Abstract: A coated article, a coating for protecting an article, and a method for protecting an article are provided. The article comprises a metallic substrate and a substantially single-phase coating disposed on the substrate, wherein the coating comprises nickel (Ni) and at least about 30 atomic percent aluminum (Al); the coating further comprises a gradient in Al composition, the gradient extending from a first Al concentration level at an outer surface of the coating to a second Al concentration level at an interface between the substantially single-phase coating and the substrate, wherein the first Al concentration level is greater than the second Al concentration level and the second concentration level is at least about 30 atomic percent Al.

Abstract: A coated article is prepared by furnishing an article substrate having a free sulfur content of less than about 1 part per million. The low-sulfur article may be made of a material selected to have a low sulfur content, provided with a scavenging element that reacts with free sulfur to produce a sulfur compound, or desulfurized by contact with a reducing gas such as hydrogen. A platinum-group metal layer is deposited over the article substrate, and a ceramic coating is applied over the platinum-group metal layer.

Abstract: A coated article is prepared by furnishing an nickel-base article substrate having a free sulfur content of more than 0 but less than about 1 part per million by weight. A protective layer is formed at a surface of the article substrate. The protective layer includes a platinum aluminide diffusion coating. The protective layer may be substantially yttrium-free, or have a controlled amount of yttrium. A ceramic layer may overlie the protective layer.

Abstract: A microactuator, or micromotor, (60) and method for making it are presented such that a symmetrical build up of material is performed on opposite sides of a substrate. This reduces mechanical stresses in the device. In its construction, respective layers of circuit portions (108, 110) are built on each side of the structure, thereby eliminating the need to stack complex patterns. Stacking one complex pattern on top of a similar pattern is difficult because the surface, which is the base for subsequent layers, is not flat. The photolithography process that forms these patterns is not very forgiving to non-flat surfaces. Avoiding the stacked layers also allows thicker conductors to be considered for each circuit. Thicker circuits increase current carrying capacity, which in one of the key variables increase the power of the micromotor.

Abstract: A method for sintering a porous coating on an open-structure substrate, i.e., a substrate with pre-made pores or openings. The open-structure substrate is spread with a coating paste that is prepared with such a viscosity so that the paste will not drip through the pores/openings on the open-structure substrate. The coating paste is then sintered to form a porous layer on the surface of the open-structure substrate. Optionally, the porous coating may be further coated with a catalyst for fuel cell applications.

Abstract: A method of inspecting the surface finish of a component comprising providing an original surface to be inspected. A release agent is applied onto the original surface and an epoxy mixture is applied over the release agent. The epoxy mixture is allowed to harden into a replicated surface. Once the epoxy mixture has hardened, the replicated surface is removed and a metallic coating is applied thereon. The coated replicated surface is then ready for inspection.

Abstract: A magnetoresistance sensor structure is fabricated by providing a substrate structure, depositing a magnetic pinning structure on the substrate structure, and depositing an oxidized copper spacer layer overlying the magnetic pinning structure. The deposition of the oxidized copper spacer layer includes depositing a first copper sublayer, oxidizing the first copper sublayer, depositing a second copper sublayer, and oxidizing the second copper sublayer. More deposition and oxidation steps may be used as necessary. A sensing structure is deposited overlying the oxidized copper spacer layer.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, forming first and second semi-cured resin layers, stacking a first assembly of the first carrier, the first metal film, the first copper film and the first semi-cured resin layer on a second assembly of the second carrier, the second metal film, the second copper film and the second semi-cured resin layer, and vacuum hot pressing the first and second assemblies so as to complete cure and integrate the first and second semi-cured resin layers.

Abstract: A method for fabricating a plated product with a basecoat layer, a metal plating layer, and a topcoat layer that are formed on a surface of a base is provided. The method includes the step of forming the basecoat layer and the metal plating layer on the surface of the base. The step is followed by subjecting the metal plating layer to a cold heat treatment or an ultrasonic wave treatment, thus forming a microcrack in the metal plating layer. Afterwards, the topcoat layer is formed on the surface of the metal plating layer.

Abstract: A method of treating a substrate. The method comprises forming a metal-containing layer on at least a selected portion of the substrate during a substrate cleaning process.

Abstract: An environmentally resistant coating (34) for improving the oxidation resistance of a niobium-based refractory metal intermetallic composite (Nb-based RMIC) at high temperatures, the environmentally resistant coating (34) comprising silicon, titanium, chromium, and niobium. The invention includes a turbine system (10) having turbine components (11) comprising at least one Nb-based RMIC, the environmentally resistant coating (34) disposed on a surface (33) of the Nb-based RMIC, and a thermal barrier coating (42) disposed on an outer surface (40) of the environmentally resistant coating (34). Methods of making a turbine component (11) having the environmentally resistant coating (34) and coating a Nb-based RMIC substrate (32) with the environmentally resistant coating (34) are also disclosed.

Abstract: A protective coating forming a thermal barrier is made on a superalloy metal substrate by forming a bonding underlayer on the substrate, the bonding underlayer being constituted by an intermetallic compound comprising at least aluminum and a metal from the platinum group, and by forming a ceramic outer layer which is anchored on a film of alumina present on the surface of the bonding underlayer. The bonding underlayer preferably has a thickness of less than 50 &mgr;m and is made by using physical vapor deposition, e.g. by cathode sputtering, to deposit a plurality of individual layers alternately of aluminum and of a metal from the platinum group, and by causing the metals in the resulting layers to react together exothermally.

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Abstract: There is provided contact, sliding, fitting-in and ornamental members having a surface treatment structure in which contact resistance is low, and lubricating property and wear resistance are excellent, and capable of being used suitably for any use of contact, sliding, fitting-in or ornament, and a method for manufacturing the same. The surface treatment structure 1 having a plating layer formed on the surface of a substrate 2 comprises a lubrication plating layer 5 made of a plating layer of a metal matrix containing fine particles 4 having lubricating property, and a noble metal plating layer 7 formed on the lubrication plating layer 5. Preferably, an anti-diffusive plating layer 3 made of a metal plating layer is formed under the lubrication plating layer 5, and a joining layer 6 made of a strike plating layer of noble metal is formed between the lubrication plating layer 5 and the noble metal plating layer 7.

Abstract: A spin valve based magnetic read head that is suitable for use with ultra-high recording densities is described along with a process for manufacturing it. This produces a product that is free of conductor lead bridging and conductor lead fencing. A key sub-process is the deposition of a first capping layer through DC sputtering followed by, without breaking vacuum, a lead overlay layer This is followed by deposition, also by DC sputtering, of a second capping layer which is patterned so that it becomes a hard mask. Then, using this hard mask, the lead overlay layer is removed from the center of the structure by means of ion beam etching. Hard bias and conductor lead layers are then formed inside parallel trenches without the use of liftoff processes.

Abstract: Disclosed is an aqueous alloy plating solution for surface treatment of a modular PCB. The plating solution comprises 1-30 wt % of an organic acid having at least one sulfonic acid group (—SO3H), 0.1-20 wt % of a complexing agent, 0.1-15 wt % of a thio-compound having at least one —S—, 0.05-5 wt % of a water soluble gold compound, 0.001-1 wt % of a water soluble silver compound and 0.1-10 wt % of a sequestering agent, based upon the weight of the plating solution. According to this invention, all plating properties required for the modular PCB are obtained through a single plating process, instead of the conventional double plating process.

Abstract: ABSTRACT OF THE DISCLOSURE A method for forming the soldering layer of fiber array substrate surface has been disclosed herein. A plurality of fiber array bases having V-shape grooves are formed on a substrate, and a solder layer is formed on the whole substrate via chemical plating method of following steps: forming a layer of nickel/chromium (Ni/Cr) alloy or aluminum (Al) metal on said substrate through evaporation or sputtering; treating said surface of said substrate having V-shape grooves with a sensitizing solution for plating said surface with Sn2+, wherein said sensitizing solution comprises deionized water and SnCl2; treating said sensitized surface of said substrate with an activating solution for precipitating catalytic element Pd0 on said surface, wherein said sensitizing solution comprises 2 to 10 g/l of PdCl2 and 0.01 to 0.1 M HCl; and (E) immersing said treated surface into an electroless nickel plating solution to form a nickel metal layer on said treated surface.

Abstract: A nickel-base superalloy article has a surface protective layer comprising nickel, from about 20 to about 35 weight percent aluminum, and from about 0.5 to about 10 weight percent rhenium. The protective layer, which is preferably an overlay coating of the beta (&bgr;) phase NiAl form, is formed by depositing nickel, aluminum, rhenium, and modifying elements onto the substrate surface. A ceramic layer may be deposited overlying the protective layer.

Abstract: An article includes an antireflection composite material, a substrate, and an inorganic layer deposited onto the substrate. The inorganic layer has a thickness of from about 1 nm to about 10 nm. The article includes a polymer layer in contact with the inorganic layer to form an outer surface of the antireflection composite material. The polymer layer has a thickness of from about 70 nm to about 120 nm.

Abstract: The invention is directed to a method for producing Palladium alloy composite membranes that are useful in applications that involve the need to separate hydrogen from a gas mixture. Further, in one embodiment, a Pd alloy composite membrane is realized in which the Pd alloy film is 1 &mgr;m or less in thickness and resistant to poisoning by sulfide compounds. Further, the Pd alloy composite membranes are applied to a number of applications, such a fuel reforming.

Abstract: Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.

Abstract: A method of forming a tantalum-containing layer on a substrate is described. The tantalum-containing layer is formed using a physical vapor deposition technique wherein a magnetic field in conjunction with an electric field function to confine material sputtered from a tantalum-containing target within a reaction zone of a deposition chamber. The electric field is generated by applying a power of at least 8 kilowatts to the tantalum-containing target. The magnetic field is generated from a magnetron including a first magnetic pole of a first magnetic polarity surrounded by a second magnetic pole of a second magnetic polarity opposite the first magnetic polarity. The first magnetic pole preferably has a magnetic flux at least about 30% greater than a magnetic flux of the second magnetic pole. The tantalum-containing layer deposition method is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, an interconnect structure is formed.

Abstract: It is an object of the present invention to provide a magnetic recording medium which has a high level of magnetic antisotropy energy, retains stably the state of recording magnetization within the operating temperature range and is suitable for high-density recording with a low noise level, and a magnetic storage device for the magnetic recording medium. For attaining the above object, the magnetic recording film of the magnetic recording medium is characterized in that its magnetic anisotropy energy constant Ku at an absolute temperature of 300 K is greater than 3.6×106 erg/cc and the average particle diameter is larger than 5 nm and smaller than 12 nm.

Abstract: A method and apparatus are provided for protecting internal aluminum components of a plasma reactor from plasma-induced erosion. The components are coated, first with a dielectric layer, then with a thin layer of one or more metals selected from the group consisting of gold, chromium, platinum, silver and rhenium. The dielectric layer may either be grown or deposited. The metal layer is deposited, preferably using evaporative deposition.

Abstract: A method of manufacturing a magnetic recording medium comprises steps of providing a non-magnetic substrate for a magnetic recording medium, the substrate including at least one major surface; forming a layer of a sol-gel on the at least one major surface; forming a pattern, e.g., a servo pattern in an exposed surface of the layer of said sol-gel; and converting the layer of sol-gel to a glass or glass-like layer while preserving the pattern in an exposed surface of said glass or glass-like layer. Embodiments of the invention include magnetic media including a patterned glass or glass-like layer formed from a layer of a hydrophilic sol-gel with the pattern embossed therein by means of a stamper having a hydrophilic surface including a negative image of the pattern.

Abstract: A first thin film including at least one transition metal selected from the group consisting of Co, Fe and Ni, and a second thin film including at least one platinum group element selected from the group consisting of Pt and Pd are prepared. Then, a multilayered structure where said first thin film and said second thin film are stacked is formed. Then, the multilayered structure is heated at the same time or after the formation of said multilayered structure, thereby to counter-diffuse constituent elements of said first thin film and said second thin film and alloy said at least one transition metal and said platinum group element.

Abstract: A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The method can also include applying the stamping surface to the material surface, wherein a pattern of copper plating catalyst is applied to the material surface. The method can further include providing a copper solution over the copper plating catalyst, whereby a layer of copper is patterned on the material surface.

Abstract: A melting and impregnating apparatus includes an impregnating tank having an inlet sealing portion in the bottom portion thereof, an outlet sealing portion in the upper portion thereof and a drawing portion disposed between the sealing portions; a raw-material heating tank allowed to communicate with the impregnating tank through a heating passage; and pressurizing means for maintaining pressurized states of the inside portions of the impregnating tank and the pressurizing means.

Abstract: The present invention provides a method of coating a surface with a slip resistant coating. The method of the invention comprises either sequentially or simultaneously melting two different metal wires and directing droplets of the melted wires towards a surface to be coating. The resulting coating formed by this process tends to be rough and confers anti-slip properties to the surface. In one variation of the invention, the two different metal wires will be melted and atomized in a single spray gun. Alternatively, these wires may be melted in separate but adjacent spray guns. In either variation, the resulting metal sprays formed from the different wires will at least partially overlap.

Abstract: Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for firing of device substrate to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe, Cu and Ag, or alloys thereof.

Abstract: A nanolayered coated cutting tool that includes a substrate that has a surface with a coating on the surface thereof. The coating comprises a plurality of coating sets of alternating nanolayers of titanium nitride and titanium aluminum nitride wherein each coating set has a thickness up to about 100 nanometers. The coating includes a bonding region and an outer region. The bonding region comprises a plurality of the coating sets wherein the thickness of each coating set increases as the set moves away from the surface of the substrate. The outer region comprises a plurality of the coating sets wherein the thickness of each coating set is about equal.

Abstract: A spin valve structure and a method for manufacturing it are described. The spin valve uses a modified pinned layer that consists of two cobalt iron layers separated by a layer of either ruthenium, iridium, or rhodium. A key feature of the invention is that this spacer layer is significantly thinner (typically 3-4 Angstroms) than similar layers in prior art structures. Normally, when such thin spacer layers are used, annealing fields in excess of 20,000 Oersted are needed to cause the two cobalt iron layers to become antiparallel. The present invention, however, teaches that much lower annealing fields (spanning a limited range) may be used with equal effect. The result is that a very high internal pinning field is created giving devices of this type greater pinned layer stability and reduced pinning reversal. These devices also exhibits a minimum amount of open looping in their hysteresis curves.

Abstract: A system and method for forming servo patterns on magnetic medium is disclosed. A magnetic film coated with a layer of styrene-acrylonitrile is stamped with a nickel stamper reproducing the negative image of the stamper pattern on the styrene-acrylonitrile. Ions are then accelerated towards the surface of the styrene-acrylonitrile, which stops the ions in the areas where the styrene-acrylonitrile is thick and allows the ions to penetrate through to the magnetic layer in the areas where the styrene-acrylonitrile is thin. The ions, which penetrate through to the magnetic layer, interact with the magnetic layer altering the magnetic layer's structure reducing its coercivity (Hc) and remnant moment (Mrt). This reproduces the stamped styrene-acrylonitrile pattern on the magnetic layer. The styrene-acrylonitrile is then removed by oxygen plasma etching the surface leaving behind a patterned magnetic medium.

Abstract: The present invention relates to a process for coating apparatuses and apparatus parts for chemical plant construction—which are taken to mean, for example, apparatus, tank and reactor walls, discharge devices, valves, pumps, filters, compressors, centrifuges, columns, dryers, comminution machines, internals, packing elements and mixing elements—wherein a metal layer or a metal/polymer dispersion layer is deposited in an electroless manner on the apparatus(es) or apparatus part(s) to be coated by bringing the parts into contact with a metal electrolyte solution which, in addition to the metal electrolyte, comprises a reducing agent and optionally the polymer or polymer mixture to be deposited in dispersed form, where at least one polymer is halogenated.

Abstract: The present invention relates to a method for plating the surface of polymer materials with a metal film by treating the surface of polymer materials with cold plasma method to introduce hydrophilic functional groups and then plating the surface of polymer materials with a metal film according to the electroless plating method. Wherein said method is characterized in that the cold plasma treatment reduces the contact angle of the surface of polymer materials to water by 5 to 60°. Further, in said method the surface of polymer materials can be more efficiently plated with the metal film by additionally practicing the step either of immersing the polymer material into an organic solvent for 0.1 to 5 minutes or of washing the polymer material with ultrasonic washing machine, after introducing the hydrophilic functional groups by treatment of cold plasma.

Abstract: Disclosed is a method for forming a bonding pad in a TFT array process for a reflective LCD and the bonding pad formed by the method, in which an ITO is formed on the first or second metal layer directly during the fabrication of the TFT structure for the reflective LCD to thereby obtain the bonding pad directly after etching the contact window for the scan bonding pad or data bonding pad, and thus an ITO mask process for bonding pad is saved and the LCD process is simplified.

Abstract: Described is a method of treating or coating homogeneously at least a portion of the surface of a material selected from metallic materials having a thickness of less than 100 &mgr;m and/or polymeric materials. The method of the present invention comprises exposing at least a portion of the surface of the material to an atmospheric plasma generated by an indirect plasmatron. In the method of the present invention, the surface of the material may undergo at least one of an increase in surface tension, a surface grafting, a surface cleaning and a surface sterilization.

Abstract: In a method for manufacturing an Al clad product, first, cladding material is fused and coated on base material having Al. Then, slurry material is coated on the cladding material coated on the base material, the slurry material including mixture of a flux powder, a resin binder powder and a diluent. Thereafter, the slurry material is hardened to thereby provide a hardened product including the base material, the cladding material and hardened slurry material. In a subsequent step, the hardened product is brazed to thereby provide an Al clad product, wherein the diluent included in the slurry material is gasified in the hardening process of the slurry material and the cladding material is fused by employing an arc discharge technique.

Abstract: The present invention is directed to a method of controlling the formation of metal layers. In one illustrative embodiment, the method comprises depositing a layer of metal above a structure, irradiating at least one area of the layer of metal, and analyzing an x-ray spectrum of x-rays leaving the irradiated area to determine a thickness of the layer of metal. In further embodiments of the present invention, a plurality of areas, and in some cases at least five areas, of the layer of metal are irradiated. The layer of metal may be comprised of, for example, titanium, cobalt, nickel, copper, tantalum, etc.

Abstract: The use of surface-coated rutile modification TiO2 pigments having a primary particle grain size d50 of 0.1 to 1.0 &mgr;m as an anticorrosive white pigment, with firstly magnesium phosphate and secondly aluminum oxides and/or aluminum hydroxides being precipitated onto the TiO2 pigments, is described.

Abstract: Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe, Cu and Ag, or alloys thereof.

Abstract: A low-emissivity multilayer coating includes, in order outward from the substrate, a first layer including a layer containing titanium oxide, a layer containing silicon nitride, or a sublayer layer containing titanium oxide in combination with a sublayer containing silicon nitride; a second layer including Ag; a third layer including at least one layer selected from titanium oxide layers and silicon nitride layers; a fourth layer including Ag; and a fifth layer including silicon nitride. The color of the coatings can be varied over a wide range by controlling the thicknesses of the layers of titanium oxide, silicon nitride and Ag. A diffusion barrier of oxidized metal protects relatively thin, high electrical conductivity, pinhole free Ag films grown preferentially on zinc oxide substrates. Oxygen and/or nitrogen in the Ag films improves the thermal and mechanical stability of the Ag.

Abstract: A cooling system for cooling of the flow path surface region of an engine component used in a gas turbine engine and a method for making a system for cooling of the flow path surface region of an engine component used in a gas turbine engine. The method comprises the steps of channeling apertures in a substrate to a diameter of about 0.0005″ to about 0.02″ to allow passage of cooling fluid from a cooling fluid source; applying a bond coat of about 0.0005″ to about 0.005″ in thickness to the substrate such that the bond coat partially fills the channels; applying a porous inner TBC layer of at least about 0.01″ in thickness to the bond coat, such that the TBC fills the channels; applying an intermediate ceramic layer that is more dense than the inner TBC layer on top of the porous TBC; applying an outer TBC layer over the intermediate layer; and, passing cooling fluid from a cooling fluid source through the channel into the porous TBC.

Abstract: A method for improving the integrated circuits bonding firmness, whose principle is that after the later film is piled on top of the previous film, the upper surface of the later film will be affected by the previous film. Among the metal layers of the multi-level interconnection, the metal layer under and most close to the bond pad metal (the top metal layer of the multi-level interconnection) has a regular or an irregular layout pattern, which is under the predetermined regions serving as bond pad windows. These regular or irregular layout patterns result in a rough upper surface, and then improves the firmness of bond wires.

Abstract: Magnetic recording media exhibiting high SNR and high thermal stability are produced by sputter depositing a magnetic alloy overlying a non-magnetic substrate, e.g., on an underlayer, heating to eliminate thermally unstable small grains thereby increasing the average grain size of the magnetic alloy layer but narrowing the grain size distribution, depositing a layer comprising a non-ferromagnetic element, and then heating to diffuse the non-ferromagnetic element into the grain boundaries of the heat treated magnetic alloy layer. Embodiments include sputter depositing a magnetic alloy layer comprising Co and Pt on an underlayer, heating at a temperature of about 150° C. to about 600° C. to increase the average grain size to about 8 to about 10 nm, depositing a layer comprising Cr, Mn or Ta, at a thickness up to about 25 Å, e.g., up to about 10 Å, on the magnetic alloy layer and heating to diffuse the Cr, Mn or Ta into the grain boundaries of the magnetic alloy layer.

Abstract: The present invention provides a method for forming a desired plating film on a desired place at a reasonable cost. When workpieces are mixed in a plating solution containing Ni ions with a great number of Zn particles having an average diameter of 1 mm and having an electrochemically base immersion potential with respect to the precipitation potential of Ni, the Zn particles are dissolved and generates electrons, the potential of Cu electrodes in contact with the Zn particles is shifted to an electrochemically base potential side, and hence the Ni ions are precipitated on the electrodes, thereby forming Ni plating films on the surfaces of the electrodes.

Abstract: The present invention relates to methods for selectively enhancing corrosion protection of fabricated metal parts. One method of the present invention includes providing a non-galvanized metal sheet to be processed to form the fabricated metal part; selecting a localized region on the non-galvanized metal sheet; roughening the localized region for acceptance of a protective coating; applying a protective coating to localized region; and fabricating the non-galvanized metal sheet into a fabricated metal part. Another method includes providing a galvanized metal sheet; selecting a localized region on the galvanized metal sheet; applying a protective coating to the localized region; and fabricating the galvanized metal sheet into a fabricated metal part. Yet another method includes selecting a localized region on a fabricated metal part; roughening the localized region for acceptance of a protective coating; and applying the protective coating to the localized region.

Abstract: The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to palladium, and subsequently nickel is electroless deposited over the mass. The invention also includes a method of electroless deposition of nickel over aluminum-containing materials and copper-containing materials. The aluminum-containing materials and copper-containing materials are both exposed to palladium-containing solutions prior to electroless deposition of nickel over the aluminum-containing materials and copper-containing materials. Additionally, the invention includes a method of forming a solder bump over an aluminum-containing material.

Abstract: A turbine engine component is provided that has a surface that contains a plurality of depressions that are effective to increase the surface area of the component. The depressions are generally concave in contour and improve the heat transfer characteristics of the component. Methods for forming the turbine engine components are also disclosed.

Abstract: The present invention is to provide a highly adhesive surface-coated cemented carbide which comprises a cemented carbide base material and a hard film formed on a surface of the base material, characterized in that both of the hard film at a proximate portion of an interface between the hard film and the cemented carbide base material and the cemented carbide at a proximate portion of an interface contain at least one diffusive element selected from chromium, molybdenum, manganese, copper, silicon and an iron group metal and a method for producing the same by uniformly coating at least part of a surface of the base material with a metal, an alloy, or a compound comprising at least one diffusive element selected from iron group metals, chromium, molybdenum, manganese, copper, and silicon followed by coating the surface with the hard film.