Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.

Abstract: A curable composition includes a condensation product having a weight average molecular weight of 30,000 or less and a curing agent, the condensation product being obtained by hydrolysis and condensation of a first and second silane compound in the presence of a neutral salt catalyst. The condensation product also has a ratio Y/X of 0.2 or less, wherein X is the number of moles of an OR3 group directly bonded to silicon atoms of the first and second silane compounds, and Y is the number of moles of an OR3 group directly bonded to a silicon atom of the condensation product. The first silane compound is represented by R1—(SiR2a(OR3)3-a), and the second silane compound is represented by R4—(SiR2a(OR3)3-a).

Abstract: An active energy ray-curable composition includes (A) a condensate having a weight average molecular weight of 20,000 or less, and (B) a photoacid generator, with the condensate (A) being obtained by hydrolysis/condensation of: (I) a silane compound containing a hydrolyzable silyl group represented by formula (I): R1—(SiR2a(OR3)3-a. A ratio (Y/X) of Y to X is 0.2 or less, where X represents the number of moles of OR3 groups directly bonded to silicon atoms in the silane compound (I) which is a starting material of the condensate (A) and Y represents the number of moles of OR3 groups directly bonded to silicon atoms in the condensate (A).

Abstract: An adhesive resin composition includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.

Abstract: There is provided a novel material used for solar cells that can contribute to the improvement in maximum output of solar cells without using the conventional MPPT system. A film-forming material for forming a light-collecting film on a transparent electrode of a solar cell, including an aromatic group-containing organic polymer compound (A) and a cross-linker (B), wherein the film-forming material exhibits an index of refraction of 1.5 to 2.0 at a wavelength of 633 nm and a transmittance of 95% or more with respect to light having a wavelength of 400 nm, and a solar cell obtained by coating a cured film made from the film-forming material on a surface of a transparent electrode.

Abstract: A positive photosensitive siloxane composition having high photosensitivity and having such properties as high heat resistance, high transparency and low dielectric constant may be used to form a planarization film for a TFT substrate, an interlayer dielectrics or a core or cladding of an optical waveguide. The positive photosensitive siloxane composition includes a siloxane polymer, quinonediazide compound and solvent, and a cured film formed of the composition has a light transmittance per 3 ?m of film thickness at a wavelength of 400 nm of 95% or more.

Abstract: Disclosed are multilayered resist structures including bilayer and top surface imaging which utilize tuned underlayers functioning as ARCs, planarizing layers, and etch resistant hard masks whose properties such as optical, chemical and physical properties are tailored to give a multilayer resist structure exhibiting high resolution, residue free lithography and methods of preparing these materials.

Abstract: A heat-sensitive recording material includes a support having disposed thereon a heat-sensitive recording layer and a protective layer. The heat-sensitive recording layer contains at least two components that react to develop color by imagewise heating. At least one layer contains a compound represented by the following general formula (I). In the general formula (I), R represents a hydrophobic group or a hydrophobic polymer, and n represents an integer.

Abstract: The present invention includes an imageable element, which can be: (a) an imageable element comprising an imaging layer which comprises: an aromatic diazonium salt containing compound having an alkoxy substituent and an aromatic diazonium salt containing compound free of an alkoxy substituent; a polyvinyl acetal binder; and a sheet substrate; or (b) an imageable element comprising an imaging layer which comprises: an aromatic diazonium salt containing compound having an alkoxy substituent and an aromatic diazonium salt containing compound free of an alkoxy substituent; and a sheet substrate. The imaging layer includes a total aromatic diazonium salt containing compound content of at least 10 weight percent. The molar ratio of the aromatic diazonium salt containing compound having an alkoxy substituent to the aromatic diazonium salt containing compound that is free of an alkoxy substituent is from about 1.0:1 to 70:1. Upon imagewise exposure and development, an imaged element is obtained.

Abstract: A positive photosensitive resin composition having high sensitivity is provided which can form patterns with high resolution and high film thickness retention and can give by curing film excellent in mechanical characteristics, adhesion, and water absorption. This composition comprises 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitive diazoquinone compound (B) and a filler (C), the content (F) of the filler(C) as defined by the following formula ranging from 2 to 70 wt %.

Abstract: There is provided an image recording device which is compact and free of waste materials, which has a completely dry system and a simplified exposure system, and which can carry out high speed image recording. The image recording device includes, within a housing of the image recording device, an accommodating section for accommodating a light and heat sensitive recording material; a light recording section for exposing the light and heat sensitive recording material, which is supplied from the accommodating section, with light to record a latent image; a heat developing section for developing the latent image by applying heat; a light fixing section for irradiating light to fix the developed image; and a discharging section for discharging the light and heat sensitive recording material having an image recorded thereon. Exposure is carried out by a plurality of LEDs provided at a light source section of an exposure unit of the light recording section.

Abstract: Provided is a polybenzoxazole precursor having a high purity which does not contain ionic by-products.

Abstract: Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 &mgr;m from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight.

Abstract: A method of coupling a diazonium salt with an organic polymer comprising, on order, the steps of: providing a polymer in one liquid phase; providing an diazonium salt in a separate liquid phase; contacting the separate phases, and thereby reacting the polymer and the diazonium salt.

Abstract: According to the present invention there is provided a method for making lithographic printing plates including the following steps:a) preparing a light sensitive imaging element having on a lithographic base with a hydrophilic surface a first layer including a polymer, soluble in an aqueous alkaline solution and a top layer on the same side of the lithographic base as the first layer which top layer is unpenetrable for an alkaline developer containing SiO.sub.2 as silicate;b) exposing imagewise said light sensitive imaging element to actinic light;c) developing said imagewise exposed light sensitive imaging element with said alkaline developer so that the exposed areas of the top layer and the underlying areas of the first layer are dissolved and the unexposed areas of the first layer remain undissolved characterized in that said top layer includes a diazonium salt and for at least 20% of its weight one or more non-proteinic hydrophilic film-forming polymers.

Abstract: Disclosed is a method of processing an exposed presensitized planographic printing plate employing an automatic processor, the method comprising the steps of developing the exposed presensitized planographic printing plate with a developer; and washing the developed printing plate with a washing water, wherein the ratio W/D of the washing time W to the cross-over time D taken from completion of the developing step to the beginning of the washing step is 3 or more.

Abstract: The present invention relates to novel photosensitive quinolone compounds, specifically novel 3-diazo 2,4-quinolinedione compounds, that may be used in a variety of applications, such as, photosensitive coating compositions, pharmaceuticals, agricultural, amongst others. The invention further relates to a process for making the novel photosensitive 3-diazo 2,4-quinolinedione compounds. These compounds are particularity useful as a photoactive component in a positive working photoresist composition, particularity for use as a deep ultraviolet (UV) photoresist.

Abstract: The present invention provides a method for producing a water insoluble, aqueous alkali soluble novolak resins having consistent molecular weight and superior performance in photoresist composition, by isolating such novolak resin without high temperature distillation. A method is also provided for producing photoresist composition from such a novolak resin and for producing semiconductor devices using such a photoresist composition.

Abstract: Process for producing a photosensitizer comprising a diazo ester of a p-cresol oligomer where at least one of the hydroxy groups on the p-cresol ring has been esterified with diazo-sulfonyl chloride comprising from about 60 to 100 mole % 2,1,4 or 2,1,5-diazo sulfonyl chloride, or a mixture thereof; and a photoresist comprising an admixture of the photosensitizer, which is present in the photoresist composition in an amount sufficient to uniformly photosensitive the photoresist composition, a water insoluble, aqueous alkali soluble novolak resin, the novolak resin being present in the photoresist composition in an amount sufficient to form a substantially uniform photoresist composition, and a suitable solvent.

Abstract: A photosensitive positive working photosensitive composition suitable for use as a photoresist, which comprises an admixture of at least one water insoluble, aqueous alkali soluble, film forming novolak resin; at least one o-diazonaphthoquinone photosensitizer; and a photoresist solvent mixture comprising a propylene glycol alkyl ether acetate and 3-methyl-3-methoxy butanol and process for producing such a composition.

Abstract: Process for producing a photosensitizer comprising a diazo ester of a p-cresol oligomer where at least one of the hydroxy groups on the p-cresol ring has been esterified with diazo-sulfonyl chloride comprising from about 60 to 100 mole % 2,1,4 or 2,1,5-diazo sulfonyl chloride, or a mixture thereof; and a photoresist comprising an admixture of the photosensitizer, which is present in the photoresist composition in an amount sufficient to uniformly photosensitive the photoresist composition, a water insoluble, aqueous alkali soluble novolak resin, the novolak resin being present in the photoresist composition in an amount sufficient to form a substantially uniform photoresist composition, and a suitable solvent.

Abstract: According to the present invention there is provided a method for making a lithographic printing plate comprising the steps of:(1) image-wise exposing an imaging element having of a flexible film support in the order given (i) a uniform ink-repellant layer comprising a cross-linked hydrophilic binder and (ii) a photosensitive layer comprising a diazonium salt or a diazo resin;(2) and developing a thus obtained image-wise exposed imaging element by mounting it on a print cylinder of a printing press and wiping it with a disposable absorbing tissue moistened with water or fountain solution.

Abstract: According to the present invention there is provided a method for making a lithographic printing plate comprising the steps of:(1) image-wise exposing an imaging element having on a plastic film support in the order given (i) a uniform ink-repellant layer comprising a cross-linked hydrophilic binder and (ii) a photosensitive layer comprising a diazonium salt or a diazo resin;(2) and developing a thus obtained image-wise exposed imaging element by mounting it on a print cylinder of a printing press and supplying an aqueous dampening liquid and/or ink to said photosensitive layer.

Abstract: The present invention provides an imaging element comprising on a hydrophilic base a light-sensitive layer containing polyvinyl alcohol hydrolyzed to at least an extent of 95% by weight, a cationic surfactant and a diazo resin and/or a diazonium salt characterized in that the light-sensitive layer comprises metal-free phthalocyanine.The present invention also provides a method for obtaining an imaging element as defined in any of the claims 1 to 6 bypreparing a dispersion of metal-free phthalocyanine in water in the presence of a cationic surfactant in an amount ranging from 0.24 g/l to 24 g/l;preparing a light-sensitive composition by mixing said dispersion, polyvinyl alcohol hydrolyzed to at least an extent of 95% by weight and a diazo resin and/or a diazonium salt andcoating said light-sensitive composition on a hydrophilic base, characterized in that said dispersion comprises polyvinyl alcohol hydrolyzed to at least an extent of 95% by weight in an amount ranging from 4.0 g/l to 200 g/l.

Abstract: A photosensitive recording material is described which has a layer base, a negative-working photosensitive layer containing a diazonium salt and a water-insoluble polymeric binder which is soluble or swellable in aqueous alkaline solutions, and a discontinuous top layer which forms a rough surface and which is composed of particles of a water-insoluble polymer which is dispersible in water in the presence of anionic or anionic/nonionic dispersants and which has a content of free acid groups or acid groups neutralized by salt formation of less than 0.8 mmol/g, the mean height of the particles being 2 to 6 .mu.m, the maximum height less than 10 .mu.m, the mean horizontal diameter less than 40 .mu.m, the maximum diameter less than 80 .mu.m and the number of particles being 100 to 10,000 per cm.sup.2. The material is suitable for the production of planographic printing plates and requires only short vacuum times in a vacuum-operated copying frame.

Abstract: A process for producing a water insoluble, aqueous alkali soluble, film forming novolak resin having low metal ions, made by the fractionation of a phenol formaldehyde condensation product, a process for producing a resin a photoresist composition of superior quality containing such novolak resin, and a method for producing a semiconductor device using such photoresist composition.

Abstract: A conformal, substantially uniform thickness layer of photoresist is deposited on a semiconductor wafer by causing photoresist solids to "sediment" out of solution or suspension. Generally, the more conformal the layer, the more uniform the reflectance of the layer and the less variation in underlying feature critical dimension (cd). In order to accommodate possible resulting deviations in photoresist layer thickness causing undesirable reflectance nonuniformities (and cd variations), a top antireflective coating may be applied to the photoresist layer. In the case of a point-by-point lithography process, such as e-beam lithography, the thickness/reflectance variations can be mapped, and exposure doses adjusted accordingly.

Abstract: A photoresist composition comprising an alkali soluble resin and an ortho-naphthoquinone diazide sulfonic acid ester of a polyhydroxy alcohol. The photoresist is characterized by having at least a portion of its free hydroxyl groups on the photoactive compound blocked with an acid labile blocking group that generates a hydroxide upon cleavage.

Abstract: A process for producing a water insoluble, aqueous alkali soluble, film forming novolak resin fraction having a low metal ion content, made by the fractionation of a phenol formaldehyde condensation product, a process for producing a photoresist compositions containing such a novolak resin, and a method for producing a semiconductor device using such a photoresist composition.

Abstract: A water soluble diazonium salt composition made by the condensation of diazoaryl amines and aldehydes and precipitated to form a polymeric anionic species having both ZnCl.sub.4.sup.= and HSO.sub.4.sup.- moieties. These composition are blended with suitable binders, colorants and other optional components to produce light sensitive coating compositions. When applied to aluminum substrates, these light sensitive coating compositions form lithographic printing plates that are especially stable under high humidity conditions. Such plates may be developed by either water alone or by water which contains surfactants and/or a small amount of an organic solvent.

Abstract: The present invention relates to an aqueous alkaline developing solution comprising an alkaline mixture of an alkali metal silicate and/or an alkali metal metasilicate, wherein the M.sub.2 O/SiO.sub.2 molar ratio of said alkaline mixture is in the range of from 0.5 to 1.2, the total content of said alkaline mixture being in the range of from 6 to 15% by weight of the total developing solution, and wherein said developing solution comprises a non-ionic surfactant and at least another surfactant selected from the group consisting of anionic surfactants and amphoteric surfactants. An alkali metal hydroxide can be optionally added to the alkaline mixture. Also claimed is the concentrated developing solution to be diluted to the desired strength.

Abstract: The present invention provides methods for producing TPPA having low level of metal ions, utilizing treated ion exchange resins. A method is also provided for producing photoresist composition having a very low level of metal ions from such TPPA for producing semiconductor devices using such photoresist compositions.

Abstract: Ternary mixtures of C.sub.4 to C.sub.8 alkyl acetate, C.sub.4 to C.sub.8 alkyl alcohol, and water, formulated to have a flash point of above 100.degree. F., are disclosed, particularly for use in edge residue removal processes in the fabrication of integrated circuits and like products.

Abstract: A process of removing trace metal impurities from an impure resist component solution comprising the steps of:(1) forming an impure resist component solution containing trace amounts of dissolved metallic impurities, the resist component solvent selected from the group consisting of ethyl lactate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, propylene glycol methyl ethyl acetate, or mixtures thereof;(2) contacting said impure resist component solution with a mixture of cyclohexane and isopropyl acetate and with an aqueous acidic solution for a sufficient amount of time to form a first two-phase reaction mixture comprising a first aqueous phase containing metallic impurities extracted from said impure resist component solution and a first organic phase containing said resist component solution with a reduced amount of trace metal impurities;(3) separating said first aqueous phase from said first organic phase;(4) contacting said first organic phase with a mixture of water and resist component solvent

Abstract: The present invention provides methods for producing water insoluble, aqueous alkali soluble novolak resins having a precise and consistent molecular weight, by adjusting the concentration of Lewis base. A method is also provided for producing photoresist composition from such novolak resins and for producing semiconductor devices using such photoresist compositions.

Abstract: The invention provides toner for a two-component type developer containing toner particles including a binder resin and magnetic powder dispersed in the binder resin. The binder resin in the toner is made of a composition including a low molecular weight polymer and a high molecular weight polymer both having an anionic group. The magnetic powder is contained in the toner particles in the range of 0.1 to 5 parts by weight per 100 parts by weight of the binder resin.

Abstract: The invention is directed to a process for producing microcapsules containing a diazonium salt compound by the steps of (i) adding a dialkyl sulfate compound represented by the formula: RO--SO.sub.2 --OR, where R is an alkyl or cycloalkyl group having up to 24 carbon atoms, to an organic solvent solution containing a diazonium salt compound and a polyfunctional isocyanate compound, (ii) emulsifying the resulting organic solvent solution into an aqueous solution of ,a water-soluble polymer, and then (iii) polymerizing the polyfunctional isocyanate compound to form microcapsule walls. The invention also discloses the recording material produced by the process.

Abstract: A process for producing microcapsules containing a diazonium salt compound, and a photofixation thermal recording material employing the same. The process comprises adding an organic solvent solution containing both the diazonium salt compound and a polyfunctional isocyanate compound to an aqueous solution of a water-soluble polymer, emulsifying the organic solvent solution into the aqueous solution using an emulsifying agent, and then polymerizing the polyfunctional isocyanate compound to form microcapsule walls, said emulsifying agent comprising an alkyl glucoside represented by formula (I): ##STR1## wherein n is an integer of 0 to 2 and R represents a linear or branched alkyl group having 4 to 18 carbon atoms.

Abstract: The present invention provides methods for producing water insoluble, aqueous alkali soluble novolak resins having a very low level of metal ions and a substantially consistent molecular weight. A method is also provided for producing photoresist composition from such novolak resins and for producing semiconductor devices using such photoresist compositions.

Abstract: A resist material comprises a polysiloxane obtained by hydrolysis and condensation with dehydration of one or more alkoxysilanes having an oxirane ring, or of a mixture of the alkoxysilane(s) having an oxirane ring and one or more alkoxysilanes having no oxirane ring, and an acid generator. The resist material may contain one or more of a spectral sensitizer, an organic polymer having a hydroxyl group or an epoxy compound. Resist patterns are formed by coating an organic polymer on a substrate and then the resist material on the film of the organic polymer to form a two layer resist having a bottom layer of the organic polymer and top layer of the resist material, prebaking, imagewise exposing high radiation, postbaking, and developing the resist with alkaline solutions to remove an unexposed portion of the top layer, and dry etching the bottom layer using the relic of the resist material as a mask. the temperature of the post baking is preferably lower than that of the prebaking.

Abstract: A positive-type photosensitive electrodeposition coating composition comprising a water-soluble or water-dispersible resin having an ionic group and containing at least one modified quinonediazidesulfone unit represented by the following formula (I) or (II) ##STR1## wherein R.sub.1 represents ##STR2## R.sub.2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group, andR.sub.3 represents an alkylene group, a cycloalkylene group, an alkylene ether group,a phenylene group which may optionally be substituted with an alkyl group having 1 to 20 carbon atoms, or an alkylene, cycloalkylene or alkylene ether group containing in its chain a phenylene group which may optionally be substituted with an alkyl group having 1 to 20 carbon atoms, in the molecule.

Abstract: Ternary mixtures of C.sub.4 to C.sub.8 alkyl acetate, C.sub.4 to C.sub.8 alkyl alcohol, and water, formulated to have a flash point of above 100.degree. F., are disclosed, particularly for use in edge residue removal processes in the fabrication of integrated circuits and like products.

Abstract: In a resist composition, a novolak resin including at least one recurring unit of the formula (1): ##STR1## wherein n is an integer of 1 to 4 and m is an integer of 0 to 3, having a weight average molecular weight of 1,000 to 10,000 calculated as polystyrene, and having the hydrogen atom of a hydroxyl group therein replaced by a 1,2-naphthoquinonediazidosulfonyl group in a proportion of 0.03 to 0.27 mol per hydrogen atom serves as an alkali-soluble resin and a photosensitive agent. The composition is uniform in that the photosensitive agent is uniformly incorporated in the novolak resin, and thus forms a uniform resist film. It is a useful positive resist having improved sensitivity, resolution, heat resistance, and film retentivity.

Abstract: A positive-type photosensitive resin composition containing a resin which results from reactions between a specific polyepoxide compound, a carboxylic acid compound having a specific phenolic hydroxyl group, a carboxylic acid compound having no specific phenolic hydroxyl group, and 1,2-quinone diazide sulfonyl halide. The resin composition has high exposure sensitivity, is capable of inhibiting swell or dissolution of unexposed areas during the stage of development, and yet retains other favorable properties. The resin composition has also attained short developing time.

Abstract: Photoresists are disclosed that display increased sensitivity, measured as lithographic potential, when compared to known photoresists that contain melamine resin as a crosslinker. The melamine resin in these photoresists contains a higher percent by weight of monomeric hexamethoxymethylmelamine than in known resists.

Abstract: Photopolymeric printing plates are presented wherein and electrochemically etched and anodized, silicated aluminum substrate has a single photosensitive coating thereon composed of a photopolymerizable combination which includes a photopolymerizable pigment dispersion, a photosensitive lithographic diazonium resin, multifunctional acrylate oligomer, multifunctional acrylate monomer, photopolymerizable binder and photoinitiator to yield a non-tacky, mar resistant, easily developed durable plate. In a preferred embodiment, an additional aqueous, non-photosensitive overcoat is applied over the initial coating to retard oxygen inhibition.

Abstract: The present invention relates to a process for producing a negative-working photosensitive lithographic printing form, in which a negative-working photosensitive mixture which is dissolved in a solvent mixture and which contains a negative-working photosensitive compound and a polymeric binder which is insoluble in water but soluble in aqueous alkaline solution is applied to a base and the layer obtained is subsequently dried, which process comprises using a mixture of more than 2% by weight of at least one monoether of diethylene glycol with one or more organic solvent(s) having a boiling point below 200.degree. C. as the solvent mixture.

Abstract: Radiation-sensitive polymers, a mixture containing these radiation-sensitive polymers as binder, and a process for the preparation of the radiation-sensitive polymer binders are disclosed. A positive radiation-sensitive recording material containing the radiation-sensitive polymer is also disclosed.

Abstract: A conformal, substantially uniform thickness layer of photoresist is deposited on a semiconductor wafer by causing photoresist solids to "sediment" out of solution or suspension. Generally, the more conformal the layer, the more uniform the reflectance of the layer and the less variation in underlying feature critical dimension (cd). In order to accommodate possible resulting deviations in photoresist layer thickness causing undesirable reflectance nonuniformities (and cd variations), a top antireflective coating may be applied to the photoresist layer. In the case of a point-by-point lithography process, such as e-beam lithography, the thickness/reflectance variations can be mapped, and exposure doses adjusted accordingly.

Abstract: The invention relates to radiation sensitive compositions having high uniformity when deposited as thick films. The compositions of the invention comprise a radiation sensitive component and a resin binder blend. The resin binder blend is a mixture of an aliphatic novolak resin component and an aromatic novolak resin component.