Abstract: An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complementary channel communicating with the injection circuit. The injection circuit includes at least one injection cavity for housing the chip, at least one transfer chamber from which the encapsulation material is injected, and at least one injection channel connecting the transfer chamber to the injection cavity. The blind complementary channel is formed between the two parts of the mold and forms at least one appendage of encapsulation material that is connected to the encapsulation material that fills the injection circuit. Also provided is a method for injection molding an encapsulation material to encapsulate at least one integrated circuit chip.

Abstract: An injection molding apparatus includes a vessel, mold, pusher, and thrust providing section. The vessel stores a molding material and has a nozzle hole which is formed in the bottom portion to inject the molding material and a first seal surface formed around the nozzle hole. The mold is made up of stacked members stacked on the lower side of the vessel and is filled with the molding material injected from the vessel. The mold has a sprue communicating with the nozzle hole and a second seal surface formed around the sprue. The stacked members respectively have third seal surfaces at portions where the members are in contact with each other. The pusher pressurizes the molding material in the vessel. The thrust providing section provides a thrust to the pusher to pressurize one of the pusher and the mold through the molding material in the vessel.

Abstract: A resin molding apparatus including a holder for controllably holding and releasing a lead frame having a first and second principal surfaces and a plurality of elements mounted on at least one of the first and second principal surfaces. The resin molding apparatus also includes a transporter for transporting the holder with the lead frame from a first position via a second position to a third position. Further it has a first and second molding dice controllably adjoining the first and second principal surfaces of the lead frame arranged on the second position, respectively, so that a molding cavity is defined therebetween, which covers the element of the lead frame. A resin injector is provided for injecting resin into the molding cavity; and also an elevator is arranged on the second position for elevating the holder with the lead frame in a direction perpendicular to the first and second principal surfaces.

Abstract: A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.

Abstract: A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.

Abstract: Disclosed are a resin material supply apparatus and a method thereof ensuring a predetermined amount of resin material to be supplied and the molding quality to be improved without the need of storing many types of tablets or managing products by separation of damaged ones or by other methods.

Abstract: A mold for manufacturing semiconductor packages, which allows leadframes to be easily separated from a top mold section after a molding process by utilizing eject pins therein. The mold includes a bottom mold section having housing parts on the upper surface so as to allow leadframes to be placed in a flat state therein, and a top mold formed with transports therethrough. The top mold also incorporates runners formed along a lower surface with connections to the transports to introduce encapsulation material into select regions. A plurality of gates and cavities for molding the semiconductor packages are in flow communication. The eject pins are reciprocally mounted in the top mold section contiguous with the runners thereof to facilitate separation of the leadframes from the top mold.

Abstract: A method for tracking multiple SKUs of ophthalmic devices in a manufacturing line, comprises the steps of: assembling first molding devices, at least one of the first molding devices having an identification device, such as, a bar-code or an inductive transmitting/receiving device; reading the identification device of the first molding devices; forming first molded parts using the first molding devices; providing a plurality of carriers, the carriers having carrier indicators; transferring the first molded parts to at least one of a plurality of carriers; reading the carrier indicator of the carrier carrying the first molded parts; and storing in machine-accessible memory the information associated with the identification device of the first molding devices and the information associated with the carrier indicator of the carrier carrying the first molded parts.

Abstract: A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injection zone of the resin, a slit between the perimeter portion of the metal frame and the central pad. Resin flows through an inlet channel of the mold and through the slit to fill the upper and lower cavities. An edge of the central pad defining the slit is bent upward to form a spoiler intercepting the resin stream so that part of the resin is directed toward the lower cavity. The inner edge of the upper half shell of the mold defining the internal cavity along the injection side of the resin is inwardly offset.

Abstract: An apparatus and related techniques for making a golf ball having one or more deep dimples are disclosed. The apparatus is a molding assembly for making a golf ball which includes a mold body that defines a molding cavity. The molding cavity is adapted to accommodate and preferably retain a golf ball core during a molding operation of one or more layers about the core. The molding assembly includes at least one material flow inlet, at least one material flow channel extending between and providing fluid communication with the material flow inlet and the molding cavity. The molding cavity includes at least one outwardly extending protrusion that forms a deep dimple that extends through the cover of the golf ball to and/or into the underlying component of the golf ball upon molding. The outwardly extending protrusion has a height greater than or equal to the thickness of the cover.

Abstract: A resin transfer molding (RTM) process is disclosed for rapidly filling a fibrous preform and/or a rigid, porous body with high viscosity resin or pitch. The process is suitable for impregnated multiple porous bodies stacked in a single mold. The process uses a fibrous preform or rigid porous body which is placed into a mold matching the desired part geometry. A resin is injected into the mold at temperature and pressure. After cooling, the infiltrated component is removed from the mold. The mold is constructed from two halves fitted to form at least one mold cavity. A gate fitted with a nozzle is set into one of the mold halves, and a valve admits resin or pitch into the gate area. Venting or vacuum can be applied to the mold. The mold is held in a hydraulic press and an extruder, optionally fitted with an accumulator, supplies molten resin or pitch to the mold.

Abstract: A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavity insert, forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. Generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section is prevented, and, consequently, a resin-sealing mold with high reliability is produced.

Abstract: A hydrostatic injection molding apparatus and process are provided for thermoplastic materials, especially thermoplastic elastomers. The apparatus includes a hot pot plate with a transfer chamber for receiving a thermoplastic material. The hot pot plate is heated to maintain the thermoplastic material in the transfer chamber in a molten state. A cavity plate is positioned adjacent the transfer pot plate, the cavity plate is formed with a plurality of cavities extending therein. Gates are formed in the hot pot plate and the cavity plate. The gates in the respective plates register with one another to provide communication between the transfer chamber and the cavities. The cavity plate is cooled to enable a rapid curing of the thermoplastic material therein.

Abstract: An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.

Abstract: An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.

Abstract: A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: The method of resin molding and a resin molding machine are capable of uniformly control amount of the resin for molding a work piece and pressure of the melted resin. A parting face of one of molding dies, which includes a pot and a cavity, is covered with release film. A work piece to be molded is set in the cavity. Resin is set in the pot. Parts of the release film, which enclose the work piece except a resin path, are clamped by the molding dies. Capacity of the cavity is reduced when the parts of the release film are clamped. The resin is sent from the pot to the cavity so as to mold the work piece in the cavity.

Abstract: An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.

Abstract: An injection molding apparatus and a method of encapsulating integrated circuits which include a plurality of molding presses, such as transfer molding presses for encapsulating integrated circuits, which are mounted on an indexable rotary table. Stationary loading and unloading stations are arranged at spaced angular locations around the table for loading an insert into the mold cavities. A controller is provided to rotate with the molding presses for individually controlling function thereof such as opening and closing of the presses and temperature and pressure in the molds.

Abstract: A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.

Abstract: A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.

Abstract: The invention provides a resin-sealing apparatus that is operated with a low pressure and with a low clamping force without void generation and that is favorable for shortening the molding time and reduction of sealing resin consumption. In the resin-sealing apparatus of the present invention, a resin injection inlet of a pot has an opening at the center of the cavity surface of a cavity of a bottom mold that is a component of a mold unit, and a plunger for injecting molten resin in the pot from the opposite side to the resin injection inlet side is provided slidably and airtightly with the inside wall of the pot.

Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.

Abstract: The invention relates to a mould part of a mould for encapsulating electronic components mounted on a carrier, composing at least one mould cavity provided in said mould part and at least one runner for moulding material connecting to said mould cavity, wherein the gate from said runner to said mould cavity has an oblong shape. The invention also relates to a mould with at least one such mould part. The invention also provides a method for encapsulating electronic components mounted on a carrier, wherein the liquid moulding material is fed into the mould cavity through a wide supply opening. Finally, the invention also provides an encapsulated electronic component mounted on a carrier, which component is manufactured by this method.

Abstract: The casting chamber for a die casting machine includes a casting chamber jacket in which, over its entire length, there is provided an inner jacket defining the sliding surface for the pressure piston. In order for excessive heat in the inner jacket to be uniformly distributed and passed to the casting chamber jacket, copper rings are inserted in the inner jacket (3), the latter being pressed against the casting chamber jacket by means of screws threaded into a conical wedge. In this manner, heat distortion of the casting chamber can, for the first time, be held within limits, without requiring an oil or water cooling apparatus.

Abstract: An injection molding machine with a vertically displaceable closing unit, comprises a plate-like lower yoke as the counterpressure plate; a plate-like upper yoke as the stationary mold clamping plate; at least three vertically aligned struts connecting the lower yoke and the upper yoke with each other in a force-locked manner; as well as another plate-like element serving as the displaceable mold clamping plate, which is displaceable on the struts by one or more driving cylinders having a small cross section and a large stroke length. The displaceable mold clamping plate is displaceable by one or more driving cylinders stopped on the displaceable mold clamping plate and on the counterpressure plate, such that molding tool halves arranged on surfaces of the mold clamping plates can be driven from a maximum spacing into a position of mutual abutment, and vice-versa.

Abstract: A resin plunging apparatus for molding resin to seal an electronic device, in which a ball screw is rotated to move a movable base plate and two load elements at the movable base plate, enabling a plunger holder which is supported on the load elements to be moved with the movable base plate along guide bars, so that plungers which are securely mounted on the plunger holder are positively smoothly forced into cavities in upper and lower molds to plunge resin tablets.

Abstract: An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complementary channel communicating with the injection circuit. The injection circuit includes at least one injection cavity for housing the chip, at least one transfer chamber from which the encapsulation material is injected, and at least one injection channel connecting the transfer chamber to the injection cavity. The blind complementary channel is formed between the two parts of the mold and forms at least one appendage of encapsulation material that is connected to the encapsulation material that fills the injection circuit. Also provided is a method for injection molding an encapsulation material to encapsulate at least one integrated circuit chip.

Abstract: In the method of resin molding of the present invention, air can be perfectly discharged from a specific area of a molding die including cavities, resin paths, pots, etc. so as to mold high quality products. The method comprises the steps of: covering a specific area of a molding die, in which air is left, with release film; clamping a work piece and the release film between an upper die and a lower die of the molding die so as to air-tightly seal the specific area; discharging the air from the sealed specific area; and filling a molding section with resin.

Abstract: The pressing method includes the first step of displacing a sub-piston provided within a sub-cylinder from its initial position to press working fluid such that the working fluid is introduced via a check valve into a main cylinder to displace a main piston provided therein, and the second step of causing the sub-piston to return to the initial position such that the working fluid is supplied to the sub-cylinder. The first and second steps are repeated successively until the working fluid in the main cylinder attains a prescribed pressure level. With this method, variation in the way of pressing an object is alleviated, contamination due to the working fluid is prevented, and downsizing of the pressing mechanism is enabled.

Abstract: A method and apparatus for reducing or eliminating the formation of air pockets or voids in a flowable material provided in contact with at least one substrate. The flowable material is provided in a non-horizontal direction and flows from a lower portion to an upper portion. As a result, the flowable material is provided uniformly with a single, uniform flow front due to gravity acting thereon and gravity thereby substantially preventing voids and air pockets from forming in the flowable material. In one embodiment, the at least one substrate is provided in the cavity of a transfer mold in which the cavity is filled from a gate at a lower portion of the cavity to a vent at an upper portion of the cavity. In another embodiment, a bumped semiconductor device is attached to a substrate having a gap therebetween, in which the gap is oriented longitudinally perpendicular to a horizontal plane so that the flowable material may fill the gap in a vertical direction.

Abstract: A resin molding machine is capable of preventing molded products from forming resin flash on their surfaces. The resin molding machine includes a press section, a loading section, an unloading section, an accommodating section, a film feeding section, and an air sucking mechanism. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.

Abstract: The method of manufacturing semiconductor devices is capable of efficiently manufacturing semiconductor devices and preventing production of bad products. The method is executed in a molding machine including an tipper die and a lower die, in one of which a plurality of cavities corresponding to resin-molded parts of the semiconductor devices are formed. And, the method comprises the steps of: covering inner faces of the cavities and a parting face of one of the dies, which contacts a substrate of the semiconductor devices, with release film, which is easily peelable from the dies and resin for molding; clamping the substrate with the dies; filling the resin in the cavities; and forming the semiconductor devices by cutting the molded substrate.

Abstract: In a resin-sealing mold of a semiconductor device, each of the upper and lower molds is provided with: a first cavity insert for forming a cavity side face portion; a first elastic post for supporting the first cavity insert; an elastic plate, built in the first cavity insert, for forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post for supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. It becomes possible to prevent the generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section, and consequently to provide a resin-sealing mold with high reliability.

Abstract: A molding die used for concurrently packaging semiconductor chips in a large piece of synthetic resin has a cavity rectangular in cross section and having two long peripheral lines and two short peripheral lines for accommodating a circuit panel where the semiconductor chips are mounted, melted synthetic resin is supplied through a gate extending along one of the long peripheral lines to the cavity so that the melted synthetic resin smoothly flows over the cavity, and the smooth flow prevents the molded product from voids and a wire weep.

Abstract: A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.

Abstract: A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the lead frame. The gasket has grooves formed therein which are defined by projections between adjacent grooves. The depth of each groove is slightly greater than a thickness of the leads. When the gasket is compressed prior to injection of an encapsulation material, the gasket material deforms such that the projections sealingly fill the spaces between leads and the cross-sectional shape of each groove is substantially the same as the cross-sectional shape of the respective lead disposed within the groove.

Abstract: A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the lead frame. The gasket has grooves formed therein which are defined by projections between adjacent grooves. The depth of each groove is slightly greater than a thickness of the leads. When the gasket is compressed prior to injection of an encapsulation material, the gasket material deforms such that the projections sealingly fill the spaces between leads and the cross-sectional shape of each groove is substantially the same as the cross-sectional shape of the respective lead disposed within the groove.

Abstract: A flash-free mold structure is designed for use in the molding of an encapsulant for encapsulating a semiconductor die. The flash-free mold structure includes a first molding piece and a second molding piece. The second molding piece is formed with a resin passage for an encapsulating material to flow therethrough during molding process. It is a characteristic feature of this flash-free mold structure that a cutaway portion, which can be either an one-step cutaway portion or a multi-step cutaway portion, is formed at the rim of the resin passage. The cutaway portion is dimensioned significantly smaller than the resin passage for the retarding the flow speed of the encapsulating material from the resin passage into the cutaway portion during the molding process, thereby preventing the encapsulating material from entering the fissure in the junction between the first and second molding pieces. The resin passage can be either a cull, a runner, or a subrunner defined by the first and second molding pieces.

Abstract: In the surface of a lower die 104 in a resin sealing mold, a region where an external leads 18 of a lead frame 12 and its peripheral regions having a width of 0.1 mm are mirror-finished to form a mirror-face region 22. The other region than the mirror-face region is subjected to discharging processing to form a satin-finished region 24. The resin-sealing mold having such a structure permits a package to be smoothly released and prevents resin from remaining.

Abstract: A transfer molding apparatus, wherein a top-half mold and a bottom-half mold form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any of the plurality of cavities.

Abstract: A transfer/injection molding apparatus and process is defined that includes a charge forming unit. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. The charge forming unit includes a cutter for cutting sheet material into strips and a wind-up fork for rolling the strips into wrapped charges. The wrapped charges are formed by winding the strips around prongs extending from the wind-up fork. Further, the fork is attached to a robotic arm which loads the wrapped charge into the molding die.

Abstract: A molding apparatus for use in forming a flexible substrate based package comprises a plurality of pots. Two flexible substrates are installed at two sides of the pots. A plurality of sets of chips mounted on the upper surface of the substrate wherein each set of chips is in an array arrangement. The molding apparatus further comprises a plurality of runners. Each runner independently extends from one side of the pot to one side of the substrate, and connects to a cavity of a upper part of a mold disposed on the substrate through a gate. The present invention characterized in that, the molding apparatus is provided with a first communication channel formed corresponding to one side of the substrate and a second communication channel formed corresponding to the other side of the substrate. The first and the second communication channels interconnect the cavities at two opposite sides thereof.

Abstract: A semiconductor chip mounted on a lead frame is sealed in a synthetic resin package through a molding process, and pressure is applied to synthetic resin softened from granular synthetic resin so as to evacuate the air from the synthetic resin before injecting the synthetic resin into cavities formed in a molding die, thereby preventing the synthetic resin package from void.

Abstract: A resin sealing method for a chip size package electrically connected to electrodes of a semiconductor chip in a chip face of the semiconductor chip with one end of leads joined and the other end thereof exposed to an outer face of a sealing resin for sealing the chip face as connection parts to a package substrate, includes the steps of: providing a first transfer mold formed with a cavity recess in which an object to be molded including the semiconductor chip joined to leads is set, and a second transfer mold mated with the first transfer mold; setting the object to be molded in the cavity recess with a transfer mold face containing the cavity recess of the transfer mold; covering the mold face of the first and second mold with release films having flexibility and heat resistance, respectively; clamping the object to be molded with the transfer mold face of the second mold; and filling the cavity of the first mold with a resin for sealing the package with the resin.

Abstract: An improved mold system (20) is provided. The mold system (20) includes a mold (30) having a mold cavity (28). A pot (22) is connected to the mold cavity (28) through a boomerang runner system (24). The boomerang runner system may include a boomerang passage (25) having an inner curvilinear surface (44) and an outer curvilinear surface (42).

Abstract: A molding die used for concurrently packaging semiconductor chips in a large piece of synthetic resin has a cavity rectangular in cross section and having two long peripheral lines and two short peripheral lines for accommodating a circuit panel where the semiconductor chips are mounted, melted synthetic resin is supplied through a gate extending along one of the long peripheral lines to the cavity so that the melted synthetic resin smoothly flows over the cavity, and the smooth flow prevents the molded product from voids and a wire weep.

Abstract: A method and an apparatus for forming a panel of packaged integrated circuits is disclosed. A substrate panel having an array of integrated circuits mounted thereon is placed in a mold having a molding chamber. The molding chamber has a multiplicity of adjacent package recesses flowably interconnected by way of a plurality of molding compound flowgates. Each package recess is suitable for receiving at least one associated integrated circuits. A molding compound is passed into the molding chamber by way of a mold gate such that at least some of the molding compound passes through a plurality of different package recesses by way of their associated flowgates. In one embodiment, the mold includes a mold body having a molding chamber with a plurality of ridges that define the multiplicity of package recesses within the molding chamber. The multiplicity of package recesses are flowably interconnected through flowgates formed by the ridges.

Abstract: A transfer molding apparatus with a specially designed cull-block can prevent the occurrence of defective molding caused by the air trapped inside the mold body. This cull-block has a cylindrical protrusion at the center of the cull-block and a circular sunken part along the perimeter of the protrusion. This new design prevents the air remaining behind the front of the fluid molding compound during molding process and finally, promotes the production of semiconductor device package free from molding defects.