Abstract: An optical recording medium having an inorganic recording film, wherein the inorganic recording film has: a first recording film containing titanium Ti; and a second recording film containing oxides of germanium Ge and tin Sn.

Abstract: Non-line-of-sight process for coating complexed shaped structures of Si-based substrates with protective barrier layers.

Abstract: A process for forming functionalized nanorods. The process includes providing a substrate, modifying the substrate by depositing a self-assembled monolayer of a bi-functional molecule on the substrate, wherein the monolayer is chosen such that one side of the bi-functional molecule binds to the substrate surface and the other side shows an independent affinity for binding to a nanocrystal surface, so as to form a modified substrate. The process further includes contacting the modified substrate with a solution containing nanocrystal colloids, forming a bound monolayer of nanocrystals on the substrate surface, depositing a polymer layer over the monolayer of nanocrystals to partially cover the monolayer of nanocrystals, so as to leave a layer of exposed nanocrystals, functionalizing the exposed nanocrystals, to form functionalized nanocrystals, and then releasing the functionalized nanocrystals from the substrate.

Abstract: A layer sequence (400), comprising an aluminium layer (300), a nickel layer (301), and a nickel layer protection layer (302; 701). The aluminium layer (300) is formable on a substrate (200), the nickel layer (301) is formed on the aluminium layer (300), and the nickel layer protection layer (302; 701) is formed on the nickel layer (301).

Abstract: A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.

Abstract: The present invention is directed to a method of refining spangle facet size in a hot-dip coated product by applying grain-refining particles to the surface of a steel substrate before immersion into the hot-dip coating bath, to an intermediate coated steel sheet, and to a finish coated steel sheet having a different coating spangle facet size on opposite surfaces.

Abstract: A coated article includes a substrate and a thermal barrier layer. An aluminide layer is between the substrate and the thermal barrier layer. A PtAl2 layer is between the aluminide layer and the thermal barrier layer.

Abstract: A heating structure of an inkjet printhead and an inkjet printhead including the heating structure. The heating structure includes a substrate, a heater formed on the substrate, an electrode formed on the heater, a passivation layer formed to cover the heaters and the electrodes, and carbon nanotubes (CNTs) formed in the passivation layer.

Abstract: A coating system is used on an engine component having an outer surface configured to be exposed to a first plurality of particles impinging against the outer surface at an angle within a first angle range and a second plurality of particles impinging at an angle in a second angle range. The system includes a bond layer overlying the engine component outer surface, a first erosion-resistant layer comprising a first material that is more resistant to erosion by particles impinging the component outer surface at an angle within the first angle range than by particles impinging within the second angle range, an interlayer overlying the first erosion-resistant layer, and a second erosion-resistant layer comprising a second material that is more resistant to erosion by particles impinging the component outer surface at an angle within the second angle range than by particles impinging within the first angle range.

Abstract: A microcantilever sensor for targeted analyte detection can generally comprise a microcantilever having a base and a beam, a metallic coating disposed substantially only on a first surface of a distal-most end of the beam, and a receptor compound immobilized to the metallic coating wherein the receptor compound can have substantially exclusive binding interaction with the analyte. The receptor compound can be a thiol-terminated bifunctional compound having a receptor site with specific binding affinity for the analyte, for example, an isolated Fab? fragment. The metallic coating can be a noble metal and/or a semi-noble metal, such as a bilayer of chromium and gold. The metallic coating can be applied to the microcantilever surface by electron-beam lithography.

Abstract: A method for depositing a platinum-group-containing layer on a substrate includes furnishing the substrate, and preparing a water-base paint containing metallic platinum-group powder, water, and a binder. The method further includes spraying the water-base paint overlying the substrate to form a platinum-group-containing layer, and thereafter heating the platinum-group-containing layer to interdiffuse the platinum-group-containing layer.

Abstract: The present invention relates to a method for fabricating a composite gas separation module and to gas separation modules formed by the method. In one embodiment, the method for fabricating a composite gas separation module includes depositing a first material on a porous substrate, thereby forming a coated substrate. The coated substrate is abraded, thereby forming a polished substrate. A second material is then deposited on the polished substrate. The first material, the second material, or both the first material and the second material can include a gas-selective material such as a hydrogen-selective metal, e.g., palladium, or an alloy thereof. In one embodiment, the method includes the step of forming a dense gas-selective membrane over the porous substrate. The present invention also relates to a method for selectively separating hydrogen gas from a hydrogen gas-containing gaseous stream.

Abstract: Disclosed is a method of reducing damage resulting from environmental electromagnetic effects on a non-metallic surface. The method includes disposing a polymeric sheet material over the non-metallic surface and disposing a metal layer between the non-metallic surface and the polymeric sheet material. Objects which includes a substrate having a non-metallic surface, a halopolymer sheet material disposed over the substrate's non-metallic surface, and a metal layer disposed between the halopolymer sheet material and the substrate's non-metallic surface are also described. Laminates are also disclosed. One such laminate includes a metal layer having a first surface and a second surface, a halopolymer sheet material bonded or adhered to the first surface of the metal layer, and an adhesive disposed on the second surface of the metal layer.

Abstract: A Ni-based first material is deposited on a substrate by electroless plating. A Zn-based second material is deposited on the first material. One or more components of at least one of the first and second materials are diffused into the other. The diffusion creates a ZnNi alloy layer enhancing corrosion resistance.

Abstract: The present invention is a method for screen printed lacquer deposition for a display device comprising aligning a mask on top of a faceplate of the display device. Next, the present invention deposits a lacquer material above the mask. Then, the present invention performs a screen printing process to apply the lacquer material through the mask and onto the faceplate to form a lacquer layer on the faceplate. Finally, the present invention dries the lacquer layer.

Abstract: A process for protecting a thermal barrier coating (TBC) on a component used in a high-temperature environment, such as the hot section of a gas turbine engine. The process applies a protective film on the surface of the TBC to resist infiltration of contaminants such as CMAS that can melt and infiltrate the TBC to cause spallation. The process generally entails applying to the TBC surface a metal composition containing at least one metal whose oxide resists infiltration of CMAS into the TBC. The metal composition is applied so as to form a metal film on the TBC surface and optionally to infiltrate porosity within the TBC beneath its surface. The metal composition is then converted to form an oxide film, with at least a portion of the oxide film forming a surface deposit on the TBC surface.

Abstract: The present invention provides adhesiveless copper clad laminates wherein there is formed a copper film layer having high adhesiveness and insulation reliability, and a method for manufacturing such adhesiveless copper clad laminates.

Abstract: A method of patterning a deposit metal on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern having a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively onto the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and depositing electrolessly a deposit metal selectively on the unfunctionalized recessed region.

Abstract: An exemplary organic light emitting display (200) includes a substrate (20), a first electrode layer (22), an organic layer (23), and a second electrode layer (21). The first electrode layer is disposed at the substrate. The organic layer is disposed at the first electrode layer. The second electrode layer includes a photic layer (210) disposed on the organic layer, an absorbing layer (211) disposed on the photic layer, and a metal layer (212) disposed on the absorbing layer. The absorbing layer is configured to absorb light beams passing through the photic layer. A method for manufacturing the organic light emitting display is also provided.

Abstract: We disclose methods of sorting or separating mixtures of living cells (e.g., eukaryotic, prokaryotic, mammalian, pathogenic, bacterial, viral, etc.). We perform our methods by activating cell-selective photophoric labels, which photosensitize and chemically reduce a photosensitive metal compound to form metal grains, particles or crystals. The metal adheres to the cells and forms the basis for sorting or separating different cell types. Photophoric labels may include chemiluminescent agents such as peroxidase enzymes activated with peroxidase substrates capable of luminescence. Photosensitive metal compounds may be present in a light-sensitive matrix or emulsion containing photosensitizable metal compounds, which form metal grains, particles or crystals upon exposure to a developer solution. Developer solutions are formulated to substantially allow living cells to remain viable after exposure to the developing solution.

Abstract: A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing a second support substrate on the first support substrate so that the metal layer is interposed between the first and second support substrates; pouring a resin material in a fluid state between the first and second support substrates; curing the resin material to form a resin substrate; and removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the resin substrate.

Abstract: The present invention provides an emissive material with excellent electron emission characteristics. In particular, the present invention relates to a method for manufacturing an emissive material consisting of oriented graphite, having a step of obtaining an oriented graphite comprising a second component and having pores on the inside by heat treating a polymer film in the presence of a second, non-carbon component.

Abstract: A method of fabricating of a metal line by a wet process is provided. A catalytic adhesive layer is formed on an insulating substrate. A fist metal layer is formed by an electoless plating process, and then, a second metal layer is formed by an electoless plating process or an electoplating process. The first and the second metal layers are patterned to form a metal line.

Abstract: The embodiments fill the need of improving electromigration and reducing stress-induced voids of copper interconnect by enabling deposition of a thin and conformal barrier layer, and a copper layer in the copper interconnect. The adhesion between the barrier layer and the copper layer can be improved by making the barrier layer metal-rich prior copper deposition and by limiting the amount of oxygen the barrier layer is exposed prior to copper deposition. Alternatively, a functionalization layer can be deposited over the barrier layer to enable the copper layer being deposit in the copper interconnect with good adhesion between the barrier layer and the copper layer. An exemplary method of preparing a substrate surface of a substrate to deposit a functionalization layer over a metallic barrier layer of a copper interconnect to assist deposition of a copper layer in the copper interconnect in an integrated system in order to improve electromigration performance of the copper interconnect is provided.

Abstract: The present invention relates to a color-coated fouling-resistant conductive cloth and a manufacturing method thereof. The method includes the steps of providing a conductive cloth interwoven by natural fibers or artificial fibers and containing a metal layer, and forming at least one colored resin-coating layer on the metal layer of the conductive cloth by means of blade coating, wherein the surface of the resin-coating layer does not exceed the intersections of warp yarns and weft yarns of the conductive cloth. The conductive cloth of the present invention has the characteristics of colored appearance, artificial or environmental contamination resistance, and low surface resistance.

Abstract: An improved seed/AFM structure is formed by first depositing a layer of tantalum on the lower shield. A NiCr layer is then deposited on the Ta followed by a layer of IrMn. The latter functions effectively as an AFM for thicknesses in the 40-80 Angstrom range, enabling a reduced shield-to-shield spacing.

Abstract: Disclosed are thixotropic compositions that are curable using ultraviolet and visible radiation. In addition, methods of applying the compositions to fiber substrates such as paper are described, as are methods of curing the coated products. Partially or fully water-resistant articles made using these compositions, such as snow melting mats, windshield protectors, and freezer defrosting sheets are also disclosed.

Abstract: A method for preparing a palladium-containing layer comprises the steps of cleaning a top surface of the porous substrate, modifying the top surface of the porous substrate to form a planar surface, performing a seeding process on the planar surface to adhere palladium nanoparticles on the planar surface and performing an electroless plating process to form the palladium-containing layer on the planar surface. The step of modifying the top surface of the porous substrate includes filling holes of the porous substrate with aluminum oxide particles, coating a sol-gel containing aluminum oxide or silicon oxide on the top surface of the porous substrate, The step of performing a seeding process on the planar surface includes exposing the planar surface of the porous substrate in a nanocolloidal solution having dispersed palladium nanoparticles derived from a palladium-containing species and a surfactant.

Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment of the present invention, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, or mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.

Abstract: A UV-emitting phosphor comprising SrB4O7:Eu phosphor particles that have been treated to yield a surface layer containing from greater than 0 to about 25 atomic percent aluminum. The holdover stability of the treated SrB4O7:Eu phosphor improves the 100-hour maintenance in a fluorescent tanning lamp to the extent that the treated phosphor may be subject to a holdover period of more than 25 days without a significant change in its 100-hour maintenance.

Abstract: A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.

Abstract: A method of fabricating a magnetic recording medium is disclosed, including a monomolecular film formation step of forming a monomolecular film on a substrate and a magnetic film formation step of forming on the monomolecular film a magnetic film for recording magnetic information. In the monomolecular film formation step, it is preferable to form a perylene-based organic monomolecular film.

Abstract: In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.

Abstract: A glass molding die and renewing method thereof. The molding die for molding glass includes a substrate, a first noble metal layer overlying the substrate, a second noble metal layer overlying the first noble metal layer, a carbon-containing third noble metal layer overlying the second noble metal layer, and a DLC passivation film overlying the third noble metal layer. In addition, the carbon-containing third noble metal layer and the DLC passivation film can be easily renewed.

Abstract: Disclosed herein is a method for forming a metal pattern by using metal nanocrystals. The method comprises the steps of: (i) coating a photosensitive compound having a substituent, which is converted into a free carboxyl group by light exposure, on a substrate to form a photosensitive film; (ii) selectively exposing the photosensitive film to light in the presence of a photoacid generator to form a latent pattern for crystal growth having a free carboxyl group; and (iii) treating the latent pattern for crystal growth with a nanometallic solution in which metal nanocrystals can be formed to grow the metal nanocrystals on the latent pattern. According to the method, a metal wiring pattern can be formed in a cost-effective and relatively simple manner. Further, the metal pattern formed by the method can be useful in the manufacture of an electromagnetic interference filter for flat panel display devices or an electrode, and can thus be applied to devices, e.g.

Abstract: The present invention provides a process for preparing a thin film having alternating monolayers of a metal-metal bonded complex monolayer and an organic monolayer by layer-by-layer growth. The process comprises the steps of: (1) applying onto a surface of a substrate a first linker compound to produce a primer layer; (2) applying onto said primer layer a layer of a metal-metal bonded complex to produce a metal-metal bonded complex monolayer on said primer layer; (3) applying onto said metal-metal bonded complex monolayer a second linker compound; and optionally (4) sequentially repeating steps (2) and (3) at least once to produce said layer-by-layer grown thin film having alternating monolayers of a metal-metal bonded complex monolayer and an organic monolayer.

Abstract: Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

Abstract: A representative method for manufacturing a highly-laminated magnetic inductor core includes: depositing at least a first layer of a ferromagnetic material; depositing at least a first layer of a sacrificial conductive material; depositing a support structure formed of a ferromagnetic material; and removing the sacrificial conductive material, thereby leaving the at least first layer of ferromagnetic material mechanically supported by the support structure.

Abstract: Composite which contains reinforcing fibers comprising carbon and whose matrix comprises silicon carbide, silicon and copper, with the mass fraction of copper in the composite being up to 55%, processes for producing it, in particular by liquid infiltration of C/C intermediate bodies with melts comprising Si and/or Cu and Si, and also its use as friction lining in a friction pairing with ceramic brake discs or clutch discs comprising C/SiC.

Abstract: A high strength composite particle comprised of a series of incrementally applied resin microlayer coatings such that each of the microlayer partial coatings are interleaved with each other is described. Methods of making the composite particles, as well as methods of using such particles as a proppant in oil and gas well hydraulic fracturing are also described.

Abstract: A method of forming a fluid ejection device is disclosed. The steps of forming the fluid ejection device may include forming a heating element on a substrate. The steps for forming the fluid ejection device may further include depositing a buffer layer over the heating element, and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer.

Abstract: This ceramic element, the visible surface of which includes features, is intended to be fitted onto a watch case. This visible surface has, at each feature, a hollow having the shape of said feature, with a depth at least equal to 0.05 mm, the side walls of said hollow being essentially perpendicular to said visible surface, the bottom of said hollows having a first tie layer of Ti, Ta, Cr or Th type, with a thickness of at least 100 nm and at least a second layer from the group Au, Ag, CrN, Ni, Pt, TiN, ZrN, Pd or alloys thereof with a thickness of at least 100 nm.

Abstract: Low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures provide solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one aspect the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another aspect, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe and Cu, or alloys thereof.

Abstract: A method for producing a disk-shaped substrate 10 used for producing an optical disk includes: (a) forming a protective layer 12a that is larger in area than the disk-shaped substrate 10 on a surface of a transparent plate 11a; and (b) cutting a portion of the plate 11a with the protective layer 12a formed thereon other than an outer edge portion of the protective layer 12a to form a disk shape. According to this producing method, a thin substrate can be prevented from being damaged by forming a protective layer. Furthermore, according to this producing method, a protective layer with a uniform thickness can be formed.

Abstract: A tri-layer anti-reflective coating for use in photolithographic applications, and specifically, for use in ultraviolet photolithographic processes. The tri-layered anti-reflective coating is used to minimize pattern distortion due to reflections from neighboring features in the construction of microcircuits. The tri-layer anti-reflection coating features a first layer, a first dielectric layer, an absorption layer disposed on the first dielectric layer, and a second dielectric layer, which is then disposed between the absorption layer and a photoresist layer. At least the absorption layer and dielectric layers can be formed using vacuum deposition. A unique character of the tri-layer anti-reflective coatings is that it dampens reflections structures having severe topologies and also allows a thinner anti-reflection layer that has a wider process latitude.

Abstract: A method of patterning self-assembled thin films, including forming a photoresist layer on a substrate and then patterning and etching the photoresist layer. In combination with the etched photoresist layer, a self-assembled layer is formed on the substrate using LbL self-assembly.

Abstract: A method of forming a rhenium layer on a substrate, comprising: applying a solid rhenium-containing compound to a substrate; reducing at a temperature above ambient temperature the rhenium-containing compound so that a rhenium layer is formed on the substrate; and optionally, repeating applying additional rhenium-containing compound on at least a section of the rhenium layer, and reducing at a temperature above ambient temperature the additional rhenium-containing compound so that a thicker layer of rhenium is formed.

Abstract: The present invention aims to provide a surface-conductive resin suitable for wiring boards, and the like, a process for forming the resin efficiently, and a wiring board using the surface-conductive resin. The surface-conductive resin according to the present invention is formed by selectively generating reactive groups capable of substitution under alkaline conditions on the resin surface, bringing the reactive groups into contact with an alkaline solution so that part of the reactive groups are substituted by alkali metal ions, bringing the substituted parts by the alkali metal ions into contact with ions of a conductive material so that the alkali metal ions are substituted by ions of the conductive material, and reducing the ions of the conductive material so that the conductive material deposits on the resin surface.

Abstract: A coating is stripped off a work piece by applying a chromous and aluminiforous coat directly on the work piece and stripping the work piece with an alkaline solution containing a strong oxidant. A single-compartment system can be used, which includes a spray chamber including a circulatory spray-cycle system; a support for holding the work piece; and a media container connected to the spray chamber via a media circulation system.

Abstract: Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the barrier layer. The method continues by performing in situ surface treatment of the metal-seed layer to form a passivation layer on the metal-seed layer. In another embodiment of a method of this invention, a substrate is provided into an electroplating tool chamber. The substrate has a barrier layer formed thereon, a metal seed layer formed on the barrier layer and a passivation layer formed over the metal seed layer. The method continues by annealing the substrate in forming gas to reduce the passivation layer. A conductive material is deposited on the substrate using an electrolytic plating or electroless plating process.