Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.

Abstract: The present invention provides the substrate comprises a fiber film base material comprising a sheet of a surface-treated fiber film or a plural number of sheets of the surface-treated fiber films being laminated, wherein the surface-treated fiber film has a value of a conventional flexural rigidity measured by a method according to JIS R 3420 of 3-fold to 100-fold to a value of a conventional flexural rigidity of an untreated fiber film. There can be provided a substrate having a uniform and homogeneous insulating layer which does not generate unfastening or twisting of a fiber, and in addition to heat resistance, dimensional stability and impact resistance, having further excellent in bendability and flexibility.

Abstract: The invention relates to a film body, a method for the back-injection molding of a film body and a back-injection molding tool therefor. In particular, the invention relates to a method for the back-injection molding of layer electrodes (1) for producing touch-sensitive sensors for example for touch screens. Parts of the layer electrode (1), which after the back-injection molding should still be able to move freely, are covered by a sacrificial film (3) before and during the back-injection molding.

Abstract: Various sapphire and laminate structures are discussed herein. One embodiment may take the form of a sapphire structure having a first sapphire sheet with a first sapphire plane type forming the major surface and a second sapphire sheet having a second different sapphire plane type forming the major surface. The first and second sapphire sheets are fused together to form the sapphire structure.

Abstract: The present invention is a solventless one liquid type cyanate ester-epoxy resin composition having high thermal resistance as well as excellent storage stability and curing properties, which contains (A) cyanate ester, (B) epoxy resin, (C) guanidine compounds and (D) at least one kind of phenol compounds selected from a group consisting of phenol compounds represented by the following general formulae. In the general formulae, 1 is an integer selected from 0 to 4, R1 represents an unsubstituted or fluorine-substituted monovalent hydrocarbon group.

Abstract: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

Abstract: There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.

Abstract: Provided are a traffic signal housing and a road sign which are higher in weather resistance and lighter in weight as compared with conventional traffic signal housings and road signs using metal plates. A traffic signal housing and a road sign each made of a high-strength fiber composite in which a surface of a prepreg in which a thermoplastic resin has been combined with a sheet-shaped high-strength fiber including carbon fiber or basalt fiber has been coated with a thermosetting resin, wherein the prepreg is one prepared b thermally pressing a laminate in Which a sheet-shaped thermoplastic resin and said sheet-shaped high-strength fiber have been laminated together in a sandwich structure, are high in weather resistance to salt damage and so on, and moreover since they are lightweight, poles with reduced strength can be used therefor.

Abstract: An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can be used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cured, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.

Abstract: Apparatus and methods are disclosed for a safety door of an oven having glass therein with a plastic laminate. The safety door retains glass within the door in order to prevent glass from falling or being forced outside of the oven, which may cause injury.

Abstract: Provided is a circuit substrate, including a glass film (10) forming a rough layer (11) after surface roughness processing, a resin adhesion (20) located the rough layer (11) on either side of the glass film (10), and a metal foil (30) located on the outside of resin adhesion layer (20). The glass film (10), the resin adhesion layer (20) and the metal foil (30) are joined together through suppressing. The circuit substrate employs the glass film (10) which forms a rough layer (11) after surface roughness processing as a carrier material, so that the resin adhesion layer (20) and the surface of the glass film (10) have a good binding force, and the dielectric constant of the circuit substrate has slight difference in the directions of X, Y and Z. Also provided is manufacturing method for a circuit substrate.

Abstract: Glass sheets according to the invention, in particular lacquered glass sheets, are covered with a coating of enamel. This coating comprises between 11 and 40% of organic material. Such glass sheets may be heat treated and, before heat treatment, may be handled and transported without damaging the coating, may be cut and ground without causing the coating to peel off or to be damaged at the borders of the cutting line, and offer a good resistance under running water, avoiding the peeling off or destruction of the coating during edges grinding or storage or transportation.

Abstract: An object having a coating produced using an adhesion promoter, wherein the adhesion promoter comprises at least one, optionally oligomeric, addition product having no terminal C?C double bonds and having hydrolyzable silane groups.

Abstract: The present invention encompasses polymer compositions comprising aliphatic polycarbonate chains containing functional groups that increase the polymer's ability to wet or adhere to inorganic materials. In certain embodiments, chain ends of the aliphatic polycarbonates are modified to introduce silicon-containing functional groups, boron-containing functional groups, phosphorous-containing functional groups, sulfonic acid groups or carboxylic acid groups.

Abstract: The invention relates to a lightweight transparent armor laminate comprising layers of borosilicate glass, layers of transparent glass-ceramics and a polymer spall layer of polycarbonate and/or polymethyl methacrylate. The layers are bound by polyurethane and/or polyvinylbutyral interlayer films.

Abstract: An anti-fogging article having a substrate and an anti-fogging film on at least part of the surface of the substrate, wherein the anti-fogging film comprises a resin underlayer and a water-absorptive resin layer laminated in order on the substrate surface, the water-absorptive resin layer is composed mainly of a first cured epoxy resin obtained by reacting a water-absorptive resin layer-forming composition containing a first polyepoxide component consisting of a low molecular weight polyepoxide having molecular weight of from 200 to 800 and a high molecular weight polyepoxide having molecular weight of from 900 to 2,000 combined in mass ratio of from 30:70 to 70:30, and a first curing agent, and the resin underlayer is composed mainly of a second cured epoxy resin obtained by reacting a resin underlayer-forming composition containing a second polyepoxide component and a second curing agent, and has water absorption property lower than the water-absorptive resin layer.

Abstract: Provided are a bonded structure, a sealed structure, an electronic component including the same, a bonding method, and a sealing method, the bonded structure and sealed structure allow hermetic adhesion using an adhesive even when the materials of the bonding surfaces are different, or the bonding surfaces have low wettability for the adhesive. A sealed structure 21 used for an electronic component or the like includes a first bonding surface 17 on a first adherent 11 bonded to a second bonding surface 18 on a second adherent 16 via an adhesive layer 24, the first and/or second bonding surfaces 17 and 18 having films 22 and 23 of film-forming compounds, the film-forming compounds being bound to the surfaces 17 and 18 at one end of the molecule thereof, and bound to a molecule of the adhesive at the functional group at the other end of the molecule.

Abstract: A transparent reinforced composite material. An illustrative embodiment of the reinforced composite material includes a polymeric matrix, at least one low-density region including a first plurality of glass elements having a first packing density provided in the polymeric matrix and at least one high-density region including a second plurality of glass elements having a second packing density greater than the first packing density provided in the polymeric matrix. A method for reinforcing a composite material is also disclosed.

Abstract: The transparent glass ceramic plate has a thermal expansion coefficient (CTE) of ?0.05 to ?0.1×10?6/K at 30 to 700° C. and a composition, in wt. %, consisting of: Li2O, 3.0-4.5; Al2O3, 18.0-24.0; SiO2, 55.0-70.0; TiO2, 0.01-2.3; ZrO2, 0.01-2.0; ? TiO2+ZrO2, 0.5-4.3; SnO2, 0-0.2; MgO, 0-0.8; BaO, 0-3; ZnO, 0-2.5; Na2O, 0-1.5; As2O3, 0.3-0.9; and Fe2O3, 0.004 to 0.02. A transparent plate laminate, which is used as armor or in a bullet-proof vest and which contains one or more of this glass ceramic plate together with optional glass and/or plastic plates, and a process for making the glass ceramic plate, are also described.

Abstract: A glazing comprising a sheet of glass, a film of damping material, and a rigid sheet, the assembly being laminated and comprising one or more exciters fastened to the glazing.

Abstract: Disclosed are processes for preparing articles having anti-fog properties, comprising providing a substrate having at least one main surface coated with an intermediate coating obtained by applying and at least partially curing an intermediate coating composition comprising at least one monoepoxysilane and/or an hydrolyzate thereof and at least one polyepoxy monomer comprising at least two epoxy groups, forming onto said intermediate coating at least one bi-layer, and curing said at least one bi-layer by heating at a temperature of 150° C. or less at atmospheric pressure and in the absence of added water steam. Also disclosed are articles made and/or makeable by these processes.

Abstract: The instant invention is a multilayer structure, and a method for making the same. The multilayer structure comprises: (a) at least one substrate layer comprising a polymeric material; (b) at least one adhesion layer, wherein said adhesion layer is derived from an adhesion promoter composition comprising: at least one epoxy resin solution; at least one hardening agent; optionally at least one leveling agent; at least one toughening agent; at least one filler; and at least one or more solvents; and (c) at least one surface layer comprising a plating metal; wherein said adhesion layer is disposed therebetween said at least one substrate layer and set at least one surface layer.

Abstract: A method for diffusing titanium and nitride into a sports equipment component. The method generally includes the steps of providing a sports equipment component providing a salt bath which includes sodium dioxide and a salt selected from the group consisting of sodium cyanate and potassium cyanate; dispersing metallic titanium formed by electrolysis of a titanium compound in the bath, heating the salt bath to a temperature ranging from about 430° C. to about 670° C.; and soaking the sports equipment component in the salt bath for a time of from about 10 minutes to about 24 hours. In accordance with another aspect of the present invention, the sports equipment component may further be treated with conventional surface treatments or coatings.

Abstract: The invention relates to a plastic film, at least one side of which is provided with a surface structure comprising parallel rows of elevations (a). Said elevations (a) are interconnected by means of webs (b) that are at least 10 percent lower than the elevations (a). The inventive films can be used for producing laminated glass.

Abstract: An adhesive composition useful in bonding a protective glass with a silicon substrate of a semiconductor device contains (A) an epoxy-containing high-molecular compound and (B) a solvent. The compound (A) has a weight average molecular weight of 3,000 to 500,000 and repeating units represented by the following formula (1): wherein R1 to R4 each represent a monovalent hydrocarbon group, m is 1 to 100, a, b, c and d indicate ratios of respective repeating units based on a number of all repeating units and each stand for 0 or a positive number with a proviso that c and d are not 0 at the same time and 0<(c+d)/(a+b+c+d)?1.0 is satisfied, and X and Y are phenolic hydroxyl-containing, divalent aromatic groups.

Abstract: An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material, the particles of the expansion material being at least partially encapsulated.

Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.

Abstract: The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Abstract: The invention relates to a composite material made up of at least one ceramic layer or at least one ceramic substrate and at least one metallization formed by a metallic layer on a surface side of the at least one ceramic substrate.

Abstract: Glass coatings on metals including Ti, Ti6A14V and CrCo were prepared for use as implants. The composition of the glasses was tailored to match the thermal expansion of the substrate metal. By controlling the firing atmosphere, time, and temperature, it was possible to control the reactivity between the glass and the alloy and to fabricate coatings (25-150 ?m thick) with excellent adhesion to the substrate. The optimum firing temperatures ranged between 800 and 840° C. at times up to 1 min in air or 15 min in N2. The same basic technique was used to create multilayered coatings with concentration gradients of hydroxyapatite (HA) particles and SiO2.

Abstract: A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement, where the polymeric resin comprises; at least one difunctional epoxy resin; and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.

Abstract: A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T1 (?m) of the adhesive pattern formed after development satisfying the conditions represented by the following expression (1). (T1/T0)×100?90??(1) [In expression (1), T0 represents the film thickness (?m) of the adhesive layer before developing treatment.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be molded to form composite parts that have high levels of both strength and damage tolerance without causing any substantial negative impact upon the physical or chemical characteristics of the uncured prepreg or cured part. This is achieved by including in the matrix resin a substantial amount of a multifunctional aromatic epoxy resin that has at least one phenyl group that is meta-substituted.

Abstract: A composition for preparing a resin is provided. The composition includes a brominated epoxy resin, a urethane-modified copolyester, a curing agent and a solvent. A prepreg is also provided. The prepreg includes a glass fabric and a resin layer on the glass fabric. The resin layer is made from the foregoing resin.

Abstract: A sealant disposed between two substrates to be sealed, the sealant comprising: at least two layers disposed layered on top of each other between the two substrates, wherein the at least two layers comprise materials having different components and at least one layer selected from the at least two layers includes a thermoplastic glass frit. A dye-sensitized solar cell including the sealant, and a method of manufacturing a dye-sensitized solar cell are also provided.

Abstract: The present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents, and, more specifically, the present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents that selectively absorb infrared radiation. In various embodiments of the present invention, an interlayer includes lanthanum hexaboride, which effectively absorbs infrared radiation at about 1,000 nanometers, and an epoxy, which stabilizes the lanthanum hexaboride agent.

Abstract: A compound represented by the formula (1) is provided. A polymerizable liquid crystal composition containing the compound can be controlled in birefringence and is excellent in stability of a liquid crystal phase. An anisotropic polymer excellent in uniformity of alignment is obtained by coating and polymerizing the composition on a supporting substrate. In the formula (1), at least one of Ra represents a polymerizable group, A represents a ring group, Y and Z each represent a single bond or alkylene; in which —CH2— in the alkylene may be replaced by another group, and m and n each represent an integer of from 0 to 5.

Abstract: A brightness enhancement film comprising a substrate which comprises, on one side, a scratch-resistant layer comprising inorganic microparticles is provided. The brightness enhancement film is useful as a scratch-resistant brightness enhancement film in liquid crystal displays.

Abstract: The present invention relates to glazing comprising a sheet of glass (4), a film (3) of damping material, and a rigid sheet (5), the assembly being laminated and comprising one or more exciters fastened to the glazing.

Abstract: Provided are multilayer laminates having one or more layers comprising twisted nematic liquid crystals and one or more layers of a polymeric sheet comprising a polymer with a modulus between 20,000 psi (138 MPa) and 100,000 psi (690 MPa). The twisted nematic liquid crystal layers reflect infrared radiation. Thus, the multilayer laminates are useful to reduce the transmission of infrared energy. For example, in some embodiments the multilayer laminates are useful as windows to reduce energy consumption necessary to cool the interior of a structure such as an automobile or building. Preferably, the multilayer laminates retain the beneficial properties of safety glass. The multilayer laminates may include additional layers such as infrared absorbing layers, half wave plates, and the like, to minimize the transmission of infrared energy. The multilayer laminates may also include further additional layers such as polymeric films, polymeric sheets, rigid sheets, and the like.

Abstract: A composite substrate 10 is a composite substrate in which a piezoelectric substrate 11 that is transparent to light used for photolithography and a supporting substrate 12 for supporting the piezoelectric substrate 11 are bonded together via an organic adhesive layer 13. At least one of the supporting substrate 12 and the organic adhesive layer 13 of the composite substrate 10 can absorb light used for photolithography.

Abstract: Provided are multilayer laminates having one or more layers comprising twisted nematic liquid crystals and one or more layers of a polymeric sheet comprising a polymer with a modulus of 20,000 psi (138 MPa) or less. The twisted nematic liquid crystal layers reflect infrared radiation. Thus, the multilayer laminates are useful to reduce the transmission of infrared energy. For example, in some embodiments the multilayer laminates are useful as windows to reduce energy consumption necessary to cool the interior of a structure such as an automobile or building. Preferably, the multilayer laminates retain the beneficial properties of safety glass. The multilayer laminates may include additional layers such as infrared absorbing layers, half wave plates, and the like, to minimize the transmission of infrared energy. The multilayer laminates may also include further additional layers such as polymeric films, polymeric sheets, rigid sheets, and the like.

Abstract: The present invention describes a transparent plate of lithium aluminosilicate glass ceramic showing a high transmission, a process for producing same and transparent plate laminates comprising at least one plate of the lithium aluminosilicate glass ceramic of the invention and the use thereof as armored glass or bullet-proof vest.

Abstract: The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.

Abstract: A paint and method are divulged for protecting the silver film of mirrors. The paint in its preferred embodiment includes a metal carboxylate which will contribute metal ions, namely stannous octoate for the contribution of stannous(II) ions in an amount of 0.5% or greater by weight. Alternate methods of the invention utilize an additional coating over the paint, such as an acrylic, epoxy or blend thereof which is UV curable. In another form of the paint, copper octoate is utilized in a minimum amount of 0.5% by weight for contribution of copper(II) ions.

Abstract: It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

Abstract: A composite of glass and hot melt composition including glass; a primer layer formed on the glass using a primer containing a film forming resin and at least one alkoxysilyl group-containing compound selected from the group consisting of isocyanate silane and a reaction product of aminosilane and epoxysilane; and a hot melt layer formed on the primer layer using a hot melt composition containing an aromatic polyester (a), and its production method are provided. The resulting composite of glass and hot melt composition is excellent in water-resistant adhesion to glass.

Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.

Abstract: Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same. The epoxy resin composition in accordance with the present invention exhibits excellent flame retardancy without use of a halogen flame retardant, and also advantageously provides well-balanced various physical properties which are to be required in copper-clad laminates, such as higher heat resistance and copper peel strength, and lead heat-resistant characteristics after moisture absorption.