Abstract: An adhesive sheet having a substrate and an adhesive layer laminated on one or both surfaces of the substrate, and which has an anti-static performance, is described. At least one of the adhesive layers contains an adhesive and a compound (1) represented by the following formula (1), and contains the compound (1) in an amount of from 0.1 to 100 parts by mass on the basis of 100 parts by mass of the adhesive. In the formula, R1 is a (meth)acryloyl group; R2 is a C1-4 alkylene group; and n is an integer of from 1 to 20, such as 4 to 16.

Abstract: A method of forming a semiconductor structure includes forming a photoresist layer over a substrate. The photoresist layer includes a first material removable by a removal process. The first material at a guard band portion of the photoresist layer along an edge portion of the photoresist layer is converted to a second material. The second material is not removable by the removal process. Also, the first material at the edge portion of the photoresist layer is not converted to the second material. The guard band portion is farther from a periphery of the substrate than the edge portion. The removal process is performed to remove the first material after the conversion of the guard band portion.

Abstract: A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

Abstract: A printed mask derived from a composition comprised of at least one compound including at least one alkaline-hydrolyzable group, at least one compound including at least one ethylene oxide group and at least one ultraviolet radiation blocking agent, wherein the printed mask is removable using an alkaline solution in about 30 seconds or less.

Abstract: Methods for removing a photoresist from a metal-comprising material are provided. In accordance with an exemplary embodiment of the present invention, the method comprises applying to the photoresist a substantially non-aqueous-based solvent having a pH no less than about 9 or no pH and subsequently applying to the metal-comprising material an aqueous-based fluid having a pH no less than about 9.

Abstract: A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

Abstract: A metallization forming method comprises the steps of: patterning a silver halide emulsion on a surface of at least one side of a substrate in accordance with a desired metallization pattern to form a patterned emulsion layer; exposing the patterned emulsion layer; and thereafter developing the exposed patterned emulsion layer to form a patterned conductive silver layer having the metallization pattern.

Abstract: A method of making a microstructure includes selectively activating a portion of a surface of a silicon-containing elastomer, contacting the activated portion with a substance, and bonding the activated portion and the substance, such that the activated portion of the surface and the substance in contact with the activated portion are irreversibly attached. The selective activation may be accomplished by positioning a mask on the surface of the silicon-containing elastomer, and irradiating the exposed portion with UV radiation.

Abstract: A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

Abstract: The present invention provides a halogen-free dry film photosensitive resin composition, which comprises (a) 10˜60 wt % of at least two kinds of acrylic resins having unsaturated carboxylic acid monomers as polymerized units; (b) 5˜20 wt % of a photosensitive resin having at least two (meth)acrylate groups; (c) 0.1˜15 wt % of a photoinitiator; and (d) 0.5˜20 wt % of a thermo-curing agent. The resin composition of the invention is suitable for use as a photoresist in the process of producing printed circuit boards. The resin composition of the invention is particularly suitable for use in the surface of printed circuit boards or semiconductor packages as a protective dry film solder mask.

Abstract: The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 ?m and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist; whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20–90 wt % of an alkaline soluble binder oligomer or polymer; (b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a); (c) from 0.01 to 20% by weight of one or more photoinitiators; (d) from 0 to 20% by weight of additives and/or assistants; and (e) from 0.

Abstract: The invention is directed to a photo-imageable composition precursor, the precursor composition comprising: (I) finely divided particles of inorganic material comprising: Functional phase particles selected from electrically conductive, resistive, and dielectric particles; inorganic binder having a glass transition temperature in the range of from 325 to 600° C.

Abstract: A method for removing a resist pattern having a resist pattern forming step of forming a resist pattern on a substrate using a chemically amplified positive resist composition and a removing step of removing the resist pattern from the substrate using a solvent, a composition prepared by dissolving (A) an alkali soluble resin having a hydroxyl group in the side chain, (B) a photo acid generator and (C) a compound represented by the following general formula (I): H2C?CH—O—R1—O—CH?CH2??(I) ?wherein R1 represents an alkylene group having 1 to 10 carbon atoms or the like, in an organic solvent being used as the chemically amplified positive resist composition, the method further having a heat treatment step of heat-treating the substrate on which the resist pattern is formed at a temperature of 150 to 400° C. between the resist pattern forming step and the removing step.

Abstract: The photosensitive film for circuit formation of the present invention has: on a first film (base film), a photosensitive layer having a thickness of 0.1 to 10 ?m; or a photosensitive layer having a thickness of 0.1 to 14 ?m and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.

Abstract: The present invention relates to a thinner composition for removing resist used in TFT-LCD manufacturing processes, and more particularly to a thinner composition for removing resist that comprises: a) 0.1 to 5 wt % of an inorganic alkali compound; b) 0.1 to 5 wt % of an organic amine; c) 0.1 to 30 wt % of an organic solvent; d) 0.01 to 5 wt % of a surfactant comprising an ionic surfactant and a non-ionic surfactant in the weight ration of 1:5 to 1:25; and e) 60 to 99 wt % of water. The thinner composition for removing resist of the present invention has good efficiency of removing unwanted resist film constituents formed on the edge of the resist film or at the back of the substrate in TFT-LCD device and semiconductor device manufacturing processes. Also, it does not have the problem of equipment corrosion.

Abstract: Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.

Abstract: The present invention provides a positive photosensitive resin composition comprising (A) a positive photosensitive resin, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more; a positive photosensitive dry film prepared by applying the photosensitive resin composition to a surface of support film, followed by drying, to form a photosensitive resin layer; and a method of forming a pattern using the resin composition or the dry film.

Abstract: A photosensitive transfer material comprising a temporary support, a thermoplastic resin layer, an alkali-soluble intermediate layer, and an alkali-soluble photosensitive resin layer including a pigment in this order, wherein, when the thermoplastic resin layer and the intermediate layer are separated from each other at a separation speed of 1 m/min under an atmosphere of 25° C. and 30% RH, both an absolute value of a surface potential of the separated thermoplastic resin layer and that of the separated intermediate layer are no more than 5 kV; and a method for producing a color filter by using the photosensitive transfer material.

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

Abstract: A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

Abstract: A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.

Abstract: The present invention is directed to a photo-sensitive laminate film for use in making an image mask for etching an image on a substrate. In a first preferred embodiment, the photo-sensitive laminate film comprises a support sheet having a first surface and a second surface, a layer of polymer resin composition having photocrosslinkability, the layer of polymer resin composition having a first surface and a second surface, and a fractionally-releasable bonding layer located between the first surface of the support sheet and the second surface of the layer of polymer resin composition. Upon the creation of an image mask from the layer of polymer resin composition, the image mask is capable of being separated from the first surface of the support sheet such that at least a portion of the bonding layer located between the image mask and the first surface of the support sheet is released from the support sheet with the image mask, and the remaining portion of the bonding layer remains with the support sheet.

Abstract: An alkylsiloxane-containing epoxy resin composition can suitably be used as water-repellent agent or a water-repellent coating to be advantageously applied to areas that are apt to be brought into contact with solutions and substances containing one or more than one components that can damage the film forming property and the adhesion of an ordinary water-repellent agent. The resin composition comprises at least an alkylsiloxane-containing epoxy resin having two or more than two alkylsiloxane groups and two or more than two cyclic aliphatic epoxy groups in a molecule and a cationic polymerization catalyst.

Abstract: The present invention relates to a photosensitive transfer material comprising a temporary support and a thermoplastic resin layer, an alkali-soluble intermediate layer and an alkali-soluble photosensitive resin layer containing a pigment which layers are disposed in this order on the support, wherein the ratio (Em/Ep) of the elastic modulus Em of the intermediate layer to the elastic modulus Ep of the thermoplastic resin layer is in the range of 0.8 to 2.0.

Abstract: The present invention is directed to a process for separating polyester materials from various coating materials. In general, the process includes the steps of mixing polyester materials which have coatings adhered to the surface with an alkaline composition in a mixer. The alkaline composition contains a solution of a Group I alkaline compound and a Group II alkaline compound. The mixer imparts sufficient energy to the slurry to provide substantially complete, even coating of the polyester containing materials with the alkaline composition and cause separation of the coating materials from the surface of the polyester substrate. The mixture can be dried causing the remaining coating materials to form a dry powder mixed with the polyester substrate. After drying, the coating materials can be substantially removed from the polyester substrate by one or more dry separation techniques.

Abstract: A photosensitive transfer recording material includes a temporary support having sequentially disposed thereon a thermoplastic resin layer, an alkali-soluble intermediate layer, and an alkali-soluble pigment-containing photosensitive resin layer, with the intermediate layer containing a polymer latex. The glass transition temperature of the polymer latex is 60° C. or less. Also disclosed is a process for producing a color filter including the photosensitive transfer recording material.

Abstract: A line slit nozzle for spraying steam is disposed along a diameter of a resist film. Steam containing a mist is sprayed onto a surface of the resist film. The film is thereby peeled off and removed. By using a change in physical properties (swelling, etc.) of the resist film by water, the film is easily and surely peeled off. Breakaway from much resources/energy consumption type techniques is realized. In other words, realized are environment-symbiosis type techniques by which resist films can be removed independently of the quantity of energy and kinds of chemical solvents.

Abstract: The invention provides a colored photosensitive resin composition for forming a colored image on a transparent substrate, the colored photosensitive resin composition comprising: an alkali-soluble binder, one of a monomer and an oligomer having at least two ethylenic unsaturated double bonds, one of a photopolymerization initiator and a photopolymerization initiating system, and a pigment, said alkali-soluble binder comprising a copolymer including a structural unit having a carboxyl group, a structural unit represented by the following general formula (1), and a structural unit comprising a (meth)acrylate having at least one of an aromatic ring and an alicyclic ring:

Abstract: A method of manufacturing a panel assembly used to assemble a display panel intends to achieve an alignment-free between barrier ribs and a fluorescent layer and minimize the waste of a barrier rib material for cost reduction. On a support body 51 which is not a substrate, formed are a plurality of walls 281 through 283 made of a fluorescent material that are belt-shaped in plan view arranged in stripes, an electrode material layer a1, and a barrier rib material filling spaces between the walls. The support body 51 and a substrate 21 are coupled so that the barrier rib material faces the substrate. The walls 281 through 283, the electrode material layer a1 and the barrier rib material 291 are transferred in one step to the substrate 21, and thus a panel assembly 20 having barrier ribs 29, electrodes A and fluorescent layers 28R, 28G and 28B is obtained.

Abstract: The present invention is for a method of fabricating a high aspect ratio, freestanding microstructure. The fabrication method modifies the exposure process for SU-8, an negative-acting, ultraviolet-sensitive photoresist used for microfabrication whereby a UV-absorbent glass substrate, chosen for complete absorption of UV radiation at 380 nanometers or less, is coated with a negative photoresist, exposed and developed according to standard practice. This UV absorbent glass enables the fabrication of cylindrical cavities in a negative photoresist microstructures that have aspect ratios of 8:1.

Abstract: Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 &mgr;m from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight.

Abstract: A mixture of a dibasic ester (DBE), an alcohol, a polar solvent and water to remove photoresist from a flat panel substrate. Photoresist is effectively removed at low temperature with this non-phenolic, non-halogenated stripper solution.

Abstract: To provide a thermosensitive transfer film in which a color filter layer and a phosphor layer can be easily formed by a small number of processes and a method of using the film. A thermosensitive transfer film 10 comprising at least a photosensitive phosphor layer 5 of a predetermined color, a color filter layer 4 of the same color, and a photosensitive adhesive layer 3 which are provided on a base film 6.

Abstract: The present invention is for a method of fabricating a high aspect ratio, freestanding microstructure. The fabrication method modifies the exposure process for SU-8, an negative-acting, ultraviolet-sensitive photoresist used for microfabrication whereby a UV-absorbent glass substrate, chosen for complete absorption of UV radiation at 380 nanometers or less, is coated with SU-8, exposed and developed according to standard practice. This UV absorbent glass enables the fabrication of cylindrical cavities in SU-8 microstructures that have aspect ratios of 8:1.

Abstract: The present invention provides a positive photosensitive resin composition comprising (A) a positive photosensitive resin, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more;

Abstract: A non-corrosive photoresist stripping and cleaning composition, comprising: (a) about 5% to about 50% of a solvent; (b) about 10% to about 90% of an alkanolamine; (c) about 0.1 to 10% of a carboxylic acid; and (d) about 1.0% to 40% of water.

Abstract: The object of the present invention is to provide a polymeric material without odors or fuming and with reduced stickiness of the worked surface of material for seals and workability during laser processing, and the flexographic printing plate and sealing material made of the polymeric material having excellent characteristics of laser processing and having sufficient carving depth. The polymeric material of the present invention is characterized in that the polymeric material is made by crosslinking a polymer composition comprising a polymer which contains an ethylene unit as a repeating unit in content of 45% or more by mass and an organic peroxide.

Abstract: A method and structure for textured surfaces in non volatile floating gate tunneling oxide (FLOTOX) devices, e.g. FLOTOX transistors, are provided. The present invention capitalizes on using “self-structured masks” and a controlled etch to form nanometer scale microtip arrays to form the textured surfaces. The present invention further employs atomic layer epitaxy (ALE) to create a very conformal tunnel oxide layer which complements the nanometer scale microtip arrays. The resulting structure provides a higher tunneling current than currently exists in FLOTOX technology. The improved tunneling currents at low voltages can make these FLOTOX devices suitable for replacing DRAMS.

Abstract: A mass transfer imaging element comprising a substrate having a surface colourant layer containing a pigment to be imagewise transferred, wherein said colourant layer comprises a fluorocarbon additive in an amount to provide a fluorocarbon additive:pigment weight ratio of at least 1:20.

Abstract: A flexographic varnishing plate, used for the selective application of varnish over printed areas, is made by cutting an elastomeric layer bonded to a clear substrate with a pressure-sensitive adhesive. The elastomer is peeled off from the areas which should not be varnished and an exposure to ultra-violet light increases the strength of the adhesive holding the remaining elastomer to the substrate. The plate can be used on lithographic and flexographic printing presses.

Abstract: A method for stripping photoresist material (26) from a semiconductor substrate (16) avoids incorporation of sodium and other contaminant ions from a rework solvent. An oxygen and hydrogen plasma mixture strips the photoresist material without significant introduction of oxygen into the titanium nitride layer (24). Any oxidation of the titanium nitride is reversed by exposing the substrate to an oxygen-free, reducing plasma, such as a hydrogen-containing plasma. The titanium nitride layer is thereby much less susceptible to incorporation of contaminant ions in a subsequent cleaning with rework solvent than a layer which has been extensively oxidized during the plasma stripping process.

Abstract: The present invention relates to a method for negative a positive image, using a negative acting color proofing element comprising, sequentially, a strippable cover sheet; a crosslinked layer containing a polymer having phenolic groups; a color layer, containing a colorant, a polymeric binder, a polymerizable monomer and, optionally, a photoinitiator; a photoadhering layer containing polymerizable groups, and, optionally, a free radical photoinitiator; and a optional thermoplastic adhesive layer. At least one of the color layer and the photoadhering layer containing the photoinitiator. The element is first exposed to actinic radiation and then laminated to a receiver sheet. The composite peeled apart to thereby form a colored negative image on the receiver sheet.

Abstract: A peel-apart photosensitive element comprising in order: a strippable cover sheet; a photosensitive layer; an essentially non-photosensitive, non-tacky organic layer comprised of block or random polymers of at least one aromatic polymer and at least one non-aromatic monomer; and a support, wherein the photosensitive layer has a lowered peel force in relation to the cover sheet after exposure to actinic radiation.

Abstract: An element containing, in order: a first strippable substrate; a substantially transparent, non-photosensitive, polymeric isolation layer having a coating weight of 10 to 150 mg/dm.sup.2 ; an essentially non-photosensitive, non-tacky organic layer having a coating weight of 25 to 200 mg/dm.sup.2 ; a pigmented photosensitive, preferably photopolymerizable layer; and a second different strippable substrate adjacent the photosensitive layer, wherein the photosensitive layer upon imagewise exposure to actinic radiation exhibits a lowered peel force relative to a system which does not have a polymeric isolation layer.

Abstract: A method for manufacturing a pattern sheet for plate-making capable of easily forming a positive image through the use of a photographic negative film. In this method, as a first step, a negative film with a printed negative image is placed on a surface of a light transmission sheet carrying a photosensitive color-developing layer containing a photosensitive color-developing material which makes a color development in response to light. Further, as a second step, the light is applied thereto from the negative film side after the first step. As a result of the application of the light, a color development takes place in the photosensitive color-developing layer due to the light passing through the negative image, thus causing a positive image to be formed on the surface of the light transmission sheet.

Abstract: The present invention describes a process for the formation of a black image on a substrate comprising the steps of:a) providing a donor element comprising a carrier substrate, a black, pigmented photohardenable layer, and photopolymerizable adhesive layer in which the unexposed photopolymerizable adhesive layer has a viscosity at 25.degree. C. of less than 100,000 cps,b) adhering said photopolymer adhesive layer to a first substrate,c) irradiating said photopolymer adhesive in an imagewise distribution of radiation to polymerize said adhesive in an imagewise distribution, andd) stripping said element from said first substrate leaving an imagewise distribution of said black pigmented layer secured to said substrate.

Abstract: A negative acting photoimageable composition comprisesA) between about 30 and about 70 wt %, based on total weight of A) plus B), of a organic binder polymers having sufficient acid functionality to render said photoimageable composition developable in alkaline aqueous solution,A) comprising between about 3 and about 65 wt % relative to total of A) plus B) a binder polymer A') having a weight average molecular weight between about 5000 and about 40,000 and a T.sub.g of between about 40 and about 100, and 5 to 67 wt % relative to total of A) plus B) a binder polymer A") having a weight average molecular weight between about 41,000 and about 200,000 and a T.sub.g of between about 40 and about 100,B) between about 30 and about 60 wt %, based on total weight of A) plus B), of .alpha.,.beta.-ethylenically unsaturated compounds, said component B) comprisingB') an isocyanate trimer having tri-.alpha.,.beta.

Abstract: A peel-apart photosensitive element comprising in order: a strippable cover sheet; a photosensitive layer; an essentially non-photosensitive, non-tacky organic layer comprised of block or random polymers of at least one aromatic polymer and at least one non-aromatic monomer; and a support, wherein the photosensitive layer has a lowered peel force in relation to the cover sheet after exposure to actinic radiation.

Abstract: Monomers with cyclic carbonate groups of the formula I are suitable for the production of photosensitive recording materials, for example for the production of offset printing plates ##STR1## in which A means an (n+m)-valent hydrocarbon residue with 3 to 30 C atoms, which may be OH-substituted and may contain up to 8 ether bridges,R means H or methyl;n means an integer from 1 to 5;m means an integer from 1 to 3, providing that n+m is at least 3.

Abstract: A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.