More Than One Such Component Patents (Class 428/622)
  • Patent number: 9187831
    Abstract: A sliding surface of a high-temperature portion is subjected to an electro-discharge surface treatment with one or both of a high-temperature hard material (4) and a material having a lubricating property at a high temperature (6). The high-temperature hard material (4) is any or a mixture of cBN, TiC, TiN, TiAlN, TiB2, WC, Cr3C2, SiC, ZrC, VC, B4C, Si3N4, ZrO2, and Al2O3. The material having the lubricating property at the high temperature (6) contains chromium and/or chromium oxide (Cr2O3) and/or hexaboron nitride (hBN). An electrode formed by compression molding of the high-temperature hard material, and the high-temperature lubricating material containing at least one of Cr and hBN and having the lubricating property at the high temperature is used as the electrode for the electro-discharge surface treatment.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: November 17, 2015
    Assignees: ISHIKAWAJIMA-HARIMA HEAVY INDUSTRIES CO., LTD., MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Hiroyuki Ochiai, Mitsutoshi Watanabe, Mikiya Arai, Shigeru Saburi, Eiji Nakayama, Akihiro Goto, Masao Akiyoshi
  • Publication number: 20150079419
    Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.
    Type: Application
    Filed: March 28, 2013
    Publication date: March 19, 2015
    Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
  • Patent number: 8974914
    Abstract: A metal-ceramic substrate for electrical circuits or modules includes at least one first outer metal layer forming one first surface side of the metal-ceramic substrate and at least one second outer metal layer forming one second surface side of the metal-ceramic substrate. The outer metal layers are bonded respectively by two-dimensional bonding with the surface sides of a plate-like substrate body.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: March 10, 2015
    Assignee: Rogers Germany GmbH
    Inventors: Andreas Meyer, Jürgen Schulz-Harder
  • Publication number: 20150044497
    Abstract: This disclosure concerns bonding a thin film of diamond to a second thick diamond substrate in a way that does not cause the exposed (un-bonded) diamond surface to become contaminated by the bonding process or when the bonded diamond is held at high temperature for many hours in vacuum.
    Type: Application
    Filed: June 16, 2014
    Publication date: February 12, 2015
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Jonathan L. Shaw, Jeremy Hanna
  • Publication number: 20150037604
    Abstract: This relates to a coated substrate for packaging applications and a method for producing the coated substrate.
    Type: Application
    Filed: April 10, 2013
    Publication date: February 5, 2015
    Inventors: Jan Paul Penning, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
  • Publication number: 20140272454
    Abstract: Provided is High Productivity Combinatorial (HPC) testing methodology of semiconductor substrates, each including multiple site isolated regions. The site isolated regions are used for testing different compositions and/or structures of barrier layers disposed over silver reflectors. The tested barrier layers may include all or at least two of nickel, chromium, titanium, and aluminum. In some embodiments, the barrier layers include oxygen. This combination allows using relative thin barrier layers (e.g., 5-30 Angstroms thick) that have high transparency yet provide sufficient protection to the silver reflector. The amount of nickel in a barrier layer may be 5-10% by weight, chromium—25-30%, titanium and aluminum—30%-35% each. The barrier layer may be co-sputtered in a reactive or inert-environment using one or more targets that include all four metals. An article may include multiple silver reflectors, each having its own barrier layer.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: INTERMOLECULAR INC.
    Inventors: Guizhen Zhang, Jeremy Cheng, Guowen Ding, Minh Huu Le, Daniel Schweigert, Yu Wang
  • Publication number: 20140272453
    Abstract: A coated article includes a substrate, a first dielectric layer, a subcritical metallic layer having discontinuous metallic regions, a primer over the subcritical layer, and a second dielectric layer over the primer layer. The primer can be a nickel-chromium alloy. The primer can be a multilayer primer having a first layer of a nickel-chromium alloy and a second layer of titania.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 18, 2014
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Adam D. Polcyn, Paul A. Medwick, Andrew V. Wagner, Paul R. Ohodnicki, Dennis J. O'Shaughnessy, James P. Thiel
  • Publication number: 20140248507
    Abstract: The invention is related to optical coatings and may be used for significant reducing reflection of visible light from an external surface of displays or other devices for optical communication and information processing. Anti-reflective coating in various embodiments consists of two or three layers which include one metal layer of a thickness ranging in various embodiments from 2 to 12 nanometers and one or two nonmetallic layers possessing refractive indices and thicknesses in certain ranges wherein the metal layer is placed either between the nonmetallic layer and a substrate or between the nonmetallic layers.
    Type: Application
    Filed: March 1, 2013
    Publication date: September 4, 2014
    Inventor: Vladimir Kleptsyn
  • Publication number: 20140231300
    Abstract: The present disclosure refers to a material impermeable to water vapour and oxygen for packaging dietary products, cosmetics and medicinal specialities. In particular, the present disclosure refers to primary packaging in the form of blister packs or sachets, which comes into direct contact with the formulations of medicinal specialities and dietary products and cosmetics, such as, for example, tablets, pills, pessaries, powders, granules, suppositories, rigid capsules and soft capsules (also known as soft gel capsules).
    Type: Application
    Filed: September 21, 2012
    Publication date: August 21, 2014
    Applicant: PROBIOTICAL NORTH AMERICA INC.
    Inventor: Giovanni Mogna
  • Patent number: 8808871
    Abstract: A sintered cermet of a rotary tool has a hard phase with a first hard phase and a second hard phase comprising a carbide, a nitride, and a carbonitride of at least one of group 4, 5, and 6 metals of the periodic table of which metals the metal titanium is a main component. The result of an X-ray diffraction measurement in a surface region of the sintered cermet provides a first peak intensity Ib on a high angle side that is attributable to a (220) plane of the first hard phase and a second peak intensity Ia on a low-angle side that is attributable to a (220) plane of the second hard phase, and an intensity ratio Ib/Ia of the first peak intensity Ib to the second peak intensity Ia is in the range of 0.5 to 1.5.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: August 19, 2014
    Assignee: Kyocera Corporation
    Inventors: Hideyoshi Kinoshita, Katsuhiro Hanaki
  • Patent number: 8734957
    Abstract: A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: May 27, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Eugene P. Marsh
  • Patent number: 8722201
    Abstract: A connection is between a monolithic metal component and a continuous-fiber reinforced laminate component wherein the metal component and the laminate component are joined at the ends thereof. A method allows for the production of the connection between the monolithic metal component and the continuous-fiber reinforced laminate component.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: May 13, 2014
    Inventors: Patrick Schiebel, Christoph Hoffmeister, Claus Thomy, Axel Herrmann, Frank Vollertsen
  • Publication number: 20140072826
    Abstract: 1,2-Diazine compounds have been found to provide anti-corrosion properties when incorporated into silver nanowire containing films. The effectiveness of such compounds may be enhanced by their introduction into a layer disposed adjacent to a silver nanowire containing layer.
    Type: Application
    Filed: August 14, 2013
    Publication date: March 13, 2014
    Inventors: James B. Philip, JR., Chaofeng Zou
  • Publication number: 20130288071
    Abstract: The invention relates to a method for manufacturing a metallized plastic product with a gold or silver hue, comprising the steps: galvanization of a surface of the plastic body for forming a galvanized chromium layer; deposition by evaporation of a metal layer directly on the galvanized chromium layer, the metal being copper, a mixture of metals comprising at least 70% by weight of copper, a copper alloy comprising at least 70% by weight of copper, or aluminum. The invention also relates to a metallized plastic product (1) with a gold or silver hue, comprising a plastic body (2), a galvanized chromium layer (3, 4, 5, 6), and a metal layer (7), the metal being copper, a mixture of metals comprising at least 70% by weight of copper, an alloy containing copper in an amount of at least 70% by weight, or aluminum.
    Type: Application
    Filed: January 9, 2013
    Publication date: October 31, 2013
    Inventor: Cécile Ghesquiere
  • Publication number: 20130252018
    Abstract: A protecting coating for a copper substrate is disclosed. The coating comprises seed layer comprising titanium ions that forms an “alloy-like” structure with the copper substrate. The coating further comprises a first layer of carbon disposed on the seed layer comprising titanium ions. A second layer comprising titanium is disposed on the first layer of carbon, and a second layer of carbon is disposed on the second layer comprising titanium.
    Type: Application
    Filed: May 28, 2013
    Publication date: September 26, 2013
    Applicant: Seagate Technology LLC
    Inventors: Yongping Gong, Kristoffer Steven Scheponik
  • Publication number: 20130244052
    Abstract: A metallic cladding is provided onto a substrate of an architectural component such as a door or window by beginning sputter welding of a primary metallic layer onto a surface of a substrate of an architectural component; while maintaining a temperature of the surface of the substrate at or below a temperature threshold to avoid damage or outgassing to the substrate, continuing the sputter welding until a pre-determined thickness of the primary metallic layer is achieved; depositing a secondary metallic layer onto the primary metallic layer, wherein the secondary metallic layer is formed up to a secondary thickness less than the pre-determined thickness of the primary metallic layer; and applying one or more protective coats of an essentially transparent material loaded with a metallic substance to the secondary metallic layer.
    Type: Application
    Filed: March 18, 2012
    Publication date: September 19, 2013
    Inventor: Michael A Mullock
  • Publication number: 20130170059
    Abstract: Certain example embodiments of this invention relate to sputtered aluminum second surface mirrors with permanent protective coatings optionally provided thereto, and/or methods of making the same. A mirror coating supported by a substrate may include, for example, first and second silicon-inclusive layers sandwiching a metallic or substantially metallic layer including aluminum, and an optional layer including Ni and/or Cr in direct contact with the metallic or substantially metallic layer comprising aluminum. A protective film is disposed directly over and contacting an outermost layer of the mirror coating, with the protective film having a peel strength of 200-500 cN/20 mm wide strip. The protective film is adapted to survive seven day exposure to an 85 degree C. temperature at 85% relative humidity, as well as seven day exposure to a 49 degree C. temperature at 100% relative humidity.
    Type: Application
    Filed: December 28, 2011
    Publication date: July 4, 2013
    Inventors: Philip J. LINGLE, Willem DEN BOER
  • Publication number: 20130136949
    Abstract: The present invention provides an Al alloy film that, in a production step of a thin-film transistor substrate, reflective film, reflective anode, touch panel sensor, or the like, can effectively prevent corrosion such as pinhole corrosion (black dots) or corrosion of the Al alloy surface when immersed in a sodium chloride solution, has superior corrosion resistance, is able to suppress hillock formation, and has superior heat resistance. The Al alloy thin film is used as a reflective film or a wiring film on a substrate, and contains 0.01-0.5 at % of Ta and/or Ti and 0.05-2.0 at % of a rare earth element.
    Type: Application
    Filed: September 26, 2011
    Publication date: May 30, 2013
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Hiroyuki Okuno, Toshihiro Kugimiya
  • Publication number: 20130130053
    Abstract: A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit.
    Type: Application
    Filed: December 21, 2012
    Publication date: May 23, 2013
    Applicant: MICRON TECHNOLOGY, INC.
    Inventor: Micron Technology, Inc.
  • Patent number: 8388815
    Abstract: A coated article includes a substrate, a catalyst layer, a bonding layer and a hydrophobic layer. The catalyst layer made of tin is formed on the substrate. The bonding layer is formed on the catalyst layer, including titanium, tin, stannic oxide and titanium dioxide. The hydrophobic layer made of silicon-nitrogen is formed on the bonding layer.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: March 5, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Jia Huang
  • Publication number: 20130022835
    Abstract: A coated article is described. The coated article includes a substrate, a copper layer formed on the substrate, a compound copper-zinc layer formed on the copper layer, and a zinc oxide layer formed on the compound copper-zinc layer. A method for making the coated article is also described.
    Type: Application
    Filed: August 16, 2011
    Publication date: January 24, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, CHENG-SHI CHEN, CONG LI
  • Publication number: 20130022836
    Abstract: The present disclosure relates to brazed coated diamond-containing materials and methods of producing brazed coated diamond-containing materials. The method for brazing the coated diamond-containing material may include bringing a braze metal into contact with the refractory metal layer and a substrate; heating at least the braze metal above the melting temperature of the braze metal; and bringing the braze metal into contact with the substrate to form a braze metal layer to join the diamond-containing material, braze metal layer, and substrate together. An advantage of the method may include that the brazing step may be performed in air, under ambient pressure, and without the need for a protective layer.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 24, 2013
    Applicant: DIAMOND INNOVATIONS, INC.
    Inventors: Thomas C. Easley, Yuanbo Lin, Dwight Dyer
  • Publication number: 20120318568
    Abstract: Provided is an electronic circuit as a laminated body configured from a layer (A) which is made of a copper or copper alloy foil formed on one surface or both surfaces of a resin substrate, a copper or copper alloy plated layer (B) formed on a part or whole surface of the (A) layer, a plated layer (C) formed on a part or whole surface of the (B) layer and having a slower etching rate than that of copper relative to a copper etching solution, and a copper or copper alloy plated layer (D) formed on the layer (C) and which has a thickness of 0.05 ?m or more and less than 1 ?m, and which is made of a copper circuit formed by etching and removing a part of the laminated portion of the (A) layer, the (B) layer, the (C) layer and the (D) layer up to the resin substrate surface. It is thereby possible to form a circuit having a uniform circuit width, improve the etching properties in pattern etching, and prevent the occurrence of short-circuits and defects in the circuit width.
    Type: Application
    Filed: January 7, 2011
    Publication date: December 20, 2012
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Keisuke Yamanishi, Ryo Fukuchi, Kengo Kaminaga
  • Patent number: 8287984
    Abstract: The invention concerns an under-roof screen (100) comprising: a first layer (102) produced from a first metallic or metallized material forming a thermal reflection barrier; a second layer (108) produced from a second woven material bonded to the first layer (102); a third layer (106) produced from a third insulating material and bonded to the second layer (108); and a fourth layer (104) produced from a fourth metallic or metallized material forming a thermal reflection barrier and bonded to the third layer (106); the first layer (102) and the second layer (108) being provided with micro-perforations (110) providing permeability to water vapor and impermeability to water and the fourth layer (104) being provided with perforations (112) providing permeability to water vapor.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: October 16, 2012
    Assignee: Loda S.A.R.L.
    Inventor: Patrick Grall
  • Patent number: 8277661
    Abstract: A hydrothermally stable, microporous organic-inorganic hybrid membrane based on silica, having an mean pore diameter of between 0.2 and 1.5 nm, is characterised in that between 5 and 40 mole % of the Si—O—Si bonds have been replaced by moieties having the one of the formulas: Si—{[CmH(n-1)X]—Si—}q, Si—[CmH(n-2)X2]—Si or Si—CmHn—Si{(CmHn)—Si—}y in which m=1-8, n=2m, 2m?2, 2m?4, 2m?6 or 2m?8; provided that n?2, X=H or (CH2)pSi, p=0 or 1, and q=1, 2, 3 or 4. The membrane can be produced by acid-catalysed hydrolysis of suitable bis-silane precursors such as bis(trialkoxysily)alkanes, preferably in the presence of monoorganyl-silane precursors such as trialkoxy-alkylsilanes.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: October 2, 2012
    Assignee: Stichting Energieonderzoek Centrum Nederland
    Inventors: Ashima Sah, Hessel Lennart Castricum, Jaap Ferdinand Vente, David Hermanus Adrianus Blank, Johan Evert Ten Elshof
  • Publication number: 20120244381
    Abstract: A coated article is described. The coated article includes a substrate, a plurality of titanium dioxide layers and a plurality of copper layers formed on the substrate. Each titanium dioxide layer interleaves with one copper layer. One of the titanium dioxide layers forms an outermost layer of the coated article. A method for making the coated article is also described.
    Type: Application
    Filed: August 16, 2011
    Publication date: September 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, ZHI-JIE HU
  • Publication number: 20120244379
    Abstract: A coated article is described. The coated article includes a substrate, a bonding layer formed on the substrate, a plurality of nickel-chromium-nitrogen layers and a plurality of zinc layers formed on the bonding layer. The bonding layer is a nickel-chromium layer. Each nickel-chromium-nitrogen layer interleaves with one zinc layer. One of the nickel-chromium-nitrogen layers is directly formed on the bonding layer. A method for making the coated article is also described.
    Type: Application
    Filed: August 4, 2011
    Publication date: September 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, CONG LI
  • Publication number: 20120244380
    Abstract: A coated article is described. The coated article includes a substrate, a bonding layer formed on the substrate, a plurality of nickel-chromium-nitrogen layers and a plurality of copper-zinc alloy layers formed on the bonding layer. The bonding layer is a nickel-chromium layer. Each nickel-chromium-nitrogen layer interleaves with one copper-zinc alloy layer. One of the nickel-chromium-nitrogen layers is directly formed on the bonding layer. A method for making the coated article is also described.
    Type: Application
    Filed: August 4, 2011
    Publication date: September 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, CONG LI
  • Publication number: 20120244378
    Abstract: A coated article is described. The coated article includes a substrate, a bonding layer formed on the substrate, a plurality of nickel-chromium-nitrogen layers and a plurality of copper-silver-cerium alloy layers formed on the bonding layer. The bonding layer is a nickel-chromium layer. Each nickel-chromium-nitrogen layer interleaves with one copper-silver-cerium alloy layer. One of the nickel-chromium-nitrogen layers is directly formed on the bonding layer. A method for making the coated article is also described.
    Type: Application
    Filed: August 4, 2011
    Publication date: September 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, CONG LI
  • Publication number: 20120189869
    Abstract: A coated article is described. The coated article includes a substrate, a plurality of zinc layers and a plurality of zinc oxide layers formed on the substrate. Each zinc layer interleaves with one zinc oxide layer. One of the zinc layers is formed on the substrate. One of the zinc oxide layers forms an outermost layer of the coated article. A method for making the coated article is also described.
    Type: Application
    Filed: August 16, 2011
    Publication date: July 26, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO. LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, CONG LI
  • Publication number: 20120148863
    Abstract: A low-e insulating glass unit has a suspended, coated IR reflecting polymer sheet under tension, e.g. from heat shrinkage. The polymer sheet is coated with a multilayer stack of dielectric and metallic layers, including at least one silver layer deposited upon a zinc oxide seed layer that is at most 15 nm thickness. The use of zinc oxide ensures good seeding for high quality silver layer growth, thereby providing low emissivity. The thinness of the zinc oxide ensures that it resists cracking when the polymer sheet is tensioned.
    Type: Application
    Filed: December 13, 2010
    Publication date: June 14, 2012
    Applicant: SOUTHWALL TECHNOLOGIES, INC.
    Inventors: Ronny Kleinhempel, Julius G. Kozak, Roland C. Thielsch, Richard T. Wipfler, Christian H. Stoessel, Lee C. Boman
  • Patent number: 8101286
    Abstract: A multi-layer coating for a smooth contact surface of a clutch plate and a method for manufacturing the same have been developed. This coating can help reduce the prevalence of clutch shudder, noise, and plate wear that is often encountered in a friction-disc clutch mechanism found in a motor vehicle's powertrain. The multi-layer coating may comprise a relatively soft base layer and one or more relatively hard particle layers overlying the base layer. This combination of layers can help provide stable friction characteristics and thermal properties between clutch plate surfaces. One or more optional bonding layers may also be provided between any two adjacent layers to improve the adherent bonding therebetween. At least some of the layers of the multi-layer coating may be applied by a HVO/AF thermal spray procedure.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: January 24, 2012
    Assignee: GM Global Technology Operations LLC
    Inventors: Simon Chin-Yu Tung, Gregory Mordukhovich
  • Publication number: 20120003499
    Abstract: A reliable flexible board prevents disconnection from occurring in a conductor layer in a stacking process or during use of a product that repeatedly causes deformation. The flexible board includes resin layers and conductor layers that are alternately stacked on top of one another, wherein each of the conductor layers includes a first conductor layer made of a first metal and a second conductor layer made of a second metal disposed between one of the resin layers and the first conductor layer, the second metal having a higher ductility than the first metal.
    Type: Application
    Filed: September 8, 2011
    Publication date: January 5, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Shunsuke CHISAKA
  • Patent number: 8084142
    Abstract: The invention comprises methods of forming a conductive contact to a source/drain region of a field effect transistor, and methods of forming local interconnects. In one implementation, a method of forming a conductive contact to a source/drain region of a field effect transistor includes providing gate dielectric material intermediate a transistor gate and a channel region of a field effect transistor. At least some of the gate dielectric material extends to be received over at least one source/drain region of the field effect transistor. The gate dielectric material received over the one source/drain region is exposed to conditions effective to change it from being electrically insulative to being electrically conductive and in conductive contact with the one source/drain region. Other aspects and implementations are contemplated.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: December 27, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Cem Basceri, Gurtej S. Sandhu, H. Montgomery Manning
  • Publication number: 20110236715
    Abstract: An architectural transparency includes a substrate, a first dielectric layer formed over at least a portion of the substrate, a continuous metallic layer formed over at least a portion of the first dielectric layer, a second dielectric layer formed over at least a portion of the first metallic layer, and a subcritical metallic layer formed over at least a portion of the second dielectric layer such that the subcritical metallic layer forms discontinuous metallic regions.
    Type: Application
    Filed: March 28, 2011
    Publication date: September 29, 2011
    Applicant: PPG INDUSTRIES OHIO, INC.
    Inventors: Adam D. Polcyn, Andrew V. Wagner, Harry Buhay, Abhinav Bhandari, James J. Finley, Paul R. Ohodnicki, JR., Dennis J. O'Shaughnessy, Jeffrey A. Benigni, Paul A. Medwick, James P. Thiel
  • Patent number: 8012562
    Abstract: The present technology generally relates to a wear-resistant coating, especially for gas turbine components, comprising a horizontally segmented or multilayered structure, i.e. at least one relatively hard, ceramic layer and at least one relatively soft, metallic layer. The ceramic layer and the metallic layer are alternately arranged on top of each other in such a way that an external layer forming an external surface of the wear-resistant coating is embodied as a ceramic layer. According to the invention, at least the external, ceramic layer is segmented in a column-type manner in a vertical direction.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: September 6, 2011
    Assignee: MTU Aero Engines GmbH
    Inventors: Wolfgang Eichmann, Falko Heutling, Thomas Uihlein
  • Patent number: 7989086
    Abstract: A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze comprises a gold alloy and the dissolution barrier comprises a layer of alumina on the order of 2-3 microns thick. A titanium wetting layer is provided between the alumina layer and the alloy. A metallization layer provided between the dissolution barrier and the ceramic component in one example comprises a layer of gold between two thin layers of titanium. In one particular example, a platinum mesh is included with the gold of the braze alloy to control braze flow during the brazing operation.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: August 2, 2011
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Sunil G. Warrier, Richard S. Bailey, Willard H. Sutton
  • Publication number: 20110171137
    Abstract: A process of preparing a plurality of nanostructures, each being composed of at least one target material is disclosed. The process comprises sequentially electrodepositing a first material and the at least one target material into pores of a porous membrane having a nanometric pore diameter, to thereby obtain within the pores nanometric rods, each of the nanometric rods having a plurality of segments where any two adjacent segments are made of different materials. The process further comprises and etching the membrane and the first material, thereby obtaining the nanostructures.
    Type: Application
    Filed: September 10, 2009
    Publication date: July 14, 2011
    Applicant: RAMOT AT TEL-AVIV UNIVERSITY LTD.
    Inventors: Fernando Patolsky, Roey Elnathan, Raisa Kantaev
  • Patent number: 7867627
    Abstract: Functionalized substrates and method of passivating the surface of a substrate to improve the surface by imparting desirable surface properties to improve the performance of a surface, the method steps including exposing the substrate to a chemical vapor deposition process to coat the substrate with silicon, and functionalizing the coated surface by exposing the substrate surface to a binding reagent having at least one unsaturated hydrocarbon group.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: January 11, 2011
    Assignee: Silcotek Corporation
    Inventors: David A. Smith, Gary A. Barone, Martin E. Higgins
  • Publication number: 20100209729
    Abstract: Certain example embodiments relate to sputter-deposited transparent conductive coatings (TCCs) that are capable of surviving the harsh environments of ovens so that they can be included, for example, in oven door applications. In certain example embodiments, zirconium oxide (e.g., ZrO2 or other suitable stoichiometry) may be used as a protective overcoat to protect an underlying Ag layer from corrosion in the atmosphere. In three lite oven door example embodiments, surface 1 has a TCC pyrolytically disposed thereon, surface 2 has a TCC sputter-deposited thereon and, optionally, surface 3 has a TCC sputter-deposited thereon. In two lite oven door example embodiments, surface 1 has a TCC pyrolytically disposed or sputter-deposited thereon, and surface 2 has a TCC sputter-deposited thereon.
    Type: Application
    Filed: February 19, 2009
    Publication date: August 19, 2010
    Applicant: Guardian Industries Corp.
    Inventors: Scott V. Thomsen, Jingyu Lao
  • Publication number: 20100203351
    Abstract: Composite materials exhibiting very high strength properties and other characteristics are disclosed. The materials comprise one or more nanomaterials dispersed within one or more matrix materials. The nanomaterials can be in a variety of forms, such as for example, carbon nanotubes and/or nanofibers. The matrix material can be glass, fused silicas, or metal. Also disclosed are various processes and operations to readily disperse and uniformly align the nanotubes and/or nanofibers in the flowing matrix material, during production of the composite materials.
    Type: Application
    Filed: June 7, 2007
    Publication date: August 12, 2010
    Inventor: Taysir H. Nayfeh
  • Patent number: 7655280
    Abstract: A extreme low resistivity light attenuation anti-reflection coating structure includes a substrate, a coating module, and a composed protection coating layer. The coating module is formed on a front surface of the substrate. The coating module is composed of a plurality of Ti-based oxide coating layers and a plurality of metal coating layers that are alternately stacked with each other. The composed protection coating layer is formed on the coating module.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: February 2, 2010
    Assignee: Innovation & Infinity Global Corp.
    Inventors: Cheng-Chieh Chang, Shiu-Feng Liu, Pi-Jui Kuo
  • Publication number: 20090317708
    Abstract: Plastics composite foil for the sheathing of lithium-ion-polymer batteries and lithium-polymer batteries, comprising, arranged in mutual superposition, the following layers: a) a base foil composed of plastic b) a metal foil and c) a functional plastics layer, where at least one metal protective layer applied via a physical deposition process, such as vapour deposition processes or sputtering, an example being a chromium layer, has been arranged with thickness of from 0.1 to 1000 nm (nanometres) on the layer b), the metal foil, at least in the direction of the layer c), and/or on the layer c), the functional plastics layer, in the direction of the layer b), the metal foil, and/or in the functional plastics layer.
    Type: Application
    Filed: July 11, 2007
    Publication date: December 24, 2009
    Inventors: Oliver Brandl, Erwin Pasbrig, Hans-Rudolf Nägeli, Wolfgang Lohwasser, Thomas Hentschel
  • Patent number: 7560172
    Abstract: A method for dynamically varying a threshold voltage of a complimentary metal oxide semiconductor (CMOS) includes providing a substrate pickup formed a semiconductor material type which is complimentary to the semiconductor material type of a well thereof, so as to define a diode. The diode is at least partially turned on, so as to increase the potential of a substrate of the complimentary metal oxide semiconductor and thus reduce the turn-on threshold voltage thereof. The turn-off threshold voltage is approximately unchanged.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: July 14, 2009
    Assignee: Macronix International Co., Ltd.
    Inventors: Yaowen Chang, Taocheng Lu
  • Patent number: 7534488
    Abstract: Disclosed herein is a graded core/shell semiconductor nanorod having at least a first segment of a core of a Group II-VI, Group III-V or a Group IV semiconductor, a graded shell overlying the core, wherein the graded shell comprises at least two monolayers, wherein the at least two monolayers each independently comprise a Group II-VI, Group III-V or a Group IV semiconductor.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: May 19, 2009
    Assignee: The Regents of the University of California
    Inventors: A. Paul Alivisatos, Erik C. Scher, Liberato Manna
  • Publication number: 20090092850
    Abstract: An extreme low resistivity light attenuation anti-reflection coating with a transparent surface conductive layer includes a substrate, a coating module, and a composed protection coating layer. The coating module is formed on a front surface of the substrate. The coating module is composed of a plurality of mixture coating layers and a plurality of metal coating layers that are alternately stacked with each other. Each mixture coating layer is composed of silicon carbide compound and Ti-based oxide. The composed protection coating layer is formed on the coating module.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 9, 2009
    Inventors: Cheng-Chieh Chang, Shiu-Feng Liu, Pi-Jui Kuo
  • Publication number: 20080230585
    Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
    Type: Application
    Filed: April 17, 2008
    Publication date: September 25, 2008
    Applicant: NGK Insulators, Ltd.
    Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida
  • Patent number: 7368376
    Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: May 6, 2008
    Inventor: Mou-Shiung Lin
  • Patent number: 7351348
    Abstract: A novel arrangement and method for depositing evaporation control agents so as to coat immersion lithographic solutions which are employed on the surface of semiconductor wafers in connection with the etching of the surfaces of the wafer through the intermediary of an immersion lithographic process.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: April 1, 2008
    Assignee: International Business Machines Corporation
    Inventors: Daniel A. Corliss, Dario L. Goldfarb, Steven J. Holmes, Kurt R. Kimmel, Michael J. Lercel
  • Patent number: 7147931
    Abstract: A coated steel strip product with a dense and hard abrasion resistant coating on one side or both sides of said strip substrate is provided. The thickness of said coating is in total maximally 25 ?m, the hardness of said coating is at least 600 HV and the tensile strength of the steel strip substrate is at least 1200 MPa. The coating is preferably applied by electron beam evaporation and the coating may be, e.g., of Al2O3. The coated metal strip is suitable for shaving equipment, medical instruments, utility and industrial knives as well as saw applications.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: December 12, 2006
    Assignee: Sandvik Intellectual Property AB
    Inventors: Anna Hultin Stigenberg, Mikael Schuisky