Means For Transfer Molding Patents (Class 425/544)
  • Patent number: 10485633
    Abstract: The present invention provides an improved root canal filling point/cone that can be manufactured precisely to result in better obturation with less micro-leakage. One aspect of the present invention is directed to a molded root canal filling point/cone. Another aspect of the present invention is directed to a thermo-pressure molding process for manufacturing root canal filing appliances (e.g., Gutta Percha points). Another aspect of the present invention is directed to the structure of the mold for undertaking thermo-injection molding. A further aspect of the present invention is directed to a production line comprising the thermo-injection process.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: November 26, 2019
    Inventors: Nathan Y. Li, DaQing Wu
  • Patent number: 9409325
    Abstract: A plunger is provided. The plunger includes a top plat and a bottom plate coupled to the top plate. A first split ring is provided between the top plate and the bottom plate and is coupled to the top plate. A second split ring is provided between the first split ring and the bottom plate and is coupled to the first split ring.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: August 9, 2016
    Assignee: Caterpillar Inc.
    Inventor: Andrew R. Stodgel
  • Patent number: 9180613
    Abstract: An injection molding system having a shooting pot assembly is disclosed. In one embodiment, the shooting pot assembly is in fluid communication with a mold and has an actuation direction that is substantially perpendicular to an injection axis of material injected into a mold cavity. In another embodiment, a shooting pot actuation system is a mounted on a side of a hot runner. In certain embodiments, the shooting pot actuation system includes a linear actuator operatively coupled with the shooting pot assembly to actuate the shooting pot assembly.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: November 10, 2015
    Assignee: Husky Injection Molding Systems Ltd.
    Inventor: Manon Danielle Belzile
  • Publication number: 20150123322
    Abstract: A connecting port arrangement for use in an apparatus for producing a composite material component comprising a base member attached to a surface of a foil adapted to seal a mold of the apparatus for producing a composite material component. The base member is provided with a channel extending therethrough. The connecting port arrangement further comprises a punch member adapted to be inserted into the channel formed in the base member and provided with a cutting device suitable to cut at least one opening into the foil.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 7, 2015
    Inventors: Hauke Seegel, Claus Fastert, Paulin Fideu
  • Patent number: 8968617
    Abstract: A resin flow-controlling apparatus for infusing composite reinforcement material with resin. The resin flow-controlling apparatus may have at least one viscosity valve to speed, slow, allow, or deny resin flow through the viscosity valve to the composite reinforcement material depending on the temperature of the viscosity valve. The viscosity valve may fluidly couple a resin reservoir with an enclosed chamber in which the composite reinforcement material resides. The viscosity valve may be thermally coupled with heating and/or cooling elements selectively variable between at least two different temperatures to affect viscosity of the resin and control resin flow from the resin reservoir into the composite reinforcement material. A vacuum port at an opposite end of the composite reinforcement material from the viscosity valve may fluidly couple with the enclosed chamber and a vacuum source may pull atmosphere and/or resin from the enclosed chamber and/or the resin reservoir.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: March 3, 2015
    Assignee: Spirit AeroSystems, Inc.
    Inventors: Mark A. Wadsworth, Adrienne M. Strohmeyer, Khai Nguyen
  • Patent number: 8911229
    Abstract: An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: December 16, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Yun Lee, Seong Wook Cheong, Byeong Kap Choi, Sang Jin Choi
  • Patent number: 8851875
    Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: October 7, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Young-jin Hwang
  • Patent number: 8827690
    Abstract: A hollow body molding device having molten resin injected into a main cavity, fluid is pressure-injected through a pressure port after the injection of molten resin, a floating core moves to the outlet side, the molten resin is extruded from the outlet simultaneously with the movement of the floating core, and a hollow molded body is molded, the hollow body molding device having a floating core storage portion connected to the main cavity and stores the floating core moved by the pressurized fluid, an auxiliary cavity stores molten resin discharged from the main cavity and the floating core storage portion, communication passages and which communicate the floating core storage portion and the auxiliary cavity with each other; and an opening and closing means that opens and closes the communication passages by sliding movement. In the hollow body molding device, each inlet cross-sectional area B of the communication passages is specified.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 9, 2014
    Assignee: RP Topla Limited
    Inventors: Tomoyoshi Sakamoto, Minoru Ojiro, Takashi Hirose, Yasuhiko Hata, Hiroki Katagiri
  • Publication number: 20140197446
    Abstract: An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 17, 2014
    Applicant: Lextar Electronics Corporation
    Inventors: Shing-Kuo Chen, Bo-Yu Ko, Hsiu-Hsiang Lin
  • Patent number: 8721954
    Abstract: In some examples, a method for densifying a material via pitch comprises inserting the material to be densified into a mold, wherein the mold is part of an apparatus. The apparatus may include a ram configured to apply a ram pressure sufficient to force a pitch into the mold to densify the material, a gas source configured to apply a gas pressure sufficient to force the pitch into the mold to densify the material, and a vacuum source operable to create a vacuum pressure in the mold at least prior to application of either the ram pressure or the gas pressure. The method may further comprise densifying the material in the mold via pitch using a selectable one of the ram, the gas source, the ram and the vacuum source, or the gas source and the vacuum source.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: May 13, 2014
    Assignee: Honeywell International Inc.
    Inventors: Mark L. La Forest, Roger L. Klinedinst, David M. Wright
  • Patent number: 8616869
    Abstract: An in-mold labeling apparatus for an injection-molded product includes a label magazine, a handling tool, an injection mold, and a controller. The injection mold has a suction port disposed in the mold cavity. A pin may be fixedly or movably disposed in the suction port. A method of in-mold labeling an injection-molded product includes applying a static charge to the label using the handling tool, activating the suction port in the mold cavity, deactivating a suction port of the handling tool, and activating the injection molding.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: December 31, 2013
    Assignee: Vention Medical, Inc.
    Inventors: Thomas R. Houdeshell, Bradley A. Atkins
  • Patent number: 8597017
    Abstract: A mold for producing a variety of fenestration members having different predetermined lengths is disclosed. Generally, the mold has a first lineal mold part that has an extended length and a second lineal mold part also having an extended length. The mold may also have mold end parts that are adapted to form end features of the fenestration member. In use, the first lineal mold part and the second lineal mold part fit together to define a profile. The first and second mold end parts can be positioned in a range of positions to define the lengths of a variety of different molded fenestration members.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: December 3, 2013
    Assignee: Anderson Corporation
    Inventors: Troy Rubenzer, Jim Eggert, Dale Thompson, Kathleen Barton, David J. Weiss, Matt Sedivy
  • Patent number: 8342837
    Abstract: There are provided a first mold 2 and a second mold 1 that can be brought into and released from contact with the first mold 2. A substrate 70 provided in both the molds 1, 2 and mounted with electronic components is subjected to resin sealing and molding by filling with resin of cavities formed by both the molds 1, 2. The second mold 1 is placed on a base plate 9 so as to be capable of horizontally reciprocating, and has a cavity block 7 that can be brought into and released from contact with the first mold 2 and a mold clamping mechanism 16 that supports the cavity block 7 and that brings and releases the cavity block 7 into and from contact with the first mold 2 so as to perform mold clamping. On the base plate 9 is provided a horizontal actuation mechanism 11 for moving the second mold 1 to a facing position where the second mold 1 faces the first mold 2 and to a non-facing position where the second mold 1 has been moved sideways from the facing position.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: January 1, 2013
    Assignee: Dai-Ichi Seiko Co., Ltd.
    Inventors: Kenji Ogata, Shin Nagaoka
  • Patent number: 8142611
    Abstract: A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31a, 31b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30b in a direction to depart from the other needle pin 30a. By the sliding unit 33, the interval between the needle pins 30a, 30b can be changed so as to cope with a variation of semiconductor chips 1, 1A.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: March 27, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Motojiro Shibata, Akira Ushijima
  • Patent number: 8127431
    Abstract: A method comprising: a first process of placing a laminated rotor core in a preheating device to preheat the laminated core; a second process of removing the preheated laminated core from the preheating device and disposing the laminated core between upper and lower dies of a resin sealing apparatus; a third process of pressing the laminated core by the upper and lower dies and liquefying resin material in resin reservoir pots by heating; and a fourth process of ejecting the liquefied resin material from the pots into the magnet insertion holes by plungers inserted and moving vertically in the pots and thermally curing the resin material. The method improves efficiency of resin sealing the permanent magnets in the laminated core.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: March 6, 2012
    Assignee: Mitsui High-Tec, Inc.
    Inventors: Katsumi Amano, Kazutoshi Ueda
  • Patent number: 8071005
    Abstract: A casing of a solid-propellant engine comprising a core and a layer of elastomeric material, set as coating for at least part of the core to provide a thermal protection of the core itself is obtained by: inserting the core in a forming mould so as to make within the mould two annular chambers separated from one another by the core; forming a strand of elastomeric material; obtaining a defined portion of elastomeric material by cutting the strand transversely to size in an external environment; and injecting the cut portion of elastomeric material simultaneously within both of the annular chambers.
    Type: Grant
    Filed: June 11, 2008
    Date of Patent: December 6, 2011
    Assignee: AVIO S.p.A.
    Inventor: Giuseppe Magistrale
  • Patent number: 8029720
    Abstract: A resin molten in a pot portion 59 is molded by being loaded via a gate 48 into a cavity, which has a rectangular parallelepiped shape in plan view and is formed of both molds 1 and 2, which are a second mold 2 and a first mold 1 that can make or release contact with the second mold 2. The pot portion 59 is provided at either one of the molds 1 and 2 and constituted of recess portions 54c located at prescribed intervals at the cavity. The recess portions 54c have a bottom surface constituted of part of a moving member 60 movable toward an opening portion. The gate 48 is structured so that one side of the cavity and the long side of the pot portion 59 are connected with each other.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: October 4, 2011
    Assignee: Dai-Ichi Seiko Co., Ltd.
    Inventors: Kenji Ogata, Yoshihiro Mitsui
  • Patent number: 7950133
    Abstract: A method comprising: a first process of placing a laminated rotor core in a preheating device to preheat the laminated core; a second process of removing the preheated laminated core from the preheating device and disposing the laminated core between upper and lower dies of a resin sealing apparatus; a third process of pressing the laminated core by the upper and lower dies and liquefying resin material in resin reservoir pots by heating; and a fourth process of ejecting the liquefied resin material from the pots into the magnet insertion holes by plungers inserted and moving vertically in the pots and thermally curing the resin material. The method improves efficiency of resin sealing the permanent magnets in the laminated core.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: May 31, 2011
    Assignee: Mitsui High-Tec, Inc.
    Inventors: Katsumi Amano, Kazutoshi Ueda
  • Publication number: 20110111082
    Abstract: A resin molding device includes a lead plate and a first resin molding member. The lead plate includes patterns. Each of the patterns includes a base, a plurality of lead pairs; and a lead connection portion. Each of the lead pairs includes a first lead and a second lead. The first resin molding member is integrally formed with the base and the lead pairs. The first resin molding member defines a recessed portion at a mounting side surface on the base where a light emitting device is to be mounted. The recessed portion is formed to open upwardly and to have a side surface. The lead pairs are partially exposed at a bottom surface area of the recessed portion. The first lead or the second lead is capable of mounting a protection device thereon such that the protection device is covered by the first resin molding member.
    Type: Application
    Filed: January 17, 2011
    Publication date: May 12, 2011
    Applicant: NICHIA CORPORATION
    Inventor: Masaki HAYASHI
  • Patent number: 7931458
    Abstract: Injection structure with a fiber-composite semifinished product for manufacturing a fiber-composite component, having a gate device for feeding matrix material, a distribution fabric, and a barrier layer that is impermeable to the matrix material, wherein the distribution fabric is arranged between the gate device and the fiber-composite semifinished product, and the barrier layer is arranged between the distribution fabric and the fiber-composite semifinished product, as well as device for manufacturing a fiber-composite component by this injection structure.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: April 26, 2011
    Assignee: EADS Deutschland GmbH
    Inventors: Thomas Lippert, Hans-Wolfgang Schroder, Franz Stadler, Stefan Utecht
  • Patent number: 7927087
    Abstract: An apparatus and process are provided for molding electronic devices in a mold, which apparatus comprises at least one runner in the mold connected to a mold supply pot for channeling a molding compound from the mold supply pot to the electronic devices. A plunger assembly is also provided that comprises a main body, and a supplementary body configured to be movable relative to the main body. The plunger assembly is locatable in the mold supply pot and is drivable in a direction towards the runner for forcing the molding compound into the runner. In order to avoid or reduce cull formation, a width of the runner at an opening connecting the runner to the mold supply pot is smaller than a width of the main body of the plunger assembly.
    Type: Grant
    Filed: February 7, 2005
    Date of Patent: April 19, 2011
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Xiang Chen, Shu Chuen Ho, Teng Hock Eric Kuah, Si Liang Lu, See Yap Ong
  • Patent number: 7906194
    Abstract: A method for producing optical discs is provided. A substrate for an optical disc is formed by utilizing a molding process. A textured surface is formed at an outer diameter edge of the substrate. A protective coating is applied to cover the textured surface at the outer diameter edge. The protective coating adheres securely to the textured surface at the outer diameter edge to prevent seepage of moisture into the optical disc through the outer diameter edge surface. Thus, an improved optical disc which avoids moisture-caused warpage, corrosion and/or oxidation can be formed.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: March 15, 2011
    Assignee: Cinram International Inc.
    Inventors: Edward Pickutoski, Kenneth James Rinaldi
  • Patent number: 7887313
    Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.
    Type: Grant
    Filed: November 24, 2006
    Date of Patent: February 15, 2011
    Assignee: Dai-Ichi Seiko Co., Ltd.
    Inventors: Kenji Ogata, Masashi Nishiguchi, Kenichiro Imamura
  • Patent number: 7731883
    Abstract: A method for making an article of footwear is disclosed. The method can include a number of steps where various molds are used to attach or mold a tread element onto a substrate or matrix lining. The tread element can be formed by compressing a rubber block between various molding members to liquefy and cause the resulting rubber material to flow into at least one lug cavity disposed near the matrix lining. The rubber material eventually enters the lug cavity and becomes attached to the matrix lining.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: June 8, 2010
    Assignee: Nike, Inc.
    Inventors: Jeffrey L. Johnson, Jang Rae Cho
  • Patent number: 7682140
    Abstract: A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: March 23, 2010
    Assignee: Fujitsu Microelectronics Limited
    Inventors: Futoshi Fukaya, Yoshitsugu Katoh
  • Patent number: 7677874
    Abstract: A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: March 16, 2010
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Zheng Yu Gao, Shu Chuen Ho
  • Patent number: 7653984
    Abstract: A method comprising: a first process of placing a laminated rotor core (13) in a preheating device (18) to preheat the laminated core (13); a second process of removing the preheated laminated core (13) from the preheating device (18) and disposing the laminated core (13) between upper and lower dies (14, 15) of a resin sealing apparatus (29); a third process of pressing the laminated core (13) by the upper and lower dies (14, 15) and liquefying resin material (17) in resin reservoir pots (16) by heating; and a fourth process of ejecting the liquefied resin material (17) from the pots (16) into the magnet insertion holes (12) by plungers (32) inserted and moving vertically in the pots (16) and thermally curing the resin material (17). The method improves efficiency of resin sealing the permanent magnets (11) in the laminated core (13).
    Type: Grant
    Filed: May 29, 2006
    Date of Patent: February 2, 2010
    Assignee: Mitsui High-tec, Inc.
    Inventors: Katsumi Amano, Kazutoshi Ueda
  • Patent number: 7604469
    Abstract: A degating device applied to remove a cull between two chip carriers comprises a lower mold, an upper mold, a blowing-opening, and a cooling pipe. The lower mold is used to load chip carriers and has a plunger set for propping and degating the cull. The upper mold is fit in with the lower mold tightly. The airflow blown out from the blowing-opening blows to lower the temperature around the chip carriers. The cooling pipe is disposed according to the position of the blowing-opening to cool down the temperature around the blowing-opening. The two chip carriers are disposed on the lower mold and fixed between the upper mold and the lower mold while the upper mold combines with the lower mold. By changing the position of the plunger set relative to the upper mold and the lower mold, the cull can be stripped from the chip carriers.
    Type: Grant
    Filed: January 9, 2007
    Date of Patent: October 20, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yun-Lung Chang, Chin-Sung Lee, Chia-Ming Chang, Yu-Chang Tsai
  • Patent number: 7534103
    Abstract: Embodiments of the present invention relates to an injection moulding machine or injection unit and to an injection moulding method for injection moulding plastic materials (e.g., elastomeric materials), particularly according, to cold channel and hot channel techniques, comprising an extruder, a first piston/cylinder unit and a second piston/cylinder unit mounted in series thereto. The cylinder of the first piston/cylinder unit leads into the end of the second piston/cylinder unit located at a distance from an injection mould to be filled. According to an aspect of the invention, the elastomeric material is firstly led by means of the first piston/cylinder unit through the cylinder of the second piston/cylinder unit and into the injection mould, wherein the piston of the second piston/cylinder unit frees the flow path to the injection mould.
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: May 19, 2009
    Assignee: Landshuter Werkzeugbau Alfred Steinl GmbH & Co. KG
    Inventors: Stefan Weyand, Hubert Degenbeck, Rainer Schmidt
  • Patent number: 7481641
    Abstract: To avoid air pockets (voids), for example when embedding semiconductor devices (15) in a plastic package molding compound, process parameters in transfer and compression molding are to be contemporaneously controlled. For this purpose, the tendency for voids to form is observed on the basis of test structures in control cavities (7), which form outwardly directed continuations of the mold cavity (3) of a capillary nature.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: January 27, 2009
    Assignee: Infineon Technologies, AG
    Inventors: Edward Fuergut, Hai Guan Loh
  • Patent number: 7470120
    Abstract: A configurable die detachment apparatus is provided that can be used to handle a wide range of die sizes. The apparatus comprises a pin mounting assembly having a plurality of pin sites for selectively mounting ejector pins in a desired configuration on some of the pin sites and a vacuum enclosure enclosing the pin mounting assembly. The vacuum enclosure has a support platform comprising a plurality of openings that are sized and arranged to accommodate different configurations of ejector pins mounted on the pin mounting assembly, the ejector pins being drivable to project through the openings towards a die to be detached.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: December 30, 2008
    Assignee: ASM Assembly Automation, Ltd.
    Inventor: Yiu Ming Cheung
  • Publication number: 20080298063
    Abstract: A light emitting apparatus includes a plurality of light emitting devices. A first lead and a second lead compose a lead pair. The first and second leads are electrically connected to the light emitting devices. A plurality of the light emitting devices is mounted on the base. The lead pairs are arranged generally symmetrically with respect to the base as the center line of the light emitting apparatus. The first and second leads are electrically insulated from each other. A first resin molding member covers at least parts of the base and the lead pairs. Thus, the first resin molding member, the base, and the lead pairs are integrally formed. A recessed portion is formed in the first resin molding member. The recessed portion is filled with a second resin molding member. The first and second resin molding members are formed of a thermosetting resin material.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 4, 2008
    Applicant: NICHIA CORPORATION
    Inventor: Masaki Hayashi
  • Patent number: 7419627
    Abstract: According to one embodiment of the invention, a co-cured vacuum-assisted resin transfer molding manufacturing method includes providing a tool base, disposing a prepreg skin panel outwardly from the tool base, disposing one or more tooling details outwardly from the prepreg skin panel, and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium between the one or more tooling details and the one or more preforms, enclosing the prepreg skin panel, the one or more tooling details, the one or more preforms, and the high permeability medium with at least one vacuum bag, pulling a vacuum on the vacuum bag, infusing the one or more preforms with a resin, and curing the one or more preforms and the prepreg skin panel.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: September 2, 2008
    Assignee: Northrop Grumman Corporation
    Inventors: Chi Hsien Sheu, Denise M. Shimazu, David Michael Kane
  • Publication number: 20080031995
    Abstract: A hand operated injection molding machine apparatus constructed from prefabricated sub-assemblies and a desired mold clamping means attached to a main support structure, and then electrically integrated with each other
    Type: Application
    Filed: July 27, 2007
    Publication date: February 7, 2008
    Applicant: GALOMB, INC.
    Inventor: David E. Galomb
  • Patent number: 7265453
    Abstract: A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such that corners of the body segments do not include the trapped air.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: September 4, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Steven L. James, Lori Tandy, legal representative, William D. Tandy, deceased
  • Patent number: 7175405
    Abstract: A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a movable die being held by the movable platen; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism turning the screw shaft so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen in the direction crossing the open-close direction of the movable die.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: February 13, 2007
    Assignee: Apic Yamada Corporation
    Inventors: Kazuhiko Kobayashi, Tsutomu Miyagawa, Tomokazu Asakura, Shusaku Tagami, Hideaki Nakazawa, Naoya Gotoh
  • Patent number: 7169345
    Abstract: According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes a second non-planar surface. The first and second non-planar surfaces form upper and lower surfaces of a mold cavity when the first and second mold plates are engaged. The mold tool also includes a distribution system coupled to the mold cavity. The distribution system transfers a mold compound into the mold cavity to substantially encapsulate an integrated circuit. The distribution system includes a gate runner coupled to the mold cavity. The gate runner funnels the mold compound into the mold cavity. The distribution system also includes a bridge insert that decreases wear on the gate runner as the mold compound is transferred through the gate runner.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: January 30, 2007
    Assignee: Texas Instruments Incorporated
    Inventor: Selvarajan Murugan
  • Patent number: 7156633
    Abstract: A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: January 2, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Todd O. Bolken, David L. Peters
  • Patent number: 7029257
    Abstract: Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: April 18, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-soo Lee, Dae-sung Lee, Kyung-soo Park
  • Patent number: 7005101
    Abstract: The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so that the leadframe space acts as a virtual gate. This reduces the need for trimming and lowers stress on the finished package.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: February 28, 2006
    Assignee: Texas Instruments Incorporated
    Inventor: Selvarajan Murugan
  • Patent number: 6981859
    Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: January 3, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shingo Okuyama, Tadahiro Nakagawa, Takehiko Miura, Makoto Fukuda
  • Patent number: 6942478
    Abstract: The present invention relates to a packaging mold with electrostatic discharge protection comprising a pot block and at least one receiver. The pot block comprises a plurality of pots and runners. Each of the pots branches and connects the runners for injecting molding compound into the runners through the pots. The receiver for supporting a plurality of substrate plates connects the runners for receiving the molding compound from the runners to package the dice on the substrate plates. Each receiver comprises a receiving surface contacting the substrate plate; wherein the receiving surface is roughened to reduce static electric charges generated when separating the substrate plates and the packaging mold. Additionally, the surfaces of the runners are roughened to reduce static electric charges generated in the runners when separating the molding compound and the runners. It prevents the dice packaged from damage due to static electric charges to raise the yield rate of semiconductor package products thereby.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: September 13, 2005
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Meng-Tsang Lee, Kuang-Lin Lo
  • Patent number: 6908293
    Abstract: In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: June 21, 2005
    Assignees: NEC Electronics Corporation, Asahi Engineering K.K.
    Inventors: Ichirou Furuta, Akira Kajiwara
  • Patent number: 6899533
    Abstract: A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: May 31, 2005
    Assignees: Casio Computer Co., Ltd., Oki Electric Industry Co., Ltd.
    Inventors: Yasuo Tanaka, Jiro Matsumoto
  • Patent number: 6887418
    Abstract: Post-mold cooling of injection molded plastic articles such as preforms is achieved by transferring the articles directly from the mold cavities onto cooling cores carried by a take-out plate. The molded articles are supported on the cooling cores until they become sufficiently frozen that they can be stripped from the cores.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: May 3, 2005
    Assignee: Mold-Masters Limited
    Inventors: George Olaru, Robert Sicilia
  • Patent number: 6863516
    Abstract: A method and apparatus for reducing or eliminating the formation of air pockets or voids in a flowable material provided in contact with at least one substrate. The flowable material is provided in a non-horizontal direction and flows from a lower portion to an upper portion. As a result, the flowable material is provided uniformly with a single, uniform flow front due to gravity acting thereon and gravity thereby substantially preventing voids and air pockets from forming in the flowable material. In one embodiment, the at least one substrate is provided in the cavity of a transfer mold in which the cavity is filled from a gate at a lower portion of the cavity to a vent at an upper portion of the cavity. In another embodiment, a bumped semiconductor device is attached to a substrate having a gap therebetween, in which the gap is oriented longitudinally perpendicular to a horizontal plane so that the flowable material may fill the gap in a vertical direction.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: March 8, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Vernon M. Williams
  • Patent number: 6857865
    Abstract: A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold has a recessed cavity for receiving the fixture therein, and adapted to be engaged with the top mold, wherein a resilient member is disposed on an inner wall of the recessed cavity, and interposed between the fixture and the recessed cavity of the bottom mold, allowing the resilient member to provide a resilient force for properly positioning the fixture. By using the above mold structure, chips mounted on a substrate can be firmly supported in the mold structure without causing chip cracks during a molding process for encapsulating the chips.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: February 22, 2005
    Assignee: UltraTera Corporation
    Inventors: Chung-Che Tsai, Wei-Heng Shan
  • Patent number: 6840751
    Abstract: A die mold machine for molding a plurality of semiconductor assemblies on multiple substrate/leadframes includes a plurality of die mold layers stacked vertically one above the other to form a plurality of die mold sections. The top die mold layer has at least one aperture or die hall in the top most die layer and apertures or die halls in the in-between layers for passing molding compound which flows through the die hall in the top layer down through the die halls or apertures between the die mold layers into the die mold sections for molding semiconductor assemblies on said substrate/leadframes between said die mold layers.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: January 11, 2005
    Assignee: Texas Instruments Incorporated
    Inventor: Akira Matsunami
  • Patent number: 6773247
    Abstract: A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.
    Type: Grant
    Filed: November 2, 2000
    Date of Patent: August 10, 2004
    Assignees: Towa Corporation, Shimizu Co., Ltd.
    Inventors: Michio Osada, Keiji Maeda, Yoshihisa Kawamoto, Yoshiji Shimizu, Toshiyuki Nishimura, Susumu Yamahara
  • Patent number: 6755634
    Abstract: An apparatus and related techniques for making a golf ball having one or more deep dimples are disclosed. The apparatus is a molding assembly for making a golf ball which includes a mold body that defines a molding cavity. The molding cavity is adapted to accommodate and preferably retain a golf ball core during a molding operation of one or more layers about the core. The molding assembly includes at least one material flow inlet, at least one material flow channel extending between and providing fluid communication with the material flow inlet and the molding cavity. The molding cavity includes at least one outwardly extending protrusion that forms a deep dimple that extends through the cover of the golf ball to and/or into the underlying component of the golf ball upon molding. The outwardly extending protrusion has a height greater than or equal to the thickness of the cover.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: June 29, 2004
    Assignee: Callaway Golf Company
    Inventors: Michael J. Tzivanis, David M. Melanson, Vincent J. Simonds, Thomas J. Kennedy, III