Removable Furnace Bottom Section Or Kiln Cart Patents (Class 432/241)
  • Patent number: 11195744
    Abstract: A substrate treatment apparatus according to an embodiment of the present invention includes a chamber, a stage, a gas discharger, a plasma generator, and a rotation mechanism. The stage supports a semiconductor substrate in the chamber. The gas discharger discharges a film formation gas toward the semiconductor substrate from a position opposing the stage. The plasma generator is provided on the gas discharger and generates plasma in the chamber during discharge of the film formation gas. The rotation mechanism rotates the stage during generation of the plasma.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: December 7, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Motoki Fujii, Takuo Ohashi, Daisuke Nishida
  • Patent number: 11024523
    Abstract: A substrate processing apparatus, comprising a substrate support (32) provided with a support surface (34) for supporting a substrate or a substrate carrier (24) thereon and a support heater (50) constructed and arranged to heat the support surface (34). The apparatus comprises a heat shield constructed and arranged to cover and shield the substrate support (32) when no substrate or substrate carrier (24) is on the support surface.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: June 1, 2021
    Assignee: ASM IP Holding B.V.
    Inventor: Theodorus Oosterlaken
  • Patent number: 10712093
    Abstract: A kiln car assembly for a firing kiln having a plurality of upper burners includes a kiln car with an uppermost plurality of ceramic green bodies, a plurality of vertical members, and a horizontal supporting plate for supporting the ceramic green bodies during a firing process in the kiln. Further, the kiln car assembly includes a covering table having a tabletop located between the uppermost plurality of ceramic green bodies and the upper burners, and a plurality of legs positioned on the horizontal supporting plate.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: July 14, 2020
    Assignee: Corning Incorporated
    Inventors: Peng Chen, Jeffrey Siler White, Christopher Steven Witte
  • Patent number: 10573535
    Abstract: A technique capable of preventing by-products from adhering to a lower portion of a process vessel utilizes a substrate processing apparatus including: a process vessel having a process chamber; a lid configured to close a lower end opening of the process vessel; a substrate retainer; an insulating structure; a process gas supply mechanism configured to supply a process gas; a purge gas supply unit configured to supply a purge gas to a lower region of the process vessel via a gap between the insulating structure and the lid; and a restrictor disposed in the gap. The restrictor regulates flow of the purge gas such that the flow rate of the purge gas supplied to a first portion of the lower region of the process vessel is greater than a flow rate of the purge gas supplied to a second portion of the lower region of the process vessel.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: February 25, 2020
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shuhei Saido, Mika Urushihara, Yusaku Okajima
  • Patent number: 10290792
    Abstract: A thermoelectric element is formed with a thread portion on at least one end in an electromotive force generating direction.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: May 14, 2019
    Assignee: AISIN TAKAOKA CO., LTD.
    Inventor: Hitoshi Yoshimi
  • Patent number: 10239796
    Abstract: The invention provides tooling (100) for acting during heat treatment to support a preform (110) of a three-dimensional part obtained by shaping a metal or ceramic powder, the preform presenting at least one bearing surface (112) on which it can rest and at least one suspended surface (111) that is suspended relative to the bearing surface, the tooling comprising a tray (120), and a plurality of blocks (130) arranged on the tray and each having at least one surface (130a) for supporting the preform, the blocks being suitable for moving relative to one another by sliding on the tray between a first position in which the blocks are spaced apart from one another and together define a first volume, and a second position in which the blocks together define a second volume that is smaller than the first volume. The invention also provides a method of heat treating a preform made of powder and using such tooling.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: March 26, 2019
    Assignee: SAFRAN AIRCRAFT ENGINES
    Inventor: Guillaume Fribourg
  • Patent number: 10141208
    Abstract: A vacuum processing apparatus includes a tilting unit configured to tilt, in a vacuum vessel, a substrate holder including a refrigerator, and a rotary joint provided in the tilting unit and including a coolant path configured to supply or exhaust a coolant gas to or from the refrigerator. The rotary joint includes a fixed portion fixed to the vacuum vessel, a pivotal portion provided so as to pivot with respect to the fixed portion and fixed to the substrate holder, and a grease supply passage.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: November 27, 2018
    Assignee: Canon Anelva Corporation
    Inventors: Ryo Ishizaki, Daisuke Kobinata, Naoki Kubota, Kyosuke Sugi
  • Patent number: 10018418
    Abstract: A mobile removable hearth skid for a furnace and/or cooling chamber including: a base, the base including a top horizontal surface supporting a refractory platform which possesses a perimeter edge including a front perimeter edge, a rear perimeter edge, and at least two side perimeter edges. The rear perimeter edge and the at least two side perimeter edges form a continuous shoulder extending beyond the base perimeter edge. Also disclosed is a furnace and/or cooling chamber including a refractory lining with a continuous ledge at the bottom edges of the refractory linings mounted on the rear wall and the at least two side walls. A gap is formed by the furnace supports between a bottom surface of the ledge and a surface supporting the furnace supports. The shoulder and ledge form a removable refractory seal.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: July 10, 2018
    Assignee: Can-Eng Partners Limited
    Inventors: Alan Van Geyn, Joseph Jason Saliba
  • Patent number: 9534847
    Abstract: Firing containers for firing an electrode active material include one or more through openings, and protrusions protruding from an outer surface of sidewalls of each of the firing containers. The protrusions allow adjacent firing containers to be spaced apart from each other and guide the adjacent firing containers during alignment.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 3, 2017
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Young-Hoon Do, Myung-Hun Bae, Suk-Chul Jung
  • Patent number: 9460945
    Abstract: A substrate processing apparatus comprises a processing chamber for processing a substrate, a substrate supporting tool for supporting and carrying the substrate into the processing chamber, a standby chamber formed below the processing chamber for holding the substrate supporting tool in standby, a gas supply unit provided on the side of the standby chamber for supplying inert gas or gas containing oxygen into the standby chamber, a gas exhaust unit provided on the side of the standby chamber and opposite to the gas supply unit, for exhausting the inert gas or gas containing oxygen from the standby chamber, a first gas exhaust path connected to the gas exhaust unit for exhausting the inert gas or gas containing oxygen within the gas exhaust unit, a second gas exhaust path connected to the side of the gas exhaust unit for exhausting the gas containing oxygen within the exhaust gas unit, and a gate valve for opening and closing the second gas exhaust path.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: October 4, 2016
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Shigeo Nakada, Takayuki Nakada
  • Patent number: 9362150
    Abstract: A substrate processing apparatus includes a housing, a mounting table provided in the housing and configured to mount a substrate thereon, a drive mechanism provided below the mounting table so as to move the mounting table in a front-back direction between a delivering/receiving location for the substrate and a processing chamber, an ultraviolet irradiation unit configured to irradiate the substrate in the processing chamber with ultraviolet rays, a partition member provided to partition the processing chamber and a drive chamber with the drive mechanism positioned therein up and down, the partition member having a slit for allowing movement of a support supporting the mounting table, first exhaust ports formed in the drive chamber to exhaust an atmosphere in the drive chamber, and second exhaust ports formed along a lengthwise direction of the slit so as to face the slit.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: June 7, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masatoshi Kaneda, Kazuki Nagamoto, Ryo Shimada
  • Patent number: 9279618
    Abstract: A kiln tool plate for firing a ceramic material used during the firing of an article to be fired, where at least uneven conformations are imparted to a front surface side on which the article to be fired is mounted and a back surface side, and opening areas are formed. In the ceramic material firing kiln tool plate, the decrease of heat capacity and the reduction of costs can be achieved, a contact area with the article to be fired is decreased to improve outgassing, and the atmosphere can be made uniform to uniformly manufacture the fired article. Above all, the kiln tool plate for firing the ceramic material has excellent thermal shock resistance, creep resistance, high strength at high temperature and oxidation resistance, and enables weight saving.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: March 8, 2016
    Assignee: NGK Insulators, Ltd.
    Inventors: Shigeru Hanzawa, Tsuneo Komiyama
  • Patent number: 9263307
    Abstract: Provided are an apparatus and method for treating a substrate, and more particularly, to a substrate treatment apparatus having a cluster structure and a substrate treatment method using the same. The apparatus for treating the substrate includes a load port on which a container for receiving the substrate is placed, a treatment module for treating the substrate, and a transfer module including a robot for transferring the substrate between the container and the treatment module. The treatment module includes a transfer chamber including a robot for transferring the substrate, a load lock chamber disposed between the transfer chamber and the transfer module, a first treatment chamber disposed spaced from the transfer module around the transfer chamber to perform a first treatment process, and a second treatment chamber disposed around the transfer chamber to perform a second treatment process.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: February 16, 2016
    Assignee: Semes Co., Ltd.
    Inventor: Hyung Joon Kim
  • Patent number: 9188598
    Abstract: An improved sample handling carousel is mounted to an analytical furnace at an acute angle and includes sample holding cavities which are readily visible at eye level to an operator. The rotary carousel can be easily removed from a stepwise driven drive shaft for filling the carousel at a remote location, such as a weighing station, or can be filled directly while mounted on the drive shaft. A tray is positioned below the carousel and has a slot for dropping a sample when one of the sample holding cavities aligns with the slot in the tray. In a preferred embodiment of the invention, the carousel is made of aluminum or a transparent polymeric material, such as acrylic.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: November 17, 2015
    Assignee: Leco Corporation
    Inventor: Gordon C. Ford
  • Patent number: 9163878
    Abstract: A device and method for transporting blanks is provided. The blanks are made from an initially plastic, subsequently dried and finally fired material. A transport tray transports the blanks through both a dryer and a kiln. The blanks can be stacked on a drying trolley or a firing trolley. A first transfer device transfers the blanks onto the drying trolley when the blanks are stacked on the transport tray and are plastic. The drying trolley transports the blanks and the transport tray in the dryer for drying the blanks. A second transfer device transfers the blanks and the transport tray onto the firing trolley after the blanks have been dried. The firing trolley transports the blanks and the transport tray in the kiln for firing the blanks.
    Type: Grant
    Filed: October 4, 2010
    Date of Patent: October 20, 2015
    Assignee: HANS LINGL ANLAGENBAU UND VERFAHRENSTECHNIK GMBH & CO. KG
    Inventors: Helmut Simon, Franz Simmnacher, Frank Appel
  • Patent number: 9097463
    Abstract: A heating storage structure 1 includes a plurality of mounting parts 5 each including a mounting face 9 on which articles 31 to be heated are mounted, which is a part of the surface of the mounting part; and a fixing part 7 to which the plurality of mounting parts 5 are detachably fixed so that the plurality of mounting parts 5 are stacked while each of spaces S1 to S4 is left between the mounting face 9 of one of the mounting parts 5 and the mounting part 5 disposed adjacent to the one mounting part 5, and the plurality of mounting parts 5 include a mounting part 5b provided with the mounting face 9 having a thermal emissivity which is different from that of the mounting face 9 of another mounting part 5a.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: August 4, 2015
    Assignee: NGK Insulators, Ltd.
    Inventors: Shigeru Hanzawa, Hiroyoshi Suzumura, Tsutomu Yamamoto
  • Patent number: 9018567
    Abstract: A semiconductor substrate processing apparatus (1), comprising a substrate support assembly (30), including a substrate support (32) defining an outer support surface (34) for supporting a substrate or substrate carrier (24) thereon, and a heater (50) comprising a heat dissipating portion (54) that is disposed within the substrate support (32) and that extends underneath and substantially parallel to the support surface (34), said substrate support (32) being rotatably mounted around a rotation axis (L) that extends through said support surface (34), such that the support surface (34) is rotatable relative to the heat dissipating portion (54) of the heater (50).
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: April 28, 2015
    Assignee: ASM International N.V.
    Inventors: Chris G. M. de Ridder, Klaas P. Boonstra, Theodorus G. M. Oosterlaken, Barend J. T. Ravenhorst
  • Patent number: 8890036
    Abstract: A vacuum oven or vacuum furnace is disclosed having a heat distribution sleeve that conforms to the shape of an interior heating chamber. The heat distribution sleeve may be of generally annular shape, like a ring, and located in a substantially regularly spaced and offset relationship from a heating element located within walls adjacent the interior heating chamber. The heat distribution sleeve includes a thermal conductive material which absorbs and re-radiates heat emitted from the heating element, thereby providing more consistent and regular radiation fields for heating treating a work piece that is loaded on a work holding tray and, upon the vacuum oven being in an operational position, the work piece is located within the furnace chamber.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: November 18, 2014
    Inventors: Daniel F. Serrago, James D. Emmons
  • Publication number: 20130209947
    Abstract: A lifting apparatus for a vertical vacuum furnace is disclosed. The apparatus includes first and second support modules arranged in spaced parallel alignment and first and second reversible lifting mechanisms mounted on respective ones of the first and second support modules. The apparatus also includes first and second motive means coupled to the first and second reversible lifting mechanisms for driving the reversible lifting mechanisms. First and second trolleys are operatively connected to the first and second reversible lifting mechanisms and adapted for engaging with a payload. The apparatus further includes a control system connected to the first and second motive means for controlling the operation of the first and second reversible lifting mechanisms whereby the first and second trolleys can be raised or lowered. A vertical vacuum furnace assembly including the lifting apparatus is also disclosed as well as a support module and a bottom head assembly for the lifting apparatus.
    Type: Application
    Filed: December 27, 2012
    Publication date: August 15, 2013
    Applicant: IPSEN, INC.
    Inventor: IPSEN, INC.
  • Patent number: 8487220
    Abstract: A vacuum oven or vacuum furnace is disclosed having a heat distribution sleeve that conforms to the shape of an interior heating chamber. The heat distribution sleeve may be of generally annular shape, like a ring, and located in a substantially regularly spaced and offset relationship from a heating element located within walls adjacent the interior heating chamber. The heat distribution sleeve includes a thermal conductive material which absorbs and re-radiates heat emitted from the heating element, thereby providing more consistent and regular radiation fields for heating treating a work piece that is loaded on a work holding tray and, upon the vacuum oven being in an operational position, the work piece is located within the furnace chamber.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: July 16, 2013
    Inventors: Daniel F. Serrago, James D. Emmons
  • Patent number: 8469703
    Abstract: A vertical boat for heat treatment includes a plurality of supporting columns, a pair of plate members coupled to both ends of each supporting column. In each of the supporting columns a plurality of supporting parts for horizontally supporting substrates to be treated are formed and an auxiliary supporting member to place each of the substrates to be treated is removably attached to each of the plurality of supporting parts. The auxiliary supporting member is adjusted for each supporting part with respect to the inclination of a surface for placing the substrates to be treated depending on the shape of each supporting part by processing a surface for attaching to the supporting part, or by interposing a spacer between the supporting part and the auxiliary supporting member is provided.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: June 25, 2013
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventor: Takeshi Kobayashi
  • Patent number: 8455293
    Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: June 4, 2013
    Assignee: ASM International N.V.
    Inventors: Chris G. M. de Ridder, Klaas P. Boonstra, Adriaan Garssen, Frank Huussen
  • Patent number: 8417394
    Abstract: Provided are a substrate processing apparatus, a semiconductor device manufacturing method, and a temperature controlling method, which are adapted to improve equipment operational rate. A calculation parameter computing unit computes a calculation parameter using at least a first calculation parameter correction value determined by a first calculation parameter setting unit based on an accumulated film thickness on a reaction vessel, a second calculation parameter correction value determined by a second calculation parameter setting unit based on an accumulated film thickness on a filler wafer, and a third calculation parameter correction value determined by a third calculation parameter setting unit based on the number of filler wafers.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: April 9, 2013
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Masashi Sugishita, Masaaki Ueno, Tsukasa Iida, Susumu Nishiura, Masao Aoyama, Kenichi Fujimoto, Yoshihiko Nakagawa, Hiroyuki Mitsui
  • Patent number: 8398773
    Abstract: A thermal processing furnace, comprising: a generally bell jar-shaped outer reaction tube having a central axis; and an open-ended inner reaction tube for accommodating a wafer boat holding a plurality of substrates, which inner reaction tube is substantially coaxially disposed within the outer reaction tube, thereby defining a gas passage between an outer wall of the inner reaction tube and an inner wall of the outer reaction tube, wherein at least one of the outer wall of the inner reaction tube and the inner wall of the outer reaction tube is provided with a flow deflector that protrudes radially from the respective wall into the gas passage.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: March 19, 2013
    Assignee: ASM International N.V.
    Inventors: Lucian C. Jdira, Noureddine Adjeroud
  • Patent number: 8230806
    Abstract: A heat treatment apparatus has a substrate holder with two holder constituting bodies that each have a plurality of columns and substrate holding sections. One of the holder constituting bodies holds substrates so that their front surfaces face upward, while the other holds the substrates so that their back surfaces face upward. At least one of the holder constituting bodies moves vertically to change the positions of the holder constituting bodies relative to each other. A distance between one of a first pair of vertically-adjacent substrates with respective front surfaces facing each other and the other of the first pair of substrates is set to ensure treatment uniformity and to be larger than a distance between one of a second pair of vertically-adjacent substrates with their respective back surfaces facing each other and the other of the second pair of substrates.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: July 31, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Hisashi Inoue, Shunichi Matsumoto, Yasushi Takeuchi
  • Patent number: 8231381
    Abstract: To provide a processing system for a process object capable of preventing a transport arm mechanism from being thermally damaged, so as to effectively perform a transport operation of the process object. A processing system 2, which takes out a process object W from a storage box 6 for process object, and thermally process the process object, includes: a vertical processing unit 24; a process-object transport area 10 disposed below the processing unit; a plurality of process-object boats 20 configured to hold the process objects; a boat elevating means 68 configured to vertically move the process-object boat 20; a boat table for transport 52, on which the process-object boat can be placed; and a transport arm mechanism configured to transport the process objects between the storage box 6 and the process-object boat 20 placed on the boat table for transport 52. The transport arm mechanism 56 is vertically moved by an arm elevating means 58.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: July 31, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Katsuyuki Hishiya, Kiichi Takahashi
  • Patent number: 7935185
    Abstract: A clean gas circulates to pass through a loading area provided below a vertical heat treatment furnace. The clean gas unidirectionally flows through the loading area. After completion of wafer processing, a wafer boat lowers from the heat treatment furnace to the loading area, where the wafers are removed from the wafer boat. Subsequently, a clean gas jetting nozzle arranged in the loading area jets a clean gas toward the emptied wafer boat. Fragment of thin film which may readily peel off are blown away from the wafer boat, and are discharged out of the loading area together with the unidirectional flow. Thus, it is possible to avoid wafer contamination due to the unexpected peel-off of thin film fragments from the wafer boat.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: May 3, 2011
    Assignees: Kabushiki Kaisha Toshiba, Tokyo Electron Limited
    Inventors: Shinji Miyazaki, Hiroki Fukushima
  • Patent number: 7922485
    Abstract: Disclosed is a vertical type heat processing apparatus and a vertical type heat processing method, which can prevent fall down of the boat on a boat carrier mechanism to be caused by an external force, such as an earthquake or the like, by employing a simple structure, while taking a form of the two-boat system. The vertical type heat processing apparatus 1 includes a heating furnace 5 having a furnace port 5a, a cover 17 adapted to close the furnace port 5a, a pair of substrate holding tools 4 each adapted to hold multiple substrates W in a multistage fashion and configured to be placed on the cover 17 via a heat insulating mount 19, and a lifting mechanism 18 adapted to raise and lower the cover 17 so as to carry in and carry out each substrate holding tool 4 relative to the heating furnace 5. When one substrate holding tool 4 is in the heating furnace 5, the other substrate holding tool 4 is placed on a substrate-holding-tool table 22 for loading the substrates W thereon.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: April 12, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Hiromi Nitadori, Katsuyuki Hishiya
  • Patent number: 7900579
    Abstract: A heat treatment method includes a substrate holder that holds a plurality of substrates at predetermined vertical intervals and is carried into a heat treating furnace for performing a predetermined heat treatment on the substrates. The substrate holder has two holder constituting bodies each having a plurality of columns and substrate holding sections. One of the holder constituting bodies holds the substrates at a first, vertically adjacent distance so that their front surfaces face each other, while the other of the holder constituting bodies holds the substrates at a second, vertically adjacent distance so that their back surfaces face each other wherein the second distance is smaller than the first distance to ensure uniformity of the heat treatment. At least one of the holder constituting bodies moves in the vertical direction to change the positions of the holder constituting bodies relative to each other.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: March 8, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Hisashi Inoue, Shunichi Matsumoto, Yasushi Takeuchi
  • Patent number: 7896648
    Abstract: The present invention is a vertical heat processing apparatus comprising: a heat processing furnace having a furnace opening; a lid member for closing the furnace opening of the heat processing furnace; a first substrate holder and a second substrate holder, each of which is capable of holding a plurality of substrates in a tier-like manner and of being alternately placed on the lid member through a heat retention tube; an elevating mechanism that vertically moves the lid member to load one of the substrate holders into the heat processing furnace, and to unload the one of the substrate holders from the heat processing furnace; a holder table configured to be placed thereon the other of the substrate holders for transfer of the substrates, when the one of the substrate holders is in the heat processing furnace; and a holder conveying mechanism configured to convey the respective substrate holders between the holder table and the heat retention tube; wherein the holder table is provided with a holder gripping
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: March 1, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Hiromi Nitadori, Katsuyuki Hishiya
  • Patent number: 7798811
    Abstract: A vertical type heat processing apparatus prevents falling-down of a boat placed on a heat insulating mount due to an external force, such as an earthquake. The apparatus includes a heating furnace having a furnace port, a cover, a pair of substrate holding tools, each to be placed on the cover via a heat insulating mount and to hold multiple substrates, a rotating mechanism, and a lifting mechanism to raise and lower the cover to carry in and carry out the substrate holding tool relative to the furnace. While one of the substrate holding tools is located in the furnace, the other is placed on a table, for loading the substrates. Each substrate holding tool is carried between the table and the heat insulating mount due to a carrier mechanism. Further, a locking part and a part to be locked can be engaged with each other.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: September 21, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Hiromi Nitadori, Hirofumi Kaneko
  • Patent number: 7717705
    Abstract: The present invention relates to a device for supporting, stacking and transporting kiln run, in particular, when firing ceramic products, comprising an assembly from supports and support beams, in particular carrier beams, cross beams, large plates or similar, on which, in particular, one or several supports for placing kiln run are provided. The device comprises at least one substantially rectangular sleeve, in particular disposed on a kiln cart. In this sleeve a substantially rectangular support of the support assembly is disposed, wherein the sleeve has at least one adjustment means, which is supported in the sleeve, and which can be pressed against the support, wherein the sleeve additionally comprises at least one pressure means, formed from at least one elastic element, which is preloaded through the impact of the adjustment devices, so that it builds up reversal forces against the support.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: May 18, 2010
    Assignee: Saint-Gobain Industriekeramik Rodental GmbH
    Inventor: Winkler Erhard
  • Patent number: 7665988
    Abstract: Provided is a complex sintering furnace to sequentially perform a bake-out process and a sintering process for molding ceramic products. The complex sintering furnace includes: a support frame; a pair of furnace bodies supported on the top of the support frame and having a built-in heat insulator covered by a disc-shaped cover; a pair of rails arranged under the support frame in parallel in a length direction along arrangement of the furnace bodies; a rotating base horizontally transferred along the rails and rotatably connected to bottoms of the furnace bodies when the rotating base is vertically transferred directly under the bottoms of the furnace bodies, the rotating base including a separately rotating setter mounted the top thereof; and an ascending/descending apparatus mounted under the rotating bases and having a ball-screw type rotation shaft to vertically ascend/descend the rotating base at the same time of the separate rotation of the setters.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: February 23, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Mo Kim, Tae Shin Kim, Jong Hwa Lee, Jeong Woon Lee
  • Patent number: 7575370
    Abstract: The present invention provides precise temperature estimation in a heat treatment apparatus that estimates temperatures of process objects by using a thermal model and performs a heat treatment while performing a temperature control based on the estimated temperatures. The heat treatment apparatus (1) includes a processing vessel (11) accommodating plural wafers W, plural heaters (31 to 33) and plural temperature sensors (S1 to S5), and stores the thermal model. The heat treatment apparatus 1 estimates temperatures of the wafers W based on outputs of the temperature sensors (S1 to S5) by using the thermal model and controls the heaters (31 to 33) based on the estimated temperatures, applying a heat treatment to the wafers W. The thermal model for an individual apparatus is made by calibrating a standard thermal model designed for a standard apparatus.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: August 18, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Youngchul Park, Kazuhiro Kawamura, Yuichi Takenaga
  • Publication number: 20080248436
    Abstract: A method of filling cavities in refractory bodies, comprising lofting refractory fibers in flowing air, mixing lofted refractory fibers with refractory foam to generate a fibrous refractory foam, and filling a substantially enclosed cavity in a refractory material with fibrous refractory foam to produce a foam-filled cavity, heating the foam-filled cavity to a first drying temperature for sufficient time to dry the fibrous refractory foam filling, and heating the foam-filled cavity to a second substantially higher firing temperature to produce a fired body. The substantially enclosed cavity is defined by at least one refractory wall.
    Type: Application
    Filed: April 4, 2008
    Publication date: October 9, 2008
    Inventor: David Erhardt
  • Patent number: 7431585
    Abstract: An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: October 7, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Jun Zhao, David Quach, Timothy Weidman, Rick J. Roberts, Farhad Moghadam, Dan Maydan
  • Patent number: 7431584
    Abstract: A heat processing apparatus for heating a mask substrate is disclosed. A mask substrate on which a coating solution has been coated is placed on a heating plate that heats the substrate. A frame member is disposed on the heating plate so that the frame member faces a side surface of the mask substrate placed on the heating plate when the frame member is attached to the heating plate and that a clearance is formed between the frame member and the heating plate when the frame member is attached to the heating plate. The frame member suppresses heat radiated from the side surface of the substrate. As a result, the temperature uniformity of the surface of the substrate can be improved. In addition, since the clearance is formed between the frame member and the heating plate, particles do not accumulate in the region. Thus, adhesion of particles to the substrate can be suppressed.
    Type: Grant
    Filed: February 10, 2004
    Date of Patent: October 7, 2008
    Assignee: Tokyo Electron Limited
    Inventors: Toshichika Takei, Masatoshi Kaneda
  • Patent number: 7416405
    Abstract: A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: August 26, 2008
    Assignee: Tokyo Electron Limited
    Inventors: Satoshi Asari, Katsuhiko Mihara
  • Publication number: 20080199818
    Abstract: The present invention is a vertical heat processing apparatus comprising: a heat processing furnace having a furnace opening; a lid member for closing the furnace opening of the heat processing furnace; a first substrate holder and a second substrate holder, each of which is capable of holding a plurality of substrates in a tier-like manner and of being alternately placed on the lid member through a heat retention tube; an elevating mechanism that vertically moves the lid member to load one of the substrate holders into the heat processing furnace, and to unload the one of the substrate holders from the heat processing furnace; a holder table configured to be placed thereon the other of the substrate holders for transfer of the substrates, when the one of the substrate holders is in the heat processing furnace; and a holder conveying mechanism configured to convey the respective substrate holders between the holder table and the heat retention tube; wherein the holder table is provided with a holder gripping
    Type: Application
    Filed: January 29, 2008
    Publication date: August 21, 2008
    Inventors: Hiromi Nitadori, Katsuyuki Hishiya
  • Publication number: 20080153049
    Abstract: The present invention provides a vertical type heat processing apparatus, which can prevent falling-down of a boat placed on a heat insulating mount due to an external force, such as an earthquake, by employing a simple structure, while taking a form of the so-called two-boat system. The vertical-type heat processing apparatus comprises a heating furnace 5 having a furnace port 5a formed at a bottom portion thereof, a cover 17 adapted to close the furnace port 5a, a pair of substrate holding tools 4, each configured to be placed on the cover 17 via a heat insulating mount 19 and adapted to hold multiple substrates W in a multistage fashion, a rotating mechanism 20 provided to the cover 17 and adapted to rotate the substrate holding tool 4, and a lifting mechanism 18 adapted to raise and lower the cover 17 so as to carry in and carry out the substrate holding tool 4 relative to the furnace 5.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 26, 2008
    Inventors: Hiromi Nitadori, Hirofumi Kaneko
  • Patent number: 7371998
    Abstract: A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding positions is provided for holding a batch or workpieces or wafers. The process chamber vessel is moveable to a position where it substantially encloses the holder, so that wafers in the holder may be processed in a controlled environment. A cooling shroud may be provided to absorb heat from the heater before or after thermal processing. The thermal processor is compact and thermally shielded, and may be used in an automated processing system having other types of processors.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: May 13, 2008
    Assignee: Semitool, Inc.
    Inventors: Randy A. Harris, Gregory J. Wilson, Paul R. McHugh
  • Patent number: 7329947
    Abstract: When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that holds the first jig and is mounted on a heat treatment boat is adopted as a heat treatment boat of a vertical heat treatment furnace, the stress concentrated during the heat treatment on a particular portion of the semiconductor substrate can be reduced; in the case of a semiconductor substrate large in the tare stress and having an outer shape of 300 mm being heat treated, or even in the case of the heat treatment being carried out under very high temperature conditions, the slips can be suppressed from occurring. The present invention can be widely applied as a stable heat treatment method of semiconductor substrates.
    Type: Grant
    Filed: January 5, 2004
    Date of Patent: February 12, 2008
    Assignee: Sumitomo Mitsubishi Silicon Corporation
    Inventors: Naoshi Adachi, Kazushi Yoshida, Yoshiro Aoki
  • Patent number: 7204887
    Abstract: The present invention provides a wafer holder, a wafer support member, a wafer boat and a heat treatment furnace, which are capable of sufficiently suppressing slip dislocations, without lowering productivity and at low cost, in the high temperature heat treatment of silicon wafers, and said wafer holder is characterized in that: the wafer holder is composed of a wafer support plate and three or more wafer support members mounted on said wafer support plate, each of the wafer support members having a wafer support portion or more; at least one of said wafer support members is a tilting wafer support member which has a plurality of upward-convex wafer support portions on the upper surface and is tiltable with respect to said wafer support plate; and the wafer is supported by at least four wafer support portions.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: April 17, 2007
    Assignee: Nippon Steel Corporation
    Inventors: Keisuke Kawamura, Tsutomu Sasaki, Atsuki Matsumura, Atsushi Ikari, Isao Hamaguchi, Yoshiharu Inoue, Koki Tanaka, Shunichi Hayashi
  • Patent number: 6984267
    Abstract: A manufacture method for a semiconductor device includes the steps of: (a) transporting a silicon wafer into a reaction chamber having first and second gas introducing inlet ports; (b) introducing an oxidizing atmosphere via the first gas introducing inlet port and raising the temperature of the silicon wafer to an oxidation temperature; (c) introducing a wet oxidizing atmosphere to form a thermal oxide film on the surface of the silicon wafer; (d) purging gas in the reaction chamber by using inert gas to lower a residual water concentration to about 1000 ppm or lower; and (e) introducing an NO or N2O containing atmosphere into the reaction chamber via the second gas introducing inlet port while the silicon wafer is maintained above 700° C. and above the oxidation temperature, to introduce nitrogen into the thermal oxide film and form an oxynitride film. A thin oxynitride film can be manufactured with good mass productivity.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: January 10, 2006
    Assignee: Fujitsu Limited
    Inventors: Kiyoshi Irino, Ken-ichi Hikazutani, Tatsuya Kawamura, Taro Sugizaki, Satoshi Ohkubo, Toshiro Nakanishi, Kanetake Takasaki
  • Patent number: 6957956
    Abstract: A vertical heat-processing apparatus (1) includes a vertical heat-processing furnace (2) having a furnace port (3), a lid (5) movable up and down to open and close the furnace port, and a rotation mechanism (15) disposed on the lid to rotate a holder (13) that holds a number of target substrates (W). The rotation mechanism (15) includes a rotary shaft (16), and a support unit (19) that supports the rotary shaft (16) rotatably through a bearing (17) and sealing member (18). The rotary shaft (16) has a hollow structure with a thin wall, and is supplied with a cooling gas to flow inside and outside the rotary shaft. The support unit (19) has a cooling passage (32) surrounding an upper portion of the rotary shaft (16), and is supplied with a coolant to flow through the cooling passage.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: October 25, 2005
    Assignee: Tokyo Electron Limited
    Inventors: Katsuya Toba, Kiichi Takahashi, Mitsuru Obara
  • Patent number: 6936108
    Abstract: A film-forming unit of the invention includes: a processing furnace, gas-supplying means that supplies a process gas into the processing furnace, heating means that heats an inside of the processing furnace to a predetermined process-temperature, and a normal-pressure gas-discharging system for discharging gas from the processing furnace at a predetermined discharging-pressure that is near to an atmospheric pressure. A valve is provided in the normal-pressure gas-discharging system, the valve being adjustably caused to open and close, a pressure of the gas through the valve being also adjustable. A pressure sensor detects a discharging-pressure in the normal-pressure gas-discharging system. A controller controls the valve based on the pressure detected by the pressure sensor. According to the feature, a stable control can be achieved without necessity of introducing atmospheric air or introducing any inert gas.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: August 30, 2005
    Assignee: Tokyo Electron Limited
    Inventor: Yukimasa Saito
  • Patent number: 6902395
    Abstract: A pedestal for use in a high temperature vertical furnace for the processing of semiconductor wafers provides a closure and heat insulation for the lower end of the furnace and is a wafer boat support. The pedestal, comprising quartz-enveloped insulation material, supports a wafer boat at a boat support level and is provided with an upper section disposed above the boat support level. The upper section comprises enveloped insulating material. The envelope of the upper section is also formed of quartz and the insulating material in the upper section has a lower thermal conductance than the insulating material in a lower quartz enveloped section.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: June 7, 2005
    Assignee: ASM International, N.V.
    Inventors: Theodorus Gerardus Maria Oosterlaken, Frank Huussen, Timothy Robert Landsmeer, Herbert Terhorst
  • Patent number: 6834597
    Abstract: This relates to a furnace that is useful in safely detonating or demilitarizing munitions or explosives, particularly small caliber munitions. The preferred variation includes a series of chambers having a set of runners or tracks passing amongst the various chambers to allow movement of the munitions from chamber to chamber in trays. The first chamber is heated in such a way so that a tray of munitions placed on the runners in this chamber are baked and detonated. After the detonation is generally complete, the tray containing the then-detonated munition fragments is slid through an opening at the end of that heated detonation chamber into a first cooling chamber. Generally, this movement takes place by addition of another tray containing non-detonated munitions into the first chamber.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: December 28, 2004
    Inventor: Terry Northcutt
  • Patent number: 6830449
    Abstract: The present invention provides an injector robot for replacing a gas injector in a running furnace, which is still running and without any cooling and reheating action. According to the present invention, the injector robot is arranged and mounted upon a boat elevator, which is originally used to transport a boat with wafers into the furnace. The replacement of the gas injector could be executed precisely and safely by the assistant means and will not affect the predetermined procedure of the furnace.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: December 14, 2004
    Assignee: SIS Microelectronics Corporation
    Inventor: Cheng-Chung Hung
  • Patent number: 6793734
    Abstract: An assembly of heating furnace and semiconductor wafer-holding jig. This assembly includes a furnace body made of refractory or heat insulting material; a heater disposed around the inner side surface of the furnace body; a reaction chamber which forms a uniform heating zone; and a wafer-holding jig. The wafer-holding jig is capable of holding the wafer and advancing and retracting the wafer in the uniform heating region along the longitudinal direction of the furnace body. The front surface of the semiconductor wafer to be heat-treated is substantially in parallel with the surface of the heater. The assembly of the invention can be used in rapid thermal processing and the footprint of the heating furnace can be reduced.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: September 21, 2004
    Assignees: F.T.L. Co., Ltd., Topco Scietific Co., Ltd.
    Inventor: Mikio Takagi