Coil Or Winding Patents (Class 427/116)
  • Patent number: 10414948
    Abstract: A bonding system for bonding a plastic substrate to another substrate, the bonding system comprising a plastic substrate wherein the plastic substrate is impregnated with a transition metal; and an anaerobically curable composition. Cure of the anaerobically curable composition is initiatable by the transition metal when the anaerobically curable composition is contacted with the plastic substrate under anaerobic conditions.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: September 17, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventors: James Houlihan, Nigel Sweeney, Brian Deegan, Brendan Kneafsey
  • Patent number: 9728323
    Abstract: A transformer assembly is provided that includes a housing, transformer oil disposed within the housing, a plurality of coils of electrically conductive wire, and aliphatic polyamide insulation material operable to insulate the coils disposed within the oil. The plurality of electrically conductive coils is disposed in the housing and in contact with the transformer oil. The aliphatic polyamide insulation material includes stabilizing compounds and nano-fillers. The stabilizing compounds provide thermal and chemical stability for the insulation material.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: August 8, 2017
    Inventor: Martin Weinberg
  • Patent number: 9566764
    Abstract: Two substrates are mechanically and electrically coupled together using a combination of a fast cure electrically non-conductive epoxy for mechanical attachment and a slow cure electrically conductive epoxy for electrical interconnects. The two epoxies are selectively applied between the two substrates as a stack, and the stack is subjected to a temperature that is sufficient to cure the fast cure electrically non-conductive epoxy in a short period of time but does not damage the substrates or components coupled thereto. In some applications, the temperature is less than 100 degrees Celsius and the time period is less than 5 seconds. The stack is removed from the heat and the slow cure electrically conductive epoxy continues to cure over a longer second period of time, such as a few hours to a day.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: February 14, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Anwar Mohammed, Weifeng Liu, David Geiger, Dennis Willie, Gervasio Mutarelli, Murad Kurwa
  • Patent number: 9546260
    Abstract: The present disclosure relates to a curable system comprising at least two compositions (A) and (B) where composition (A) comprises an epoxy resin, an inorganic thixotropic agent, an organic gelling agent and a filler and composition (B) comprises a hardener, an inorganic thixotropic agent, an organic thixotropic agent and filler. The curable system may be used in the manufacture of components or parts of electrical equipment.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: January 17, 2017
    Assignee: Huntsman International LLC
    Inventors: Josef Grindling, Christian Beisele, Astrid Beigel, Cliff Beard, Ann Beard
  • Publication number: 20150130580
    Abstract: A common mode filter and a manufacturing method thereof are disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil layer formed on the magnetic substrate and including a coil pattern; a magnetic layer formed on the coil layer; a resin layer formed on the magnetic layer; and an external electrode formed in the resin layer so as to be electrically connected with the coil pattern.
    Type: Application
    Filed: April 23, 2014
    Publication date: May 14, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang-Moon LEE, Ju-Hwan YANG, Hye-Won BANG, Won-Chul SIM
  • Publication number: 20150123509
    Abstract: A coil includes a wound body and a resin covering. The wound body is configured by winding a conductor. The wound body is pressure-moulded. The resin covering covers a surface of the wound body.
    Type: Application
    Filed: January 16, 2015
    Publication date: May 7, 2015
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Tsuyoshi NONAKA, Masayuki HIRAYAMA, Haruki YAHARA
  • Publication number: 20150093499
    Abstract: An insulating material and its method of use of insulating material for rotating machines such as motors and generators. The insulating material includes a resin embedded with a filler that is not based only on a monomodal nanoparticle size particle distribution. Radiation erodes the material and is conductive to the formation of in situ protective layers on the body to be insulated.
    Type: Application
    Filed: March 22, 2013
    Publication date: April 2, 2015
    Inventors: Peter Gröppel, Christian Meichsner
  • Patent number: 8943676
    Abstract: A method of manufacturing a solenoidal magnet structure, comprising the steps of providing a collapsible mold in which to wind coils; winding wire into defined positions (88) in the mold to form coils (34); placing a preformed tubular mechanical support structure (102, 120) over the coils (34) so wound; impregnating the coils and bonding them to the mechanical support structure by applying a thermosetting resin and allowing the thermosetting resin to harden; and collapsing the mold and removing the resultant solenoidal magnet structure comprising the resin impregnated coils and the mechanical support structure from the mold as a single solid piece.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: February 3, 2015
    Assignee: Siemens PLC.
    Inventors: Graham Hutton, Jonathan Noys, Adrian Mark Thomas
  • Publication number: 20150010697
    Abstract: Electrical insulating resin comprising A) isohexidediol diglycidyl ether, B) a hardener, C) an optional filler, D) further optional additives. The isohexidediol diglycidyl ether is preferably an isosorbide diglycidyl ether, isomannide diglycidyl ether or isoidide diglycidyl ether.
    Type: Application
    Filed: February 13, 2013
    Publication date: January 8, 2015
    Applicant: ELANTAS GmbH
    Inventors: Giancarlo Soncini, Gunther Baumgarten, Klaus-Wilhelm Lienert
  • Publication number: 20140302258
    Abstract: The embodiments disclosed herein relate generally to magnetic resonance imaging systems and, more specifically, to the manufacturing of a gradient coil assembly for magnetic resonance imaging (MRI) systems. For example, in one embodiment, a method of manufacturing a gradient coil assembly for a magnetic resonance imaging system includes depositing a first layer comprising a base material onto a surface to form a substrate and depositing a second layer onto the first layer. The second layer may enable bonding between a conductor material and the substrate. The method also includes depositing a third layer onto the second layer using a consolidation process. The consolidation process uses the conductor material to form at least a portion of a gradient coil.
    Type: Application
    Filed: April 9, 2013
    Publication date: October 9, 2014
    Applicant: General Electric Company
    Inventors: Jean-Baptiste Mathieu, Saban Kurucay, Thomas Kwok-Fah Foo, Yanzhe Yang
  • Patent number: 8826514
    Abstract: Microfabricated inductors with through-wafer vias and including a first wafer and a second wafer, each wafer having a plurality of metal fillings therein, and a plurality of metal conductors connecting the plurality of metal fillings together to form a spiral. A method for producing an inductor including steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral, performing the foregoing steps similarly on a second substrate formed with a second plurality of vias filled with a second plurality of metal fillings, and bonding the first substrate with the second substrate.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: September 9, 2014
    Assignee: Teledyne Scientific & Imaging, LLC
    Inventors: Alexandros Papavasiliou, Jeffrey F. DeNatale, Philip A. Stupar, Robert L. Borwick, III
  • Publication number: 20140240075
    Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.
    Type: Application
    Filed: February 27, 2014
    Publication date: August 28, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Hyuck YANG, Young Seuck YOO, Sung Kwon WI, Hye Won BANG, Geon Se CHANG, Young Do KWEON, Ju Hwan YANG
  • Publication number: 20140203900
    Abstract: Disclosed herein is a common mode filter including: a magnetic substrate; an electrode layer disposed on one surface of the magnetic substrate and formed of a coil electrode and an insulating resin enclosing the coil electrode; and an uneven layer disposed between the magnetic substrate and the electrode and formed of a groove and a projection, wherein a part of the insulating resin is depressed between the groove of the uneven layer, whereby an adhesion between the magnetic substrate and the insulating resin is increased.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 24, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hee BAE, Sang Moon LEE, Jeong Bok KWAK, Sung Kwon WI
  • Patent number: 8749339
    Abstract: A coil-type electronic component has a coil inside or on the surface of its base material wherein the base material in the coil-type electronic component is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer. The coil-type electronic component can be produced at low cost and combines high magnetic permeability with high saturation magnetic flux density.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: June 10, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Hideki Ogawa, Atsushi Tanada, Hitoshi Matsuura, Kiyoshi Tanaka, Hiroshi Kishi, Kenji Kawano
  • Publication number: 20140139312
    Abstract: A composition for insulating a component may include between about 80 and about 99 percent by volume of a non-silicone-based insulating resin. The composition may also include between about 1 and about 20 percent by volume of magnesia trihydrate.
    Type: Application
    Filed: November 19, 2012
    Publication date: May 22, 2014
    Applicant: ELECTRO-MOTIVE DIESEL, INC.
    Inventors: John Ernst Nielsen Madsen, Edward Joseph Gawel, JR.
  • Publication number: 20140132387
    Abstract: Disclosed herein are a multilayered power inductor including an inner electrode coil pattern formed on a ceramic substrate; an outer electrode layer; and a magnetic layer made of a metal powder insulated along a grain interface of the metal powder included in a part or the whole of a chip, and a method for preparing the same. According to the exemplary embodiments of the present invention, the magnetic layer made of the metal powder insulation-coated with the ceramic material along the grain interface of the magnetic metal powder can be used for a part or the whole of the chip, thereby increasing the filling ratio of the magnetic metal powder to 90% within the magnetic layer. Therefore, a high-capacity power inductor can be implemented to effectively improve efficiency characteristics.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sung Sik SHIN
  • Publication number: 20140062636
    Abstract: Disclosed herein are a coil component and a manufacturing method thereof. The coil component includes: an electrode body including coil electrodes disposed therein, the coil electrodes having an insulating film deposited on a surface thereof; and external terminals formed at both side portions of the electrode body and connected to the coil electrodes, wherein the electrode body is made of an insulating material with which magnetic powders are mixed, in order to improve impedance characteristics.
    Type: Application
    Filed: March 11, 2013
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Sung Kwon Wi, Jin Hyuck Yang, Young Do Kweon, Sang Moon Lee
  • Publication number: 20140023823
    Abstract: According to various embodiments, a method for forming a direct data connector for a sealed device may be provided. The method may include: providing a substrate with a hole; and filling the hole with a filling material using a plating process.
    Type: Application
    Filed: July 19, 2013
    Publication date: January 23, 2014
    Applicant: Agency for Science, Technology and Research
    Inventors: Ji-Feng Ying, Wen Huei Tsai
  • Publication number: 20130342302
    Abstract: Coil bodies having a ceramic core.
    Type: Application
    Filed: March 12, 2012
    Publication date: December 26, 2013
    Applicant: CERAM TEC GMBH
    Inventors: Alexander Dohn, Roland Leneis, Alfred Thimm
  • Publication number: 20130316291
    Abstract: The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer.
    Type: Application
    Filed: July 29, 2013
    Publication date: November 28, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Kwon Wi, Young Seuck Yoo, Jeong Bok Kwak, Yong Suk Kim, Sang Moon Lee, Kang Heon Hur
  • Publication number: 20130224544
    Abstract: An electrode plate is configured by applying an active material onto a base member formed of a punching steel plate, the electrode plate being wound via a separator together with an electrode plate, which has a different polarity, and having an outermost peripheral portion positioned at the outermost periphery of an electrode assembly. The rate of hole area of the base member at a different electrode overlapping portion, which radially inwardly overlaps on a winding terminal end of the electrode plate having the different polarity, is smaller than that of the base member at the outermost peripheral portion.
    Type: Application
    Filed: February 13, 2013
    Publication date: August 29, 2013
    Applicant: GS Yuasa International Ltd.
    Inventor: GS Yuasa International Ltd.
  • Publication number: 20130200970
    Abstract: A coil-type electronic component has a coil inside or on the surface of its base material wherein the base material in the coil-type electronic component is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer. The coil-type electronic component can be produced at low cost and combines high magnetic permeability with high saturation magnetic flux density.
    Type: Application
    Filed: April 26, 2011
    Publication date: August 8, 2013
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Hideki Ogawa, Atsushi Tanada, Hitoshi Matsuura, Kiyoshi Tanaka, Hiroshi Kishi, Kenji Kawano
  • Publication number: 20130076456
    Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.
    Type: Application
    Filed: August 10, 2012
    Publication date: March 28, 2013
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: YU CHIA CHANG, CHI LONG LIN, CHENG YI WANG, SHIN MIN TAI
  • Publication number: 20130069478
    Abstract: An electrical machine is described that has a ceramic material as insulation around the winding wire. In some embodiments, the ceramic material is hexagonal boron nitride (HVR), aluminum oxide, aluminum nitride, or beryllium oxide. The ceramic material may be rolled, brush, sprayed, or dipped onto the wire using a binder-less or binder-containing solution. The whole wire may be coated, or just parts that are particularly subject to abrasion of the conductor and/or electrical contact with other conductive materials.
    Type: Application
    Filed: September 20, 2011
    Publication date: March 21, 2013
    Inventor: Colin Hamer
  • Patent number: 8397371
    Abstract: In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: March 19, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Daniel Wayne Bedell, David Patrick Druist, Edward Hin Pong Lee, Jennifer Ai-Ming Loo, Vladimir Nikitin, Sue Siyang Zhang
  • Patent number: 8314342
    Abstract: The present invention is designed to provide an insulation coil with high insulation reliability using a dry mica tape, an integral impregnation coil and a mica tape for the electrical rotating machines using these coils, said mica tape having a long shelf life and capable of preventing run-off of the impregnating epoxy resin composition during curing, with the cured product of said epoxy resin composition being high in heat resistance. It is also envisaged to provide a single insulation coil using a mica tape containing epoxy adduct imidazole as an epoxy resin curing catalyst or a mica tape containing a mixture of epoxy adduct imidazole and zinc naphthenate. An integral impregnation coil made by using said insulation coil and an epoxy resin composition, and the electrical rotating machines using such coils are also provided.
    Type: Grant
    Filed: February 27, 2007
    Date of Patent: November 20, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Kenji Ikeda, Hisashi Morooka, Keiji Suzuki, Mitsuru Onoda, Nobuaki Tanaka
  • Publication number: 20120249282
    Abstract: Methods and apparatus described herein are associated with integrated magnetic induction devices. A magnetic induction device can include a groove formed in a substrate, a magnetic core included in the groove and surrounded by a conductive winding that is adjacent to portion(s) of the substrate, and respective insulation layers included between the substrate and the conductive winding and between the magnetic core and the conductive winding. An inductor can further include conductive vias formed in the substrate and connected to respective portions of the conductive winding. Further, a transformer can include a groove formed in a substrate, a closed-loop/gapped magnetic core included in the groove and surrounded by first and second conductive windings that are adjacent to respective portions of the substrate, and respective insulation layers formed between the substrate and the first and second conductive windings, and between the closed-loop/gapped magnetic core and the first and second conductive windings.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Applicant: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Johnny Kin On Sin, Rongxiang Wu, Xiangming Fang
  • Publication number: 20120200381
    Abstract: A molded coil according to the present invention includes a coil body that is formed by an elongated insulation-coated conductor. The coil body has a spiral portion winded around in a spiral manner, a first end portion forming a beginning end of the spiral portion, and a second end portion forming a terminating end of the spiral portion. The molded coil also includes an insulative locking member that keeps a shape of the spiral portion so as to prevent the spiral portion from expanding in a vertical direction, and an insulative resin body that covers the spiral portion with the locking member being attached thereto.
    Type: Application
    Filed: January 12, 2012
    Publication date: August 9, 2012
    Applicant: Suncall Corporation
    Inventors: Motoaki KIMURA, Takashi Fujimura
  • Patent number: 8215260
    Abstract: A rotary electric machine-manufacturing apparatus utilized to implement a process of infiltrating varnish into wire-wound coils of a rotary electric machine, and of curing the varnish, an apparatus includes a rotator 2 supporting a work S attached with the wire-wound coils Sc and rotating the work; and a high-frequency power supply device supplying electric power to the wire-wound coils. It is thus possible to support and heat up the work without having devices that surround the work S, thereby positioning a varnish dropping-infiltrating device 6 appropriately. Further, there is no need to change a stage as conventional heat-up processes with an oven or a hot blast-circulating furnace did, and an entire process from pre-drying to curing can be implemented at a single stage.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: July 10, 2012
    Assignee: Aisin AW Co., Ltd.
    Inventors: Hideaki Kimura, Yoshiyuki Kawasaki, Tooru Kuroyanagi, Nobuyuki Asaoka
  • Patent number: 8122589
    Abstract: There is provided a method of manufacturing an electric motor. To begin with, a stator is provided by fixing a stator winding on a stator core. The stator winding has a coil end projecting from one end face of the stator core. Subsequently, a lead wire is drawn out from the coil end radially outward thereof. A connecting terminal is fixedly mounted to a distal end of the lead wire. A terminal block is provided such that the terminal block is held at a position to be finally fixed relative to the stator. The lead wire is bent toward the terminal block. The connecting terminal is electrically connected to the terminal block. An insulator is coated on the lead wire and the coil end by impregnating the lead wire and the coil end with liquid insulating material.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: February 28, 2012
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventor: Tomohiro Kosaki
  • Publication number: 20120023870
    Abstract: A method includes coating a conductive wire with a paste comprising a first inorganic dielectric material, an organic binder, and a solvent to form a coated wire, drying the coated wire at a first drying temperature to remove at least a portion of the solvent and form a green wire, winding the green wire around a core to form a green assembly, heat treating the green assembly at a decomposing temperature above the first temperature and below a melting point of the first inorganic dielectric material to decompose the organic binder to form an intermediate assembly, and exposing the intermediate assembly to a densifying temperature that is above the decomposing temperature and substantially equal to or above the melting point of the first inorganic dielectric material to densify the dielectric material on the conductive wire.
    Type: Application
    Filed: July 27, 2010
    Publication date: February 2, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Reza Oboodi, Robert Franconi
  • Patent number: 8079134
    Abstract: A method is provided that utilizes silicon through via technology, to build a Toroid into the chip with the addition of a layer of magnetic material such as Nickel above and below the T-coil stacked multi-ring structure. This allows the connection between the inner via and an array of outer vias. This material is added on a BEOL metal layer or as an external coating on the finished silicon. Depending on the configuration and material used for the via, the inductance will increase approximately two orders of magnitude (e.g., by utilizing a nickel via core). Moreover, a ferrite material with proper thermal conduction properties is used in one embodiment.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: December 20, 2011
    Assignee: International Business Machines Corporation
    Inventors: Andrew Benson Maki, Gerald Keith Bartley, Philip Raymond Germann, Mark Owen Maxson, Darryl John Becker, Paul Eric Dahlen, John Edward Sheets, II
  • Publication number: 20110285215
    Abstract: A method for manufacturing a module including a planar coil, and a module including a planar coil, reduce manufacturing cost and also are able to handle a large current. The method for manufacturing the module including the planar coil includes the steps of providing a second resin layer including a magnetic filler on a first resin layer with a built-in chip-type electronic component; providing a planar coil on the second resin layer; and providing a third resin layer including a non-magnetic property so as to coat the planar coil.
    Type: Application
    Filed: August 4, 2011
    Publication date: November 24, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Minoru HATASE
  • Publication number: 20110128109
    Abstract: The laminate device of the present invention comprises magnetic layers and coil patterns alternately laminated, the coil patterns being connected in a lamination direction to form a coil, and pluralities of magnetic gap layers being disposed in regions in contact with the coil patterns.
    Type: Application
    Filed: February 10, 2011
    Publication date: June 2, 2011
    Applicant: HITACHI METALS., LTD
    Inventors: Tomoyuki TADA, Toru UMENO, Yasuharu MIYOSHI
  • Patent number: 7849587
    Abstract: A method of manufacturing a solenoidal magnet structure, includes the step of providing a collapsible accurate mold in which to wind the coils winding wire into defined positions in the mold, placing a mechanical support structure over the coils so wound, impregnating the coils and the mechanical support structure with a thermosetting resin, allowing the thermosetting resin to harden, and collapsing the mold and removing the resultant solenoidal magnet structure formed by the resin impregnated coils and the mechanical support structure from the mold as a single solid piece.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: December 14, 2010
    Assignee: Siemens PLC
    Inventors: Simon James Calvert, Jonathan Noys, Adrian Mark Thomas
  • Publication number: 20100181076
    Abstract: A motor winding wire. The motor winding wire may be configured for use in, and direct exposure to, a hydrocarbon environment. The motor winding wire may be electrically insulated by one polymer layer, whereas another, outer, polymer layer is employed to provide moisture resistance as well as other contaminant and hydrocarbon environment shielding to the underlying layer. Additionally, this manner of polymer layering over the motor winding wire is achieved in a manner cognizant of the limited dimension of the motor winding wire.
    Type: Application
    Filed: March 27, 2010
    Publication date: July 22, 2010
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Joseph Varkey, Byong Jun Kim, Pete Howard
  • Publication number: 20100130005
    Abstract: A method of fabricating a semiconductor device by filling carbon nanotubes in a recess is disclosed. The method of fabricating the semiconductor device comprises patterning a mold on a substrate, coating carbon nanotubes on an entire surface of the recess and the mold formed by the patterning, filling the carbon nanotubes coated on the an entire surface of the mold in the recess, and removing the mold.
    Type: Application
    Filed: July 31, 2006
    Publication date: May 27, 2010
    Inventors: Byung Chul Lee, Jeong Oen Lee, Yang Kyu Choi, Jun-Bo Yoon
  • Patent number: 7694409
    Abstract: A method of insulating a coil of an electrical machine includes applying an insulating varnish to a coil of conductive wire. The varnish includes (i) a resin; (ii) a first catalyst having a first activation temperature, the first catalyst being active at room temperature; and (iii) a second catalyst with a second activation temperature substantially higher than the first activation temperature. The varnish is allowed to partially cure at room temperature. The coil is mounted to a yoke to form a rotor of the electrical machine. The rotor is operated so as to heat the coil and activate the second catalyst to complete curing of the varnish.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: April 13, 2010
    Assignee: General Electric Company
    Inventors: Rihong Mo, Shuo Chen
  • Patent number: 7669315
    Abstract: Apparatus for making a helically wound conductor includes a pulling mechanism for axially advancing a cable core and a guide mechanism for axially directing one or more secondary strand(s) from a location offset from the cable core toward the cable core at a common approach angle. A mandrel body is disposed at a forward end of the apparatus, the mandrel body having an axial passageway extending from a rearward to the forward end of the mandrel body dimensioned to axially receive the cable core therethrough and a forward radiused end positioned to intercept the secondary strand(s). The secondary strand(s) converge on the mandrel radiused end at a common approach angle, tangentially intersect respective locations of the mandrel radiused end, and follow the radiused end to intersect with the cable core.
    Type: Grant
    Filed: November 7, 2006
    Date of Patent: March 2, 2010
    Assignee: The Goodyear Tire & Rubber Company
    Inventor: James Christopher Kish
  • Publication number: 20100028528
    Abstract: The use of cyclohexane polycarboxylic acid esters for the preparation of coating compositions for the coil coating process containing at least one paste PVC and at least one extender PVC and of coated coils, the coil coating process, which is carried out by using coating compositions containing cyclohexane polycarboxylic acid esters, one-sided or two-sided coated coils with at least one coating composition containing at least one cyclohexane polycarboxylic acid ester as well as three-dimensional formed parts preparable by the shaping of the said coated coils.
    Type: Application
    Filed: November 26, 2007
    Publication date: February 4, 2010
    Applicant: BASF SE
    Inventors: Deborah Lois Coombs, Paul Michael Davies, Ulrik Stengel, Christopher David Morgan
  • Patent number: 7655271
    Abstract: In one embodiment a coating process is disclosed. The process comprises, assembling a coating shield to an article, and disposing a coating on the article via an electrostatic coating process, wherein the coating lacks electrostatic attraction to the coating shield.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: February 2, 2010
    Assignee: General Electric Company
    Inventors: Patricia Chapman Irwin, Peter John Foley, Elena Rozier, Tamara Jean Kluge, John Kost
  • Patent number: 7566684
    Abstract: A superconductor coating inclusive, tape-like electrical conductor and windings using such conductor for magnets and electrical machines, etc. The described windings are suited for inclusion of successor superconductor materials such as yttrium barium copper oxide wherein magnetic flux related losses can potentially be excessive and preclude successful machine operation. Winding orientation and configuration of the conductor in an alternating current machine for lower losses are disclosed along with methods and apparatus for achieving the desired windings. Windings intended for differing locations within a machine of this type are made possible by the invention. Equations relating to magnetic losses incurred in such windings are also disclosed.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: July 28, 2009
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: George A. Levin, Paul N. Barnes
  • Publication number: 20090162538
    Abstract: A composition for fixing wound items comprising A) 0 to 90 wt % of at least one ?, ?-unsaturated polyester and/or polyester imide resin based on at least one unsaturated mono-, di- or tricarboxylic acids and/or mono-, di- or tricarboxylic acid group containing molecules, at least one polyol and/or, in case of an unsaturated polyester imide, at least one imide having 5-membered cyclic imide moieties, B) 0.1 to 80 wt % of at least one inorganic and/or organic-inorganic hybrid component having functionalities to react with component A) and C), C) 2 to 80 wt % of at least one monomeric and/or oligomeric unsaturated component to react with component A) and B), and D) 0 to 15 wt % of customary additives, the wt % being based on the total weight of the composition. The composition provides excellent thermal transfer properties and a high level of electrical insulation properties with excellent adhesion and thermal stability.
    Type: Application
    Filed: December 3, 2008
    Publication date: June 25, 2009
    Inventors: Frank-Rainer Boehm, Michael Herm, Murat Gueltekin, Barbara Trappmann
  • Publication number: 20090162700
    Abstract: The present disclosure relates to high purity apparati, e.g., magnetic hard disk drives, and more specifically, to coatings for particle reduction of surfaces of such apparati. The provided coatings include thin polymer coatings with reactive pendant groups having crosslinking functionality and ability to anchor to substrate surfaces to suppress particle shedding from substrate surfaces. Provided is a substrate that includes a coating on at least a portion of the substrate that comprises a fluorinated acrylate random copolymer. Methods of reducing particulate contamination are also provided.
    Type: Application
    Filed: December 2, 2008
    Publication date: June 25, 2009
    Inventors: Jason M. KEHREN, Patricia M. Savu
  • Patent number: 7509730
    Abstract: A method and apparatus for forming a high conductance, high aspect ratio structure in a single low temperature copper chemical vapor deposition step. A trench for a winding of a coil is formed by forming a first length of the trench in the insulation layer. The first length of the trench forms a first portion of the winding of the coil in a confined area proximate a yoke region. A second length of trench is formed in the insulation layer extending away from the first length of the trench and the yoke region. The second length of trench includes parallel trenches for forming a second portion of the winding in a nonconfined area. A metal is deposited into the first length of the trench and the second length of the trench to form the first and second portions of the winding of the coil.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: March 31, 2009
    Assignee: International Business Machines Corporation
    Inventor: Jeffrey S. Lille
  • Patent number: 7504127
    Abstract: An electrically conductive elastic composite yarn comprises an elastic member that is surrounded by at least one conductive covering filament(s). The elastic member has a predetermined relaxed unit length L and a predetermined drafted length of (N×L), where N is a number preferably in the range from about 1.0 to about 8.0. The conductive covering filament has a length that is greater than the drafted length of the elastic member such that substantially all of an elongating stress imposed on the composite yarn is carried by the elastic member. The elastic composite yarn may further include an optional stress-bearing member surrounding the elastic member and the conductive covering filament. The length of the stress-bearing member is less than the length of the conductive covering filament and greater than, or equal to, the drafted length (N×L) of the elastic member, such that a portion of the elongating stress imposed on the composite yarn is carried by the stress-bearing member.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: March 17, 2009
    Assignee: Textronics Inc.
    Inventors: Eleni Karayianni, Omero Consoli, George W. Coulston, Klaus J. Regenstein
  • Publication number: 20090029185
    Abstract: A manufacturing method of a magnetic device includes the steps of forming a magnetic substrate having a plurality of recesses, and forming at least one coil in the recess. In addition, a magnetic device is also disclosed. The magnetic device includes a magnetic substrate and at least one coil. The magnetic substrate has a plurality of recesses and the coil is disposed in the recess.
    Type: Application
    Filed: January 29, 2008
    Publication date: January 29, 2009
    Inventors: Cheng-Chang Lee, Ming-Hsien Lin, Yu-Ru Chang, Zong-Ting Yuan, Heng-Chung Chang, Huang-Kun Chen, Tai-Kang Shing
  • Publication number: 20090011121
    Abstract: An electrode mixture paste application method includes: a first step of unwinding a core material (2) wound in a coil shape; a second step of immersing the core material in an electrode mixture paste (5); a third step of adjusting an application amount of the electrode mixture paste; a fourth step of drying a paste-coated sheet (6) with the electrode mixture paste applied to the both sides thereof; and a fifth step of winding the paste-coated sheet in a coil shape, wherein a seam welding step for connecting coils of the core material to each other is provided between the first and second steps, wherein a metal containing molybdenum and/or tungsten is used as a welding electrode (91) in the seam welding step, and wherein a mechanism for air cooling by gas is provided. This can achieve a stable method for applying an electrode mixture paste in which apprehensions for micro short circuits and the like are eliminated and troubles in the step of welding core materials can be avoided.
    Type: Application
    Filed: April 26, 2006
    Publication date: January 8, 2009
    Inventors: Masahiko Kato, Hironori Yaginuma, Keiji Minamino
  • Publication number: 20080262611
    Abstract: A foldable polymer-based coil structure and a method for fabricating the same are disclosed. The coil structure has metal wirings and interconnections between the wirings. The wirings and connections are embedded by a polymer. The coil structure is foldable in two or more layers. In the folded condition, coils of one layer overlap the coils of another layer. A stackable structure and jigs for aligning the foldable and stackable structures are also disclosed.
    Type: Application
    Filed: April 19, 2008
    Publication date: October 23, 2008
    Inventors: Wen Li, Damien C. Rodger, Yu-Chong Tai
  • Publication number: 20080170952
    Abstract: A hermetic compressor includes a compressing device and a drive motor connected to the compressing device. The drive motor has a stator with a stator coil made of aluminum wire and an insulating layer disposed on an outer surface of the aluminum wire. The aluminum wire has a diameter between about 0.4 mm to about 1.2 mm.
    Type: Application
    Filed: December 12, 2007
    Publication date: July 17, 2008
    Inventor: Si Hwan Jung