Including Metal Layer Patents (Class 428/209)
  • Patent number: 11983595
    Abstract: A method of fabricating a transaction card for communicating data relating to a transaction may include forming a pattern in a plastic film using a laser plating process or a print-and-plate process; providing a conductive material in the pattern formed in the plastic film, using a plating process, to form a RF antenna layer in the plastic film, wherein the RF antenna layer includes a RF antenna; and affixing the plastic film to a surface of the transaction card to permit the RF antenna to inductively connect to a printed circuit board (PCB) of the transaction card.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: May 14, 2024
    Assignee: Capital One Services, LLC
    Inventors: Adam Koeppel, Tyler Locke
  • Patent number: 11971760
    Abstract: An electronic device may include a printed circuit with a surface-mounted component. The component may produce resistive heating within the printed circuit. Resistive thermal devices (RTDs) may be embedded within the printed circuit. An RTD may at least partially overlap the electrical component. The RTD may include contact pads on a flexible substrate and a meandering conductive trace between the contact pads. The trace may have a resistance varying linearly as a function of temperature. A data acquisition system (DAQ) may measure the resistance of the RTD. Control circuitry may identify the temperature of the printed circuit based on the resistance of the RTD measured by the DAQ and may reduce power consumption by the component when the temperature exceeds a threshold. This may serve to prevent overheating in the printed circuit over time, thereby maximizing the operating life of the printed circuit.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: April 30, 2024
    Assignee: Apple Inc.
    Inventor: Anne M. Mason
  • Patent number: 11973017
    Abstract: A multilayer package substrate includes a plurality of dielectric layers including a top dielectric layer on a top side and a bottom dielectric layer on a bottom side. A top patterned metal layer is on the top dielectric layer and a bottom patterned metal layer is on the bottom dielectric layer. At least one of the top dielectric layer and the bottom dielectric layer is a porous dielectric layer having a plurality of pores including an average porosity of at least 5% averaged over its thickness.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: April 30, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jaimal Mallory Williamson, Jim C Lo
  • Patent number: 11965045
    Abstract: A method of forming an etched part includes forming a substrate including a thermoset resin and etching a surface of the substrate. The thermoset resin includes a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin. The etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites are formed on an etched surface of the substrate.
    Type: Grant
    Filed: May 18, 2023
    Date of Patent: April 23, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Xiaojiang Wang, Shannon Christine Bollin, Robert D. Bedard, Matthew Cassoli, Ellen Cheng-Chi Lee
  • Patent number: 11963558
    Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: April 23, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomohiro Fukao, Tomoaki Sawada, Susumu Fukushima
  • Patent number: 11961972
    Abstract: Provided are flexible multi-battery assemblies and methods of manufacturing these assemblies. In some examples, a flexible multi-battery assembly comprises a first current collector, parsed into a first plurality of current collector portions such that each portion contacts one of a plurality of electrochemically active stacks. The second current collector may be continuous (e.g., to provide support to the electrochemically active stacks) or similarly parsed into a second plurality of current collector portions. Each electrochemically active stack forms one of flexible electrochemical cells in the flexible multi-battery assembly. Furthermore, at least one outer surface of the first current collector or the second outer surface is fully exposed, e.g., to allow forming electrical and mechanical connections directly to one or both current collectors. In some examples, an insulator layer covers a non-exposed surface of the other current collector.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: April 16, 2024
    Assignee: CCL LABEL, INC.
    Inventors: Jesse Smithyman, Konstantin Tikhonov, Christine Ho, Chaojun Shi
  • Patent number: 11961637
    Abstract: This disclosure relates to a stretchable composite electrode and a fabricating method thereof, and particularly relates to a stretchable composite electrode including a silver nanowire layer and a flexible polymer film and a fabricating method thereof.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 16, 2024
    Assignee: TPK ADVANCED SOLUTIONS INC.
    Inventors: Wei Sheng Chen, Ching Mao Huang, Jia Hui Zhou, Huan Ran Yu, Shu Xiong Wang, Chin Hui Lee
  • Patent number: 11963269
    Abstract: A ceramic heater includes a ceramic plate having a surface that serves as a wafer placement surface, resistance heating elements that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, a recess that is formed in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, and terminals that are disposed to be exposed at a side surface of the recess and that supply electric power to the resistance heating element.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: April 16, 2024
    Assignee: NGK INSULATORS, LTD.
    Inventors: Noboru Kajihara, Shuichiro Motoyama
  • Patent number: 11952667
    Abstract: A method for depositing a decorative and/or functional layer on at least a portion of a surface of a finished or semi-finished article made of a non-conductive ceramic material, this deposition method includes the following operations: subjecting the at least a portion of the surface of the article to a carburising or nitriding treatment during which carbon, respectively nitrogen atoms, diffuse in the at least a portion of the surface of the article, then depositing, by galvanic growth of a metallic material, the decorative and/or functional layer on at least a portion of the surface of the article which has undergone the carburising or nitriding treatment.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: April 9, 2024
    Assignee: The Swatch Group Research and Development Ltd
    Inventors: Loïc Curchod, Pierry Vuille
  • Patent number: 11953545
    Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seyoung Won, Dan-Kyu Kang, Sang-Yeol Lee
  • Patent number: 11955685
    Abstract: Embodiments of the present disclosure provide a radio frequency (RF) conductive medium for reducing the undesirable insertion loss of all RF hardware components and improving the Q factor or “quality factor” of RF resonant cavities. The RF conductive medium decreases the insertion loss of the RF device by including one or more conductive pathways in a transverse electromagnetic axis that are immune to skin effect loss and, by extension, are substantially free from resistance to the conduction of RF energy.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 9, 2024
    Assignee: Nanoton, Inc.
    Inventor: John Aldrich Dooley
  • Patent number: 11942386
    Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: March 26, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Christopher Daniel Manack, Patrick Francis Thompson, Qiao Chen
  • Patent number: 11926696
    Abstract: Low molecular weight, high Tg resins, with applications including tire additives and adhesives. An oligomer is obtained by ring opening metathesis polymerization (ROMP) of a sterically encumbered cyclic monomer with an olefinic chain transfer agent. The sterically encumbered cyclic monomer and the olefinic chain transfer agent are present in the polymerization at a molar ratio of from 2:1 to about 40:1. Also, methods for making the oligomer by ROMP.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: March 12, 2024
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Eric D. Metzger, Mika L. Shiramizu, Brian J. Rohde, Alan A. Galuska
  • Patent number: 11930601
    Abstract: A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: March 12, 2024
    Assignee: IBIDEN CO., LTD.
    Inventors: Yuji Kadowaki, Tomomi Kano
  • Patent number: 11925099
    Abstract: A flexible substrate, a manufacturing method thereof, and a flexible display device are provided. The method includes: step S10, forming a first aerogel layer with a cross-linked structure and a nanoporous structure on a substrate; step S20: forming an inorganic layer on the first aerogel layer; step S30, forming a second flexible substrate layer on the first aerogel layer, and allowing the second flexible substrate layer to cover the inorganic layer; and step S40, peeling the first aerogel layer, the inorganic layer, and the second flexible substrate layer from the substrate to form the flexible substrate.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: March 5, 2024
    Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Linshuang Li
  • Patent number: 11923227
    Abstract: An electrostatic chuck includes an insulating base body including a predetermined surface, and an electrode inside the base body, which is layer shaped along the predetermined surface. An upper surface of the electrode facing a side where the predetermined surface is located and the base body are in contact. A gap which is rendered a vacuum or filled with a gas is interposed between a side surface of the electrode and the base body.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: March 5, 2024
    Assignee: KYOCERA CORPORATION
    Inventors: Yasunori Kawanabe, Yoshihiro Okawa
  • Patent number: 11919286
    Abstract: Transaction and proximity cards having an improved construction and systems for utilizing such cards. The card system includes a card having only one top ply and only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply. In one card embodiment, the card further includes at least one inlay between the only one top ply and the only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply and the at least one inlay. In addition, the transaction card system includes card dispensers adapted to dispense the cards.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: March 5, 2024
    Assignee: AmaTech Group Limited
    Inventor: H. Russell Hallman
  • Patent number: 11916334
    Abstract: The present disclosure provides a combined type hand warmer, including a first hand warmer unit and a second hand warmer unit; a first connection part is arranged on the first hand warmer unit, and a second connection part is arranged on the second hand warmer unit; the first connection part is detachably connected to the second connection part such that the first hand warmer unit and the second hand warmer unit are combined into a whole; and when a user needs to warm two hands/multiple body parts, the first hand warmer unit can be separated from the second hand warmer unit, and the first hand warmer unit and the second hand warmer unit can be respectively used for warming the two hands/multiple body parts.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: February 27, 2024
    Inventor: Xueping Zhu
  • Patent number: 11917757
    Abstract: A circuit board includes a substrate including first and second sections with different thicknesses, a protective layer, and mounting electrodes. The substrate includes a step surface connecting a first principal surface of the first section and a first principal surface of the second section. The mounting electrodes are on the first principal surface corresponding to an element to be mounted. The protective layer is disposed over the first principal surface, the step surface, and the first principal surface. The separation distance between the mounting electrode and the step surface is greater than or equal to the terminal-to-terminal distance between the mounting electrode and the mounting electrode.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: February 27, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroki Maegawa
  • Patent number: 11903144
    Abstract: The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point; a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein heating is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: February 13, 2024
    Assignee: MATERIAL CONCEPT, INC.
    Inventor: Junichi Koike
  • Patent number: 11901185
    Abstract: According to an embodiment, an etching method includes forming a first layer on a substrate having a main surface including first and second regions adjacent to each other, the first layer including a portion covering the first region and having a plurality of openings or one or more openings defining a plurality of island-shaped portions, and the first layer further including a portion as a continuous layer covering the second region, forming a catalyst layer an a portion(s) of the main surface exposed in the openings by plating, forming a second layer to cover a portion of the catalyst layer adjacent to a boundary between the first and second regions and expose a portion of the catalyst layer spaced apart from the boundary, and etching the substrate in a presence of the catalyst layer and the second layer.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: February 13, 2024
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Mitsuo Sano, Susumu Obata, Kazuhito Higuchi, Takayuki Tajima
  • Patent number: 11894233
    Abstract: Methods of depositing platinum group metal films of high purity, low resistivity, and good conformality are described. A platinum group metal film is formed in the absence of an oxidant. The platinum group metal film is selectively deposited on a conductive substrate at a temperature less than 200° C. by using an organic platinum group metal precursor.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: February 6, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Yixiong Yang, Wei V. Tang, Seshadri Ganguli, Sang Ho Yu, Feng Q. Liu, Jeffrey W. Anthis, David Thompson, Jacqueline S. Wrench, Naomi Yoshida
  • Patent number: 11886240
    Abstract: The mobile terminal includes a first part, a second part, a connection structure, and a flexible circuit board. A signal is transmitted between the first part and the second part through the flexible circuit board. The flexible circuit board includes a first end and a second end. The first end is electrically connected to the first part, and the second end is electrically connected to the second part. The flexible circuit board passes through the connection structure, and a part of the flexible circuit board in the connection structure maintains a regular bending structure.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: January 30, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wentao Bie, Wen Fan, Chia Huan Chang, Qilin Xu, Rui Wang
  • Patent number: 11878489
    Abstract: A method for manufacturing a sandwich panel for a vehicle includes: etching a sheet, which etches one surface of a metal sheet; pressing the sheet, which forms a pattern of a specific shape on the one surface of the metal sheet; laminating a pair of the metal sheets; and performing injection-molding by injecting a plastic resin into the laminated pair of the metal sheets. The method may improve the bonding performance of the sandwich panel, thereby improving the degree of freedom of shape due to the press-molding.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: January 23, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, IL KWANG POLYMER. CO., LTD
    Inventors: Jae-Gi Sim, Hyo-Moon Joo, Yong-Wan Jo
  • Patent number: 11882654
    Abstract: Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: January 23, 2024
    Assignee: KYOCERA CORPORATION
    Inventor: Makoto Yamamoto
  • Patent number: 11877396
    Abstract: Provided is a laminate containing a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is 0.5 to 5 ?m; and the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 ?m.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: January 16, 2024
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa
  • Patent number: 11873413
    Abstract: A printable molecular ink that is can be treated (e.g. dried or curable) and sintered using broad spectrum ultraviolet light is provided to produce electrically conductive traces on a low temperature substrate, for example PET. The ink includes a silver or copper carboxylate, an organic amine compound, and may include a thermal protecting agent.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: January 16, 2024
    Inventors: Xiangyang Liu, Jianfu Ding, Patrick Roland Lucien Malenfant, Chantal Paquet, Bhavana Deore, Arnold J. Kell
  • Patent number: 11866622
    Abstract: The present invention provides a flame-retardant pressure-sensitive adhesive, comprising reaction products of the following reaction compositions based a total weight of the reaction compositions as 100 wt. %: 35-99 wt. % of a (meth)acrylate copolymer containing a functional reactive functional group, the functional reactive functional group comprising one or a plurality of the following groups: carboxyl group, hydroxyl group and epoxy group; the (meth)acrylate copolymer containing the functional reactive functional group being formed by free radical polymerization of one or a plurality of monomers; and 1-65 wt. % of a reactive organophosphorus flame retardant capable of reacting with the functional reactive functional group, the reactive organophosphorus flame retardant being formed by reaction of reaction components comprising the following substances: a compound or oligomer containing n epoxy groups, wherein n>=2, and 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: January 9, 2024
    Assignee: 3M Innovative Properties Company
    Inventors: Qing Wu, Fan Gao
  • Patent number: 11864437
    Abstract: A display device includes a first substrate that includes a first electrode, a second substrate disposed under the first substrate and that includes, a second electrode that overlaps the first electrode, and an anisotropic conductive film disposed between the first substrate and the second substrate. The anisotropic conductive film includes an insulating resin layer and a plurality of conductive particles in the insulating resin layer. The conductive particles include first conductive particles that overlap the first electrode and the second electrode, and second conductive particles other than the first conductive particles. Each of the first conductive particles and the second conductive particles includes a first flat surface, a second flat surface that faces the first flat surface, and a curved surface rounded between the first flat surface and the second flat surface.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Joo-Nyung Jang
  • Patent number: 11854747
    Abstract: A stacked capacitor includes a body having opposing faces, first side faces in a first direction, and second side faces in a second direction. The body includes a first insulation margin without a first metal film and a second insulation margin without a second metal film. The first metal film includes a metal film edge overlapping the second insulation margin. The second metal film includes a metal film edge overlapping the first insulation margin. The first and second metal films each include multiple sub-films separated by multiple first slits. A first slit includes a first portion extending from the first or second insulation margin along the first side faces and a second portion located in the metal film edge and extending at an angle with the first side faces. The second portion has a length in the first direction greater than or equal to an interval between adjacent first slits.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: December 26, 2023
    Assignee: Kyocera Corporation
    Inventor: Yoshihiro Nakao
  • Patent number: 11854734
    Abstract: A multilayer coil component includes an element body formed by stacking a plurality of insulating layers on top of one another, a coil buried inside the element body, and an outer electrode that is electrically connected to the coil. The dead weight of the multilayer coil component lies in a range from 0.2 mg to 0.35 mg. The element body has a mounting surface and has a coil lead-out surface to which the coil is electrically led out and on which the outer electrode is provided. Looking at a cross section of the element body that is perpendicular to the mounting surface and the coil lead-out surface, a radius of curvature of an edge portion where the mounting surface and the coil lead-out surface intersect lies in a range from 13 ?m to 30 ?m.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: December 26, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kouhei Matsuura
  • Patent number: 11855119
    Abstract: A method of fabricating a photonic device includes in part, forming a multitude of metal and dielectric layers over a semiconductor substrate to form a structure. The metal layers form a continuous metal trace that characterize an etch channel. At least one of the metal layers extends towards an exterior surface of the structure such that when the structure is exposed to a metal etch, the metal etch removes the metal from the exterior surface of the structure and flows through the etch channel to fully etch the metal layers. The metal etch leaves behind a dielectric structure characterizing a photonic device. The photonic device may be a suspended rib waveguide, a suspended channel waveguide, a grating coupler, an interlayer coupler, a photodetector, a phase modulator, an edge coupler, and the like. A photonics system may include one or more of such devices.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: December 26, 2023
    Assignee: California Institute of Technology
    Inventors: Craig E Ives, Seyed Mohammadreza Fatemi, Aroutin Khachaturian, Seyed Ali Hajimiri
  • Patent number: 11846686
    Abstract: The present disclosure provides a wireless flexible magnetic sensor based on magnetothermal effect, and a preparation method and a detection method thereof. The magnetic sensor includes an aerogel substrate, and magnetic nanoparticles having magnetothermal effect that are attached to a surface of the aerogel substrate. The magnetic sensor is placed in the alternating magnetic field to be measured, and then a trigger signal is generated by a data collecting device and sent to an infrared camera. The infrared camera can collect temperature distribution information at different instants of time from the surface of the magnetic sensor. A curve of temperature rise changes at different positions on the surface of the magnetic sensor can be obtained by analyzing a temperature distribution image captured by the infrared camera. Thus, a spatial distribution of the strength of the alternating magnetic field at different positions on the surface of the sensor can be determined.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: December 19, 2023
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Shejuan Xie, Yue Li, Panpan Xu, Zhenmao Chen, Jingda Tang, Hang Yang
  • Patent number: 11842853
    Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: December 12, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Jong Choi, Yoo Jeong Lee, Kwan Young Son, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park, Kwang Yeun Won
  • Patent number: 11839576
    Abstract: A selectively locking rotational bearing element includes at least one bearing element supporting an outer race for rotational movement and a plurality of locking elements disposed circumferentially about an inner surface of the outer race. An actuator selectively moves the plurality of locking elements into engagement with the outer race to restrict rotational movement of the outer race and selectively move the plurality of locking elements away from engagement with the outer race such that the outer race is free to rotate relative to the locking elements.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: December 12, 2023
    Assignee: Sunrise Medical (US) LLC
    Inventors: Samuel D. Traxinger, Jefferey Bashian
  • Patent number: 11833846
    Abstract: Building panels, especially floor panels, and a method of forming embossed in register surfaces with a digital ink head that applies a curable ink on the panel surface or on an upper side of a foil as a coating and forms an ink matrix that is used to create a cavity in the surface by applying a pressure on the ink matrix.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: December 5, 2023
    Assignee: Ceraloc Innovation AB
    Inventors: Darko Pervan, Tony Pervan
  • Patent number: 11830835
    Abstract: A semiconductor chip includes a chip pad arranged at a surface of the semiconductor chip. A dielectric layer is arranged at the surface of the semiconductor chip. The dielectric layer has an opening within which a contact portion of the chip pad is exposed, the opening having at least one straight side. The dielectric layer includes a solder flux outgassing trench arranged separate from and in the vicinity of the at least one straight side of the opening and that extends laterally beyond sides of the opening adjoining the straight side.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: November 28, 2023
    Assignee: Infineon Technologies AG
    Inventors: Michael Stadler, Paul Armand Asentista Calo
  • Patent number: 11830679
    Abstract: A multi-layer ceramic electronic component, including: a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics. The circumferential unit includes a cover that is provided to the capacitance forming unit outward in the first direction, a side margin that is provided to the capacitance forming unit outward in a second direction orthogonal to the first direction, and a grain growth region that is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: November 28, 2023
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Yoichi Kato
  • Patent number: 11823839
    Abstract: An electronic component includes an element body having a functional layer and an internal electrode layer, and an external electrode formed on a surface of the element body and connected to the internal electrode layer electrically. The chlorine concentration of the element body of the electronic component is 10 ppm or less.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: November 21, 2023
    Assignee: TDK CORPORATION
    Inventors: Kosuke Takano, Toshihiko Kaneko, Nobuto Morigasaki, Yasushi Kawashima, Momoyo Sasaki
  • Patent number: 11823966
    Abstract: A wiring substrate includes an insulating substrate, a conductor layer and an interlayer. The insulating substrate contains AlN. The conductor layer contains Cu. The interlayer is located between the insulating substrate and the conductor layer. In the interlayer, between a first region near the insulating substrate and a second region near the conductor layer, Cu concentration is higher in the second region than in the first region, and Al concentration is higher in the first region than in the second region.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: November 21, 2023
    Assignee: KYOCERA CORPORATION
    Inventors: Kyohei Yamashita, Yoshihiro Hosoi
  • Patent number: 11824040
    Abstract: A package component for carrying a device package and an insulating layer thereon includes a molding layer, first and second redistribution structures disposed on two opposite sides of the molding layer, a semiconductor die, and a through interlayer via (TIV). A hardness of the molding layer is greater than that of the insulating layer that covers the device package. The device package is mounted on the second redistribution structure, and the insulating layer is disposed on the second redistribution structure opposite to the molding layer. The semiconductor die is embedded in the molding layer and electrically coupled to the device package through the second redistribution structure. The TIV penetrates through the molding layer to connect the first and the second redistribution structure. An electronic device and a manufacturing method thereof are also provided.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: November 21, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 11823909
    Abstract: Selective deposition of a sacrificial material on a semiconductor substrate, the substrate having a surface with a plurality of regions of substrate materials having different selectivities for the sacrificial material, may be conducted such that substantial deposition of the sacrificial material occurs on a first region of the substrate surface, and no substantial deposition occurs on a second region of the substrate surface. Deposition of a non-sacrificial material may then be conducted on the substrate, such that substantial deposition of the non-sacrificial material occurs on the second region and no substantial deposition of the non-sacrificial material occurs on the first region. The sacrificial material may then be removed such that net deposition of the non-sacrificial material occurs substantially only on the second region.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: November 21, 2023
    Assignee: Lam Research Corporation
    Inventors: Kashish Sharma, Taeseung Kim, Samantha Tan, Dennis M. Hausmann
  • Patent number: 11817359
    Abstract: An organic substrate that has one or more layers. Each of the layers is made of one or more sub-patterns of conductive material disposed on a non-conductive material. The layers are divided into one or more tile subareas. A corresponding layer pair has a corresponding upper layer (with corresponding upper tile subareas) and a corresponding lower layer (with corresponding lower tile subareas) that are equidistant from and symmetric about a reference plane. Each corresponding upper tile subarea and the corresponding lower tile subarea are in a same vertical projection. A symmetric upper (lower) layout on the corresponding upper (lower) tile subarea replaces an original corresponding upper (lower) layer. The symmetric upper and lower layouts have one or more upper portions that have no electrical function but are partly responsible for making the symmetric lower layout and symmetric upper layout more thermo-mechanically symmetric and help reduce warp.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: November 14, 2023
    Assignee: International Business Machines Corporation
    Inventors: Hien Dang, Sri M. Sri-Jayantha
  • Patent number: 11814719
    Abstract: A deposition mask in which deformation of long sides is restrained is manufactured. A manufacturing method of a deposition mask includes a step of preparing a metal plate; a processing step of processing the metal plate into an intermediate product comprising: a plurality of deposition mask portions each including a pair of long sides and a pair of short sides, and having a plurality of through-holes formed therein; and a support portion that surrounds the plurality of deposition mask portions, and is partially connected to the short sides of the plurality of deposition mask portions; and a separation step of separating the deposition mask portions from the support portion to obtain the deposition mask. In the intermediate product, the long sides of the deposition mask portions are not connected to the support portion.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: November 14, 2023
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Takanori Maruoka, Sachiyo Matsuura
  • Patent number: 11807716
    Abstract: An oligomer (2,6-dimethylphenylene ether) is provided. Its structure is shown as follows: which comprises separately independent hydrogen; alkyl or phenyl; separately independent —NR—, —CO—, —SO—, —CS—, —SO2—, —CH2—, —O—, null, —C(CH3)2—, or and a hydrogen, The features of the cured products include a high glass-transition temperature, a low dielectric feature, preferred thermal stability, and good flame retardancy. The present invention effectively controls the number-average molecular weight of the product to obtain excellent organic solubility.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: November 7, 2023
    Assignee: CPC Corporation, Taiwan
    Inventors: Sheng-De Li, Ching-Hsuan Lin, Yi-Hsuan Hsieh, Wei-Yen Chen, Way-Chih Hsu, Jui-Fu Kao, Ming-Yu Huang, Jann-Chen Lin, Yih-Ping Wang
  • Patent number: 11810697
    Abstract: A resistor includes a resistive element including a first surface and a second surface; a protective film having electrical insulating properties disposed on the first surface; and a pair of electrodes in contact with the resistive element. The protective film includes a first outer edge and a second outer edge. The resistive element includes a first slit and a second slit extending from the first surface through to the second surface and extending in the second direction. The first slit is located closest to the first outer edge; and the second slit is located closest to the second outer edge. As viewed in the thickness direction, a first distance from the first outer edge to the first slit and a second distance from the second outer edge to the second slit together have a length 15% or greater of a dimension of the protective film in the first direction.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: November 7, 2023
    Assignee: ROHM CO., LTD.
    Inventor: Atsuki Yakata
  • Patent number: 11810688
    Abstract: Electrically conductive nanocomposite particles including a core of a C1-C6 alkyl polyacrylate homopolymer or a copolymer of C1-C6 alkyl acrylate and of an ?,?-unsaturated amide comonomer, a shell of polyaniline, and a non-ionic surfactant, for printing on a stretchable substrate. Also, a printed stretchable substrate obtained from the electrically conductive nanocomposite particles, which is usable, for example, in the field of printed electronics or connected clothing.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: November 7, 2023
    Assignees: UNIVERSITE DE PAU ET DES PAYS DE L'ADOUR, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Stéphanie Reynaud, Pierre Marcasuzaa
  • Patent number: 11812542
    Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.
    Type: Grant
    Filed: February 2, 2023
    Date of Patent: November 7, 2023
    Assignee: TDK CORPORATION
    Inventors: Shuichi Takizawa, Hironori Sato, Atsushi Yoshino, Hideki Kachi
  • Patent number: 11804745
    Abstract: A printed coil assembly including a flexible dielectric material, a patterned top conductive layer formed on a top surface of the flexible dielectric material, and a patterned bottom conductive layer formed on a bottom surface of the flexible dielectric material. The patterned top conductive layer and the patterned bottom conductive layer form a plurality of printed coils arranged in a plurality of printed coil rollers concentrically arranged in a cylindrical shape. Each of the plurality of printed coils includes a top layer printed coil disposed within the patterned top conductive layer and a bottom layer printed coil disposed within the patterned bottom conductive layer. Coil pitches of the coils within each roller are chosen such that corresponding ones of the plurality of printed coils in adjacent rollers are axially aligned relative to a center of the cylindrical shape.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: October 31, 2023
    Assignee: Systems, Machines, Automation Components Corporation
    Inventors: Edward A. Neff, Toan Vu, Vinh Hoang
  • Patent number: 11794460
    Abstract: A method is provided for manufacturing panels with a substrate and a decorative top layer that may include a printed motif and a transparent or translucent protective layer formed there above. The method may involve applying a first and a second finishing layer for forming a first and a second portion of the protective layer. Recesses may be formed at the surface of the second finishing layer. Hard particles may be provided in the first finishing layer.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: October 24, 2023
    Assignee: Flooring Industries Limited, SARL
    Inventor: Bruno Vermeulen