Abstract: In a magnetic recording medium particularly for perpendicular magnetization comprising a non-magnetic substrate and a magnetic thin film formed on the surface thereof and including at least two layers, a lower layer with low coercive force and high permeability, for example, of permalloy is sputtered on the substrate and an upper layer for perpendicular recording, for example, of cobalt-chromium alloy is sputtered on the lower layer, and the average grain diameter of the lower layer is less than one half of that of the upper layer.

Abstract: A perpendicular magnetic recording medium composed of a base material, a 1st magnetic thin layer formed on the base material, and a perpendicularly magnetizable 2nd magnetic thin layer formed on the 1st magnetic thin layer, wherein the 1st magnetic thin layer is composed of a Co-base ternary amorphous alloy containing small amounts of Hf and Ta.

Abstract: The present invention relates to an improvement of a packaging material for use in integrated circuits (IC) such as IC, LSI and VLSI, and in particular to an improvement of a lead frame made of iron-nickel alloys used as a material in a low-melting-point glass-ceramic package. The invention resides in provision of a lead frame faces made of an iron-nickel alloy substrate containing nickel therein at a ratio of 42 to 49% by weight and the improvement wherein an aluminium layer of 0.2 to 10 microns thick is coated on both faces and sides of the substrate.

Abstract: A ceramic part is joined to a metal part by means of a molybdenum copper composite interlayer disposed between, and brazed to, the ceramic part and the metal part.

Abstract: An EMI/RFI shielding panel prepared by glow discharge treatment of a substrate material to provide a chemically reactive surface, and then successively vapor plating the surface with an adhesive layer of chromium or stainless steel, a shielding layer of copper or aluminum onto the adhesive layer, and then a protective layer of chromium or aluminum onto the shielding layer.

Abstract: There is disclosed a new and improved material and device for improved selective absorption of light energy for use in photothermal applications and a method and apparatus for manufacturing same.The device includes a layer of thermal infrared radiation reflecting material containing a transition metal or stainless steel. A solar radiation absorbing layer is deposited over the infrared reflecting layer. This layer comprises either amorphous boron or an amorphous alloy of boron and silicon, boron and germanium or boron and molybdenum.Finally, a solar radiation antireflecting material layer is deposited over the solar radiation absorbing layer. This layer comprises an amorphous alloy of nitrogen and either silicon or boron.

Abstract: A method is disclosed for improving the adhesion of sputtered metal films such as silver and copper by means of first depositing a primer layer of a metal such as stainless steel.

Abstract: A ceramic-aluminum alloy composite in which residual stress between the ceramic and aluminum components is substantially eliminated and strong cohesion is provided between the components of the composite over a wide temperature range. The composite of the invention is an integral combination of a ceramic element, a metallized layer, a cladding layer and an aluminum alloy layer. The metallized layer and the cladding layer are formed in that order on the surface of the ceramic element. The aluminum alloy layer is formed adjacent the cladding layer by pouring and solidification of a molten aluminum alloy. The metallized layer is a thin metal layer formed by any of vapor deposition of a metal, a high-melting metal method, and an activated metal method. The cladding layer is a three-layer laminated structure having top and bottom layers of Cu, Ag or Al and an intermediate layer of a metal dissimilar to the top and bottom layers. The ceramic element is preferably one of Si.sub.3 N.sub.4, SiC, Al.sub.2 O.sub.3, ZiO.

Abstract: The invention relates to a current inlet conductor assembly particularly for vacuum devices, especially for light sources such as incandescent lamps or discharge tubes, comprising an inlet conductor made of molybdenum for passing electric current and being surrounded by a vitreous material forming a hermetic seal therewith and an intermediate metal coating covering the surface of the inlet conductor at least on the places to be welded. The essence of the invention is that the intermediate metal coating is made of rhenium, advantageously with a thickness from 3 to 1200 nm. As proposed, the intermediate rhenium layer should be produced by electrolytic deposition, especially from an aqueous solution.

Abstract: A glass wafer having high aspect ratio holes passing therethrough is provided with metal conductors in the holes as feedthroughs. First, the wafer is processed to line the holes with a thin electron-conducting layer of metal. Next, a layer of the same or different metal is applied over the first metal layer providing the requisite feedthrough electrical conductivity for each hole. Preferably, the glass contains lead oxide, the first metal layer is lead and the next layer is copper.

Abstract: This specification is directed to a new article of manufacture. In particular, the article is a glass sheet having first and second sides spaced apart in generally parallel planes with a multilayer coating on one of the sides of the glass sheet. The side of the glass sheet having the multilayer coating thereon is designated as the film side of the glass sheet while the other side is designated as the glass side of the glass sheet. The multilayer coating film is a film selected from the group of films consisting of a copper, stainless steel, titanium dioxide multilayer film; a copper, titanium, titanium dioxide multilayer film; and a copper, titanium, titanium nitride multilayer film. The multilayer coating film is characterized, when applied to 6 mm thick clear glass, as having: (1) a film side Y-x-y chromaticity value of reflective color falling within area A of the graph of FIG. 1 of this specification; (2) a glass side Y-x-y chromaticity value of reflective color falling within area B of the graph of FIG.

Abstract: A method is disclosed for improving the adhesion of sputtered metal films such as silver and copper by means of first depositing a primer layer of a metal such as stainless steel.

Abstract: A method for depositing an indium oxide film by magnetron sputtering is disclosed wherein the resistance of the film is lowered by maintaining the substrate at an elevated temperature during the magnetron sputtering process.

Abstract: A method is disclosed for producing by cathode sputtering a silver/copper coated article which duplicates the low reflectance colored appearance of a silver/copper coated article produced by wet chemical deposition. The method involves depositing the silver layer in a discontinuous agglomerated state.

Abstract: An infrared radiation reflecting substrate, having deposited thereon a first layer formed from a metal or an alloy, and a second layer deposited on the first layer and consisting of a solar radiation absorbing amorphous material, such as amorphous carbon. The substrate can be formed from an infrared radiation reflecting layer deposited on a primary substrate.

Abstract: A process for bonding a copper or copper-chromium alloy body and a ceramic body of components of an electrical or electronic device to each other includes a step of directly sandwiching a layer of chromium oxide between the ceramic and copper or copper-chromium bodies, a step of heating a temporary assembly of the ceramic and copper or copper-chromium alloy bodies and the layer of chromium oxide, under an atmosphere which can oxidize chromium without oxidizing copper, at a temperature of at least 900.degree. C. but below the melting point of copper or the alloy, and then a step of slowly cooling the resulting bonded assembly. In particular, in a process for bonding the alloy body to the ceramic body, the chromium oxide sandwiching step is performed concurrently with the temporary assembly heating step. The bonding process can produce a hermetic envelope, particularly a vacuum envelope of a vacuum interrupter.

Abstract: A solid-state hydrogen storage system. A layer of an amorphous binary metal lloy of a lanthanide and iron, nickel or cobalt is disposed on a suitable substrate and overcoated with palladium metal.

Abstract: A method is disclosed for producing by cathode sputtering a silver/copper coated article which duplicates the low reflectance colored appearance of a silver/copper coated article produced by wet chemical deposition. The method involves depositing the silver layer in a discontinuous agglomerated state.

Abstract: A method of bonding a plurality of thermally stable high strength graphite fiber reinforced glass matrix composite pieces is described. The process comprises applying to the surfaces to be bonded at least one layer of a metal which is highly adherent to the composite and the solder and is oxidatively stable. A tie layer may be used between the composite bond surface and the metal layer to better bond the metal layer to the composite. Following application of the metal layer, the composite pieces are stacked with the metal layers facing each other and a solder layer in between. The temperature of the assembly is raised to melt the solder and form the bond. The melting temperature of the solder and the metal layers are chosen so as to be higher than the use temperature of the bonded composite. A bonded composite article thus formed is also described.

Abstract: A multi-layer solar energy collector of improved stability comprising: (1) a substrate of quartz, silicate glass, stainless steel or aluminum-containing ferritic alloy; (2) a solar absorptive layer comprising silver, copper oxide, rhodium/rhodium oxide and 0-15% by weight of platinum; (3) an interlayer comprising silver or silver/platinum; and (4) an optional external anti-reflective coating, plus a method for preparing a thermally stable multi-layered solar collector, in which the absorptive layer is undercoated with a thin film of silver or silver/platinum to obtain an improved conductor-dielectric tandem.

Abstract: A thin film of magnetic recording material is sputter deposited over a base layer of gold and tantalum on a polished substrate. A protective layer of gold and tantalum is deposited overlaying the magnetic recording film. A solid lubricant layer such as carbon, preferably in the form of graphite, gold, silver, tin, molybdenum disulfide, and tungsten disulfide is sputter deposited or ion plated over the protective layer to reduce wear. The recording contacting portion of the recording head is similarly coated with a solid lubricant material. Other suitable protective materials include tantalum, niobium, tungsten and nitrides and carbides of such metals. In a preferred method for making such recording members, the layers are successively sputter deposited in an evacuated sputter chamber, whereby the recording layers and protective coatings are formed in a continuous process requiring only one pump down.

Abstract: A high-strength ceramic laminated tube comprising an inner tube of ceramic material and at least one outer tube of a metal or ceramic material shrunken onto the inner tube is provided, e.g., a ceramic tube capable of withstanding the mechanical stresses which occur in, e.g., a gun barrel, or in a bearing subjected to great stress.

Abstract: A method of bonding a graphite fiber reinforced glass matrix composite to a metal structure comprising depositing a layer of eutectic alloy metal component to the bond surfaces of the metal and composite followed by placing the thus treated bond surfaces of the metal and composite together with a layer of eutectic alloy containing such metal therebetween. The metal-bond-composite is then heated to melt the alloy and bond the composite to the metal. Articles formed by such a process are also described. The method has particular utility in bonding cooling channel containing metal bases to graphite-glass composite laser mirrors.

Abstract: The invention is directed to an article comprising a thin film of silver and/or copper contacted with a compound selected from the group consisting of a thiadiazole substituted by a mercapto group and/or an amino group and a triazole substituted by a mercapto and optionally an amino group. The invention is also directed to a method of protecting a silver and/or copper metallic film by contacting the film with a compound selected from the above group.

Abstract: A method of bonding a plurality of thermally stable high strength graphite fiber reinforced glass matrix composite pieces is described. The process comprises applying to the surfaces to be bonded at least one layer of a metal which is highly adherent to the composite and the solder and is oxidatively stable. A tie layer may be used between the composite bond surface and the metal layer to better bond the metal layer to the composite. Following application of the metal layer, the composite pieces are stacked with the metal layers facing each other and a solder layer in between. The temperature of the assembly is raised to melt the solder and form the bond. The melting temperature of the solder and the metal layers are chosen so as to be higher than the use temperature of the bonded composite. A bonded composite article thus formed is also described.

Abstract: To reduce the proportion of rejects resulting by reasons of short circuits in the manufacture and use of miniaturized multilayer circuits and to improve the electric efficiency, there is inserted between each conductive layer of low resistance and each insulating layer of high thermal stability, a very thin layer of a conductive material, preferably non-magnetic, of high resistivity and of crystallographic reference at least compatible with respect to the first conductive material and of low or negligible thermal expansion in the range of temperatures to which the circuits are submitted both during manufacture and use.

Abstract: A heat-reflecting panel having a neutral-color outer appearance has a transparent film support, such as a glass pane, an interference film having a refractive index >2 disposed on the support, a heat reflecting gold film of a thickness of 70-105 A disposed on the side of the interference film remote from the support, and neutralization film formed from chromium, iron, nickel, titanium or alloys thereof, or an alloy of chromium, aluminium and iron, the neutralization film disposed on the side of the gold film remote from the interference film.

Abstract: There is disclosed herein a glass-to-metal seal construction especially adapted for use in the fabrication of devices of the compact arc discharge lamp or gas discharge laser type.

Abstract: An improved selective absorber on a glass substrate having high solar absorption and low infrared emission. The Selective Absorber on a glass substrate includes an electrically conducting layer of silver metal having a thickness on the order of 0.1 microns, and an absorbing layer of either black nickel or, alternatively, a layer of oxidized iron over a layer of nickel or bright nickel. The method of this invention defines the process of producing the Selective Absorber on a glass substrate by thoroughly cleaning the glass, chemically depositing a thin layer of silver metal over the clean glass surface, then electroplating an absorbing layer over the silver layer. The absorbing layer may be electroplated black nickel or, alternatively, an electroplated layer of nickel or bright nickel, such as cobalt-nickel, and an electroplated cover layer of iron. The glass substate and composite layers are heat treated to thermally cured to improve its optical and properties.

Abstract: A solid state laser rod and a mount through which heat is dissipated from the rod are joined together at a bond comprised of a reflective layer on the surface of the rod, a barrier layer over the reflective layer, and a solder layer between the barrier layer and the mount. The reflective layer may be applied by sputter or other deposition procedures and is highly reflective in the region of the spectrum at which the laser operates, thus insuring optimum efficiency for the rod. The barrier layer may be applied to the reflective layer by the same deposition procedure, and it is impervious to the solder so that the solder does not penetrate it and scavenge the reflective layer. The solder should have a low melting point so as to avoid setting up excessive mechanical stresses in the rod when the solder solidifies. Both the mount and the barrier layer may be covered with a wetting layer prior to soldering to achieve better adhesion of the solder.

Abstract: To reduce the proportion of rejects resulting by reasons of short circuits in the manufacture and use of miniaturized multilayer circuits and to improve the electric efficiency, there is inserted between each conductive layer of low resistance and each insulating layer of high thermal stability, a very thin layer of a conductive material, preferably non-magnetic, of high resistivity and of crystallographic reference at least compatible with respect to the first conducting material and of low or negligible thermal expansion in the range of temperatures to which the circuits are submitted both during manufacture and use.

Abstract: High stability thin film resistors are made from an alloy comprising selected portions of nickel, chromium, and gold selected in a ratio to provide the desired temperature coefficient of resistance (TCR). The resistors are made by co-depositing gold with the nickel chromium alloy by a flash evaporation process. The evaporation process is carried out by feeding a nickel chromium wire, having a gold wire extending therealong to provide the desired composition, onto a heated tungsten strip within a vacuum system with substrates disposed in a position to obtain uniform deposition of the evaporated material thereon.

Abstract: A method of fabricating a hybrid circuit including a siliceous substrate and thick metal conductors. A thin film barrier layer is provided intermediate the substrate and a vacuum-deposited metal layer, which metal layer is subsequently electroplated to provide the desired metal thickness. The barrier layer, which may suitably be a refractory metal oxide such as the oxides of zirconium, tantalum, titanium, or tungsten, prevents loss of adhesion between the vacuum deposited metal and substrate that occurs during electroplating.

Abstract: A composite metallic article for effecting a seal with glass, said article comprising a nickel-iron alloy core portion, a low carbon steel alloy sheath portion bonded to the core, and a uniformly thick shell portion of a glass-wetting material bonded about the sheath. A method for making the article is also disclosed.

Abstract: An improved laminated beam lead for microelectronic devices, e.g., thin film resistors, integrated circuits or the like includes a first metal adhesion layer, e.g. tantalum nitride having disposed thereover a barrier metal such as palladium or platinum, and a bulk beam material, e.g., gold.In accordance with one aspect of the present invention, a transverse discontinuity is formed in the barrier metalization layer such that normal forces applied to the end portion of the composite beam lead remote from the device chip will merely cause the beam lead to deform at the discontinuity rather than delaminating from the chip.

Abstract: The invention relates to a method for forming surface coatings on a substrate by anodic oxidation, wherein the substrate contains, at least in those of its parts which are immediately sub-adjacent to its surface, at least one element selected from niobium, chromium, molybdenum, tungsten, titanium and vanadium, or a conducting compound containing such a first element, and at least one second element, different from the first, selected notably from silicon, aluminum, gallium, tantalum, uranium and molybdenum, either in the metallic state, if it constitutes itself a semi-conductor element, or even an insulator, or in the combined or alloyed state with at least one other element to form a semi-conductor compound, or even an insulator, said second element being flush at least in part at the surface of the substrate.

Abstract: Uniform gold films having an intense pure gold color and superior abrasion and adhesion properties are prepared by first depositing a gold film on a nonmetallic substrate by a known method, preferably electroless deposition, then depositing a silver film over the gold by electroless deposition.

Abstract: A composite metallic article for effecting a seal with glass, said article comprising a nickel-iron alloy core portion, a low carbon steel alloy sheath portion bonded to the core, and a uniformly thick shell portion of a glass-wetting material bonded about the sheath. A method for making the article is also disclosed.

Abstract: Metal/metal oxide coated articles having selective reflectance and transmittance of radiation over an extended spectral range are provided by a combination of at least three coating layers: one being substantially copper, one being substantially copper oxide and one being substantially nickel disposed between the copper coating layer and the copper oxide coating. Chemical or electroless plating techniques are disclosed for the production of such articles.

Abstract: Iron-silicon is sputtered onto a substrate to be used for a magnetic recording head from a target containing 4% to 7% of silicon with a substrate bias between -2.5 and -60 volts, anode-cathode spacing of about 1/2 to about 2 inches, a deposition rate of greater than 150A/min, a substrate temperature above 250.degree. C, an argon pressure above 10 microns, and a single film thickness greater than 0.4 micron, a laminated film thickness greater than 0.05 micron, and R.F. input power above 8 watts/in.sup.2.