Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: A connector terminal which can achieve high mechanical connection strength and stabilized low electrical connection resistance when it is crimped to an aluminum electric wire, and in addition, can suppress electrical contact resistance low when it is fitted to a mating connector terminal is provided. In a connector terminal (1A) having an electrical contact section (10) which is brought into contact and conducted with a mating connector terminal by fitting to the mating connector terminal, and a conductor crimping section (12) which is crimped to the conductor of an electric wire, a metal material which constitutes the terminal uses aluminum or an aluminum alloy as a base material (100), a Zn layer (101) having a thickness in the range from 0.1 ?m to 2.0 ?m by electroless plating and a Cu layer (102) having a thickness in the range from 0.5 ?m to 1.0 ?m by electrolytic plating are formed in sequence on the surface of the base material (100), and an Sn layer (105) having a thickness in the range from 0.

Abstract: Provided is a Ni-plated steel sheet having excellent press formability. An Fe—Ni diffusion layer and a softened Ni layer formed on the Fe—Ni diffusion layer are formed on a surface of a steel sheet corresponding to an outer surface of a battery can, a semi-bright Ni plating layer is formed on the softened Ni layer, a Ni coating weight of the Fe—Ni diffusion layer and the softened Ni layer formed on the Fe—Ni diffusion layer is set smaller than a Ni coating weight of the semi-bright Ni plating layer, and average roughness Ra of the semi-bright Ni plating layer measured by a traceable roughness gauge is 1.0 ?m or more and 2.0 ?m or less, and a maximum height Ry of the semi-bright Ni plating layer measured by the traceable roughness gauge is 5 ?m or more and 20 ?m or less.

Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.

Abstract: Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Abstract: A corrosion-resistant electrical connector is disclosed. A multi-layer nickel underplating is applied to the substrate material of the connector contacts. The three layers of nickel include a leveling nickel layer, a sulfumate nickel layer, and a high-phosphorous nickel layer. A layer of gold is applied to the nickel underplating in an embodiment.

Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern.

Abstract: The invention provides a method and system for electrolytically coating an article. The method includes providing an article to be coated and disposing the article in an electrolytic cell. The cell includes an anode, a cathode in operable communication with the article, and an electrolyte bath. During electrolysis, the electrolyte bath comprises cobalt ions, phosphorous acid, and tribological particles selected from the group consisting of refractory materials, solid lubricants and mixtures thereof dispersed therein. The method further includes applying steady direct electric current through the anode, the electrolyte bath and the cathode to coat the article with cobalt, phosphorous and the tribological particles. An improved composition of matter is also provided that may be used as a coating, or the composition may be electroformed on a mandrel to form an article made from the composition of matter.

Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Abstract: The invention concerns a galvanic deposition method for an anthracite colored coating for metallic parts, including a first step of depositing a gold-nickel alloy by means of an electrolytic bath, characterized in that it includes a second step of treating said gold-nickel alloy by means of a diluted acid bath, containing an acid selected from among hydrochloric, hydrofluoric, phosphoric, nitric and sulphuric acid.

Abstract: The invention provides a method and system for electrolytically coating an article. The method includes providing an article to be coated and disposing the article in an electrolytic cell. The cell includes an anode, a cathode in operable communication with the article, and an electrolyte bath. During electrolysis, the electrolyte bath comprises cobalt ions, phosphorous acid, and tribological particles selected from the group consisting of refractory materials, solid lubricants and mixtures thereof dispersed therein. The method further includes applying steady direct electric current through the anode, the electrolyte bath and the cathode to coat the article with cobalt, phosphorous and the tribological particles. An improved composition of matter is also provided that may be used as a coating, or the composition may be electroformed on a mandrel to form an article made from the composition of matter.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.

Abstract: An endless fusing thick belt for an electrographic imaging device having a flexible tubular configuration of predetermined diameter, said endless fusing thick belt comprising; an outside surface toner release layer comprised of a coating and a sleeve; a silicone rubber layer positioned inside said outside surface toner release layer; a rigid material layer positioned inside said silicone rubber layer; and a silicone base layer positioned inside and affixed to the internal surface of said polyimide layer using an adhesive.

Abstract: A coating which improves the wear performance of a part is described. The coating is applied over an article such as a part or a workpiece using an electroplating process. The coating broadly includes a cobalt material matrix with a hardness of at least 550 HV and a plurality of carbide particles distributed throughout the cobalt material matrix. The cobalt material matrix may be a cobalt-phosphorous alloy. The particles interspersed throughout the matrix may be chrome carbide or silicon carbide particles.

Abstract: A crystalline chromium deposit having a lattice parameter of 2.8895+/?0.0025 ?, and an article including the crystalline chromium deposit. An article including a crystalline chromium deposit, wherein the crystalline chromium deposit has a {111} preferred orientation. A process for electrodepositing a crystalline chromium deposit on a substrate, including providing an electroplating bath comprising trivalent chromium and a source of divalent sulfur, and substantially free of hexavalent chromium; immersing a substrate in the electroplating bath; and applying an electrical current to deposit a crystalline chromium deposit on the substrate, wherein the chromium deposit is crystalline as deposited.

Abstract: The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.

Abstract: The invention describes a multi-layered bearing with a supporting metal layer, optionally a bearing metal layer disposed on top of it, an anti-friction layer on top of the latter as well as a wearing layer on top of it. The wearing layer is made from bismuth or a bismuth alloy and the anti-friction layer is made from a copper-bismuth or silver-bismuth alloy or silver.

Abstract: A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

Abstract: The present invention provides electrodeposited copper foil with a carrier foil which permits the formation of finer-pitch circuits and also enables the multilayer process to be easily performed to meet the requirements for recent printed wiring boards. According to the invention, there is provided electrodeposited copper foil with a carrier foil in which an adhesive interface layer is formed on a surface of the carrier foil and an electrodeposited copper foil layer is formed on the adhesive interface layer, which is characterized in that the electrodeposited copper foil layer is provided with a passivated layer formed without performing roughening treatment as nodular treatment and that a nickel-zinc alloy consisting essentially of 50 to 99% nickel by weight and 50 to 1% zinc by weight is adopted as the passivated layer.

Abstract: The invention describes a sliding element, in particular a sliding bearing, with a support element and a sliding layer, between which a bearing metal layer is arranged, wherein the sliding layer is made from bismuth or a bismuth alloy, and wherein the crystallites of the bismuth or the bismuth alloy in the sliding layer adopt a preferred direction with respect to their orientation, expressed by the Miller index of the lattice plane (012), wherein the X-ray diffraction intensity of the lattice plane (012) is the greatest compared to the X-ray diffraction intensities of other lattice planes. The X-ray diffraction intensity of the lattice plane with the second-largest X-ray diffraction intensity is a maximum of 10% of the X-ray diffraction intensity of the lattice plane (012).

Abstract: A contact surface. for electrical contacts may include an Ag layer deposited on a copper-based substrate using galvanic methods. The Ag layer includes finely dispersed graphite particles in a quantity of, e.g., 1 to 3 weight % of the Ag layer, the graphite particles having a length in the range of, e.g., 0.5 to 20 ?m.

Abstract: A laminated metal thin plate produced by electrodeposition is composed of a plurality of metal layers provided by at least two kinds of materials different in composition from each other. The laminated metal thin plate includes a first layer excellent in mechanical characteristics and/or chemical resistance and a second layer excellent in electrical characteristics such as electrical conductivity. The first and the second layers are adhered to each other in atomic level directly at their interface, with composition gradient at their interface, or with an adherence buffer layer such as a copper thin film interposed therebetween. The first layer is at first deposited on an electrode substrate. The second layer is deposited on the first layer. Deposition is repeatedly carried out in such a way that the first layers on opposite sides of the second layer are equal in thickness. Finally, the electrode substrate is dissolved and removed.

Abstract: A composite chromium plating film containing hard particles in network-shaped microcracks, a surface-occupying ratio of the microcracks being 10 to 20% by area, a distribution density of the microcracks being 1,200 to 2,500/cm, and the amount of the above hard particles being 1 to 15% by mass per 100% by mass of the above entire plating film. This composite chromium plating film has excellent wear resistance and scuffing resistance with small attacking ability to a mating member.

Abstract: Various structures or components can include plated surfaces or other parts. For example, an article can include a base and a plated part with a limit artifact that results from plating adjacent a non-plateable surface; the limit artifact can be disposed away from the base. Exemplary limit artifacts include lack of protrusions, smooth upper surfaces, and curved surfaces, where a curved surface can transition between a smooth upper surface and an irregular side surface. Exemplary plated structures can be tube-shaped or cup-shaped, with an opening at a top end and, around the opening, a lip with a limit artifact. Wall-like structures can similarly have limit artifacts at their top end. If plating on a mold's side surface, the non-plateable surface can be the lower surface of an overhanging polymer disk or structure positioned on the mold. Plated tubes and wall-like structures can be employed in microfluidic structures.

Abstract: An engraved surface in a metallic workpiece and an engraving method therefor, for use in providing a decorative metallic surface. An engraved pattern is formed in a workpiece prior to the formation of an electroplated layer that continuously extends over the engraved pattern and adjacent surface areas of the workpiece. The engraved pattern includes wall-cut engravings inscribed in the workpiece that are used to define outer boundaries of the engraved pattern. The substantially vertical walls obtained by such wall-cut engravings permits a sharp, well-defined boundary between the engraved pattern and adjacent painted surfaces. A mask material is first applied to cover the engraved pattern, and then trimmed to create the sharp edge at the boundary of the engraved pattern. This permits a paint layer to be formed immediately adjacent to the engraved pattern, providing a decorative juxtaposition in an electroplated metallic surface after removal of the mask layer.

Abstract: Objects of the present invention are to provide an endless metal belt superior in flexing resistance and durability, to provide a fixing belt using the endless metal belt, and to provide a heat fixing device with high durability and high reliability. The objects are achieved by the endless metal belt formed of a nickel alloy containing 5% by weight or more of an additional metallic element and having a half-value width of an X-ray diffraction peak in a range of 0.5 degrees to 2 degrees for each of a crystal plane and a crystal plane, and by using the same.

Abstract: A method for heat treatment of a cold rolled strip with a surface coating of Ni and/or Co and incorporated non-metallic elements C and/or S, if need be with the addition of Fe, In, Pd, Au and/or Bi, whereby the cold rolled strip has a low carbon content. Since the compounds of C, S, N and P deposited on the grain boundaries bring about the most micro-cracks with the surface coating metal if no recrystallization takes place, the temperature of the heat treatment should be selected lower than the recrystallization temperature and higher than the precipitation temperature. With a recrystallization, the grain sizes would easily attain the thickness of the coating so that the embrittled compounds would migrate with the grain boundaries out of the coating. Due to the choice of temperature of the heat treatment of the surface coating of the invention, in contrast, an optimal embrittlement of the grain boundaries is guaranteed, which is especially advantageous in the manufacture of battery cans.

Abstract: Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.

Abstract: The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.

Abstract: The present invention provides a black, chrome-free, multilayer corrosion protection finish designed to meet extended corrosion properties. This corrosion-resistant finish is engineered to meet a minimum of 500 salt spray testing hours to white corrosion, and 1500 salt spray testing hours to red corrosion when tested to ASTM B117 standards. It is also designed to comply with the European Union Directive on End of Life Vehicles. This multilayer system is designed for use on automotive body sheet steel, automotive underbody parts, automotive under-hood parts, and some automotive interior parts specifying a gloss requirement greater than 4. This chrome-free, multilayer finish is a combination of a zinc-iron electroplated substrate, a non-electrolytic phosphate crystal conversion layer using orthophosphoric acid, and a Xylan/Teflon fluorocarbon sealer coating to form a three layer total corrosion protection system.

Abstract: A capacitor comprising an aluminum anode and a dielectric layer comprising phosphate doped aluminum oxide and process for making the capacitor. The capacitor has a CV Product of at least 9 ?F-V/cm2 at 250 volts. Furthermore, the capacitor is formed by the process of: forming an aluminum plate; contacting the plate with an anodizing solution comprising glycerine, 0.1 to 1.0%, by weight, water and 0.01 to 0.5%, by weight, orthophosphate; applying a voltage to the aluminum plate and determining an initial current; maintaining the first voltage until a first measured current is no more than 50% of the initial current; increasing the voltage and redetermining the initial current; maintaining the increased voltage until a second measured current is no more than 50% of the redetermined initial current, and continuing the increasing of the voltage and maintaining the increased voltage until a final voltage is achieved.

Abstract: An aqueous suspension liquid of finely divided diamond particles comprising 0.05 to 160 parts by weight of a finely divided diamond particles in 1000 parts of water, wherein; (i) the finely divided diamond particles have an element composition consisting mainly of 72 to 89.5% by weight of carbon, 0.8 to 1.5% of hydrogen, 1.5 to 2.5% of nitrogen, and 10.5 to 25.0% of oxygen; (ii) and, almost all of said diamond particles are in the range of 2 nm to 50 nm in diameters thereof (80% or more by number average, 70% or more by weight average), (iii) and, said finely divided diamond particles exhibit a strongest peak of the intensity of the Bragg angle at 43.9° (2?±2°), strong and characteristic peaks at 73.5° (2?±2°)and 95° (2?±2°), a warped halo at 17° (2?±2°), and no peak at 26.5°, by X-ray diffraction (XRD) spectrum analysis using Cu-K? radiation when dried, (iv) and, specific surface area of said diamond particles when dry state powder is not smaller than 1.

Abstract: A Bi base material of which a Miller index (202) face has the index of orientation of not less than 30% and in which the (202) face has the index of orientation assuming a maximum value as compared with those of other faces forms a minute structure and has a surface which is not a mirror finished surface but a fine, irregular surface on which minute and uniform projections in the form of a triangular pyramid or a quadrangular pyramid congregate. Therefore, the surface easily retains oil thereon to be improved thereby in oil wettability, as a result of which an improvement in anti-seizure is achieved.

Abstract: A metal belt of the present invention is formed to be endless by electroforming, has a crystal orientation in which a crystal orientation ratio I(200)/I(111) is not less than 80 and not more than 250, mainly contains nickel, and has an excellent durability.

Abstract: A composite nickel and copper alloy plating film (3) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high resistance of the film. The film may further contain self-lubricating particles and hard particles which ensure its wear resistance and lubricating property to a further extent.

Abstract: The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a method other than sputtering. In order to remove conducting material from the conductive layers with the aid of a laser for the purposes of adjustment while producing as little contaminating material as possible, the electrically conductive reinforcing layer has a reduced thickness or is completely eliminated in regions of the electrically conductive layers to be adjusted than in other regions outside of the regions to be adjusted.

Abstract: The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of the clad layer a plated layer of nickel-tin alloy, such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and have a composition with the proviso that the mol-ratio of Ni:Sn is in the range of 10:(0.5 to 9).

Abstract: The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-wiring board comprising a nodular treatment side on one side, wherein a nickel-zinc alloy layer is formed on the nodular treatment side is used for applications of printed-wiring boards. At the same time, a production method suitable for production of the copper foil is provided.

Abstract: A method of forming a surface finish of trivalent chromium on metal or plastics substrates by electrodeposition from an aqueous plating solution of trivalent chromium ions in which the trivalent chromium is deposited on a layer of silver or silver alloy whereby the color and/or corrosion resistance of the trivalent chromium is comparable to surface finishes of hexavalent chromium. The invention avoids the health and safety risks associated with the electrodeposition of hexavalent chromium surface finishes.

Abstract: An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.

Abstract: A method of manufacturing a high strength steel sheet containing, in mass %, C: 0.02 to 0.04%, Si: at most 0.4%, Mn: 0.5-3.0%, P: at most 0.15%, S: at most 0.03%, Al: at most 0.50%, N: at most 0.01%, and Mo: 0.01-1.0%. The method includes performing hot rough rolling either directly or after heating to a temperature of at most 1300° C., commencing hot finish rolling either directly or after reheating or holding, completing finish rolling at a temperature of at least 780° C., performing coiling after cooling to a temperature of 750° C. or below at an average cooling rate of at least 3° C./second, heating to an annealing temperature of at least 700° C. and then cooling to a temperature of 600° C. or below at an average cooling rate of at least 3° C./second, then holding in a temperature range of 450-600° C. for at least 10 seconds, and performing hot dip galvanizing after cooling.

Abstract: A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum, palladium, rhodium, ruthenium and iridium. The protective coating is typically heat treated to increase homogeneity of the coating and adherence with the substrate. The component typically further comprises a ceramic thermal barrier coating overlying the protective coating. Also disclosed are methods for forming the protective coating on the turbine engine component by electroplating the platinum group metals.

Abstract: An improved electrode and method for manufacturing the improved electrode wherein the electrode having a fractal surface coating of platinum [which the present inventor refers to as “platinum gray”] with a increase in surface area of at least 5 times when compared to shiny platinum of the same geometry and also having improved resistance to physical stress when compared to platinum black having the same surface area. The process of electroplating the surface coating of platinum gray comprising plating at a moderate rate, i.e., at a rate that is faster than the rate necessary to produce shiny platinum and that is less than the rate necessary to produce platinum black.

Abstract: The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surface-treated copper foil for a low-dielectric substrate which is used in bonded relationship to a low-dielectric substrate, which is characterized in that a nodular-treated layer constituted by bump-like copper particles is formed on a surface of the copper foil and that ultrafine copper particles are caused to precipitate on the whole surface of the nodular-treated layer and adhere thereto and the roughness value Rz of the surface is 1.0 to 6.5 ?m. The surface color of the surface-treated copper foil has L* of not more than 50, a* of not more than 20 and b* of not more than 15.

Abstract: A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 ?m. The copper-tin alloy layer has a thickness of 0.1-1.0 ?m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 ?m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 ?m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Abstract: Structure incorporating lead is fabricated from specially prepared components such that mobility of the lead is impeded when the structure is exposed to an unprotected environment such as weathering outdoors or saltwater. In a preferred embodiment, a bullet or bullet core is swaged from a number of bunched electroplated fine lead or lead-alloy wires placed in a die. The lead or lead-alloy wires may be fabricated from lead or lead-alloy wool. The lead alloy may comprise zinc and antimony. The electroplating process plates zinc on the fine wires and may plate a zinc alloy such as zinc-aluminum. The plated surface may be coated with a corrosion resistant coating such as molybdenum phosphate. In addition to bullets and bullet cores, fishing weights, lead shielding, counterweights, ballast, and other lead containing structure may be fabricated or treated using methods and materials of the present invention.

Abstract: A process for electrodepositing a low stress nickel-manganese multilayer alloy on an electrically conductive substrate is provided. The process includes the steps of immersing the substrate in an electrodeposition solution containing a nickel salt and a manganese salt and repeatedly passing an electric current through an immersed surface of the substrate. The electric current is alternately pulsed for predetermined durations between a first electrical current that is effective to electrodeposit nickel and a second electrical current that is effective to electrodeposit nickel and manganese. A multilayered alloy having adjacent layers of nickel and a nickel-manganese alloy on the immersed surface of the substrate is thereby produced. The resulting multilayered alloy exhibits low internal stress, high strength and ductility, and high strength retention upon exposure to heat.

Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited copper foil for a printed circuit board, comprising electrolytically treating the copper foil in an electrolytic solution containing pyrophosphoric acid potassium of about 10 g/l to about 200 g/l, Zn of about 0.1 g/l to about 20 g/l, Co of about 0.1 g/l to about 20 g/l and As of about 0.05 g/l to about 5 g/l, is provided. Further, the electrolytic solution remains at the temperature of about 20° C. to about 50° C. and a pH of about 9 to about 13. The copper foil is electrolytically treated for about 2 seconds to about 20 seconds at a cathode current density of about 0.5 A/dm2 to about 20 A/dm2.