Abstract: A method of producing a substrate includes: applying a composition on a metal basal plate to form a coating film; and forming a metal-containing layer on at least a part of the coating film. The composition contains a solvent, and a polymer having a first terminal structure and a second terminal structure in a single molecule. Each of the first terminal structure and the second terminal structure is at least one selected from the group consisting of a structure represented by formula (1) and a structure represented by formula (2). A1 and A2 each independently represent a monovalent group having a functional group capable of forming a chemical bond with a metal atom. L2 represents —S—, —NR—, or —NA22-, wherein A22 represents a monovalent group having a functional group capable of forming a chemical bond with a metal atom.

Abstract: A battery system with a passive thermal management system is formed from a plurality of battery cells arranged on a printed circuit board assembly. In some cases, the printed circuit board assembly may include a flexible printed circuit board that is folded along an axis forming an upper and lower portion of the printed circuit board assembly. The thermal management system may include fire-blocking foam members individually attached to each battery cell. The battery cells may be arranged in a grid-like pattern to allow for a spacing arrangement between the battery cells to keep a failing battery cell from negatively affecting an adjacent battery cell. In addition, the flexible printed circuit card may include a fuse for each battery cell to shut off any current flow to a faulty battery cell if it begins to fail causing current flow to exceed beyond a predetermined current limit. The battery system may be a conformal wearable battery.

Abstract: A resin molded product includes: a laminated body including a transparent resin layer that constitutes a transparent resin substrate molded in a predetermined shape, and a metal evaporation film formed on a surface of the transparent resin layer; and a colored layer formed on one surface of the laminated body and configured to transmit infrared rays. The laminated body includes a region where the metal evaporation film is removed by an irradiation with an infrared laser beam.

Abstract: A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.

Abstract: An electro-optical apparatus includes an electro-optical panel having a first end portion, a first connector that is flexible, and a reinforcement member on the first connector. The first connector has a second end portion and a third end portion opposite to the second end portion. The second end portion is connected to the first end portion. The first connector has a first surface connected to the electro-optical panel, and a second surface opposite to the first surface. The reinforcement member is located on the first surface, and extends from an end surface at the first end portion of the electro-optical panel to the third end portion. The first connector has first and second side edges, at least one of which has a first cutout depressed inward. The first and second side edges connect the second and third end portions to each other.

Abstract: A flexible printed circuit board includes: a base film; a first circuit pattern disposed on an upper surface of the base film; a second circuit pattern disposed on a lower surface of the base film; and a boundary reinforcing pattern expanding the first circuit pattern in a width direction of the first circuit pattern based on a virtual boundary along which the first circuit pattern and the second circuit pattern meet each other in an overlay of the first circuit pattern and the second circuit pattern.

Abstract: A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.

Abstract: A bonding pad such as for a ball grid array includes a conductive pad having a top surface and a first interface surface in contact with a signal trace of a substrate, and a plating layer having a bottom surface in direct contact with the top surface of the conductive pad. The plating layer includes one or more protrusions extending toward the signal trace in a direction generally parallel to a longitudinal axis of the signal trace. Each of the one or more protrusions includes two parallel sidewalls extending upwardly from the bottom surface of the plating layer, and a second interface surface contiguous with the bottom surface of the plating layer. The second interface surface is positioned over and in direct contact with a top surface of the signal trace. The protrusions prevent the connection to the signal trace from being compromised.

Abstract: A retroreflective sign comprising a rigid substrate with a pattern of cell walls formed of a polyurethane adhesive or two-part polyurea adhesive, and a polymeric sheet having a front face and a rear face, the rear face facing the substrate, the rear face comprising microprismatic reflective elements is disclosed. The polymeric sheet is adhered directly to the cell walls formed of the polyurethane adhesive or two-part polyurea adhesive while leaving an air gap between the microprismatic retroreflective elements and the rigid substrate in the cells. A method of making the retroreflective sign includes applying a polyurethane adhesive or two-part polyurea adhesive to a front side of a rigid substrate in a pattern defining cell walls; and prior to full curing of the polyurethane adhesive, laminating the front side of the rigid substrate a rear side of a polymeric sheet via the cell walls, the polymeric sheet comprising microprismatic elements.

Abstract: In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Abstract: A dielectric film is provided. The dielectric film includes a dielectric polymer substrate having two surfaces opposite to each other and a coating layer formed on at least one of the two surfaces of the dielectric polymer substrate by chemical vapor deposition polymerization and/or irradiation polymerization. A power capacitor includes the dielectric film. A process for preparing the dielectric film is provided.

Abstract: This disclosure relates to counterfeit detection and deterrence using advanced signal processing technology including steganographic embedding and digital watermarking. Digital watermark can be used on consumer products, labels, logos, hang tags, stickers and other objects to provide counterfeit detection mechanisms.

Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.

Abstract: A photocurable composition for three-dimensional stereolithography which has a lower viscosity and from which a cured product having a high refractive index is obtained, and a three-dimensional object formed by using the composition. The composition is a photocurable composition for three-dimensional stereolithography containing a fluorene monomer, a carbazole monomer, a diluent monomer, and a photopolymerization initiator, the carbazole monomer being contained in an amount of less than 30 wt % with respect to the total amount of the fluorene monomer and the carbazole monomer, and the diluent monomer being contained in an amount of at least 20 wt % with respect to total solids.

Abstract: Integrated circuit (IC) interconnect lines having improved electromigration resistance. Multi-patterning may be employed to define a first mask pattern. The first mask pattern may be backfilled and further patterned based on a second mask layer through a process-based selective occlusion of openings defined in the second mask layer that are below a threshold minimum lateral width. Portions of material underlying openings defined in the second mask layer that exceed the threshold are removed. First trenches in an underlying dielectric material layer may be etched based on a union of the remainder of the first mask layer and the partially occluded second mask layer. The first trenches may then be backfilled with a first conductive material to form first line segments. Additional trenches in the underlayer may then be etched and backfilled with a second conductive material to form second line segments that are coupled together by the first line segments.

Abstract: A method for detecting deposited particles (P) on a surface (11) of an object (3, 14) includes: irradiating a partial region of the surface (11) of the object (3, 14) with measurement radiation; detecting measurement radiation scattered on the irradiated partial region, and detecting particles in the partial region of the surface of the object (3, 14) based on the detected measurement radiation. In the steps of irradiating and detecting, the surface (11) of the object (3, 14) has an anti-reflective coating (13) and/or a surface structure (15) for reducing the reflectivity of the surface (11) for the measurement radiation (9), wherein the particle detection limit is lowered due to the anti-reflective coating (13) and/or the surface structure (15). Also disclosed are a wafer (3) and a mask blank for carrying out the method.

Abstract: A microwave dielectric component (100) comprises a microwave dielectric substrate (101) and a metal layer, the metal layer being bonded to a surface of the microwave dielectric substrate (101). The metal layer comprises a conductive seed layer and a metal thickening layer (105). The conductive seed layer comprises an ion implantation layer (103) implanted into the surface of the microwave dielectric substrate (101) and a plasma deposition layer (104) adhered on the ion implantation layer (103). The metal thickening layer (105) is adhered on the plasma deposition layer (104). A manufacturing method of the microwave dielectric component (100) is further disclosed.

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

Abstract: A hybrid part includes a base structure and a plurality of layers of additive manufacturing material disposed on and attached to the base structure. The base structure may includes a plurality of sheets of base material, and/or a base formed by any non-additive manufacturing method. A method of forming a hybrid part includes providing a base structure that includes either or both of: a) a plurality of sheets of base material, and b) a base formed by a non-additive method. The method further includes disposing a plurality of layers of additive manufacturing material, layer by layer, onto the base structure.

Abstract: A substrate inspection apparatus is disclosed. The substrate inspection apparatus includes: a first light source configured to radiate an ultraviolet light onto a coated film of a substrate, the coated film being mixed with fluorescent pigments; a first light detector configured to capture fluorescence generated from the coated film onto which the ultraviolet light is radiated, and to obtain a two-dimensional (2D) image of the substrate; a processor configured to derive one region among a plurality of regions of the substrate based on the 2D image; a second light source configured to radiate a laser light onto the one region; and a second light detector configured to obtain optical interference data generated from the one region by the laser light, wherein the processor is configured to derive a thickness of the coated film of the one region based on the optical interference data.

Abstract: A device attachable to a substrate for improving penetration of wireless communication signals is provided. The device is a bendable resin configured to enhance penetration of an incidental radio wave from a first region through the substrate to a second region by forming one or more communication signal beams in the second region. The bendable resin includes a base layer of a first material, and one or more patterned elements each formed by providing a meta-pattern of a second material on the base layer. The first and second materials are different and selected from the group consisting of a dielectric material and a metallic material. Each individual patterned element is configured to tilt the incidental radio wave to form the one or more communication signal beams, wherein each individual communication signal beam is beam-focused at a predetermined focal point or a predetermined focal area in the second region.

Abstract: A wiring board includes: an insulating layer; and a connection terminal formed on the insulating layer. The connection terminal includes a first metal layer laminated on the insulating layer, a second metal layer laminated on the first metal layer, a metal pad laminated on the second metal layer, and a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer. An end portion of the second metal layer is in contact with the surface treatment layer, and an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end portion of the first metal layer and the surface treatment layer.

Abstract: A subwavelength grating displaying a colored image exhibiting a color corresponding to a grating period of a subwavelength grating in reflection directions including a specular reflection direction. A relief surface displaying a reflection image in monochromatic reflected light in reflection directions including a direction different from the specular reflection direction. An optical element has a first state in which neither a colored image nor a reflection image is displayed, a second state in which the colored image is mainly displayed, and a third state in which the reflection image is mainly displayed. A plane in which the optical element is disposed and a plane including a line of sight of an observer form an observation angle therebetween. The optical element is observed in any of the first, second and third states according to the observation angle.

Abstract: One embodiment provides a hard coat laminated film, comprising, in order from a surface layer side, a first hard coat, a second hard coat, and a transparent resin film layer, where the first hard coat is formed of a coating material including: (A) 100 parts by mass of a polyfunctional (meth)acrylate; (B) 0.01 to 7 parts by mass of a water repellent; (C) 0.01 to 10 parts by mass of a silane coupling agent; and (D) 0.1 to 10 parts by mass of resin microparticles having an average particle diameter of 0.5 to 10 ?m, and containing no inorganic particles, and where the second hard coat is formed of a coating material containing inorganic particles. Another embodiment provides a hard coat laminated film having, in order from a surface layer side, a first hard coat, a second hard coat, and a resin film layer. The first hard coat includes a coating material that does not include inorganic particles. The second hard coat includes a coating material including inorganic particles.

Abstract: An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.

Abstract: A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.

Abstract: A connection electrode includes a first metal film, a second metal film, a mixed layer, and an extraction electrode. The second metal film is located on the first metal film, and the extraction electrode is located on the second metal film. The mixed layer includes a mix of metal particles of the first and second metal films. As viewed in a first direction in which the first metal film and the second metal film are on top of each other, at least a portion of the mixed layer is in a first region that overlaps a bonding plane between the extraction electrode and the second metal film.

Abstract: A structure includes first to a first conductor, a second conductor, a third conductor, and a fourth conductor. The first conductor extends along a second plane including a second direction and a third direction intersecting with the second direction. The second conductor faces the first conductor along a first direction intersecting with the second plane and extends along the second plane. The third conductor capacitively connects the first conductor and the second conductor. The fourth conductor is electrically connected to the first conductor and the second conductor, and extends along a first plane including the first direction and the third direction. The third conductor faces the fourth conductor via a base. The base includes a plurality of first fiber components and a first resin component that holds the first fiber components. Part of the first fiber components extends along the first direction.

Abstract: An electronic device is disclosed. The electronic device may comprise: a housing having a first dielectric constant and including a first part; a substrate disposed inside the housing and including a communication module disposed on the surface thereof opposite to the first part; and a ceramic layer formed between the substrate and the first part to cover the communication module, wherein the first part and the ceramic layer are formed to have a second dielectric constant different from the first dielectric constant. Various other embodiments understood through the specification are possible.

Abstract: A coated gas turbine engine part includes a substrate and a calcium-magnesium-alumino-silicate CMAS protection layer present on the substrate. The layer includes a first phase of a calcium-magnesium-alumino-silicate CMAS protection material and a second phase including particles of an anti-wetting material dispersed in the first phase.

Abstract: A touch panel including a first electrode plate having a first conductive film, a second electrode plate having a second conductive film facing the first conductive film, an insulating layer disposed between the first electrode plate and the second electrode plate and having an opening, and a touch plate having a pressing member disposed at a position corresponding to the opening. The pressing member transmits pressing force applied to the touch plate to the second electrode plate, to bring the second conductive film into contact with the first conductive film.

Abstract: A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.

Abstract: Embodiments described herein are directed to interfacial layers and techniques of forming such interfacial layers. An interfacial layer having one or more light absorbing molecules is on a metal layer. The light absorbing molecule(s) may comprise a moiety exhibiting light absorbing properties. The interfacial layer can assist with improving adhesion of a resist layer to the metal layer and with improving use of one or more lithography techniques to fabricate interconnects and/or features using the resist and metal layers for a package substrate, a semiconductor package, or a PCB. For one embodiment, the interfacial layer includes, but is not limited to, an organic interfacial layer. Examples of organic interfacial layers include, but are not limited to, self-assembled monolayers (SAMs), constructs and/or variations of SAMs, organic adhesion promotor moieties, and non-adhesion promoter moieties.

Abstract: An electromagnetic-wave absorber having a body of porous material, including a first surface for receiving electromagnetic waves is described. Starting from the first surface, a first layer for scattering the electromagnetic waves includes pores which are coated with electrically conductive material. The electromagnetic-wave absorber also includes a second layer positioned after the first layer which is substantially transparent to the electromagnetic waves.

Abstract: A flexible inductor mounted on a flexible substrate can be deformed while following deflection of the flexible substrate over time, and has high resistance to drop impact. The flexible inductor includes a coil substrate having a spiral conductor on at least one of upper and lower surfaces, and first and second magnetic sheets laminated on the upper and lower surfaces, respectively. First and second outer electrodes are provided in a peripheral edge portion of the lower surface. The first and second electrodes make direct contact with the lower surface, and are electrically connected to outermost and innermost end portions, respectively, of the spiral conductor. The second magnetic sheet is laminated on the lower surface other than portions corresponding to the first and second outer electrodes. Thicknesses of the first and second outer electrodes are equal to or larger than a thickness of the second magnetic sheet.

Abstract: The present disclosure relates to a multilayer ceramic substrate preparation method.

Abstract: A component carrier includes a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; a dielectric filling medium filling at least part of the at least one recess; and a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium. A method of manufacturing a component carrier includes forming a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; at least partially filling the at least one recess by a dielectric filling medium; and thereafter forming a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium.

Abstract: A credential with one or more security features is disclosed. The disclosed credential includes a windowed security feature. The windowed security feature is taught to include a mirror element positioned in proximity with a transparent window and a first photo-luminescent feature positioned relative to the transparent window and the mirror element such that the mirror element enhances a luminescence of the first photo-luminescent feature when viewed and illuminated through the transparent window.

Abstract: An embodiment of the present application discloses an optical fingerprint identification apparatus and an electronic device, which can improve performance of the optical fingerprint identification apparatus. The optical fingerprint identification apparatus includes: a light detection array; a filter layer, disposed above the light detection array, where the filter layer is integrated with the light detection array in a photosensor chip; a first light blocking layer formed above the filter layer, where the first light blocking layer is provided with a plurality of light passing holes; and a first microlens array disposed above the first light blocking layer, where the first microlens array is configured to converge the optical signal to the plurality of light passing holes of the first light blocking layer, and the optical signal is transmitted to the light detection array through the plurality of light passing holes of the first light blocking layer.

Abstract: Described herein are a bonded ceramic and a manufacturing method therefor. The bonded ceramic includes: a first ceramic substrate; and a second ceramic substrate, wherein the first ceramic substrate and the second ceramic substrate are bonded to each other without an adhesive layer therebetween and include pores, each of which is formed along a bonded surface therebetween and has a size of 0.01 to 50 ?m.

Abstract: A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face.

Abstract: An electronic device includes a first battery, a second battery, and a serial-parallel conversion circuit. The serial-parallel conversion circuit is coupled to the first battery and the second battery, and is configured to, according to a control signal, couple the first battery and the second battery in series so as to reversely charge on a to-be-charged device by the first battery and the second battery, or couple the first battery and the second battery in parallel so as to supply power to the electronic device by the first battery and the second battery.

Abstract: An electronic component includes a body portion and an external electrode on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer has a S concentration of not less than about 5.2×1018 atoms/cm3.

Abstract: The disclosure relates to an electronic device including a housing filled to a fill level with a first matrix produced from a first potting compound, and a circuit board having a component arranged thereon and having a passageway that connects a component side arranged within the housing interior filled with the first matrix and a front face of the component arranged outside the housing interior filled with the first matrix, the passageway acts as capillaries for media whose viscosity is less than a limit and as barriers for media whose viscosity is greater than the limit, the component is arranged in a spatially bounded region adjoining the component side, a second matrix produced from a second potting compound having a viscosity exceeding the limit, which second matrix effects a terminal sealing of the connection formed by the passageway against the first potting compound used for producing the first matrix.

Abstract: An electro-optical apparatus includes an electro-optical panel having a first end portion, a first connector that is flexible, and a reinforcement member on the first connector. The first connector has a second end portion and a third end portion opposite to the second end portion. The second end portion is connected to the first end portion. The first connector has a first surface connected to the electro-optical panel, and a second surface opposite to the first surface. The reinforcement member is located on the first surface, and extends from an end surface at the first end portion of the electro-optical panel to the third end portion. The first connector has first and second side edges, at least one of which has a first cutout depressed inward. The first and second side edges connect the second and third end portions to each other.

Abstract: A manufacturing method of transformer circuit board includes following steps: plate stamping, forming a plurality of metal plates with a stamping mold; primary layering, layering the metal plates that are in alignment with each other between two outer insulation layers, with an inner insulation layer disposed between the two metal plates; primary pressing, hot pressing the metal plates to fix the metal plates between the two outer insulation layers; secondary layering, layering another metal plate on the outer side of the two outer insulation layers, respectively, corresponding to the positions of the previously layered metal plates; secondary pressing, hot pressing the metal plates on the outer side of the outer insulation layers, and printing to form a solder mask layer on the outer insulation layers. Finally, cutting to form a transformer circuit board with low leakage inductance and high EMI shield.

Abstract: A polarization apparatus includes a conductive carrier, a dielectric barrier discharge (DBD) plasma source, an electric net, a DBD power supply, and a DC power supply. The conductive carrier has a carrying surface which is configured to carry a work piece. The work piece includes a piezoelectric material film, and the conductive carrier is grounded. The DBD plasma source is disposed over the carrying surface and is configured to apply plasma toward the piezoelectric material film. The electric net is disposed between the carrying surface and the DBD plasma source. The DBD power supply includes a first electrode and a second electrode, in which the first electrode is electrically connected to the DBD plasma source, and the second electrode is grounded. The DC power supply includes a third electrode and a fourth electrode. The third electrode is electrically connected to the electric net, and the fourth electrode is grounded.

Abstract: A decorative member according the present disclosure includes: a wooden veneer having a plurality of through-holes which transmit light from a back face side to a front face side; a transparent reinforcing layer laminated to a back face side of the veneer; and a coating layer which is laminated to a front face side of the veneer and fills interiors of the plurality of through-holes.

Abstract: Thermal cutting surgical instruments incorporate a blade incorporating a first substrate of high thermal conductivity material in the heated portion of the blade and a support and, the first substrate of high thermal conductivity material joined to a second substrate of low thermal conductivity material in the support region of the blade; an electrically insulative dielectric layer disposed on the first surface of the first substrate and on the first surface of second substrate; an electrically resistive heating element disposed on the electrically insulative dielectric; electrically conductive power leads and electrically conductive sense leads disposed on the electrically insulative dielectric layer and that are in electrical communication with the electrically resistive heating element; and an electrically insulative dielectric overcoat layer disposed on the electrically resistive heating element and on the distal portion of the electrically conductive power leads and electrically conductive sense leads.

Abstract: A method of manufacturing a magnetic recording medium forms an unfinished product including a magnetic recording layer and a protection layer that are successively formed on a substrate, and forms a lubricant layer on the protection layer of the unfinished product. The lubricant layer is formed by coating a first organic fluorine compound on the protection layer of the unfinished product, and supplying a gas, including a second organic fluorine compound, onto the protection layer of the unfinished product, and decomposing the second organic fluorine compound by Townsend discharge and ultraviolet ray irradiation. The protection layer includes carbon, and the first organic fluorine compound includes a functional group at a terminal thereof.