Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited copper foil for a printed circuit board, comprising electrolytically treating the copper foil in an electrolytic solution containing pyrophosphoric acid potassium of about 10 g/l to about 200 g/l, Zn of about 0.1 g/l to about 20 g/l, Co of about 0.1 g/l to about 20 g/l and As of about 0.05 g/l to about 5 g/l, is provided. Further, the electrolytic solution remains at the temperature of about 20° C. to about 50° C. and a pH of about 9 to about 13. The copper foil is electrolytically treated for about 2 seconds to about 20 seconds at a cathode current density of about 0.5 A/dm2 to about 20 A/dm2.

Abstract: A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic solutions containing oxidizing agents, then treated in trivalent bismuth compound solution and additionally treated in sulphide solution.

Abstract: An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

Abstract: A negative bias is applied to an integrated circuit wafer immersed in an electrolytic plating solution to generate a DC current. After about ten percent to sixty percent of the final layer thickness has formed in a first plating time, biasing is interrupted during short pauses during a second plating time to generate substantially zero DC current. The pauses are from about 2 milliseconds to 5 seconds long, and typically about 10 milliseconds to 500 milliseconds. Generally, about 2 pauses to 100 pauses are used, and typically about 3 pauses to 15 pauses. Generally, the DC current density during the second plating time is greater than the DC current density during the initial plating time. Typically, the integrated circuit wafer is rotated during electroplating. Preferably, the wafer is rotated at a slower rotation rate during the second plating time than during the first plating time.

Abstract: A metal foil for a current collector of a secondary battery formed by electrodeposition and has a thickness (T) of 8 to 40 ?m, the metal foil satisfying the following formulae: 4.9×108?T×S×Y?31×108 4.5???(0.0005×T2)?15 where S is a breaking strength (MPa), ? is a tensile elongation (%) and Y is a Young's modulus (MPa). This foil is preferably a nickel foil and is manufactured by softening or annealing the metal foil obtained by electrodeposition. Thereby, a metal foil for a negative electrode of a secondary battery is obtained with an excellent capability of supporting the active material and large electric conductivity.

Abstract: In a method of providing a surface with a protection layer having at least a first surface area (2) and a second surface area (1), which surface areas (1, 2) are distinguishable in that the surface areas (1, 2) differ from each other in at least one visual property, parts of the surface situated outside the first surface area (2) are masked with a mask layer which partially covers the surface, and the surface is subjected to an electrochemical treatment (14, 20), whereby non-masked parts of the surface are treated. As the mask layer provided on the surface is a sol-gel layer forming the protection layer in the second surface area (1), a wear-resistant surface-protection layer having visually distinguishable surface areas is provided in an efficient manner. An object which can be obtained by means of the proposed method is also described.

Abstract: An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: The present invention is directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, zirconium ions, titanium ions, manganese ions, vanadium ions, iron ions, tin ions, indium ions, silver ions, and combinations thereof; and optionally, an electrolyte that does not contain potassium or sodium ions; wherein the treatment composition is substantially free of chromium, and wherein the treatment composition forms a coating on a substrate or material that enhances adhesion of a polymer to the material. The present invention is also directed to materials coated with the above treatment composition, and methods of coating materials using the above composition.

Abstract: A titanium article having improved corrosion resistance resulting from a direct or indirect attachment of a platinum group metal or alloy thereof or incorporation of this metal or alloy thereof into a minor surface portion of the article.

Abstract: Method of synthesis of confined colloidal crystals using electrodeposition. The present invention provides a method of growing confined colloidal crystal structures using electrodeposition of monodispersed charged colloid spheres onto a substrate patterned with an array of electroconductive surface relief features on a surface of a substrate. In this approach, control over large-scale ordering is achieved via a planar pattern whose scale is on the order of tens of microns, a regime readily accessed through coarse lithography, laser micromachining, and holography.

Abstract: A new and improved, anodized aluminum gas distribution plate for process chambers, particularly an etch chamber. The gas distribution plate includes an aluminum body having multiple gas flow openings extending therethrough and an alumina anodized coating or layer on the plate. The gas distribution plate is characterized by enhanced longevity and durability and resists particle-forming deterioration and damage throughout prolonged use.

Abstract: The invention relates to a doctor or coater blade (1) of steel, having a nickel coating comprising abrasion resistant particles, said coating being constituted by an electrolytic nickel layer comprising abrasion resistant particles. The coating preferably comprises at least two electrolytic nickel layers having different composition, and may be formed differently in different sections of the blade. The invention also relates to a continuous process for electrolytic nickel coating in at least one electrolytic cell holding an electrolyte liquid comprising at least one nickel salt, and in at least one of these cells also comprising abrasion resistant particles.

Abstract: Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals, alkaline earth metals, or a combination thereof other than sodium and potassium, to in major part balance the hydroxyl ions. A preferred alkali metal is rubidium.

Abstract: A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.

Abstract: An alloyed hot-dip galvanized steel sheet is obtained by forming a hot-dip galvanized layer on the surface of the steel sheet and then alloying the steel sheet. The steel sheet exhibits a potential of −850 mV or less when it is immersed in a zinc sulfate-sodium chloride electrolyte. Alternatively, when it is electrolyzed according to constant potential electrolysis process in a zinc sulfate-sodium chloride electrolyte at a potential in a range from −940 mV to −920 mV, the quantity of electricity consumed is less than or equal to 0.5 C/cm2. The steel sheet exhibits excellent processability and particularly excellent sliding property.

Abstract: There is provided a copper clad laminate which makes laser beam drilling extremely easy and is suitable for forming an interlayer connection microhole by improving a surface of its copper foil, which is to be used as the surface which a laser beam enters, in the production of printed circuit boards. Specifically, the copper clad laminate is such that it includes electrodeposited copper foil for use in the laser beam drilling and is characterized in that the matte side of the above electrodeposited copper foil is used as the surface which the laser beam enters.

Abstract: Disclosed is a method of electroplating a Ni—Fe—P alloy using a sulfamate solution and, in particular, a method of electroplating a Ni—Fe—P alloy using a plating solution containing nickel sulfamate, iron sulfamate, phosphorous acid, and a buffer agent. The method is advantageous in that a residual stress of a deposited layer is very low and has stable mechanical properties, and excellent thermal and corrosion resistance because the deposited layer is obtained by electroplating the Ni—Fe—P alloy using the sulfamate solution useful in a high rate plating process. Furthermore, the method can be applied to various parent metals such as stainless steel, Inconel and iron alloys, and to various fields because the chemical compositions of the deposited layer are readily controlled by varying the concentration of the plating solution.

Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include a polyethylene component, acrylonitrile-butadiene-styrene polymer(s), and at least one styrene monoolefin copolymer. The invention also relates to articles containing such alloys, and to methods of forming such blends and articles containing the same. These blends have excellent platability and superior physical properties including enhanced stiffness and toughness.

Abstract: The invention relates to structural components for the boiler zone of power plants or refuse incineration plants, especially tubes or nests of tubes, fin and diaphragm walls, that consist of steel or steel alloys, and is characterized by a continuous closed outer nickel or nickel alloy layer galvanically deposited having a layer thickness of approximately 1 to 5 mm, preferably 1 to 2.5 mm.

Abstract: A method of fabricating a semiconductor device, having a reduced-oxygen Cu—Zn alloy thin film (30) electroplated on a Cu surface (20) by electroplating, using an electroplating apparatus, the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing agents, a pH adjuster, and surfactants; and annealing the electroplated Cu—Zn alloy thin film (30); and a semiconductor device thereby formed. The method controls the parameters of pH, temperature, and time in order to form a uniform reduced-oxygen Cu—Zn alloy thin film (30), having a controlled Zn content, for reducing electromigration on the Cu—Zn/Cu structure by decreasing the drift velocity therein which decreases the Cu migration rate in addition to decreasing the void formation rate, for improving device reliability, and for increasing corrosion resistance.

Abstract: The object is to provide carrier foil-incorporated copper foil which permits drilling by a carbon dioxide laser when on the surface of outer-layer copper foil of a copper-clad laminate there is no nickel assist metal layer or an organic material film to increase the absorption of laser light. For this purpose, there is used, for example, carrier foil-incorporated copper foil in which copper foil for printed wiring board manufacturing having a nodular-treated surface on the side of one surface of a bulk copper layer and carrier foil are laminated via an adhesive interface layer on a side opposite to the nodular-treated surface of the bulk copper layer, the bulk copper layer being formed from a high-carbon copper with a carbon content of 0.03 wt % to 0.40 wt %.

Abstract: An electrodeposition process for producing a layered composite material and the layered composite material produced by the process. The layered composite material includes at least one layer of a first alloy species of an alloy and at least one layer of a second alloy species of the alloy. The first alloy species and the second alloy species have distinguishable properties. The process includes the steps of first energizing an electroplating circuit to provide a first electroplating current to deposit a layer of the first alloy species and second energizing the electroplating circuit to provide a second electroplating current to deposit a layer of the second alloy species. The alloy is preferably a gold-tin alloy, the first alloy species is preferably the Au5Sn alloy phase and the second alloy species is preferably the AuSn alloy phase.

Abstract: A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting the metal mesh to a relatively fast deposition of an electrodeposited material so as to substantially uniformly coat said mesh with electrodeposited material; and (3) subjecting the product of the relatively fast deposition step to a relatively slow deposition of an electrodeposited material so as to reduce at least one dimension greater than nanometer scale size to a size of nanometer scale. Also provided are metallic meshes so prepared and spectral filters.

Abstract: A laminar structure (17) comprising a deposited metal, the structure having microholes (17a) extending between a first surface and a second surface thereof, each microhole having a wall which meets the first surface with a rounded edge or tapered configuration in such a manner that the first surface is substantially smooth.

Abstract: This invention relates to a structure on a bi-color rust-proof barrier layer of a tool head, mainly used to form a surrounding recessed section marked with indication of a size, a model, a trademark and the like on a surface of a tool head (a metallic object) so that the structure on the rust-proof barrier layer painted with the different two colors is provided between the recessed section and the peripheral surface, thereby highlighting the indication marked at the recessed section so as to increase the distinctions of said object from other object.

Abstract: An electroplating process reduces the whisker formation rate that results from an interruption of the electroplating process for an alloy. The process forms a tin strike or a thin layer of a pure(>99.9%) metal on the alloy during an activation operation, so that an interruption in the electroplating process during which the lead frame or other work piece remains in an activation solution etches the pure metal layer rather than the alloy and thus does not unacceptably roughen the surface of the work piece. An exemplary embodiment forms a tin strike on a predominantly copper lead frame during an activation operation and forms an Sn—Pb solder layer on the tin strike during a plating operation. The solder layer is generally more than five times as thick as the tin strike layer.

Abstract: The invention relates to a doctor or coater blade (1) of steel, having a nickel coating comprising abrasion resistant particles, said coating being constituted by an electrolytic nickel layer comprising abrasion resistant particles. The coating preferably comprises at least two electrolytic nickel layers having different composition, and may be formed differently in different sections of the blade. The invention also relates to a continuous process for electrolytic nickel coating in at least one electrolytic cell holding an electrolyte liquid comprising at least one nickel salt, and in at least one of these cells also comprising abrasion resistant particles.

Abstract: Disclosed is a brazing sheet product including a core metal sheet (1), on at least one side of the core metal sheet (1) a clad layer (2) made of an aluminium brazing alloy comprising silicon in an amount in the range of 4 to 14% by weight, and on at least one outersurface of the clad layer (2) a layer comprising iron or iron alloy (4), and on the outersurface of the layer comprising iron or iron alloy (4) a further layer (3) including a metal X, whereby X is selected from the group consisting of tin, zinc, bismuth, indium, antimony, strontium, titanium, manganese, copper, or combinations of two or more thereof. Also, disclosed is a method of manufacturing such a brazing product, and a brazed assembly including at least one component made of this brazing product.

Abstract: A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Abstract: The present invention is a solder coated material having a large amount of solder adhered to a difficult to solder material such as Kovar or Alloy 42 and a method which can adhere a sufficient amount of solder to a difficult to solder material without using flux. An electroplated coating is applied to a portion to be soldered of a difficult to solder material, the difficult to solder material is then passed through molten solder to which ultrasonic waves are applied, and a large amount of solder is adhered only to solder plated portions.

Abstract: An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided.

Abstract: A metal belt of the present invention is formed to be endless by electroforming, has a crystal orientation in which a crystal orientation ratio I(200)/I(111) is not less than 80 and not more than 250, mainly contains nickel, and has an excellent durability.

Abstract: The invention concerns the manufacture of complex metallic or metallized porous structures, wherein the electroplating metal over the entire developed surface is preceded by a specific pre-metallization of the basic structure. The pre-metallization is obtained by depositing a conductive polymer, which is deposited on the entire developed surface of the structure by the steps of an oxidizing pre-treatment of the structure, depositing in the liquid phase, a monomer having a polymerized form that is electrically conductive, and polymerizing by oxidation-doping of the monomer. The structures according to the invention are particularly intended for use as electrodes for the electrolysis of liquid effluents, as electrode supports for electrochemical generators, as catalyst supports, filtration media, phonic insulation, electromagnetic and nuclear protection structures, or for other applications.

Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;, &pgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.

Abstract: The invention relates to structural components for the boiler zone of power plants or refuse incineration plants, especially tubes or nests of tubes, fin and diaphragm walls, that consist of steel or steel alloys, and is characterized by a continuous closed outer nickel or nickel alloy layer galvanically deposited having a layer thickness of approximately 1 to 5 mm, preferably 1 to 2.5 mm.

Abstract: The present invention provides a copper electroplating method using an insoluble anode, including: using an insoluble anode and a copper electroplating solution which contains a compound having a —X—S—Y— structure (where X and Y are each independently selected from the group consisting of a hydrogen atom, a carbon atom, a sulfur atom, a nitrogen atom, and an oxygen atom, and X and Y can be the same only where they are carbon atoms); and using direct current to plate a substrate. By this method, even a certain time period after the initial make-up of the electrolytic bath, stable deposition of the plated metal and formation of a filled via can be achieved, and an MVH can be filled up with the metal with no void left.

Abstract: The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.

Abstract: A highly corrosion-resistant material and a corrosion-resistant member which are improved in corrosion resistance, adhesion, contact electrical resistance, electrical conductivity, airtightness, etc. and are suitable for use as, e.g., a metallic separator for polymer electrolyte fuel cells (PEFC); and a process for producing them. A thin noble-metal layer is formed on the desired part of the surface of a metallic base and then subjected to compression working. The coated base may further be subjected to anticorrosive treatment with a liquid phase containing a peroxide or ozone or with an active gas atmosphere.

Abstract: We make particulates, especially magnetic Fe—Co alloys having high magnetic permeability, of controlled dimensions, especially those having a narrow thickness size distribution centered around a median or target thickness in the range of about 0.1-1.0 &mgr;m, using electrodeposition typically on a smooth (polished) titanium cathode. Our preferred continuous process uses a rotating drum cathode inside a fixed anode to grow flakes and to produce them automatically by inherent instability in the deposited film. The drum preferably rotates about a substantially vertical axis. The particulates shed (slough off) into the electrolyte (because of mismatch between the cathode surface and the plated metal or alloy at the molecular level) where they are separated in a magnetic separator or other suitable device. If the flakes are soft iron or iron-cobalt alloys, the drum generally is titanium or titanium alloy.

Abstract: A coated steel sheet composed of a steel sheet and at least two types of coating layers formed thereon is provided with an electrodeposition painting having a superior appearance. The coated steel sheet has an arithmetic mean roughness Ra, which is defined by JIS B 0601-1994, of from about 0.7 to about 1.5 &mgr;m and a peak per inch PPI of from about 180 to about 250.

Abstract: A tin-silver alloy plating film improved in solderability and flex cracking characteristics is provided by producing it by an electroplating process which uses a current having a pulse waveform of a current passing period of not less than 3 ms and not more than 500 ms and a stopping period of not less than 1 ms and not more than 500 ms with a proviso that the stopping period is equal to or shorter than the passing period.

Abstract: A Zn—Co—W alloy electroplated steel sheet with excellent corrosion resistance and weldability, and an electrolyte for manufacturing same are provided. The plating layer consisting of Co: 0.1-3.0 wt %, and zinc: balance, is formed on the steel sheet and all tungsten plating is carried out with metallic tungsten; an electrolyte for manufacturing a Zn—Co—W alloy electroplated steel sheet, comprising zinc chloride: 60-200 g/l, cobalt chloride: 0.1-6.0 g/l, tungsten: 0.1-4.0 g/l, citric acid: 0.5-10.0 g/l, polyethylene glycol: 0.1-2.0 m/l and electric conductive aid: 30-400 g/l, wherein substantially all of the tungsten ions form a complex compound with citric acid, thereby preventing formation of sludge; and a Zn—Co—W alloy electroplated steel sheet, on which a plating layer is formed by electroplating the steel in the electrolyte.

Abstract: A metallic component exposed to high temperature steam is provided with a coating comprising a thin primer layer deposited on the surface of the metallic component and a thicker overlay layer on top of the primer layer. The primer layer consists of highly ductile, oxidation resistant material such that it remains free of any defects over a long period of exposure. The overlay layer consists of an oxidation resistant, less ductile, and low-cost material. It protects the thin primer layer from mechanical damage and chemical degradation. The primer layer protects the base material of the metallic component from oxidizing steam that may penetrate through cracks of the overlay layer. Due to suitable choice of coating materials and thicknesses of the layers the coating is low-cost.

Abstract: The invention provides a pretreatment process for electroplating aluminum parts or strip, in which the zincating solution is modified to improve the adhesion of the subsequent electroplate to the substrate. The aluminum part or strip, such as an aluminum coin blank or strip for coin blanks, is pretreated with an improved zincate solution which provides hydroxide ions in an amount in the range of 75-175 gpl, zinc ions in an amount in the range of 15-40 gpl, nickel ions in an amount in the range of 2-10 gpl and copper ions in an amount in the range of 1.5-5 gpl. The pretreatment process preferably includes a copper strike applied from a copper cyanide strike bath at a pH in the range of 8.5-9.5, using a current density in the range of 0.1-10 A/dm2. The pretreatment and electroplating steps are preferably conducted by barrel plating, in accordance with another aspect of the invention.

Abstract: The addition of small amounts of CeO2 and Cr to intermetallic compositions of NiAl and FeAl improves ductility, thermal stability, thermal shock resistance, and resistance to oxidation, sulphidization and carburization.

Abstract: There is provided contact, sliding, fitting-in and ornamental members having a surface treatment structure in which contact resistance is low, and lubricating property and wear resistance are excellent, and capable of being used suitably for any use of contact, sliding, fitting-in or ornament, and a method for manufacturing the same. The surface treatment structure 1 having a plating layer formed on the surface of a substrate 2 comprises a lubrication plating layer 5 made of a plating layer of a metal matrix containing fine particles 4 having lubricating property, and a noble metal plating layer 7 formed on the lubrication plating layer 5. Preferably, an anti-diffusive plating layer 3 made of a metal plating layer is formed under the lubrication plating layer 5, and a joining layer 6 made of a strike plating layer of noble metal is formed between the lubrication plating layer 5 and the noble metal plating layer 7.

Abstract: The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.

Abstract: The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.

Abstract: A titanium article having improved corrosion resistance resulting from an appliqué of a platinum group metal or alloy thereof attached to a minor surface portion of the article.