Mechanical Polishing Of Wafer Patents (Class 438/959)
  • Method of forming conductive bumps on die for flip chip applications
    Patent number: 5736456
    Abstract: The present invention relates to an improved method for forming a UBM pads and solder bump connections for flip chip which eliminates at least one mask step required in standard UBM pad forming processes. The method also includes repatterning bond pad locations.
    Type: Grant
    Filed: July 17, 1996
    Date of Patent: April 7, 1998
    Assignee: Micron Technology, Inc.
    Inventor: Salman Akram