Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer on a substrate, forming a carbon nanotube (CNT) layer on the first dielectric layer, forming a second dielectric layer on the carbon nanotube (CNT) layer, patterning a plurality of trenches in the second dielectric layer exposing corresponding portions of the carbon nanotube (CNT) layer, forming a plurality of contacts respectively in the plurality of trenches on the exposed portions of the carbon nanotube (CNT) layer, performing a thermal annealing process to create end-bonds between the plurality of the contacts and the carbon nanotube (CNT) layer, and depositing a passivation layer on the plurality of the contacts and the second dielectric layer.

Abstract: A masking strip for use in painting automobile doors includes an elongated flexible body configured to cover a gasket of a door assembly, and an elongated spine extending perpendicularly from the elongated flexible body. The elongated spine is configured for receipt in a narrow opening defined between the door assembly and a front fender.

Abstract: A method for manufacturing a water resistant substrate comprises a first step of providing a substrate. The method proceeds with a step of populating at least one component onto the substrate. Next, the method includes a step of cleaning the substrate including the at least one component to form a cleaned substrate. Then, the method proceeds with depositing a multi-layered water resistant coating onto the cleaned substrate.

Abstract: Methods for coating a glass-based article, for example a cover glass, with a coating layer that is not deposited on the perimeter edge of the glass-based article. The methods may include direct patterning of a sacrificial material over a first region on a top surface the glass-based article but not a second region on the top surface of the glass-based article. The first region includes at least a portion of a perimeter edge of the glass-based article that is to be protected from deposition of the coating layer. After direct patterning of a sacrificial material and deposition of a coating layer, the sacrificial material may be removed such that the coating layer is disposed on the second region on the top surface of the glass-based article and not the first region. These methods may be used to make a glass-based article with non-edge-to-edge coating layers.

Abstract: A system and method includes pre-warping a mask to induce strain when affixed to a substrate and ensure positive contact between the mask and the substrate during all phases of deposition. A film is applied to the mask at a rate sufficient to impart stress to the film faster than such stress can be released. Depending on the features defined by the mask, the pre-warping may be concentric, linear along one axis, or complex along a plurality of axes.

Abstract: A vapor deposition mask (100) includes a resin layer (10) including a plurality of openings (11); a magnetic metal layer (20) located so as to overlap the resin layer, the magnetic metal layer including a mask portion (20a) having such a shape as to expose the plurality of openings and a peripheral portion (20b) located so as to enclose the mask portion; and a frame (30) secured to the peripheral portion of the magnetic metal layer. The resin layer is not joined to the mask portion of the magnetic metal layer but is joined to at least a part of the peripheral portion of the magnetic metal layer.

Abstract: An apparatus and a method performing work free from variations among a plurality of work heads having individual differences. A working apparatus includes a number n (a natural number 2 or greater) of work heads, a stage retaining a work object, drive devices moving the stage and the work heads relative to each other in three directions, a work amount measurement device measuring a work amount of each work head, and a control device, wherein the first-direction drive device enables the number n of work heads to be independently moved in a first direction, and the second-direction drive device includes a second-direction main drive device moving the number n of work heads simultaneously in a second direction, and a second-direction auxiliary drive device moving n?1 work heads among the number n of work heads independently in the second direction. A working method is carried out using the working apparatus.

Abstract: A mask frame and a method for manufacturing the same, a mask assembly for evaporation and an evaporation apparatus are provided. The mask frame includes a frame body. The frame body includes a plurality of frame members, and the frame body comprises a first surface and a second surface opposite to each other. A plurality of grooves are provided at intervals on the first surface of each of the plurality of frame members and along an extending direction of the frame member, and each groove is formed by the first surface recessing towards the second surface, and has a groove depth in a direction perpendicular to the first surface. For the plurality of grooves in each frame member, a groove depth of the groove at a middle position of the frame member is smaller than the grooves at two ends of the frame member.

Abstract: Aspects of the embodiments set forth a sacrificial plug system including a component having a surface and at least one cooling hole in the surface; a sacrificial plug integrally formed with the component and integrally formed in the at least one cooling hole, where the sacrificial plug includes a top portion; a cover portion; and a bottom portion, the bottom portion integrally formed, engaged to, and connected to at least one cooling hole. The sacrificial plug system also includes at least one connective member integrally formed with the bottom portion of the sacrificial plug and integral with an inner wall of each respective at least one cooling hole; each at least one connective member being severable from the respective inner wall when a force is applied to the top portion, thus permitting the sacrificial plug to be removed from the at least one respective cooling hole.

Abstract: A method for manufacturing a semiconductor device includes forming a dielectric layer on a substrate, forming a first carbon nanotube (CNT) layer on the dielectric layer at a first portion of the device corresponding to a first doping type, forming a second CNT layer on the dielectric layer at a second portion of the device corresponding to a second doping type, forming a plurality of first contacts on the first CNT layer, and a plurality of second contacts on the second CNT layer, performing a thermal annealing process to create end-bonds between the plurality of the first and second contacts and the first and second CNT layers, respectively, depositing a passivation layer on the plurality of the first and second contacts, and selectively removing a portion of the passivation layer from the plurality of first contacts.

Abstract: The present application provides a flexible substrate and a manufacturing method of the flexible substrate. The flexible substrate includes a first flexible layer, a barrier layer, a second flexible layer, and a buffer layer. The barrier layer is disposed on a surface of the first flexible layer, the barrier layer includes a first bending resistant structure disposed therein, the second flexible layer is disposed on a surface of the barrier layer, the buffer layer is disposed on a surface of the second flexible layer, and the buffer layer includes a second bending resistant structure disposed therein.

Abstract: In an example, a flexible three-dimensional (3D) maskant is described. The maskant comprises a flexible base structure comprising a first side and a second side opposite the first side, where the first side is configured to attach and conform to a surface being spray coated. The maskant further comprises a plurality of members attached to, and protruding from, the second side of the base structure. Each member comprises (i) a base end attached to the second side of the base structure and (ii) a distal end. An outermost subset of the plurality of members are positioned along an outer edge of the base structure. Each distal end of the outermost subset extends outward beyond the outer edge of the base structure, thereby overhanging the surface when the maskant is attached to the surface of the object being spray coated.

Abstract: A holding device for fastening bar cutters in order for the cutting edges thereof to be coated, wherein the fastening is configured in such a way that a plurality of bar cutters can be arranged in a row such that the cutting faces and tips thereof have the same orientation, and the holding device includes a screen which at least partially protects the cutting faces from the coating, wherein, with bar cutters arranged in a row in the manner described, the top edge of the screen projects beyond the knife tips in such a way that no knife tips protrude.

Abstract: A system for treating a surface and applying adhesive to an already treated portion of the surface concurrently is presented. The system comprises surface treatment equipment, adhesive application equipment, and a common feed system. The surface treatment equipment is configured to treat the surface of an elongated member. The adhesive application equipment is configured to apply adhesive to the already treated portion of the surface. The common feed system feeds the elongated member beneath the surface treatment equipment and the adhesive application equipment concurrently.

Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

Abstract: A silicone resin represented by formula (1) and having a Mw of 1,000-8,000 is useful in cosmetics. [(C6H5)3SiO1/2]a[R13SiO1/2]b[R22SiO2/2]c[R3SiO3/2]d[SiO4/2]e??(1) R1 is a C1-C8 alkyl group, C6-C12 aryl group (exclusive of phenyl) or C1-C8 fluorinated alkyl group, R2 and R3 are each independently a C1-C8 alkyl group, C6-C12 aryl group or C1-C8 fluorinated alkyl group, a=0-0.2, b=0.1-0.5, c=0-0.2, d=0.01-0.5, e=0-0.6, a+b+c+d+e=1.0, at least one phenyl group is included in the molecule. A film of the silicone resin has a refractive index of at least 1.48.

Abstract: A grit boot mask tool including an enclosure to receive at least a portion of a blade and a door. A lock assembly that retains the door to the enclosure. The lock assembly provides for rotating a latch to retain the door to the enclosure.

Abstract: A masking strip for use in painting automobile doors includes an elongated flexible body configured to cover a gasket of a door assembly, and an elongated spine extending perpendicularly from the elongated flexible body. The elongated spine is configured for receipt in a narrow opening defined between the door assembly and a front fender.

Abstract: The present disclosure provides a mask assembly and a method for manufacturing the same, and a display device. The mask assembly includes a frame, a first mask and a second mask, and the first mask and the second mask are superposed on the frame; the first mask includes an opening region, the second mask includes an evaporation region in which a first evaporation hole is provided for allowing an evaporation material to pass therethrough and a buffer region surrounding the evaporation region and configured to block off the evaporation material, and an orthographic projection of the boundary of the opening region onto the second mask is located within the buffer region.

Abstract: Active LEDs have a control transistor in series with an LED and have a top electrode, a bottom electrode, and a control electrode. The active LEDs are microscopic and dispersed in an ink. A substrate has column lines, and the active LEDs are printed at various pixel locations so the bottom electrodes contact the column lines. A hydrophobic mask defines the pixel locations. Due to the printing process, there are different numbers of active LEDs in the various pixel locations. Row lines and control lines contact the top and control electrodes so that the active LEDs in each single pixel location are connected in parallel. If the LEDs emit blue light, red and green phosphors are printed over various pixel locations to create an ultra-thin color display. Any active LED may be addressed using row and column addressing, and the brightness may be controlled using the control lines.

Abstract: An application device and an application method capable of increasing the speed of a line-drawing application are provided. The application device includes a discharge device, a worktable, a drive device, and a control unit. A discharge member gives an inertial force to a liquid material inside a liquid chamber, thereby discharging the liquid material from a plurality of discharge ports at the same time and forming a plurality of droplets on an application object. The plurality of discharge ports are arranged in a nozzle along a straight nozzle arrangement line, and the nozzle arrangement line is aligned with a drawing direction in which a drawing line is to be drawn.

Abstract: Disclosed is a manufacturing apparatus of a light-emitting element including: a main transporting route extending in a first direction, the main transporting route comprising first and second transfer devices connected through a first transporting chamber; a sub-transporting route extending in a second direction intersecting the first direction, the sub-transporting route comprising a second transporting chamber connected to the first or second transfer device and a delivery chamber connected to the second transfer chamber; and a plurality of first treatment chambers connected to the delivery chamber. The main transporting route is configured to transfer a substrate to be treated in a horizontal state, and one of the plurality of treatment chambers is configured to hold the substrate in a vertical state during treatment.

Abstract: The present disclosure discloses a method of manufacturing a nanowire grid polarizer, including: sequentially laminating a first wire grid material layer, a second wire grid material layer and a third wire grid material layer on a substrate; disposing a nano photoresist array on the third wire grid material layer; etching the third wire grid material layer which is not covered by the nano photoresist array by dry-etching; etching the second wire grid material layer which is not covered by the nano photoresist array by wet-etching; etching the first wire grid material layer which is not covered by the nano photoresist array by dry-etching; and removing the nano photoresist array to obtain the nanowire grid polarizer.

Abstract: Electrical, mechanical, computing, and/or other devices that include components formed of extremely low resistance (ELR) materials, including, but not limited to, modified ELR materials, layered ELR materials, and new ELR materials, are described.

Abstract: A method for coating a component is provided. The coating method includes providing a component having at least one aperture with an aperture geometry formed in a surface thereof, positioning a filler material within the at least one aperture, the filler material extending away from the surface of the component a distance greater than a reduced coating thickness and less than an applied coating thickness, applying at least one coating over the surface of the component and the filler material to form an applied coating having the applied coating thickness, removing a portion of the applied coating to provide the reduced coating thickness and expose the filler material, and removing the filler material to extend the at least one aperture having the aperture geometry through the applied coating. Another coating method and a template for use with the coating methods are also provided.

Abstract: Embodiments of the disclosure provide methods and apparatus for monitoring film properties on a substrate in-situ. In one embodiment, a deposition system is provided. The deposition system includes at least two deposition chambers, and a patterned mask designed specifically for each of the deposition chambers, wherein a first mask of the patterned masks has a first opening formed therethrough outside of a pattern formed thereon, and a second mask of the patterned masks has a first opening formed therethrough outside of a pattern formed thereon, the first opening of the second mask having a position on the second mask that is different than a position of the first opening on the first mask.

Abstract: A method for masking a gap between a closure panel member and a surround, such, for example, as an automobile door arrangement, in which a mask protrudes from the gap and overlies the panel member edge defining a space tapering towards the edge, whereby to feather the paint towards the edge, and masking tapes used in carrying out the method. The masking can be effected by introducing a resiliently deformable elongate strip mask into the gap so as to compress it to be pinched in the gap to protrude therefrom and, after painting, to remove the strip from the gap prior to overpainting. The mask may be introduced with the closure member closed, and needs no adhesive to hold it to the door or surround.

Abstract: A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.

Abstract: The present invention relates to an UV coating special for PET window film and its preparation method. A pigmented UV-curable window-film coating comprising the following components in parts by mass: UV monomer: 3-40, modified acrylate: 10-50, photoinitiator: 1-10, leveling agent: 0.4-2, pigment: 3-20, coupling agent: 0.5-1.5 and dispersant: 0.4-0.8. The pigmented window film according to the present invention has the functions of being difficult to fade, UV resistance and excellent outdoor weather-resistance as well as the functions of surface-scratch resistance. The color or hue of the pigment itself can remain unchanged for several or even a dozen years. Thus, a PET window film produced from a pigment with good weather resistance can guarantee that it will keep its original color for several to a dozen years and its performance will not be influenced by outdoor environmental factors.

Abstract: A semiconductor structure includes a substrate; a chip disposed over the substrate; and a molding disposed over the substrate and surrounding the chip at a molding temperature. The warpage of the substrate is convex or about zero at the molding temperature or 10° C. more or less than the molding temperature.

Abstract: A method of manufacturing a semiconductor structure includes providing a substrate and a chip disposed over the substrate; disposing the substrate over a first molding member; disposing a second molding member over the substrate to encapsulate the chip; disposing a molding material around the chip; forming a molding over the substrate and around the chip; removing the first molding member; removing the second molding member; wherein the first molding member includes a curved surface protruded towards the substrate, the chip or the second molding member.

Abstract: Systems and methods for liquid deposition photolithography are described. In particular, some embodiments relate to systems and methods for using photolithography to control the 2D structure of a thin layer of material (e.g., photopolymer) using various masks, projection optics and materials. In one or more embodiments, this thin layer can be manipulated by micro-fluidic techniques such that it can be formed, patterned and post-processed in a liquid environment, vastly simplifying the creation of multi-layer structures. Multiple layers are rapidly built up to create thick structures of possibly multiple materials that are currently challenging to fabricate by existing methods.

Abstract: Disclosed is a manufacturing apparatus of a light-emitting element including: a main transporting route extending in a first direction, the main transporting route comprising first and second transfer devices connected through a first transporting chamber; a sub-transporting route extending in a second direction intersecting the first direction, the sub-transporting route comprising a second transporting chamber connected to the first or second transfer device and a delivery chamber connected to the second transfer chamber; and a plurality of first treatment chambers connected to the delivery chamber. The main transporting route is configured to transfer a substrate to be treated in a horizontal state, and one of the plurality of treatment chambers is configured to hold the substrate in a vertical state during treatment.

Abstract: A vehicle windshield assembly including a glass layer, a first layer, and a second layer is disclosed. The glass layer has inner and outer surfaces. The first layer contacts the inner surface of the glass layer, and defines voids in the first layer in a shape of a design. The second layer contacts the first layer and occupies the voids. The first and second layers have a color contrast to enhance visibility of the design.

Abstract: In various embodiments multi-component systems for the protection of spray booth surfaces and the suppression of dust are provided. In certain embodiments the multi-component system for the temporary protection of a paint spray booth and the suppression of dust comprises a first component comprising a liquid that when applied to a surface of said paint booth dries to form a peelable film; and a second component comprising a liquid that when applied to a surface of said paint booth or to said film, forms a tacky coating that adheres dust particles. In certain embodiments the system further comprises a third component comprising a liquid that when applied to a surface of said paint booth or to said film, forms a tacky coating that adheres dust particles, wherein the composition of said third component is different than the composition of said second component. In certain embodiments the system further comprises a non-woven material configured for application to a floor of a spray booth.

Abstract: An oriented electrical steel sheet and a method of manufacturing the same are provided, and in a method of manufacturing an oriented electrical steel sheet including processes of producing a hot rolled plate by hot rolling a steel slab, performing or omitting hot rolled plate annealing, performing cold rolling, performing decarburization and nitride annealing, and performing final high temperature annealing, the decarburization and nitride annealing process is performed in a dew point range of 35-55° C., and in the final annealing process, a glassless additive including MgO is applied.

Abstract: In plan view, a magnet plate (10) has a first magnetic domain (11) and a second magnetic domain (12), a magnetic domain boundary line (14) is inclined to an opening side (26) and is bent or curved, and the magnet plate has magnetic fields that are generated in a respective plurality of different directions.

Abstract: A turbine blade machining method and a machining tool, which allow efficient machining of a through-hole running from the surface of a turbine blade to the interior thereof, and a turbine blade. This turbine blade machining method, in which a through-hole is machined in a turbine blade with a protective film formed on a surface of a substrate, has: an insertion step of inserting a machining tool, including a grinding region provided at a tip thereof, into the through-hole with such an orientation that the grinding region faces the surface of the through-hole; and a removal step of grinding the protective film laminated in the through-hole with the grinding region of the machining tool inserted into the through-hole, to remove the protective film laminated in the through-hole.

Abstract: To provide a production method including: a first step of forming a mask member in which a resin film and a magnetic metal member, which has first through-holes and second through-holes, are brought into close contact; a second step in which a peripheral edge of the magnetic metal member is bonded to one end face of a frame; and a third step in which a portion of the film in each first through-hole is irradiated with laser light to form an opening pattern, and a portion of the film in each second through-hole is irradiated with laser light to form a mask-side alignment mark.

Abstract: An adhesive article for masking a portion of a substrate surface from a liquid coating applied to the surface includes a support having first and second opposed major surfaces, and a cationic or zwitterionic adhesive composition disposed on at least a portion of at least one of the first and second opposed major surfaces. The adhesive composition provides a barrier that impedes the migration of the coating past the edge of the adhesive article.

Abstract: A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer.

Abstract: A display device includes a plurality of pixels arranged on a substrate, a plurality of pixel electrodes, wherein each pixel electrode of the plurality of pixel electrodes corresponds to a pixel of the plurality of pixels, a bank between adjacent pixel electrodes of the plurality of pixel electrodes, wherein the bank exposes a part of the pixel electrodes, an electroluminescent layer on each of the plurality of pixel electrodes, a common electrode above the bank and the electroluminescent layer, a plurality of insulators on the exposed regions of the pixel electrodes, wherein the common electrode is between the insulators and the pixel electrodes, and an auxiliary wiring on the common electrode between adjacent insulators of the plurality of insulators, wherein a top surface of each insulator of the plurality of insulators is farther from the substrate than a top surface of the common electrode.

Abstract: Nonwoven fibrous webs including randomly oriented discrete fibers defining a multiplicity of non-hollow projections extending from a major surface of the nonwoven fibrous web (as considered without the projections), and a plurality of substantially planar land areas formed between each adjoining projection in a plane defined by and substantially parallel with the major surface. In some exemplary embodiments, the randomly oriented discrete fibers include multi-component fibers having at least a first region having a first melting temperature and a second region having a second melting temperature, wherein the first melting temperature is less than the second melting temperature. At least a portion of the oriented discrete fibers are bonded together at a plurality of intersection points with the first region of the multi-component fibers. In certain embodiments, the patterned air-laid nonwoven fibrous webs include particulates.

Abstract: A mask for deposition for forming a pattern on a transparent substrate according to the present invention includes a mask member having a mask alignment mark penetratedly formed so as to be aligned with a substrate alignment mark formed on the transparent substrate; and an unevenness region formed on one surface of the mask member so as to be adjacent to the mask alignment mark and having protrusions and depressions on a surface thereof. In accordance with embodiments of the present invention, it is possible to prevent the alignment error of the mask from occurring by increasing the recognition rate of the align marks formed on the substrate and the mask. As a result, it is possible to reduce the manufacturing costs by reducing the defective rate of the organic light emitting diode (OLED) display device.

Abstract: Disclosed herein are sacrificial coating compositions comprising at least one polyvinyl alcohol; at least one waxy starch; at least one hygroscopic agent; at least one surfactant; and water, wherein the ratio by weight of the at least one waxy starch to the at least one polyvinyl alcohol is at least two to one. In certain embodiments, the at least one polyvinyl alcohol has a degree of hydrolysis of at least about 95%, such as at least about 98%, or at least about 99.3%. In certain embodiments, the viscosity of the at least one polyvinyl alcohol in a deionized water solution at 20° C. ranges from about 30 cps to about 80 cps, wherein the solution contains 4% by weight polyvinyl alcohol relative to the total weight of polyvinyl alcohol and deionized water in the solution. Also disclosed herein are methods of making a sacrificial coating composition.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a dielectric layer over the semiconductor substrate. The semiconductor device structure also includes a conductive feature in the dielectric layer, and the conductive feature includes a catalyst layer and a conductive element. The catalyst layer is between the conductive element and the dielectric layer, and the catalyst layer is in physical contact with the conductive element. The catalyst layer continuously surrounds a sidewall and a bottom of the conductive element. The catalyst layer is made of a material different from that of the conductive element, and the catalyst layer is capable of lowering a formation temperature of the conductive element.

Abstract: In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.

Abstract: A mask according to the invention includes a masking having a first side, a second side, and a perimeter opening. The second side is either tacky or has an adhesive applied and includes a backing, and the first side may include a cover. In use, the backing is removed to apply the mask to a hatch on a surface, with the perimeter of the hatch exposed through the perimeter opening. If used, the cover is then removed and liquid sealant is applied to the perimeter through the perimeter opening. Excess sealant collects on the masking rather than on the hatch or surface surrounding the perimeter. Once the sealant dries, the masking is removed.

Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information—when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of a printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component mounting device.