Abstract: A cleaning wafer cleans process residues from a support surface used in the processing of a substrate in an energized gas. The cleaning wafer has a disc having a liquid precursor derived polyimide layer formed directly on the disc by applying a liquid polyimide precursor to the disc. The polyimide layer has a thickness of less than about 50 microns, and a cleaning surface shaped to match a contour of the support surface. Process residues adhere to the cleaning surface and are cleaned from the support surface upon removal of the cleaning wafer therefrom.

Abstract: Methods and compositions for depositing a film on one or more substrates include providing a reactor with at least one substrate disposed in the reactor. At least one metal precursor are provided and at least partially deposited onto the substrate to form a metal-containing film.

Abstract: The preparation of robust, thin film materials with large second-order optical nonlinearities through the covalent self-assembly of chromophoric compositions and innovative use of silyl chemistry.

Abstract: The present invention provides a laminated material for metal key-sheet to be used for input button portion of information terminal devices, the laminated material for metal key-sheet including: at least a transparent resin sheet and a metal plate, wherein cut-out letters and so on are formed in the laminated material by etching. The present invention also provides a metal key-sheet in which cut-out letters with a lot of flexibility of design can be formed, and a metal keypad which can be produced by simple methods.

Abstract: The invention relates to a composite article comprising at least one metal reinforcement element embedded in a polymer material. An adhesion promoting layer is interposed between the metal reinforcement element and the polymer material. The adhesion promoting layer comprises an organofunctional silane and a hyperbranched polymer. The invention further relates to a method of manufacturing a composite article and to the use of a composite article as metal reinforced article.

Abstract: An article which comprises a surface of light metal. The surface is provided with an alkali-resistant protective coat comprising (a) an oxide layer which comprises silicon and boron as a basecoat and (b) an oxide layer which comprises silicon as a vitreous topcoat.

Abstract: This surface-treated metal material includes a composite film obtained by applying a metal surface treatment agent on a surface of a metal material and drying the metal surface treatment agent, the metal surface treatment agent containing: an organic silicon compound (W) obtained by combining a silane coupling agent (A) containing one amino group in a molecule and one glycidyl group in a molecule, at a solid content mass ratio [(A)/(B)] of 0.7 to 1.7; at least one kind of fluorine compound (X) selected from titanium hydrofluoric acid and zirconium hydrofluoric acid; a phosphoric acid (Y); a vanadium compound (Z); and at least one kind of lubricant (J).

Abstract: A method for making a composite structure or a portion of a composite structure of a braking band of a brake disc, unusually capable of obtaining a structure with an especially long life, comprising at least the following steps: making a composite ceramic structure, comprising carbon fibre filaments, silicon and silicon carbides, obtaining a body of a braking band comprising at least one braking surface; processing said braking surface removing a surface layer so as to have carbon not bonded with the silicon on surface; removing at least partly the carbon not bonded with silicon from the surface; depositing an anchoring substrate on said braking surface; and depositing a protective coating on said anchoring substrate.

Abstract: A sol-gel coating composition comprising fluoropolymer particles is disclosed. The fluoropolymer particles are distributed homogeneously in the coating, leading to scratch-resistant anti-stick and low-friction coatings that are suitable, for example, for electrical and non-electrical domestic appliances.

Abstract: The present invention relates to a metal matrix composite (MMC) and the method of manufacturing the MMC. The MMC includes a preform formed from a composition having ceramic particles and ceramic fibers. The metal matrix composite also includes a support element formed from a metal where the metal impregnates through the preform. The method of forming the MMC includes the step of extruding the composition through a multi-screw extruder to form an extrudate. The method also includes the step of heating the preform and positioning the preform within a mold. The method further includes the step of heating the metal for forming a molten metal and injecting the molten metal into a cavity of the mold under pressure for infiltrating the preform with the molten metal. The method also includes cooling the molten metal to solidify the molten metal and form the metal matrix composite and removing the metal matrix composite from the mold.

Abstract: The invention provides oxidation resistant coatings for transition metal substrates and transition metal alloy substrates and method for producing the same. The coatings may be multilayered, multiphase coatings or gradient multiphase coatings. In some embodiments the transition metal alloys may be boron-containing molybdenum silicate-based binary and ternary alloys. The coatings are integrated into the substrates to provide durable coatings that stand up under extreme temperature conditions.

Abstract: Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial substrate. A seed layer of the metal can be deposited on or over the adhesion layer. The metal material can be deposited on the seed layer by electroplating or other low-temperature, low-stress process to form a microelectronics-grade metal substrate. Thin film sensors and/or other microelectronic devices, followed by appropriate insulating layer(s), may be fabricated on or over the sacrificial substrate before forming the metal substrate. The sacrificial silicon substrate can then be etched away, leaving the microelectronics-grade metal substrate, and possibly the microelectronics device.

Abstract: A method for producing synthetic ceramic tile, including at least providing a ceramic tile, coating a coating on the ceramic tile, the coating containing at least an aluminum pigment and/or at least a titanium-mica pearlescent pigment, and drying a liquid coating deposited on the ceramic tile, or melt-quenching or melt-curing a powder coating deposited on the ceramic tile. The synthetic ceramic tile has a metallic or pearl color, which improves its decorative effect.

Abstract: The invention relates to the use of polysilazanes as a permanent coating on metal and polymer surfaces for preventing corrosion, increasing scratch resistance and to facilitate easier cleaning. The invention comprises a solution of a polysilazane or a blend of polysilazanes of the general formula 1 —(SiR?R?—NR??)n—??(1) where R?, R? and R?? are identical or different and independently of one another represent hydrogen or an optionally substituted alkyl, aryl, vinyl or (trialkoxysilyl)alkyl group and n represents a whole number and is calculated in such a way that the polysilazane has a numerical average molecular weight of 150 to 150 000 g/mol, in a solvent. The invention also relates to a method for producing the coating.

Abstract: An object of the present invention is to provide a fixing member which includes a surface layer including fluorine rubber having an ether bond and a polysiloxane having a polyether structure, and which has excellent adhesion between the surface layer and a substrate. A fixing member is provided including a substrate, an adhesion layer and a surface layer disposed in contact with the adhesion layer, wherein the surface layer includes fluorine rubber having an ether bond and a polysiloxane having a polyether structure, and wherein the adhesion layer contains a polyorganosiloxane resin and an existence ratio of carbon combining with oxygen to silicon combining with oxygen in the adhesion layer is 1.0 or more and 20.0 or less.

Abstract: Semiconductor devices, structures and systems that utilize a polysilazane-based silicon oxide layer or fill, and methods of making the oxide layer are disclosed. In one embodiment, a polysilazane solution is deposited on a substrate and processed with ozone in a wet oxidation at low temperature to chemically modify the polysilazane material to a silicon oxide layer.

Abstract: The present invention describes processes for coating substrates with a nanocomposite SiCON material. In addition, the present invention describes the dielectric nanocomposite coatings.

Abstract: An appliance transparency, such as an oven transparency, includes at least one substrate and a coating deposited over at least a portion of the substrate. The coating includes at least one metal layer, such as a metallic silver layer. The metal layer can have a thickness in the range of 80 ? to 100 ? and optionally or the coating can have a protective coating deposited thereon.

Abstract: Methods for forming ruthenium films and semiconductor devices such as capacitors that include the films are provided.

Abstract: A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of the metal substrate satisfies an equation as follows, ? f + 0.162 × ( 1 - v f ) E f ? ? s ? ? f + 0.889 × ( 1 - v f ) E f Ef representing Young's modulus of the buffer layer, vf representing Poisson's ratio of the buffer layer, ?f representing a coefficient of thermal expansion of the buffer layer, and ?s representing the predetermined coefficient of thermal expansion of the metal substrate.

Abstract: A method of forming a layer of an electrically conductive metal-silicide material, comprises steps of: providing a Si-containing workpiece; forming a Ni-doped Co layer on a surface of the workpiece, as by sputter deposition utilizing a Ni-doped Co sputtering target; and reacting the Ni-doped Co layer and workpiece. Embodiments include performing a salicide process to form electrically conductive Ni-doped Co silicide functioning as electrically conductive contacts to the gate electrode and source and drain regions of a MOS transistor. Also disclosed are PVD sources, e.g., sputtering targets, comprising Ni-doped Co and utilized for forming the Ni-doped Co layer.

Abstract: A glazing panel has a coating stack comprising in sequence at least a base antireflective layer, an infra-red reflecting layer, a top antireflective layer and a top coat layer comprising in sequence at least two sublayers: a first one consisting essentially of at least one material selected from the group consisting of titanium, titanium oxide and titanium nitride, and a second one, consisting essentially of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, silicon carbonitride, silicon oxycarbide, or silicon oxycarbonitride. The second topcoat sublayer may have a geometrical thickness in the ranges 15 to 30 ? or 200 to 400 ?.

Abstract: A stress distribution resulting from variation in in-plane film quality of a stress relaxation layer and a reflective layer is eliminated. A reflective layer is stacked on a substrate via a stress relaxation layer. The stress relaxation layer has a stress relaxation portion having a uniform film thickness distribution to cancel the internal stress of the reflective layer, and a stress distribution eliminating portion with a film thickness distribution approximated to a second order even function. The stress is substantially proportional to the film thickness. Thus, formation of a given film thickness distribution allows the stress distribution to be controlled. However, changing the film thickness distribution based on a design value may degrade the optical characteristics. Thus, the film thickness distribution of the stress distribution eliminating portion, which serves to eliminate the stress distribution, is approximated to the second order even function.

Abstract: A silicon nitride cutting tool comprising a sintered product is disclosed. The sintered product comprises silicon nitride, at least one rare earth element compound, and a magnesium compound. The silicon nitride cutting tool further comprises a surface region and an inside region comprising the sintered product with varying content ratios of component compounds to provide enhanced wear and fracture resistance.

Abstract: The present invention relates to a dielectric ceramic composition comprises a main component including a dielectric oxide having a composition shown by [(Ca1-xSrx)O]m[(Zr1-y-z-?TiyHf2Mn?)O2], note that, 0.991?m?1.010, 0?x?1, 0?y?0.1, 0<z?0.02, 0.002<??0.05), 0.1 to 0.5 parts by mol of Al2O3 and 0.5 to 5.0 parts by mol of SiO2 with respect to 100 parts by mol of the main component. A purpose of the present invention is to provide a dielectric ceramic composition available to prevent the occurrence of crack even when a dielectric layer is made thin, for example, 2 ?m or less, while maintaining various advantageous properties of a dielectric ceramic composition of [(CaSr)O]m[(TiZrHf)O2] type.

Abstract: An environmental barrier coating for a component including silicon that has a first coefficient of thermal expansion is provided. The environmental coating includes a silicon bondcoat that is bonded to at least a portion of an outer surface of the component. An intermediate layer is bonded to the silicon bondcoat and has a second coefficient of thermal expansion matched to the first coefficient of thermal expansion. The intermediate layer has a general composition of RE2Si2O7. A protective layer is bonded to the intermediate layer and has a general composition of RE2SiO5. A surface layer is bonded to the protective layer. The surface layer includes RE and has a ratio of RE to oxygen of at least 2:3.

Abstract: Oleophilic compositions, coatings employing the same, and devices formed therefrom that exhibit one or more improved coating properties. The compositions may comprise a film-forming binder and, when at least partially coated and cured on a substrate, comprise: (a) a contact angle with water ranging from 50 to less than 78; and (b) a contact angle with squalene of less than 25. The coating compositions may include various binder compositions, including, for example, thermosetting acrylic polymers, thermoplastic acrylic polymers, radiation curable coating compositions, and alkoxide compositions. The resultant coatings exhibit one or more improved physical properties, such as improved gloss, improved stain and sebum resistance, and/or improved cleaning ability relative to existing coating systems when deposited over various substrates.

Abstract: The present invention provides a mask blank used for the charged particle beam exposure made by employing an SOI substrate having a silicon membrane higher reliability in quality, without the problem of deformation due to the compression stress of a silicon oxide film as an intermediate layer of the SOI substrate, and provides a method for forming a mask blank and a mask used for the charged particle beam exposure. The mask blank used for the charged particle beam exposure made by employing an SOI substrate having a front-side silicon membrane and a back-side silicon layer with a silicon oxide layer interposed therebetween is characterized in that the back-side silicon layer and the silicon oxide film of said SOI substrate are partially removed to form an opening to be an exposed region and an etching stop layer having lower stress is formed in the opening.

Abstract: A piston ring includes: a refined steel including: carbon C in a range of 0.20% mass to 0.90% mass, silicon Si in a range of 0.10% mass to less than 0.60% mass, manganese Mn in a range of 0.20% mass to 1.50% mass, chromium Cr in a range of 0.30% mass to 2.00% mass, and a remnant including: iron Fe, and an unavoidable impurity. A parameter A calculated from the following expression (1) based on contents of the Si, Mn and Cr is 9.0 or less: parameter A=8.8 Si+1.6 Mn+1.7 Cr—expression (1). A parameter B calculated from the following expression (2) based on contents of the C, Si, Mn and Cr is 10.8 or more: parameter B=36 C+4.2 Si+3.8 Mn+4.5 Cr—expression (2).

Abstract: An optically modified three-dimensional object includes a metal substrate material. At least one dielectric material is on the metal substrate material. A visual property of the substrate material and visible light reflected by the at least one dielectric material create a desired visual appearance of the three-dimensional object.

Abstract: The invention relates to a multilayered film comprising at least one upper layer a), a middle layer b) made of (meth)acrylate copolymer, and a supporting layer c) made of polycarbonate. Upper layer a) contains a light-stability agent and is made of a (meth)acrylate copolymer that, together with the polycarbonate of supporting layer c), can form partially compatible mixtures. A test piece, which is made from a mixture consisting of 20% by weight of (meth)acrylate copolymer and 80% by weight of polycarbonate, has a breaking elongation (ISO 527-2) of at least 75% at 23° C. The middle layer b) contains a colorant and, optionally, a light-stability agent and is made from an identical or different (meth)acrylate copolymer that, together with the polycarbonate of supporting layer c), can form partially compatible mixtures.

Abstract: The invention relates to a thin-film composite system which has at least one substrate film and at least one thin film. The catalyst thereby catalyses the reduction of oxygen, as a result of which oxygen which is detrimental to oxidation-susceptible packaging items is consumed. The composite system according to the invention is used also in the form of bag films, cover films or partially applied individual films for oxygen-susceptible packaging items. A method for oxygen-free packaging of oxidation-susceptible packaging items is likewise provided.

Abstract: The invention relates to a glazing assembly comprising at least one transparent substrate, especially made of glass, provided with a thin-film multilayer comprising, in the following order starting from the substrate, at least: (a) a first dielectric layer comprising a barrier layer acting as a barrier to the diffusion of oxygen and chosen from silicon nitrides; (b) a lower stabilizing layer made of a metal or metal alloy X; (c) a functional layer having reflection properties in the infrared and/or in the solar radiation, especially a metal layer; (d) an upper metal blocking layer made of a metal or metal alloy Y; (e) a second dielectric layer comprising a barrier layer acting as a barrier to the diffusion of oxygen and chosen from silicon nitrides; and (f) optionally, a protective oxide layer; in which multilayer the metal or alloy X of the lower stabilizing layer is different from the metal or alloy Y of the upper blocking layer.

Abstract: The present invention can provide a silicon semiconductor substrate used for and epitaxial wafer, in which uniform and high-level gettering ability is obtained irrespective of slicing positions from a silicon single crystal while generation of epitaxial defects can be suppressed, by doping carbon or carbon along with nitrogen during a pulling process of a CZ method or by performing appropriate heat treatment prior to the epitaxial process. Therefore, a crystal production yield can remarkably be improved because a permissible upper limit (concentration margin) of an oxygen concentration which is restricted by formation of a ring-shaped OSF region can be higher and also an excellent gettering ability is exhibited, while allowing an epitaxial wafer to be produced wherein epitaxial defects attributable to substrate crystal defects are not formed.

Abstract: Hydrophobic coating compositions are provided as are processes to coat articles with the compositions. Extremely hydrophobic coatings are provided by the compositions. Durable, weatherable and scratch-resistant coatings are provided by compositions comprising a fluorinated component and an adhesion promoter compound. The adhesion promoter compound can include an alkoxy group, a furfuryl-containing ring structure, and a reactive group.

Abstract: Provided is a copper foil for a printed circuit board comprising a heatproof treatment layer formed on an non-roughened surface of the copper foil to become a joining surface with resin, a chromate coated layer formed on the heatproof treatment layer, and a silane coupling agent layer formed on the chromate coated layer, wherein the Zn amount of the outermost copper foil surface after forming the silane coupling agent layer is 1.5 Atomic % or less, and the Cr amount is 3.0 to 12.0 Atomic %. This copper foil for a printed circuit board is superior in chemical resistance, adhesiveness, and high frequency characteristics.

Abstract: An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covalently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covalently bound POSS allows for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.

Abstract: An appliance transparency includes a first substrate defining a No. 1 and a No. 2 surface and a second substrate spaced from the first substrate and defining a No. 3 and a No. 4 surface. A first coating is deposited over at least a portion of the No. 2 surface and is free of metallic layers. A second coating is deposited over at least a portion of the No. 4 surface and has at least one metallic layer. A protective coating is deposited over at least a portion of the second coating.

Abstract: An electromagnetic radiation shielding device includes a first ply having a No. 1 surface and a No. 2 surface and a second ply having a No. 3 surface and a No. 4 surface. The No. 2 surface of the first ply faces the No. 3 surface of the second ply. A first coating having three or more metallic layers is provided over at least a portion of one of the surfaces, such as over at least a portion of the No. 2 surface. A second coating having three or more metallic layers is provided over at least a portion of one or more of the other surfaces, such as over at least a portion of the No. 3 surface.

Abstract: Provided are a metal line, a method of forming the same, and a display using the same. To increase resistance of a metal line having a multilayered structure of CuO/Cu and prevent blister formation, a plasma treatment is performed using a nitrogen-containing gas and a silicon-containing gas or using a hydrogen or argon as and the silicon-containing gas. Accordingly, a plasma treatment layer such as a SiNx or Si layer is thinly formed on the copper layer, thereby preventing an increase in resistance of the copper layer and also preventing blister formation caused by the damage of a copper oxide layer. Consequently, it is possible to improve the reliability of a copper line and thus enhance the reliability of a device.

Abstract: A silicon wafer that has a carbon concentration of 5×1015 to 5×1017 atoms/cm3, interstitial oxygen concentration of 6.5×1017 to 13.5×1017 atoms/cm3, and a resistivity of 100 ?cm or more.

Abstract: A coating system and process capable of providing erosion and corrosion-resistance to a component, particularly a steel compressor blade of an industrial gas turbine. The coating system includes a metallic sacrificial undercoat on a surface of the component substrate, and a ceramic topcoat deposited by thermal spray on the undercoat. The undercoat contains a metal or metal alloy that is more active in the galvanic series than iron, and electrically contacts the surface of the substrate. The ceramic topcoat consists essentially of a ceramic material chosen from the group consisting of mixtures of alumina and titania, mixtures of chromia and silica, mixtures of chromia and titania, mixtures of chromia, silica, and titania, and mixtures of zirconia, titania, and yttria.

Abstract: A ceramic resistor element or sensor element includes a ceramic substrate, which is exposable to a gas atmosphere containing carbon compounds, the ceramic substrate being provided with a coating. The coating includes copper, cerium and/or vanadium.

Abstract: An implantable medical device includes a device body at least partially formed of a polymeric material including a base polymer and a block copolymer. The block copolymer includes at least one polyethylene oxide (PEO) segment and at least one silicone (SI) segment, wherein the weight average molecular weight of the block copolymer is in the range of about 400 to about 50,000.

Abstract: A method of fabricating a device, comprising a ink or paste on a silicon based semiconductor material, wherein the ink or paste comprises a mixture of inorganic conductive and additive nanoparticles and wherein the semiconductor material is silicon. An example is a mixture of silver and palladium nanoparticles.

Abstract: Disclosed are methods of treating a metal to improve the metal's corrosion resistance. In one such method, the method is carried out by applying, to the surface of the metal, a coating which includes magnesium powder and a UV-curable or other radiation-curable binder. In another such method, the method is carried out by applying, to the surface of the metal, a coating which includes magnesium powder and an inorganic binder. In another such method, a coating that includes a magnesium alloy powder and a binder is applied to the surface of the metal. The magnesium alloy powder is selected such that it has a corrosion potential that is from about 0.01 volt to about 1.5 volt more negative than the metal's corrosion potential. Also disclosed are methods of treating a ferrous metals and magnesium alloys to improve the corrosion resistance of these materials.

Abstract: A method of imparting a non-stick coating to a surface of an aluminum foil sheet, and the resulting foil sheet. The method involves coating at least part (preferably at least 40%) of an area of a surface of a metal sheet article (preferably an aluminum foil sheet) with a substantially solvent-free silicone oil at an average coating application rate in a range of 1.5 to 10 mg/ft2 of the coated surface area. The coated sheet article is then preferably coiled. The coated sheet article is then heated in the presence of air or oxygen at a temperature of 250° C. or higher for a period of time of at least 10 minutes. The treated surface is both non-stick and food-friendly.

Abstract: An insert in an injection-molded part is provided, in particular a fastening bush for accommodating a fastening means in a receptacle opening, having at least one outer surface. At least the outer surface has a metallic anticorrosion layer on which a sealing layer is deposited.

Abstract: A composite structure for microlithography, in particular a holding device for a wafer, has two or more components, the surfaces of which are bonded together at least at one bond. At least one of the components consists of cordierite (Mg2Al4Si5O18) or of silicon carbide (SiC). Also disclosed is an optical arrangement, in particular a projection illumination apparatus for microlithography, having at least one such composite structure, preferably a wafer stage.

Abstract: A wafer has a rare earth fluoride coating disposed, typically sprayed on a substrate as an outermost layer, the rare earth fluoride being selected from lanthanoid fluorides, yttrium fluoride, and scandium fluoride. It is useful as a dummy wafer in a plasma etching or deposition system.