Abstract: An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complementary channel communicating with the injection circuit. The injection circuit includes at least one injection cavity for housing the chip, at least one transfer chamber from which the encapsulation material is injected, and at least one injection channel connecting the transfer chamber to the injection cavity. The blind complementary channel is formed between the two parts of the mold and forms at least one appendage of encapsulation material that is connected to the encapsulation material that fills the injection circuit. Also provided is a method for injection molding an encapsulation material to encapsulate at least one integrated circuit chip.

Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.

Abstract: A resin molding apparatus including a holder for controllably holding and releasing a lead frame having a first and second principal surfaces and a plurality of elements mounted on at least one of the first and second principal surfaces. The resin molding apparatus also includes a transporter for transporting the holder with the lead frame from a first position via a second position to a third position. Further it has a first and second molding dice controllably adjoining the first and second principal surfaces of the lead frame arranged on the second position, respectively, so that a molding cavity is defined therebetween, which covers the element of the lead frame. A resin injector is provided for injecting resin into the molding cavity; and also an elevator is arranged on the second position for elevating the holder with the lead frame in a direction perpendicular to the first and second principal surfaces.

Abstract: A mold for casting a cover for a golf ball is disclosed herein. The mold is composed of a first mold half and a second mold half. Each mold half has an internal hemispherical cavity and a plurality of recesses in flow communication with the internal hemispherical cavity. The recesses are preferably concave on one side of the parting line and convex on the opposing side of the parting line. Preferably, the mold assembly is utilized to mold a polyurethane cover on a golf ball precursor product.

Abstract: A golf ball mold comprises an upper portion (1) and a lower portion (3). A large number of projections (7) for dimple formation are provided on a cavity surface (5) of each of the upperportion (1) and the lower portion (3). The joining surface of the upper portion (1) and the lower portion (3) has a concavo-convex shape. In each of the upper portion (1) and the lower portion (3), each of the numbers of convex and concave sections is three to five. Each of the convex sections has two to eight projections (7) on a first line from the joining surface. At least one of the projections (7) on the first line from the joining surface in each of the convex sections is constituted such that an equation (I) is established: R×0.8≦L≦R×1.2  (I). In the equation (I), R represents a radius of the projection (7) and L represents a linear distance in a vertical direction between a center of the projection (7) and the joining surface.

Abstract: The present invention provides a molding system as well as a method for encapsulating semiconductor packages, wherein a cavity plate is kept at a desired temperature during molding. The system includes a mold comprising a first mold piece and a second mold piece adapted to define a mold cavity for enclosing one or more semiconductor devices for molding, and a cavity plate adapted for mounting in the cavity to introduce encapsulation material to the semiconductor device(s). The system also includes retaining means adapted selectively to hold the cavity plate against the first mold piece or the second mold piece whereby to maintain the cavity plate at the desired temperature.

Abstract: A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold has a recessed cavity for receiving the fixture therein, and adapted to be engaged with the top mold, wherein a resilient member is disposed on an inner wall of the recessed cavity, and interposed between the fixture and the recessed cavity of the bottom mold, allowing the resilient member to provide a resilient force for properly positioning the fixture. By using the above mold structure, chips mounted on a substrate can be firmly supported in the mold structure without causing chip cracks during a molding process for encapsulating the chips.

Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.

Abstract: The present invention is an improved mold-half that is useful in forming golf ball covers or other layers. The mold-half is particularly useful for compression molding a thin polyurethane cover over a golf ball formed from a plurality of inner layers. The mold-half includes a cavity and a land area surrounding the cavity. The land area has an upper surface and at least one vent in fluid connection with the cavity via a chamber formed by a recessed circumferential ledge adjacent the cavity. The ledge controls the flow of excess layer material from the cavity to each vent.

Abstract: A resin encapsulation mold of the present invention comprises a lower mold, which is mounted on a lead frame, includes an indentation into which a semiconductor device is placed, and forms a gate through which resin is injected; an upper mold, in which an indentation is formed opposite the indentation of the lower mold to configure a cavity for holding the semiconductor device; a plurality of ejection pins, which protrude from the respective bottoms of the indentation of the upper mold and the indentation of the lower mold into a resin package body formed by injecting the resin from the gate into the cavity, and eject the resin package body; a vertical drive mechanism, which brings into contact and separates the upper mold and the lower mold; and protrusion adjustment means for adjusting the amount of protrusion of the respective ends of the plurality of ejection pins.

Abstract: A golf ball mold having non-planar parting lines and a method for forming a cover using such mold are disclosed herein. The mold has a pair of mold halves, and each mold half has a non-planar perimeter. The non-planar perimeter has alternating extensions and indentations. Each of the extensions has an apex that may be curved, and each of the indentations has a depression that may be curved. The mold may be used in compression molding, injection molding and cast molding a layer on a golf ball. The mold may be used to produce golf balls having non-dimpled surfaces.

Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.

Abstract: A mold for manufacturing semiconductor packages, which allows leadframes to be easily separated from a top mold section after a molding process by utilizing eject pins therein. The mold includes a bottom mold section having housing parts on the upper surface so as to allow leadframes to be placed in a flat state therein, and a top mold formed with transports therethrough. The top mold also incorporates runners formed along a lower surface with connections to the transports to introduce encapsulation material into select regions. A plurality of gates and cavities for molding the semiconductor packages are in flow communication. The eject pins are reciprocally mounted in the top mold section contiguous with the runners thereof to facilitate separation of the leadframes from the top mold.

Abstract: A process for the production by a moulding process of a micro-cellular or non-cellular elastomeric polyurethane skin layer or, more generally, to a process for the production of a composite comprising a first layer shaped part, which is made by a moulding process from a polyurethane reaction mixture, and a second layer shaped part which is adhered to the first part to form the composite. In order to avoid the use of release agents on the back side of the first layer shaped part, and thus the negative effect on the adhesion of the second layer shaped part, and the penetration of reaction mixture on this back side between the slides (9-10) of the mould, the mould surface (4) is covered on the back side of the moulding with a removable flexible covering (12), with a removable rigid pre-shaped covering or with a permanent non-stick coating layer.

Abstract: Molding equipment and related techniques for forming a golf ball are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component underneath are disclosed. The molding equipment provides one or more selectively positionable knock-out pins along the surface of the molding chamber. These pins are specially tailored such that after their retraction subsequent to molding, the resulting voids are deep dimples. The molding equipment and related processes are particularly useful when forming the various layers by reaction injection molding.

Abstract: A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

Abstract: An optoelectronic component has a lens that is formed in the surface of an encapsulant surrounding a semiconductor diode element. With respect to emitters, the lens reduces internal reflection and reduces dispersion to increase overall efficiency. With respect to detectors, the lens focuses photons on the active area of the detector, increasing detector sensitivity, which allows a detector having a reduced size and reduced cost for a given application. The lens portion of the encapsulant is generally non-protruding from the surrounding portions of the encapsulant reducing contact surface pressure caused by the optoelectronic component. This non-protruding lens is particularly useful in pulse oximetry sensor applications. The lens is advantageously formed with a contoured-tip ejector pin incorporated into the encapsulant transfer mold, and the lens shape facilitates mold release.

Abstract: A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injection zone of the resin, a slit between the perimeter portion of the metal frame and the central pad. Resin flows through an inlet channel of the mold and through the slit to fill the upper and lower cavities. An edge of the central pad defining the slit is bent upward to form a spoiler intercepting the resin stream so that part of the resin is directed toward the lower cavity. The inner edge of the upper half shell of the mold defining the internal cavity along the injection side of the resin is inwardly offset.

Abstract: An apparatus and related techniques for making a golf ball having one or more deep dimples are disclosed. The apparatus is a molding assembly for making a golf ball which includes a mold body that defines a molding cavity. The molding cavity is adapted to accommodate and preferably retain a golf ball core during a molding operation of one or more layers about the core. The molding assembly includes at least one material flow inlet, at least one material flow channel extending between and providing fluid communication with the material flow inlet and the molding cavity. The molding cavity includes at least one outwardly extending protrusion that forms a deep dimple that extends through the cover of the golf ball to and/or into the underlying component of the golf ball upon molding. The outwardly extending protrusion has a height greater than or equal to the thickness of the cover.

Abstract: There is provided a device for covering a core of a foothold with a synthetic resin capable of certainly and easily holding the core for the foothold in a floating state, enabling one supply passage to supply the synthetic resin so as to cover the outer periphery of the core for the foothold with the synthetic resin, eliminating a surface where the synthetic resins are mixed with each other as made in the prior art, thereby manufacturing a strong foothold. The device comprises a lower mold for holding the core of the foothold, an upper mold for covering the upper portion of the core, wherein a plurality of pins stand upright on the lower mold, which pins are urged by springs at portions corresponding to a tread and leg portions of the foothold, pistons for fixing the core to portions in the vicinity of both ends of the portion corresponding to the tread are provided in the back and forth direction of the core while opposing the core.

Abstract: The present invention relates to an optical fiber recoating device. In the optical fiber recoating device, the bare fiber portion of an optical fiber is recoated by filling a recoating resin into molds made of a transparent or semi-transparent material and curing the recoating resin with light from a resin curing lamp that is provided to one side of either of molds. Furthermore, a reflective coating layer is provided to sides of molds where the resin curing lamp is not located, and the light from the resin curing lamp directly radiate and are reflected to radiate onto the bare fiber portion of optical fiber. As a result, the cost of the device is reduced and resin curing is promoted.

Abstract: A homogeneous sash or fenestration unit is shown which may be made of a wide variety of materials, and holds a first and a second pane of glazing material in a parallel, spaced apart, relationship without the use of spacers or a preassembled glazing unit. A novel method and apparatus for making the sash or fenestration unit may use a double door horizontal booking press with fixed or adjustable molds.

Abstract: A system and method for producing fuel cell separators can produce fuel cell separators with high contact performance. The fuel cell separator production system includes an upper mold which has a pattern corresponding to a pattern of gas passages for one surface of a fuel cell separator, a lower mold which has a pattern corresponding to a pattern of gas passages for other surface of the fuel cell separator, one or more nozzles which spray a gas on the periphery of the fuel cell separator on the lower mold, and a suction device which horizontally advances and retracts in a space between the upper mold and the lower mold and removes the fuel cell separator from the lower mold. The nozzles and the suction device are formed independently from the upper mold and the lower mold.

Abstract: A molding device and method utilizes a cavity including first and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.

Abstract: A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.

Abstract: The present invention relates to an optical fiber recoating device, and to an improvement in the molds employed in this device. The optical fiber recoating device is provided for filling a recoating resin into molds, wherein semicircular mold grooves in molds into which the recoating resin is filled are longer than a bare fiber portion of an optical fiber, and an outer diameter of mold groove is larger than the outer diameter of semicircular sheath engaging grooves that engage a sheath of the optical fiber. As a result, a cylindrically shaped extending portion which extends to the sheath is formed to each end of the recoated sheath, so that joining strength of the recoated sheath is improved.

Abstract: A mold for casting a cover for a golf ball is disclosed herein. The mold is composed of a first mold half and a second mold half. Each mold half has an internal hemispherical cavity and a plurality of recesses in flow communication with the internal hemispherical cavity. The recesses are preferably concave on one side of the parting line and convex on the opposing side of the parting line. Preferably, the mold assembly is utilized to mold a polyurethane cover on a golf ball precursor product.

Abstract: A molding device has a first outer mold, a second outer mold engaging with the first outer mold, a silicon mold disposed between the first outer mold and the second outer mold, a center mold, an upper ring, and a lower seat. The first outer mold has a first inner thread, a first upper flange, a first upper inner groove, a first middle flange, a first lower flange, a first bottom base, and a first lower inner groove. The second outer mold has a second inner thread, a second upper flange, a second upper inner groove, a second middle flange, a second lower flange, a second bottom base, and a second lower inner groove. The lower seat is inserted in the first lower inner groove of the first outer mold and the second lower inner groove of the second outer mold. The upper ring is inserted in the first upper inner groove of the first outer mold and the second upper inner groove of the second outer mold. The center mold passes through the upper ring and the silicon mold.

Abstract: An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.

Abstract: An optical fiber recoater for recoating a portion of an optical fiber, such as an optical fiber splice, that has been stripped of or otherwise lacks a protective coating. The recoater may be configured to accommodate optical fibers of varying diameters without the need to reconfigure the device each time the size of the fiber to be recoated increases or decreases. The recoater may be configured to progressively cure coating material within the mold about the optical fiber in a controlled manner. The recoater may be provided with an ejector arrangement that is configured to dislodge the cured material from the mold prior to its removal. The recoater may also be provided with the capability to proof test the integrity of an optical fiber splice. The recoater may be computer controlled and provide for automatic recoating of an exposed fiber portion.

Abstract: A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

Abstract: An apparatus for making a golf ball is disclosed. The apparatus is a molding assembly for making a golf ball which includes a mold body that defines a molding cavity. The molding cavity is adapted to accommodate and preferably retain a golf ball core during a molding operation of one or more layers about the core. The molding assembly includes at least one material flow inlet, at least one material flow channel extending between and providing fluid communication with a material flow inlet and the molding cavity. At least one portion of the material flow channel has a plurality of bends and at least one branching intersection adapted to promote turbulence in a liquid flowing therethrough. A method of making a golf ball is also disclosed. A golf ball made from the disclosed molding apparatus and/or process is also disclosed.

Abstract: Apparatus for manufacturing a multicolor slide fastener includes an upper die 110, a lower die 120, and a plurality of unit fastening teeth-forming slots 101 formed in a lengthwise direction. Molding material-injecting passages and a plurality of sprue holes 102 are provided for injecting the molding materials S into the slots 101. Inclined passages 201 and 202 are connected to the molding material injecting passages respectively, for carrying the molding materials S from a raw material source. Heaters 240 and heat sensors 241 heat the passages 201 and 202. Pressing means 300 press the molding materials S into the inclined passages 201 and 202. Valves 400 control injection of the molding materials S into the sprue holes 102 of the upper die 110.

Abstract: A first injection mechanism of an apparatus for molding articles injects coating material into a cavity defined in a clamped mold, thereby forming a predetermined coating on the inner surface of the cavity. After the coating material is injected into the cavity, a decompression mechanism lowers the pressure in the cavity through at least one vent. After the coating is formed on the inner surface of the cavity, a second injection mechanism injects molding material into the cavity. When the pressure in the cavity is being lowered, an opening-closing mechanism opens the vent. Before or during the injection of the molding material, the opening-closing mechanism closes the vent.

Abstract: A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavity insert, forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. Generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section is prevented, and, consequently, a resin-sealing mold with high reliability is produced.

Abstract: A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.

Abstract: A molding tool for producing several assembly injection molded components, especially assembly injection molded switching dampers, which are combined into a subassembly by inserting an insertion part, and a method for producing such a subassembly from several components using the molding tool of the invention. The insertion part is encapsulated at least partially by one or more of the components to be injection molded, as a result of which a completely assembled subassembly is produced in the original molding process. This can be, for example, a switching damper assembly 18, which results from a common actuating shaft 17. In this way, assembly injection molded components 14, 15 with a complicated structure can be produced, for which a molding tool with only a single molding cavity would not be usable. The individual components 13 are produced in different mold cavities, which preferably are mounted rotatably on a carousel.

Abstract: In order to waterproof a terminal connecting portion of a sheathed wire, in which a terminal fitting and a bare conductor of the sheathed wire are connected with each other, the terminal connecting portion of the sheathed wire is placed into a molding cavity of a molding die such that a bottom face of the terminal connecting portion is closely brought into contact with one of inner faces of the molding cavity. Then molten molding resin is injected into the molding cavity such that a bottom face of a solidified molding resin and the bottom face of the terminal connecting portion define an identical plane.

Abstract: The present invention relates to a method and tooling for forming a stent and the stent so formed. The stent includes filaments of a first material and joints of a second material. The present invention also discloses the above described stent in combination with an angioplasty balloon. The tooling in accordance with the present invention provides a fixture having grooves that receive the filaments of the stent to hold the filaments in place for joining. The joining of all of the filaments can be performed simultaneously by laser welding or injection molding a joint material. The tooling in accordance with the present invention also provides the capability to mold the stent as one piece. The method in accordance with the present invention includes the steps of providing a fixture with internal grooves, placing filaments into the grooves and joining the filaments together.

Abstract: An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.

Abstract: Molding apparatus (200) is provided for simultaneously molding a molding material around a number of separate substrates, each substrate having a semiconductor chip mounted thereon. The apparatus includes a mold holder (113a, 113b, 114, 103) having a first holding section for holding a first mold half (119) and a second holding section for holding a second mold half (120). The first and second holding sections have a common support surface (135), the support surface (135) including a first movable member (104a) in the first holding section and a second movable member (104b) in the second holding section. The first and second movable members (104a, 104b) are movable between a first position in which they protrude out of the support surface (135) and a second position in which the protrusion from the support surface (135) is less than in the first position.

Abstract: Mold cleaning apparatus (1) includes a manifold (5) adapted to be coupled to a suction device. A first conduit (6) extends from the manifold (5) and has a first opening (8) remote from the manifold. A second conduit (7) extends from the manifold (5) and has a second opening (11) remote from the manifold (5). The first and the second openings (8, 11) being directed in opposite directions, and the first conduit (6) having a section (10) with a cross-sectional area which is less than cross-sectional area at any point along the length of the second conduit (7).

Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.

Abstract: A method and system for casting a thermoset layer over a golf ball precursor product is disclosed herein. The system includes multiple stations connected by a conveyor system. The thermoset flowable material is dispensed into a plurality of cavities on each of the mold halves. A plurality of golf ball precursor products are then centered and inserted into the first mold half cavities. The mold halves are mated, heated and cooled. Then, at a de-molding station, the mold halves are separated and the thermoset layered golf balls are removed from the second mold half. A preferred thermoset material is a thermoset polyurethane.

Abstract: An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.

Abstract: A method and system for casting a thermoset layer over a golf ball precursor product is disclosed herein. The system includes multiple stations connected by a conveyor system. The thermoset flowable material is dispensed into a plurality of cavities on each of the mold halves. A plurality of golf ball precursor products are then centered and inserted into the first mold half cavities. The mold halves are mated, heated and cooled. Then, at a de-molding station, the mold halves are separated and the thermoset layered golf balls are removed from the second mold half. A preferred thermoset material is a thermoset polyurethane.

Abstract: A method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The method employs a device formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies.

Abstract: The present invention is an improved mold-half that is useful in forming golf ball covers or other layers. The mold-half is particularly useful for compression molding a thin polyurethane cover over a golf ball formed from a plurality of inner layers. The mold-half includes a cavity and a land area surrounding the cavity. The land area has an upper surface and at least one vent in fluid connection with the cavity via a chamber formed by a recessed circumferential ledge adjacent the cavity. The ledge controls the flow of excess layer material from the cavity to each vent.

Abstract: An integrated circuit chip package according to the present invention includes an integrated circuit chip mounted on a substrate by a plurality of solder bumps. A mold compound is used for underfilling air gaps between the chip and the substrate. The integrated circuit chip package is formed by placing the chip and substrate within a mold cavity and pressing a transfer mold compound into the mold cavity. Air spaces between the integrated circuit chip and the substrate are underfilled by the mold compound as it is pressed in between the integrated circuit chip and the substrate. Air is allowed to escape from between the chip and the substrate during the underfilling through a vent which extends through the substrate. The underfilling material may also be used to encapsulate the chip at the same time that underfilling is performed.

Abstract: A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.