And Monomeric Processing Ingredient Patents (Class 430/191)
  • Patent number: 10720259
    Abstract: A method for manufacturing an electroconductive pattern 40, provided with: a lamination step for laminating an acid generation film 10 containing an acid proliferation agent and a photoacid generator on a polymer film 20 containing an electroconductive polymer formed on a substrate 21; a masking step for masking the top of the acid generation film 10; a light irradiation step for irradiating the laminate from the acid-generation-film 10 side; a doping step for doping the electroconductive polymer with an acid generated and proliferated in the acid generation film 10 by the light irradiation; and a releasing step for releasing the acid generation film 10 from the polymer film 20. This method makes it possible to provide an electroconductive film and a method for manufacturing an electroconductive pattern in which photoacid generation and acid proliferation effects are utilized.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: July 21, 2020
    Assignees: TOKYO UNIVERSITY OF SCIENCE FOUNDATION, NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Koji Arimitsu, Makoto Wakabayashi
  • Patent number: 10604859
    Abstract: A method for forming a pattern in which a plating layer is selectively formed on a base material using a resin layer as a mask, includes resin layer-forming in which the resin layer is formed on the base material; and patterning in which the resin layer is selectively removed, in which in the patterning, a part of the resin layer is sublimed by heating to be removed.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: March 31, 2020
    Assignee: Seiko Epson Corporation
    Inventor: Takuya Miyakawa
  • Patent number: 10526266
    Abstract: The composition contains an alkali-soluble resin and a crosslinking agent that is represented by the following General Formula (I). In the formula, each of R1 and R6 independently represents a hydrogen atom or a hydrocarbon group having 5 or less carbon atoms; each of R2 and R5 independently represents an alkyl group, a cycloalkyl group, an aryl group, or an acyl group; and each of R3 and R4 independently represents a hydrogen atom or an organic group having 2 or more carbon atoms, and R3 and R4 may be bonded to each other to form a ring.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: January 7, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Natsumi Yokokawa, Hidehiro Mochizuki, Koutarou Takahashi, Shuhei Yamaguchi
  • Patent number: 10520813
    Abstract: A method includes forming a photoresist layer over a substrate, wherein the photoresist layer includes a polymer, a sensitizer, and a photo-acid generator (PAG), wherein the sensitizer includes a resonance ring that includes nitrogen and at least one double bond. The method further includes performing an exposing process to the photoresist layer. The method further includes developing the photoresist layer, thereby forming a patterned photoresist layer.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: December 31, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Wei-Han Lai, Chin-Hsiang Lin, Chien-Wei Wang
  • Patent number: 10457779
    Abstract: The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X1 represents a tetravalent organic group; and R1 represents a group shown by the following general formula (2), wherein the dotted line represents a bond; Y1 represents an organic group with a valency of k+1; “k” represents 1 or 2; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition and usable as a base resin of a photosensitive resin composition.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: October 29, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Katsuya Takemura, Hiroyuki Urano, Masashi Iio, Masayoshi Sagehashi, Koji Hasegawa
  • Patent number: 10162260
    Abstract: The invention shows a photosensitive resin composition which can be used in protective film and liquid crystal display element and provides good transparency and high chemical resistance. The composition includes a complex resin (A), an o-naphthoquinone diazide sulfonate (B), and a solvent (C). The complex resin (A) includes a main chain and a side chain. The main chain includes a repeating unit derived from siloxane (meth)acrylate based monomer (a1-2). The side chain includes a repeating unit derived from siloxane based monomer (a2), and is bonded to the repeating unit derived from siloxane (meth)acrylate based monomer (a1-2). The complex resin (A) satisfies at least one of the following conditions (I) and (II): Condition (I): the main chain further includes a repeating unit derived from unsaturated monomer (a1-1) including a carboxylic acid or a carboxylic anhydride. Condition (II): the siloxane based monomer (a2) includes a monomer (a2-1) represented by formula (A-4).
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: December 25, 2018
    Assignee: Chi Mei Corporation
    Inventors: Chih-Hang Hsu, Ming-Ju Wu, Chun-An Shih
  • Patent number: 10120281
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes an alkali-soluble resin (A) having a phenolic hydroxyl group, and a crosslinking agent (C) having two or more hydroxymethyl groups or alkoxymethyl groups in total within the molecule, wherein the composition contains a crosslinking agent (C1) having a molecular weight of 420 or more and also having two to four hydroxymethyl groups or alkoxymethyl groups in total within the molecule in a proportion of 60 mol % to 100 mol % based on the total amount of the crosslinking agent (C) including the crosslinking agent (C1), and in which the total concentration of the hydroxymethyl groups or the alkoxymethyl groups of the crosslinking agent (C) relative to 1 g of the solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 0.30 mmol/g or more.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: November 6, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Koutarou Takahashi, Tomotaka Tsuchimura, Shuhei Yamaguchi, Natsumi Yokokawa, Hidehiro Mochizuki
  • Patent number: 9698014
    Abstract: A photoresist composition and a method for forming a patterned photoresist, and a method for forming an integrated circuit pattern are provided. A photoresist composition is provided. The photoresist composition includes a first polymer, a second polymer; and a solvent. The first polymer is more soluble than the second polymer in an aqueous solution, and the first polymer has a higher etching resistance than the second polymer.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 4, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Tsung-Pao Chen, Sheng-Min Chuang, Teng-Kuei Chuang
  • Patent number: 9529260
    Abstract: The present invention provides a photosensitive insulated resin composition and method of producing an insulated film thereof. The photosensitive insulated resin composition, which comprises the following components, can be evenly coated on a surface step of a substrate in order to form a fully covered insulate film. an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130° C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130° C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30° C.˜100° C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92˜40:60.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: December 27, 2016
    Assignee: eChem Solutions Corp.
    Inventors: Che Wei Chang, Ming Che Chung
  • Patent number: 9488913
    Abstract: Provided is a method of fabricating a semiconductor device. A substrate is provided. A material layer is formed over the substrate. A photoresist layer is formed over the material layer. The photoresist layer contains a polymer. The polymer includes an acid labile group (ALG) that is linked to a plurality of carboxylic acid function groups. The photoresist layer is then patterned using a lithography process, for example an extreme ultraviolet (EUV) lithography process.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: November 8, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Han Lai, Ching-Yu Chang
  • Patent number: 9482943
    Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: November 1, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Ji-Yun Kwon, Jin-Hee Kang, Dae-Yun Kim, Sang-Kyeon Kim, Sang-Soo Kim, Yong-Tae Kim, Kun-Bae Noh, Eun-Bi Park, Jae-Yeol Baek, Jae-Hwan Song, Eun-Kyoung Youn, Bum-Jin Lee, Jong-Hwa Lee, Jin-Young Lee, Chung-Beum Hong, Eun-Ha Hwang, In-Chul Hwang
  • Patent number: 9405188
    Abstract: Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: August 2, 2016
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jong-Hwa Lee, Ji-Yun Kwon, Sang-Soo Kim, Kun-Bae Noh, Eun-Bi Park, Jae-Yeol Baek, Bum-Jin Lee, Sang-Haeng Lee, Eun-Ha Hwang
  • Patent number: 9366959
    Abstract: A negative photosensitive resin composition including an alkali-soluble resin (A), a photoacid generator (B), a basic compound (C), a cross-linking agent (D), and a solvent (E) is provided. The alkali-soluble resin (A) includes an acrylate resin (A-1) and a novolac resin (A-2). The acrylate resin (A-1) is synthesized by polymerizing a monomer for polymerization, wherein the monomer for polymerization includes an unsaturated carboxylic acid or unsaturated carboxylic acid anhydride monomer (a-1-1) and a monomer (a-1-2). The monomer (a-1-2) includes a compound (a-1-2-1) with a tricyclodecane or dicyclopentadiene structure, a compound (a-1-2-2) represented by formula (1), or a combination of both. The novolac resin (A-2) is synthesized by polymerizing an aldehyde compound with an aromatic hydroxy compound, wherein the aromatic hydroxy compound includes a xylenol compound.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: June 14, 2016
    Assignee: Chi Mei Corporation
    Inventor: Yu-Jie Tsai
  • Patent number: 9348229
    Abstract: A hardmask composition includes a polymer including a moiety represented by the following Chemical Formula 1 and a solvent. In the above Chemical Formula 1, A and B are as defined in the specification.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: May 24, 2016
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Youn-Hee Nam, Hea-Jung Kim, Sang-Kyun Kim, Sung-Hwan Kim, Yun-Jun Kim, Joon-Young Moon, Hyun-Ji Song
  • Patent number: 9309446
    Abstract: The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: April 12, 2016
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuyuki Mitsukura, Takashi Kawamori, Takashi Masuko, Shigeki Katogi
  • Patent number: 9268221
    Abstract: Provided is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by Chemical Formula 1 and a repeating unit represented by Chemical Formula 2, and having a thermally polymerizable functional group at least one terminal end; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. A photosensitive resin film fabricated using the positive photosensitive resin composition is provided.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: February 23, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Ji-Young Jeong, Min-Kook Chung, Jong-Hwa Lee, Mi-Ra Im, Hyun-Yong Cho, Myoung-Hwan Cha, Hwan-Sung Cheon
  • Patent number: 9261788
    Abstract: The invention provides a compound for forming an organic film having a partial structure represented by the following formula (i) or (ii), wherein the ring structures Ar1, Ar2 and Ar3 each represent a substituted or unsubstituted benzene ring or naphthalene ring; e is 0 or 1; R0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; L0 represents a linear, branched or cyclic divalent organic group having 1 to 32 carbon atoms; and the methylene group constituting L0 may be substituted by an oxygen atom or a carbonyl group. There can be provided an organic film composition for forming an organic film having high dry etching resistance as well as advanced filling/planarizing characteristics.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: February 16, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Seiichiro Tachibana, Daisuke Kori, Tsutomu Ogihara, Takeru Watanabe, Kazumi Noda, Toshiharu Yano
  • Patent number: 9188864
    Abstract: Provided are photoresist compositions useful in forming photolithographic patterns by a negative tone development process. Also provided are methods of forming photolithographic patterns by a negative tone development process and substrates coated with the photoresist compositions. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: November 17, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Young Cheol Bae, Deyan Wang, Thomas Cardolaccia, Seokho Kang, Rosemary Bell
  • Patent number: 9176381
    Abstract: This disclosure relates to a positive photosensitive resin composition including (A) a resin precursor including a polybenzoxazole precursor, a polyamic acid, or a combination thereof, (B) a dissolution-controlling agent having a boiling point ranging from about 210° C. to about 400° C. and a polarity ranging from about 1 D to about 4 D, (C) an acid generator, (D) a silane-based compound, and (E) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical Formula 1, or both of repeating units represented by Chemical Formulae 1 and 2 and has a thermally polymerizable functional group at at least one end. The polyamic acid includes a repeating unit of Chemical Formulae 50 and 51.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: November 3, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Jeong-Woo Lee, Yong-Sik Yoo, Hyun-Yong Cho, Ji-Young Jeong, Doo-Young Jung, Jong-Hwa Lee, Min-Kook Chung, Myoung-Hwan Cha, Hwan-Sung Cheon
  • Patent number: 9158006
    Abstract: Provided is a composition for reflective film comprising a polyvinyl acetal resin, an epoxidized vegetable oil, a solvent, a coupling agent and titanium oxide.
    Type: Grant
    Filed: July 13, 2009
    Date of Patent: October 13, 2015
    Assignee: TOSHIBA ELECTRON TUBES & DEVICES CO., LTD.
    Inventors: Shinetsu Fujieda, Katsuhisa Homma, Akiko Suzuki, Tatsuoki Kono
  • Patent number: 9051429
    Abstract: Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention. In addition, a metal foil and the polyimide resin formed from the cyclization have excellent adhesive strength, high flat degree, and excellent electrical property.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: June 9, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Li-Ming Chang, Charng-Shing Lu, Shur-Fen Liu, Jinn-Shing King
  • Patent number: 9040213
    Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. In Chemical Formula 1, each substituent is the same as defined in the detailed description.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: May 26, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Hyun-Yong Cho, Sang-Soo Kim, Eun-Kyung Yoon, Jong-Hwa Lee, Jun-Ho Lee, Eun-Ha Hwang, Ji-Yun Kwon, Jin-Young Lee
  • Patent number: 9023559
    Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: May 5, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Jong-Hwa Lee, Hyun-Yong Cho, Mi-Ra Im, Hwan-Sung Cheon, Min-Kook Chung, Ji-Young Jeong, Myoung-Hwan Cha
  • Patent number: 9012122
    Abstract: A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: April 21, 2015
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Patent number: 9012595
    Abstract: The present invention provides polyimide applied to the buffer coating of semiconductors and a photosensitive resin composition including the same. The polyimide is a polyimide polymer represented by Chemical Formula 1 below. Further, the present invention provides a photosensitive resin composition, including 1) BDA-series soluble polyimide having an i-ray permeability of 70% or more; 2) a polyamic acid having elongation of 40% or more; 3) a novolak resin, and 4) diazonaphthoquinone-series photosensitive substance and having a high resolution, high sensitivity, an excellent film characteristic, and mechanical physical properties which are the requirements of semiconductor buffer coating.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: April 21, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Sang Woo Kim, Chanhyo Park, Kyungjun Kim, Hyeran Seong, Sejin Shin, Hye Won Jeong, Jung Ho Jo
  • Patent number: 8980506
    Abstract: The present invention relates to a photosensitive resin composition, which comprises an alkali-soluble resin (A), a compound (B) containing vinyl unsaturated group(s), a photoinitiator (C), ortho-naphthoquinone diazide sulfonic acid ester (D), a thermal initiator (E) and a solvent (F). The photosensitive resin composition added with the ortho-naphthoquinone diazide sulfonic acid ester (D) and the thermal initiator (E) can have excellent resolution and development adherence. Moreover, the present invention further provides a spacer or a protective film formed by the aforementioned photosensitive resin composition, as well as a liquid crystal display device (LCD) including the aforementioned spacer or protective film.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: March 17, 2015
    Assignee: Chi Mei Corporation
    Inventors: I-Chun Hsieh, Hao-Wei Liao
  • Patent number: 8940470
    Abstract: A material for a microlens having heat resistance, high resolution and high light-extraction efficiency is provided. A positive resist composition comprises an alkali-soluble polymer containing a unit structure having an aromatic fused ring or a derivative thereof, and a compound having an organic group which undergoes photodecomposition to yield an alkali-soluble group. The positive resist composition has coating film properties of a refractive index at a wavelength of 633 nm of 1.6 or more and a transmittance at wavelengths of 400 to 730 nm of 80% or more. A pattern forming method comprises applying the positive resist composition, drying the composition, exposing the composition to light, and developing the composition.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: January 27, 2015
    Assignee: Nissan Chemical Industries, Inc.
    Inventors: Takayuki Negi, Takahiro Sakaguchi, Takahiro Kishioka
  • Patent number: 8936891
    Abstract: The invention relates to a photosensitive polysiloxane composition that has good thermal transmittance, good chemical resistance and good sensitivity and good refractivity. The invention also provides a method for forming a thin film on a substrate, a thin film on a substrate and an apparatus.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: January 20, 2015
    Assignee: Chi Mei Corporation
    Inventors: Ming-Ju Wu, Chun-An Shih
  • Patent number: 8927189
    Abstract: A photoresist composition including a binder resin including a novolac resin represented by Chemical Formula 1, a diazide photosensitive initiator, and a solvent including a base solvent and an auxiliary solvent, wherein the base solvent includes propylene glycol monomethyl ether acetate, and the auxiliary solvent includes dimethyl-2-methylglutarate and ethyl beta-ethoxypropionate, wherein in Chemical Formula 1, R1 to R9 are each independently a hydrogen atom or an alkyl group, “a” is an integer number from 0 through 10, “b” is an integer number from 0 through 100, and “c” is an integer number from 1 through 10.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: January 6, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Gwui-Hyun Park, Pil Soon Hong, Jinho Ju, Taegyun Kim, Jin-Su Byun, Dong Min Kim, Seung Ki Kim, Doo Youn Lee
  • Patent number: 8921019
    Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: December 30, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Ji-Yun Kwon, Jin-Hee Kang, Dae-Yun Kim, Sang-Kyeon Kim, Sang-Kyun Kim, Sang-Soo Kim, Kun-Bae Noh, Eun-Kyung Yoon, Jong-Hwa Lee, Jun-Ho Lee, Jin-Young Lee, Hwan-Sung Cheon, Hyun-Yong Cho, Chung-Beom Hong, Eun-Ha Hwang
  • Patent number: 8921024
    Abstract: A photosensitive polysiloxane composition for forming a protective film having superior sensitivity is disclosed. A protective film formed from the photosensitive polysiloxane composition and an element including the protective film are also disclosed. The photosensitive polysiloxane composition includes a polysiloxane, an o-naphthoquinonediazidesulfonic acid ester, a urethane(meth)acrylate compound having at least six (meth)acryloyl groups in a molecule, and a solvent.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: December 30, 2014
    Assignee: Chi Mei Corporation
    Inventors: Ming-Ju Wu, Chun-An Shih
  • Patent number: 8883391
    Abstract: Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350° C. or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: November 11, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Tomotsugu Miyabe, Yoji Fujita
  • Patent number: 8859170
    Abstract: Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: October 14, 2014
    Assignee: PI R&D Co., Ltd.
    Inventors: Toshiyuki Goshima, Maw Soe Win, Sigemasa Segawa, Eika Kyo
  • Patent number: 8846297
    Abstract: A positive photoresist composition includes 3 to 80 parts by mass of a novolac phenol resin (B) relative to 100 parts by mass of a cresol novolac resin (A).
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: September 30, 2014
    Assignee: DIC Corporation
    Inventors: Tomoyuki Imada, Takakazu Kage, Norifumi Imaizumi
  • Patent number: 8841050
    Abstract: A photosensitive resin composition includes: an alkali-soluble resin; an o-naphthoquinonediazidesulfonic acid ester; a silsesquioxane having at least two thiol groups in a molecule; and a solvent. The silsesquioxane is obtained by subjecting to condensation a silane material which includes a thiol-group-containing silane represented by RaSi(ORb)3. Ra represents a C1-C8 organic group that contains a thiol group and that is free from an aromatic group, or an organic group that contains a thiol group and an aromatic group. Rb independently represents hydrogen, a C1-C6 alkyl group, a C1-C6 acyl group, or a C6-C15 aromatic group.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: September 23, 2014
    Assignee: Chi Mei Corporation
    Inventors: Kai-Min Chen, Chun-An Shih
  • Patent number: 8835091
    Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, and etching away the sacrificial film pattern through an aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) coating a substrate with a composition comprising a cresol novolac resin, a crosslinker, and a photoacid generator, (B) heating to form a sacrificial film, (C) patternwise exposure, (D) development to form a sacrificial film pattern, and (E) forming crosslinks within the cresol novolac resin.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: September 16, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Patent number: 8815489
    Abstract: Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: August 26, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Ji-Young Jeong, Jin-Young Lee, Jong-Hwa Lee, Hyun-Yong Cho, Sang-Soo Kim, Eun-Kyung Yoon, Jun-Ho Lee, Myoung-Hwan Cha, Eun-Ha Hwang
  • Patent number: 8785103
    Abstract: Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R11, R12, R13, and R14 in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: July 22, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Jong-Hwa Lee, Hyun-Yong Cho, Min-Kook Chung, Ji-Young Jeong, Myoung-Hwan Cha
  • Patent number: 8758977
    Abstract: A negative-type photosensitive resin composition which is good in sensitivity and resolution, a pattern forming method by the use thereof wherein a pattern which can be developed in an alkali aqueous solution, is excellent in sensitivity, resolution and heat resistance and has a good shape is obtained, and highly reliable electronic parts are provided. The negative-type photosensitive rein composition includes (a) a polymer that has a phenolic hydroxyl group at a terminal and is soluble in the alkali aqueous solution, (b) a compound that generates an acid by irradiating active light, and (c) a compound that can be crosslinked or polymerized by an action of the acid.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: June 24, 2014
    Assignee: Hitachi Chemical DuPont MicroSystems, Ltd.
    Inventor: Tomonori Minegishi
  • Patent number: 8758976
    Abstract: The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: June 24, 2014
    Assignee: LG Chem Ltd.
    Inventors: Hye-Ran Seong, Chan-Hyo Park, Dong-Hyun Oh, Hye-In Shin, Kyung-Jun Kim, Se-Jin Shin
  • Patent number: 8753790
    Abstract: Embodiments in accordance with the present invention encompass self-imageable film forming compositions that comprise norbornene-type polymers and that can be formulated to be either positive tone imaging or negative tone. The films formed thereby are useful in the forming of microelectronic and optoelectronics devices.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: June 17, 2014
    Assignee: Promerus, LLC
    Inventors: Osamu Onishi, Haruo Ikeda, Larry Rhodes, Paul Evans, Edmund Elce, Andrew Bell, Chad Brick, Hendra Ng, Pramod Kandanarachchi
  • Patent number: 8748074
    Abstract: Polymers and compositions for forming self-imageable films encompassing such polymers that encompass norbornene-type repeating unit having at least one phenolic functionality and maleic anhydride-type repeating unit, which can be formulated to be either positive tone imaging or negative tone imaging. The films formed thereby are useful as self-imageable layers in the manufacture of microelectronic, such as semiconductor, and optoelectronic devices.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: June 10, 2014
    Assignees: Promerus, LLC, Sumitomo Bakelite Co., Ltd.
    Inventors: Osamu Onishi, Haruo Ikeda, Larry F. Rhodes, Pramod Kandanarachchi
  • Patent number: 8748850
    Abstract: An energy application device applies optical energy on an adhesion sheet by a light radiator and, subsequently, applies heat energy on the adhesion sheet by a heater. With this arrangement, even the adhesion sheet, which includes an adhesive layer having an energy barrier that cannot be overcome only with optical energy, is enabled to start a photoreaction by overcoming an energy barrier with the heat energy from the heater.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: June 10, 2014
    Assignee: Lintec Corporation
    Inventor: Kimihiko Kawasaki
  • Patent number: 8735029
    Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. The Chemical Formula 1 is the same as defined in the detailed description.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: May 27, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Eun-Kyung Yoon, Eun-Ha Hwang, Jong-Hwa Lee, Ji-Yun Kwon, Dae-Yun Kim, Sang-Kyeon Kim, Sang-Kyun Kim, Sang-Soo Kim, Kun-Bae Noh, Jun-Ho Lee, Jin-Young Lee, Hyun-Yong Cho, Chung-Beom Hong
  • Patent number: 8709552
    Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: April 29, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Kazuto Miyoshi, Mika Koshino, Masao Tomikawa
  • Patent number: 8703367
    Abstract: A positive photosensitive resin composition includes: (A) a polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a polyamic acid ester compound; and (E) a solvent. The positive photosensitive resin composition can reduce film shrinkage, can have high sensitivity, high resolution, and excellent residue removal properties, and can provide good pattern shapes.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: April 22, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Hyun-Yong Cho, Doo-Young Jung, Yong-Sik Yoo, Ji-Young Jeong, Jong-Hwa Lee, Min-Kook Chung, Kil-Sung Lee, Myoung-Hwan Cha
  • Patent number: 8697320
    Abstract: Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: April 15, 2014
    Assignees: Cheil Industries Inc., Samsung Electronics Co., Ltd.
    Inventors: Ji-Young Jeong, Min-Kook Chung, Hyun-Yong Cho, Yong-Sik Yoo, Jeong-Woo Lee, Jong-Hwa Lee, Hwan-Sung Cheon, Soo-Young Kim, Young-Ho Kim, Jae-Hyun Kim, Su-Min Park
  • Patent number: 8652749
    Abstract: A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. and R1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: February 18, 2014
    Assignees: Samsung Display Co., Ltd., AZ Electronic Materials (Korea) Ltd.
    Inventors: Hi-Kuk Lee, Sang-Hyun Yun, Cha-Dong Kim, Jung-In Park, Deok-Man Kang, Youn-Suk Kim, Sae-Tae Oh
  • Patent number: 8647806
    Abstract: The present invention is related to a photosensitive resin composition containing: a vinyl-based copolymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group and a carboxyl group-containing vinyl monomer (b); a quinonediazide compound (II) and a compound (III) represented by the following formula (5), and to a photosensitive dry film and a method for forming a patter by using the photosensitive resin composition.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: February 11, 2014
    Assignees: Micro Process Inc, Everlight Chemical Industrial Corporation, Mitsubishi Rayon Co., Ltd.
    Inventors: Akifumi Ueda, Hidetaka Nakagawara, Kazuo Watanabe, Shigeki Watanabe, Wei Jen Lan, Chao Wen Lin
  • Patent number: 8647807
    Abstract: A photosensitive resin composition comprising: a vinyl-based polymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group; a vinyl-based polymer (II) obtained by polymerizing a monomer mixture containing a carboxyl group-containing vinyl monomer (b), and having a weight average molecular weight of 20,000 to 100,000, provided that the vinyl-based polymer (I) is excluded; a quinonediazide compound (III); and a compound (IV) represented by following formula (5). [In the formula, Y is a hydrocarbon group of 1 to 6 carbon atoms; l and m are each independently an integer of 1 to 3; n is 1 or 2; p and q are each independently 0 or 1.].
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: February 11, 2014
    Assignees: Micro Process Inc., Everlight Chemical Industrial Corporation, Mitsubishi Rayon Co., Ltd.
    Inventors: Akifumi Ueda, Hidetaka Nakagawara, Kazuo Watanabe, Shigeki Watanabe, Wei Jen Lan, Chao Wen Lin