Abstract: A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., the working direction and the direction perpendicular to it. A very thin-walled member can be produced from this spring material since its anisotropy in characteristics is small and will not increase even if the amount of working is increased.The copper base alloy of which this spring material is made consists essentially of 2.2-5% Ti, 0.1-0.8% Co, 0.02-0.5% Cr, 0-0.6% of Ni and/or Fe, 0-0.5% of at least one of Ca, Mg, Zn, Cd, Li, Zr, Si, Mn, Sn and Al, and the balance being Cu and incidental impurities.

Abstract: A mold member and a rapidly solidifying water cooled rotary roll member contain 1.3 to 5% of Ni, 0.2 to 2% of Ti, 0.1 to 1.5% of Cr, 0 to 0.5% of Zr, 0 to 1% of Al, 0 to 0.5% of at least one of Fe and Co, 0 to 1.2% of Sn, 0 to 1.2% of Mn, 0 to 1.2% of Zn, 0 to 0.2% of Mg, 0 to 0.2% of P, and 0 to 0.2% of a rare earth element, wherein the remainder of the material has a composition consisting of Cu and unavoidable impurities. Each of the members has superior thermal fatigue resistance and erosion resistance against molten metal, high-temperature strength, high-temperature hardness, high-temperature ductility and heat resistance.

Abstract: Disclosed is a corrosion-resistant copper alloy having a composition consisting essentially, by weight, of 5 to 9% of Al, 0.5 to 4% of Ni, 0.5 to 4% of Fe, 0.1 to 3% of Mn, 0.001 to 1% of Ti, at least one selected from 0.001 to 1% of Co and 0.001 to 0.1% of B, and the balance Cu and unavoidable impurities, and a substantially single-phase structure consisting essentially of .alpha.-phase. This alloy has excellent weather resistance whereby its beautiful color tone close to gold is able to last for a long time, and further has superior corrosion resistance, particularly, high resistance to corrosion by seawater, together with high strength and excellent cold formability.

Abstract: An in situ process is provided for producing a composite comprising a refractory material dispersed in a solid matrix. A molten composition comprising a matrix liquid, and at least one refractory carbide-forming component are provided, and a gas is introduced into the molten composition. A reactive component is also provided for reaction with the refractory material-forming component. The refractory material-forming component and reactive component react to form a refractory material dispersed in the matrix liquid, and the liquid composite is cooled to form a solid composite material. In one embodiment, the reactive component is a carbonaceous component in the form of a component of the gas, a solid in the gas or the molten composition, or both. The carbonaceous component is provided for reaction with a refractory carbide-forming component to yield a refractory carbide. In a preferred embodiment, the matrix liquid is molten aluminum and the refractory carbide-forming component is tantalum.

Abstract: A corrosion-resistant copper-based alloy contains 0.1-5 percent by weight of nickel; 0.01-1.5 percent by weight total of titanium and niobium; 0.2-5 percent by weight total of iron and chromium; 0.01-0.25 percent by weight total of germanium and gallium; and up to 0.01 percent by weight each of the trace elements phosphorus, silicon and manganese. The alloying elements passivate and cathodically protect the copper while the trace elements function as stabilizers. The alloy may be used for the facades of buildings, for roofs, for the gutters of buildings and for applications involving flowing corrosive media.

Abstract: A highly corrosion-resistant amorphous Ni-Cu-Ti-Ta, Ni-Cu-Ti-Nb and Ni-Cu-Ti-Ta-Nb alloys in which the sum of Ti and Ta and/or Nb is 30-62.5 atomic %.

Abstract: A group of alloys exhibiting good corrosion resistance and with properties suitable for fabricating dental prostheses consist essentially of copper, nickel and tantalum. Copper and nickel comprise the major components, while tantalum is present in lesser quantities. Lithium and/or Ce, Si metal may be added in small amounts as a deoxidant. Minor amounts of elements such as aluminum, gallium, indium, silicon, titanium and cerium can be added to modify the physical properties of the alloys.

Abstract: Brazing alloys of copper-indium-titanium alloy can be used to braze ceramic to metal. Other elements such as gold, manganese, palladium, nickel, aluminum, tin singly or in combination can also be added.

Abstract: A spring material for electric and electronic parts having a high modulus of elasticity and good electrical conductivity. The material is made by melting Cu, Ni, Ti or mother alloy thereof and Cu--P as deoxidizer at a temperature between a melting point and 1,400.degree. C. to obtain a molten alloy consisting of 0.5.about.2.0% by weight of Ni, 0.1.about.1.0% by weight of Ti, less than 0.2% by weight of P and the remainder being Cu; casting the molten alloy into a metal mold to obtain an ingot; subjecting the ingot to hot (or warm) working, cold working and annealing; and finally rolling the annealed sheet above 50% and annealing it at low temperature with air cooling to obtain a formed product having a stable structure.

Abstract: A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight % of at least one of Fe and Co and 0.005-0.5 weight % of at least one element selected from the group consisting of Al, Si, Mn and Mg. The copper-base alloy has good electric conductivity and high mechanical strength. It further has good solderability and solder durability.

Abstract: A low-alloyed copper alloy suitable for use as a base material for a semiconductor includes 0.03 to 0.2% nickel by weight, 0.03 to 0.2% tin by weight; and 0.015 to 0.1% titanium by weight, the remainder being copper and common impurities.

Abstract: Reactive metal-precious metal ductile alloys containing controlled amounts of Cu and Ni and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: A copper-nickel-tin-titanium-alloy suitable for use as a base material for semiconductors includes, by weight, 0.25 to 3.0% nickel, 0.25 to 3.0% tin, and 0.12 to 1.5% titanium, the remainder being copper and common impurities. An alternative form of the inventive alloy includes, by weight, 0.25 to 3.0% nickel, 0.25 to 3.0% tin, 0.12 to 1.5% titanium, and 0.05 to 0.45% chrome, the remainder being copper and common impurities. A method for making these alloys includes the steps of homogenizing the alloy at temperatures of 850.degree. to 950.degree. C. between 1 and 24 hours, hot-rolling the alloy at temperatures of 600.degree. to 800.degree. C. in one or more passes, and cooling the alloy to room temperature with a cooling speed of between 10.degree. C. per minute and 2000.degree. C. per minute.

Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bead formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.

Abstract: Reactive metal-palladium-copper-nickel alloys are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: Reactive metal-copper alloys containing specified amounts of a third metal selected from the group consisting of silicon, tin, germanium, manganese, nickel, cobalt and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: Tensile strength and ductility of copper-base alloys having poor intermediate temperature range ductility are substantially increased by relatively small alloying additions of hafnium or zirconium.

Abstract: A precipitation hardenable alloy suitable for forming molds for continuous casting of steel and other metal containing, by weight, 0.2-2.0% nickel, 0.05-0.5% beryllium, 0.01-1.0% niobium and the balance essentially copper. The alloy is subjected to heat treatment including solution treatment and aging, so that it has improved strength, high thermal conductivity and high toughness at elevated temperatures. The alloy may contain 0.03-0.6 wt % zirconium, 0.03-0.6 wt % zirconium and 0.01-0.1 wt % magnesium, or 0.03-0.6 wt % zirconium and 0.01-0.2 wt % titanium in place of the 0.01-1.0 wt % niobium.