Abstract: The present invention provides a layer acoustic wave device that is formed without requiring a bonding process to attach a secondary substrate. In particular, the layer acoustic wave device is formed from a substrate, an interdigital transducer created on the substrate, a dielectric layer formed over the interdigital transducer and substrate, and at least one isolation layer formed over the dielectric layer. The at least one isolation layer has sufficient properties to minimize particle displacement on a top surface of the at least one isolation layer. The at least one isolation layer has a greater acoustic impedance than that of the dielectric layer.

Abstract: Acoustic wave devices and methods of coating a protective film of alumina (Al2O3) on the acoustic wave devices are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the acoustic wave devices in a precisely controlled manner. Thus, the uniform film does not significantly distort the operation of the acoustic wave device.

Abstract: A piezoelectric resonator plate includes at least a pair of excitation electrodes and at least a pair of extraction electrodes. The pair of extraction electrodes are respectively extracted from the pair of excitation electrodes to electrically and mechanically bond the pair of excitation electrodes to an external electrode. The pair of extraction electrodes each include a distal end portion. The distal end portion includes a connecting electrode extracted to a vicinity of one end portion on one principal surface of the piezoelectric resonator plate. The connecting electrodes each include a top surface where a first metal film to be bonded to the external electrode is formed. The first metal film includes a top surface with two or more protruding portions. The first metal film has a larger surface roughness and a smaller area compared with the respective connecting electrodes. The protruding portions are formed with cross-sections in curvature shapes.

Abstract: Provided is a method of manufacturing a liquid ejecting head including a pressure generating chamber communicating with a nozzle opening and a piezoelectric element including a piezoelectric layer and an electrode, the method including: forming a first piezoelectric precursor film containing Bi and Fe, or Ba and Ti; forming a first piezoelectric layer by heating and crystallizing the first piezoelectric precursor film; forming a second piezoelectric precursor film further containing at least one selected from Li, B, and Cu on the first piezoelectric layer, in addition to Bi and Fe, or Ba and Ti contained in the first piezoelectric precursor film; and forming the piezoelectric layer by heating and crystallizing the first piezoelectric layer and the second piezoelectric precursor film.

Abstract: A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a device plate, a front plate bonded on a front surface of the device plate, and a rear plate bonded on a rear surface of the device plate. The device plate includes a diaphragm, a piezoelectric actuator that vibrates the diaphragm, and a front cavity disposed in front of the diaphragm. The front plate includes a radiation hole connected to the front cavity. The rear plate includes a rear cavity formed in a surface of the rear plate facing the piezoelectric actuator, and a bent hole connected to the rear cavity. A sound absorption layer is formed on an inner surface of the rear cavity and absorbs sound radiated backward from the diaphragm so as to suppress the sound from being reflected on the rear plate.

Abstract: Methods of reducing phase and amplitude ripples in a BAW resonator frequency response by providing a substrate, fabricating a Bragg mirror having alternate layers of a high acoustic material and a low acoustic material on a first surface of the substrate, fabricating a BAW on the Bragg mirror, and coating a second side of the substrate opposite the first side with a lossy material having an acoustic impedance in the range of 0.01× to 1.0× the acoustic impedance of the layers of high impedance material, the second surface of the substrate being a polished surface. Various embodiments are disclosed.

Abstract: A component is designed to work with acoustic waves. Embodiments have an improved temperature gradient of the frequency range and have increased performance strength. To this end, the component includes a stack of layers having a lower bonding layer, an electrode layer, an upper bonding layer, a compensation layer, and a trimming layer.

Abstract: A method for forming a graded matching layer structure is presented. The method includes (a) depositing a first material slurry on at least a portion of a substrate, (b) spreading the first material slurry to a form a first material layer having a first determined thickness, (c) exposing the first material layer using light processed through a determined light pattern mask to form a first matching layer, and (d) repeating steps (a)-(c) with different material slurries to form the graded matching layer structure.

Abstract: Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed on a piezoelectric substrate. The method further includes forming a fixed electrode with a plurality of fingers on the piezoelectric substrate. The method further includes forming a moveable electrode with a plurality of fingers over the piezoelectric substrate. The method further includes forming actuators aligned with one or more of the plurality of fingers of the moveable electrode.

Abstract: An acoustic wave biosensor comprising a surface of a mixed self-assembling monolayer for receiving a probe-biomolecule is described herein. The biosensor surface may comprise a piezoelectric quartz crystal,—for detection purposes with the electromagnetic piezoelectric acoustic sensor (EMPAS)—upon which a mixed self-assembling monolayer is formed, which includes at least one linker, such as 2,2,2-trifluoroethyl-13-trichlorosilyl-tridecanoate (TTTA); its oligoethylene glycol (OEG) analog OEGylated TTTA (OEG-TTTA); S-(2-(2-(2-(3-trichlorosilyl-propyloxy)-ethoxy)-ethoxy)-ethyl)-benzenethiosulfonate (OEG-TUBTS). Linker/diluent systems for attaching a functionalizing entity to the surface of a biosensor are described, as well as methods for preparing a biosensor surface with an oligoethylene glycol linker.

Abstract: In a method for production of a polycrystalline ceramic film on a substrate: a) the substrate is prepared with the substrate surface and preparation of at least one source for the ceramic particles of the ceramic film and b) a particle stream of the ceramic particles is generated from the source of ceramic particles in the direction of the substrate surface on the substrate, with deposition of the ceramic particles on the substrate surface on the substrate with formation of the ceramic film. At least one screen is arranged within the gap, for adjusting an average incidence angle of the ceramic particles relative to a plane normal of the substrate surface, such that the ceramic particles are deposited on the substrate surface at a preferred direction and a relative position of the substrate surface and the screen is altered while the gap remains essentially the same.

Abstract: A method of forming a double bulk acoustic resonator structure comprises forming a first electrode on a substrate, forming a first piezoelectric layer on the first electrode, forming a second electrode on the first piezoelectric layer, forming a second piezoelectric layer on the second electrode, and forming a third electrode on the second piezoelectric layer. The first and second piezoelectric layers are formed by a sputter deposition process using at least one sputter target comprising a combination of scandium and aluminum.

Abstract: A thin-film bulk acoustic wave delay line device providing true-time delays and a method of fabricating same. An exemplary device can comprise several thin-film layers including thin-film transducer layers, thin-film delay layers, and stacks of additional thin-film materials providing acoustic reflectors and matching networks. The layer material selection and layer thicknesses can be controlled to improve impedance matching between transducers and the various delay line materials. For example, the transducer layers and delay layers can comprise piezoelectric and amorphous forms of the same material. The layers can be deposited on a carrier substrate using standard techniques. The device can be configured so that mechanical waves propagate solely within the thin films, providing a substrate-independent device. The device, so constructed, can be of a small size, e.g. 40 ?m per side, and capable of handling high power levels, potentially up to 20 dBm, with low insertion loss of approximately 3 dB.

Abstract: Disclosed herein is a surface acoustic wave (SAW) filter and method of making the same. The SAW filter includes a piezoelectric substrate; a planar barrier layer disposed above the piezoelectric substrate, and at least one conductor buried in the piezoelectric substrate and the planar barrier layer.

Abstract: Energy harvesting devices are provided. The energy harvesting device includes a body, a proof mass spaced apart from the body, a cantilever extending from the body onto the proof mass, a first electrode layer on the cantilever opposite to the body, a first piezoelectric layer on the first electrode layer, a second electrode layer on the first piezoelectric layer, a second piezoelectric layer on the second electrode layer, a pair of third electrode layers on the second piezoelectric layer, and a magnetic layer between the second electrode layer and the second piezoelectric layer. Related methods are also provided.

Abstract: The use of deposition modules groups for each CVD deposition position including at least two deposition modules, together with a Motion Control System that controls and confines the motion of said deposition modules, enables a quick deposition module exchange at the deposition locations of On-Line or Off-Line CVD coating system. This results in a high volume large area CVD coating system that can increase the commercial viability of a given CVD system design through production throughput increases, production cost reductions, overall higher process flexibility and/or improved film quality.

Abstract: This disclosure provides systems, methods and apparatus for encapsulating electromechanical systems devices. In one aspect, large arrays of electromechanical systems devices can be encapsulated. In one aspect the encapsulation includes an encapsulation layer supported over the electromechanical systems devices by encapsulation layer supports. The encapsulation layer can also include a plurality of orifices. The orifices can be sealed such that the electromechanical systems devices below are not damaged.

Abstract: This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems and related processes. In one aspect, a resonator structure includes a lower conductive layer of electrodes; a lower piezoelectric layer; a middle conductive layer of electrodes; an upper piezoelectric layer; and an upper conductive layer of electrodes. In one aspect, a first arrangement of the electrodes includes a first-type drive electrode in the lower conductive layer, a second-type drive electrode in the middle conductive layer, and a first-type drive electrode in the upper conductive layer; a second arrangement of the electrodes includes a second-type drive electrode in the lower conductive layer, a first-type drive electrode in the middle conductive layer, and a second-type drive electrode in the upper conductive layer; the first-type drive electrodes are coupled to receive a first input signal; and the second-type drive electrodes are coupled to receive a second input signal.

Abstract: A piezoelectric thin-film resonator includes a piezoelectric thin film which includes aluminum nitride containing Sc and which has a concentration distribution such that the concentration of Sc is non-uniform in a thickness direction of the piezoelectric thin film; a first electrode; a second electrode facing the first electrode across the piezoelectric thin film; and a substrate supporting a piezoelectric vibrating section defined by the piezoelectric thin film and the first and second electrodes.

Abstract: This disclosure provides implementations of electromechanical systems combined resonator and passive circuit component structures, devices, apparatus, systems, and related processes. In one aspect, the device includes a piezoelectric resonator structure formed over an insulating substrate. A portion of the piezoelectric resonator structure is spaced apart from the substrate by a first gap. A passive circuit component structure such as an inductor or a capacitor is formed over the insulating substrate. A portion of the passive circuit component structure is spaced apart from the substrate by a second gap. The first gap and the second gap are defined by removal of a sacrificial (SAC) layer.

Abstract: Security documents often incorporate optically variable devices to prevent or hinder counterfeiters. Disclosed herein are layered optically variable devices such as colour-shift foils that employ a piezoelectric layer, and methods for their production and use. Such devices afford new techniques for a user of a security document to check quickly and easily whether the security document is a legitimate document or a counterfeit copy by placing an electrical potential difference across the security document.

Abstract: The present invention relates to a sensor element (1), which comprises a sensor section (2) comprising a sensor unit (3) configured to measure a physiological variable or any other signal in a living body and to generate a sensor signal in response to said variable or other signal, a bond section (5) comprising contact members configured to electrically connect at least one signal transmitting microcable, wherein the bond section is coated with an electrically insulating material (18) and the sensor section is left uncoated. The sensor element may further comprise an intermediate section between said sensor section and said bond section, including electric connection lines (19) configured to connect the contact members to the sensor unit, which intermediate section is also coated with said electrically insulating material. The invention further relates to a sensor wire and a method of producing a sensor element.

Abstract: A piezoelectric actuator is formed by forming first and second electrodes on a substrate, and depositing a material on the substrate and between side surfaces of adjacent first and second electrodes to form a thin film sheet within which the first and the second electrodes extend from a first surface of the thin film sheet towards a second surface of the thin film sheet opposite the first surface. The second electrode is interdigitated in relation to the first electrode. The side surfaces of the first and the second electrodes are at least substantially perpendicular to the substrate. The thin film sheet is to physically deform in response to an electric field induced within the thin film sheet via application of a voltage across the first and the second electrodes.

Abstract: A piezoelectric device includes: a substrate; a first electrode which is layered over the substrate; a first piezoelectric film which is layered over the first electrode; a metal oxide film which is layered over the first piezoelectric film; a metal film which is layered over the metal oxide film; a second piezoelectric film which is layered over the metal film; and a second electrode which is layered over the second piezoelectric film.

Abstract: The noble metal coating of the present invention is formed on a ceramic substrate. The noble metal coating has a thickness of less than 2 ?m and comprises a matrix metal and a ceramic fine particle. The matrix metal includes at least one metal selected from a group consisting of Pt, Pd, Ru, Rh, Os, Ir and Au as a main component. The content of the ceramic fine particle is preferably 3 to 30 parts by weight with respect to 100 parts by weight of the matrix metal. The ratio between the average particle size of the ceramic fine particle and the thickness of the noble metal coating is preferably 1/1.5 to 1/400.

Abstract: This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.

Abstract: A method of manufacturing a piezoelectric element includes a process of forming on the surface of an electrode having lanthanum nickel preferentially aligned in (100) plane, at least on a surface thereof; a process of applying a precursor solution including at least Bi, Ba, Fe, and Ti onto the surface of the electrode, and a process of crystallizing the applied precursor solution to form the piezoelectric layer including a perovskite oxide preferentially aligned in (100) plane.

Abstract: The present disclosure relates to a touch technology, and more particularly to a touch device and a fabrication method thereof. The touch device comprises a sensing area and a peripheral area. The touch device further comprises a sensing electrode layer, a shading layer, a signal transmission line layer, and a conductive layer. The sensing electrode layer extends from the sensing area to the peripheral area. The shading layer is disposed on the peripheral area to overlay the sensing electrode layer and has a through hole to expose a portion of the sensing electrode layer. The signal transmission line layer is disposed on the shading layer and does not cover the through hole. The conductive layer fills the through hole and electrically connects the sensing electrode layer. In addition, a fabrication method of a touch device is also provided.

Abstract: A method of constructing a sensor includes depositing a first material in a predetermined arrangement to form a structure. The depositing results in at least one void occurring within the structure. The method further includes depositing a second material within the voids. The second material may have electrical properties that vary according to deformation of the second material. The method also includes providing electrical access to the second material to enable observation of the one or more electrical properties. A sensor includes a structure that has one or more voids distributed within the structure. The sensor also includes a material deposited within the one or more voids. The material may be characterized by one or more electrical properties such as piezoresistivity. The sensor includes a first contact electrically coupled to a first location on the material, and a second contact electrically coupled to a second location on the material.

Abstract: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

Abstract: When a piezoelectric actuator, having a lower electrode, an intermediate electrode, and an upper electrode respectively on upper surfaces of a vibration plate, a lower piezoelectric layer, and an upper piezoelectric layer mutually stacked, is produced, a voltage of 30 V is applied to the upper and the intermediate electrodes, and ?30 V is applied to the lower electrode so that a second active portion, which is included in portions of the piezoelectric layers interposed between the upper and the lower electrodes and from which a portion opposed to the intermediate electrode is excluded, is polarized downwardly. After that, 0 V is applied to the upper and lower electrodes, and 30 V is applied to the intermediate electrode so that a first active portion, which is included in the upper piezoelectric layer and which is interposed between the upper and the intermediate electrodes, is polarized upwardly.

Abstract: Disclosed is a method of manufacturing an electromechanical transducer element including a first process of hydrophobizing a first area of an electrode by forming a self-assembled monolayer film; a second process of applying a sol-gel solution onto a predetermined second area of the electrode so as to produce a complex oxide; a third process of producing the complex oxide by calcining the electrode; a fourth process of acid-washing the electrode on which the complex oxide has been produced; a fifth process of hydrophobizing the first area of the acid-washed electrode by forming the self-assembled monolayer film; a sixth process of applying the sol-gel solution onto the predetermined second area; and a seventh process of producing the complex oxide by calcining the electrode.

Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamine carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.

Abstract: An electrode structure of a piezoelectric element is provided. The piezoelectric element 23a (23b) constitutes a piezoelectric actuator 19 attached to an attaching part 30 of an object, to minutely move a movable part 15 of the object relative to a base part 13 of the object according to deformation occurring on the piezoelectric element in response to a power applied state of the piezoelectric element. The electrode structure in response an electrode 41a formed on one of a pair of electrode forming faces 31a and 31b of the piezoelectric element on an inner side of a peripheral zone 31a1, the peripheral zone being defined along the periphery of the electrode forming face 31a on which the electrode is formed. The electrode structure also includes a non-electrode part 51 formed in the peripheral zone. Even if the peripheral zone 31a1 of the electrode forming face 31a having a short-circuit causing possibility touches the attaching part 30, no short circuit occurs.

Abstract: A method of manufacturing a stacked piezoelectric element that can suppress periodic damping on miniaturization of a vibration wave motor and improve its performance. A stacked piezoelectric element comprises piezoelectric layers and electrode layers alternately stacked to have a shape of a cylinder. The electrode layers are divided into a plurality of electrode layer regions along a circumferential surface of the shape of a cylinder.

Abstract: A microelectromechanical (MEM) resonator includes a resonant cavity disposed in a first layer of a first solid material disposed on a substrate and a first plurality of reflectors disposed in the first layer in a first direction with respect to the resonant cavity and to each other. Each of the first plurality of reflectors comprises an outer layer of a second solid material and an inner layer of a third solid material. The inner layer of each of the first plurality of reflectors is adjacent in the first direction to the outer layer of each reflector and to either the outer layer of an adjacent reflector or the resonant cavity.

Abstract: Electrically conductive thin film metallizations having continuous operating temperatures of 300° C. and more are of considerable practical interest for a number of technical applications, such as surface wave elements. Technical reasons and high production costs are a bar to the use of standard films. In order to remedy this, films including a mixture of a high-melting conductive metal and aluminum oxides, wherein in particular aluminum-rich non-stoichiometric aluminum oxides are used. The aluminum oxides act as components thermally stabilizing the conductive metal film; an optional proportion of chemically available aluminum can additionally alloy with the conductive metal and thereby enables essential film properties, such as the electrical conductivity to be specifically influenced.

Abstract: A method for manufacturing an acoustic wave device with an excellent frequency-temperature profile is performed such that the acoustic wave device produced includes a piezoelectric substrate, an IDT electrode located on the piezoelectric substrate, and a dielectric film mainly including Si and O and arranged on the piezoelectric substrate to cover the IDT electrode. The dielectric film is formed by sputtering in a sputtering gas containing H2O.

Abstract: To provide a PBNZT ferroelectric film capable of preventing sufficiently oxygen ion deficiency. The PBNZT ferroelectric film according to an embodiment of the present invention is a ferroelectric film including a perovskite-structured ferroelectric substance represented by ABO3, wherein the perovskite-structured ferroelectric substance is a PZT-based ferroelectric substance containing Pb2+ as A-site ions and containing Zr4+ and Ti4+ as B-site ions, and the A-site contains Bi3+ as A-site compensation ions and the B-site contains Nb5+ as B-site compensation ions.

Abstract: A ferroelectric oxide structure includes a substrate and a ferroelectric thin-film deposited on the substrate. The ferroelectric thin-film has a thickness of greater than or equal to 200 nm and a tetragonal crystal system. The ferroelectric thin-film has (100) single-orientation crystal orientation.

Abstract: A method of forming a device is provided. The method includes providing a substrate, forming a sacrificial layer over the substrate, and forming a field layer around the sacrificial layer. After formation, both the sacrificial layer and the field layer are planarized. A component is then formed over the planarized sacrificial layer and the planarized field layer. The component has a first electrode and a second electrode and a single crystal wafer disposed between the first and second electrodes. The component includes anchors disposed substantially over the field layer. Once the component is formed, the sacrificial layer is released with an etchant having a selectivity for the sacrificial layer wherein a cavity is formed beneath the component. The cavity allows free movement within the cavity during operation of the device. The etchant does not release the field layer and the component so the field layer remains below the anchors.

Abstract: There is provided a piezoelectric film having an alkali niobate-based perovskite structure expressed by a general formula (NaxKyLiz)NbO3(0?x?1, 0?y?1, 0?z?0.2, x+y+z=1), wherein the alkali niobate has a crystal structure of a pseudo-cubic crystal, a tetragonal crystal, an orthorhombic crystal, a monoclinic crystal, a rhombohedral crystal, or has a crystal structure of coexistence of them, and when total of K—O bonding and K-Metal bonding is set as 100% in a binding state around K-atom of the alkali niobate, a K—O bonding ratio is 46.5% or more and a K-Metal bonding ratio is 53.5% or less, wherein the Metal indicates a metal atom included in the piezoelectric film.

Abstract: The invention relates to a electrically conductive steel-ceramic connection comprising a steel interconnector and an electrically conductive ceramic joining layer arranged thereon. The interconnector comprises a ferritic steel containing Cr in a quantity ranging from 18 to 24% by weight. The ceramic layer contains perovskite of a formula Ln1-xSrxMn1-yCoyO3-? or Ln1-xSrxFe1-yCoyO3-?, wherein 0.1?x?0.4, 0.1?y?0.6, 0???x/2 and Ln=La—Lu. The inventive steel-ceramic connection is usable for a high-temperature fuel cell and regularly exhibits good adhesive properties and a low transition resistance (initial transition resistance R approximately equal to 0.01 ?cm2). Said steel-ceramic connection makes it possible to advantageously introduce a ferritic steel into high-temperature fuel cells. The inventive method for producing said steel-ceramic connection consists in pre-treating an inserted ceramic powder exhibiting good sinterability during an assembly process and during the fuel cell operation.

Abstract: This invention utilizes atomic layer deposition (ALD) to deposit a layer of a material (e.g., aluminum oxide) as a passivation and adhesion enhancement layer on a piezoelectric layer and an interdigitated transducer(s) (IDT(s)) of a surface acoustic wave (SAW) filter and also utilizes a photosensitive polymer layer (e.g., epoxy dry film) for photodefining a cavity for SAW filter fabrication. The ALD layer serves to protect the IDTs from possible corrosion caused by either the polymer layer and/or moisture and at same time provide for stable operation of the SAW filter without a signal shift occurring by protection of the piezoelectric layer. The cavity, having walls formed by the photosensitive polymer, provides for a SAW fabrication process that is simple and cost effective.

Abstract: A method of forming a vinylidene fluoride (VDF) oligomer or co-oligomer film on a substrate is disclosed. The method comprises forming a VDF oligomer or co-oligomer precursor solution; depositing the VDF oligomer or co-oligomer precursor solution onto the substrate to form a preliminary VDF oligomer or co-oligomer film on the substrate; and applying uniaxial pressure on the preliminary VDF oligomer or co-oligomer film and the substrate at an elevated temperature to form the VDF oligomer or co-oligomer film on the substrate. The substrate may comprise a metal surface which may be used as a bottom electrode and a top electrode may be deposited on the VDF oligomer or co- oligomer film The VDF oligomer or co-oligomer film, the bottom electrode on the substrate and the top electrode on the VDF oligomer or co-oligomer film form an electrical device.

Abstract: An acoustic resonator, comprises a substrate and a first passivation layer disposed over the substrate. The first passivation layer comprises a first layer of silicon carbide (SiC). The acoustic resonator further comprises a first electrode disposed over the passivation layer, a second electrode, and a piezoelectric layer disposed between the first and second electrodes. The acoustic resonator comprises a second passivation layer disposed over the second electrode. The second passivation layer comprises a second layer of silicon carbide (SiC).

Abstract: A magnetic head according to one embodiment includes a substrate; an array of transducers formed on the substrate, wherein the transducers and substrate form portions of a magnetic media facing surface; and an at least partially polycrystalline dielectric layer on the media facing surface, wherein the at least partially polycrystalline dielectric layer is on a magnetic film of at least one of the transducers in the array. A method for forming an at least partially polycrystalline dielectric layer on a media facing surface of a magnetic head according to one embodiment includes forming an at least partially polycrystalline dielectric layer on an array of transducers of a magnetic head, wherein an oxide layer is formed above at least some of the magnetic layers before and/or during the forming of the at least partially polycrystalline dielectric layer.

Abstract: An electrical component comprises a lead-based perovskite crystal material layer between a lower electrode on the surface of a substrate and an upper electrode, characterized in that the lower electrode comprises a stabilizing first layer made of a first material and a seeding second layer made of a second material, the first and second materials having the same chemical composition but different structural parameters and/or densities. A process for fabricating a component is also provided, in which the material with a perovskite structure may be PZT with a (100) or (111) orientation.

Abstract: An actuator is manufactured that includes piezoelectric film that does not suffer physical damage. Provided is a manufacturing method comprising first insulating layer deposition of depositing a first insulating layer on a substrate using an insulating material; first annealing of annealing the first insulating layer; first electrode layer deposition of depositing a first electrode layer on the first insulating layer using a conductive material; first piezoelectric film deposition of depositing a first piezoelectric film on the first electrode layer by applying a sol-gel material on the first electrode layer and annealing the sol-gel material; second electrode layer deposition of depositing a second electrode layer on the first piezoelectric film using a conductive material; second insulating layer deposition of depositing a second insulating layer on the second electrode layer using an insulating material; and second annealing of annealing the second insulating layer.

Abstract: A system having a print head for depositing material on a piezoelectric array, where the print head and array are moveable with respect to each other, and a computer for controlling movement of the print head and array with respect to each other to locations along the array, and controlling the print head to dispense the material onto the array at such locations. The print head deposits a pre-determined amount of material in one of dots, or in a line with movement of the print head and array with respect to each other. The system enables deposit of conductive material for electrical connections to array elements. Non-conductive polymer material may be deposited on the array before depositing conductive material to create barriers avoiding unintended connection of array elements by the conductive material. The system may also be used for fabricating a piezoelectric array by depositing electro-ceramic material.