Abstract: A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.

Abstract: This invention provides an improved apparatus and method for encapsulating the solder ball interconnections of an integrated circuit assembly which accommodates the use of high viscosity encapsulating materials and enables flush molding to be accomplished without substantially altering the exposed surface of the integrated circuit chip. In accordance with the preferred embodiment of this invention, an integrated circuit chip assembly including an integrated circuit chip mounted on a chip carrier or directly on a circuit board in a standoff relationship by solder ball connections is provided. A mold is placed over the integrated circuit chip. The mold of one embodiment has a compliant material disposed on the molding surface of the mold cavity. The mold also has at least one inlet hole for dispensing encapsulant into the mold, at least one opening for applying a vacuum to the mold and at least one vent.

Abstract: A BGA mould assembly which can facilitate high degree of control over the clamping force on BGA substrates of varying thickness. An Independent drive is provided for each of the dual in-line cavity bars which clamp the BGA substrates. The drive mechanism is a wedge press which includes a servo motor, and a linear-conversion mechanism coupled to the servo motor to convert the rotation motion of the motor to a linear movement. An input wedge is coupled to the linear-conversion mechanism such that the input wedge moves correspondingly with the linear movement of the linear conversion mechanism. An output wedge is coupled to the cavity bar and positioned such that a horizontal movement by the input wedge causes the output wedge to move downwards. A roller cage is provided at the top and bottom of the input wedge to reduce friction.

Abstract: In encapsulating an optocomponent with a plastics material, an MT-connector compatible interface is obtained having bores for guide pins in the wall of the capsule and optical connection surfaces. These bores are obtained from mold cavity guide pins that are used for aligning the optocomponent in a mold cavity in a mold in the molding operation of the encapsulating material on top of the component. In order to achieve a good accuracy in the positioning of the component during the molding operation, the mold guide pins are as short as possible and end directly behind the component where they are supported by projections extending from each mold half. Thus, cavities are created extending straight through the capsule behind the component. The cavities allow that the guide pin bores are cleansed and that material residues are removed after the molding operation. Further, the cavities can be used for spring clamps for retaining the optocomponent capsule at an optical connector having a similar interface.

Abstract: A golf ball mold includes a pair of split mold sections which are removably mated to define a spherical cavity. The cavity surfaces are provided with a plurality of dimple-forming protrusions. Some of the dimple-forming protrusions are constructed by dimple-forming pins whose inner end has substantially the same shape as the protrusions. The dimple-forming pins are axially or radially movable so that the projection distance of the pins into the cavity is adjustable. With a single mold, golf balls having dimples of different shapes can be produced. Golf balls of quality including symmetry and flight performance can be manufactured at low cost.

Abstract: A flat plug molding device comprised of a lower die, an upper die and a fixing seat in conjunction with conductor wire in practice, within, a cavity in proper thickness is provided and recessed at the center of the lower die, several holding ribs with arc top are provided on one side and a channel formed and recessed on the other side, with two penetrating holes provided at where appropriately in the center of said cavity, the upper die is provided in counter locked type, and a cavity is provided at the recess in the center of said upper die and a channel on one side corresponding to that at the lower die; the fixing seat are erected on it several protection walls at the right angle in proper height designed in conjunction with the route of the conductor wire and the shape of a conductor blade of the conductor wire, and two penetrating holes are provided at where appropriately; both ends of the conductor wire are each connected with a conductor blade which extends downward to form a plug blade with a hole; th

Abstract: An apparatus for the production of drug-containing implants in the form of strings of beads, comprising chains of small drug-containing plastic bodies respectively arranged in series on a surgical wire or thread, has two elongate mold halves (1), which are accommodated in a mold housing (2). In the mutually facing mold parting surfaces (3) of the two mold halves (1) there are made two rows of mold cavities (4) for receiving in each case a small plastic body and a surgical wire or thread (6) joining the said bodies. The mold cavities (4) are respectively connected to a gate (14) opening out at, a mold outer surface (12 or 13). In each case, a plurality of mold cavities (4) of a row are connected to a common runner (15) which is made in an inner wan of the mold housing and into which there respectively opens out an injection opening (16) adapted such that it can be connected in a sealed manner to an injection device (1).

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using liquid mold compound. A prepackaged liquid mold compound insert 11 is placed in a rectangular receptacle 43 in a bottom mold chase 31. The receptacle 43 is coupled to a plurality of die cavities 37 by runners 39. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 31 such that the integrated circuit dies are each centered over a bottom mold die cavity 35. A top mold chase 53 is placed over the bottom mold chase 31 and the mold compound package 11. The top mold chase 53 has die cavities 57 corresponding to those in the bottom mold chase 31. The prepackaged liquid mold compound is packaged in a plastic film which has heat sealed edges 15. The mold compound is forced through the heat seals 15 during the molding process by the pressure applied by a rectangular plunger 61.

Abstract: A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.

Abstract: A mold set for encapsulating semiconductor chips on lead frame strips with a molding compound supplied in tablets, includes a pot where molding compound tablets are loaded and pressed to form a fluid molding compound (FMC), and a main runner connected to the pot, through which the FMC passes from the pot. A plurality of sub-runners are connected to the main runner and are oriented substantially radially from a center region of the main runner. Each sub-runner has a proximal end, where it joins the main runner, and a distal end. A plurality of cavities are disposed on both sides of the main runner. Each of the plurality of cavities is in flow to communication with the distal end of a respective one of the plurality of sub-runners. The present invention allows the FMC to be introduced into all cavities at nearly the same time and at nearly a constant velocity.

Abstract: A manual loader for use in bypassing an automatic pellet feeder for an automold machine used to encapsulate integrated circuit assemblies in plastic. The loader has a support mounted adjacent the mold section of the machine. The loader also has at least one pellet boat which moves relative to the support into and out of said mold section. The pellet boat includes one or more pellet pots which are adapted to receive and hold a solid pellet of material. The loader has a release mechanism which is movable between a blocking position and a release position. The release mechanism retains the pellets in the pellet pots in the blocking position and releases the pellets from the pots when manipulated to the release position for dropping the pellets into a mold of the machine's mold section.

Abstract: A high pressure mold assembly and method for holding a sheet of material such as glass while molding a gasket or other molded portion on the sheet from a thermoplastic or other moldable material such as PVC at high pressures of at least 2000 psi. The assembly and method provides an improved holding feature which reduces the percentage of broken sheets of material and yet controls the flash or overflow of the moldable material out of the mold cavity. The mold assembly includes a first mold section and a second mold section. The first mold section includes a first seal receiving surface which receives a first resilient seal while the second mold section has a second seal receiving surface which receives a second resilient seal. The seals engage and hold the sheet therebetween and accommodate variations in the sheet. Each of the seals is adapted to press and seal against the sheet for preventing the flow of the molten material along the sheet while under high pressure of between about 2,000 psi and 5,000 psi.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101.

Abstract: A spin casting apparatus, method of manufacture for producing a molded article from a polyurethane material, shown as a non-pneumatic tire, where a mold that is formed in sections or halves and has an inner cavity formed to have the shape of the article to be manufactured and is separable to release that article after manufacture. The mold is secured to a support plate of the apparatus that is journaled to turn axially imparting a centrifugal force into the mold. The support plate is connected to or is arranged to be connected to a motor assembly for turning, and includes a clamping arrangement for maintaining the mold halves together on the support plate. An annular trough is formed in the mold immediately adjacent to a mold interior cavity inner circumference to receive a polyurethane material liquid passed thereto, and to, in turn, pass that liquid through a trough annular opening or ports into the mold cavity.

Abstract: A mold for encapsulating semiconductor device packages provides improved reliability by reducing air traps in the encapsulant. The mold has an upper mold die and a lower mold die which together form a cavity where the package is encapsulated by the molding compound. Air traps are reduced by equipping the lower mold die with projections formed along edges of the cavity extending in the direction of the molding compound flow. The mold allows a reduction of the formation air traps around or at the positions where the lead frame and chip are located so that the reliability of the resulting package is improved.

Abstract: A method and apparatus for making a golf ball of selected instruction having an encapsulated core or a non-treated core and a polyurethane cover of selected composition in which equipment is employed for aligning, centering and locating the core in relationship with the molding of the cover thereon.

Abstract: An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.

Abstract: The automatic molding machine of the present invention comprises: molding dies; a press mechanism to which the molding dies are attached, the press mechanism clamping and molding a work piece which is set in the molding die; a film feeding mechanism linking with molding action of the press mechanism, the film feeding mechanism feeding release film, which is formed into a long belt form, prescribed length so as to correspond a setting position of the work piece, which is set in the molding die; and a conveying mechanism linking with the molding action of the press mechanism, the conveying mechanism feeding the work piece and resin for molding into the molding die and taking out a molded product therefrom, wherein the work piece is molded by the molding dies whose molding sections are covered with the release film.

Abstract: An improved process for molding parts such as gaskets using an injection molding machine including upper and lower mold plates which are transparent to UV light and have pattern recesses of differing sizes and spaced apart locations, a UV light source, and a low pressure injection system for delivering elastomers to the mold plates. The elastomers are cured by exposure to UV light. An optional carrier plate may be inserted between the mold plates and provides a rigid surface for attachment of the elastomer. The carrier plate selectively covers the pattern recesses located in the mold plates.

Abstract: A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to from a cavity block and a center block. Opposing surfaces of the cavity block halves include a silicone rubber layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.

Abstract: A molding machine for manufacturing a shaped article which is comprised of a polymeric material and formed in a mold cavity between first and second mold halves of a mold assembly. At least one spring-loaded ejector member is provided in the first mold half and serves to eject the shaped article therefrom. The ejector member is movable toward and away from the second mold half and operates when the two mold halves are being opened. At least one resilient member urges the ejector member toward the second mold half. The resilient member exerts a resilient force to the ejector member, which is smaller than a tightening force of the mold halves. A method for manufacturing a shaped article comprised of a polymeric material includes providing at least one ejector member in the first mold half of the molding machine such that as the mold halves are opened, the ejector member urges the insulator away from the first mold half in which the ejector member is disposed.

Abstract: A device for encapsulating a plurality of semiconductor die comprises a form having first and second halves such that as the first half contacts the second half the first and second halves have a plurality of cavities therein. The first and second halves each comprise a conduit therein for receiving a heated liquid. The device further comprises a runner block having a hole therein, a separate runner for each cavity, and a conduit therein for receiving a heated liquid. The runners have a rectangular cross section and a width to height ratio of at least 3:1. The device further comprises a mounting plate for mating with the runner block. The mounting plate comprises a concave recess and a hole in the mounting plate at the recess. The hole in the mounting plate passes through the mounting plate to align with the hole in the runner block such that an encapsulation material can be passed between the mounting plate and the runner block.

Abstract: An injection mold for golf balls includes a pair of separable mold segments (1a, 1b). The mold segments (1a, 1b) are mated at their peripheral surfaces (12) along a parting line so that their inner surfaces (2a) define a spherical cavity (2). A plurality of dimple-forming projections (11) are formed on the inner surfaces (2a). At least four tubular gates (7) are disposed in the peripheral surfaces (12) and in fluid communication with the cavity (2). The peripheral surfaces (12) are furrowed except for the areas where the gates are disposed. Dimple-forming pins (14) are received in furrows (13) so as to lie across the parting line (PL). A molten stock material is injected into the cavity (2) through the gates (7) to mold a golf ball having dimples lying across the parting line.

Abstract: An improved transfer molding apparatus has a laminated chase block with many sets, which is capable of fabricating a plurality of semiconductor packages. The apparatus includes an upper plate and a movable lower plate and a plurality of posts disposed between the upper and lower plates. A plurality of laminated chase blocks is fixed to the posts. A plurality of ejecting means are disposed at one side of the chase blocks and supply means concurrently supplies a molding compound to the plurality of chase blocks.

Abstract: A closed mold for encapsulating LED alphanumeric display devices uses opposing platens and top and bottom plates to achieve a seal about the display device. By providing the display device with a dambar, splatter on the leads is avoided.

Abstract: A molding die set includes an upper die having an upper cavity; and a lower die including a lower cavity to be arranged to face the upper cavity, and a gate which guides plasticized resin into the lower cavity and the upper cavity. The lower cavity is provided with a projection region which is projecting inwardly. The gate is arranged to be extending in the projection region.

Abstract: Real time distance and pressure data of a plunger (35) relative to a mold compound is provided by a compensation assembly (29) in a mold press (10). The compensation assembly has a sliding block assembly (30) which moves substantially in the same direction as the plungers (35). The sliding block assembly (30) has pressure control cylinders (33) which limit the pressure plungers (35) can apply. If the pressure on the plungers (35) should exceed this limit, the plungers (35) retract towards the sliding block assembly (30). A sensor (37) is coupled between the sliding block assembly (30) and the plungers (35) to measure the distance the plungers have moved towards the sliding block assembly (30). In one application, the sensor (37) is formed from a linear voltage displacement transducer (LVDT) so the mold press (10) can have real time pressure and distance data.

Abstract: A method of producing a semiconductor device by encapsulating a semiconductor element with a resin, which comprises disposing a semiconductor element with lead frames and an encapsulating resin in a state of being sandwiched between a pair of films on a molding mold having a port for setting the encapsulating resin, closing the mold, pressing the encapsulating resin between the films in a heated state by a plunger vertically moving in the pot, and injecting the molten encapsulating resin in the inside of the mold cavity from the pot portion through a runner portion to encapsulate the semiconductor element with the encapsulating resin.

Abstract: In an apparatus for molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. Using this apparatus, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.

Abstract: A method for forming a grommet element including two successive steps which are performed on an assembly of conduits, such as cables or wires. The first step consists of sealing the conduit assembly under pressure, while the second step involves molding PVC or another thermoplastic elastomer over the sealed structure to form the grommet. A mold is also provided for carrying out the method. The mold includes a stationary portion and an axially movable portion.

Abstract: A passenger seat comprising: a frame element, vehicle anchorage means connected to the frame element, a seat body comprising a resilient material fixed with respect to the frame element and trim cover attachment means, the trim cover attachment means comprising a relatively high density, rigid foam member having a groove disposed in a surface thereof, the groove capable of receiving connection means comprised in a trim cover. A process, system and mold for producing a passenger seat are also described.

Abstract: A passenger seat comprising: a frame element, vehicle anchorage means connected to the frame element, a seat body comprising a resilient material fixed with respect to the frame element and trim cover attachment means, the trim cover attachment means comprising a relatively high density, rigid foam member having a groove disposed in a surface thereof, the groove capable of receiving connection means comprised in a trim cover. A process, system and mold for producing a passenger seat are also described.

Abstract: An improved golf ball injection mold is characterized by upper and lower support plates each containing corresponding hemispherical cavities which define spherical mold cavities when the plates are brought together. A plurality of retractable core pins are arranged in each cavity for supporting a core of a golf ball. A runner within the plates delivers fluid thermoplastic material to each cavity to form a cover on the golf ball core supported therein, and a cooling channel is provided adjacent to each cavity to provide even cooling of the thermoplastic material. Independently operated ejection assemblies are provided for the golf ball and for the residual thermoplastic material in the runner. With the improved ejection mold, the size and roundness of the golf ball and the surface configuration of the golf ball cover are more consistent and the molding time is reduced.

Abstract: A method of molding golf balls using an injection mold. The golf ball includes a plurality of dimples closely distributed on the surface of the ball. The injection mold for golf balls including a pair of separable mold segments (12, 12) defining a spherical cavity (22) when mated along a parting line (PL). A plurality of hollow tubular gates (20) are disposed in the surfaces of the mold segments to be mated along the parting line and in fluid communication with the cavity. Each gate (20) has a non-circular cross section at its outlet. Opposed portions (20-1, 20-2) of the gate cross section separated by the parting line (PL) have an equal area. A stock material is injected into the cavity through the gates to mold a golf ball.

Abstract: A method and apparatus for resin molding upon an insert-member. The molding machine includes an upper die and a lower die, a cavity in at least one of the dies, a pot in which resin is introduced, and a resin path which allows the resin to flow from the pot into the cavity and onto the insert-member set in the dies. A film member is set between a parting face of the die and the insert-member. The film member covers a part of the insert-member corresponding to the resin path. An edge of the film member coincides with at least one of side edges of the cavity. The insert-member is clamped by the dies together with the film member when molding occurs.

Abstract: In an injection mold for golf balls having a pair of separable mold segments (12, 12) defining a spherical cavity (22) when mated along a parting line (PL), at least ten hollow tubular gates (20) are disposed in the surfaces of the mold segments to be mated along the parting line and in fluid communication with the cavity. A stock material is injected into the cavity through the gates to mold a golf ball.

Abstract: An improved mold for forming a semiconductor package, having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.

Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies. A member to be molded by the molding dies is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.

Abstract: A mold tool (40) includes a lower platen (10) and an upper platen (18) which have modified surfaces (16) and (20), respectively. The modified surfaces are formed by implanting an implant species (14) at least into areas of the platens which will be in contact with a molding compound resin. By modifying the surface of the molding tool by ion implantation, the need for cleaning the mold tool is reduced due to lower surface friction and wettability of the modified surfaces. These surface characteristics also facilitate easier release of the molded package from the tool. At the same time, wear resistance of the mold tool is improved due to increased surface hardness.

Abstract: A molding machine comprises a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.

Abstract: A compression mold having first and second steel plates. First and second frame members are attached to the first and second plates respectively and have a plurality of cavities for receiving replaceable half-molds. The mold further includes a plurality of first and second half-molds positioned within the cavities of the first and second frame members and having opposing top edges for contacting when the mold is closed. First and second rubber shims are positioned between the first and second plates and the first and second half-molds and have a first configuration before curing and a second configuration after curing in that position for positioning the corresponding, opposing half-molds such that their top edges contact each other fully when the mold is closed.

Abstract: An apparatus for producing a molded plastic product including, feeding means for feeding plastic and an electromagnetic shielding part into a die having a cavity of predetermined configuration so that the electromagnetic shielding part is located between opposite inner walls of the plastic; and molding means for introducing compressed air between the opposite inner walls of the plastic inside the die so that the plastic accommodates the electromagnetic shielding part and has a hollow configuration between the opposite inner walls.

Abstract: A mold is provided for forming a grommet element. The mold includes a stationary portion and an axially movable portion. The grommet element is formed by the steps of installing respective connecting terminals on conduits; forming a conduit assembly from a plurality of individual conduits, and banding together two proximal points of the conduit assembly; introducing the conduit assembly into the lower part of the mold; closing the mold; moving the two proximal points closer together to produce flexural buckling of the conduits in the conduit assembly; introducing an adhesive mass into the mold, under pressure, at an elevated temperature, during a predetermined period of time; injecting the hot adhesive between the conduits of the conduit assembly; cooling the mold to solidify the adhesive; and molding PVC or another thermoplastic elastomer over the adhesive-sealed conduit assembly, to form a grommet element, and joining the thus sealed conduit assembly to a flange or dividing wall.

Abstract: A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.

Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.

Abstract: An apparatus for the manufacture of corrugated tubing of thermoplastic including a shaping path adjoining the head of an extruder, composed of a guide arranged in a frame structure, along which guide mold halves closed together in pairs as annular molds are advanced in close succession, said mold halves being provided on a lower side thereof with racks, at least one drive pinion arranged in the initial part of the shaping path for meshing with the racks of the mold halves as the same are pushed along the path, and an outlet, following the shaping path, in which the mold halves are separated from one another and are transferred to mutually separate return paths, on which they are shunted back by a conveyor to the inlet.

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and means for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by means of a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: There is provided a mold die set for molding a package body which is composed of a lead frame and a semiconductor chip mounted on the lead frame, and the lead frame has a hole. The mold die set is composed of an upper mold die and a lower mold die and the package body being clamped by the upper mold die and the lower mold die. The lower mold die includes a runner section, a table section connected to the runner section and protruding from a bottom of the runner section, a lower concave section connected to the table section, and a lower gate disposed between the table section and the lower concave section.

Abstract: A mold system for encapsulating substrate-mounted ICs includes a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation.

Abstract: Apparatus for manufacturing a composite insulator including an FRP core rod which is integrally provided with a sheath and a plurality of sheds formed of an electrically insulating polymeric material. The core rod has a longitudinal end portion provided with a seat for a metal fitting, which is integral with the sheath. To manufacture such a composite insulator, the core rod is placed in a mold cavity of a mold assembly, with a seat forming member detachably fitted to the end portion of the core rod and arranged between a pair of mold halves. An inner space is formed between a seat forming member and the core rod, which is in communication with the mold cavity. An electrically insulating polymeric material is introduced into the mold cavity to form the sheath and sheds, while admitting the polymeric material into the space between the seat forming member and the core rod so as to form a seat for the metal fitting, which is essentially free from burrs.