Refractory Metal Containing Patents (Class 420/484)
  • Publication number: 20150132179
    Abstract: An advantage of the invention is to provide a master alloy used in a casting of a modified copper alloy, grains of which can be refined during a melt-solidification, and also a method of casting a modified copper alloy using the same. In order to achieve the advantage, master alloy for casting a copper alloy in a form of Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn; and Cu: 40 to 80%, Zr: 0.5 to 35%, P: 0.01 to 3% and the balance of Zn are used, and thus grain-refined copper alloy casting products are obtained.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 14, 2015
    Inventor: Keiichiro OISHI
  • Publication number: 20140369883
    Abstract: To obtain a copper alloy having a tensile strength of 700 N/mm2 or more and a conductivity of 60% IACS or more, a copper alloy of the present invention comprises from 0.8 mass % to 1.8 mass % of Co, from 0.16 mass % to 0.6 mass % of Si, and the balance of Cu and unavoidable impurities, in which a mass ratio of Co to Si (Co/Si) is between 3.0 and 5.0; a size of inclusions to be precipitated in the copper alloy is 2 ?m or less; and a total volume of the inclusions having a size of between 0.05 ?m and 2 ?m in the copper alloy is 0.5 vol % or less.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 18, 2014
    Applicants: MITSUBISHI ELECTRIC CORPORATION, MITSUBISHI ELECTRIC METECS CO., LTD.
    Inventors: Takefumi ITO, Toshikazu KAWAHATA, Yumiko IWASHITA, Toshihiro KURITA, Takayuki NAGAI
  • Publication number: 20140251488
    Abstract: A hot-forged copper alloy part which has a tubular shape, in which an alloy composition contains 59.0 mass % to 84.0 mass % of Cu and 0.003 mass % to 0.3 mass % of Pb with a remainder of Zn and inevitable impurities, a content of Cu [Cu] mass % and a content of Pb [Pb] mass % have a relationship of 59?([Cu]+0.5×[Pb])?64, a shape of the forged part satisfies a formula of 0.4?(average inner diameter)/(average outer diameter)?0.92, 0.04?(average thickness)/(average outer diameter)?0.3, and 1?(tube axis direction length)/(average thickness))?10, a forging material which is to be hot-forged has a tubular shape and satisfies 0.3?(average inner diameter/average outer diameter)?0.88, 0.06?(average thickness)/(average outer diameter)?0.35, and 0.8?(tube axis direction length)/(average thickness))?12, and 0%?(degree of uneven thickness)?30%, 0?(degree of uneven thickness)?75×1/((tube axis direction length)/(average thickness))1/2 in any location in a tube axis direction.
    Type: Application
    Filed: November 2, 2012
    Publication date: September 11, 2014
    Applicant: Mitsubishi Shindoh Co., Ltd
    Inventors: Keiichiro Oishi, Takayuki Oka, Shin Oikawa
  • Publication number: 20140193655
    Abstract: Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)?0.5.
    Type: Application
    Filed: February 28, 2012
    Publication date: July 10, 2014
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventor: Ikuya Kurosaki
  • Publication number: 20130294965
    Abstract: Alloys and methods for forming alloys of copper, including red brass, and yellow brass, having sulfur and antimony.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 7, 2013
    Applicant: Sloan Valve Company
    Inventors: Mahi Sahoo, Michael Murray
  • Publication number: 20130224070
    Abstract: To provide a copper alloy sheet excellent in the balance of strength and electroconductivity and excellent in the balance of strength and bending workability also. A copper alloy contains predetermined amount of Cr, Ti, and Si so as to satisfy a mass ratio of the Cr to the Ti: 1.0?(Cr/Ti)?30, and a mass ratio of the Cr to the Si: 3.0?(Cr/Si)?30, the remainder including copper and unavoidable impurities, in which 70% or more out of total amount of Cr, Ti and Si contained in the copper alloy is precipitated, a number of piece of precipitates with 300 nm or more circle equivalent diameter observed by a SEM in a region of 25 ?m in the thickness direction from the surface of the copper alloy×40 ?m in the cross-sectional direction in a cross section in the width direction of the copper alloy is 50 pieces or less, and an average circle equivalent diameter of precipitates with less than 300 nm circle equivalent diameter observed by a TEM on the surface of the copper alloy is 15 nm or less.
    Type: Application
    Filed: January 29, 2013
    Publication date: August 29, 2013
    Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)
    Inventor: KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)
  • Patent number: 8506730
    Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: August 13, 2013
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventor: Keiichiro Oishi
  • Patent number: 8425697
    Abstract: A tin-free lead-free free-cutting magnesium brass alloy contains 56.0 to 64.0 wt % Cu, 1.05 to about 2.1 wt % Mg, 0.21 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which contain at least two elements selected from Al, Si, Sb, rare earth elements, Ti and B and the balance being Zn with unavoidable impurities, accordingly a cutting percentage of the alloy is at least 80%. The process for producing such alloy is also proposed. The invented alloy is excellent in cuttability, castability, hot and cold workability, corrosion resistance, mechanical properties and weldability and particularly applicable in spare parts, forging and casting which need cutting and grinding process. The cost of necessary metal materials of the invented alloy is lower than lead-free free-cutting bismuth and antimony brass alloy and is equivalent to lead-contained brass alloy.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: April 23, 2013
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
  • Patent number: 8273193
    Abstract: The present invention supplies a lead-free, bismuth-free free-cutting silicon brass alloy with high zinc which preferably comprises 35.0 to 42.0 wt % Zn, 0.1 to 1.5 wt % Si, 0.03 to 0.3 wt % Al, 0.01 to 0.36 wt % P, 0.01 to 0.1 wt % Ti, 0.001 to 0.05 wt % rare earth metals selected from the group consisting of La and Ce, 0.05 to 0.5 wt % Sn, and/or 0.05 to 0.2 wt % Ni, and the balance being Cu and unavoidable impurities. In yet another embodiment, the alloy may be boron-free. The invented alloy is excellent in castability, weldability, cuttability, electroplating properties, corrosion resistance, mechanical properties. The alloy is especially applicable in castings which need cutting and welding under low pressure die casting, such as castings for faucet bodies in the water supply system. The alloy is also suitable for use in components which are produced from casting ingots by die forging.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: September 25, 2012
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chankai Xu, Zhenqing Hu, Siqi Zhang
  • Publication number: 20100297464
    Abstract: A melt-solidified substance includes melt-solidified portions formed by welding, build-up spray welding, metallizing or fusing. The melt-solidified portions have the alloy composition containing Zr: 0.0005 to 0.05 mass %, P: 0.01 to 0.34 mass %, Cu: the remainder and satisfying the relationship between the contents of P and Zr, [P]/[Zr]=0.3 to 20, and the mean grain size in the macrostructure after melt-solidification is 300 ?m or less. If Fe and/or Ni are contained in the melt-solidified portion as inevitable impurities, the content of Fe or Ni is restricted to be 0.3 mass % or less when either Fe or Ni is contained, and the total content of Fe and Ni is restricted to be 0.4 mass % or less when both Fe and Ni are contained.
    Type: Application
    Filed: September 30, 2005
    Publication date: November 25, 2010
    Applicant: SANBO SHINDO KOGYO KABUSHIKI KAISHA
    Inventor: Keiichiro Oishi
  • Patent number: 7736448
    Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 15, 2010
    Assignee: Institute of Metal Research Chinese Academy of Sciences
    Inventors: Lei Lu, Xiao Si, Yongfeng Shen, Ke Lu
  • Publication number: 20100008817
    Abstract: A seamless pipe copper alloy includes Zr and at least one of Al, Sn, and Zn, with the balance being Cu and unavoidable impurities, the Al content, the Sn content, the Zn content, and the Zr content of the copper alloy satisfying the expressions 0.05?A+B+C, 0.01?D?0.5, and 0.25?A+B+C+D?0.8 (wherein A represents the Al content (mass %), B represents the Sn content (mass %), C represents the Zn content (mass %), and D represents the Zr content (mass %)). The seamless pipe copper alloy exhibits excellent workability, high strength, and high thermal conductivity. The seamless pipe copper alloy also shows only a small decrease in strength due to brazing.
    Type: Application
    Filed: October 2, 2007
    Publication date: January 14, 2010
    Inventor: Tetsuya Ando
  • Patent number: 7628872
    Abstract: A lead-free free-cutting copper-antimony alloy comprises in percentage by weight: 55 to 65% Cu, 0.3 to 2.0% Sb, 0.2 to 1.0% Mn, at least two elements selected from the group of Ti, Ni, B, Fe, Se, Mg, Si, Sn, P and rare-earth metal in amount of 0.1-1.0%, as well as balance Zn and unavoidable impurities. The brass alloys according to the present invention possess superior cutting property, weldability, corrosion resistance, dezincification resistance and high-temperature-oxidation resistance, and are suitable for use in drinking-water installations, domestic appliances, toy for children, fastener, etc. The process for producing such alloys is also proposed.
    Type: Grant
    Filed: June 11, 2004
    Date of Patent: December 8, 2009
    Assignee: Ningbo Powerway Alloy Material Co., Ltd.
    Inventors: Ming Zhang, Siqi Zhang, Jihua Cai, Haorong Lou, Xiao Xie
  • Publication number: 20090280026
    Abstract: A Cu—Zn—Si alloy includes, in % by weight, 70 to 80% of copper, 1 to 5% of silicon, to 0.5% of boron, up to 0.2% of phosphorus and/or up to 0.2% of arsenic, a remainder of zinc, plus inevitable impurities. Products using the alloy and processes for producing the alloy are also provided. The alloy is distinguished by an improved resistance to oxidation and by uniform mechanical properties.
    Type: Application
    Filed: June 3, 2009
    Publication date: November 12, 2009
    Applicant: DIEHL METALL STIFTUNG & CO. KG
    Inventors: HEINZ STROBL, KLAUS SCHWARM, HERMANN MAYER, NORBERT GAAG, ULRICH REXER, KLAUS MARSTALLER
  • Publication number: 20090239094
    Abstract: A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less.
    Type: Application
    Filed: May 28, 2007
    Publication date: September 24, 2009
    Applicant: Nippon Mining & Metals Co., Ltd.
    Inventor: Takaaki Hatano
  • Publication number: 20090016927
    Abstract: A brass alloy as raw materials for Semi Solid Metal casting has a component composition containing Zn of 8 to 40 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing one or more kinds of Si of 2 to 5 mass %, Sn of 0.05 to 6 mass %, and Al of 0.05 to 3.5 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass %.
    Type: Application
    Filed: February 9, 2007
    Publication date: January 15, 2009
    Applicants: Mitsubishi Shindoh Co., Ltd., Mitsubishi Materials Corporation
    Inventor: Keiichiro Oishi
  • Publication number: 20080298998
    Abstract: A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities, wherein R{200} is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a {200} plane of the following diffraction intensities and is represented by R{200}=I{200}/(I{111}+I{200}+I{220}+I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 4, 2008
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiroshi KANEKO, Tatsuhiko EGUCHI, Kuniteru MIHARA, Kiyoshige HIROSE
  • Patent number: 7056396
    Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4, by weight, of lead, and the remaining percent, by weight, of zinc.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: June 6, 2006
    Assignee: Sambo Copper Alloy Co., Ltd.
    Inventor: Keiichiro Oishi
  • Patent number: 6881281
    Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 ?m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: April 19, 2005
    Assignee: Nikko Metal Manufacturing Co., Ltd.
    Inventors: Kazuki Kanmuri, Kazuhiko Fukamachi
  • Publication number: 20040208778
    Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 &mgr;m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.
    Type: Application
    Filed: January 20, 2004
    Publication date: October 21, 2004
    Inventors: Kazuki Kanmuri, Kazuhiko Fukamachi
  • Patent number: 6632300
    Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: October 14, 2003
    Assignee: Olin Corporation
    Inventors: John F. Breedis, Dennis R. Brauer, Peter W. Robinson
  • Publication number: 20030091461
    Abstract: An Ni-free white copper alloy of formula CuaZnbTic or CuaZnbTicXd wherein X is at least one element selected from the group consisting of Al, Sn, Ag and Mn, b, c and d are, in mass %, 0.5≦b≦30, 1≦c≦7 and 0.1≦d≦4, and a is the balance, with unavoidable elements, and also a producing method therefor, comprising: preparing a material alloy for the above white copper alloy; heating the alloy to 700 to 885° C.; and cooling the alloy. The Ni-free white copper alloy has a strength and excellent hardness comparable to those of nickel silver, as well as excellent workability, corrosion resistance and whiteness in addition to ductility, and is free from an Ni allergy problem because of containing no nickel, and moreover tends not to cause needle detectors to malfunction.
    Type: Application
    Filed: October 24, 2002
    Publication date: May 15, 2003
    Applicant: YKK CORPORATION
    Inventors: Yasuharu Yoshimura, Kazuhiko kita, Takuya Koizumi
  • Patent number: 6093499
    Abstract: Copper alloy foils are provided having far greater strength and heat resistance than conventional copper foils, and having better productivity, are characterized by a composition comprising, all by weight, from 0.01 to 0.4% Cr, from 0.01 to 0.25% Zr, from 0.02 to 2.0% Zn; and when necessary from 0.05 to 1.8% Fe and from 0.05 to 0.8% Ti; and when further necessary one or more elements selected from the group consisting of Ni, Sn, In, Mn, P, Mg, Al, B, As, Cd, Co, Te, Ag, and Hf in a total amount of from 0.005 to 1.5%; the balance being copper and unavoidable impurities. Inclusions in the copper foil not larger than 10 .mu.m in size, and the inclusions between 0.5 and 10 .mu.m in size number less than 100 pieces/mm.sup.2.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: July 25, 2000
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventor: Yasuo Tomioka
  • Patent number: 5800914
    Abstract: A thermal image transfer recording medium includes a heat resistant substrate; an intermediate layer with a voidage of 20% or less, which includes a granular thermofusible material and a thermoplastic resin, formed on the heat resistant substrate; and a thermal image transfer ink layer containing a coloring agent, formed on the intermediate layer.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: September 1, 1998
    Assignee: Ricoh Company, Ltd.
    Inventors: Keiichi Shiokawa, Yasumitsu Kuga, Naoshi Yamamoto
  • Patent number: 5766377
    Abstract: A drinking water installation is made up of a source of drinking water and equipment for delivering the drinking water. In the equipment for delivering drinking water, a copper-zinc alloy which does not contain lead or bismuth is used. This alloy has a copper to zinc ratio of from 1.3 to 2.0 and contains at least one additive for improving the properties of the alloy. This alloy possesses superior machinability properties and yet does not pose the potential toxic hazard that lead- or bismuth-containing alloys do.
    Type: Grant
    Filed: September 16, 1996
    Date of Patent: June 16, 1998
    Assignee: Wieland-Werke AG
    Inventors: Gert Mueller, Harald Siegele, Michael Bohsmann
  • Patent number: 5759563
    Abstract: Improved biocompatible liquid delivery compositions, which are useful for the formation of sustained release delivery systems for active agents, are provided. The compositions include liquid formulations of a biocompatible polymer or prepolymer in combination with a controlled release component. The controlled release component includes an active agent. These compositions may be introduced into the body of a subject in liquid form which then solidify or cure in situ to form a controlled release implant or a film dressing. The liquid delivery compositions may also be employed ex situ to produce a controlled release implant. Methods of forming a controlled release implant and employing the liquid formulations in the treatment of a subject are also provided.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 2, 1998
    Assignee: Atrix Laboratories, Inc.
    Inventors: Gerald L. Yewey, Nancy L. Krinick, Richard L. Dunn, Michael L. Radomsky, Gerbrand Brouwer, Arthur J. Tipton
  • Patent number: 5288683
    Abstract: A wear-resistant copper alloy which consists essentially of 56 to 65 wt. % of Cu, 28 to 32 wt. % of Zn, 3.5 to 5.5 wt. % of Al, 0.5 to 2.0 wt. % of Fe, 1.0 to 3.0 wt. % of Ni, 0.1 to 1.0 wt. % of Nb, and 0.4 to 1.5 wt. % of Ti, provided that Ti+Nb is equal to or greater than 0.7 wt. %. The alloy includes two discrete intermetallic compounds comprising Ti-Ni-Fe-Al and Nb-Fe-Al uniformly dispersed in a microstructure preferably including at least 50 volume % beta phase and limited alpha and gamma phases. A synchronizer ring made of the copper alloy is also provided.
    Type: Grant
    Filed: November 3, 1992
    Date of Patent: February 22, 1994
    Assignee: Chuetsu Metal Works Co., Ltd.
    Inventors: Kunio Nakashima, Masao Hosoda, Kazuyuki Inagaki
  • Patent number: 4965045
    Abstract: A new copper-based metallic alloy is described containing principally Zn and Al in quantities such as to render it capable, after solution heat treatment at high temperature, and tempering, of assuming a crystalline structure of Beta type; its principal characteristics lies in the fact that it simultaneously contains, as grain size reducing additives, Nb and Ti in an overall quantity lying between 0.01 and 0.2% by weight.
    Type: Grant
    Filed: December 21, 1988
    Date of Patent: October 23, 1990
    Assignee: Europe Metalli - LMI S.p.A.
    Inventors: Andrea Giarda, Sergio Ceresara
  • Patent number: 4886641
    Abstract: A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., the working direction and the direction perpendicular to it. A very thin-walled member can be produced from this spring material since its anisotropy in characteristics is small and will not increase even if the amount of working is increased.The copper base alloy of which this spring material is made consists essentially of 2.2-5% Ti, 0.1-0.8% Co, 0.02-0.5% Cr, 0-0.6% of Ni and/or Fe, 0-0.5% of at least one of Ca, Mg, Zn, Cd, Li, Zr, Si, Mn, Sn and Al, and the balance being Cu and incidental impurities.
    Type: Grant
    Filed: April 20, 1988
    Date of Patent: December 12, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Takuro Iwamura, Masao Kobayashi
  • Patent number: 4612167
    Abstract: A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight % of at least one of Fe and Co and 0.005-0.5 weight % of at least one element selected from the group consisting of Al, Si, Mn and Mg. The copper-base alloy has good electric conductivity and high mechanical strength. It further has good solderability and solder durability.
    Type: Grant
    Filed: March 1, 1985
    Date of Patent: September 16, 1986
    Assignee: Hitachi Metals, Ltd.
    Inventors: Rikizo Watanabe, Daizi Sakamoto
  • Patent number: 4559200
    Abstract: A copper alloy excellent in general properties such as heat resistance, electric and heat conductivity and mechanical strength and suitable for use as materials for lead frames of electronic parts, heat exchanger fins, or the like can be obtained by optimizing the Fe and Ti contents and proportions of a Cu-Fe-Ti ternary alloy and adding thereto a suitable amount of one or more members selected from the group consisting of Mg, Sb, V Misch metal, Zr, In, Zn, Sn, Ni, Al, and P.
    Type: Grant
    Filed: August 7, 1984
    Date of Patent: December 17, 1985
    Assignee: Mitsui Mining and Smelting Company, Ltd.
    Inventors: Syuichi Yamasaki, Hiroshi Yamaguchi, Yousuke Taniguchi