Abstract: A method for preserving wood by contacting wood with a composition comprising a polyurethane polymer, non-aqueous solvents, and a wood preservative.

Abstract: A thermal interface material, an integrated circuit formed therewith, and a method of application thereof are provided. The thermal interface material includes 5% to 30% by volume of a polymer component and at least 70% by volume of liquid metal droplets, all based on total volume of the thermal interface material. The polymer component has a first polymer having a molecular weight in a range of 400 g/mol to 400,000 g/mol. The liquid metal droplets are dispersed throughout the polymer component.

Abstract: A wood preservative composition and method for preserving wood by contacting wood with said composition comprising a polyurethane polymer, non-aqueous solvents, and a wood preservative active.

Abstract: A surface preparation method (200) for a composite material (104) having an original surface (110), the material (104) comprising fibres (104a) within a matrix (104b), comprises removing (204) a surface portion of the matrix (104b) by plasma ablation so as to reveal and activate (206) a new surface (120) with at least a portion of a plurality of the fibres (104a) exposed thereon, without creating a residual heat-affected zone.

Abstract: A photochromic polyurethane laminate wherein the photochromic polyurethane layer of the laminate has been crosslinked with an isocyanate-active prepolymer using a crosslinking agent. The crosslinking agent is formulated to have at least three functional groups that are reactive with functional groups of the polyurethane or of the isocyanate-active prepolymer. A method of making the photochromic polyurethane laminate includes steps of causing the crosslinking.

Abstract: The present invention addresses the problem of providing a prepreg that has excellent short-time and low-pressure handling properties, during pasting and layering work. In order to solve the problem, this invention has the following configuration. The prepreg includes reinforcing fibers and an epoxy resin composition, has a fiber content of 90 mass % or less, and satisfies conditions (a) and (b) below. (a) When the average thickness of the prepreg is set as D (D being 3 ?m or greater), the viscosity at 25° C. of the epoxy resin composition at a site (I) located at a depth of D/4 to 3D/4 from the surface on one side of the prepreg is 50,000 to 300,000 Pa·s inclusive. (b) From among sites (II) located at a depth of up to 0.5 ?m from each surface on both sides of the prepreg, the viscosity at 25° C. of the epoxy resin composition at least at a site (II) on the one side is 10,000 to 40,000 Pa·s inclusive.

Abstract: The present invention relates to an acryl-based adhesive composition containing an acryl-based copolymer, which is formed by polymerization of a monomer mixture that contains a (meth)acryl-based monomer having an acetoacetyl group, a (meth)acryl-based monomer having a hydroxy group, a (meth)acrylate monomer having an alicyclic group, and an alkyl (meth) acrylate-based monomer; and a curing agent containing a metal chelate compound and an isocyanate compound, in which the acryl-based adhesive composition has a glass transition temperature of ?30° C. or greater after curing; and a polarizing plate and a display device prepared using the same.

Abstract: An inorganic fiber toughened inorganic composite artificial stone panel and a preparation method thereof are disclosed. The panel includes a surface layer and a toughened base layer. The surface layer includes the the following components in parts by weight: 40-70 parts of quartz sand, 10-30 parts of quartz powder, 20-45 parts of inorganic active powder, 0.5-4 parts of pigment, 0.3-1 parts of water reducing agent and 3-10 parts of water. The toughened base layer includes the following components in parts by weight: 40-60 parts of inorganic active powder, 45-65 parts of sand, 0.8-1.5 parts of water reducing agent, 6-14 parts of water, 0.4-2 parts of inorganic fiber and 0.8-2.5 parts of toughener.

Abstract: Provided is a photopolymer composition for hologram recording comprising: a polymer matrix or a precursor thereof; a dye including a compound of the following Chemical Formula 1; a photoreactive monomer; and a photoinitiator,

Abstract: A high toughness inorganic composite artificial stone panel and preparation method are disclosed. The panel includes a surface layer, an intermediate metal fiber toughening layer and a substrate toughening layer. The surface layer includes the following components: 40-70 parts of quartz sand, 10-30 parts of quartz powder, 20-45 parts of inorganic active powder, 0.5-4 parts of pigment, 0.3-1 part of water reducer and 3-10 parts of water. The intermediate metal fiber toughening layer includes the following components: 40-60 parts of inorganic active powder, 45-65 parts of sand, 0.8-1.5 parts of water reducer, 6-14 parts of water and 4-8 parts of metal fiber. The substrate toughening layer includes the following components: 30-50 parts of inorganic active powder, 30-55 parts of quartz sand, 15-20 parts of quartz powder, 0.5-1.2 parts of water reducer, 4-8 parts of water and 0.8-2.5 parts of toughening agent.

Abstract: A curing agent for a water-based epoxy resin, including a reaction composition (A) containing a reaction product of styrene and an amine compound represented by the following formula (1), a water-based epoxy resin composition containing the same, and a cured product thereof. H2N—CH2-A-CH2—NH2??(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

Abstract: To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

Abstract: Adhesive bonds are applied by mixing two adhesives with different properties and dispensing them to form bondlines between substrate pairs. The adhesives are then thermally cured and cooled. Varying the mix ratio permits one to vary the properties of the adhesive mixture so formed for use in bonding many different substrate pairs. The process allows potentially infinite variations of adhesive properties between those of the respective starting adhesives, simply by varying the mix ratio. The invention is especially adapted for use in manufacturing settings in which adhesives are to be applied in multiple places, but differing adhesive properties are needed among the various bonding areas.

Abstract: A pultruded material includes a thermosetting resin, and a reinforced fibers impregnated with the thermosetting resin. The thermosetting resin includes a solid resin that contains a fire-resistant resin having a median oxygen index of equal to or higher than, a long-chain fatty acid ester that has a median number of carbons per molecule within a range equal to or more than 3 and equal to or less than 1000, and that has a median flash point within a range equal to or higher than 150 degrees Celsius, and an additive that has a median BET specific surface area within a range equal to or more than 150 m2/g and equal to or less than 250 m2/g, and that has a median primary particle diameter within a range equal to or more than 5 nanometers and equal to or smaller than 20 nanometers.

Abstract: A heat dissipating coating composition is provided. A heat dissipating coating composition according to an embodiment of the present disclosure includes a coating layer forming component including a main resin. The heat dissipating coating composition also includes a carbon-based filler including 8 to 72 parts by weight with respect to 100 parts by weight of the main resin and a physical property enhancing component for improving heat dissipating and adhering properties. Accordingly, a heat dissipating coating layer having excellent heat dissipating performance can be realized by having not only good heat conductivity but also good heat radiation.

Abstract: A reusable attaching apparatus includes (a) a reversible adhesive comprising a shape memory polymer and (b) a mounting structure bonded to the reversible adhesive. The shape memory polymer has a glass transition temperature (Tg) and comprises a deformable state at temperatures above the Tg and a rigid state at temperatures below the Tg.

Abstract: Epoxy adhesives include a latent curing agent, a reactive toughener having capped isocyanate groups, and certain urea compounds. The toughener is made by chain extending and capping a mixture of isocyanate-terminated prepolymers. The prepolymers include an isocyanate-terminated polyether and an isocyanate-terminated diene polymer. The adhesives have excellent wash-off resistance and excellent ability to adhere to oily substrates.

Abstract: In a three-dimensional printing method example, a build material, including an epoxy resin powder, is applied. A hardener liquid is selectively applied on at least a portion of the build material. The portion of the build material in contact with the hardener liquid is allowed to cure to form a layer of a 3D part. In another three-dimensional printing method example, a filler build material is applied. A liquid epoxy resin is selectively applied on at least a portion of the filler. A hardener liquid is selectively applied on the at least the portion of the filler. The portion of the filler in contact with the liquid epoxy resin and the hardener liquid is allowed to cure to form a layer of a 3D part.

Abstract: An aqueous adhesion composition comprising: a) at least one dispersed solid epoxy resin (EP); b) at least one amino silane (AS); c) at least one acid (HS); d) at least one amine hardener (AH); and e) water. According to the invention, the adhesion compositions substantially improve, particularly under humid conditions, the adhesion on different substrates. The compositions are storage stable for a longer period of time and have, even after different aging states of the components, essentially no impairment in the action thereof.

Abstract: A composition, comprising at least one silane-group-containing polymer that is liquid at room temperature, at least one epoxide liquid resin, and at least one aliphatic polyamine having a molecular weight of at least 115 g/mol and having at least three amine hydrogens reactive toward epoxide groups, as a sealing film applied in liquid form. The sealing film applied in liquid form is isocyanate-free, low-odor, and easy to process because of the low viscosity and the long open time. Said sealing film cures quickly and forms a high-quality elastic material having good mechanical properties and good weather resistance.

Abstract: An electrical steel sheet provides: a steel strip (1) for an electrical steel sheet; and an insulating film (2) formed at a surface of the steel strip (1) and containing metal phosphate and organic resin. At least a part of the metal phosphate includes at least one kind of crystal structure selected from a group consisting of a cubic system, a tetragonal system, a hexagonal system, and an orthorhombic system. The organic resin contains at least one kind selected from a group consisting of an acryl-based resin, an epoxy-based resin, and a polyester resin having a carboxyl group or a hydroxyl group at a surface of an emulsion particle for one part by mass to 50 parts by mass relative to 100 parts by mass of the metal phosphate.

Abstract: The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. an epoxy resin; ii. a filler material; iii. an epoxy-based reactive diluent; and iv. optionally, a core-shell polymer toughening agent; and wherein the amount of filler material is selected such as to provide the part (B) with a hysteresis area of at least 30 Pa×1/s, when measured at 23 C according to the test method described in the experimental section.

Abstract: A coating composition including a blend of at least two or more epoxy resins, wherein at least one of the epoxy resins comprises (i) a CHDM epoxy resin having less than about 2 wt % total chlorine content; and wherein at least one of the epoxy resins comprises (ii) at least one other epoxy resin other than the epoxy resin in component (i); a curable coating composition including (a) the above blend of epoxy resins and (b) at least one amine curing agent; a thermoset coating product prepared from the above curable composition; and a process for preparing the above compositions and a coating therefrom.

Abstract: This disclosure provides compositions, films, labels, structures and methods that may include a substrate having a first side and a second side, wherein the first side comprises a skin layer comprising at least 50 wt. % of high-density polyethylene. Further, the compositions may include a coating on the skin layer, wherein the coating comprises a topcoat and a primer, wherein the topcoat consists of: (i) at least 50 wt. % high-density polyethylene and one or more polyethylene polymers in water; (ii) wax, silicone or combination thereof; and (iii) optionally additives, whereupon imaging the composition by a thermal print head at a temperature of 300° C. or less results in no or negligible solvent-penetrability beneath the skin layer.

Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 ?S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 ?S/cm or less, can provide a thin insulating layer having excellent insulating properties.

Abstract: A method for producing an electrical device including an electrical component at least partially covered by a covering material having a cement material includes supplying the cement material, mixing an additive into the cement material, applying the covering material having the cement material with the additive onto the electrical component, and treating the covering material. The treatment allows the additive from the cement material to reach a surface of the cement material and to form a protective layer on the surface.

Abstract: A transparent adhesive having a refractive index ranging from 1.7 to 1.73 and to the production and the use thereof, particularly the use thereof for coatings and adhesive bonds.

Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.

Abstract: A low viscosity polymer having a linear or branched backbone derived from farnesene monomers and at least one terminal-end functionalized with a hydroxyl group. This polymer may be further hydrogenated to reduce unsaturation and acrylated, such that it may be incorporated into a LOCA composition. The LOCA composition may be used in a laminated screen assembly, such as a touch screen, for electronic devices by adhering the LOCA composition between an optically transparent layer, such as a cover glass, and a display. The cured LOCA composition has a refractive index similar to the optically transparent layer. A method of making the low viscosity polymer for the LOCA composition includes anionically polymerizing farnesene monomers, quenching a living end of the polymer to provide the hydroxyl-terminated polymer; hydrogenating the hydroxyl-terminated polymer; and reacting the at least partially saturated hydroxyl-terminated polymer with at least one reagent to provide an acrylate terminated hydrogenated polymer.

Abstract: An anisotropic conductive film composition, an anisotropic conductive film prepared using the same, and a connection structure using the same, the anisotropic conductive film including a binder resin; a curable alicyclic epoxy compound; a curable oxetane compound; a quaternary ammonium catalyst; and conductive particles, wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1: Heat quantity variation rate (%)=[(H0?H1)/H0]×100??Equation 1 wherein H0 is a DSC heat quantity of the anisotropic conductive film, as measured at 25° C. and a time point of 0 hr, and H1 is a DSC heat quantity of the anisotropic conductive film, as measured after being left at 40° C. for 24 hours.

Abstract: Surfaces 1, 2 are bonded together by a heat activated adhesive 3 that is applied to a surface 2 to cover an area greater than the area that is to form the bond, the two surfaces 1, 2 are brought together and the adhesive 3 activated so that it creates the bond and also covers the exposed edges of the surfaces to provide an aesthetically pleasing and coatable corrosion and rust protective layer.

Abstract: A thermoset pressure-sensitive adhesive containing a tacky polymer, polyvinyl acetal, an epoxy resin, and an epoxy resin curing agent. The tacky polymer is obtained by copolymerizing a first monomer constituted by at least one type of (meth)acrylate ester of a non-tertiary non-cyclic alcohol having 8 to 12 carbon atoms and including one (meth)acryloyl group, a second monomer comprising a nitrogen atom and an ethylenically unsaturated group, and more than 0 parts by mass to no more than about 0.5 parts by mass of a crosslinking agent per a total of 100 parts by mass of the first monomer and the second monomer.

Abstract: Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlorohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.

Abstract: An armature winding is configured by mounting into an armature core a plurality of distributed-winding coils that are each produced by bending and shaping a conductor wire that is coated with insulation, coil ends are configured by arranging coil end portion rows that are formed by arranging coil end portions of the coils in a single row circumferentially in n layers in a radial direction, where n is an integer that is greater than or equal to 1, and an interphase insulating material includes: a strip-shaped insulating sheet material that is inserted inside the coil end portions, and that is disposed so as to extend circumferentially between the coil end portion rows; and an insulating buffering material that is formed on one surface of the insulating sheet material, and that is fixed to the coil end portion rows by forming air bubble groups internally.

Abstract: An adhesive composition comprising a main agent including at least one epoxy resin selected from a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a phenol novolac epoxy resin, and an acrylic rubber; a curing agent including xylylene diamine; and a filler including silica. The adhesive composition further comprises an ion exchanger.

Abstract: Disclosed is a plastic film which exhibits high hardness and processability without the problems of curling, warping and cracking.

Abstract: A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.

Abstract: The invention provides a layered structure comprising at least two layers: A) a first layer A, formed from a composition A, comprising a polyurethane; and B) a second layer B, formed from a composition B, comprising at least one functionalized polymer B comprising the following: i) at least one polymerized monomeric unit comprising a functional group selected from the group consisting of the following: a) an acid group, b) an anhydride group, c) a primary or secondary amine group, and d) combinations thereof; or ii) at least one reacted functionalization agent comprising a functional group selected from the group consisting of the following: e) an acid group, f) an anhydride group, g) a primary or secondary amine group, and h) combinations thereof; or iii) combinations thereof; and wherein the functionalized polymer B has a number-average molecular weight greater than 1,000 g/mole, and/or a melt index (I2) less than, or equal to, 2500 g/10 min.

Abstract: Heat-curable epoxy resin compositions and the use thereof, for example, in motor vehicle construction and sandwich panel construction, are disclosed. Exemplary heat-curable epoxy resin compositions include, in addition to epoxy resin components A1, optionally A2, a hardener component B, a carboxylic acid C and a hydroxyalkylamide or hydroxyalkylurea H, an accelerator E for activation of the conversion of components A1, A2 and B. The compositions and the structural foams produced therefrom are notable for high mechanical strength, high glass strength and good adhesion capacity on metallic and nonmetallic substrates, and it is possible at the same time to dispense with the use of toxic or inflammable blowing agents.

Abstract: An epoxy terminated prepolymer formed as a reaction product of a cycloaliphatic epoxide resin and an amine terminated polymeric polyol, and a catalyst that promotes the reaction of the cycloaliphatic epoxide resin and the aminated polyol. The epoxy terminated prepolymer and an anhydride hardener react to form an epoxy elastomer composition having a microphase separated morphology of hard particles, formed with the anhydride hardener reacted with the epoxy terminated prepolymer, dispersed in a soft continuous phase formed from polymeric polyol in the epoxy terminated prepolymer.

Abstract: An encapsulating material for solar cell excellent in a balance among properties including transparency, flexibility, adhesiveness, heat resistance, appearance, crosslinking properties, electrical properties and calender moldability. The encapsulating material includes an ethylene/?-olefin copolymer satisfying the following requirements: (a1) the content ratio of structural units derived from ethylene is from 80 to 90 mol % and the content ratio of structural units derived from ?-olefin having 3 to 20 carbon atoms is from 10 to 20 mol %; (a2) MFR is equal to or more than 2 g/10 minutes and less than 10 g/10 minutes as measured under the conditions of a temperature of 190 degrees centigrade and a load of 2.16 kg in accordance with ASTM D1238; (a3) the density is from 0.865 to 0.884 g/cm3 as measured in accordance with ASTM D1505; and (a4) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240.

Abstract: In one or more embodiments, a composite die includes a die face defining a protrusion and including a first metal, and a die base supporting the die face, the die base including a housing, a first filler positioned within the housing and contacting the protrusion, and a bridging member reinforcing the housing, the housing including a second metal different than the first metal.

Abstract: Methods for adhering materials and methods for enhancing adhesion between materials are disclosed. In some embodiments, a polymer brush material is bonded to a base material, and a developable polymer resist material is applied over the grafted polymer brush material. The resist material is at least partially miscible in the grafted polymer brush material. As such, the resist material at least partially dissolves within the grafted polymer brush material to form an intertwined material of grafted polymer brush macromolecules and resist polymer macromolecules. Adhesion between the developable polymer resist and the base material may be thereby enhanced. Also disclosed are related semiconductor device structures.

Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.

Abstract: The invention relates to a procedure for applying a coating with metallic or ceramic finish on the entirety or part of the surface of a thermoplastic, metallic or metallic alloy article, which comprises: preparing the thermoplastic, metallic, or metallic alloy article; applying on the article a base polymeric layer based on aqueous dispersions of resins without volatile organic components or on dispersions in organic solvents of resins without urethane; curing the base polymeric layer; and depositing a single layer of a metallic or ceramic material on the article coated with the cured base polymeric layer. The curing of the base polymeric layer is carried out at a temperature of between 30 and 80° C. in the case of thermal polymeric layers, or by means of ultraviolet radiation in the case of photosensitive polymeric layers. Optionally, a second transparent polymeric layer can be applied for protective purposes.

Abstract: The present invention relates to a multicomponent resin system comprising a. a compound capable of undergoing a radical copolymerization selected from the group consisting of unsaturated polyester resins, vinyl ester resins and mixtures thereof b. an epoxide functional resin as compound capable of reacting with a primary and/or secondary aliphatic amine, c. a transition metal compound, d. a primary and/or secondary aliphatic amine characterized in that the transition metal is selected from the group consisting of Cu, Mn, Fe and mixtures thereof.

Abstract: A kit for repairing an opening formed in a composite panel having a laminate skin arranged on opposing sides of a first core material is provided including a plug and a patch. The plug is formed from a second core material and has a cured filler material arranged within at least a portion of the second core material. The patch is formed from a plurality of cured first plies arranged in a stacked orientation. The plug is configured to be received within the opening of the composite panel and the patch is configured to cover the opening of the composite panel.

Abstract: A method is disclosed for the on-site surface coating of a structure, the structure being part of a construction including a plurality of structures, the method including the steps of: a) applying one or more layers of a coating system on-site to at least a part of the structure, b) arranging at least one gas catalytic infrared emitting unit in a position so that the infrared radiation is adapted for heating the one or more layers of the protective coating system on-site and c) irradiating the coated surface with infrared radiation emitted by the at least one gas catalytic infrared emitting unit on-site. The method allows the drying and/or curing of the one or more layers of the coating system to be accelerated.

Abstract: The present invention provides an adhesive composition that may improve both adhesiveness to a film layer and adhesiveness to a rubber layer, and an adhesion method using the same, as well as a laminate and a tire. The adhesive composition according to the present invention includes a rubber component, at least 80 mass % of which rubber component is an epoxidized natural rubber.

Abstract: An object with a coating comprising: a) covalent bonds formed by reaction of a thiol group and a carbon-carbon double bond, b) covalent bonds formed by reaction of a thiol group and epoxide group, c) covalent bonds formed by a reaction of a carbon-carbon double bond and an epoxide group, said coating comprising a first primer coating and a second coating, said coating comprising covalent bonds between said first and second coatings, said first primer coating comprising covalent cross links between compounds, in the first coating the fraction (r3=ta/tc) of unreacted thiol groups (ta) to thiol groups which have reacted to form a covalent bond (tc) does not exceed 0.11, wherein the half height peak width of tan delta does not exceed 30° C. Advantages of the dual cure composition is that excellent strength is obtained and that the second curing is slow compared to the first initial curing.