Abstract: A scratch-off coating is provided which includes a first layer of ink comprised of a water-based ink; and a second layer of ink comprised of an ultraviolet-cured ink layered over said first layer of ink, wherein upon application of a scratching force said first layer of ink and said second layer of ink are removable from a surface on which said first layer of ink and said second layer of ink are applied.

Abstract: The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification.

Abstract: The embodiment relates to a packaging substrate and a semiconductor apparatus, including an element unit including a semiconductor element; and a packaging substrate electrically connected to the element unit; and it applies a glass substrate as a core of the packaging substrate, thereby can significantly improve electrical properties such as a signal transmission rate by connecting the semiconductor element and a motherboard to be closer to each other so that electrical signals are transmitted through as short a path as possible. Therefore, it can significantly improve electrical properties such a signal transmission rate, substantially prevent generating of parasitic element, and simplify a process of treatment for an insulating layer, and thus provides a packaging substrate applicable to a high-speed circuit.

Abstract: A touch sensor includes a substrate layer, sensing electrodes on the substrate layer, and at least one device hole penetrating through one or more of the sensing electrodes. The device hole is superimposed over a functional device of an image display device such that the functional device is not positioned in the device hole. The sensing electrodes include first sensing electrodes arranged along a first direction to form a first sensing electrode row and second sensing electrodes arranged along a second direction to form a second sensing electrode column, the first and second directions being perpendicular to each other on the substrate layer. The device hole is defined by a space between a pair of the neighboring first sensing electrodes and a pair of the neighboring second sensing electrodes.

Abstract: A re-wearable physiological monitoring device includes a reusable component and a disposable component. The reusable component includes an electronics module and a latching system for latching the reusable component to the disposable component. The disposable component includes an adhesive patch to be adhered to a user's skin, two electrodes to receive electrical signals from the user's skin, a cradle for the reusable component to be latched on, and a battery to power the device. The disposable component may include a “battery disconnect switch” for disconnecting the battery when the reusable component is not latched on; a gasket for isolating each contact between the reusable component and the disposable component in a waterproof enclosure; and a printed contact within the disposable component that is resistant to scratching.

Abstract: A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to titanium surfaces. This process forms an oxide layer on a titanium surface that includes a layered double hydroxide. The layered double hydroxide both raises the bond strength and minimizes air or water leakage. The process enables the use of titanium alloys with injection molded polymer structural bonds in strong, lightweight, and water-resistant enclosures for consumer electronics.

Abstract: In an example, use of a solder joint may include a solder joint layer having a melted solder material containing Sn as a main component and further containing Ag and/or Sb and/or Cu; and a joined body including a Ni—P—Cu plating layer on a surface of the joined body in contact with the solder joint layer. The Ni—P—Cu plating layer may contain Ni as a main component and may contain 0.5% by mass or greater and 8% by mass or less of Cu and 3% by mass or greater and 10% by mass or less of P, and the Ni—P—Cu plating layer may have a microcrystalline layer at an interface with the solder joint layer.

Abstract: A method of constructing an antenna of a portable communication device. The method includes wrapping a conductive element around a flexible support, coupling the conductive element and the flexible support to a rigid connector to assemble an antenna core, and coating the antenna core with a room temperature vulcanizing (RTV) silicone layer. The method further includes fitting a first half of a silicone rubber sheath and a second half of a silicone rubber sheath around the antenna core, compression molding the first half of the silicone rubber sheath and the second half of the silicone rubber sheath around the antenna core, and bonding, by the RTV silicone layer, the silicone rubber sheath to the antenna core.

Abstract: A touch-type panel structure for a vehicle that is employed to operate electronic equipment, an air conditioning apparatus, or the like that is mounted in a vehicle, and a method of manufacturing the touch-type panel structure for a vehicle. The touch-type panel structure for a vehicle includes a touch film whose touch by a user is detected; and a transfer film arranged on a surface of a touch panel that is in a direction opposite to a direction in which a base film is arranged, wherein the touch film is formed of a multiplicity of electro-conductive plastics that have electro-conductivity; and a thermoplastic combined with the multiplicity of electro-conductive plastics.

Abstract: A multilayer ceramic capacitor includes a multilayer body including a laminate chip and side gap portions. The laminate chip includes an inner layer portion in which dielectric layers and internal electrode layers are alternately laminated, and outer layer portions respectively on both sides of the inner layer portion in a lamination direction. Side gap portions are on both sides of the laminate chip in a width direction. The multilayer ceramic capacitor further includes external electrodes respectively on both sides of the multilayer body in a length direction. When a thickness of one of the outer layer portions is defined as T1, and a thickness of one of the side gap portions is defined as W1, W1 and T1 are about 20 ?m or less, and about 0.1<|(W1-T1)|/T1<about 0.3 is satisfied.

Abstract: A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more.

Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body and including an electrode plating layer disposed to at least partially contact the internal electrodes, and a plating layer disposed on the electrode plating layer. The electrode plating layer may include a plurality of first crystal grains having a major axis of 0.2 ?m or more, and the plurality of first crystal grains may have an average ratio of a major diameter to a minor axis to 1:1 to 3:1.

Abstract: A resin composition comprising a resin and an aggregated inorganic filler, wherein an increase in a weight of a cured product of the resin composition at 85° C. and 85% RH is 0.80% or less, and wherein a storage modulus of a cured product of the resin composition excluding the inorganic filler at 200° C. is 1.0×107 Pa or more. The resin composition has a high strength and excellent moisture-absorption reflow resistance and reduces the risk of the interfacial detachment being caused by the heat expansion and contraction in the case where the resin composition or the resin cured product is combined with a metal sheet to form a multilayer body.

Abstract: A panel structure (10A) includes a substrate portion (11) and at least two ribs (12) standing on the substrate portion (11) and intersecting with each other. A substrate material portion (24) constituting the substrate portion (11) is formed by using at least matrix resin. Continuous fibers or slit continuous fibers are arranged at a position corresponding to the ribs (12) and a rib intersecting portion (13).

Abstract: A method is provided for manufacturing panels having a substrate and a decorative top layer that may include a printed motif and a transparent or translucent protective layer formed there above. The method may involve providing the substrate. A finishing layer may be applied for forming a portion of the protective layer. Recesses may be formed at a surface of the finishing layer. Forming the recesses may involve applying a surface structure-altering agent that is colored.

Abstract: In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided.

Abstract: A damping panel includes a first metal and a second metal. The first metal has a first surface and a second surface opposite the first surface. The second metal portion has a third surface and a fourth surface opposite the third surface. A fixed region is where the second surface of the first metal is fixed to the third surface of the second metal. A non-fixed region is where the second surface is not fixed to the third surface. A cavity is disposed between the second surface and the third surface at the non-fixed region. A damping material is disposed on at least one of: at least a portion of the cavity on the second surface, at least a portion of the cavity on the third surface, at least a portion of the first surface, and at least a portion of the fourth surface.

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Abstract: To provide a metal-fiber reinforced resin material (FRP) composite having a good appearance even when used as an automobile outer panel and not deformed even after a coating and baking process. The metal-FRP composite of the invention has a laminated structure of three or more layers, having at least a metal layer, a fiber-reinforced resin material layer holding a reinforced fiber material in a layer constituted by a matrix resin, and a resin layer located between the metal layer and the fiber-reinforced resin material layer. The resin layer is a layer constituted by a room temperature curing adhesive or by a predetermined resin and the room temperature curing adhesive. An elastic modulus E of the resin layer is more than 0.1 MPa and 1000 MPa or less, and a thickness of the resin layer is 0.005 times or more and less than 7.500 times a thickness of the metal layer.

Abstract: Polarization-insensitive metasurfaces using anisotropic nanostructures are disclosed. These anisotropic structures allow for an accurate implementation of phase, group delay, and group delay dispersion, while simultaneously making it possible to realize a polarizationinsensitive, diffraction-limited and achromatic metalens for wavelength, e.g., ?=from about 460 nm to about 700 nm. The approach of polarization-insensitivity can be also applied for other metasurface devices with applications in, e.g., imaging and virtual or augmented reality.

Abstract: A wiring board includes: first and second insulating layers; a first wiring conductor layer located between the first and second insulating layers and including a first via land; a second wiring conductor layer located on the second insulating layer and including a second via land; a via hole penetrating from the upper to lower surfaces of the second insulating layer; and a via conductor located in the via hole and electrically connecting the first second via lands. The via conductor is located on the inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on the upper surface of the first base layer and containing the same metal as the via conductor. An alloy layer containing tin and nichrome is located between the first via land and the first base layer.

Abstract: An inductive heating assembly for generating an aerosol from an aerosol precursor material in an aerosol provision system, the inductive heating assembly including: a susceptor; and a drive coil arranged to induce current flow in the susceptor to heat the susceptor and vaporize aerosol precursor material in proximity with a surface of the susceptor, and wherein the susceptor includes regions of different susceptibility to induced current flow from the drive coil, such that when in use the surface of the susceptor in the regions of different susceptibility are heated to different temperatures by the current flow induced by the drive coil.

Abstract: A thermoplastic liquid crystal polymer (TLCP) molded body including a thermoplastic polymer capable of forming an optically anisotropic melt phase. The TLCP molded body includes an adherend portion in at least a part of the TLCP molded body. The adherend portion has a surface satisfying: a ratio <C—O>/<COO> of 1.5 or greater in which the <C—O> represents a proportion of a peak area of [C—O bond] to a C(1s) peak area, and the <COO> represents a proportion of a peak area of [COO bond] based on the C(1s) peak area; and a ratio <C?O>/<COO> of 0.10 or higher in which the <C?O> represents a proportion of a peak area of [C?O bond] based on the C(1s) peak area, and the <COO> represents the proportion of the peak area of the [COO bond] based on the C(1s) peak area in a result of X-ray photoelectron spectroscopy analysis.

Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.

Abstract: A method of preparing a light-emitting material, the method including mixing a first precursor solution including a first precursor and a first solvent with a second precursor solution including a second precursor and a second solvent to form a precipitate, and separating the precipitate to obtain a light-emitting material, wherein a solubility of the first precursor in the first solvent may be greater than a solubility of the first precursor in the second solvent, and a solubility of the second precursor in the second solvent may be greater than a solubility of the second precursor in the first solvent. A light-emitting material prepared by the method, and a light-emitting device including the light-emitting material is also described.

Abstract: A secure instrument and associated systems and methods of authentication, the secure instrument including a polymer substrate having a first surface and a second surface; an inner layer disposed on or over the first surface of the polymer substrate, the inner layer being a conductive, absorbing, or upconverting layer and including one or more gaps therein; and an opacity layer disposed on or over the inner layer disposed on or over the first surface of the polymer substrate.

Abstract: Methods of processing coated articles, such as transparencies, are provided comprising flash annealing one or more layers of the coated article. The one or more layers may be reflective metallic layers, such as silver layers, or comprise a transparent conductive oxide, such as indium tin oxide, or a semiconductor.

Abstract: Embodiments disclosed herein include electronic packages with a bridge that comprise improved power delivery architectures. In an embodiment, a bridge comprises a substrate and a routing stack over the substrate. In an embodiment, the routing stack comprises first routing layers, where individual ones of the first routing layers have a first thickness, and a second routing layer, where the second routing layer has a second thickness that is greater than the first thickness.

Abstract: An AlN joined body includes a first AlN member and a second AlN member that are joined together. The content of yttria in the first AlN member is equal to or below the detection limit. The second AlN member contains yttria.

Abstract: A display device includes a first substrate having a thin-film transistor; a second substrate spaced apart from the first substrate; a dam disposed between the first substrate and the second substrate and disposed on an edge area of the first substrate; and a gap-maintaining film disposed between the first substrate and the second substrate and disposed on a central area of the first substrate surrounded with the edge area, wherein the dam contains an UV curable resin and a curing retarder. Thus, a sufficient time duration required for a bonding process after UV irradiation for curing the dam is secured.

Abstract: A printed circuit board according to an embodiment includes an insulating layer; and a via portion disposed on the insulating layer; wherein the via portion includes: a first pad disposed under the insulating layer; a second pad disposed on the insulating layer; and a via part disposed between the first and second pads in the insulating layer; and wherein a width of the first pad is less than or equal to a width of a lower surface of the via part.

Abstract: Provided are a display substrate, a method for manufacturing a display substrate and a display apparatus. The display substrate includes a base, a drive structure layer disposed on the base, a light emitting element disposed on the drive structure layer, an encapsulation layer disposed on the light emitting element, a circular polarizer layer disposed on the encapsulation layer, and a lens definition layer and a lens structure layer disposed on the circular polarizer layer. The light emitting element includes a pixel definition layer provided with a plurality of sub-pixel openings; the lens structure layer includes a plurality of lenses disposed at intervals, the lens definition layer is disposed in a gap region between adjacent lenses, and an orthographic projection of each lens on the base contains an orthographic projection of a sub-pixel opening on the base.

Abstract: A phase shift mask blank including a transparent substrate, an etching protection film formed on the transparent substrate, and a phase shift film formed in contact with the etching protection film, for exposure light being ArF excimer laser. The etching protection film is composed of a material containing hafnium and oxygen or hafnium, silicon and oxygen, and has a thickness of 1 to 30 nm, and a transmittance of not less than 85% with respect the exposure light, and the phase shift film is composed of a material containing silicon and being free of hafnium, and has a thickness of 50 to 90 nm.

Abstract: A method of forming a flexible circuit, including providing a flexible flat cable with a first surface and a second surface. The first surface of the flexible flat cable is diametrically opposed to the second surface. A dispensing apparatus including a nozzle is further provided, and an extruded material is dispensed through the nozzle onto the first surface of the flexible flat cable. The extruded material is shaped into a pattern and cured onto the first surface of the flexible flat cable.

Abstract: Techniques are disclosed for protecting a lithographic mask and its lithographic pattern during the lifecycle of the mask. This is accomplished by deposited an extremely uniform and geometrically conformal protective coating on the mask that provides it mechanical and electrostatic protection. The coating envelopes or surrounds the pattern on the mask thereby providing it protection during the various operations in the lifecycle of the mask, including cleanings, repairs, inspections, etc. The conformal coating is deposited using atomic layer deposition (ALD) which is preferably a plasma-enhanced ALD (PEALD) or preferably still a continuous-flow PEALD. The instant conformal coating protects various types of lithographic masks including projection or contact photomasks or extreme ultra-violet (EUV) masks. While improving the yield, the conformal coating, that may eventually be sacrificial, protects the underlying mask and its lithographic pattern from mechanical or other forms of damage.

Abstract: A multilayer ceramic capacitor and a method of manufacturing the same are disposed. The multilayer ceramic capacitor includes: a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, respectively. One of the external electrodes includes a first plating layer, and the first plating layer includes a crystal grain in which an average ratio of major and minor axes thereof is 1:1 to 3:1.

Abstract: A system and method for controlling the air temperature of a building using a control plan based on a target time. The system includes a controller which may be connected to a number of indoor and outdoor heating ventilation and air-conditioning units. The system may include a thermostat. The system may also operate without a thermostat. The method includes determining a control plan to reach a desired temperature in a target time. The method also includes updating the plan by comparing the actual time to reach the desired temperature with the target time.

Abstract: A heater includes: a flexible printed wiring board including a base film and a metal foil provided on one side of the base film; a heater circuit portion that is formed from the metal foil and generates heat when energized; and a heat conductive foil portion that is formed from the metal foil at a position away from the heater circuit portion and is maintained in a non-energized state.

Abstract: Disclosed is a method for manufacturing a supporting substrate for a semiconductor light emitting device, the method including: preparing a substrate having a groove; introducing a material into the groove of the substrate, the material serving to form a thermal and/or electrical pass; and compressing the material inwards from both ends of the groove, using a compressing means.

Abstract: A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on the first conductor layer and covering the first conductor layer, a second conductor layer formed on the interlayer insulating layer and including wirings, a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first conductor layer and the second conductor layer, and a wiring part formed in the interlayer insulating layer and including an embedded wiring layer filling one or more grooves formed in the interlayer insulating layer. The interlayer insulating layer includes a first insulating layer and a second insulating layer laminated on the first insulating layer, and the embedded wiring layer is formed in the first insulating layer on a side facing the second insulating layer and filling the groove or grooves formed in the first insulating layer.

Abstract: The disclosure relates to compositions containing alumina nanoparticles. Each alumina nanoparticle is covalently bonded to polyurethane and two different functional groups. One of the functional groups contains a fluorocarbon. The other functional group is capable of undergoing protonation. The wettability of the compositions can be altered by changes in pH. The disclosure also provides methods for synthesizing the compositions and using the compositions in oil-water separation applications.

Abstract: Discussed is a self-assembly apparatus for a plurality of semiconductor light-emitting devices, and a method for self-assembly of the plurality of semiconductor light-emitting devices, whereby the apparatus includes a chamber accommodating the plurality of semiconductor light-emitting devices and a fluid; a transferor to transfer a substrate to an assembly position; a magnet to apply a magnetic force to the plurality of semiconductor light-emitting devices; a position controller to control a position of the magnet; and a vibration generator in contact with the fluid to generate a vibration in the fluid to separate the plurality of semiconductor light-emitting devices from each other while in the fluid, wherein an electric field is produced in the substrate while the plurality of semiconductor light-emitting devices are moved according to a change of the position of the magnet.

Abstract: In an embodiment, a device includes: a back-side redistribution structure including: a metallization pattern on a first dielectric layer; and a second dielectric layer on the metallization pattern; a through via extending through the first dielectric layer to contact the metallization pattern; an integrated circuit die adjacent the through via on the first dielectric layer; a molding compound on the first dielectric layer, the molding compound encapsulating the through via and the integrated circuit die; a conductive connector extending through the second dielectric layer to contact the metallization pattern, the conductive connector being electrically connected to the through via; and an intermetallic compound at the interface of the conductive connector and the metallization pattern, the intermetallic compound extending only partially into the metallization pattern.

Abstract: In various embodiments, the present disclosure provides for reflective materials, articles and methods incorporating a mesh arrangement of multiple, discrete retroreflective canted cube corner reflectors each having generally flat incident surfaces and high transparency, with a geometry and a refractive index ratio sufficiently high enough to produce a high degree of total internal reflection (TIR) that results in anisotropic retroreflectivity.

Abstract: A light guide layer for vehicle glass, a vehicle glass and a vehicle interior lighting system are provided. The light guide layer or vehicle glass includes a transparent body or a glass body including a first surface and a second surface arranged opposite to each other, and the transparent body being adapted to be couple to vehicle glass, so as to receive light-source light emitted from a light source arranged at a predetermined position of a vehicle and allow the light-source light to propagate within the transparent body; and a light diffusion part formed in the transparent body or the glass body or on at least one of the first surface and the second surface and configured to diffusely reflect, scatter and/or refract the light-source light propagating to the light diffusion part to a predetermined area of at least one of the first surface and the second surface, so as to emit the light-source light out from the predetermined area.

Abstract: A method for producing a plastic composite panel which is provided as a layer structure. The method includes providing a film layer structure comprising an adhesive layer which is arranged between two transparent plastic films. The film layer structure is pre-molded to assume an approximately final shape and is arranged in a molding tool so that a first main surface of the film layer structure is towards the molding surface of the molding tool and so that a cavity is formed between the second main surface of the film layer structure and a surface of the molding tool. The film layer structure is then back-molded in a thermal molding method step while introducing a thermoplastic material into the cavity to provide the layer structure. A pre-molding and back-molding step, a rigidification of the thermoplastic layer, and a demolding of the layer structure is further performed.

Abstract: A data storage device includes a substrate including a number of contact pads and a number of passive component packages coupled to the contact pads. The data storage device further includes a memory controller coupled to the substrate, and one or more NAND die stacks coupled to the substrate and in electrical communication with the memory controller. One or more of the passive component packages include a first passive component, a second passive component electrically connected to the first passive component, and a first terminal coupled to the first passive component. The passive component packages further include a second terminal coupled to the second passive component, and a third terminal coupled to a common node of the first passive component and the second passive component.

Abstract: Selective deposition of a sacrificial material on a semiconductor substrate, the substrate having a surface with a plurality of regions of substrate materials having different selectivities for the sacrificial material, may be conducted such that substantial deposition of the sacrificial material occurs on a first region of the substrate surface, and no substantial deposition occurs on a second region of the substrate surface. Deposition of a non-sacrificial material may then be conducted on the substrate, such that substantial deposition of the non-sacrificial material occurs on the second region and no substantial deposition of the non-sacrificial material occurs on the first region. The sacrificial material may then be removed such that net deposition of the non-sacrificial material occurs substantially only on the second region.

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.