As Intermediate Layer Patents (Class 428/414)
  • Patent number: 10759946
    Abstract: A composition, comprising at least one silane-group-containing polymer that is liquid at room temperature, at least one epoxide liquid resin, and at least one aliphatic polyamine having a molecular weight of at least 115 g/mol and having at least three amine hydrogens reactive toward epoxide groups, as a sealing film applied in liquid form. The sealing film applied in liquid form is isocyanate-free, low-odor, and easy to process because of the low viscosity and the long open time. Said sealing film cures quickly and forms a high-quality elastic material having good mechanical properties and good weather resistance.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: September 1, 2020
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Hans Häberle, Urs Burckhardt
  • Patent number: 10665372
    Abstract: An electrical steel sheet provides: a steel strip (1) for an electrical steel sheet; and an insulating film (2) formed at a surface of the steel strip (1) and containing metal phosphate and organic resin. At least a part of the metal phosphate includes at least one kind of crystal structure selected from a group consisting of a cubic system, a tetragonal system, a hexagonal system, and an orthorhombic system. The organic resin contains at least one kind selected from a group consisting of an acryl-based resin, an epoxy-based resin, and a polyester resin having a carboxyl group or a hydroxyl group at a surface of an emulsion particle for one part by mass to 50 parts by mass relative to 100 parts by mass of the metal phosphate.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 26, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Kazutoshi Takeda, Kenji Kosuge, Tatsuya Takase, Hiroyasu Fujii
  • Patent number: 10647897
    Abstract: The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. an epoxy resin; ii. a filler material; iii. an epoxy-based reactive diluent; and iv. optionally, a core-shell polymer toughening agent; and wherein the amount of filler material is selected such as to provide the part (B) with a hysteresis area of at least 30 Pa×1/s, when measured at 23 C according to the test method described in the experimental section.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: May 12, 2020
    Assignee: 3M Innovative Properties Company
    Inventor: Mareike Bardts
  • Patent number: 10584261
    Abstract: A coating composition including a blend of at least two or more epoxy resins, wherein at least one of the epoxy resins comprises (i) a CHDM epoxy resin having less than about 2 wt % total chlorine content; and wherein at least one of the epoxy resins comprises (ii) at least one other epoxy resin other than the epoxy resin in component (i); a curable coating composition including (a) the above blend of epoxy resins and (b) at least one amine curing agent; a thermoset coating product prepared from the above curable composition; and a process for preparing the above compositions and a coating therefrom.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: March 10, 2020
    Assignee: Blue Cube IP LLC
    Inventors: Christian Piechocki, Ray E. Drumright, Sandrine Sinsoulieu, Erin B. Vogel, Yinzhong Guo
  • Patent number: 10569920
    Abstract: This disclosure provides compositions, films, labels, structures and methods that may include a substrate having a first side and a second side, wherein the first side comprises a skin layer comprising at least 50 wt. % of high-density polyethylene. Further, the compositions may include a coating on the skin layer, wherein the coating comprises a topcoat and a primer, wherein the topcoat consists of: (i) at least 50 wt. % high-density polyethylene and one or more polyethylene polymers in water; (ii) wax, silicone or combination thereof; and (iii) optionally additives, whereupon imaging the composition by a thermal print head at a temperature of 300° C. or less results in no or negligible solvent-penetrability beneath the skin layer.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: February 25, 2020
    Assignee: Jindal Films Americas LLC
    Inventors: Daniel L Hinman, Mark W Lockhart, Terry O Jensen, Robert M Sheppard, Thierry J. L. Dabadie, Alexandra N Wolfe, Anand Sundararaman, David J Hill, David Piran
  • Patent number: 10512161
    Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 ?S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 ?S/cm or less, can provide a thin insulating layer having excellent insulating properties.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: December 17, 2019
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Shiro Tatsumi, Ikumi Sawa
  • Patent number: 10504809
    Abstract: A method for producing an electrical device including an electrical component at least partially covered by a covering material having a cement material includes supplying the cement material, mixing an additive into the cement material, applying the covering material having the cement material with the additive onto the electrical component, and treating the covering material. The treatment allows the additive from the cement material to reach a surface of the cement material and to form a protective layer on the surface.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: December 10, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Tjalf Pirk, Helmut Schmidt, Petra Stedile
  • Patent number: 10308840
    Abstract: A transparent adhesive having a refractive index ranging from 1.7 to 1.73 and to the production and the use thereof, particularly the use thereof for coatings and adhesive bonds.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: June 4, 2019
    Assignee: CeramTec-ETEC GmbH
    Inventors: Elisabeth Klemm, Martin Tittel
  • Patent number: 10266730
    Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: April 23, 2019
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Rikia Furusho, Shintaro Abe, Takeshi Kondo, Teruki Tanaka
  • Patent number: 10239973
    Abstract: A low viscosity polymer having a linear or branched backbone derived from farnesene monomers and at least one terminal-end functionalized with a hydroxyl group. This polymer may be further hydrogenated to reduce unsaturation and acrylated, such that it may be incorporated into a LOCA composition. The LOCA composition may be used in a laminated screen assembly, such as a touch screen, for electronic devices by adhering the LOCA composition between an optically transparent layer, such as a cover glass, and a display. The cured LOCA composition has a refractive index similar to the optically transparent layer. A method of making the low viscosity polymer for the LOCA composition includes anionically polymerizing farnesene monomers, quenching a living end of the polymer to provide the hydroxyl-terminated polymer; hydrogenating the hydroxyl-terminated polymer; and reacting the at least partially saturated hydroxyl-terminated polymer with at least one reagent to provide an acrylate terminated hydrogenated polymer.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: March 26, 2019
    Assignee: FINA TECHNOLOGY, INC.
    Inventors: Taejun Yoo, Herbert Chao, Steven K Henning
  • Patent number: 10224303
    Abstract: An anisotropic conductive film composition, an anisotropic conductive film prepared using the same, and a connection structure using the same, the anisotropic conductive film including a binder resin; a curable alicyclic epoxy compound; a curable oxetane compound; a quaternary ammonium catalyst; and conductive particles, wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1: Heat quantity variation rate (%)=[(H0?H1)/H0]×100??Equation 1 wherein H0 is a DSC heat quantity of the anisotropic conductive film, as measured at 25° C. and a time point of 0 hr, and H1 is a DSC heat quantity of the anisotropic conductive film, as measured after being left at 40° C. for 24 hours.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: March 5, 2019
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Youn Jo Ko, Soon Young Kwon, Ji Yeon Kim, Ha Na Kim, Young Woo Park, Hyun Joo Seo, Gun Young Heo, Ja Young Hwang
  • Patent number: 10195837
    Abstract: Surfaces 1, 2 are bonded together by a heat activated adhesive 3 that is applied to a surface 2 to cover an area greater than the area that is to form the bond, the two surfaces 1, 2 are brought together and the adhesive 3 activated so that it creates the bond and also covers the exposed edges of the surfaces to provide an aesthetically pleasing and coatable corrosion and rust protective layer.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: February 5, 2019
    Assignee: Zephyros, Inc.
    Inventors: Xabier Morral, Michael Czaplicki, Ira Miller
  • Patent number: 10077384
    Abstract: A thermoset pressure-sensitive adhesive containing a tacky polymer, polyvinyl acetal, an epoxy resin, and an epoxy resin curing agent. The tacky polymer is obtained by copolymerizing a first monomer constituted by at least one type of (meth)acrylate ester of a non-tertiary non-cyclic alcohol having 8 to 12 carbon atoms and including one (meth)acryloyl group, a second monomer comprising a nitrogen atom and an ethylenically unsaturated group, and more than 0 parts by mass to no more than about 0.5 parts by mass of a crosslinking agent per a total of 100 parts by mass of the first monomer and the second monomer.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: September 18, 2018
    Assignee: 3M Innovative Properties Company
    Inventor: Kotaro Shinozaki
  • Patent number: 10023774
    Abstract: Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlorohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: July 17, 2018
    Assignee: COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH
    Inventors: Kundalik Ganpat Raut, Manohar Virupax Badiger, Sivaram Swaminathan, Vivek Vitthal Kodgire, Rajeshwari Shyamji Gour
  • Patent number: 9935515
    Abstract: An armature winding is configured by mounting into an armature core a plurality of distributed-winding coils that are each produced by bending and shaping a conductor wire that is coated with insulation, coil ends are configured by arranging coil end portion rows that are formed by arranging coil end portions of the coils in a single row circumferentially in n layers in a radial direction, where n is an integer that is greater than or equal to 1, and an interphase insulating material includes: a strip-shaped insulating sheet material that is inserted inside the coil end portions, and that is disposed so as to extend circumferentially between the coil end portion rows; and an insulating buffering material that is formed on one surface of the insulating sheet material, and that is fixed to the coil end portion rows by forming air bubble groups internally.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: April 3, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masashi Nakamura, Shogo Okamoto, Tatsuro Hino
  • Patent number: 9822287
    Abstract: An adhesive composition comprising a main agent including at least one epoxy resin selected from a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a phenol novolac epoxy resin, and an acrylic rubber; a curing agent including xylylene diamine; and a filler including silica. The adhesive composition further comprises an ion exchanger.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: November 21, 2017
    Assignee: OLYMPUS CORPORATION
    Inventors: Hiroki Yokoyama, Koji Kobayashi, Jun Matsumoto, Mitsuhiro Nakamura
  • Patent number: 9701861
    Abstract: Disclosed is a plastic film which exhibits high hardness and processability without the problems of curling, warping and cracking.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: July 11, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Joon Koo Kang, Yeong Rae Chang, Heon Kim, Han Na Lee
  • Patent number: 9643285
    Abstract: A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: May 9, 2017
    Assignees: FUJI ELECTRIC CO., LTD., FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO., LTD.
    Inventors: Tatsuya Ganbe, Kenji Okamoto
  • Patent number: 9487337
    Abstract: The invention provides a layered structure comprising at least two layers: A) a first layer A, formed from a composition A, comprising a polyurethane; and B) a second layer B, formed from a composition B, comprising at least one functionalized polymer B comprising the following: i) at least one polymerized monomeric unit comprising a functional group selected from the group consisting of the following: a) an acid group, b) an anhydride group, c) a primary or secondary amine group, and d) combinations thereof; or ii) at least one reacted functionalization agent comprising a functional group selected from the group consisting of the following: e) an acid group, f) an anhydride group, g) a primary or secondary amine group, and h) combinations thereof; or iii) combinations thereof; and wherein the functionalized polymer B has a number-average molecular weight greater than 1,000 g/mole, and/or a melt index (I2) less than, or equal to, 2500 g/10 min.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: November 8, 2016
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Sekhar Sundaram, Debkumar Bhattacharjee, Jozef J. Van Dun, Bradley A. Jacobs, Rajen M. Patel, Alexander Williamson
  • Patent number: 9475904
    Abstract: Heat-curable epoxy resin compositions and the use thereof, for example, in motor vehicle construction and sandwich panel construction, are disclosed. Exemplary heat-curable epoxy resin compositions include, in addition to epoxy resin components A1, optionally A2, a hardener component B, a carboxylic acid C and a hydroxyalkylamide or hydroxyalkylurea H, an accelerator E for activation of the conversion of components A1, A2 and B. The compositions and the structural foams produced therefrom are notable for high mechanical strength, high glass strength and good adhesion capacity on metallic and nonmetallic substrates, and it is possible at the same time to dispense with the use of toxic or inflammable blowing agents.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: October 25, 2016
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Jürgen Finter, Elyes Jendoubi
  • Patent number: 9371416
    Abstract: An epoxy terminated prepolymer formed as a reaction product of a cycloaliphatic epoxide resin and an amine terminated polymeric polyol, and a catalyst that promotes the reaction of the cycloaliphatic epoxide resin and the aminated polyol. The epoxy terminated prepolymer and an anhydride hardener react to form an epoxy elastomer composition having a microphase separated morphology of hard particles, formed with the anhydride hardener reacted with the epoxy terminated prepolymer, dispersed in a soft continuous phase formed from polymeric polyol in the epoxy terminated prepolymer.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: June 21, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Kwanho Chang, Harshad M Shah, Rajat Duggal
  • Patent number: 9349895
    Abstract: An encapsulating material for solar cell excellent in a balance among properties including transparency, flexibility, adhesiveness, heat resistance, appearance, crosslinking properties, electrical properties and calender moldability. The encapsulating material includes an ethylene/?-olefin copolymer satisfying the following requirements: (a1) the content ratio of structural units derived from ethylene is from 80 to 90 mol % and the content ratio of structural units derived from ?-olefin having 3 to 20 carbon atoms is from 10 to 20 mol %; (a2) MFR is equal to or more than 2 g/10 minutes and less than 10 g/10 minutes as measured under the conditions of a temperature of 190 degrees centigrade and a load of 2.16 kg in accordance with ASTM D1238; (a3) the density is from 0.865 to 0.884 g/cm3 as measured in accordance with ASTM D1505; and (a4) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: May 24, 2016
    Assignees: MITSUI CHEMICALS, INC., MITSUI CHEMICALS TOHCELLO, INC.
    Inventors: Shigenobu Ikenaga, Fumito Takeuchi, Keiji Watanabe, Tomoaki Ito
  • Patent number: 9302310
    Abstract: In one or more embodiments, a composite die includes a die face defining a protrusion and including a first metal, and a die base supporting the die face, the die base including a housing, a first filler positioned within the housing and contacting the protrusion, and a bridging member reinforcing the housing, the housing including a second metal different than the first metal.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: April 5, 2016
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Vijitha Senaka Kiridena, Zhiyong Cedric Xia, Matthew John Zaluzec
  • Patent number: 9293328
    Abstract: Methods for adhering materials and methods for enhancing adhesion between materials are disclosed. In some embodiments, a polymer brush material is bonded to a base material, and a developable polymer resist material is applied over the grafted polymer brush material. The resist material is at least partially miscible in the grafted polymer brush material. As such, the resist material at least partially dissolves within the grafted polymer brush material to form an intertwined material of grafted polymer brush macromolecules and resist polymer macromolecules. Adhesion between the developable polymer resist and the base material may be thereby enhanced. Also disclosed are related semiconductor device structures.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: March 22, 2016
    Assignee: Micron Technology, Inc.
    Inventor: Dan B. Millward
  • Patent number: 9242505
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
    Type: Grant
    Filed: November 24, 2011
    Date of Patent: January 26, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
  • Patent number: 9138776
    Abstract: The invention relates to a procedure for applying a coating with metallic or ceramic finish on the entirety or part of the surface of a thermoplastic, metallic or metallic alloy article, which comprises: preparing the thermoplastic, metallic, or metallic alloy article; applying on the article a base polymeric layer based on aqueous dispersions of resins without volatile organic components or on dispersions in organic solvents of resins without urethane; curing the base polymeric layer; and depositing a single layer of a metallic or ceramic material on the article coated with the cured base polymeric layer. The curing of the base polymeric layer is carried out at a temperature of between 30 and 80° C. in the case of thermal polymeric layers, or by means of ultraviolet radiation in the case of photosensitive polymeric layers. Optionally, a second transparent polymeric layer can be applied for protective purposes.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: September 22, 2015
    Assignee: SIDASA ENGINEERING, S.L.
    Inventors: Maria Benelmekki Erretby, Montse Riera Giner
  • Patent number: 9115281
    Abstract: The present invention relates to a multicomponent resin system comprising a. a compound capable of undergoing a radical copolymerization selected from the group consisting of unsaturated polyester resins, vinyl ester resins and mixtures thereof b. an epoxide functional resin as compound capable of reacting with a primary and/or secondary aliphatic amine, c. a transition metal compound, d. a primary and/or secondary aliphatic amine characterized in that the transition metal is selected from the group consisting of Cu, Mn, Fe and mixtures thereof.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: August 25, 2015
    Assignee: DSM IP ASSETS B.V.
    Inventors: Arie Boer Den, Johan Franz Gradus Antonius Jansen, Daniel Raimann
  • Publication number: 20150136308
    Abstract: A kit for repairing an opening formed in a composite panel having a laminate skin arranged on opposing sides of a first core material is provided including a plug and a patch. The plug is formed from a second core material and has a cured filler material arranged within at least a portion of the second core material. The patch is formed from a plurality of cured first plies arranged in a stacked orientation. The plug is configured to be received within the opening of the composite panel and the patch is configured to cover the opening of the composite panel.
    Type: Application
    Filed: November 21, 2013
    Publication date: May 21, 2015
    Applicant: Sikorsky Aircraft Corporation
    Inventors: Jonathan Bremmer, Christian A. Rogg, Jeffrey G. Sauer, Darryl Mark Toni, Allan R. Macallister, Jr., William E. Hovan, III, Paul H. Denavit, Mihail Sirbu
  • Publication number: 20150128443
    Abstract: A method is disclosed for the on-site surface coating of a structure, the structure being part of a construction including a plurality of structures, the method including the steps of: a) applying one or more layers of a coating system on-site to at least a part of the structure, b) arranging at least one gas catalytic infrared emitting unit in a position so that the infrared radiation is adapted for heating the one or more layers of the protective coating system on-site and c) irradiating the coated surface with infrared radiation emitted by the at least one gas catalytic infrared emitting unit on-site. The method allows the drying and/or curing of the one or more layers of the coating system to be accelerated.
    Type: Application
    Filed: May 21, 2013
    Publication date: May 14, 2015
    Applicant: MAERSK OLIE OG GAS A/S
    Inventor: Jonathan David Madden
  • Patent number: 9029462
    Abstract: The present invention provides an adhesive composition that may improve both adhesiveness to a film layer and adhesiveness to a rubber layer, and an adhesion method using the same, as well as a laminate and a tire. The adhesive composition according to the present invention includes a rubber component, at least 80 mass % of which rubber component is an epoxidized natural rubber.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: May 12, 2015
    Assignee: Bridgestone Corporation
    Inventors: Takuya Ogasawara, Ryuji Nakagawa, Kotaro Hayakawa, Hideyuki Chiashi
  • Publication number: 20150118456
    Abstract: An object with a coating comprising: a) covalent bonds formed by reaction of a thiol group and a carbon-carbon double bond, b) covalent bonds formed by reaction of a thiol group and epoxide group, c) covalent bonds formed by a reaction of a carbon-carbon double bond and an epoxide group, said coating comprising a first primer coating and a second coating, said coating comprising covalent bonds between said first and second coatings, said first primer coating comprising covalent cross links between compounds, in the first coating the fraction (r3=ta/tc) of unreacted thiol groups (ta) to thiol groups which have reacted to form a covalent bond (tc) does not exceed 0.11, wherein the half height peak width of tan delta does not exceed 30° C. Advantages of the dual cure composition is that excellent strength is obtained and that the second curing is slow compared to the first initial curing.
    Type: Application
    Filed: November 5, 2014
    Publication date: April 30, 2015
    Inventors: Carl Fredrik CARLBORG, Tommy HARALDSSON
  • Publication number: 20150111043
    Abstract: Disclosed is an antifogging film-forming material obtained by reacting, in the presence of a quaternary ammonium salt or quaternary phosphonium salt, a copolymer represented by a certain general formula with a multifunctional epoxy compound having a solubility of 40-100 mass % in 25° C. water. The antifogging film-forming material is characterized by having a weight average molecular weight of 100,000-5,000,000. With this material, it becomes possible to obtain an antifogging article excellent in antifogging property, heat resistance, chemical resistance and abrasion resistance.
    Type: Application
    Filed: February 20, 2013
    Publication date: April 23, 2015
    Inventors: Chiharu Takimoto, Toshihiro Hirano, Toru Ashida, Nozomi Oonishi
  • Publication number: 20150104650
    Abstract: An adhesive composition for polarizing plates includes: (A) a non-(meth)acrylate type epoxy compound; (B) a non-epoxy type (meth)acrylate compound; and (C) a (meth)acrylate group-containing epoxy compound. A polarizing plate includes an adhesive layer formed from the adhesive composition on a polarizer, and a protective film on the adhesive layer. A display apparatus includes the polarizing plate.
    Type: Application
    Filed: August 27, 2014
    Publication date: April 16, 2015
    Inventors: Mi Yeon Yu, Do Heon Lee, Tae Hyun Lee, In Cheon Han
  • Patent number: 9005761
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 14, 2015
    Assignee: Elite Material Co., Ltd.
    Inventor: Yu-Te Lin
  • Publication number: 20150099127
    Abstract: Disclosed herein is an adhesive composition for polarizing plates having increased adhesion by preventing curing inhibition due to moisture. The present invention provides an adhesive composition for polarizing plates, comprising: (A) a radical polymerizable monomer; (B) a cationic polymerizable monomer; (C) an unsaturated dicarboxylic acid anhydride; and (D) an initiator.
    Type: Application
    Filed: February 14, 2013
    Publication date: April 9, 2015
    Inventors: Hirosh Ogawa, Tatsuhiro Suwa
  • Publication number: 20150097463
    Abstract: The stack of laminations consists of punched laminations (5), which are bonded together by an adhesive agent. The adhesive agent is composed of an adhesive (4) and an initiator (15), which consists of methacrylates, derivative imines and methacrylic esters. The completely cured adhesive bond has long-term resistance when exposed to a temperature of at least over 80° C. The adhesive (4) is applied over the full surface area and in a contacting manner to one side of the lamination (5) and the initiator (15) is applied to the same side and/or to the other side of the lamination (5). The initiator (15) reacts with the adhesive (4) when contact is made and establishes the adhesive connection between laminations (5) lying against one another. The adhesive agent may, however, also be an adhesive (4) that cures by itself when heat is applied.
    Type: Application
    Filed: March 13, 2013
    Publication date: April 9, 2015
    Inventors: Daniel Blocher, Steffen Bauer, Andras Bardos
  • Publication number: 20150086791
    Abstract: One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate. One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate during building or reconfiguring a product.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Applicant: GM Global Technology Operations LLC
    Inventors: Alan L. Browne, Tao Xie, John C. Ulicny, William R. Rodgers, Nilesh D. Mankame, Xingcheng Xiao, Nancy L. Johnson, Jessica A. Schroeder, John N. Owens, Ingrid Rousseau, Hamid G. Kia, Paul E. Krajewski
  • Publication number: 20150082747
    Abstract: Provided is e.g., an epoxy resin curing agent, epoxy resin composition and a gas-barrier adhesive containing the epoxy resin composition which can express high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester, and a gas-barrier laminate having high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester. The epoxy resin curing agent of the present invention is a reaction product of the following (A) and (B). Furthermore, the epoxy resin curing agent contains at least an epoxy resin and the epoxy resin curing agent of the present invention. (A) metaxylylenediamine or paraxylylenediamine; (B) an unsaturated carboxylic acid represented by the following formula (1) and/or derivatives thereof: wherein R1 represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.
    Type: Application
    Filed: March 25, 2013
    Publication date: March 26, 2015
    Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., Henkel AG & Co. KGaA
    Inventors: Eiichi Honda, Kazuki Kouno
  • Patent number: 8974905
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: March 10, 2015
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Publication number: 20150064447
    Abstract: An optical device includes a support structure configured to retain an optical element using a cured adhesive composition that is disposed between a surface of the support structure and a surface of the optical element, wherein a structured optical particulate material is dispersed throughout the cured adhesive. The structured optical particulate material redirects curing radiation via a scattering mechanism to facilitate curing of portions of the adhesive compositions that cannot be directly exposed to the radiation, thereby facilitating rapid and more thorough curing than could otherwise be achieved without the structured optical particulate material.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 5, 2015
    Applicant: Corning Incorporated
    Inventors: Paul Gerard Dewa, Justin Paul Gales, Robert Dennis Grejda, Todd Robert McMichael, Paul John Shustack
  • Publication number: 20150059295
    Abstract: An epoxy resin curing agent includes at least the following component (I) and component (II) in a mass ratio of 50/50 to 92/8: Component (I): a reaction product obtained by reacting at least (A) metaxylylenediamine or paraxylylenediamine and at least one selected from (B1) acrylic acid and acrylic acid derivatives; Component (II): a reaction product obtained by reacting at least (A) metaxylylenediamine or paraxylylenediamine and at least one selected from (B2) unsaturated carboxylic acids represented by the following formula (1) and derivatives thereof: wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group; so that at least one of R1 and R2 is an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.
    Type: Application
    Filed: March 25, 2013
    Publication date: March 5, 2015
    Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., HENKEL AG & CO. KGAA
    Inventors: Eiichi Honda, Kazuki Kouno
  • Publication number: 20150053458
    Abstract: Disclosed herein are an insulating film for a printed circuit board and products having the same. In detail, in the insulating film according to a representative embodiment of the present invention, an insulating material in which a content of an inorganic filler in an insulating layer has a concentration gradient and a printed circuit board using the same may increase fillability of an inner layer circuit and a through hole of the inner layer circuit.
    Type: Application
    Filed: June 19, 2014
    Publication date: February 26, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Choon Keun Lee, Dong Hoon Kim, Jong Yoon Jang, Jae Hyun Jung, Jae Choon Cho
  • Patent number: 8956732
    Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: February 17, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masaki Takeuchi, Katsuyuki Masuda, Kenichi Tomioka, Takako Ejiri
  • Publication number: 20150041181
    Abstract: A process for the preparation of a printed wiring board that can prevent generation of crack and warpage is provided. A process for the preparation of a printed wiring board, comprising a step of forming a curable resin layer and a non-curable resin layer sequentially on a surface of a substrate; a step of forming depressions in the non-curable resin layer and the curable resin layer from the non-curable resin layer side; a step of applying a catalyst for plating to a surface of the non-curable resin layer and surfaces of the depressions; a step of removing the non-curable resin layer and the catalyst for plating provided on the surface of the non-curable resin layer; and a step of electroless plating the surfaces of the depressions.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 12, 2015
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Takayuki CHUJO, Arata ENDO
  • Publication number: 20150034156
    Abstract: The invention relates to a radiation curable adhesive system for use in bonding a high thermal deformation temperature layer to a UV opaque, pigmented or non-pigmented fluoropolymer film The radiation curable adhesive system uses an adhesive composition optimized for cure using long wavelength UV energy. The adhesive system may also be optimized for curing by LED or e-beam radiation. The system is designed for curing through a UV opaque fluoropolymer film—and especially where titanium dioxide is used as the pigment. A preferred multilayer film structure is a polyvinylidene fluoride (PVDF)/curable adhesive/polyester terephthalate (PET) structure. This film structure is especially useful as a backsheet for a photovoltaic module.
    Type: Application
    Filed: February 14, 2013
    Publication date: February 5, 2015
    Inventors: Robert L. Kensicki, Joshua M. Oliver, Amy A. Lefebvre, Gregory S. O'Brien
  • Publication number: 20150034227
    Abstract: An article having a fluid permeation prevention layer, such as a pneumatic tire or hose. A tire for example includes an outer tread layer, intermediate sidewall and carcass layers and an innermost air permeation prevention layer: (i) the air permeation prevention (APP) layer having an upper and a lower surface, the layer having a polymer composition exhibiting an air permeation coefficient (APC) of about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.) or less and a Young's modulus of about 1 MPa to about 500 MPa, the polymer composition comprising: (A) at least 10 wt % of at least one thermoplastic resin component having an APC of about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.) or less and a Young's modulus of more than 500 MPa, which is preferably a polyamide resin or mixture, and (B) at least 10 wt % of at least one elastomer component having an APC of more than about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.
    Type: Application
    Filed: October 17, 2014
    Publication date: February 5, 2015
    Inventors: Andy Haishung Tsou, Stephan Bertil Ohlsson, Yoshihiro Soeda, Shusaku Tomoi, Yuichi Hara
  • Publication number: 20150037865
    Abstract: Kits and assemblies for causing, enhancing, and/or expediting consumption of an article by at least one biodegradative living organism are disclosed. The kits and assemblies include at least one additional living organism that enhances and/or expedites consumption of the article by the at least one biodegradative living organism. Methods of producing and using same are also provided.
    Type: Application
    Filed: October 21, 2014
    Publication date: February 5, 2015
    Inventor: Donald E. Weder
  • Patent number: 8945711
    Abstract: It is an object of the present invention to provide a water-based composite resin composition which has an excellent long-term storage stability and which enables formation of a coating film having an excellent water resistance and solvent resistance. The present invention relates to a water-based composite resin composition and a coating agent; the water-based composite resin composition containing composite resin particles (A) and an aqueous medium (B), the composite resin particles (A) containing polyester resin (a1) particles having a sulfonate group and an epoxy resin (a2) of which some or all parts are encapsulated in the polyester resin (a1) particles, wherein a mass ratio [(a1)/(a2)] of the polyester resin (a1) to the epoxy resin (a2) in the composite resin particles (A) is in the range of 95/5 to 30/70.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: February 3, 2015
    Assignee: DIC Corporation
    Inventors: Tomokazu Higeshiro, Mitsuru Kitada
  • Publication number: 20150016072
    Abstract: The present invention provides a dry film capable of forming a cured coating film having an excellent laser processability and a desmear resistance, and a printed writing board using the same. Further, the present invention provides a method of producing a printed writing board for a flip-chip mounting substrate capable of simply and inexpensively forming a dam preventing from spreading an underfill, a printed writing board obtained by the method of producing, and a flip-chip mounting substrate in which a chip is subjected to flip chip mounting on the printed writing board. A dry film comprising: a carrier film and a photocurable resin composition layer (L1) formed by applying and drying a photocurable resin composition; and at least a thermosetting resin composition layer (L2) formed by applying and drying a thermosetting resin composition in a gap between the photocurable resin composition layer (L1) and the carrier film.
    Type: Application
    Filed: December 18, 2012
    Publication date: January 15, 2015
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Gento Iwayama, Arata Endo, Shoji Minegishi, Masao Arima
  • Publication number: 20150017448
    Abstract: An adhesive composition for a polarizing plate has good initial curing and an adhesive property. The adhesive composition includes (A) a polymerizable functional group-containing monomer capable of providing an anchor effect; (B) an epoxy group-containing compound; (D) a photoacid generator; and (E) at least one of a photopolymerization initiator and a photosensitizer.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Inventors: Tatsuhiro SUWA, Hiroshi OGAWA