Abstract: Provided are methods for forming polymer-infiltrated nanoparticle films by using capillary action to draw mobile molecular chains into the pores of a bed of nanoparticles. The chains can spread across the entire bed of nanoparticles. The disclosed methods also provide the formation of patterned polymer-infiltrated nanoparticle film compositions, as well as laterally graded compositions and compositions that feature a polymer gradient through the composition's thickness. Articles can be formed that include a plurality of polymer types infiltrated into the bed of nanoparticles.

Abstract: Radio frequency (RF) packages containing multilevel power substrates and associated fabrication methods are disclosed. In an embodiment, the method includes producing a multilevel substrate panel by obtaining a base panel level containing prefabricated base structures and having a surface through which metallic surfaces of the prefabricated base structures are exposed. A secondary panel level is formed on the base layer to include patterned metal features embedded in a secondary dielectric body and electrically contacting the exposed metallic surfaces of the prefabricated base structures at a direct plated interface. The presingulated array of multilevel power substrates is separated into singulated multilevel power substrates each including a base substrate level formed from a singulated piece of the base panel level and a secondary substrate level formed from a singulated piece of the secondary substrate level.

Abstract: A touch sensor includes a substrate layer, a plurality of sensing electrodes on the substrate layer, and at least one device hole penetrating through one or more of the sensing electrodes. A functional device of an image display device may overlap the device hole so that an optical interference by the touch sensor may be prevented.

Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

Abstract: An artificial muscle includes a housing including an electrode region and an expandable liquid region and a dielectric liquid housed within the housing. The artificial muscle further includes an electrode pair positioned in the electrode region of the housing, the electrode pair comprising a first electrode and a second electrode, wherein the electrode pair is configured to actuate between a non-actuated state and an actuated state such that actuation from the non-actuated state to the actuated state directs the dielectric liquid into the expandable liquid region, expanding the expandable liquid region. The artificial muscle also includes a composite electrical insulating layered structure in contact with at least one of the first electrode or the second electrode, wherein the composite electrical insulating layered structure that includes an electrical insulator layer surrounded by adhesive surfaces. The adhesive surfaces are located between one or more flexible electrical insulators.

Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

Abstract: Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

Abstract: Disclosed are examples of integrated circuit (IC) packages. Each IC package may include a flip-chip (FC) die on a substrate, a wire bond die above the FC die, a wire bond connected to the wire bond die, and a mold on the substrate and encapsulating the FC die, the wire bond die, and the wire bond. The substrate may include least a first metallization layer includes a first substrate layer, a trace on the first substrate layer and routed within the first metallization layer to electrically couple with one or more FC interconnects of the FC die, and a bond finger pad formed on the trace. The bond finger pad may be circular. The wire bond may electrically connect to the trace such that the wire bond die is electrically coupled with the FC die through the wire bond, the bond finger pad, and the trace.

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer and a surface electrode on a surface of the electronic component body. The surface electrode includes a first sintered layer on the base ceramic layer, a second sintered layer on the first sintered layer, and a plating layer on the second sintered layer. A peripheral section of the first sintered layer has an exposed surface which is not overlaid with the second sintered layer or the plating layer.

Abstract: A method for improving the impact resistance of a fiber-composite part includes positioning fibers within an expected impact region of the part, wherein at least a portion of most of the positioned fibers is oriented to be within about 45 degrees of parallel to an impact vector of an impact that occurs at the impact region. At least some of the fibers in the impact region should have relatively high impact resistance, such as glass fiber or aramid fiber, and the matrix in the impact region should have relatively high impact resistance.

Abstract: A three-dimensional inkjet printer and method for printing an aperture mask on a multi-spectral filter array. A custom tray is used by the printer allowing for printing on a prefabricated filter array. Photopolymer resin is deposited on the prefabricated filter array to form the aperture mask of dark mirror coating. An ultraviolet lamp illuminates the deposited photopolymer resin on the surface of the prefabricated multi-spectral optical filter array to cure the resin, thereby forming the mask. The prefabricated multi-spectral optical filter array includes an optical coating on at least one side, the aperture mask being formed on the optical coating, without the use of heat, chemical etching, or deformation of the optical coating.

Abstract: A wiring substrate includes an insulating layer including resin and filler particles, conductor layers including an upper-layer conductor layer and a lower-layer conductor layer such that the insulating layer is sandwiched between the upper-layer and lower-layer conductor layers, and a penetrating conductor formed in the insulating layer such that the penetrating conductor is penetrating through the insulating layer and connecting the upper-layer and lower-layer conductor layers. The penetrating conductor is formed such that the penetrating conductor has a first length which is the maximum width of the penetrating conductor in the direction orthogonal to the thickness direction of the wiring substrate and the first length is 25 ?m or less, and the insulating layer is formed such that the maximum particle size of the filler particles in a region within the distance of 40% of the first length from the penetrating conductor is 20% or less of the first length.

Abstract: Provided is an image sensor including a color separating lens array. The image sensor includes: a sensor substrate including a first pixel configured to sense light of a first wavelength and a second pixel configured to sense light of a second wavelength; a transparent spacer layer on the sensor substrate; and a color separating lens array on the spacer layer, wherein the color separating lens array condenses the light of the first wavelength toward the first pixel, and includes a first lens layer on the spacer layer, a second lens layer on the first lens layer, and an etch prevention layer between the first lens layer and the second lens layer.

Abstract: A power combiner/splitter for multiple input multiple output (MIMO) applications and a method of making the same. A metallisation stack has a plurality of layers including patterned metal features forming first and second branched arrangements of the power combiner/splitter. Each branched arrangement includes a port located at one end of that branched arrangement, and a plurality of further ports. Each branched arrangement also includes a plurality of bifurcated branches extending between each end of that branched arrangement for dividing/combining a signal passing through that branched arrangement between the port and the plurality of further ports. The metallisation stack further includes a common ground plane that is shared by the first and second branched arrangements. At least some of the patterned metal features forming the first branched arrangement overlie at least some of the patterned metal features forming the second branched arrangement.

Abstract: A press pad for a hydraulic single- or multi-stage heating press, the press pad comprising: a support fabric advantageously including metal threads; and an elastomeric material application made from a crosslinked rubber material, characterized in that the elastomeric material application is applied by a 3-D printing method to the support fabric by a printing arrangement, wherein the application is performed as a function of predetermined digitized data of a 3-D topography of the desired elastomeric material application.

Abstract: An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.

Abstract: A wiring substrate includes a first conductor layer, an insulating layer on the first layer such that the insulating layer is covering the first layer, a second conductor layer on the insulating layer such that the insulating layer is formed between the first and second layers, the connection conductors penetrating through the insulating layer and connecting the first and second layers, and a coating film formed at least partially on surface of the first layer such that the film improves adhesion between the first layer and insulating layer. The first layer includes pads and wiring patterns such that the pads are in contact with the connection conductors and that the patterns have surfaces facing the insulating layer and covered by the film, and the pads have roughened surfaces facing the insulating layer and having first surface roughness that is higher than second surface roughness of the surfaces of the patterns.

Abstract: A method of fabricating a transaction card for communicating data relating to a transaction may include forming a pattern in a plastic film using a laser plating process or a print-and-plate process; providing a conductive material in the pattern formed in the plastic film, using a plating process, to form a RF antenna layer in the plastic film, wherein the RF antenna layer includes a RF antenna; and affixing the plastic film to a surface of the transaction card to permit the RF antenna to inductively connect to a printed circuit board (PCB) of the transaction card.

Abstract: A multilayer package substrate includes a plurality of dielectric layers including a top dielectric layer on a top side and a bottom dielectric layer on a bottom side. A top patterned metal layer is on the top dielectric layer and a bottom patterned metal layer is on the bottom dielectric layer. At least one of the top dielectric layer and the bottom dielectric layer is a porous dielectric layer having a plurality of pores including an average porosity of at least 5% averaged over its thickness.

Abstract: An electronic device may include a printed circuit with a surface-mounted component. The component may produce resistive heating within the printed circuit. Resistive thermal devices (RTDs) may be embedded within the printed circuit. An RTD may at least partially overlap the electrical component. The RTD may include contact pads on a flexible substrate and a meandering conductive trace between the contact pads. The trace may have a resistance varying linearly as a function of temperature. A data acquisition system (DAQ) may measure the resistance of the RTD. Control circuitry may identify the temperature of the printed circuit based on the resistance of the RTD measured by the DAQ and may reduce power consumption by the component when the temperature exceeds a threshold. This may serve to prevent overheating in the printed circuit over time, thereby maximizing the operating life of the printed circuit.

Abstract: A method of forming an etched part includes forming a substrate including a thermoset resin and etching a surface of the substrate. The thermoset resin includes a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin. The etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites are formed on an etched surface of the substrate.

Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.

Abstract: This disclosure relates to a stretchable composite electrode and a fabricating method thereof, and particularly relates to a stretchable composite electrode including a silver nanowire layer and a flexible polymer film and a fabricating method thereof.

Abstract: A ceramic heater includes a ceramic plate having a surface that serves as a wafer placement surface, resistance heating elements that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, a recess that is formed in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, and terminals that are disposed to be exposed at a side surface of the recess and that supply electric power to the resistance heating element.

Abstract: Provided are flexible multi-battery assemblies and methods of manufacturing these assemblies. In some examples, a flexible multi-battery assembly comprises a first current collector, parsed into a first plurality of current collector portions such that each portion contacts one of a plurality of electrochemically active stacks. The second current collector may be continuous (e.g., to provide support to the electrochemically active stacks) or similarly parsed into a second plurality of current collector portions. Each electrochemically active stack forms one of flexible electrochemical cells in the flexible multi-battery assembly. Furthermore, at least one outer surface of the first current collector or the second outer surface is fully exposed, e.g., to allow forming electrical and mechanical connections directly to one or both current collectors. In some examples, an insulator layer covers a non-exposed surface of the other current collector.

Abstract: Embodiments of the present disclosure provide a radio frequency (RF) conductive medium for reducing the undesirable insertion loss of all RF hardware components and improving the Q factor or “quality factor” of RF resonant cavities. The RF conductive medium decreases the insertion loss of the RF device by including one or more conductive pathways in a transverse electromagnetic axis that are immune to skin effect loss and, by extension, are substantially free from resistance to the conduction of RF energy.

Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

Abstract: A method for depositing a decorative and/or functional layer on at least a portion of a surface of a finished or semi-finished article made of a non-conductive ceramic material, this deposition method includes the following operations: subjecting the at least a portion of the surface of the article to a carburising or nitriding treatment during which carbon, respectively nitrogen atoms, diffuse in the at least a portion of the surface of the article, then depositing, by galvanic growth of a metallic material, the decorative and/or functional layer on at least a portion of the surface of the article which has undergone the carburising or nitriding treatment.

Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.

Abstract: Low molecular weight, high Tg resins, with applications including tire additives and adhesives. An oligomer is obtained by ring opening metathesis polymerization (ROMP) of a sterically encumbered cyclic monomer with an olefinic chain transfer agent. The sterically encumbered cyclic monomer and the olefinic chain transfer agent are present in the polymerization at a molar ratio of from 2:1 to about 40:1. Also, methods for making the oligomer by ROMP.

Abstract: A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

Abstract: An electrostatic chuck includes an insulating base body including a predetermined surface, and an electrode inside the base body, which is layer shaped along the predetermined surface. An upper surface of the electrode facing a side where the predetermined surface is located and the base body are in contact. A gap which is rendered a vacuum or filled with a gas is interposed between a side surface of the electrode and the base body.

Abstract: A flexible substrate, a manufacturing method thereof, and a flexible display device are provided. The method includes: step S10, forming a first aerogel layer with a cross-linked structure and a nanoporous structure on a substrate; step S20: forming an inorganic layer on the first aerogel layer; step S30, forming a second flexible substrate layer on the first aerogel layer, and allowing the second flexible substrate layer to cover the inorganic layer; and step S40, peeling the first aerogel layer, the inorganic layer, and the second flexible substrate layer from the substrate to form the flexible substrate.

Abstract: Transaction and proximity cards having an improved construction and systems for utilizing such cards. The card system includes a card having only one top ply and only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply. In one card embodiment, the card further includes at least one inlay between the only one top ply and the only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply and the at least one inlay. In addition, the transaction card system includes card dispensers adapted to dispense the cards.

Abstract: The present disclosure provides a combined type hand warmer, including a first hand warmer unit and a second hand warmer unit; a first connection part is arranged on the first hand warmer unit, and a second connection part is arranged on the second hand warmer unit; the first connection part is detachably connected to the second connection part such that the first hand warmer unit and the second hand warmer unit are combined into a whole; and when a user needs to warm two hands/multiple body parts, the first hand warmer unit can be separated from the second hand warmer unit, and the first hand warmer unit and the second hand warmer unit can be respectively used for warming the two hands/multiple body parts.

Abstract: A circuit board includes a substrate including first and second sections with different thicknesses, a protective layer, and mounting electrodes. The substrate includes a step surface connecting a first principal surface of the first section and a first principal surface of the second section. The mounting electrodes are on the first principal surface corresponding to an element to be mounted. The protective layer is disposed over the first principal surface, the step surface, and the first principal surface. The separation distance between the mounting electrode and the step surface is greater than or equal to the terminal-to-terminal distance between the mounting electrode and the mounting electrode.

Abstract: The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point; a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein heating is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

Abstract: According to an embodiment, an etching method includes forming a first layer on a substrate having a main surface including first and second regions adjacent to each other, the first layer including a portion covering the first region and having a plurality of openings or one or more openings defining a plurality of island-shaped portions, and the first layer further including a portion as a continuous layer covering the second region, forming a catalyst layer an a portion(s) of the main surface exposed in the openings by plating, forming a second layer to cover a portion of the catalyst layer adjacent to a boundary between the first and second regions and expose a portion of the catalyst layer spaced apart from the boundary, and etching the substrate in a presence of the catalyst layer and the second layer.

Abstract: Methods of depositing platinum group metal films of high purity, low resistivity, and good conformality are described. A platinum group metal film is formed in the absence of an oxidant. The platinum group metal film is selectively deposited on a conductive substrate at a temperature less than 200° C. by using an organic platinum group metal precursor.

Abstract: The mobile terminal includes a first part, a second part, a connection structure, and a flexible circuit board. A signal is transmitted between the first part and the second part through the flexible circuit board. The flexible circuit board includes a first end and a second end. The first end is electrically connected to the first part, and the second end is electrically connected to the second part. The flexible circuit board passes through the connection structure, and a part of the flexible circuit board in the connection structure maintains a regular bending structure.

Abstract: A method for manufacturing a sandwich panel for a vehicle includes: etching a sheet, which etches one surface of a metal sheet; pressing the sheet, which forms a pattern of a specific shape on the one surface of the metal sheet; laminating a pair of the metal sheets; and performing injection-molding by injecting a plastic resin into the laminated pair of the metal sheets. The method may improve the bonding performance of the sandwich panel, thereby improving the degree of freedom of shape due to the press-molding.

Abstract: Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.

Abstract: Provided is a laminate containing a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is 0.5 to 5 ?m; and the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 ?m.

Abstract: A printable molecular ink that is can be treated (e.g. dried or curable) and sintered using broad spectrum ultraviolet light is provided to produce electrically conductive traces on a low temperature substrate, for example PET. The ink includes a silver or copper carboxylate, an organic amine compound, and may include a thermal protecting agent.

Abstract: The present invention provides a flame-retardant pressure-sensitive adhesive, comprising reaction products of the following reaction compositions based a total weight of the reaction compositions as 100 wt. %: 35-99 wt. % of a (meth)acrylate copolymer containing a functional reactive functional group, the functional reactive functional group comprising one or a plurality of the following groups: carboxyl group, hydroxyl group and epoxy group; the (meth)acrylate copolymer containing the functional reactive functional group being formed by free radical polymerization of one or a plurality of monomers; and 1-65 wt. % of a reactive organophosphorus flame retardant capable of reacting with the functional reactive functional group, the reactive organophosphorus flame retardant being formed by reaction of reaction components comprising the following substances: a compound or oligomer containing n epoxy groups, wherein n>=2, and 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.

Abstract: A display device includes a first substrate that includes a first electrode, a second substrate disposed under the first substrate and that includes, a second electrode that overlaps the first electrode, and an anisotropic conductive film disposed between the first substrate and the second substrate. The anisotropic conductive film includes an insulating resin layer and a plurality of conductive particles in the insulating resin layer. The conductive particles include first conductive particles that overlap the first electrode and the second electrode, and second conductive particles other than the first conductive particles. Each of the first conductive particles and the second conductive particles includes a first flat surface, a second flat surface that faces the first flat surface, and a curved surface rounded between the first flat surface and the second flat surface.

Abstract: A stacked capacitor includes a body having opposing faces, first side faces in a first direction, and second side faces in a second direction. The body includes a first insulation margin without a first metal film and a second insulation margin without a second metal film. The first metal film includes a metal film edge overlapping the second insulation margin. The second metal film includes a metal film edge overlapping the first insulation margin. The first and second metal films each include multiple sub-films separated by multiple first slits. A first slit includes a first portion extending from the first or second insulation margin along the first side faces and a second portion located in the metal film edge and extending at an angle with the first side faces. The second portion has a length in the first direction greater than or equal to an interval between adjacent first slits.

Abstract: A method of fabricating a photonic device includes in part, forming a multitude of metal and dielectric layers over a semiconductor substrate to form a structure. The metal layers form a continuous metal trace that characterize an etch channel. At least one of the metal layers extends towards an exterior surface of the structure such that when the structure is exposed to a metal etch, the metal etch removes the metal from the exterior surface of the structure and flows through the etch channel to fully etch the metal layers. The metal etch leaves behind a dielectric structure characterizing a photonic device. The photonic device may be a suspended rib waveguide, a suspended channel waveguide, a grating coupler, an interlayer coupler, a photodetector, a phase modulator, an edge coupler, and the like. A photonics system may include one or more of such devices.

Abstract: A multilayer coil component includes an element body formed by stacking a plurality of insulating layers on top of one another, a coil buried inside the element body, and an outer electrode that is electrically connected to the coil. The dead weight of the multilayer coil component lies in a range from 0.2 mg to 0.35 mg. The element body has a mounting surface and has a coil lead-out surface to which the coil is electrically led out and on which the outer electrode is provided. Looking at a cross section of the element body that is perpendicular to the mounting surface and the coil lead-out surface, a radius of curvature of an edge portion where the mounting surface and the coil lead-out surface intersect lies in a range from 13 ?m to 30 ?m.