Abstract: A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.

Abstract: The disclosure relates to a deep-drawing packaging machine with a forming station for deep-drawing trays into a film, a loading stretch for filling products into the trays, and a sealing station for sealing the trays. The deep-drawing packaging machine further comprises at least one vacuum cooling station which is disposed in a direction of transport upstream of the sealing station and which is formed for vacuum cooling the products placed into the trays along the loading stretch. The disclosure furthermore relates to a method for vacuum cooling products.

Abstract: Disclosed are a full-automatic storage shelf assembly production line and an operation method thereof. The production line includes a logistics channel, a stand column-based feeding area, a supporting beam-based feeding area, an in-line logistics system, a shelf assembly area, a finished product area, and a control system. The stand column-based feeding area, the supporting beam-based feeding area, the shelf assembly area, and the finished product area are connected in series by means of the in-line logistics system to form an integrated production line.

Abstract: The improved mold assembly for cultured marble molding is provided. The mold assembly can comprise a male mold portion and a female mold portion. The assembly can further comprise a molding tool. The molding tool can have a side wall having an upper curved s and a lower curved portion. The molding tool can be constructed from a flexible and/or soft material. The lower curved portion of the molding tool can be coated with a gel coat having a first color. The molding tool can facilitate molding of a countertop having a recessed bowl portion having a color different from a counter portion of the countertop.

Abstract: An apparatus, system and method of forming a plurality of panels into a panelized section of panels and installing the panelized section on the frame of a building to form a wall or roof of the building. The apparatus has a panelizing assembly which sits on the ground or other surface to allow the user to accurately position panels for the panelized section and a lifting apparatus that helps form the panelized section and lifts the panelized section to the building's frame. The panels are aligned using positioning devices on the panelizing assembly and cap members on the lifting assembly, each of which have profiles that correspond to the profile of the panel so the panel is squeezed between the lifting assembly and the panelizing assembly. Panels from a bundle of panels are positioned on a frame of the panelizing assembly using a cart that rolls on a rail track.

Abstract: According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: Provided is a technology with which, when producing a resin molded article, the inside of which is provided with an insert component such as a terminal fitting, it is possible to prevent the insert component from being exposed at an inappropriate position, and to ensure the desired positional accuracy. In an injection molding device, the accuracy of the position of a terminal is improved by allowing a core-back mold to move after a terminal, which is an insert component, has been inserted in a terminal tip holding section of a slide mold. By allowing the core-back mold to move by only a prescribed amount prior to injection molding, a resin wall is formed between the core-back mold and the terminal. The inappropriate exposure and shorting of and the adhesion of foreign substances to, and the like, the terminal can thus be prevented.

Abstract: An assembly includes a plurality of core retention elements for transferring cores to a tablet press turn table. The core retention elements may each include a core receptacle that selectively receives a core. The core retention elements may transfer the core into one of a plurality of die bores in the press turn table.

Abstract: The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound.

Abstract: A process for making a tufted article from a thermoplastic material comprises controlling injection pressure according to a pressure-dominated algorithm including detecting at least 100 melt-pressure measurements per second upstream a front end of a mold cavity. An apparatus comprises a pressure-control mechanism for monitoring and adjusting an injection pressure according to the pressure-dominated algorithm, wherein the pressure-control mechanism comprises at least one high-frequency pressure sensor located upstream the mold cavity's front end.

Abstract: An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal; a ground portion extending from the antenna pattern portion; a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case.

Abstract: Method and apparatus for overmolding delicate parts are disclosed. A mold unit for an injection molding apparatus can be provided. The mold unit can include a clamping mechanism and a locking mechanism. The clamping mechanism can be positioned in contact with the delicate part. The position of the clamping mechanism can be selected such that the clamping mechanism does not exert a force that damages the delicate part. The delicate part can vary in size from part to part. Thus, as the overmolding process is repeated, the position that is selected each time for the clamping mechanism can vary depending on the size of a part that is used. The locking mechanism can be configured to lock the clamping mechanism into the position selected for the part.

Abstract: The high straightness arrow in the present invention is designed to improve the straightness of the archery arrow by adopting new manufacturing technique and method. Chamber and post are made of dissimilar metals and the chamber includes a wall that creates an external housing and defines an internal airspace. Once the post with shaft is positioned through chamber, nuts are tightened securely, forming an assembly, to straighten post. Due to the different coefficients of thermal expansion of chamber and post, when they are heated simultaneously, the chamber expands more than the post, creating a natural tension along post which results in a near perfectly straight shaft. As the assembly cools, the post and chamber return to their original length, yet the shaft retains its straightened form and thus this manufacturing process yields an arrow shaft that is straighter than shafts made of the same materials but with a traditional manufacturing technique.

Abstract: A fixing device for fixing cores includes a base and a cover. The base defines holding grooves. Each holding groove includes a V-shaped portion and a through hole connected with the V-shaped portion. The cover is fixed on the base to secure the cores inside the holding grooves.

Abstract: A removable molding tab facilitates loading component parts into a mold by providing a body with holding configurations suitable to releasably secure the component parts in mold ready positions. The component parts are loaded into a mold as a preassembly with the removable tab. The tab is removed after the component parts are placed into the mold.

Abstract: A motif-arraying apparatus for arraying motifs such as a hot fix or the like in mounting grooves formed in a mold plate. The motif-arraying apparatus includes a shaking member for loading motifs in the mounting grooves formed in the mold plate, wherein the shaking member includes a vertical board and a horizontal board coupled to an edge thereof, and a plurality of shaking knives coupled to the bottom surface of the vertical board at a predetermined interval. The apparatus not only enables motifs to be correctly arrayed in the mounting grooves formed in the mold plate in a quick and easy manner, but also enables a motif inserted in a wrong direction to be removed from the mounting groove and correctly arrayed, thereby improving productivity, minimizing defects, and reducing costs.

Abstract: Methods and devices for forming a composite carrier frame assembly used in an injection molding process are described. Methods and devices described herein are well suited for insert molding multiple small pieces into a single injection molded part. The composite carrier frame assembly can include a number of insert attached thereto that are positioned in a pre-determined arrangement such during an injection molding process the inserts are molded in a molded part in the pre-determined arrangement. Each insert can include an anchor portion arranged to be molded in the single injection molded part and an exterior portion arranged to be positioned exterior to the single injection molded part.

Abstract: The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.

Abstract: The invention relates to a method for the manufacturing of a component or a structural part made of polymeric material, adapted to integrate electrical devices and connections, and a system for carrying out the method. The method includes injection moulding of a composite material including: a non-conductive polymeric matrix; a dispersed phase including at least one carbonization promoter to form carbonaceous conductive structures; and a reinforcing-fibre filler to direct the distribution and orientation of the dispersed phase in the polymeric matrix, wherein injection of the composite material into a mould for forming the component or the structural part includes supplying the material in a spatially more-concentrated way at pre-established regions of the component or of the structural part designed for the incorporation of electrical devices or connections, and supplying the material in a spatially more spread-out way elsewhere.

Abstract: Systems and methods are disclosed herein that generally involve CED devices with various features for reducing or preventing backflow. In some embodiments, CED devices include a tissue-receiving space disposed proximal to a distal fluid outlet. Tissue can be compressed into or pinched/pinned by the tissue-receiving space as the device is inserted into a target region of a patient, thereby forming a seal that reduces or prevents proximal backflow of fluid ejected from the outlet beyond the tissue-receiving space. In some embodiments, CED devices include a bullet-shaped nose proximal to a distal fluid outlet. The bullet-shaped nose forms a good seal with surrounding tissue and helps reduce or prevent backflow of infused fluid.

Abstract: An insert molding apparatus includes a forming die in which a first part is arranged, and that molds resin such that a portion of the first part is exposed; and a first mounting part that is arranged at a portion where the first part is exposed, and that has a passage that passes through a space in the forming die into which the molten resin is supplied and a portion where the first part is arranged.

Abstract: A laminated rotor core (36) wherein permanent magnets (47) are inserted in respective magnet insertion holes (46) is disposed between and pressed by an upper die (37) and a lower die (29). The upper die (37) has resin reservoir pots (50) provided above the laminated rotor core (36) and at positions corresponding to the respective magnet insertion holes (46). Raw resin material put in the resin reservoir pots (50) is heated by the upper die (37). Subsequently, the resin material in a liquefied state is ejected from the resin reservoir pots (50) by plungers (52) that are inserted and moves vertically in the resin reservoir pots (50) and is directly filled in the magnet insertion holes (46). Consequently, the respective magnet insertion holes (46) are filled with the resin material more evenly and highly reliable products can be supplied at low cost.

Abstract: The invention relates to a device and a method for producing plastic moldings from at least two different sub-elements (15; 16) that includes first and second mold halves (3) and a rotatable center block (6) with center and third mold halves (8; 17) interposed therebetween. The center and third mold halves define first and second parting planes with the first and second mold halves. First cavities are defined in the first parting plane, into which a first plastic component is introduced to produce preforms (12). When the first parting plane is opened, the performs (12) remain on the center mold halves (8) and are brought into the second parting plane when the center block (6) is rotated, in which second parting plane second cavities are at least partially defined by the preforms (12), into which a second plastic component is introduced and first sub-elements (15) are produced. Second sub-elements (16) are produced in the additional cavities.

Abstract: There are provided an apparatus and an associated method for manufacturing superplastically formed structural assemblies from preforms. The apparatus includes first and second co-operable dies structured to define a die cavity therebetween for at least partially receiving the preform, at least one heater in thermal communication with the die cavity for heating the preform to a forming temperature, and at least one injector in fluid communication with the die cavity. The injector is structured for injecting pressurized gas into the die cavity to urge the preform against one of the dies to form the preform into the structural assembly. Further, at least one of the injectors is structured for injecting a quenchant into the die cavity to thereby heat treat the structural assembly while distortion of the structural assembly is being at least partially restrained by at least one of the dies.

Abstract: The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: There is provided a semiconductor package including: at least one internal lead having at least one electronic component mounted on a surface thereof; a molding unit sealing the electronic component and the internal lead; at least one external lead extending from the internal lead and protruding outwardly from ends of the molding unit; and a stopper provided on the external lead.

Abstract: A mold for fabricating an optical fiber connector is disclosed. The optical fiber connector includes a blind hole for accommodating an optical fiber and an aspherical lens portion for being optically coaxial with the optical fiber. The mold includes a rod-shaped core for forming the blind hole and a plate-shaped core. The plate-shaped core includes an aspherical recess for forming the lens portion. The aspherical recess faces the rod-shaped core and is adjustably movable relative to the rod-shaped core to achieve alignment between the aspherical recess and the rod-shaped core.

Abstract: An assembly includes a plurality of core retention elements for transferring cores to a tablet press turn table. The core retention elements may each include a core receptacle that selectively receives a core. The core retention elements may transfer the core into one of a plurality of die bores in the press turn table.

Abstract: A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. In some cases, a movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. In some cases, gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.

Abstract: An enhanced multiobject potting fixture for exposure to a curing modality that sets an adhesive includes a fixture housing supporting a plurality of objects, the fixture housing having a wall defining a plurality of bonding wells with each the bonding well receiving a first portion of one of the objects, each the bonding well including an aperture in the wall proximate the first portion wherein each bonding well includes a target zone for selective cure of the adhesive to inhibit the adhesive from exiting the aperture; and a fixture enhancement structure integrated into the wall concentrating the curing modality in each the target zone.

Abstract: The present invention relates to an educational method and apparatus for the instruction of basic scientific principles relating to mining. The apparatus consists of a kit for science instruction that comprises a topographic mold, casting compound, and one or more components simulating materials found in nature beneath the surface of the earth. The kit may include a tool for obtaining core samples of the resulting topographic model and may include a topographic map. The components of the kit may be used in conjunction with weight measurement tools.

Abstract: A mold for fabricating an optical fiber connector is disclosed. The optical fiber connector includes a blind hole for accommodating an optical fiber and an aspherical lens portion for optically coaxial with the optical fiber. The mold includes a rod-shaped core for forming the blind hole and a plate-shaped core. The plate-shaped core includes an aspherical recess for forming the lens portion. The aspherical recess faces the rod-shaped core, and is adjustably movable relative to the first core so as to achieve alignment between the aspherical recess and the rod-shaped core.

Abstract: A method is disclosed for the sealing of hard shell capsules having coaxial body parts which overlap when telescopically joined. Also described is an apparatus to seal the capsules. The method comprises the steps of holding the capsule in a precise and upright position and injecting a known quantity of sealing fluid in the overlap of the body parts. An apparatus for performing the method is also disclosed. The apparatus comprises a sealing clamp (1, 11, 21, 31, 41, 51, 61) to hold the capsule in an upright position and means (5, 15, 25, 35, 45, 55, 65) to inject the sealing fluid in the overlap of the body parts.

Abstract: Injection molding tool for the manufacture of a plastic element sheathed with a sheet-metal shell (8), where the gate (12) which is designed as an integral part of the lower mold half (9) for correct positioning and supply of the plastic melt projects beyond the inner surface of the mold half (9) into the sheet-metal shell having a positioning opening (14), such that the plastic melt is discharged inside the sheet-metal shell and does not flow past it.

Abstract: A method of forming a plurality of reflectors for a light emitting device (LED) package includes receiving a first fluid material at at least a first source opening of an upper mold of a transfer apparatus; passing the first fluid material through a transfer passageway of the upper mold; expelling the first fluid material from the transfer passageway through a plurality of openings in a lower internal surface of a transfer chamber of the transfer passageway; depositing the first fluid material on a lead frame, disposed on a lower mold of the transfer apparatus, through the plurality of openings; forming the first fluid material into a plurality of molded structures using the upper mold and the lower mold; and hardening each of the molded structures to form a plurality of reflectors.

Abstract: A directional conductivity nanocomposite material, apparatuses and processes for making such material are generally described. A directional conductivity nanocomposite material may comprise a supporting material such as ceramic or polymer, with directionally conductive nanorod structures running through the supporting material. The material may be made by orienting nanorods in an electrophoretic gel using an electrical or magnetic field to align the nanorods, removing the gel, reinforcing the nanorods, and flowing in supporting material.

Abstract: To provide an eraser molding toy with which it is possible to mold an eraser having a colored pattern or design, a plurality of thermofusible eraser members 1 of differing colors are placed in succession inside a molding container 2 so as to form a required pattern or design etc., and the molding container 2 is heated in order to fuse the surfaces of the eraser members 1 together to mold an eraser P having a colored pattern or design in the mold shape of the container.

Abstract: To provide an eraser molding toy with which it is possible to mold an eraser having a colored pattern or design, a plurality of thermofusible eraser members 1 of differing colors are placed in succession inside a molding container 2 so as to form a required pattern or design etc., and the molding container 2 is heated in order to fuse the surfaces of the eraser members 1 together to mold an eraser P having a colored pattern or design in the mold shape of the container.

Abstract: The present invention relates to an assembly of a mold (14) and a motor vehicle cross-member (12), the cross-member including a portion for overmolding (20) that is designed to be placed in the mold, a portion that is designed to be situated outside the mold, and at least one reception zone (22, 24) for receiving a wall portion of the mold (26, 28), the reception zone being interposed between said two portions of the cross-member. The wall portion of the mold and the reception zone are essentially complementary in shape and the cross-member presents, in the reception zone, at least one offset (34, 36) relative to a reference surface following the general outline of the cross-member. The invention also provides a motor vehicle front panel that forms an overmolded part made using the above-defined assembly.

Abstract: Method and apparatus for potting an electronic device. The apparatus comprises an enclosure having a first inner volume with the electronic device disposed therein; a fill control element disposed within the first inner volume, wherein a second inner volume of the fill control element is fluidly coupled to the first inner volume; and a sealant disposed within a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, wherein air is trapped within at least a first portion of the second inner volume.

Abstract: A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.

Abstract: The complementary parts of food products destined to be coupled together are located on the frontal surfaces of half-moulds travelling on two different loop conveyor lines. The first conveyor line extends, at least partially, above the second, so to be included within the surface area occupied by the second line itself. Spatial occupation is further reduced since, downstream to the coupling station, the coupled half-moulds travel with the same spacing step that they had before coupling, with additional advantages in terms of energy absorption and advancing velocity in a successive thermal conditioning station, such as a refrigerating tunnel. One of the half-moulds can be removed upstream to the thermal conditioning station, resulting in an additional reduction in energy absorption since needless subjecting of the half-mould to the thermal cycle to which the products are subjected is avoided.

Abstract: A cradle mount assembly for use in vehicle is provided including at least two inserts having at least two rate plates connected to each respective insert. The rate plates connected to the inserts by means of a connection or structural portion. A mold provided to mold plastic, polymer or other suitable material around the at least one insert and the at least one rate plate. The mold having structure capable of accepting the connection or structural portion connecting the at least one rate plate to the at least one insert. A method is further provided for the molding process including the steps of connecting the at least one insert and the at least one rate plate to the mold by means of the connection or structural portion. The mold is then formed around the at least one insert and the at least one rate plate.

Abstract: A first mold has a core passage, and first and second cavities in fluid communication with each other at the core passage. A second mold has first and second nozzles therein that inject first and second resins to the first and second cavities, respectively. The core member is slidable within the core passage to provide or block the fluid communication between the cavities, and has a third nozzle therein to inject a third resin to the core passage. The first and second resins are injected into the cavities. The core member is moved to block the fluid communication between the cavities, before injecting the first and second resins is completed. The third resin is injected while moving the core member to provide the fluid communication, after injecting the first and second resins is completed. The molds are separated, thereby yielding a single molded product, such as a vehicle door trim.

Abstract: A directional conductivity nanocomposite material, apparatuses and processes for making such material are generally described. A directional conductivity nanocomposite material may comprise a supporting material such as ceramic or polymer, with directionally conductive nanorod structures running through the supporting material. The material may be made by orienting nanorods in an electrophoretic gel using an electrical or magnetic field to align the nanorods, removing the gel, reinforcing the nanorods, and flowing in supporting material.

Abstract: An apparatus and method are disclosed for manufacturing an electrical connector. A mold is presented having a pair of opposing dies that each define a mold pocket. The mold pockets of each die can be joined to form a mold cavity. Plastic can be injection molded into the mold cavity to form an electrical connector housing.

Abstract: Disclosed is a gypsum board forming device which provides improved slurry spread. The device includes a forming table with an arcuate or angled profile that promotes a uniform slurry spread. An arcuate or angled hinge plate can also be included to further promote the uniform distribution of slurry prior to an extrusion plate. As a result of the improved slurry spread, gypsum board with increased strength and durability can be created.

Abstract: Disclosed is a bus bar of an EPS motor configured to improve a terminal structure of a bus bar to enable an easy assembly between a stator and the bus bar, whereby assemblage and operational reliability can be enhanced, the bus bar that is connected to a stator coil of the EPS motor, the bus bar including: an insulator made of insulation materials that forms a body of the bus bar; a lower terminal protrusively formed at a lower side of a periphery of the insulator, and connected to the stator coil; and an upper terminal protrusively formed at an upper side of the periphery of the insulator, and connected to the stator coil, whereby the terminals of the bus bar are divided to an upper terminal and a lower terminal to enhance assemblage and operational reliability by further obtaining a broader mutually discrete gap.