Mask Or Stencil Utilized Patents (Class 427/468)
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Patent number: 11678558Abstract: A mask assembly and an apparatus and method for manufacturing a display apparatus are provided. A mask assembly includes a mask frame and a mask on the mask frame and having at least one opening. The mask includes a mask body portion having the at least one opening, and a protruding portion arranged to surround the at least one opening and including an inner surface defining the at least one opening, the protruding portion protruding from the mask body portion and configured to protrude toward a display substrate and contact the display substrate. A deposition material is configured to pass through the at least one opening to be deposited in an entire display area of a display panel including a plurality of pixels.Type: GrantFiled: April 10, 2019Date of Patent: June 13, 2023Assignee: Samsung Display Co., Ltd.Inventors: Yalim Kim, Jongdae Lee, Sangheon Jeon, Dongseob Jeong, Youngeun Ryu, Minju Choi
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Patent number: 9773956Abstract: A method of producing a conversion element includes providing a substrate having a surface; forming a first mask structure above the surface, wherein the first mask structure has first webs and first openings arranged between the first webs and the first openings form cavities in which the surface of the substrate is accessible; arranging a second mask structure above the first mask structure, wherein the second mask structure has second webs and second openings arranged between the second webs, the first webs are at least partly covered by the second webs, and the cavities remain at least partly accessible through the second openings; spraying a material into the cavities through the second openings; removing the second mask structure; and removing the first mask structure.Type: GrantFiled: June 6, 2014Date of Patent: September 26, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Markus Richter, Markus Burger
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Patent number: 8927068Abstract: A method and apparatus for forming lithium-ion batteries and battery cell components, and more specifically, to a system and method for fabricating such batteries and battery cell components using deposition processes that form three-dimensional porous structures are provided. One method comprises texturing a conductive substrate by calendering the conductive substrate between opposing wire mesh structures, forming a first layer of cathodically active material having a first porosity on the surface of the textured conductive substrate, and forming a second layer of cathodically active material having a second porosity on the first layer, wherein the second porosity is greater than the first porosity.Type: GrantFiled: June 25, 2012Date of Patent: January 6, 2015Assignee: Applied Materials, Inc.Inventors: Karl M. Brown, Hooman Bolandi, Victor Pebenito, Josef Thomas Hoog, Connie P. Wang
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Publication number: 20140302244Abstract: A method for forming a uniform film layer structure, including providing a phosphorous powder and a first surface of an object, wherein the phosphorous powder has a plurality of phosphorous particles, at least a portion of a surface of each of the phosphorous particles is covered with an adhesive material, and the first surface does not contact the phosphorous powder; and adsorbing the phosphorous powder to the first surface of the object by using an electrostatic adsorption method.Type: ApplicationFiled: March 27, 2014Publication date: October 9, 2014Applicant: ACHROLUX INC.Inventors: Peiching Ling, DeZhong Liu
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Publication number: 20140212641Abstract: The present invention relates to a process for producing a 3-dimensional structure assembled from nanoparticles by using a mask having a pattern of perforations, which comprises the steps of: in a grounded reactor, placing a mask having a pattern of perforations corresponding to a determined pattern at a certain distance above a substrate to be patterned, and then applying voltage to the substrate to form an electrodynamic focusing lens; and introducing charged nanoparticles into the reactor, the charged particles being guided to the substrate through the pattern of perforations so as to be selectively attached to the substrate with 3-dimensional shape. According to the process of the present invention, a 3-dimensional structure of various shapes can be produced without producing noise pattern, with high accuracy and high efficiency.Type: ApplicationFiled: March 4, 2013Publication date: July 31, 2014Applicants: Global Frontier Center for Multiscale Energy Systems, SNU R&DB FoundationInventors: Hoseop Choi, Man Soo Choi
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Patent number: 8646406Abstract: A mask assembly includes a frame with an opening, at least one support stick in the frame and extending in a first direction to traverse the opening of the frame, the support stick including a communication pattern above the opening of the frame, and a mask positioned on the frame and the at least one support stick, the mask extending in a second direction perpendicular to the first direction to traverse the opening of the frame, and the mask being exposed to the opening of the frame through the communication pattern.Type: GrantFiled: December 6, 2010Date of Patent: February 11, 2014Assignee: Samsung Display Co., Ltd.Inventors: Hong-Kyun Ahn, Se-Young Oh
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Publication number: 20130101747Abstract: A shielded cable component and method that comprises a main body that has an outer surface and the main body is formed of a dielectric material and a coating that is applied to the outer surface of the main body where the coating includes a conductive or semi-conductive shielding material. An outer layer is disposed on the coating that completely encapsulates the coating and the main body and the outer layer is formed of a dielectric material.Type: ApplicationFiled: September 21, 2012Publication date: April 25, 2013Applicant: General Cable Technologies CorporationInventor: General Cable Technologies Corporation
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Patent number: 8414977Abstract: A masking jig for specifying a coating region on which a coating is formed by spraying copper powder onto a front surface of an insulating substrate from a cold spray device. This masking jig includes a metal member formed with an opening for specifying the coating region and placed in contact with the front surface of the insulating substrate. The metal member internally includes a heating wire is provided to heat the vicinity of the opening. A cooler is connected to a back surface of the insulating substrate.Type: GrantFiled: May 10, 2010Date of Patent: April 9, 2013Assignee: Toyota Jidosha Kabushiki KaishaInventor: Takashi Ikejiri
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Publication number: 20130068511Abstract: A method for printing an electrical conductor on a substrate has been developed. In the method, a reverse image of the electrical conductor pattern is printed on a substrate with an electrically non-conductive material to form a second pattern that exposes a portion of the surface area of the substrate. The entire surface area of the substrate is then covered with an electrically conductive material. The non-conductive material of the reverse image electrically isolates the electrically conductive material covering the reverse image from the electrically conductive material covering the second pattern.Type: ApplicationFiled: September 19, 2011Publication date: March 21, 2013Applicant: XEROX CORPORATIONInventor: Yiliang Wu
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Publication number: 20120276298Abstract: A painting tool for painting a vehicle wheel is disclosed. The tool includes a base and a plurality of idler wheels rotatably coupled to the base. The wheels are disposed about the base to rotatably support a workpiece. A motor is coupled to the base and includes a motor output disposed to engage the workpiece and to rotate the workpiece on the plurality of idler wheels about a workpiece axis. A mask is operatively coupled to the base. The mask is movable between an engaged position wherein the mask obscures a portion of the workpiece and a disengaged position wherein the mask is disposed away from the workpiece. A method of painting a vehicle wheel is also disclosed.Type: ApplicationFiled: July 11, 2012Publication date: November 1, 2012Applicant: R-Coating, Inc.Inventor: Robert HELMERS
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Patent number: 8273179Abstract: A deposition mask for depositing a thin film and a method for fabricating the same are disclosed. The deposition mask is configured to ensure a positioning accuracy and a pattern size accuracy and is suitable for use in manufacturing a high definition display device. The deposition mask includes at least one pattern mask having the same patterns as the patterns that are to be formed on a substrate and a frame mask which has at least one opening. The pattern mask is individually and non-detachably fixed to the frame mask at a region of the frame mask corresponding to the opening.Type: GrantFiled: November 12, 2003Date of Patent: September 25, 2012Assignee: Samsung Mobile Display Co., Ltd.Inventors: Iee-Gon Kim, Tae-Hyung Kim
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Patent number: 7985782Abstract: The present invention provides an ink for a color filter comprising a polymer binder, a crosslinking monomer, a solvent, a pigment, and a polymerization initiator. The polymer binder comprises acrylate or methacrylate including a hydroxy group. The polymer binder may comprise 2-hydroxyethyl acrylate or 2-hydroxyethyl methacrylate.Type: GrantFiled: January 9, 2007Date of Patent: July 26, 2011Assignees: Samsung Electronics Co., Ltd., Dongjin Semichem Co., Ltd.Inventors: Kwang Ho Lee, Byoung Joo Kim, Jang Sub Kim, Chang Hun Kwak, Seong Gyu Kwon, Chan Seok Park, Kyung Ah Kim, Hyun Il Cho, Gil Lae Kim, Yoon Ho Kang
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Publication number: 20110171397Abstract: A method of forming a pattern and a method of manufacturing an organic light emitting device, the method of forming a pattern including providing an electromagnetic substrate for generating an electromagnetic field at a selectively controllable position by selectively controlling where current flows through the electromagnetic substrate; providing a patterning substrate for forming a pattern; aligning the electromagnetic substrate to a first surface of the patterning substrate; selectively applying current to the electromagnetic substrate to form the electromagnetic field at the predetermined position; providing masking powder in a vicinity of a second surface of the patterning substrate such that the masking powder reacts to the electromagnetic field; supplying a pattern forming material to the second surface of the patterning substrate; and cutting off the current to the electromagnetic substrate.Type: ApplicationFiled: January 7, 2011Publication date: July 14, 2011Inventors: Hyun-Chul Lee, Jae-Seok Park, Cheol-Lae Roh, Won-Kyu Lim
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Publication number: 20110165338Abstract: An apparatus for forming a solder dam on each lead of an electronic device includes a mask having one or more slits; and forming means that forms the solder dam made of non-metal material on the lead of the electronic device through the slits of the mask.Type: ApplicationFiled: December 23, 2010Publication date: July 7, 2011Applicants: FUJITSU LIMITED, FUJITSU COMPONENT LIMITEDInventors: Masayuki KITAJIMA, Yutaka NODA, Hidehiko KOBAYASHI, Toshihiro KUSAGAYA, Kazuhiro MIZUKAMI
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Patent number: 7943202Abstract: Disclosed are apparatus and methods for fabricating a static interferometric display device. A plurality of sputtering modules is used to form static interferometric elements on a substrate. These elements each have a plurality of interferometric sub-elements that each has an interferometric stack. A first sub-element of each element is formed so that an interferometric modulation of light due to the first element's stack transmits at a first color, and a second sub-element of each element is formed so that a second color is transmitted. The sub-elements of each element are arranged with respect to each other so that all of the elements appear as a third color to a user if all the sub-elements of each element are left unmasked. A printing system is then used to mask one or more sub-elements of one or more elements so as to form, with the elements, a static image having multiple colors.Type: GrantFiled: May 7, 2008Date of Patent: May 17, 2011Assignee: Qualcomm MEMS Technologies, Inc.Inventors: Clarence Chui, Mark W. Miles, Manish Kothari
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Patent number: 7862859Abstract: A method of correcting for pattern run out in a desired pattern in directional deposition or etching comprising the steps of providing a test substrate; providing a stencil of known thickness on the test substrate; providing a stencil pattern extending through the stencil to the test substrate.Type: GrantFiled: June 1, 2007Date of Patent: January 4, 2011Assignee: RFMD (UK) LimitedInventor: Jason McMonagle
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Patent number: 7815965Abstract: A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.Type: GrantFiled: September 18, 2009Date of Patent: October 19, 2010Assignee: Ulvac, Inc.Inventors: Charles O. Edwards, David Albertalli
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Patent number: 7713767Abstract: A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The method involves forming at least one opening between a side of the optical core and an adjacent upstanding member such that the opening is defined by at least one angular sidewall. Light passing through the optical core material (or into the core from above) is reflected off this angular sidewall. The medium (e.g., air) within the opening thus also serves as a reflecting medium due to its own reflective index in comparison to that of the adjacent optical core material. The method utilizes many processes used in conventional PCB manufacturing, thereby keeping costs to a minimum.Type: GrantFiled: October 9, 2007Date of Patent: May 11, 2010Assignee: Endicott Interconnect Technologies, Inc.Inventors: Benson Chan, How T. Lin, Roy H. Magnuson, Voya R. Markovich, Mark D. Poliks
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Patent number: 7670652Abstract: A method of manufacturing a patterned film by which an accurately patterned film is formed when film formation is performed by using the AD method. The method includes the steps of: (a) disposing a multilayered mask containing at least one soft mask layer formed of a soft material and at least one hard mask layer formed of a hard material on a substrate or an electrode formed on the substrate; (b) spraying powder formed of a brittle material toward the substrate, on which the multilayered mask has been disposed, and allowing the powder to collide with an under layer to deposit the powder thereon, thereby forming a brittle material layer; and (c) removing the multilayered mask after step (b).Type: GrantFiled: February 2, 2007Date of Patent: March 2, 2010Assignee: FUJIFILM CorporationInventor: Tsutomu Sasaki
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Patent number: 7655271Abstract: In one embodiment a coating process is disclosed. The process comprises, assembling a coating shield to an article, and disposing a coating on the article via an electrostatic coating process, wherein the coating lacks electrostatic attraction to the coating shield.Type: GrantFiled: June 8, 2006Date of Patent: February 2, 2010Assignee: General Electric CompanyInventors: Patricia Chapman Irwin, Peter John Foley, Elena Rozier, Tamara Jean Kluge, John Kost
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Patent number: 7611754Abstract: A microdeposition system microdeposit droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define subfeatures of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.Type: GrantFiled: November 27, 2002Date of Patent: November 3, 2009Assignee: ULVAC, Inc.Inventors: Charles O. Edwards, David Albertalli
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Patent number: 7585549Abstract: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the substrate.Type: GrantFiled: July 9, 2004Date of Patent: September 8, 2009Assignee: Fry's Metals, Inc.Inventors: Brian G. Lewis, Bawa Singh, Robert H. Detig, Gerard R. Minogue, Dietmar C. Eberlein, Kenneth Reilly, Michael Marczi
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Patent number: 7579050Abstract: A nano-structure can be focus-patterned while minimizing the generation of a noise pattern by the inventive method which comprises the steps of: (i) mounting a plate having a nano-scale pattern formed thereon by a patterned photoresist layer on an electrode placed in an externally grounded reactor and applying a voltage to the electrode; (ii) accumulating charges selectively onto the photoresist layer on the plate mounted on the electrode; and (iii) introducing charged nanoparticle aerosol into the reactor and guiding the migration of the charged nanoparticles to the uncharged nano-scale pattern region on the plate mounted on the electrode to guide the nanoparticles to adhere to the center region of the pattern.Type: GrantFiled: February 1, 2006Date of Patent: August 25, 2009Assignee: Seoul National University Industry FoundationInventors: Mansoo Choi, Jaehyun Kim, Hongjoo Yang
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Patent number: 7541058Abstract: A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.Type: GrantFiled: October 9, 2007Date of Patent: June 2, 2009Assignee: Endicott Interconnect Technologies, Inc.Inventors: Benson Chan, How T. Lin, Roy H. Magnuson, Voya R. Markovich, Mark D. Poliks
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Publication number: 20090022901Abstract: A method of processing a substrate includes physically contacting an exposed conductive electrode of an electrostatic carrier with a conductor to electrostatically bond a substrate to the electrostatic carrier. The conductor is removed from physically contacting the exposed conductive electrode. Dielectric material is applied over the conductive electrode. The substrate is treated while it is electrostatically bonded to the electrostatic carrier. In one embodiment, a conductor is forced through dielectric material that is received over a conductive electrode of an electrostatic carrier to physically contact the conductor with the conductive electrode to electrostatically bond a substrate to the electrostatic carrier. After removing the conductor from the dielectric material, the substrate is treated while it is electrostatically bonded to the electrostatic carrier. Electrostatic carriers for retaining substrates for processing, and such assemblies, are also disclosed.Type: ApplicationFiled: July 20, 2007Publication date: January 22, 2009Inventors: Dewali Ray, Warren M. Farnworth, Kyle K. Kirby
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Patent number: 7455888Abstract: In an apparatus A in which electrode powder 10 is allowed to adhere via the electrostatic force to an electrolyte membrane that serves as a substrate 2 so as to form a catalyst layer, a screen 5 is held in a state of non-contact with the substrate 2, and a voltage is applied therebetween. The electrode powder 10 is allowed to adhere to an elastic feed roller 7, and the feed roller 7 is allowed to rotate in contact with the screen 5 by pressure. The electrode powder 10 is dispersed toward the substrate 2 so as to stably adhere thereto via both the electrostatic force and the extruding force of the elastic body. Variation of thickness and collapse of the outline are extremely reduced on the catalyst layer to be transferred and formed on the substrate (electrolyte membrane) via the electrostatic force using a conventionally used mesh-like screen so as to obtain a membrane electrode assembly with a high product manufacturing accuracy.Type: GrantFiled: February 18, 2005Date of Patent: November 25, 2008Assignee: Toyota Jidosha Kabushiki KaishiInventors: Satoshi Kadotani, Tatsuya Kawahara, Masashi Murate, Yoshifumi Kaji
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Patent number: 7452568Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.Type: GrantFiled: February 4, 2005Date of Patent: November 18, 2008Assignee: International Business Machines CorporationInventors: Gareth Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey D. Gelorme, Kathleen C. Hinge, Anurag Jain, Sung K. Kang, John U. Knickerbocker
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Patent number: 7443553Abstract: An array of discrete sensors disposed on a substrate, each sensor comprising a holographic support medium and a hologram disposed throughout the volume of the medium, whereby interaction with an analyte results in a variation of a property of the medium.Type: GrantFiled: March 11, 2004Date of Patent: October 28, 2008Assignee: Smart Holograms LimitedInventors: Christopher Robin Lowe, Colin Alexander Bennett Davidson, Jeffrey Blyth, Alexander James Marshall, Anthony Peter James
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Patent number: 7220459Abstract: A method for finishing a manufactured article by powder painting, comprising the step of applying, on a surface to be decorated of the manufactured article, one decorative layer obtained by means of the transfer by controlled migration of powder particles which originate from a graphic matrix arranged in front of the surface to be decorated and designed to adhere thereto; the transfer and adhesion steps being provided by a first electostatic field which comprises lines of force incident at right angles to the surface to be decorated, the manufactured article acting fully or partly as reference electrode for the first electrostatic field, so as to produce a condition of solid contact between the electrode and the surface to be decorated.Type: GrantFiled: August 2, 2001Date of Patent: May 22, 2007Assignee: Paradigma S.R.L.Inventor: Tito Trevisan
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Patent number: 7185419Abstract: A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predetermined pattern and a surface roughness of the mask.Type: GrantFiled: May 30, 2003Date of Patent: March 6, 2007Assignee: Samsung SDI Co., Ltd.Inventors: Chang Ho Kang, Tae Seung Kim
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Patent number: 7160573Abstract: A method of forming a color filter is provided. The method includes providing a mixture of a color filter material and a compressed fluid; providing at least a partially controlled environment for retaining a substrate, the at least partially controlled environment being in fluid communication with the mixture of the color filter material and the compressed fluid; providing a shadow mask in close proximity to the substrate retained in the at least partially controlled environment; and chargably releasing the mixture of the color filter material and the compressed fluid into the at least partially controlled environment, wherein the color filter material becomes free of the compressed fluid prior to contacting the substrate at locations defined by the shadow mask thereby forming a patterned deposition on the substrate.Type: GrantFiled: June 12, 2003Date of Patent: January 9, 2007Assignee: Eastman Kodak CompanyInventors: Sridhar Sadasivan, Ramesh Jagannathan, Seshadri Jagannathan, Rajesh Mehta, David J. Nelson, Glen C. Irvin, Jr.
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Patent number: 7144976Abstract: The present invention includes photocurable, liquid polymers incorporating coumarin ester endgroups into their molecular structure, which polymers are crosslinked upon irradiation with ultraviolet light by photochemically allowed [2+2] cycloaddition reactions among the chain ends, and which crosslinked polymers are useful in the preparation of medical devices, tissue engineering scaffolds, drug delivery systems and, in particular, in vivo preparation of implants in an open surgical procedure or laproscopically.Type: GrantFiled: May 8, 2002Date of Patent: December 5, 2006Assignee: Ethicon, Inc.Inventors: Takehisa Matsuda, Manabu Mizutani, Steven Arnold
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Patent number: 6994803Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.Type: GrantFiled: May 12, 2003Date of Patent: February 7, 2006Assignee: International Business Machines CorporationInventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
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Patent number: 6926924Abstract: A metal-composite hose having a wall including an innermost metal layer and a resin layer surrounding it, in which the metal layer has at each end portion of the hose an inner surface covered with a resin layer, an elastic rubber layer, or both. A process for manufacturing a metal-composite hose includes: forming a metal layer; covering the metal layer with an elastic rubber layer, if required; and after masking a specific portion of the metal layer, forming a thermoplastic resin layer thereon by powder or spray coating. The hose is preferably a corrugated one. It has high fluid impermeability, flexibility and strength, as well as high metal-rust resistance and sealing property at both ends.Type: GrantFiled: April 17, 2002Date of Patent: August 9, 2005Assignee: Tokai Rubber Industries, Ltd.Inventors: Kazutaka Katayama, Motoshige Hibino, Atsuo Miyajima, Hiroaki Ito
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Patent number: 6923877Abstract: A method and apparatus for improving the properties of a material of a workpiece by laser shock peening in which an overlay which is opaque to a laser beam, and an overlay which is translucent to said laser beam, are applied to a surface of a workpiece. The translucent overlay being applied on top of and over the opaque overlay. A laser beam is then directed at the said surface to which the overlays have been applied to vaporize the opaque overlay and laser shock peen the surface of the workpiece to produce a region of compressive residual stress in said surface. The overlays and the laser beam being applied concurrently, in a single operation, as the surface of the workpiece is traversed so that as each point on the surface to be treated is traversed the opaque overlay, translucent overlay, and laser shock peening are applied sequentially to that point. The opaque overlay is preferably an ink layer which is applied by printing on the surface.Type: GrantFiled: August 17, 1999Date of Patent: August 2, 2005Assignee: Rolls-Royce plcInventor: Raymond I Anderson
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Patent number: 6884139Abstract: An organic EL display device and a method for fabricating the same are disclosed, wherein an organic luminescence layer is formed at a crossing region of first and second electrodes using a shadow mask on which a plurality of holes are connected by bridges.Type: GrantFiled: July 1, 2002Date of Patent: April 26, 2005Assignee: LG Electronics Inc.Inventor: Chang Nam Kim
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Patent number: 6869541Abstract: An epoxy resin composition suitable for forming a film of excellent water repellency which comprises an epoxy resin having one or more water repellent groups and two or more cyclic aliphatic epoxy groups per molecule, a triazine-base catalyst for cationic polymerization and a non-polar solvent.Type: GrantFiled: February 21, 2003Date of Patent: March 22, 2005Assignee: Canon Kabushiki KaishaInventors: Akihiko Shimomura, Hiromichi Noguchi, Isao Imamura
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Patent number: 6844048Abstract: Provided is, among other things, a conductive inlay film comprising: a layer of dielectric film having a pattern of holes suitable to define selected regions to which particles will be deposited by electrostatic deposition; and a conductive element comprising polymer, which element comprises (a) a conductive film laminated against the dielectric film or (b) a conductive film embedded within the holes, the portion of the conductive element appearing within the holes comprising conductive inlays, wherein the conductive element is adapted to contact one or more electrode pads and provide electrical potentials at the selected regions, and wherein the dielectric film electrically isolates the selected regions.Type: GrantFiled: July 11, 2001Date of Patent: January 18, 2005Assignee: Sarnoff CorporationInventors: Ramaswamy Murari, Jen-Chi Chen, Suggy S. Chrai
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Patent number: 6840835Abstract: A masking layer (405) is provided on selected areas of an electrode structure that is at least partly performed, to define masked areas and unmasked areas (emitter cells 410). A first constituent with particles (408) and a second constituent (409) are then applied to the emitter cells (410), and the particles (408) are selectively directed towards the bottoms of the emitter cells (410)—e.g. by electrophoresis. The masking layer (405) is then removed from the masked areas, together with any stray quantities of the first and second constituents (408, 409) on the masking layer (405). The first and second constituents (408, 409) are then processed (e.g. by curing) to create broad area field electron emission sites in desired locations of the electrode structure.Type: GrantFiled: August 21, 2000Date of Patent: January 11, 2005Assignee: Printable Field Emitters LimitedInventor: Richard Allan Tuck
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Patent number: 6818251Abstract: A masking material (28) comprising an elongate strip (8, 30) at least partially coated with a layer of a pressure-sensitive adhesive (4, 22), the strip having a curved surface which is convex when the strip is viewed in cross-section and is positioned such that when the strip is adhered to a substrate by the layer of pressure-sensitive adhesive a portion of the curved surface overhangs the substrate, characterized in that the masking material comprises a removable edge portion (10, 32) comprising said portion of the curved surface detachably secured to a remainder of the strip which may be removed to expose a second curved surface on the remainder of the strip which is convex when viewed in cross-section and which is positioned to overhang the substrate, said removable portion (10, 32) and remainder of the strip (8, 30) having different dimensions.Type: GrantFiled: July 21, 2003Date of Patent: November 16, 2004Assignee: 3M Innovative Properties CompanyInventors: Phillip J. Bouic, Stephen C. P. Joseph
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Publication number: 20040182509Abstract: A multilayered stack and method of formation. First and second dielectric layers are formed, respectively including first and second liquid crystal polymer (LCP) dielectric materials, with an electrically conductive plug through the first dielectric layer. A first and second electrical circuitization is formed in direct mechanical contact with a surface of the first and second dielectric layer, respectively, wherein the second electrical circuitization mechanically and electrically contacts an end of the plug, and wherein the plug is fluxlessly soldered to the first electrical circuitization.Type: ApplicationFiled: March 30, 2004Publication date: September 23, 2004Inventors: Donald S. Farquhar, Douglas O. Powell
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Patent number: 6790483Abstract: A method produces patterned deposition on a substrate (14) from compressed fluid. A delivery system (12) cooperates with a controlled environment (30, 100, 200) retaining a substrate (14) for receiving precipitated functional material 44 along a fluid delivery path (13) from the delivery system (12). A mask (22) is arranged in close proximity to the substrate (14) for forming the patterned deposition on the substrate (14).Type: GrantFiled: December 6, 2002Date of Patent: September 14, 2004Assignee: Eastman Kodak CompanyInventors: Ramesh Jagannathan, Suresh Sunderrajan, Seshadri Jagannathan, Glen C. Irvin, Jr., Sridhar Sadasivan, David J. Nelson, Rajesh V. Mehta, John E. Rueping
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Patent number: 6780249Abstract: A system (10) produces patterned deposition on a substrate (14) from supercritical fluids. A delivery system (12) cooperates with a partial enclosure environment (30, 100, 200) retaining a movable substrate (14) for receiving precipitated functional material (44) along a fluid delivery path (13) from the delivery system (12). A shadow mask (22) is arranged in close proximity to the movable substrate (14) for forming the patterned deposition on the movable substrate (14).Type: GrantFiled: December 6, 2002Date of Patent: August 24, 2004Assignee: Eastman Kodak CompanyInventors: David J. Nelson, Suresh Sunderrajan, Ramesh Jagannathan, Seshadri Jagannathan, Glen C. Irvin, Jr., Sridhar Sadasivan, Rajesh V. Mehta, John E. Rueping
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Publication number: 20040115342Abstract: A deposition mask frame assembly, a method of manufacturing the same, and a method of manufacturing an organic electroluminescent (EL) device using the deposition mask frame assembly are provided. The deposition mask frame assembly includes a mask including a thin plate in which a predetermined pattern of apertures is formed, a frame supporting one surface of the mask so that the mask is tensed, and a cover mask supporting an opposite surface of the mask, wherein the cover mask corresponds to the frame.Type: ApplicationFiled: November 21, 2003Publication date: June 17, 2004Applicant: SAMSUNG NEC MOBILE DISPLAY CO., LTD.Inventor: Koji Shigemura
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Publication number: 20040084137Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.Type: ApplicationFiled: August 13, 2003Publication date: May 6, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
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Patent number: 6716736Abstract: In a method for manufacturing an under-bump metallurgy (UBM) layer, a plate having a plurality of openings is prepared. Then, the plate is placed on the wafer. Finally, the material of the under-bump metallurgy layer is sputtered on the wafer using the plate as a sputter mask so as to quickly form the under-bump metallurgy layer.Type: GrantFiled: January 14, 2002Date of Patent: April 6, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Kuang Chen, Chih-Hsiang Hsu
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Patent number: 6689283Abstract: A dry etching is performed using a mask made of a titanium nitride under a reaction gas of a carbon monoxide with an additive of a nitrogen containing compound gas.Type: GrantFiled: March 26, 2001Date of Patent: February 10, 2004Assignee: TDK CorporationInventors: Kazuhiro Hattori, Kenji Uchiyama
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Patent number: 6673386Abstract: A method for forming a pattern on a surface of a panel substrate, includes electrically charging pattern-forming material particles, jetting out the electrically charged pattern-forming material particles through a nozzle by applying electrostatic force to the pattern-forming material particles to form a pattern, and fixing the pattern onto the panel substrate.Type: GrantFiled: June 28, 2001Date of Patent: January 6, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Daido Komyoji, Naoko Matsuda, Akira Fukano, Katsutoshi Ogawa, Akira Kumon, Hiroyuki Naka
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Patent number: 6649030Abstract: Physical vapor deposition of radiopaque markings onto a graft is described. A graft is placed into a chamber, and a radiopaque material is vaporized and then deposited onto the graft. The chamber is kept at a temperature below the damage threshold of the graft material. A template optionally placed on the graft may define the design of the deposited radiopaque markings. The deposited radiopaque markings of the present invention may have any design and may comprise any radiopaque material.Type: GrantFiled: August 31, 2000Date of Patent: November 18, 2003Assignee: Endovascular Technologies, Inc.Inventor: Aleta A Tesar
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Publication number: 20030188430Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimetre) of a paste very soluble in water and washing it off.Type: ApplicationFiled: May 12, 2003Publication date: October 9, 2003Applicant: International Business Machines CorporationInventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon