Abstract: A metal fine particle-containing ink that contains metal fine particles dispersed therein with a polymer dispersant, a low-molecular weight carboxylic acid and an aqueous solvent, wherein the polymer dispersant contains a constitutional unit derived from an acid group-containing monomer; a content of the low-molecular weight carboxylic acid C in the ink is not less than 1% by mass and not more than 15% by mass. A boiling point (C) of the low-molecular weight carboxylic acid and a boiling point (D) of the aqueous solvent satisfy the following relational formula (I); and an acid dissociation exponent pKa (C) of the low-molecular weight carboxylic acid and an acid dissociation exponent pKa (B) of an acid group in the polymer dispersant satisfy the following relational formula (II): boiling point (C)>boiling point (D) ??(I), and pKa (C)<pKa (B) ??(II).

Abstract: Provided are processes for producing metal oxides, including pigmentary TiO2. In embodiments, a process for producing a metal oxide comprises combining a metal halide and an oxidant in a liquid phase medium under conditions to oxidize the metal halide in the liquid phase medium to produce a metal oxide therefrom.

Abstract: The present invention relates to a composition for etching, comprising a first inorganic acid, a first additive represented by Chemical Formula 1, and a solvent. The composition for etching is a high-selectivity composition that can selectively remove a nitride film while minimizing the etch rate of an oxide film, and which does not have problems such as particle generation, which adversely affect the device characteristics.

Abstract: An etch stop layer is formed over a semiconductor fin and gate stack. The etch stop layer is formed utilizing a series of pulses of precursor materials. A first pulse introduces a first precursor material to the semiconductor fin and gate stack. A second pulse introduces a second precursor material, which is turned into a plasma and then directed towards the semiconductor fin and gate stack in an anisotropic deposition process. As such, a thickness of the etch stop layer along a bottom surface is larger than a thickness of the etch stop layer along sidewalls.

Abstract: A method comprises depositing a barrier layer on a dielectric layer to prevent oxidation of a metal layer to be deposited by electroplating due to an oxide present in the dielectric layer and depositing a doped liner layer on the barrier layer to bond with the metal layer to be deposited on the liner layer by the electroplating. The dopant forms a protective passivation layer on a surface of the liner layer and dissolves during the electroplating so that the metal layer deposited on the liner layer by the electroplating bonds with the liner layer. The dopant reacts with the dielectric layer and forms a layer of a compound between the barrier layer and the dielectric layer. The compound layer prevents oxidation of the barrier layer and the liner layer due to the oxide present in the dielectric layer and adheres the barrier layer to the dielectric layer.

Abstract: Passivation layers to inhibit vapor deposition can be used on reactor surfaces to minimize deposits while depositing on a substrate housed therein, or on particular substrate surfaces, such as metallic surfaces on semiconductor substrates to facilitate selective deposition on adjacent dielectric surfaces. Passivation agents that are smaller than typical self-assembled monolayer precursors can have hydrophobic or non-reactive ends and facilitate more dense passivation layers more quickly than self-assembled monolayers, particularly over complex three-dimensional structures.

Abstract: A conductive member is provided including a substrate, an interlayer disposed on at least one surface of the substrate, a patterned plating target layer disposed in the form of a mesh on the interlayer having a functional group interacting with a plating catalyst or a precursor thereof, a mesh-shaped metal layer that is disposed on the patterned plating target layer and includes a plurality of crossing thin metal wires, and a protective layer disposed on the metal layer. In a case where “a” represents a modulus of elasticity of the substrate at 25° C. and “b” represents a modulus of elasticity of the interlayer at 25° C., the conductive member satisfies the following Formula A, Formula A: 0.010?b/a?0.500, an area ratio of the metal layer is 0.2% to 60%, and a modulus of elasticity of the protective layer at 25° C. is 0.10 to 5.00 GPa.

Abstract: A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion-resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate.

Abstract: A method for producing metal patterns, which includes depositing a temporary protection on a substrate surface corresponding to the negative of the patterns to be produced; depositing at least one metal on the areas corresponding to the patterns to be produced; and eliminating the temporary protection at least partly during and/or after, or at least partly during and/or after the deposition step. The method can produce decorative objects or functional objects such as printed circuits, integrated circuits, RFID chips, and electronic reader-readable encoding pictograms. A set of consumables used to implement the method is also disclosed.

Abstract: Methods for forming thin, pinhole-free conformal metal layers on both conducting and non-conducting surfaces, where the morphology and properties of the metal layers are tuned to meet desired parameters by adjusting the concentration of ionic liquids during the deposition process. The formed metal films contain tunable properties for solar and electronic use and provide specific advantages for non-conducting surfaces, which are otherwise unsuitable for electroplating without the presence of the formed metal films. The disclosed methods do not require the presence of a voltage or external electric field but form the metal films through an electroless technique using electrostatic interactions between negatively charged nanoparticles. In addition, the disclosed methods are compatible with solution phase processing and eliminate the need to transfer the surfaces into a vacuum chamber for a chemical or physical vapor deposition to form a metal layer.

Abstract: An electrical circuit, for example a printed circuit, for producing a module for integration into a card such as a chip card. This module includes electrical contact or connector which includes lands for the connection and communication of the chip with a read/write system. To give them a white color, or a color close to white, these electrical contact lands are at least partially covered with a layer of a rhodium alloy. The invention also relates to a method for manufacturing such an electrical circuit.

Abstract: A method of making a copper-doped glass comprising placing a target glass in a container, placing a target glass in a container, surrounding the target glass with a powder mixture comprised of fused silica (SiO2) powder and copper sulfide (Cu2S) powder, such that both the target glass and the surrounding powder are contained in the container, and heating the container and the target glass and the surrounding powder mixture to a temperature of between 800° C. and 1150° C.

Abstract: The present invention relates to a metal oxide nanoparticle ink composition, a method of producing the same, and a method of forming a conductive layer pattern by using the metal oxide nanoparticle ink composition, and more particularly, to a metal oxide nanoparticle ink composition for forming a conductive layer by irradiating an ink composition thin film containing nickel oxide nanoparticles with a sintering laser, a method of producing the same, and a method of forming a conductive layer pattern by using the metal oxide nanoparticle ink composition.

Abstract: A copper precursor composition contains: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and, a second copper complex of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper precursor composition contains a copper complex of an imine coordinated to a copper precursor compound. The copper precursor composition is thermally degradable at a temperature lower than a comparable composition containing only primary amine copper complexes under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 ??-cm or less. Inks containing the copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate with the film thereon is useful in electronic devices.

Abstract: A negative electrode for a lithium metal battery including: a lithium metal electrode including a lithium metal or a lithium metal alloy; and a protective layer on at least portion of the lithium metal electrode, wherein the protective layer has a Young's modulus of about 106 pascals or greater and includes at least one particle having a particle size of greater than 1 micrometer to about 100 micrometers, and wherein the at least one particle include an organic particle, an inorganic particle, an organic-inorganic particle, or a combination thereof.

Abstract: A mandrel structure includes a first mandrel, a second mandrel and a third mandrel in a parallel arrangement. The second mandrel is located between the first and third mandrels and has a cut larger than a minimum ground rule feature. A sidewall layer is formed over the mandrel structure. The sidewall layer has two long parallel gaps for two contact lines and a third gap for a fuse element. The third gap is orthogonal to and connects the two long parallel gaps. The sidewall pattern is used to form a trench structure comprising two parallel contact line trenches having a width at least as great as a ground rule of the patterning process for the contact lines and an orthogonal fuse element trench having a width less than the ground rule for the fuse element. A conductive material forms the contact lines and a fuse element.

Abstract: A method comprises depositing a barrier layer on a dielectric layer to prevent oxidation of a metal layer to be deposited by electroplating due to an oxide present in the dielectric layer and depositing a doped liner layer on the barrier layer to bond with the metal layer to be deposited on the liner layer by the electroplating. The dopant forms a protective passivation layer on a surface of the liner layer and dissolves during the electroplating so that the metal layer deposited on the liner layer by the electroplating bonds with the liner layer. The dopant reacts with the dielectric layer and forms a layer of a compound between the barrier layer and the dielectric layer. The compound layer prevents oxidation of the barrier layer and the liner layer due to the oxide present in the dielectric layer and adheres the barrier layer to the dielectric layer.

Abstract: There is provided a surface-treated copper foil including a surface coating layer provided on at least one surface of a copper foil, the surface coating layer being mainly composed of silicon with a hydrogen content of 1 to 35 atomic % and/or a carbon content of 1 to 15 atomic %. This foil can be manufactured by forming a surface coating layer composed mainly of silicon with the above hydrogen and carbon contents on at least one surface of the copper foil by PVD or CVD. The present invention can provide a copper foil with a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board.

Abstract: A method for material deposition includes providing a transparent donor substrate (56, 60) having opposing first and second surfaces and multiple donor films (62, 64) including different, respective materials on the second surface. The donor substrate is positioned in proximity to an acceptor substrate (41), with the second surface facing toward the acceptor substrate. Pulses of laser radiation are directed to pass through the first surface of the donor substrate and impinge on the donor films so as to induce ejection of molten droplets containing a bulk mixture of the different materials from the donor films onto the acceptor substrate.

Abstract: An electrically conductive material for a connection component that includes a Cu—Sn alloy coating layer in which a Cu content is 55 to 70 atomic % and has an average thickness of 0.1 to 3.0 ?m, and a Sn coating layer having an average thickness of 0.2 to 5.0 ?m, which are formed in this order on a surface of a base material made of a copper or copper alloy sheet strip. When a reflected electron image of a material surface is observed with a scanning electron microscope at a magnification of 100 times, a region A and a region B having a higher brightness than the region A and in which the Cu—Sn alloy coating layer is not exposed coexist on the material surface, and an area ratio of the region A on the material surface is 2 to 65%.

Abstract: A battery structure includes an anode packaging material having a first textured surface and an anode metal formed on the first textured surface. A separator is formed on the anode metal. A cathode packaging material includes a second textured surface. A cathode metal is formed on the second textured surface. An active cathode paste is formed on the cathode metal and brought into contact with the separator such that any gap is filled with electrolyte.

Abstract: A solar cell module includes a plurality of solar cells, each solar cell including a semiconductor substrate, an emitter region, a back surface field region a first electrode connected to the emitter region, a second electrode connected to the back surface field region, and a conductive line connected to one electrode of the first and second electrodes using a conductive adhesive and insulated from the other electrode of the first and second electrodes through an insulating layer, the conductive line being used to connect a plurality of solar cells in series. A thickness of the conductive adhesive between the one electrode and the conductive line is greater than a thickness of the insulating layer between the other electrode and the conductive line.

Abstract: The invention relates to a method for manufacturing a colored blank, which contains zirconium dioxide and is intended for the manufacture of a dental restoration, whereby raw materials in powder form, at least some of which contain one coloring substance each, are mixed with, zirconium dioxide as the main ingredient, the resulting mixture is pressed and subsequently subjected to at least one thermal treatment. To generate the desired fluorescence, it is intended that in the raw materials in powder form one uses as coloring substances at least terbium, erbium, cobalt, as well as one substance that generates a fluorescence effect in the dental restoration, however not iron, aside from naturally occurring impurities.

Abstract: A method for manufacturing a sensor element for detecting (i) a gas component in a measuring gas or (ii) a temperature of the measuring gas includes: introducing at least one functional element into at least one slip at least once in such a way that a slip layer is applied to the functional element, the functional element including at least one solid electrolyte and at least one functional layer; sintering the slip layer on the functional element; grinding the slip layer at least in the area of the at least one functional layer; impregnating the slip layer; and thermally treating the impregnated slip layer.

Abstract: A metal nanoparticle ink dispersion is made by mixing ingredients comprising: a first solvent being nonpolar and having a boiling point above 160° C. at 1 atmosphere pressure; a second solvent having a boiling point above 230° C. at 1 atmosphere pressure, the second organic solvent being an aromatic hydrocarbon and having a higher boiling point than the first hydrocarbon solvent; and a plurality of metal nanoparticles. A method of printing the metal nanoparticle ink dispersion is also disclosed.

Abstract: Disclosed are a nanometal-nanocarbon hybrid material and a method of manufacturing the same, the method including modifying the surface of nanocarbon to introduce a functional group to conductive nanocarbon; mixing the surface-modified nanocarbon with an isocyanate-based compound and a pyrimidine-based compound and allowing them to react, thus forming a nanocarbon dispersion reactive to metal ions; adding the nanocarbon dispersion with a metal salt precursor, a reducing agent and a solvent, thus manufacturing nanometal particles; and separating a hybrid of the nanometal particles having the nanocarbon bound thereto. Thereby, nanocarbon is mixed with an isocyanate-based compound and a pyrimidine-based compound and then allowed to react, whereby the nanocarbon reactive with metal ions is used as an additive, thus obtaining a nanometal having a low-dimensional shape having less than three dimensions.

Abstract: An oxide superconducting wire wherein an outer periphery of an oxide superconductor is covered with a plating layer (stabilizing layer). In addition, the oxide superconductor includes: an oxide superconducting laminate that is formed by a tape-shaped substrate, an interlayer, and an oxide superconducting layer, in which the interlayer and the oxide superconducting layer are laminated on a main surface of the substrate; and an undercoat stabilizing layer that is laminated on an outer periphery of the oxide superconducting laminate. The undercoat stabilizing layer includes: a first undercoat stabilizing layer formed of Ag or an Ag alloy; and a second undercoat stabilizing layer formed of one of Cu, Ni, Pb, Bi, and an alloy containing Cu, Ni, Pb or Bi as a major component.

Abstract: Disclosed is an abrasion resistant material having low cost and excellent abrasion resistance, a puffer cylinder, and a puffer type gas circuit breaker. The abrasion resistant material includes: a base material which is formed of pure aluminum or aluminum alloy and has an unevenness structure formed on its surface; and an aluminum hydrated oxide film which is formed on the surface of the base material, wherein a surface of the aluminum hydrated oxide film is provided with an unevenness structure which is finer than the unevenness structure of the base material.

Abstract: A chemical process to formulate conductive ink with low sintering temperature for inkjet printing is described and shown. The application of fabricated flexible conductive film on lithium ion batteries is also described. This chemical method and composition can remove the oxidation on metallic nanoparticle surface during ink fabrication and sintering processes. Etched metallic ions in the conductive ink are reduced and particles bridged while annealing printed patterns to achieve low temperature sintering at about 350° C. The chemical process can be applied on nickel materials that are excellent current collectors for lithium ion batteries due to high chemical stability especially at high charging-discharging potential of less than 3 Volts. Thermal decomposition and chemical reduction of silver salts are two methods disclosed for particle-free silver ink. Surfactant additive further make silver film more uniform and easier to be sintered.

Abstract: A method for providing electrically-conductive silver-containing metal in a thin film or one or more thin film patterns on a substrate. Electrically-conductive metallic silver is provided from a non-hydroxylic-solvent soluble silver complex represented by the following formula (I): (Ag+)a(L)b(P)c?? (I) wherein L represents an ?-oxy carboxylate; P represents a 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. A photosensitizer can also be present. The reducible silver ions in the photosensitive thin film or photosensitive thin film pattern can be photochemically converted to electrically-conductive metallic silver in the thin films or thin film patterns by irradiation with electromagnetic radiation having a wavelength within the range of at least 150 nm and up to and including 700 nm.

Abstract: A method of manufacturing a lithium-ion secondary battery electrode sheet disclosed herein includes the step of preparing powder 220 of granulated particles. In this step, the powder (220) of granulated particles (240) including active material particles (241) and a binder (242) is prepared. The powder (220) is deposited on a strip-shaped collector foil (201) that is being conveyed. Then, the powder (220) is removed from widthwise center portions (202) and (203) of the collector foil (201), and a squeegee (106) is brought into contact with the powder (220) remaining on the opposite sides of the center portions (202) and (203) of the collector foil (201), thus adjusting the thickness of the powder (220). Subsequently, the powder (220) remaining on the opposite sides of the center portions (202) and (203) of the collector foil (201) is pressed.

Abstract: A wiring substrate includes an insulating layer, at least one via hole formed in the insulating layer, a first wiring layer formed on one surface of the insulating layer and having a droop portion at an end-side of the via hole, a second wiring layer formed on the other surface of the insulating layer, and a metal-plated layer formed in the via hole and configured to connect the second wiring layer and the droop portion of the first wiring layer. One surface of the insulating layer around the via hole is formed as a convex curved surface and the droop portion of the first wiring layer is arranged on the convex curved surface.

Abstract: One aspect provides an implantable medical device with a housing having an opening with an opening width. A feedthrough is provided, including an insulator having a bottom surface and side surfaces and having an insulator width between opposing side surfaces that is greater than the opening width. A sinter joint is between at least one of the bottom surface, top surface, and side surfaces of the insulator and the housing which hermetically seals the insulator to the housing without an intervening ferrule.

Abstract: New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

Abstract: A hard faced surface comprises a metal substrate. Inserts are attached to the substrate as a covering layer on the substrate. Each insert comprises a thermally stable polycrystalline diamond (TSP) body (or polycrystalline diamond or cubic boron nitride) having a plan section, a contact surface and a flat top surface. A boundary coating on the ultra-hard body renders the body wettable by first braze material. A tungsten carbide cap is brazed with said first braze material to at least the top surface of the TSP block. The inserts are brazed to the substrate in a closely packed side-by-side formation with a second braze material that penetrates the gaps between the inserts and between the contact surface of the bodies and the metal substrate. The tungsten carbide caps of the inserts provide a gauge for the hard faced surface, which caps are ground in a finishing step exposing the caps and providing the hard faced surface with a desired dimension including an amount of the thickness of the caps.

Abstract: Various embodiments may relate to a method for producing an optoelectronic component, including forming a first electrode on a substrate, arranging a first mask structure on or above the substrate, wherein the first mask structure comprises a first structuring region including an opening and/or a region prepared for forming an opening, arranging a second mask structure on or above the first mask structure, forming a second structuring region in the first mask structure and in the second mask structure in such a way that at least one part of the first structuring region in the first mask structure is formed outside the second structuring region in the first mask structure.

Abstract: The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.

Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.

Abstract: Provided is a method for manufacturing a metal film, including: coating or printing a metal ink containing an organic metal complex on a substrate; and necessarily parallel-performing a pressure process during a procedure of forming metal particles by firing the metal ink, thereby forming a conductive metal film. The present invention can provide a method for manufacturing a metal film capable of improving film characteristics such as conductivity, reflectance, and uniformity in thickness, and the like, as well as remarkably shortening the time for forming the metal film, thereby efficiently manufacturing a superior-quality metal film.

Abstract: Provided are a soldering device and method which allow for soldering at low cost with high yield and high reliability.

Abstract: A manufacturing method for an oxygen sensor that includes an oxygen sensor element includes: coating both surfaces of a solid electrolyte element of the oxygen sensor element with Pt films as a pair of electrodes; and heating at least one of the coated Pt films, coated on a side exposed to measured gas, in a gas atmosphere having a higher oxygen gas concentration than atmospheric gas to align a crystal orientation of the at least one of the Pt films with a (001) plane.

Abstract: A negative electrode 1 for lithium secondary batteries, which can increase the charge/discharge capacity of a lithium secondary battery, includes a negative electrode current collector, a negative electrode active material layer, and a lithium layer. The negative electrode active material layer is disposed on regions and of the respective surfaces and of the negative electrode current collector. The lithium layer is disposed on uncovered regions and, which are regions of the respective surfaces and of the negative electrode current collector on which the negative electrode active material layer is not disposed. The lithium layer includes lithium.

Abstract: A method for forming a monolithic seal frame and lid for use with a substrate and electronic circuitry comprises the steps of forming a mandrel from a ceramic and glass based material, forming a seal frame and lid block from a ceramic and glass based material, creating a seal frame and lid by forming a compartment and a plurality of sidewalls in the seal frame and lid block, placing the seal frame and lid on the mandrel such that the mandrel fits within the compartment, and cofiring the seal frame and lid block.

Abstract: A display device and a manufacturing method thereof are disclosed. The display device comprises an upper substrate (103), a lower substrate (104), a solvent (102), and ellipsoids (101), and the solvent (102) and the ellipsoids (101) are provided between the upper substrate (103) and the lower substrate (104). The ellipsoids are configured for forming photonic crystals and have electromagnetic characteristics. By means of photonic crystals formed by the ellipsoids having a shape of oval spheres with a size in order of nanometer or sub-micrometer, the display device can change wavelength of reflected light and present different colors, thus color images can be displayed.

Abstract: Polymer binders, e.g., crosslinked polymer binders, have been found to be an effective film component in creating high quality transparent electrically conductive coatings or films comprising metal nanostructured networks. The metal nanowire films can be effectively patterned and the patterning can be performed with a high degree of optical similarity between the distinct patterned regions. Metal nanostructured networks are formed through the fusing of the metal nanowires to form conductive networks. Methods for patterning include, for example, using crosslinking radiation to pattern crosslinking of the polymer binder. The application of a fusing solution to the patterned film can result in low resistance areas and electrically resistive areas. After fusing the network can provide desirable low sheet resistances while maintaining good optical transparency and low haze. A polymer overcoat can further stabilize conductive films and provide desirable optical effects.

Abstract: A multi-layer component has a base body that has a stack made of dielectric layers and internal electrode layers. An external contact is in electrical contact with the electrode layers. The external contact has a first layer and a second layer, where the first layer and the second layer are burned-in.

Abstract: High surface area electrodes formed using sol-gel derived monoliths as electrode substrates or electrode templates, and methods for making high surface area electrodes are described. The high surface area electrodes may have tunable pore sizes and well-controlled pore size distributions. The high surface area electrodes may be used as electrodes in a variety of energy storage devices and systems such as capacitors, electric double layer capacitors, batteries, and fuel cells.

Abstract: In an aspect, a negative active material, a negative electrode and a lithium battery including the negative active material, and a method of manufacturing the negative active material is provided. The negative active material includes a silicon-based active material substrate; a metal oxide nanoparticle disposed on a surface of the silicon-based active material substrate. An initial irreversible capacity of the lithium battery may be decreased and lifespan characteristics may be improved by using the negative active material.

Abstract: Provided are methods of preparing a separator/anode assembly for use in an electric current producing cell, wherein the assembly comprises an anode current collector layer interposed between a first anode layer and a second anode layer and a porous separator layer on the side of the first anode layer opposite to the anode current collector layer, wherein the first anode layer is coated directly on the separator layer.

Abstract: A cathode material comprising an active material, a carbon material, a binder polymer, a lithium salt, and a solvent. The cathode material has a viscosity in the range from about from about 3.0 to about 30.0 cP such that the cathode material can be applied to a surface using an ink jet print head. An anode base material includes from about 50% to about 85% by weight of metallic lithium particles substantially free from other metals and from about 15% to about 50% by weight of a solvent. The anode base material has a viscosity such that the anode base material can be extruded.