With Means To Heat Or Cool Patents (Class 425/547)
  • Publication number: 20140093602
    Abstract: The invention relates to a device for production of dental molded parts from a polymerizable plastic, with a flask (16) and with a heating device (40) for heating the polymerizable plastic in the flask (16). The heating device (40) is movable relative to the flask (16).
    Type: Application
    Filed: December 9, 2013
    Publication date: April 3, 2014
    Applicant: IVOCLAR VIVADENT AG
    Inventors: Wolfgang WACHTER, Walter POKORNY, Gottfried ROHNER, Robert GRUNENFELDER
  • Patent number: 8632335
    Abstract: An injection molding apparatus includes an injecting device, a platform, a mold, and two heat insulation assemblies. The injecting device melts plastic and injects molten plastic into the mold. The platform loads and controls the mold and the injecting device. Each of the heat insulation assemblies includes a metallic plate and a pipe member. The pipe member is mounted in the metallic plate for receiving hot liquid to heat the metallic plate. The mold is sandwiched between two metallic plates of the two heat insulation assemblies. One of the metallic plates is mounted between the mold and the injecting device. The other metallic plate is mounted between the mold and the platform.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: January 21, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Min-Tsang Tseng
  • Patent number: 8628322
    Abstract: A mold apparatus used in injection molding of liquid silicone composition. The mold apparatus is made of several components aiding in the overall process. The mold apparatus has two main sections, a cold section to prevent the liquid silicone from curing and a heated section for curing the liquid silicone. The two sections are separated by a thermal insulating plate. The metering of the flow is achieved by an actuator providing linear movement of a valve pin position in the center of the flow path of the runnerless nozzle resting against a gate orifice. The runnerless nozzle is keep cooled with an annular heat pipe surrounding the body of the runnerless nozzle and circulating a liquid coolant at one end of the runnerless nozzle. The cavity block receive heat from an heating element incorporated in the cavity back plate. Heat is evenly distributed in the cavity block by vaporization.
    Type: Grant
    Filed: February 12, 2012
    Date of Patent: January 14, 2014
    Inventor: Terry L. Schwenk
  • Publication number: 20140008842
    Abstract: Methods, devices and systems for closed mold composite material production may include placing an injection tool connected within a pressure chamber, where the injection tool is connected to a material distribution system within the pressure chamber. The methods, devices and systems may also include injecting material at an injection pressure and an injection flow rate, via the material distribution system, into the injection tool and raising an environment pressure of the pressure chamber during the injection process. The methods, devices and systems may include equalizing an injection tool pressure and the environment pressure and adjusting the environment pressure to a curing pressure to cure the material within the injection tool to form a composite product.
    Type: Application
    Filed: July 9, 2013
    Publication date: January 9, 2014
    Inventors: Eric ESCRIBANO, Eric S. Escribano
  • Publication number: 20140004222
    Abstract: A mould part for an injection moulding tool, said mould part being configured from sintering metal in a sintering process comprising successive sintering of several layers of sintering metal, whereby the cooling channel and the outer mould of the mould part are formed completely or partially, and wherein the outer shape on the mould part comprises a mould surface configured such that it faces towards the mould cavity; and wherein the mould part further comprises a substantially rectilinear channel extending from the mould surface of the mould part until the cooling channel; and wherein there is configured, in the substantially rectilinear channel, a pin which is configured from a material having a coefficient of thermal conductivity which is higher than the coefficient of the sintering metal.
    Type: Application
    Filed: January 24, 2012
    Publication date: January 2, 2014
    Applicant: LEGO A/S
    Inventors: Sven Dalager Sørensen, Ole Therkelsen
  • Patent number: 8616871
    Abstract: A hand operated injection molding apparatus constructed from prefabricated sub-assemblies and a desired mold clamping means attached to a main support structure, and then electrically integrated with each other.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: December 31, 2013
    Assignee: Galomb, Inc.
    Inventor: David E Galomb
  • Publication number: 20130334741
    Abstract: A molding device which can heat molding portions of dies by a simple structure while guaranteeing the durability of the molding portions of the dies, and a method of molding a product using the molding device are provided. A molding device 100 includes a first die 110 and a second die 120 for molding a product PR to be molded. The first die 110 and the second die 120 have a first molding portion 111 and a second molding portion 121 formed at central portions of the surfaces which face each other. Each of the first molding portion 111 and the second molding portion 121 has a three-dimensional shape corresponding to the surface shape of the product PR. Thermal/electrical insulators 113 and 124 are provided around the first molding portion 111 and the second molding portion 121 of the first die 110 and the second die 120.
    Type: Application
    Filed: December 21, 2011
    Publication date: December 19, 2013
    Applicant: CAP Co., Ltd.
    Inventor: Mitsuo Takai
  • Publication number: 20130323348
    Abstract: A heat dissipating assembly of a mold includes an angular pin, a heat pipe, and a liquid passage passing through the angular pin. The angular pin defines a receiving chamber therein. The liquid passage passes through a lower portion of the receiving chamber of the angular pin. The heat pipe includes a condensing section, an evaporation section, and a connecting section interconnecting the condensing section and the evaporation section. The evaporation section is embedded in an upper portion of the receiving chamber opposite to the lower portion. The condensing section is located in the lower portion of the receiving chamber. A mold having the heat dissipating assembly is also provided.
    Type: Application
    Filed: May 27, 2013
    Publication date: December 5, 2013
    Inventors: MING-HSIU CHUNG, NIEN-TIEN CHENG
  • Patent number: 8597018
    Abstract: A weldless-type injection mold apparatus is provided. The weldless-type injection mold apparatus includes an upper mold, a lower mold engaged to the upper mold to form a cavity for injection-molding of products, a heating unit formed on one side of the cavity of at least one of the lower and upper molds to heat a resin injected into the cavity, a first cooling unit formed at the at least one of the lower and upper molds to prevent the injection mold from being over-heated, and a second cooling unit installed between the heating unit to cool an area surrounding the cavity and an injection-molded product.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: December 3, 2013
    Assignees: Namdo Mold Co. Ltd., GNST Co., Ltd.
    Inventor: Hyung Jong Oh
  • Patent number: 8591219
    Abstract: An injection mold assembly for a high output consumer product injection molding machine, the injection mold assembly having a simplified cooling system that is an evaporative cooling system or a cooling system including a hazardous, dangerous, or expensive cooling fluid. The simplified cooling system has a cooling fluid channel that is confined to a mold support plate.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: November 26, 2013
    Assignee: The Procter & Gamble Company
    Inventors: Ralph Edwin Neufarth, Niall D. Robinson, Rainer Scharrenberg, Robert Lawrence Prosise, Charles John Berg, Jr.
  • Patent number: 8591218
    Abstract: A injection device in molding machine is capable of efficiently heating and melting a plurality of charged pellets in a short period of time, and injecting a melting resin with superior quality. The injection device has a cylinder including a pellet supply port, a plunger, a driving unit, a melting instrument with a plurality of melting holes, which are cone-shaped passages, formed in a cylinder-shaped instrument body to communicate from inflow-side large openings to outflow-side small openings, a nozzle provided on an injection side of the cylinder and a heating unit heating the melting instrument. A diameter of the tip-end of the plunger is set to be the same as a diameter of the outflow side face of the melting machine.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: November 26, 2013
    Assignee: Century Innovation Corporation
    Inventor: Hiroaki Kawasaki
  • Patent number: 8585394
    Abstract: A cooling sleeve for receiving a preform comprising a receiving cavity having a receiving opening so that a preform can be inserted into the receiving cavity, and a fluid passage arranged so that when the receiving opening is closed a fluid can be introduced into or removed from the receiving cavity by way of the fluid passage, wherein the cooling sleeve extends along a longitudinal axis and the fluid passage has a passage opening which is arranged near the longitudinal axis and which is arranged opposite the receiving opening. The cooling sleeve allows accelerated cooling of the sprue region of the preform without corresponding noses or markings being formed at the outside of the preform. Arranged in the fluid passage in the region of the passage opening is a support element having a support surface for contacting the preform when the preform is inserted into the cooling sleeve.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: November 19, 2013
    Assignee: MHT Mold & Hotrunner Technology AG
    Inventor: Helmut Thoemmes
  • Patent number: 8585392
    Abstract: Various embodiments provide methods and apparatus for cooling a mold in a compression or injection molding assembly, thereby enabling increased cycling speed and efficiency. Embodiments include a coolant flow path that transports a fluid coolant into and out of a cooling ring around the molding assembly's core. The coolant flow path may divide into several channels within the cooling ring. The coolant flow path may also include a series of stages with varying volumes or cross sectional areas designed to regulate the flow of coolant.
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: November 19, 2013
    Assignee: F&S Tool, Inc.
    Inventor: Thomas D. Barnes
  • Publication number: 20130302457
    Abstract: An injection-molding machine having a stack mold for producing injection-molded parts, has first and second external mold parts and a rotatably mounted central block, the external mold parts each having a distribution plate having a hot runner for the injection material, and mold cavities being formed between molding regions on inner sides of the mold plates of the external mold parts and molding regions being formed on mold plates on opposite outer sides of the central block. At least one gripper is provided. The mold plates of the external mold parts and the central block are held detachably in place. The mold plates of the external mold parts are positionable on the distribution plates to correspond to respective feed channels, and the mold plates of the central block are positionable on the central block to correspond to respective positions of the mold plates of the external mold parts.
    Type: Application
    Filed: May 6, 2013
    Publication date: November 14, 2013
    Inventor: Ulrich Zahoransky
  • Publication number: 20130287883
    Abstract: This relates to an injection-moulding machine comprising a hot runner for feeding a melt into a mould, a shut-off needle for closing or opening the hot runner, a piston connected to the shut-off needle, dividing the housing into first and second chambers, and a covering plate with a first and a second fluid 72 outlet, wherein the housing has a first fluid inlet, which is in connection with the first chamber, and a second fluid inlet, which is in connection with the second chamber, which are arranged in such a way that fluid can be transferred via the first fluid outlet of the covering plate into the first fluid inlet of the housing and fluid can be transferred via the second fluid inlet of the housing, and so fluid can be applied to the piston from both sides.
    Type: Application
    Filed: January 2, 2012
    Publication date: October 31, 2013
    Applicant: MHT MOLD & HOTRUNNER TECHNOLOGY AG
    Inventors: Stefan Schweininger, Christian Wagner
  • Patent number: 8568132
    Abstract: An output of heater means of a tube shaped heater device is set to melt a compound body P suitable for injecting it into a mold cavity. The conditions of temperature and the viscosity of the compound body P is adjusted in a through aperture suitably for theirs injection molding process. Upon descended a pusher shaft, the molten, compound body P is injected by the shaft into the gate and further into the cavity. After the compound body P reaches there, it solidified and changed to an article S.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: October 29, 2013
    Assignee: Satoseiki Co., Ltd.
    Inventor: Toshiomi Sato
  • Publication number: 20130280366
    Abstract: An injection nozzle that can be used in an injection blow molding system without use of an external heat source comprises a two-piece structure broadly including a structural outer body for coupling the nozzle to a resin manifold and a thermally conductive insert. At least a portion of an axial length of the insert has an outer diameter that is less than an inner diameter of a coinciding coaxial portion of the outer body, such that the differences in the inner and outer diameters present an insulating air gap along at least a portion of the nozzle length. A sufficient operating temperature for hot melt resin can then be obtained without use of the external heat source.
    Type: Application
    Filed: May 30, 2013
    Publication date: October 24, 2013
    Inventor: Jincheng Chen
  • Patent number: 8540503
    Abstract: A disk substrate molding apparatus has a disk substrate molding die and a temperature controller. The disk substrate molding die includes a stamper, a first die including a mirror member to which the stamper comes in contact, and a second die including a molding surface which forms a disk-shaped cavity between the molding surface and the stamper. The second die includes a protruding part which protrudes toward the stamper at an outer circumferential part of the molding surface. The temperature controller controls temperature of the second die so that the protruding part exhibits a higher temperature in comparison to a region further toward the inner circumferential side than the protruding part, and controls temperature of the first die so that a region opposite to the protruding part exhibits a lower temperature in comparison to the protruding part in the mirror member.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: September 24, 2013
    Assignee: Panasonic Corporation
    Inventor: Kazuo Inoue
  • Patent number: 8535048
    Abstract: Hot-runner system (100) for use with molding system. Hot-runner system (100) having: heater (102) to generate heat responsive to receiving power. Heat-sourcing component (104) to receive heat from the heater (102) so that the heat that is generated by the heater (102) is transferred, at least in part, from heater (102) to heat-sourcing component (104). Heat-sourcing component (104) becomes heated to an operating temperature. Heat-receiving component (106) being at least partially spaced from the heat-sourcing component (104). The operating temperature of the heat-receiving component (106) being cooler than operating temperature of the heat-sourcing component (104). Non-structurally supportive heat insulator (108) has thermal conductivity being lower than thermal conductivity of air during operation of the hot-runner system (100).
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: September 17, 2013
    Assignee: Husky Injection Molding Systems Ltd.
    Inventors: Patrice Fabien Dezon-Gaillard, Paul Blais, Edward Joseph Jenko
  • Patent number: 8523558
    Abstract: An injection mold (1) may include: an outer block (100) that is mounted and fixed to an injection molding machine and divided into an upper mold (110) and a lower mold (120), an inner block (200) composed of an upper block (230) and a lower block (220) that are replaceably mounted on the upper mold (110) and the lower mold (120), respectively; a metal core (300) mounted in the inner block (200) and has a cavity (310) for forming a molded product (10) with a molded portion having a size of tens to hundreds of micrometers; an ejector (400) coupled to the inner block (200) and removes the molded product (10) in the cavity (310) by moving straight; a driving unit (500) disposed inside the lower mold (120) is moved up/down by hydraulic pressure or pneumatic pressure supplied from the outside, and drives the ejector (400).
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: September 3, 2013
    Assignee: Korea Institute of Machinery & Materials
    Inventors: Jae Ho Jeon, Si Young Choi
  • Patent number: 8512621
    Abstract: In a method for injection molding molten materials, especially plastic, in a mold that has a mold surface which comes into contact with the material, at least one coating on the mold surface and a temperature-control means for the mold surface, the mold surface is cooled by the temperature-control means so that the molten material solidifies at the interface with the coating and an injection-molded part can be removed from the form. During this process the molten material is brought into contact with the coating on the mold surface, the thickness of said coating being selected in coordination with the heat penetration coefficient of the coating material such that a specified 60° gloss level and/or color value L is obtained for the injection-molded part.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: August 20, 2013
    Assignee: OC Oerlikon Balzers AG
    Inventor: Frank Mumme
  • Publication number: 20130209603
    Abstract: An injection molding machine for producing injection molded parts has an injecting station in which melt can be introduced into a cavity of a tool part. The cavity corresponds to the injection molded part. The injection molding machine has further stations in which the injection molded parts can be treated. The injection molded parts can be transported from one station to another station by way a transporting device. The transporting device has at least one transporting path that connects two stations. The injection molded parts are movable from one station to another station on the transporting path.
    Type: Application
    Filed: October 10, 2011
    Publication date: August 15, 2013
    Applicant: OTTO MAENNER INNOVATION GMBH
    Inventor: Hans-Peter Maenner
  • Publication number: 20130202728
    Abstract: An injection molding machine for producing molded parts has a machine table with a base frame on which three supporting elements with a baseplate disposed thereon are arranged. The base plate has a temperature-control element.
    Type: Application
    Filed: October 17, 2011
    Publication date: August 8, 2013
    Applicant: OTTO MAENNER INNOVATION GMBH
    Inventor: Hans-Peter Maenner
  • Patent number: 8500435
    Abstract: A system for the after-treatment of parisons (7) produced in an injection molding mold, comprising at least two after-treatment tools. To provide a system for the after-treatment of parisons produced in an injection molding mold, by means of which a plurality of after-treatment tools can be easily positioned, it is proposed in accordance with the invention that there is provided a positioning device for positioning the first after-treatment tool in at least one positioning direction, and the at least two after-treatment tools are connected together so that with the positioning device for positioning the first after-treatment tool at least one further after-treatment tool can be positioned by suitable positioning of the first after-treatment tool.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: August 6, 2013
    Assignee: MHT Mold Hotrunner Technology AG
    Inventors: Witold Neter, Helmut Thoemmes, Christian Wagner
  • Publication number: 20130177666
    Abstract: A mold-tool system (100), comprising: (i) a hot runner manifold assembly (102), (ii) a plate assembly (104) defining an air-cavity circuit (106), the plate assembly (104) being configured to support and surround, at least in part, the hot runner manifold assembly (102), and the air-cavity circuit (106) surrounding, at least in part, the hot runner manifold assembly (102); and (iii) means for forcing, in use, a relatively cooler air stream to the air-cavity circuit (106), wherein that the air-cavity circuit (106) is configured to: (i) increase, in use, thermal losses of the hot runner manifold assembly (102), and (ii) reduce time to cool down the hot runner manifold assembly (102) relative to heat lost as a result of natural convection associated with the hot runner manifold assembly (102).
    Type: Application
    Filed: October 10, 2011
    Publication date: July 11, 2013
    Applicant: HUSKY INJECTION MOLDING SYSTEMS LTD.
    Inventors: Gregory Ray Hammond, Troy Richard Mercer
  • Patent number: 8454347
    Abstract: A sprue device for an injection mold includes a first part and a second part. The sprue device is sealed and water-cooled so as to reduce overall molding time. The connecting section defines spiral grooves. The second part includes a chassis and an extension from the chassis. The chassis is defined with a through hole, and two gates communicated with the through hole respectively. The spiral grooves mate with the wall of the mounting hole to form a spiral runner. The gates, the through hole, and the spiral runner communicate with each other. An injection mold using the sprue device is also described.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: June 4, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Dian-Hong Wei, Du-Xi Gao, Zhong-Hai Xiao
  • Patent number: 8425826
    Abstract: The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mold cavity, C) filling the mold cavity, and D) curing the encapsulating material in the mold cavity. The temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature carrier. The invention also relates to a device for encapsulating electronic components mounted on a carrier.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: April 23, 2013
    Assignee: Fico B.V.
    Inventor: Johannes Lambertus Gerarus Maria Venrooij
  • Publication number: 20130075951
    Abstract: An aging apparatus and method capable of shortening time for removing molded products from an injection molding device and cooling the same, thereby enhancing production efficiency. The aging apparatus includes an injection molding device configured to produce molded products and allow the molded products to be removed and fall therefrom, a guide pipe to guide the molded products falling from the injection molding device therethrough in such a manner that bottoms of the molded products are directed downwards, a tub mounted below the guide pipe, the tub containing water to cool the molded products falling into the tub through the guide pipe and absorb shock applied to the molded products, and a conveying device to convey the molded products cooled by the water in the tub to the outside.
    Type: Application
    Filed: January 20, 2012
    Publication date: March 28, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Gyeong Su KIM, Kwang Hee Park, Kyung Mo Kang, Sung Gun Baek
  • Patent number: 8403659
    Abstract: An electroformed tooling device is disclosed. The device includes an electroformed tool with electrodeposited metal which has been plated from a structured substrate on a molding side to function as a molding surface and an uneven contour on a non-molding side of the electroformed tool left as a by-product of electroforming. The device also includes a blank base comprising a top surface, a network of thermal management channels, and at least a first opening and a second opening communicating with the network of thermal management channels to allow fluid to flow into the first opening and flow through the network of thermal management channels and flow out the second opening. The top surface further includes an electro-discharge machined contoured surface to mate with the uneven contour on the non-molding side of the electroformed tool. Fluid flowing through the thermal management channels cools or alternately cools and heats the electroformed tool.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: March 26, 2013
    Inventor: Robert E. Szokolay
  • Publication number: 20130062814
    Abstract: A method for manufacturing a product is provided. Inject a molten plastic in a cavity via a channel and a gate of a mold. Form a molten plastic product with a configuration of the cavity. Maintain a preset pressure in the cavity to maintain the configuration of the molten plastic product in the cavity. Slide a dam to into a position of the gate and remove the gate marks from the molten plastic products. Cool and harden the molten plastic product to form a solid product. Release the preset pressure. Move the dam away from the cavity. Eject the solid product out of the cavity.
    Type: Application
    Filed: June 7, 2012
    Publication date: March 14, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: FANG JIANG, FA-YE LI, SHUN-BAI WU, DAI-PING ZHOU, HAO-QUAN WU, PENG TAN, CUI CHEN
  • Publication number: 20130049263
    Abstract: Disclosed is an injection molding mold device for manufacturing a cabinet for a thin display device that allows the cabinet to be molded with no appearance defects being caused on the front face part, even in a case where bosses and ribs are disposed on the rear face part of the cabinet. The injection molding mold device 1 includes a stationary mold half 10 and a movable mold half 20. In a cavity 40, a face 42 formed in the movable mold half 20 corresponds to a cabinet front face 82 of a front cabinet 80. Further, in the stationary mold half 10, a hot runner 30 is disposed in a predetermined location, and an injection port 32 is disposed in a location corresponding to the lateral face end part of a cabinet lateral face 90.
    Type: Application
    Filed: May 13, 2011
    Publication date: February 28, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Ikuo Nakamura, Shunsaku Fuchikawa
  • Patent number: 8360768
    Abstract: Embodiments of the present invention teach a post-mold treatment device and post-mold preform receptacle for use therewith for a post-mold treatment of a preform having a bell-shape. More particularly, an upper portion of a receptacle cavity associated with the post-mold preform receptacle is configured to have the same shape as the transition portion of the preform, and the upper portion is further configured to have a transition-fit size with respect to the transition portion of the preform at the instant that the preform is received from the molding cavity of the injection mold.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: January 29, 2013
    Assignee: Husky Injection Molding Systems Ltd.
    Inventor: Joachim Johannes Niewels
  • Publication number: 20130004708
    Abstract: A molding apparatus includes a cavity mold, a core mold, a core pin, and a cavity pin. After molten resin has been filled in a cavity, at least one of the core pin and the cavity pin is moved to be pressed onto the molten resin so that a part of the molten resin is compressed before the molten resin is cured, and a molded hole is formed by cutting off the compressed part of the molten resin by moving the core pin and the cavity pin.
    Type: Application
    Filed: June 22, 2012
    Publication date: January 3, 2013
    Applicant: SONY CORPORATION
    Inventors: Shun Kayama, Yukiko Shimizu, Atsuhide Hanyu, Susumu Hoshino, Keisuke Kawamura
  • Publication number: 20120313270
    Abstract: Injection molding units and methods of delivering a cooled molding material to portions of an injection molding unit are disclosed. An injection molding unit can comprise a barrel having a feed zone, a feeding portion configured for dispensing a molding material into the feed zone, and a cooling apparatus configured for cooling at least one of the feed zone or the feeding portion to a temperature that is selected to avoid or reduce bridging or obstruction of the molding material. The cooling apparatus can include a jacket configured to cover at least a portion of the feed zone or the feeding portion. The injection molding unit can further comprise an insulation shield. A method can comprise feeding the molding material into the feed zone and cooling the molding material prior to dispensing it into the feed zone or while it is in the feed zone.
    Type: Application
    Filed: April 11, 2012
    Publication date: December 13, 2012
    Applicant: Zimmer, Inc.
    Inventors: Michael Wallick, Brian H. Thomas, Brion R. Mimnaugh
  • Patent number: 8318061
    Abstract: In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: November 27, 2012
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Publication number: 20120292826
    Abstract: In a molding machine, an electrical current is caused to flow to a coil by a high-frequency power supply, and a magnetic field is generated, whereupon lines of magnetic force are generated so as to substantially conform to cavity faces of the stationary mold and the moveable mold. The magnetic field strength is constant with respect to position in the lengthwise direction of the coil, and eddy currents are generated uniformly with respect to the cavity faces. Because the molds have electrical resistance, Joule heat is generated by the eddy currents and electrical resistance, and the cavity faces are heated. When a material in a molten state is injected into the cavities of the heated molds, flowability of the material is promoted, and therefore the quality of the molded article is improved.
    Type: Application
    Filed: September 16, 2011
    Publication date: November 22, 2012
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Ayato Ueha, Susumu Horinaka, Haruka Ito, Yasuki Okanemasa
  • Publication number: 20120294976
    Abstract: An injection molding apparatus is provided. The injection molding apparatus includes a mold, a plate heater mounted to the mold to heat the mold, and a cooling passage provided above or below the plate heater.
    Type: Application
    Filed: May 18, 2012
    Publication date: November 22, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Soo PYO, Jong Won LEE, Jin Hyun CHO, Jin Sub KIM
  • Publication number: 20120294967
    Abstract: A machine for manufacturing an electrode tape is disclosed. The machine includes a conveyor, a conductive structure coil, an adhesive material supply unit and a curing unit. The conveyor includes a molding belt with at least one groove and a roller used to drive the molding belt. The conductive structure coil is adapted to provide a conductive structure to the at least one groove of the molding belt. The adhesive material supply unit is adapted to provide an adhesive material to a surface of the molding belt. The curing unit is adapted to cure the adhesive material provided on the surface of the molding belt into a film.
    Type: Application
    Filed: April 3, 2012
    Publication date: November 22, 2012
    Inventors: Ching-Huang Lin, Rong-Chang Liang, Pei-Chang Tsai
  • Publication number: 20120292823
    Abstract: A low constant pressure injection molding machine forms molded parts by injecting molten thermoplastic material into a mold cavity at low constant pressures of 6,000 psi and lower. As a result, the low constant pressure injection molding machine includes a mold formed of easily machineable material that is less costly and faster to manufacture than typical injection molds.
    Type: Application
    Filed: May 21, 2012
    Publication date: November 22, 2012
    Inventors: Gene Michael Altonen, Charles John Berg, JR., Ralph Edwin Neufarth, Gary Francis Schiller
  • Patent number: 8303285
    Abstract: An injection nozzle having a nozzle body defining an injection cavity and at least one curing device integrally formed within the nozzle body.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: November 6, 2012
    Assignee: Airbus Operations Limited
    Inventor: Jeremy Bradley
  • Patent number: 8297836
    Abstract: Apparatus for measuring the temperature of a nozzle having fluid material injected from an injection molding machine through a flow channel in a heated manifold that is coupled to a nozzle that is coupled to the cavity of a mold, the apparatus comprising: a heating device comprising a controllably heatable thermally conductive heating element; the heating element of the heating device being mounted on or around the outer surface of the tube of the nozzle at an end point; a temperature monitor comprising a temperature sensor mounted on or around the nozzle at a selected position along the axis of the bore of the nozzle; and, a thermal insulator disposed along the axis of the nozzle separating the end point of the heating element and the temperature sensor.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: October 30, 2012
    Assignee: Synventive Molding Solutions, Inc.
    Inventors: John Peter Kuntz, Sebastiaan Hubertus Franciscus Smits, Michael Lewis Vasapoli, Christian Götz, Vito Galati
  • Patent number: 8292611
    Abstract: The cooling assembly comprising several cooling pins (1) that are connected to the same fluid inlet. Each cooling pin (1) is adapted to cool a molded hollow plastic piece (P), and comprises a hollow blowing pipe (2) having a fluid inlet (20a) at one end and at least one fluid outlet (21a) at the opposite end, and fluid boosting means (3) for boosting by Venturi effect the cooling fluid flow at the inlet (20a) of the blowing pipe (2). The cooling assembly can be mounted on a molding machine, and in particular an injection molding machine.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: October 23, 2012
    Assignee: La Seda de Barcelona S.A.
    Inventors: Jan Deckers, Roald Duchateau
  • Publication number: 20120263820
    Abstract: A cooling sleeve for receiving a preform comprising a receiving cavity having a receiving opening so that a preform can be inserted into the receiving cavity, and a fluid passage arranged so that when the receiving opening is closed a fluid can be introduced into or removed from the receiving cavity by way of the fluid passage, wherein the cooling sleeve extends along a longitudinal axis and the fluid passage has a passage opening which is arranged near the longitudinal axis and which is arranged opposite the receiving opening. The cooling sleeve allows accelerated cooling of the sprue region of the preform without corresponding noses or markings being formed at the outside of the preform. Arranged in the fluid passage in the region of the passage opening is a support element having a support surface for contacting the preform when the preform is inserted into the cooling sleeve.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 18, 2012
    Applicant: MHT Mold & Hotrunner Technology AG
    Inventor: Helmut Thoemmes
  • Patent number: 8287273
    Abstract: A color changing apparatus of an injection molding hot runner die which is simple in construction and easily capable of changing colors for molding products without removing and replacing a hot runner. In the apparatus, a passage for supplying a melted resin to a molding die, a divided type hot runner block is provided with hot runners each for exclusive use of each of molding colors, sprues and nozzles being in communication with the hot runners. A moving device is provided for moving the molding die, which is united with the divided type hot runner block, along with the divided type hot runner block. A positioning device is adapted to place the molding die in position in a state where either of the sprues of the divided type hot runner block is moved by the moving device to a position opposed to an injection nozzle for injecting the melted resin.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: October 16, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Hiroaki Isobe, Kouji Takamura, Masaaki Matsuda
  • Publication number: 20120258192
    Abstract: The present invention is a hot runner which is easier and less expensive to manufacture and which has increased capacity. The hot runner is particularly well suited for use with multi-cavity molds. The improved hot runner includes a substantially flat main body having a main melt inlet formed in a center of the main body and a plurality of drops formed in the main body. A plurality of linear distribution channels is formed in the main body with each linear distribution channel intersecting a plurality of drops. The hot runner further includes a plurality of melt channels formed in the main body and communicating with the main melt inlet and the linear distribution channels.
    Type: Application
    Filed: March 17, 2011
    Publication date: October 11, 2012
    Inventor: Rui Novo
  • Patent number: 8282386
    Abstract: An injection molding apparatus includes an inlet component, a plurality of nozzles, and a plurality of hoses, each of which is not heated. The hoses are connected between outlets of the inlet component and respective molding material inlets of the nozzles for conveying molding material from the inlet component to the nozzles. Hoses may also be connected between a rail plate and the nozzles for delivering cooling fluid or actuation fluid for an actuator to and from the nozzles. The nozzles may be fastened to a mold plate of the injection molding apparatus, such as by a threaded bushing. A heated insert may at least partially define the mold cavity to heat molding material in the mold cavity.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: October 9, 2012
    Assignee: Mold-Masters (2007) Limited
    Inventors: Denis Babin, Harold Godwin, Jiping Qian, Yat Kwong Lai
  • Patent number: 8272865
    Abstract: Disclosed is a mold for resin injection molding that can realize rapid heating or cooling. A resin injection molding mold includes a cavity mold and a core mold and is produced on a base plate by metal photofabrication. The cavity mold is provided with a cavity warm water circuit for allowing warm water for heating to flow and a cavity cold water circuit for allowing cold water for cooling to flow. The core mold is also provided with a core warm water circuit and a core cold water circuit. The core mold includes an air blowing passage for feeding warm air or cold air into a resin molding part and a suction passage (36) for sucking a gas within the resin molding part. The resin molding part side of the air blowing passage and the suction passage is formed of a low-density shaping part that has a low metallic powder sintered density and is permeable to gas.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: September 25, 2012
    Assignee: Panasonic Corporation
    Inventors: Yoshikazu Higashi, Satoshi Abe, Isao Fuwa, Masataka Takenami, Norio Yoshida
  • Patent number: 8272864
    Abstract: An injection mold having pre-heating device, the pre-heating device, and method for pre-heating injection mold are provided. The pre-heating device includes a high frequency coil member and a transportation device having a Z axle servo motor, a Z axle linear sliding rail, an annular transportation belt and a lifting rack. The annular transportation belt is driven by the Z axle servo motor. The high frequency coil member is hung on the lifting rack. The lifting rack is moveably connected to the Z axle linear sliding rail, coupled to the annular transportation belt and is driven by the annular transportation belt to perform an ascent or descent movement along the Z axle linear sliding rail.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: September 25, 2012
    Assignee: Quanta Computer Inc.
    Inventor: Shu-Chen Lin
  • Publication number: 20120237631
    Abstract: A hot-runner system (100), comprising: a manifold assembly (102), including: a manifold body (104) defining a melt channel (109, 110) being smooth-flowing, direction-changing and uninterrupted.
    Type: Application
    Filed: October 21, 2010
    Publication date: September 20, 2012
    Applicant: HUSKY INJECTION MOLDING SYSTEMS LTD.
    Inventor: Edward Joseph Jenko
  • Publication number: 20120231108
    Abstract: In an injection molding apparatus comprising a clamp plate, a heated manifold and a mold, a system for mounting an actuator to the manifold and the clamp plate, the system comprising: a mount comprised of a thermally conductive material having first and second heat conductive surfaces disposed between the clamp plate and the actuator; the first conductive surface being in heat conductive communication with the actuator, the second conductive surface being in heat conductive communication with the clamp plate; the actuator being mounted in thermal communication with the manifold; the mount being adjustably mounted to the actuator such that the second conductive surface can be adjusted in position toward and away from the actuator.
    Type: Application
    Filed: May 1, 2012
    Publication date: September 13, 2012
    Applicant: Synventive Molding Sulutions, Inc.
    Inventors: Gunter Wernz, Christian Gotz