Abstract: This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I{420}/I0{420}>1.0??(1), where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I0{420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.

Abstract: A Cu—Ni—Si based copper alloy, comprising 1.2 to 4.5% by mass of Ni, 0.25 to 1.0% by mass of Si and the the balance Cu with inevitable impurities, wherein when an X-ray diffraction intensity of a {111} plane of a rolled surface and that of a {111} plane of a pure copper powder standard specimen is represented by I{111}, I0{111} respectively, I{111}/I0{111} is 0.15 or more, wherein when an X-ray diffraction intensity of a {200} plane of the rolled surface and that of a plane {200} of the pure copper powder standard specimen is represented by I{200}, I0{200} respectively, I{200}/I0{200} is 0.5 or less, when an X-ray diffraction intensity of a {220} plane and a plane {311} of the rolled surface is represented by I{220}, I{311} respectively, I{111}/(I{111}+I{200}+I{220}+I{311}) is 0.2 or more, a bending coefficient is 130 GPa or more, a yield strength YS satisfies: YS=>?22×(Ni mass %)2+215×(Ni mass %)+422, and the electrical conductivity is 30% IACS or more both in a direction transverse to rolling direction.

Abstract: A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1}<3 4 6> is within 30° is 60 % or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.

Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation ? of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.

Abstract: Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)?0.5.

Abstract: A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} <1 0 0> is 5 to 50%, according to a crystal orientation analysis in EBSD measurement.

Abstract: The present invention relates to a high-strength copper alloy forging material having properties of high hardness, high strength and high thermal conductivity. The high-strength copper alloy forging material contains, in mass %, 3 to 7.2% of Ni, 0.7 to 1.8% of Si, 0.02 to 0.35% of Zr and 0.002 to 0.05% of P, and further contains 1.5% or less of one or two or more of Cr, Mn and Zn in total, as needed, whereby appropriate amounts of Zr and P act to cause cracks to be less likely to occur in the material during working or heat treatment. After the working and the heat treatment, the forging material of the invention can have properties of high hardness, high strength and high thermal conductivity, and can be suitably used for resin injection mold materials, aircraft components and the like.

Abstract: A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes copper, nickel, and an active metal element. The braze alloy includes nickel in an amount less than about 30 weight percent, and the active metal element in an amount less than about 10 weight percent. An electrochemical cell using the braze alloy for sealing a ceramic component to a metal component in the cell is also provided.

Abstract: A 3N copper wire with trace additions for bonding in microelectronics contains 3N copper and one or more corrosion resistance addition materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance addition materials is between about 90 wt. ppm and about 980 wt. ppm.

Abstract: A Cu—Ni—Mo alloy thin film, including Ni as a solution element and Mo as a diffusion barrier element. Ni and Mo are co-doped with Cu. The enthalpy of mixing between Mo and Cu is +19 kJ/mol, and the enthalpy of mixing between Mo and Ni is ?7 kJ/mol. The atomic fraction of Mo/Ni is within the range of 0.06-0.20 or the weight faction of Mo/Ni within the range of 0.10-0.33. The total amount of Ni and Mo additions is within the range of 0.14-1.02 at. % or wt. %. A method for manufacturing the alloy thin film is also provided.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.

Abstract: The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.

Abstract: A copper alloy wrought material, containing 1.5 to 7.0 mass % of Ni, 0.3 to 2.3 mass % of Si, 0.02 to 1.0 mass % of S, and optionally at least one selected from the group consisting of Sn, Mn, Co, Zr, Ti, Fe, Cr, Al, P, and Zn in a total amount of 0.05 to 2.0 mass %, with the balance being Cu and unavoidable impurities, wherein sulfide particles, which contribute to machinability, are dispersed therein, in which an average diameter of the sulfide particles is 0.1 to 10 ?m, and in which an area ratio of the sulfide particles is 0.1 to 10%, and wherein the copper alloy wrought material has a tensile strength of 500 MPa or greater and an electrical conductivity of 25% IACS or higher.

Abstract: A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 ?m; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.

Abstract: The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5?Ni/Co?about 2, and wherein Pc is equal to or less than about 15/1000 ?m2, or Pc/P is equal to or less than about 0.

Abstract: A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 ?m to 2 ?m, the intermetallic compound B has a compound diameter of 0.05 ?m to less than 0.3 ?m, and the intermetallic compound C has a compound diameter of more than 0.001 ?m to less than 0.05 ?m.

Abstract: A copper alloy sheet material which has a tensile strength of 730-820 MPa and contains at least nickel (Ni) and silicon (Si), with the remainder being copper (Cu) and inevitable impurities. When the sheet material has a shape capable of 180° tight bending and the width and thickness of this sheet material are expressed by W (unit: mm) and T (unit: mm) respectively, then the product of W and T is 0.16 or less. Preferably, the sheet material is constituted of an alloy containing nickel at 1.8-3.3 mass %, silicon at 0.4 mass %, and chromium (Cr) at 0.01-0.5 mass %, with the remainder being copper and inevitable impurities. The sheet material may further contain one or more of: at least one member selected among tin (Sn), magnesium (Mg), silver (Ag), manganese (Mn), titanium (Ti), iron (Fe), and phosphorus (P) in a total amount of 0.01-1 mass %; zinc (Zn) at 0.01-10 mass %, cobalt (Co) at and 0.01-1.5 mass %.

Abstract: The problem to be solved by the present invention is to provide a significant improvement in the properties in Cu—Ni—Co—Si alloy by adding Cr, i.e., to provide Corson alloys having high strength and high electrical conductivity. There is provided a copper alloy for electronic materials comprising 1.0 to 4.5 mass % of Ni, 0.50 to 1.2 mass % of Si, 0.1 to 2.5 mass % of Co, 0.003 to 0.3 mass % of Cr, with the balance being Cu and unavoidable impurities, the mass concentration ratio of the total mass of Ni and Co to Si ([Ni+Co]/Si ratio) satisfies the formula: 4?[Ni+Co]/Si?5, and with regard to Cr—Si compound whose size is 0.1 to 5 ?m dispersed in the material, atomic concentration ratio of Cr to Si in the dispersed particle is 1-5, and area dispersion density thereof is more than 1×104/mm2, and not more than 1×106/mm2.

Abstract: While securing the building-up ability and crack resistance, to provide a build-up wear-resistant copper alloy and valve seat. The build-up wear-resistant copper alloy and valve seat are characterized by having a composition of nickel: 5.0-24.5%, iron: 3.0-20.0%, silicon: 0.5-5.0%, boron: 0.05-0.5%, chromium: 0.3-5.0%, one member or two members or more selected from the group consisting of molybdenum, tungsten and vanadium: 3.0-20.0%, by weight %, and the balance being copper and inevitable impurities.

Abstract: A copper alloy material, containing Ni 1.8 to 5.0 mass % and Si 0.3 to 1.7 mass %, at a ratio of contents of Ni and Si, Ni/Si, of 3.0 to 6.0, and having a content of S of less than 0.005 mass %, with the balance of being Cu and inevitable impurities, wherein the copper alloy material satisfies formulae (1) to (4): 130×C+300?TS?130×C+650??(1) 0.001?d?0.020??(2) W?150??(3) 10?L?800??(4) wherein TS represents a tensile strength (MPa) of the copper alloy material in a direction parallel to rolling; C represents the content (mass %) of Ni in the copper alloy material; d represents an average grain diameter (mm) of the copper alloy material; W represents a width (nm) of a precipitate free zone; and L represents a particle diameter (nm) of a compound on a grain boundary.

Abstract: This is to provide a build-up wear-resistant copper-based alloy, which is advantageous for enhancing the cracking resistance and machinability, which is appropriate for cases of building up to form built-up layers especially, and which is equipped with the wear resistance, cracking resistance and machinability combinedly in a well balanced manner. A build-up wear-resistant copper-based alloy is characterized in that it has a composition, which includes nickel: 5.0-20.0%; silicon: 0.5-5.0%; manganese: 3.0-30.0%; and an element, which combines with manganese to form a Laves phase and additionally to form silicide: 3.0-30.0%; by weight %, and inevitable impurities; and additionally the balance being copper. The element can be one member or two or more members of titanium, hafnium, zirconium, vanadium, niobium and tantalum.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: A copper base alloy for electronic parts containing 2.0 to 4.0 mass % of Ti and 0.05 to 0.50 mass % of one or more of Fe, Co, Ni, Si, Cr, V, Nb, Zr, B and P, wherein the content of other impurity elements is 0.010 mass % or less in total, and the content of each of C and O is 0.010 mass % or less. This copper base alloy can be used without heat treatment after its press working into a part of a connector or the like; or can be also used in a state in which the alloy is subjected to a specific heat treatment so as to be improved in spring characteristics after its press working.

Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.

Abstract: A beryllium copper alloy is provided, having a thickness “t” in a range from 0.05 mm to 0.5 mm and having an alloy composition consisting by weight (or mass %), of Cu100?(a+b)NiaBeb, wherein 1.0?a?2.0, 0.15?b?0.35, and 5.5 ?a/b?6.5. The beryllium copper alloy also exhibits a 0.2% proof stress equal to or above 650 MPa, an electric conductivity equal to or above 70% IACS, and a bending formability defined by a ratio of R/t=0, wherein “R” is a maximum bend radius before cracking at a bent portion when the beryllium copper alloy is bent into a V shape at a right angle.

Abstract: A copper base alloy having an improved combination of yield strength and electrical conductivity consisting essentially of between about 1.0 and about 6.0 weight percent Ni, up to about 3.0 weight percent Co, between about 0.5 and about 2.0 weight percent Si, between about 0.01 and about 0.5 weight percent Mg, up to about 1.0 weight percent Cr, up to about 1.0 weight percent Sn, and up to about 1.0 weight percent Mn, the balance being copper and impurities, the alloy processed to have a yield strength of at least about 137 ksi, and an electrical conductivity of at least about 25% IACS.

Abstract: The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5?Ni/Co?about 2.

Abstract: A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.

Abstract: A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities, wherein R{200} is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a {200} plane of the following diffraction intensities and is represented by R{200}=I{200}/(I{111}+I{200}+I{220}+I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.

Abstract: Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C.

Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.

Abstract: An age-hardening copper-base alloy and processing method to make a commercially useful strip product for applications requiring high yield strength and moderately high electrical conductivity, in a strip, plate, wire, foil, tube, powder or cast form. The alloys are particularly suited for use in electrical connectors and interconnections. The alloys contain Cu—Ti—X where X is selected from Ni, Fe, Sn, P, Al, Zn, Si, Pb, Be, Mn, Mg, Ag, As, Sb, Zr, B, Cr and Co. and combinations thereof. The alloys offer excellent combinations of yield strength, and electrical conductivity, with excellent stress relaxation resistance. The yield strength is at least of 105 ksi and the electrical conductivity is at least 50% IACS.

Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.

Abstract: An age-hardenable copper alloy made of 1.2 to 2.7% cobalt, which is able to be partially replaced by nickel, 0.3 to 0.7% beryllium, 0.01 to 0.5% zirconium, optionally 0.005 to 0.1% magnesium and/or iron and in some instances up to a maximum of 0.15% of at least one element from the group including niobium, tantalum, vanadium, hafnium, chromium, manganese, titanium and cerium. The remainder is copper and includes production-conditioned impurities and usual processing additives. This copper alloy is used as the material for producing mold blocks for the side dams of continuous strip-casting installations.

Abstract: A valve seat (2) is formed by build-up cladding by irradiating a laser beam on a copper alloy powder (4) provided in the rim of a port (3) formed in an engine cylinder head (1). The copper alloy powder (4) consists of copper (Cu), 6-9 wt % nickel (Ni), 1-5 wt % silicon (Si), and 1-5 wt % of one of molybdenum (Mo), tungsten (W), tantalum (Ta), niobium (Nb) and vanadium (V). Due to this composition, the valve seat (2) has few microcracks and excellent abrasion resistance.

Abstract: A copper alloy sheet comprises 0.4 to 2.5 wt % of Ni, 0.05 to 0.6 wt % of Si, 0.001 to 0.05 wt % of Mg, and the balance being Cu and inevitable impurities wherein an average grain size in the sheet is in the range of 3 to 20 &mgr;m and a size of an intermetallic compound precipitate of Ni and Si is in the range of 0.3 &mgr;m or below. If necessary, the sheet may further comprise one or more of 0.01 to 5 wt % of Zn, 0.01 to 0.3 wt % of Sn, 0.01 to 0.1 wt % of Mn, and 0.001 to 0.1 wt % of Cr. It is preferred that when an X-ray diffraction intensity from {200} plane in the surface of said sheet is taken as I{200}, an X-ray diffraction intensity from {311} plane is taken as I{311}, and an X-ray diffraction intensity from {220} plane is taken as I{220}, the following equation is satisfied [I{200}+I{311}]/I{220}≧0.

Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).

Abstract: A hardenable copper alloy, suitable as a material for manufacturing casting rolls and casting wheels that are subjected to changing temperature stresses, is disclosed. The hardenable copper alloy comprises 1.0 to 2.6% nickel, 0.1 to 0.45% beryllium, and the remainder of copper, inclusive of impurities resulting from manufacturing and the customary processing additives, and has a Brinell hardness of at least 200 and an electric conductivity of over 38 m/.OMEGA. mm.sup.2.

Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be) +(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: A slider suspension system for use in a magnetic recording disk file comprised of a laminated suspension positioned between an actuator arm and a read/write slider. The laminated suspension is comprised of a conductor layer, a dielectric layer and a support layer. The conductor layer is comprised of a high strength conductive copper alloy selected from the group consisting of Cu--Ni--Si--Mg alloy, Be--Cu--Ni alloy, and Cu--Ti alloy, wherein the conductive layer has a thickness less than or equal to eighteen microns. The dielectric layer is comprised of an electrically insulating material such as a polyimide. The support layer is comprised of a rigid material such as stainless steel.

Abstract: An abrasion resistant copper alloy suitable for the material of an overlaid layer formed at the valve seat of an engine cylinder head formed of aluminum alloy. The copper alloy consists essentially of nickel in an amount ranging from 10 to 30% by weight; silicon in an amount ranging from 0.5 to 5.0% by weight; at least one element selected from the group consisting of molybdenum, tungsten, tantalum, niobium and vanadium, in an amount ranging from 2.0 to 15.0% by weight; and balance being copper and impurities.

Abstract: Improved biocompatible liquid delivery compositions, which are useful for the formation of sustained release delivery systems for active agents, are provided. The compositions include liquid formulations of a biocompatible polymer or prepolymer in combination with a controlled release component. The controlled release component includes an active agent. These compositions may be introduced into the body of a subject in liquid form which then solidify or cure in situ to form a controlled release implant or a film dressing. The liquid delivery compositions may also be employed ex situ to produce a controlled release implant. Methods of forming a controlled release implant and employing the liquid formulations in the treatment of a subject are also provided.

Abstract: At least quaternary alloys form metallic glass upon cooling below the glass transition temperature at a rate less than 10.sup.3 K/s. Such alloys comprise titanium from 19 to 41 atomic percent, an early transition metal (ETM) from 4 to 21 atomic percent and copper plus a late transition metal (LTM) from 49 to 64 atomic percent. The ETM comprises zirconium and/or hafnium. The LTM comprises cobalt and/or nickel. The composition is further constrained such that the product of the copper plus LTM times the atomic proportion of LTM relative to the copper is from 2 to 14. The atomic percentage of ETM is less than 10 when the atomic percentage of titanium is as high as 41, and may be as large as 21 when the atomic percentage of titanium is as low as 24. Furthermore, when the total of copper and LTM are low, the amount of LTM present must be further limited. Another group of glass forming alloys has the formula(ETM.sub.1-x Ti.sub.x).sub.a Cu.sub.b (Ni.sub.1-y Co.sub.y).sub.cwherein x is from 0.1 to 0.3, y.cndot.

Abstract: There are disclosed processing methods to improve the properties of copper base alloys containing chromium and zirconium. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity. While a third method of processing results in a copper alloy having improved bend formability.

Abstract: A method of producing a molded ceramic article comprises the first step mixing powdery raw materials and a liquid additive, thereby obtaining a mixed raw material, the second step press-molding the mixed raw material obtained in the first step in a hydrostatically applied condition of pressure, thereby removing an excess of the liquid additive to obtain a preform, and the third step calcining the preform obtained in the second step to obtain a molded ceramic article. The molded ceramic article comprises, as a principal component, copper and, as essential components, Cr and Ni within composition ranges of 0.1.ltoreq.Cr<2 wt. % and 0.1.ltoreq.Ni<10 wt. % and further at least one additive component selected from the group consisting of the following composition ratios: the following composition ratios: 0<Fe<5 wt. %, 0.ltoreq.Co<5 wt. %, 0.ltoreq.Al<10 wt. % 0.ltoreq.Ti<20 wt. %, 0.ltoreq.Mo<3 wt. %, 0.ltoreq.Si<3 wt. % 0.ltoreq.V<3 wt. % 0.ltoreq.Mg<1 wt. % and 0.ltoreq.

Abstract: A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %,Ni: 10.0 to 30.0%;Si: 0.5 to 3%;Co: 2.0 to 15.0%;at least one metal selected from the group consisting of Mo, W, Nb and V:2.0 to 15.0%; andthe balance being Cu and unavoidable impurities, and having a structure in which hard phase grains containing 5 vol% or more of silicide of at least one metal selected from the group consisting of Mo, W, Nb and V are uniformly dispersed in an amount of 10 to 60 vol% in a copper-rich matrix, to which 2.0 to 15.0% of Fe and/or 1.0 to 10.0% of Cr may be further added.

Abstract: A copper-nickel-silicon-chromium alloy having the combination of high hardness and high electrical conductivity. The alloy is composed by weight of 9.5% to 11.5% nickel, in an amount sufficient to provide a nickel-silicon ratio of 3.4 to 4.5, 0.5% to 2.0% chromium, and the balance copper. The alloy is heat treated by initially heating the alloy to a solution temperature and is thereafter quenched. The quenched alloy is then aged to precipitate the metal silicides. Because of the specific ratio of nickel to silicon, the heat treated alloy develops during heat treatment a hardness in excess of 30 Rockwell C and an electrical conductivity in excess of 24% of pure copper.

Abstract: The combination of a mold body for molded plastics or the like with a materials alloy core pin which at one and the same time establishes an aperture in the molded material and substantially reduces the mold cooling time by being formed from an alloy which rapidly dissipates heat that includes copper, nickel, silicon and chromium. The percentages of each material in the alloy can vary in a range but there is a preferred percentage to total materials for rapid cooling purposes.

Abstract: A high strength Cu-Ni-Sn alloy, comprising 3-25% Ni, 3-9% Sn, 0.05-1.5% Mn, balance Cu, is heated to a temperature of 800.degree. C. or above in a single-phase region. This heat treatment is followed by quenching and subsequent heating at a temperature range of 600.degree.-770.degree. C. in a two-phase region, followed by quenching and a finishing process with a ratio of 0-60%. Thereafter, the processed alloy is subjected to a final heat-treatment at a temperature of 350.degree.-500.degree. C.

Abstract: A brazing alloy useful for brazing ceramics having the following composition, in weight percent: 0.3 to 5% titanium; 2 to 15% nickel; 0.25 to 4% silicon; balance copper.