Having Aperture Or Cut Patents (Class 428/596)
  • Publication number: 20040026562
    Abstract: An endless yarn braking strip for a yarn tensioning device consists of precipitation hardened stainless steel (S). The endless yarn braking strip is produced by first manufacturing an endless blank from a sheet of precipitation hardening steel, shaping the blank into a truncated cone in its endless form, and then hardening the strip by precipitation hardening.
    Type: Application
    Filed: August 11, 2003
    Publication date: February 12, 2004
    Inventors: Kurt Arne Gunnar Jacobsson, Per Ohlson
  • Publication number: 20040018373
    Abstract: The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.
    Type: Application
    Filed: January 10, 2003
    Publication date: January 29, 2004
    Inventors: Tomoe Suzuki, Shinji Yuri, Kazuhisa Sato, Kozo Yamasaki
  • Publication number: 20040018372
    Abstract: A process of forming a high-definition pattern by etching is provided. A photosensitive resin layer is formed on a metal substrate material having a center line-average surface roughness Ra of up to 0.10 &mgr;m and a maximum surface roughness Rmax of up to 1.0 &mgr;m to form a resist pattern. Then, the photosensitive resin layer provided on the metal substrate material is exposed to light to form a resist pattern. Finally, etching is carried out to form a pattern on the metal substrate material.
    Type: Application
    Filed: July 18, 2003
    Publication date: January 29, 2004
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takayasu Komatsu, Daisuke Hashimoto, Akira Makita, Koji Fujiyama
  • Publication number: 20040000426
    Abstract: Provided is a process for creating a via through a substrate including the steps of (a) providing a substantially void-free film of a curable composition; (b) applying a resist onto the curable film; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the curable film; (e) removing the exposed areas of the curable film to form holes through the curable film; and (f) heating the curable film of step (e) to a temperature and for a time sufficient to cure the curable composition. Also disclosed is a process of fabricating a circuit assembly which includes building patterned circuit layers upon a substrate that has vias provided by the aformentioned process.
    Type: Application
    Filed: June 27, 2002
    Publication date: January 1, 2004
    Inventors: Kevin C. Olson, Alan E. Wang
  • Publication number: 20040001964
    Abstract: A method of manufacturing a nonostructure, which enables cylindrical pores arrayed according to any periodic pattern to be easily made on a substrate over a large area at a low cost in a short period of time. The method of manufacturing a structure having such pores includes the steps of preparing a substrate having recesses in its surface, providing a film on the surface of the substrate and anodizing the film.
    Type: Application
    Filed: July 1, 2003
    Publication date: January 1, 2004
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Hiroshi Ohkura, Tohru Den, Tatsuya Iwasaki
  • Publication number: 20040000427
    Abstract: Provided is a process for creating vias for a circuit assembly including the steps of (a) applying a curable coating composition to a substrate, some or all of which is electrically conductive, to form an uncured coating thereon; (b) applying a resist over the uncured coating; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the uncured coating; (e) removing the exposed areas of the uncured coating; and (f heating the coated substrate of step (e) to a temperature and for a time sufficient to cure the coating. Also disclosed is a process of fabricating a circuit assembly.
    Type: Application
    Filed: June 27, 2002
    Publication date: January 1, 2004
    Inventors: Alan E. Wang, Kevin C. Olson
  • Patent number: 6656603
    Abstract: A method of making an expanded metal sandwich structure includes cleaning at least two metal superplastic core sheets to remove metal oxides and residues that would interfere with diffusion bonding of the sheets. The core sheets are placed face-to-face and a gas pressure line fitting is inserted between one edge and is welded into place. The fitting has a through bore through which gas can flow under pressure from a gas pressure control system into the space between the core sheets. The core sheets are pressed together and laser welded together into a core pack along lines which will form junction lines between the core sheets when the core pack is superplastically expanded. The core pack is chemically cleaned to remove metal oxides and residues that would interfere with diffusion bonding of the core pack sheets to face sheets. Two metal face sheets having superplastic characteristics are chemically cleaned and placed over and under the core pack.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: December 2, 2003
    Assignee: The Boeing Company
    Inventors: Frederick W. Buldhaupt, David H. Gane, Matthew G. Kistner, Jeffrey D. Will
  • Publication number: 20030215664
    Abstract: The present invention describes a method for fabricating an embossing tool or an x-ray mask tool, providing microstructures that smoothly vary in height from point-to-point in etched substrates, i.e., structure which can vary in all three dimensions. The process uses a lithographic technique to transfer an image pattern in the surface of a silicon wafer by exposing and developing the resist and then etching the silicon substrate. Importantly, the photoresist is variably exposed so that when developed some of the resist layer remains. The remaining undeveloped resist acts as an etchant barrier to the reactive plasma used to etch the silicon substrate and therefore provides the ability etch structures of variable depths.
    Type: Application
    Filed: May 14, 2002
    Publication date: November 20, 2003
    Inventors: Alfredo M. Morales, Marcela Gonzales
  • Patent number: 6638642
    Abstract: A copper foil with excellent laser drilling property, having a layer containing any one or more substances selected from indium, tin, cobalt, zinc, cobalt alloys, and nickel alloys on the face of the copper foil to be radiated with laser beams. A copper foil easy to be laser-processed and suitable for forming through hole and via hole with a small diameter at the time of manufacturing a printed circuit board and a method for manufacturing such a copper foil are achieved by improving the surface of a copper foil.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: October 28, 2003
    Assignee: Nikko Materials Company, Limited
    Inventors: Kouji Kitano, Mikio Hanafusa
  • Patent number: 6630249
    Abstract: A composite structural laminate plate suitable for building maritime vessels or for building civil structures such as double hull oil tankers, bulk carriers, barges decks for roll-on roll-off ferries, orthotropic bridge decks or for building any structural application in which the traditional method of construction uses stiffened steel plates. The laminate has two facing metal layers that are structurally bonded to a polyurethane elastomer core which may have steel or rigid foam void sections embedded within. The laminate provides equivalent inplane and transverse stiffness and strength, reduces fatigue problems, minimizes stress concentrations, improves thermal and acoustical insulation, and provides vibration control. The laminate provides a structural system that acts as a crack arrest layer and that can join two dissimilar metals without welding or without setting up a galvanic cell.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: October 7, 2003
    Assignee: Fern Investments Limited
    Inventor: Stephen J. Kennedy
  • Publication number: 20030180569
    Abstract: A workpiece is coated with carbonizable polymer for laser machining an aperture through the workpiece. The workpiece is protected by the polymer during laser machining so that the surface of the workpiece and areas surrounding the aperture are substantially free of debris produced by the laser machining process. The carbonized polymer is removed after laser machining. A method of forming an aperture by a laser on a thin metallic plate is also described.
    Type: Application
    Filed: December 20, 2002
    Publication date: September 25, 2003
    Inventors: Christoph Hamann, Michael J. Kelley
  • Publication number: 20030165621
    Abstract: A process of removing deposits from through-holes in a component, such as metallic bond coat and ceramic materials from cooling holes in an air-cooled gas turbine engine. The process is particularly effective in removing a TBC material deposited in a cooling hole of a component as a result of depositing a coating of the TBC material on a surface of the component, in which the deposit is removed from the cooling hole without damaging the cooling hole or the TBC coating surrounding the cooling hole on the coated surface of the component. A preferred feature is that the cooling hole, including the entrance to the hole at a surface of the component opposite the coated surface and the coating surrounding the exit of the hole at the coated surface, exhibits improved surface characteristics that increase the discharge coefficient of the cooling hole, as evidenced by an increase in the effective area of the cooling hole.
    Type: Application
    Filed: March 1, 2002
    Publication date: September 4, 2003
    Inventors: Gilbert Farmer, Jeffrey Arnold Fehrenbach
  • Patent number: 6602611
    Abstract: The invention relates to a multi-layer composite plates and to a method for producing multi-layer composite plates. Said multi-layer composite plates are comprised of two outer metallic slabs which serve as top and base plates and which are joined to a deformable connecting material located therebetween. The top and base plates are joined to the connecting material by means of a foaming adhesive which fills the cavities remaining in the composite. The cavities remaining in the composite are completely or partially filled by the adhesive. According to the method for producing multi-layer composite plates, adhesive is introduced between the layers to be joined, and the adhesive is subjected to a thermal treatment. The adhesive is completely or partially hardened during the thermal treatment. In the case of the partially hardened adhesive, the adhesive is completely hardened during an additional thermal treatment only after the multi-layer composite plate is reshaped.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: August 5, 2003
    Assignee: DaimlerChrysler AG
    Inventors: Reiner Kopp, Arndt Gerick, Klaus Lempe-Nauer, Peter Winkler
  • Patent number: 6586110
    Abstract: Contoured metal-containing structural members and methods for making the same. The contoured structural members comprise metal-containing materials sandwiching a support or stabilizing structure. The contoured structure can be provided by tube rolling (or roll wrapping) the metal-containing materials and the support structure together and then, if necessary, bonding them or connecting them. With a contoured and generally non-flat structure, applications for the structural members of the present invention are nearly limitless.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: July 1, 2003
    Assignee: Delphi Technologies, Inc.
    Inventor: Dale Francis Obeshaw
  • Patent number: 6586112
    Abstract: A mandrel for electroforming non-uniformly thick orifice plates and a method of making the mandrel are disclosed. The orifice plates have a thicker border surrounding a thinner orifice area. The mandrel has a metallic layer on a substrate. The metallic layer has a first molding surface that is electrically isolated from a second molding surface. The first and second molding surfaces are for substantially electroforming the border and the orifice area respectively. The mandrel also has dielectric areas patterned on the metallic layer for electroforming orifices in the orifice area. In use, the first molding surface is used to first electroform the border without electroforming the orifice area. As the border builds up, it electrically connects the first and the second molding surfaces to allow the second molding surface to subsequently electroform the orifice area.
    Type: Grant
    Filed: August 1, 2000
    Date of Patent: July 1, 2003
    Assignee: Hewlett-Packard Company
    Inventor: Bun Chay Te
  • Patent number: 6579591
    Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: June 17, 2003
    Assignee: Atotech Deutschland GmbH
    Inventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
  • Publication number: 20030108762
    Abstract: A workpiece is coated with carbonizable polymer for laser machining an aperture through the workpiece. The workpiece is protected by the polymer during laser machining so that the surface of the workpiece and areas surrounding the aperture are substantially free of debris produced by the laser machining process. The carbonized polymer is removed after laser machining. A method of forming an aperture by a laser on a thin metallic plate is also described.
    Type: Application
    Filed: September 6, 2002
    Publication date: June 12, 2003
    Inventors: Christoph Hamann, Michael J. Kelley
  • Publication number: 20030087117
    Abstract: The present invention provides a tailored blank having a pair of sheet metal constituent parts each having a pair of oppositely directed major surfaces. The first constituent part has an aperture while the second constituent part has an embossment to fit the aperture. The first and second constituent parts are then secured to one another to form the tailored blank. The blank may then be subsequently formed into a component of varying material characteristics.
    Type: Application
    Filed: June 17, 2002
    Publication date: May 8, 2003
    Inventors: Walter Duley, Melih Ogmen, David Hughes, Gary Keith Black, Brian Morris, Michael James Staples
  • Patent number: 6557338
    Abstract: A thrust reverser cascade flow directing element (28) for a gas turbine engine (10) comprises a plurality of plates (30) and a plurality of flow directing vanes (40). At least one vane (40) extends between each pair of plates (30), the plurality of plates (30) are formed from sheet material and a single integral piece of ductile sheet material (32) forms the plurality of flow directing vanes (40). The single integral piece of ductile sheet material (32) has a plurality of longitudinally spaced apart apertures (36) and a plurality of longitudinally spaced apart sheet material portions (38) between the apertures (36) and the ductile sheet material (32) is bent at a plurality of longitudinally spaced positions such that each sheet material portion (38) defines one of the plurality of flow directing vanes (40).
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: May 6, 2003
    Assignee: Rolls-Royce plc
    Inventors: Michael J Holme, Jeffrey C Bishop
  • Patent number: 6555246
    Abstract: The invention relates to a method of producing a sound-absorbent insulating element with at least two metallic leaves or sheets (2, 3) in the form of films or sheets. According to said method, at least one of said elements is provided with knobs in such a manner that the limit of elasticity of the respective sheet (2, 3) is exceeded during the knobbing process, resulting in the formation of fissures (4, 11). Said fissures substantially help to improve the acoustic absorption capacity of the insulating element produced according to the inventive method.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: April 29, 2003
    Assignee: Rieter Automotive (International) AG
    Inventor: Evelyn Zwick
  • Patent number: 6534194
    Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: March 18, 2003
    Assignee: Johns Hopkins University
    Inventors: Timothy P. Weihs, Michael Reiss
  • Publication number: 20030049482
    Abstract: A method of making an expanded metal sandwich structure includes cleaning at least two metal superplastic core sheets to remove metal oxides and residues that would interfere with diffusion bonding of the sheets. The core sheets are placed face-to-face and a gas pressure line fitting is inserted between one edge and is welded into place. The fitting has a through bore through which gas can flow under pressure from a gas pressure control system into the space between the core sheets. The core sheets are pressed together and laser welded together into a core pack along lines which will form junction lines between the core sheets when the core pack is superplastically expanded. The core pack is chemically cleaned to remove metal oxides and residues that would interfere with diffusion bonding of the core pack sheets to face sheets. Two metal face sheets having superplastic characteristics are chemically cleaned and placed over and under the core pack.
    Type: Application
    Filed: June 6, 2002
    Publication date: March 13, 2003
    Applicant: The Boeing Company
    Inventors: Frederick W. Buldhaupt, David H. Gane, Matthew G. Kistner, Jeffrey D. Will
  • Patent number: 6513700
    Abstract: To provide such a boss welding structure for the arm of a working implement that is light in weight and easy in manufacture. A cylindrical body formed of one sheet metal, there are formed a first hole and a second hole of predetermined shapes. A boss is equipped with a boss seat for covering the first hole, and a bracket is equipped with a bracket seat for covering the second hole. The boss and the bracket are inserted into the cylindrical body and are individually welded on the cylindrical body from the outer side of the cylindrical body such that the first hole is covered from the inner side with the boss seat whereas the second hole is covered with the bracket seat.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: February 4, 2003
    Assignee: Komatsu Ltd.
    Inventors: Yukinobu Matsuda, Kyuichi Kawashima
  • Publication number: 20030012973
    Abstract: A metallic catalyst carrier 2 has good productivity and improves the exhaust performance by causing the flow of exhaust gas therein to become turbulent, without causing tearing, cutting, and warping of its honeycomb-structure The metallic catalyst carrier 2 has a base metal sheet 5 and a corrugated metal sheet 6 laminated together with a plurality of cell passages 7 formed between the base sheet 5 and the corrugated sheet 6 such that exhaust gases passes through the cell passages 7. The base sheet 5 or the corrugated sheet 6 is equipped with a plurality of hole lines 5a or 6a arranged along hole lines 8 or 9 in a direction perpendicular to the cell passage 7. Between adjacent hole lines 8 or 9, the holes 5a or 6a that form the hole lines 8 or 9 are separated by a prescribed distance in a direction perpendicular to the longitudinal directions of the cell passages 7.
    Type: Application
    Filed: July 15, 2002
    Publication date: January 16, 2003
    Inventors: Shin Sato, Ken Oouchi, Kimiyoshi Nishizawa
  • Publication number: 20020182436
    Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt the joining materials, which upon cooling will form a strong bond, joining two or more bulk materials. If no joining material is used, the foil reaction supplies heat directly to at least two bulk materials, melting a portion of each bulk, which upon cooling, form a strong bond.
    Type: Application
    Filed: April 18, 2002
    Publication date: December 5, 2002
    Inventors: Timothy P. Weihs, Todd Hufnagel, Omar Knio, Michael Reiss, David van Heerden, Howard Feldmesser
  • Publication number: 20020177006
    Abstract: Embedded flush circuitry features are provided by providing a carrier foil having an electrically conductive layer therein and coating the electrically conductive layer with a dielectric material. Circuitry features are formed in the dielectric material and conductive metal is plated to fill the circuitry features.
    Type: Application
    Filed: May 23, 2001
    Publication date: November 28, 2002
    Applicant: International Business Machines Corporation
    Inventors: Ronald Clothier, Jeffrey Alan Knight, Robert David Sebesta
  • Patent number: 6475629
    Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: November 5, 2002
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kazumasa Takeuchi, Tetsuya Saito, Ken Nanaumi
  • Patent number: 6447928
    Abstract: A core metal insert for use in a sealing assembly is disclosed. The core metal insert is manufactured by a process which includes the step of cutting a plurality of left lateral outermost inboard slits and a plurality of right lateral outermost inboard slits in a metal blank so as to create a slitted metal blank.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: September 10, 2002
    Assignee: The Gem City Engineering Company
    Inventor: Terry Robert Suitts
  • Patent number: 6436545
    Abstract: A joint body according to the invention is strong for a heat cycle and generates no local cracks. The joint body has the following features. An end portion of the metal member and the ceramic member are connected via a metal connection portion. The metal connection portion has a metallized layer formed on the ceramic member and a brazing connection portion interposing at least between the metallized layer and an end portion of the metal member. A melt point of a brazing member constructing the brazing connection portion is lower than that of a brazing member constructing the metallized layer.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: August 20, 2002
    Assignee: NGK Insulators, Ltd.
    Inventors: Nobuyuki Tanahashi, Tomoyuki Fujii, Tsuneaki Ohashi
  • Patent number: 6426153
    Abstract: A tailored blank is provided by welding a pair of constituent parts to one another in juxtaposition. The parts are laser welded together to form a unitary blank that is subsequently formed into a shaped finished component.
    Type: Grant
    Filed: October 1, 1999
    Date of Patent: July 30, 2002
    Assignee: Cosma Powerlasers Limited
    Inventors: Walter Duley, Melih Ogmen, David Hughes
  • Patent number: 6413650
    Abstract: A method of repairing cracks, imperfections, and the like in a cast article. A frusto-conical aperture is created in the article in the location of the crack or imperfection. A mating tapered plug is prepared such that the tapered plug can fit into the aperture so that the sloped side walls of the tapered plug evenly and unilaterally rest on frusto-conical sides of the aperture. The tapered plug is disposed into the aperture, and bonding material is applied between the surfaces of the tapered plug and the aperture, before or after insertion of the tapered plug into the aperture. The article is thereafter heated such that the bonding material joins the surfaces of the tapered plug and the aperture. The outer end of the tapered plug thereafter is polished so that such outer end is approximately level with the article's outer side in a refinement of the invention, the plug member may be pushed into the aperture such that a controlled interference fit is produced.
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: July 2, 2002
    Assignee: General Electric Company
    Inventors: Paul Leonard Dupree, Melvin Robert Jackson
  • Publication number: 20020078539
    Abstract: A core metal insert for use in a sealing assembly is disclosed. The core metal insert is manufactured by a process which includes the step of cutting a plurality of left lateral outermost inboard slits and a plurality of right lateral outermost inboard slits in a metal blank so as to create a slitted metal blank.
    Type: Application
    Filed: March 1, 2002
    Publication date: June 27, 2002
    Inventor: Terry Robert Suitts
  • Patent number: 6399179
    Abstract: A base plate comprising a hub, a flange having an outer flange region at an outer periphery of the flange and a clamping region that surrounds and is contiguous with the hub. A strain isolation region of the flange surrounds and is contiguous with the clamping region. The strain isolation region has a stress-reducing configuration that provides alternately patterned continuity areas and discontinuity areas between the modified region and adjacent areas of the outer flange region and the clamping region. The strain isolation region may be either a series of holes in the flange surrounding the clamping region, or a number of arcuate slots cut completely through the flange surrounding the clamping region.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: June 4, 2002
    Assignees: Intri-Plex Technologies, Inc., Read-Rite Corporation
    Inventors: Kevin Hanrahan, Ryan Schmidt, William P. Heist, Larry Tucker, Kim Aimonetti
  • Patent number: 6387534
    Abstract: The invention provides a novel improved packing element having the basic shape of a polygon with arches formed around the periphery by deforming the edge area in one direction and an area axially within the edge area to form arches projecting in the opposite direction and providing an axially located aperture. Such packing elements can be conveniently formed using a simple cutting and stamping operation.
    Type: Grant
    Filed: November 14, 2000
    Date of Patent: May 14, 2002
    Assignee: Saint-Gobain Norpro Corporation
    Inventor: Hassan S. Niknafs
  • Patent number: 6376096
    Abstract: The present invention is a process for making a nanochannel glass (NCG) replica, having the steps of: coating a face of an etched NCG with a replica material (with or without an intervening buffer layer), where the etched NCG face has a plurality of channels arranged in a desired pattern, to form a replica coating on the NCG conforming to the pattern; and removing the replica coating from the etched NCG. The present invention is also the replica made by this process.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: April 23, 2002
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Douglas H. Pearson, Ronald J. Tonucci
  • Patent number: 6358626
    Abstract: An exterior autobody part of reinforced plastic intended to be mounted on a motor vehicle. The expression “exterior autobody part” refers to the autobody part being entirely or partly visible when the motor vehicle is viewed from the outside. Furthermore, the invention relates to a method and an arrangement for forming such an exterior autobody part. The exterior autobody part according to the invention comprises a number of functional layers, including load-bearing layer(s) and surface layer(s), intended to provide the properties which are required for the application, and is characterized in that load-bearing layers comprise(s) fiber-reinforced thermoplastic which forms internal cavities and/or that one or several recesses has/have been created in surface layers and load-bearing layers and that surface layers and load-bearing layers together with cavities and/or recesses thereby provide a load-bearing material structure.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: March 19, 2002
    Assignee: AB Volvo
    Inventors: Arne Persson, Åke Nylinder, Krister Svensson, Axel Kaufmann
  • Publication number: 20020031678
    Abstract: A method for mechanically cutting a continuous circular shaped groove in a foil sheet for use in a metal matrix composite product. In one form the foil sheet is held adjacent a rotating machine tool by vacuum and a cutting tool is moved relative thereto to cut a spiral groove.
    Type: Application
    Filed: September 12, 2001
    Publication date: March 14, 2002
    Inventors: Robert A. Ress, Jason E. Dundas, Preston E. Light, Brian P. King
  • Patent number: 6352787
    Abstract: The invention relates to a method for producing an insulating pack (10), according to which a stack (9) of metallic lamellae is cold-welded simultaneously along a predefined contour and separated from a remaining area. The insulating pack produced according to the invention preferably has a plurality of knobbed and/or perforated aluminium foils (12, 14, 16) and at least one stretch film (18) and is characterized by a narrow welding seam (20) extending along the edge. The insulating pack can be used as an insulating part on its own or loosely inserted into an additional supporting or covering layer. Such insulating parts can be configured in an acoustically active manner and are used in the motor industry, machine industry and/or electronic or computer industry. Means for carrying out the method provided for in the invention provide for the use of a cutting blade with two cutting flanks.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: March 5, 2002
    Assignee: Rieter Automotive (International)AG
    Inventors: Evelyn Zwick, Alexander Wildhaber
  • Publication number: 20020006501
    Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When the marking is formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package structure. The marking may be formed as apertures through or recessed areas in one or more stereolithographically fabricated layers of material. Alternatively, the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. The marking may be formed directly on a surface of a packaged or bare semiconductor device component. As an alternative, the marking can be fabricated separately from a semiconductor device component, then secured thereto. Methods of stereolithographically marking semiconductor device components are also disclosed.
    Type: Application
    Filed: August 29, 2001
    Publication date: January 17, 2002
    Inventors: Ford B. Grigg, James M. Ocker, Rick A. Leininger
  • Patent number: 6337142
    Abstract: A hollow elongate element of elastic material for transmitting forces in which the walling comprises openings which reduce the bending resistance moment and are arranged such that the torsion resistance moment of the element essentially remains.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: January 8, 2002
    Assignee: Stryker Trauma GmbH
    Inventors: Hans E. Harder, Harm-Iven Jensen, Andreas W. Speitling
  • Patent number: 6335078
    Abstract: A curable masking material for protecting a passage hole in a metal-based substrate is formed of an extrudable resin composition. The resin composition is thermally stable at elevated temperatures, and does not serve as an adhesion site for any coatings which are applied over the masking material. In addition, the resin composition has non-Newtonian flow characteristics and is adapted to form a protrusion extending from the passage hole upon extrusion to fill the passage hole.
    Type: Grant
    Filed: November 27, 1998
    Date of Patent: January 1, 2002
    Assignee: General Electric Company
    Inventors: Venkat Subramaniam Venkataramani, James Anthony Brewer, Marcus Preston Borom, Wayne Charles Hasz, Lawrence Edward Szala
  • Patent number: 6316121
    Abstract: A metal foil includes at least two intersecting structures, which are spaced from an imaginary reference surface and which define an intersection region. The at least two intersecting structures partially superpose one another in the intersection region and are formed with at least one through opening in the intersection region. A honeycomb body includes at least one flat construction formed with channels, which define a flow direction for a fluid to flow through the channels. The at least one flat construction has at least two intersecting structures, which are spaced from an imaginary reference surface and which define an intersection region. The at least two intersecting structures partially superpose one another in the intersection region and have at least one through opening in the intersection region.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: November 13, 2001
    Assignee: Emitec Gesellschaft fuer Emissionstechnologie mbH
    Inventor: Wolfgang Maus
  • Patent number: 6316129
    Abstract: A thin, forged magnesium alloy casing is integrally constituted by a thin plate with projections on either or both surfaces, and the thin plate is as thin as about 1.5 mm or less. The thin forged casing can be produced by (a) carrying out a first forging step for roughly forging a magnesium alloy plate to form an intermediate forged product under the conditions of a preheating temperature of the magnesium alloy plate of 350-500° C., a die temperature of 350-450° C., a compression pressure of 3-30 tons/cm2, a compressing speed of 10‥500 mm/sec. and a compression ratio of 75% or less; and (b) carrying out a second forging step for precisely forging the intermediate forged product under the conditions of a preheating temperature of the intermediate forged product of 300-500° C., a die temperature of 300-400° C., a compression pressure of 1-20 tons/cm2, a compressing speed of 1-200 mm/sec., and a compression ratio of 30% or less.
    Type: Grant
    Filed: March 24, 1999
    Date of Patent: November 13, 2001
    Assignees: Tokyo Seitan Inc., Sony Corporation
    Inventors: Isao Seki, Shigeo Hama, Shigehiro Tanike, Fukashi Watanabe, Masahiko Kakizaki, Shinji Seki
  • Publication number: 20010038029
    Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.
    Type: Application
    Filed: May 1, 2001
    Publication date: November 8, 2001
    Inventors: Timothy P. Weihs, Michael Reiss
  • Publication number: 20010038921
    Abstract: A mat for sweeping a surface, formed of grid-like, semi-flexible material. The mat is pulled over the surface to effect the sweeping. The material has open slots (112a, 112b) therethrough. The slots have a leading edge and a trailing edge disposed transversely relative to the direction of travel of the mat. Ground debris can pass upwardly through each slot, over the respective trailing edge to collect on an upper surface of the mat. Over the upper surface, the grid-like material defines an array of first apertures (136). At least a substantial proportion of the first apertures (136) have within them second apertures (146) of smaller size than the first apertures.
    Type: Application
    Filed: December 4, 2000
    Publication date: November 8, 2001
    Inventor: Warwick Brook Tozer
  • Publication number: 20010013554
    Abstract: A method for performing an aperture plate comprises providing a mandrel that is constructed of a mandrel body having a conductive surface and a plurality of nonconductive islands disposed on the conductive surface. The mandrel is placed within a solution containing a material that is to be deposited onto the mandrel. Electrical current is applied to the mandrel to form an aperture plate on the mandrel, with the apertures having an exit angle that is in the range from about 30° to about 60°.
    Type: Application
    Filed: March 30, 2001
    Publication date: August 16, 2001
    Inventors: Scott Borland, Gary Baker
  • Publication number: 20010011676
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Application
    Filed: March 30, 2001
    Publication date: August 9, 2001
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Patent number: 6265075
    Abstract: A circuitized semiconductor structure comprising a layer of dielectric material, a catalyst seed layer above the layer of dielectric material, a layer of photoimageable dielectric material on the catalyst seed layer and having openings therein, a nickel layer in the openings and a layer of copper in the openings above the nickel layer and being coplanar with the top of the layer of dielectric material is provided, along with a method for its fabrication.
    Type: Grant
    Filed: July 20, 1999
    Date of Patent: July 24, 2001
    Assignee: International Business Machines Corporation
    Inventors: David Anton Klueppel, Voya R. Markovich, Thomas Richard Miller, Timothy L. Wells, William Earl Wilson
  • Publication number: 20010008704
    Abstract: A hollow elongate element of elastic material for transmitting forces in which the walling comprises openings which reduce the bending resistance moment and are arranged such that the torsion resistance moment of the element essentially remains.
    Type: Application
    Filed: June 22, 1998
    Publication date: July 19, 2001
    Inventors: HANS ERICH HARDER, HARM-IVEN JENSEN, ANDREAS WERNER SPEITLING
  • Publication number: 20010007708
    Abstract: A method for temporarily protecting at least one passage hole in a metal-based substrate from being obstructed by at least one coating applied over the substrate is disclosed.
    Type: Application
    Filed: November 27, 1998
    Publication date: July 12, 2001
    Inventors: VENKAT SUBRAMANIAM VENKATARAMANI, JAMES ANTHONY BREWER, MARCUS PRESTON BOROM, WAYNE CHARLES HASZ, LAWRENCE EDWARD SZALA