically movably inserted into a cassette through a lower opening of the cassette for storing a plurality of targets to be aligned having notches formed in edge portions of the targets wherein can be fitted, a rotating/supporting mechanism, including a first rotary member which is arranged on the base, and has a plurality of fitting grooves in which the notches of the targets can be fitted, a second rotary member which can be rotated and is arranged on the base, and a drive unit for rotating at least one of the first and second rotary members, the rotating/supporting mechanism supporting and rotating the targets using the first and second rotary members while the targets are spaced apart from the cassette, and a support member, arranged on the base, for supporting the targets having the notches fitted in the fitting grooves of the first rotary member to stop

Abstract: A transfer apparatus comprising a carrier table for arranging a plurality of the carriers arranged in a serial array so as to hold the substrates mutually parallel to each other, a plurality of push-up members being adapted to be moved below each of the carriers for pushing up the substrates supported on the carriers through a lower opening portion of each of the carriers and having an upper surface with a plurality of equidistantly spaced grooves for receiving and lifting all of the substrates supported in one carrier as a whole, devices for bringing at least one of the plurality of push-up members into proximity to a corresponding remaining push-up member to allow the at least one push-up member to face the corresponding push-up member so that their mutually adjacent, directly-facing endmost substrates held in an endmost grooves of the mutually adjacent, directly-facing push-up members have their mutual distance adjusted to a distance equal to a pitch distance of those substrates supported by the push-up me

Abstract: A wafer aligning apparatus for re-aligning a plurality of wafers at different pitches. The apparatus includes a plurality of wafer retaining plates, each of which retains a plurality of wafers, a guide device which guides the wafer retaining plates, and a transferring device which transfers the wafer retaining plates along the guide device, wherein when the plurality of wafer retaining plates are at one end of the guide device, they are spaced at a first pitch and aligned, and when the wafer retaining plates are at the other end of the guide device, they are aligned at a second pitch different from the first pitch.

Abstract: An assembly for transferring discs between disc manufacturing machinery or processes comprises a series of storage cassettes having discs stored therein. Each stored disc is retrieved from the cassette and placed into a shuttle which carries the disc while it is processed. The processed disc is retrieved from the shuttle subsequent to the disc manufacturing process and placed into a second storage cassette. The apparatus transfers the discs by gripping them between a stationary member which engages the edge of the disc and a selectably moveable member which engages the disc hole such that the disc is pinched between the two gripping members. The gripping and transferring functions are controlled by a computer.

Abstract: This invention relates to a system for handling and processing thin substrates, such as substrates for magnetic disks. The system includes a main chamber, entrance and output load locks, a buffer chamber, substrate load/unload structure, and a plurality of substrate processing stations positioned contiguous with the main vacuum chamber. The system further includes a transport for moving a plurality of cassettes carrying vertically oriented substrates into the entrance load lock, to the buffer chamber where the substrates are transferred into the main chamber, and to the output load lock where processed substrates are placed back in the cassettes. The substrates are transferred to and from the cassettes to and from the substrate load/unload structure by way of dedicated lift blades.

Abstract: A manufacturing system and method for processing semiconductor wafers through a plurality of processing stations that perform manufacturing operations on wafers includes a plurality of processing stations, each of which are capable of performing at least one processing operation on a wafer, each of the processing stations having a controlled environment for processing the wafers, and a branched tunnel joined and communicating with the controlled environment. A means is provided for maintaining a clean environment in the tunnel. Within the tunnel there are provided a plurality of guided transport vehicles adapted to travel between the process stations. A plurality of wafer carriers, each adapted to support a single wafer and be carried by the transport vehicles, are part of the system.

Abstract: A conveyor system used in semiconductor manufacturing line, etc. including guide rails which guide workpieces in one direction and a pair of magazine stackers for workpieces installed at both ends of the workpiece guide rails and has magazine guide rails, in which the workpiece guide rails and magazine guide rails are movable in a direction perpendicular to a workpiece feed direction and are connected via a connecting assembly so that the workpiece guide rails and magazine guide rails are moved together.

Abstract: Specimen carrier carousels adapted to support a plurality of specimen carriers in a radial configuration and selectively position specimen carriers at associated processing stations are disclosed. Specimen carriers mounted on the carousel are automatically tilted during rotation of the carousel to properly seat the specimens in their respective carriers and to prevent specimen movement during rotation. Specimen carrier platforms are also disclosed. A scanning assembly is provided in association with a carrier platform or at least one carrier station of a carrier carousel to monitor and verify the orientation of specimens within a carrier prior to commencement of processing operations. A subtilt assembly may be provided to correct the orientation of specimens identified as mispositioned during the scanning operation and to facilitate detection of the presence and location of specimens in a carrier.

Abstract: A treating device of the closed system structure in which semiconductor wafers are conveyed from a load lock chamber to a process tube comprises a gas feed pipe for feeding inert gas into a load lock chamber, and a gas circulating cleaning system which lets out the inert gas in the load lock chamber, removes gaseous impurity and particulate impurities in the let out gas by a gas cleaning filter, and returns the cleaned gas into the load lock chamber. Thus, ambient atmosphere of the inert gas in the load lock chamber can be maintained at high purity, a consumption amount of the inert gas can be small, which contributes to suppression of generation of particles and preclusion of chemical contamination. The treating device can have high achievement and can be economical.

Abstract: There is provided a transfer apparatus which is capable of transferring objects on a plurality of carriers at a time to a desired point. This apparatus comprises a carrier table for linearly arranging a plurality of the carriers, a plurality of push-up members for pushing up the objects supported on the carriers, drive devices for moving the push-up members towards or away from each other, and a rotary transfer arm mechanism having a pair of support arms for receiving the objects lifted on the push-up members, and transferring the objects to a desired point.

Abstract: A wafer boat rotating apparatus is disclosed, which includes a boat holding portion for holding both ends of the wafer boat, a vertical rotation drive mechanism for rotating the boat holding portion on a vertical plane, and a horizontal rotation drive mechanism for rotating the boat holding portion on a horizontal plane. A wafer holding member is disposed on the boat holding portion and adapted to keep the wafers held in the wafer boat apart from a bottom portion of the wafer boat by a small distance. Thus, compensation for the difference of coefficients of thermal expansion between the wafers and wafer boat during heat treatment can be made easily.

Abstract: A plurality of ring trays supporting loaded treatment objects are arranged in parallel at predetermined spacing in the vertical axis direction and are supported by rods at a minimum of three locations separated from the rod couplings. Cutouts are provided in each ring tray that do not extend to the ring tray center open area. Supporting teeth are provided on the arms driven by drive devices and are inserted via the cutouts. The supporting teeth straddle the ring tray and are shifted relatively on both sides of the vertical direction, and can exchange the wafers between the ring tray and the supporting teeth. By this, problems occurring with regard to various types of heat treatment of the treatment objects, such as treatment object slippage, can be prevented. In addition, a plurality of treatment objects can be exchanged at one time, thereby allowing the exchanging time to be shortened.

Abstract: A substrate detector device comprises a boat or chuck for holding substrates, a light emitting section having a plurality of light emitting elements, arranged side by side, for respectively applying light beams to the substrates, a light receiving section, facing the light emitting section and having a plurality of light receiving elements, for receiving light beams passed through the substrates, the light receiving elements arranged side by side so as not face the light emitting elements, a polarization filter provided on optical axes of the respective optical beams incident on the light receiving elements, a memory for storing, as reference data, an amount of light received by a receiving element which has been measured in advance when a light beam is applied to a substrate in a state where no other substrate is present on either side of the substrate, and controller for discriminating the presence, the number, and the state of arrangement of the substrates on the holding means based on the reference data a

Abstract: A method for joining a number of first and second wafers (11,12) having one polished surface in preparation for direct wafer bonding is provided. The method involves placing a number of first (11) and the same number of second (12) wafers into slots (16) of a retainer (14) so that each of the polished surfaces of the number of first wafers (11) is forced to contact one of the polished surfaces of the number of second wafers (12).

Abstract: The plate-shaped part (wafer) transfer machine of this invention consists of a rotatable turntable that supports the carrier; carrier pressers that are set on the turntable and are used to fix the carrier; a lifter which can move vertically with a wafer in the carrier or boat supported on it; and a guide which guides the wafer when the lifter performs vertical movement (the role of the guide is played by the wafer presser used for fixing the wafer in the carrier).

Abstract: A method of taking out and transferring a plurality of wafers from each of a plurality of wafer carriers to a wafer conveyor robot includes the steps of taking out wafer groups inside the wafer carriers from respective wafer carriers and aligning the same on a straight line with respective wafer groups being spaced apart, shifting at least one of the wafer groups so that an interval between the spaced wafer groups becomes equal to intervals among the wafers in each of wafer groups, and holding the shifted wafer groups with the wafer conveyor robot. An apparatus for practicing this method is also disclosed.

Abstract: A detector for detecting the presence, number and arrangement of semiconductor wafers arranged face to face comprising a light emitting unit having a light emitting element for shooting light beam to each of the wafer, a light receiving unit having a light receiving element for receiving the light beam which have passed through each of the wafers, and a controller for finding the state of each of the wafers while comparing data obtained from the light beams received with reference data stored to thereby determine how each of the wafers to be processed, wherein said light emitting and receiving elements are alternately positioned corresponding to spaces each defined between a pair of the wafers.