Abstract: A mold device for resin-packaging semiconductor devices is provided which includes a first cavity block having a first molding cavity, a second cavity block having a second molding cavity in corresponding relation to the first molding cavity, and a gate for injecting a resin material into the first and second cavities through a runner. The gate is defined between an opposed pair of first and second gate pins at a corresponding corner portion of each molding cavity. The first gate pin is removably insertable into the first cavity block, whereas the second gate pin is removably insertable into the second cavity block. Further, the gate is directly open to both of the first and second molding cavities.

Abstract: A fixture for fixing an annular upper air isolation member which is provided around an outer side of an upper mold section to an upper mounting plate is released, thereby rotating the air isolation member by a rotational member and fixing the same by a rotational position regulating member. An upper chase unit is exchanged through an upper opening which is defined by the upper mounting plate and the rotated air isolation member. A lower chase unit is also exchanged in a similar manner. Due to this structure, a sealing mechanism for a resin sealing/molding apparatus for electronic parts which can readily and quickly exchange a mold in response to small lot production of various types of products is provided.

Abstract: A method of and apparatus for molding hollow items using the resin transfer molding technique in such a manner that the resin is more uniformly distributed about and along the molding region of the mold. This is accomplished by installing oppositely spaced grooves in the mold and injecting resin directly into these grooves. Upon such injection, the resin travels along and fills the groove (by taking the path of least resistance) before such resin is squeezed or forced out a minute gap that exists between the molding surfaces and into the molding region of the mold. As such resin is being forcibly injected into the cloths in the mold, a vent permits any air displaced from the cloths by the resin to be released. Such resin injection and mold venting occurs until such time that no more air is vented and instead 100% resin is being discharged from the mold. Upon this occurrence, further resin injection is curtailed and the resin previously injected is allowed to harden and cure.

Abstract: A molding die has a plurality of cavity groups each occupying four corners of a rectangular area for accommodating semiconductor chips mounted on a lead-frame, pots each occupying a central area of the rectangular area and a plurality of runner groups each having straight runners equal in length and connecting the pot to the cavities in the four corners, and molten resin concurrently reaches the cavities in the four corners so as to produce semiconductor devices without non-filling or partially filling cavity.

Abstract: An apparatus for making an encapsulated shelf assembly includes a mold defining a mold cavity. A shelf panel and a shelf support bracket extend partially into the mold cavity. The shelf support bracket is spaced from the sides of the mold by the head of a post on one side and a nut on the other side. The post head and nut are partially encapsulated by a moldable material injected into the mold cavity. The nut and post head are removable from the mold cavity with the encapsulated shelf assembly.

Abstract: A method of making a composite tube utilizing known equipment and process to form spaced end sections and a central section having an inner corrugated portion and surrounding portion bonded to at least certain crests of the corrugations. A spaced pair of generally cylindrical end couplings are formed by sequentially telescoping the end sections over an internal cylindrically contoured die part and continuing the telescoping until an inner surface of the telescoped end section engages at least three circumferentially spaced fingers to locate the telescoped end section in concentric relationship with the core part. Positioning an external die part in spaced concentric relationship around the telescoped end section, the external die part having an inner surface contoured to the desired external configuration of a coupling being formed. Injecting a heat softened thermoplastic material into the space between the die inner surface and the core to form a coupling.

Abstract: A brush making machine with a mold for injection molding of brush bodies is disclosed. The mold includes a stationary mold part, a movable mold part and a pair of complementary mold parts fitting into a recess of the movable mold part. The complementary mold parts have tuft insertion holes. While one of the complementary mold parts fills the recess of the movable mold part and a brush body is injection molded with tufts of bristles embedded in the molding material, the other complementary mold part is in front of a tuft feeder for introducing tufts of bristles into the tuft insertion holes. The tuft feeder includes a plurality of tuft picking and transfer tubes which are movable to pick out tufts of bristles from a bristle container and to transfer each of these tufts to a position adjacent one of the tuft insertion holes. Plunger members penetrate into respective tubes to push out the tufts of bristles contained therein and to force them into and through the tuft insertion holes.

Abstract: A mold for molding a semiconductor package which is capable of guiding a resin material for encapsulating a semiconductor device uniformly into the cavity and prevents the island portion of the support member from being exposed from the molding main body, the mold comprising a pair of mold members for encapsulating a semiconductor device held on the support member, and a gate for guiding a molding resin material into the cavity, the gate being provided in the parting face of parting face of at least one of the mold members, wherein the gate is defined by a U-shape groove including the slanted bottom face inclined at an elevation angle toward the cavity to orient the flow of the resin material, supplied to the gate, toward the half of the cavity defined by the other mold member from the gate, and wherein in the slanted bottom face, there is provided an auxiliary groove for making the resin material, generally guided along the slanted bottom face, partially oriented to a direction different from the direction o

Abstract: A composite insulator-producing compression mold device including a pair of molding units each having a recess for the formation of a housing of a composite insulator. At least one partition plate is fitted to a first one of the molding units near the composite insulator housing-forming recess and at a location radially outwardly from the recess. An urging mechanism is provided for urging the partition plate toward the second molding unit such that an outer end portion of the partition plate may project toward the second molding unit from a parting face of the first molding unit when the molding units are opened. When the molding units are closed, the partition plate is received within the first molding unit. Another mechanism is provided for preventing the partition plate from being detached from the first molding unit.

Abstract: A method and apparatus for manufacturing an optical connector subassembly provide an improved device at lower cost. The optical connector includes a plastic base member 150 which is overmolded onto a cylindrical ferrule 140 having an axial passageway 145 which extends from one end face 141 of the ferrule to the other 142. A mold 900 includes two parts 910, 960 which are joined together before heated and pressurized thermoplastic material is injected. The ferrule is held within a first channel 914 of the mold and a spring-loaded core pin 950 is held within a second channel 964 of the mold. These channels are coaxially aligned when the mold parts are joined together. The core pin includes a conical point 951 at one end which enters the axial passageway of the ferrule before the thermoplastic material is injected. A third channel 912, 962 receives the thermoplastic material and routes it into the first and second channels.

Abstract: A method of manufacturing a waterproof connector housing and an apparatus for practicing the method of manufacture are provided. The apparatus includes overflow projecting walls which extends either from a male metal mold or a female metal mold in a direction in which the male metal mold is inserted into a female metal mold. The overflow preventing walls are formed at edge portions of a space for forming a packing, after tips of the overflow preventing walls are pressed against a housing arranged between the male and female metal molds so that the tips of the overflow preventing walls are allowed to adhere to the housing. Rubber material is injected into the space and the overflow preventing walls act to surely prevent the overflow of rubber material from the space.

Abstract: An apparatus is disclosed for making a composite tube with end couplings. The composite tube is made utilizing known equipment and process to form spaced end sections and a central section having an inner corrugated portion and surrounding portion bonded to at least certain crests of the corrugations. A spaced pair of generally cylindrical end couplings are formed by sequentially telescoping the end sections over an internal cylindrically contoured die part and continuing the telescoping until an inner surface of the telescoped end section engages at least three circumferentially spaced fingers to locate the telescoped end section in concentric relationship with the core part. An external die part is positioned in spaced concentric relationship around the telescoped end section, the external die part having an inner surface contoured to the desired external configuration of a coupling being formed.

Abstract: A device for obtaining a glazing surrounded, on at least a portion of its periphery, by cast plastic including an injection head, a cavity, an injection dam and at least one mold part in the wall of which a duct is provided. The duct has two parts, one part located outside the joint plane and one part located in the joint plane.

Abstract: In a system for repairing a resin-impregnated article having one or more dry spots or resin-depleted areas. A mold release is used to coat all surfaces of the defective article, except for the resin-depleted areas and a border area surrounding and contiguous to each resin-depleted area. The coated article is then placed within a mold cavity defined by a two-piece mold and corresponding in shape and size to the article. A plurality of shims are interposed in the parting line between the two halves of the mold, creating a first gap within the parting line and a second gap between the surfaces of the article and the walls defining the mold cavity. A gasket is also seated between the two halves of the mold to seal the mold cavity, and a vacuum pump is coupled to the mold cavity to evacuate the cavity to a negative pressure.

Abstract: A method for assembling a plastic integrated circuit package. The method includes placing an integrated circuit die and lead frame into a mold. The mold has a first gate that is in fluid communication with a first side of the lead frame and a second opposite gate which is in fluid communication with a second side of the lead frame. The lead frame also has a mold flow hole adjacent to the gates. A plastic encapsulant is injected into both gates and flows across each side of the lead frame. The mold flow opening allows encapsulant to flow between each side of the lead frame.

Abstract: A mold assembly for forming a panel assembly having a gasket on one surface for use as a flush-mounted panel or window in vehicles, buildings, or other structures includes a mold cavity defined in a facing surface of one mold section and a pressure pad on the second mold section, the pressure pad being urged against the surface of a sheet-like panel at a position opposite the mold cavity with the panel being held against a support surface adjacent the mold cavity when the mold sections are closed. Preferably, the pressure pad is a heat insulative pad which is urged against the panel surface by a resilient member preferably formed from urethane. The support surface and mold cavity are preferably raised above and offset from adjacent portions of the first mold section, and the size of the raised area of the support surface and mold cavity preferably corresponds in size to the area of the pressure pad.

Abstract: A plastic molding method for semiconductor devices, the method including placing semiconductor devices mounted on lead-frames between lower die cavities in a lower die chase block and upper die cavities in an upper die chase block and clamping the upper and lower die chase blocks together; evacuating an ejector chamber in the lower die chase block through a lower die common surface table, evacuating an ejector chamber in the upper die chase block through an upper die common surface table, and evacuating a parting chamber at a parting surface between the lower die chase block and the upper die chase block through one of the lower die common surface table and the upper die common surface table; and injecting a sealing resin into the upper die cavities and the lower die cavities to plastically package the semiconductor devices.

Abstract: An apparatus is provided for molding lead frames. The apparatus has a mold formed by two mold halves. An assembly for introducing a lead frame into one of the mold halves, an assembly for carrying encapsulating material into the cavities of the mold and an assembly for removing an encapsulated product from the mold are arranged on a carriage movable along a guide relative to the mold halves.

Abstract: A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to form a cavity block and a center block. Opposing surfaces of the cavity block halves include a polytetrafluoroethylene layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.

Abstract: A method for encapsulating semiconductor devices includes the steps of: providing a molding system and a close-loop control system which is coupled to the molding system, the close-loop control system including a computer, a programmable logic control, a servo motor controller, and at least two drivers, wherein the servo motor controller is coupled to the computer and the programmable logic control, respectively, the servo motor controller is further coupled to the drivers, and the drivers are coupled to the molding system; clamping together at least one set of top and bottom molds of the molding system, the molding system including a clamping assembly having a clamping axis, the close-loop control system being coupled to the clamping assembly; feeding a molding compound into a cavity formed by a space between at least one set of top and bottom molds, the molding system further including a transfer assembly having a transfer axis; alternating a gear switching assembly of the molding system between a high spee

Abstract: A resin encapsulating molding die for manufacturing a semiconductor device includes a cavity piece having a cavity on which a lead frame with a mounted semiconductor element may be placed, with the semiconductor element in the cavity, and a gate piece having a gate portion including a sub-runner through which a molten resin for encapsulating the semiconductor element is introduced into the cavity, the gate piece being detachable from the cavity piece. The molding die also includes a sealing dam disposed adjacent the sub-runner for blocking flow of molten resin from the sub-runner toward leads of the lead frame. The sealing dam may be a clamp structure for clamping the leads closest to the gate portion, the sealing dam and cavity piece may be a continuous unitary structure, and the sealing dam may have a parting surface substantially coplanar with a parting surface of the cavity piece.

Abstract: There is disclosed a mold for molding a box-shaped product which is open at one side face thereof, and has a resilient insert extending into an interior of the product through a side face of the product opposite to the opening. The insert has a convex portion formed on one surface thereof. A mold cavity is defined by a pair of metal mold halves and a pair of slide cores. The mold halves form an outer shape of the product, and the slide cores form an inner shape of the product. One of the slide cores has a recess for receiving the convex portion of the insert. In the molding, after a resin is cured, the other slide core is retracted before the metal mold halves are opened apart from each other, and then the one slide core with the recess is retracted.

Abstract: A molding die for sealing a semiconductor element with a resin includes an upper and a lower mold half. A leadframe having a resin passage aperture is sandwiched between the lower mold half and the upper mold half. The lower mold half has a lower runner space, a lower cavity, and a lower gate provided between the lower runner space and the lower cavity. The upper mold half has an upper resin well, an upper cavity, and an upper gate provided between the resin well and the upper cavity. The length of the upper resin well in the direction of the flow of resin is equal to or greater than the distance from the lower gate to the front edge of a lower runner rising slope, to thereby obtain a final product which is free from resin burrs formed in the upper resin well.

Abstract: A mold for encapsulating a transformer coil assembly in thermoplastic rubber includes a bottom mold portion having a mold cavity, an upstanding pin disposed within the mold cavity, a mold cover for closing the mold cavity, and a vent space positioned in the bottom surface of the mold cavity for venting gas within the mold cavity to the exterior of the mold during the injection of thermoplastic rubber into the mold cavity.

Abstract: A transfer molding machine for encapsulation of semiconductor devices with a resin comprises a clamping mechanism with an electrically actuated toggle mechanism, a pair of upper and lower sections of a transfer mold, and at least one compensation unit including upper and lower plates and a plurality of elastic members held between said upper and lower plates. The compensation unit is arranged either between the upper stationary platen and the upper mold section or between the moving platen and the lower mold section to compensate the dimensional errors in the mold sections and clamping mechanism.

Abstract: The invention is to a transfer mold design utilized with conventional transfer encapsulation. The design utilizes a varying runner cross section with an intermediate varying depth well or reservoir from which a constant gate depth and gate entry angled to the mold cavities is employed. The method and apparatus of the invention is applicable to single and multiplunger molding utilizing thermoset and thermoplastic encapsulants for semiconductors.

Abstract: A mold for forming a waterproof cable has wire introducing openings 3a, 3b at both ends and a cavity 7 for loosely receiving a plurality of wires. Ridges 35a, 35b, which extend in such a transverse direction relative to a wire insertion direction, are arranged on an inner surface 7a of the inner space 7. Thereby, the mold for forming waterproof cables can provide an improved waterproof structure of the electric wire bundle.

Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.

Abstract: A molding apparatus having an upper mold, a lower mold, and a cylindrical mold cavity defined between the upper mold and the lower mold and adapted to receive a molding material such as epoxy resin. An annular recess is defined in the lower mold adjacent to the mold cavity. A gasket is fit in the recess and made of lead. An oil passage is defined in the lower mold. Silicon oil as a pressure medium is fed to the recess through the oil passage so as to press the gasket against the upper mold. Then, the gasket is deformed to form a seal around a portion of the mold cavity where the upper and lower molds mate with one another. An annular spacer is placed in the bottom of the recess. An annular groove is defined below and along the bottom of the recess so as to allow the silicon oil to flow below and along the annular spacer, whereby sufficient pressure is exerted uniformly on the gasket to cause deformation of the gasket.

Abstract: A method for producing a multilayer molded article that includes a resin body and a skin material on a surface of the resin body, which method uses a mold having male and female molds. The shortest horizontal distance of a mating gap between the horizontally outermost wall surface of the male mold to which the skin material contacts and the horizontally innermost wall surface of the female mold to which the skin material contacts is 0.25 to 3 times the minimum thickness from which the once compressed skin material can restore the original thickness. The shortest length L in a mold closing direction of a mated part formed between the outermost wall of the male mold to which the resin melt contacts and the innermost wall of of a flange of the female mold satisfies the equation:(t.sub.1 -t.sub.0 +10)mm.gtoreq.L.gtoreq.(t.sub.0 -t.sub.0)mmwherein t.sub.1 is a distance (mm) between the male and female molds when the resin melt first reaches the horizontally outermost edge of the male mold, and t.sub.

Abstract: A molding equipment for making composite molded article having:(a) a fixed side mold having a convex portion integral with a gate; the convex portion being formed according to the shape of the molded article; the gate being used for injecting melted resin into a resin molding space;(b) a movable side mold capable of being moved close to and away from the fixed side mold; the movable side mold having a concave portion; the concave portion being joined with the convex portion of the fixed side mold (1) to form the resin molding space when the molding equipment is clamped;(c) a set of slide cores being mounted between the fixed side mold (1) and the movable side mold; the slide cores being movable toward and away from the fixed side mold; and(d) a skin material setting frame being mounted between the fixed side mold and the slide cores; the skin material setting frame being capable of setting a skin material.

Abstract: A composite insulator includes a FRP core rod and a sheath which is formed by integrally molding an insulating polymeric material to cover the core rod over substantially the entire length thereof. The sheath is composed of a plurality of molded portions which are aligned with each other in the axial direction of the core rod. Adjacent molded portions of the sheath are arranged relative to each other so that a gap is left between the opposite ends of the molded portions. The gap is filled by a joint insulating material which is integrally united to the polymeric material of the adjacent molded portions.

Abstract: A device for molding a buffer cap at the same time of fixing the cap to the bristle base implanting head of a toothbrush body preform. In the buffer cap molding and fixing device, a stationary molding plate is coupled to a mounting plate by a stop rod such that it is limited in its moving distance. The stationary molding plate has a plurality of sprues aligning with a plurality of gate holes. The bottom surface of the stationary molding plate has a plurality of top cavities, communicating with the sprues through their respective gates and each having a wider section provided with a pair of holding projections for holding a toothbrush body preform. The gates are formed at necks of the top cavities respectively. A back up plate is interposed between the stationary mounting plate and the stationary molding plate. A core plate comes into contact with the stationary molding plate at a parting plane. The top surface of the core plate has a plurality of bottom cavities corresponding to the top cavities.

Abstract: An apparatus for manufacturing filters for motor vehicles essentially consists of a die (1, 2) in which the filtering element (9) is introduced, around which a channel (25) is formed where a movable frame (10) is lowered having a shape substantially corresponding to that of the filtering element (9), so as to define an injection cavity (27) separated from the filtering element, and an expansion cavity (28) adjacent the filtering element (9) that are communicate one another by the lifting of the movable frame (10), whereby the resin can expand and stick to the filtering element (9). The die is provided with a seal groove (3) acting as a seal gasket and is filled with synthetic resin during the expansion thereof, which resin prevents any further resin from entering the space between the die (2) and the movable frame (10).

Abstract: A direct drive electro-mechanical press for encapsulating semiconductor devices has at least a clamping axis and a transfer axis. The clamping axis has a planetary roller screw coupled to a tie bar platen assembly on which at least one top mold is mounted. A two-speed gearbox is further coupled to the clamping axis for switching between a high speed mode and a high torque mode along the clamping axis. The two-speed gearbox has a high speed clutch coupled to a speed reducer and a high torque clutch respectively. The transfer axis is slidably located above the clamping axis; the transfer axis has another planetary roller screw coupled to a bottom platen on which at least one bottom mold is mounted. The transfer axis transfers the molding resin from the pot into the cavities formed when the top and bottom molds are clamped together.

Abstract: A process for producing, by compression molding, an insulator having a core and a housing consisting of a sheath portion and at least one shade portion around the sheath portion, including the steps of: (A) preliminarily forming a rubbery layer around an outer periphery of the core to obtain a preliminarily molded body by extrusion molding, (B) placing the preliminarily molded body between at least two mold units of a mold; (C) forming a compressed molding by compression molding said preliminarily molded body in a given shape inside a cavity defined by the at least two mold units; and (D) curing the resulting molding. An apparatus is also disclosed for producing such an insulator by compression molding, which apparatus includes (A) a preliminary molding unit, (B) a molding unit form forming a compressed molding from the preliminarily molded body in a given shape by using a mold, and (C) a heater for curing the rubber in the rubber layer.

Abstract: An apparatus is provided for making molded photointerrupters by using first and second leadframes. The first leadframe carries a plurality of light emitting devices, whereas the second leadframe carries a plurality of light receiving devices. The apparatus includes a molding unit which includes: a lower mold member which supports the first leadframe in a horizontal posture; an upper mold member movable vertically toward and away from the lower mold member; and a pair of side mold members movable laterally toward and away from each other between the upper and lower mold members, one of the respective side mold members supporting the second leadframe in a horizontal posture; wherein the respective mold members forms molding cavities when the mold is closed.

Abstract: In an apparatus for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.

Abstract: A mold for joining a molded portion onto an end of an extruded weather strip without having any looseness in the joint formed therebetween, and which facilitates removal of a fin formed in the molded portion. The mold includes mold members defining a cavity at an end of which an end of the extruded weather strip is placed, and to which a molding material is injected. The mold members further define a tunnellike additional cavity in a parting plane therebetween. The tunnellike additional cavity extends along a peripheral edge of the cavity so that an end thereof is located at the position beyond the end of the extruded weather strip. A passage is also defined in the parting plane so as to interconnect the cavity and the tunnellike additional cavity for introducing a molding material into the tunnellike additional cavity. The passage extends to a position close to but not beyond the end of the extruded weather strip.

Abstract: A mold and method of forming a butterfly valve and the novel valve formed. The disclosure includes providing a valve skeleton having a body portion, a hollow neck extending from the body portion to receive a valve stem and a cruciform-shaped actuator plate portion on the hollow neck, suspending the valve skeleton in a mold cavity in inverted orientation, and injecting reaction injection molding polymer by laminar flow into the bottom of the mold cavity with an amount of polymer sufficient to fill the space from the bottom up, encapsulating the skeleton, and overfill the space to force the leading edge of the polymer out the top of said space into said escape chamber to entrap residual gases into a severable offal member. The polymer encapsulates the cruciform-shaped actuator plate while filling the corner spaces thereof, except for fastener orifices which form adjacent the cruciform legs. A gate at the bottom of the mold assures laminar flow of polymer into the mold cavity.

Abstract: A molding machine is provided for a semiconductor package. The machine has two transfer rods for compressing resin into a leadframe of the mold. One transfer rod will move resin into the mold when the rod is moved downward and the second transfer rod will move resin into the mold when the rod is moves upwardly. Means are provided for selectively operating the transfer rods as needed depending on the type of mold used.

Abstract: A mold for a semiconductor package having a port for feeding resin which can be fixed either in an upper mold (1) or a bottom mold (2) corresponding to the location of the flange tip so that the operating rate of the equipment is increased to achieve high productivity.

Abstract: A multi-station apparatus and method of manufacture allows the manufacture of an article having a fluid filled cavity fabricated from simultaneously fed twin thermoplastic webs. A web transport means simultaneously feeds twin thermoplastic webs into an apparatus, where a oven raises the temperature of the material of the webs for thermoforming and molding. The cavity then is partially fusing to provide an injection and outlet port and a fluid is injected into the cavity, which is then sealed to provide a finished article. The fluid can be formed from a super absorbent material as a thick, viscous gel-like colloidal substance.

Abstract: Encapsulation molding equipment includes individual loading bars each having an elongated support surface which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having plural rows of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Converging gate passages and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle to the cavities. Support of the cavity inserts independent of the loading bars and resilient mounting of the loading bars is disclosed. The mold is completed by an upper mold member which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts.

Abstract: Apparatus for the preparation of optical ferrules containing cylindrical members is disclosed. The apparatus utilizes guide means receiving the cylindrical member, a sleeve receiving a piston therethrough, and a pin extending into the sleeve. The apparatus also includes biasing means to position the piston, fill gates to dispense polymer into a defined cavity, and containment means which secure the apparatus components together. Injection molded optical fiber ferrules made according to the apparatus and process disclosed exhibit superior properties.

Abstract: An improved transfer molding apparatus is provided for molding a preheated resin under pressure to thereby encapsulate a small element, such as a semiconductor device or package. In one aspect of the invention, the improvement consists of providing a shortened pot into which a piston is forcibly pressed to generate a flow of preheated resin in the encapsulating process, the improvement comprising the replacement of a single-element top drive plate, as found in a conventional apparatus, by a two-piece top drive plate which enables a shortening of the pot and corresponding reduction in the amount of air that would otherwise be trapped between the plunger and the resin during the process. The elimination of this air significantly reduces foaming, porosity, voids, and other defects in the cured resin which finally surrounds the electrical elements encapsulated thereby.

Abstract: A plastic material is injected in the fluid state into a flexible closed mold having a molding cavity in which is placed the edge of a glass pane. The plastic material is injected into the cavity of the mold in the inert state and is then activated by high-frequency electromagnetic radiation or by microwave radiation. An insert is placed in the cavity of the mold before the injection of the plastic material. The injection and subsequent hardening of the plastic material are carried out inside the cavity of the mold in which cavity the edge of the glass pane and the insert are arranged in their definitive relative position. Glass panes for motor vehicles having a trim strip or elements such as ducts, cables or fastening screws can be prepared.

Abstract: A mold for forming coreless armatures having an upper mold and a lower mold. The lower mold has a mold cavity for receiving a shaft capable of supporting windings of a coreless armature. An elastic ring plate is placed between the upper and lower molds and is adapted for being compressed therebetween. The elastic ring plate is further adapted to contact terminal ends of the windings as they extend outside of the mold cavity, and to seal said mold cavity with the terminal ends extending therefrom.

Abstract: An improved plunger apparatus used in a resin molding device for encapsulating electronic components. At least one annular recess is located in the bottom side of the plunger. The annular recess redirects the plasticized resin to flow towards the mold cavities in the molding device and away from the interface between the plunger and the cylinder of the molding device, thereby optimizing the flow of resin to the cavities and reducing the tendency of excess gas and resin to flow away from the cavities. At least one flat side is located in the lengthwise surface of the plunger. The flat side forms an enlarged clearance in the interface between the flat side and the cylinder of the molding device. The enlarged clearance receives and provides an outlet for any excess gas or resin that flows in the interface. The improved plunger still stably guides within the cylinder, and the improved plunger allows the molding apparatus to encapsulate electronic components more economically, efficiently, and effectively.

Abstract: An upper die and a lower die are provided to form a cavity. The upper die and the lower die have respectively slots made through them in parallel with each other, and the slots are connected to the cavity. Also, the slots have pins reciprocatably inserted through them. The pins are reciprocated such that they are advanced to greatly project their ends into the cavity, and that they are returned to allow their head portions to remain slightly projected into the cavity. The pins respectively comprise a body portion in a bar-shaped configuration, a head portion connected to the end surface of this body portion. The end surface of the body portion is furnished with the substantially same radius of curvature as the bottom surface of the cavity. Also, the body portion is shaped in the surface thereof so as to have a circular configuration as viewed from the center of the cavity.