Abstract: An elastically-deformable, conductive composite using elastomers and conductive fibers and simple fabrication procedures is provided. Conductive elastomeric composites offer low resistance to electrical current and are elastic over large (>25%) extensional strains. They can be easily interfaced/built into structures fabricated from elastomeric polymers.

Abstract: A backlight structure comprises a frame, a circuit board, and a connector. The frame has an opening. The circuit board is located below the frame and has a through hole, wherein the through hole aligns with the opening. The connector passes through the opening and the through hole, protrudes from a surface of the frame, and is electrically connected to the circuit board.

Abstract: A backlight structure comprises a frame, a circuit board, and a connector. The frame has an opening. The circuit board is located below the frame and has a through hole, wherein the through hole aligns with the opening. The connector passes through the opening and the through hole, protrudes from a surface of the frame, and is electrically connected to the circuit board.

Abstract: An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface.

Abstract: A video signal transmitting device having analog and digital video signal output functionality is adapted to transmit a video signal, and has a cable unit, a digital visual interface integrated input port disposed at one end of the cable unit and adapted to receive the video signal, and a digital visual interface output port and an analog video signal output port disposed at the other end of the cable unit. The digital visual interface integrated input port has a first pin set for digital video signals, and a second pin set for analog video signals. The digital visual interface output port is connected to the first pin set through the cable unit, and the analog video signal output port is connected to the second pin set through the cable unit so as to achieve an effect of respectively outputting digital video signals and analog video signals.

Abstract: A video signal transmitting device having analog and digital video signal output functionality is adapted to transmit a video signal, and has a cable unit, a digital visual interface integrated input port disposed at one end of the cable unit and adapted to receive the video signal, and a digital visual interface output port and an analog video signal output port disposed at the other end of the cable unit. The digital visual interface integrated input port has a first pin set for digital video signals, and a second pin set for analog video signals. The digital visual interface output port is connected to the first pin set through the cable unit, and the analog video signal output port is connected to the second pin set through the cable unit so as to achieve an effect of respectively outputting digital video signals and analog video signals.

Abstract: The invention provides a TFT electrode structure and its manufacturing method that can prevent metal diffusion occurring in the fabrication of a TFT, and thereby reduce the risk of contamination of the chemical vapor deposition process due to metallic ion diffusion. The transparent pixel electrode is formed after the gate electrode metal so that the pixel transparent electrode can be used as a barrier layer to prevent metal diffusion under high temperature from the gate electrode metal to adjacent insulating layers or the active layer. Further, the method used to form the transparent pixel electrode is a low-temperature physical vapor deposition process, which affected less by the processing environment, and the transparent pixel electrode is a conductive layer that is not affected by metal diffusion.

Abstract: A method and apparatus for aligning a semiconductor device with a corresponding landing site on a carrier substrate. At least two apertures are formed in a semiconductor device, the apertures passing from a first major surface to a second, opposing major surface of the semiconductor device. Corresponding alignment features are provided on the carrier substrate at the landing site to which the semiconductor device is to be mounted. The alignment features are aligned with the corresponding apertures to effect alignment of the semiconductor device. The alignment features may include apertures corresponding in size, shape and arrangement to the semiconductor device apertures. Alignment pins may be placed through the at least two apertures to assist with alignment.

Abstract: A wiring unit is provided, which includes: insulative substrates, each having through holes, to be stacked up each other; strip conductors, each having contact holes meeting the respective through holes, to be arranged in parallel on each of the insulative substrate; and a conductor pin consisting of a pin portion of conductive material to be inserted into both the through hole and the contact hole with a gap therewith and a conductor contact portion radially projecting from the pin portion so as to be put into contact with the strip conductor. The conductor contact portion has a peripheral portion to be put into contact with the strip conductor. At least one of the strip conductors has a male tab to protrude from the insulative substrate so as to be connected with a terminal electrically connected with external equipment. And, an electric junction box further includes a connector unit consisting of a wire, a terminal connected with the wire, and a housing accommodating the terminal is provided.

Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.

Abstract: An electrical connector (305) with a conductive contact (420) that self-aligns via formed notches (425). The contact (420) also includes an opening (503) formed in a central region thereof for mating with a snap protrusion within an insulator (415) and flexibly holding it in place allowing the contact (420) to float within the insulator (415). The connector (305) additionally includes a plug that is inserted and retained into an aperture formed in the insulator (415). The connector (305) is rotated and electrically couples the contact (420) with the conductive member (310), thereby allowing alternating current (AC) power to flow through the connector (305).

Abstract: It is provided an automatic MDF control system comprising: a plurality of matrix boards provided with openings in locations where a plurality of first wires and second wires cross without electrical connections; a robot which inserts electrically conductive connecting pins into the openings and connects the first wires with the second wires where the pins are inserted; a path data conversion unit converting connection requests from an operating terminal into path data having a plurality of addresses of the openings; a robot command conversion unit receiving the path data and converting the path data into robot commands for controlling activity of the robot as a distance moved by the robot moving between the plurality of addresses being reduced by a selected sequence of the converted path data; and a robot control unit controlling the activity of the robot based on the robot commands.

Abstract: A disk drive test device for performing a test (e.g., power only self test, tests which use a serial interface) on at least one disk drive at a time. The test device includes an electrical connector which is configured so as to be able to provide the necessary electrical interconnections for executing a test on disk drives having different types of drive interface connectors (i.e., the same electrical connector may be used with at least 2 different types of drive interface connectors). There is no need to use an in-line adapter to electrically interconnect a disk drive having a first drive interface connector or to electrically interconnect a disk drive having a second drive interface connector. There is also is no need to change out the electrical connector when performing a test on disk drives which use this different types of drive interface connectors.

Abstract: A remotely controlled cross-connection switching matrix, particularly suited for telephone systems, has a jumper pin picker and placement mechanism selectively movable along each of three axes under the control of a single drive motor translating a single drive cable over a series of pulleys. Movement along the selected axis is effected by braking movement along the other two axes. The system provides a “soft dial tone” to prospective telephone subscribers' premises having cable pairs permanently connected to the matrix. The cable pair for the calling prospective subscriber is automatically identified at the matrix in response to an off-hook status for that prospective subscriber, and the cable pair identification data is automatically transmitted to the telephone business office.

Abstract: A substrate for mounting an electronic part and a method for producing the same, which allows a conductive pin to be inserted and secured in a through hole without exerting any damage thereto. The substrate for mounting an electronic part is formed of a through hole piercing an insulating substrate and a conductive pin with its head inserted into the through hole. The head of the conductive pin is provided with a plurality of projections to its side wall, each projecting radially in 4 or more directions. Those projections form a plurality of pairs, each of which is extending in an opposite direction from an axial center of the head. Those projection pairs include a primary projection pair having a largest length and a secondary projection pair having a second largest length. The length of the primary projection pair is equal to or more than an inside diameter of the through hole. The length of the secondary projection pair is less than the inside diameter of the through hole.

Abstract: A printed circuit terminal includes a main terminal body and an integrally formed fixing portion that is coaxial with the terminal body for mounting the terminal to a printed circuit base member. A frusto-conical flange is integrally connected between the body and the fixing portion and has a peripheral surface located in radially outward relation to the body and the fixing portion. The flange includes two surface portions. The first surface portion is adapted to contact and extend from the base member for receiving solder deposited in electrical contact with the base member. A second surface portion is axially adjacent to the first portion and exposes a different surface material than the first portion in order to restrain solder adhesion to the second surface portion.

Abstract: A remotely controlled cross-connection switching matrix, particularly suited for telephone systems, has a jumper pin picker and placement mechanism selectively movable along each of three axes under the control of a single drive motor translating a single drive cable over a series of pulleys. Movement along the selected axis is effected by braking movement along the other two axes. The system provides a "soft dial tone" to prospective telephone subscribers' premises having cable pairs permanently connected to the matrix. The cable pair for the calling prospective subscriber is automatically identified at the matrix in response to an off-hook status for that prospective subscriber, and the cable pair identification data is automatically transmitted to the telephone business office. Stored information at the business office for the premises of the identified cable pair is automatically displayed for the telephone company representative responding to a request for service by the calling prospective subscriber.

Abstract: A substrate for mounting an electronic part and a method for producing the same, which allows a conductive pin to be inserted and secured in a through hole without exerting any damage thereto. The substrate for mounting an electronic part is formed of a through hole piercing an insulating substrate and a conductive pin with its head inserted into the through hole. The head of the conductive pin is provided with a plurality of projections to its side wall, each projecting radially in 4 or more directions. Those projections form a plurality of pairs, each of which is extending in an opposite direction from an axial center of the head. Those projection pairs include a primary projection pair having a largest length and a secondary projection pair having a second largest length. The length of the primary projection pair is equal to or more than an inside diameter of the through hole.

Abstract: The interconnection board includes a plurality of non-conductive insulation layers and through-holes running through the insulation layers. A plurality of conductive patterns are provided on each insulation layer, electrically insulated from each other, and exposed to the inside of one through-hole at the same axial position of the through-hole. The connection pin has a non-conductive stem and a connection pattern provided on the non-conductive stem. The connection pattern extends in the axial direction of the connection pin and electrically connects two conductive patterns provided on different insulation layers at the same circumferential position in the through-hole, by bringing the conductive patterns into contact at positions which are axially different and circumferentially the same.

Abstract: A circuit board structure is provided with a compact switching system for selectively connecting and disconnecting a pair of electrically conductive lead portions thereof. The switching system includes a through hole formed in the substrate portion and extending between its opposite sides. The interior side surface of the through hole is plated with an electrically conductive metal material. Portions of the plating are then removed to leave a mutually spaced plurality of plating segments within the through hole. Each plating segment is connected to an end of one of the circuit board leads. A switch structure is provided and has a contact portion which is insertable into the through hole and movable therein, into and out of engagement with a pair of the spaced plating segments, to selectively and electrically couple the circuit board leads associated with the plating segment pair.

Abstract: A cable connector having pins reserved for conveying data through shorting can be used to automatically convey pertinent information concerning the cable, the system to which the cable is connected, whether the cable is attached at all, or any combination of the above, to the adjoining component. Such information can be modified at will by changing the pins which are shorted.

Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.

Abstract: Packaging for an electronics assembly. A base card has a row of elongated slots. A number of individually insertable subassemblies have standoff feet and a pair of offset hooks at their sides. The hooks snap into the slots in such a way that each slot can hold the hooks for four different subassemblies, which are positioned adjacent each other and on both sides of the base card.

Abstract: An LSI package structure with high efficiency of the power supply and fast transmission of the signal is provided in which: adjacent to a pin 8 side surface of an LSI package 1, a power supply member 2 having an electrically conductive portions 6 and 7 for power supply bus and ground bus respectively, and a flexible interconnection board 3 having a power supply pattern layer 3b and a ground pattern layer 3a connected to the portions 6 and 7 respectively via a pin 9, are disposed; the pins 8 and 9 each extend through a through hole 3c formed on the interconnection board 3, the power supply pattern layer 3b and the pins 8 and 9 for power supply being interconnected within the through hole, the ground pattern layer 3a and the pins 8 and 9 for grounding being interconnected within the through hole; and the signal input/output pin 8 and a connector 5 of a signal input/output coaxial cable 5a are interconnected at the side of the interconnection board 3 oppsite the LSI package 1.

Abstract: An improved rework method and rework pin for repairing and reworking multilayer printed circuit boards are described. The rework pin is constructed of conductive material having a configuration that accommodates the configuration of through holes in a multilayer printed circuit board assembly. The rework pin includes a cup-like structure at one end for cooperating with component leads, an elongated electrically insulated portion and an electrically conductive tip portion extending beyond the thickness of the multilayer board.

Abstract: A controlled stratified random area illuminator is constructed of a base comprised of alternate layers of conductive and insulating material and a plurality of illuminating devices adapted to be positioned in a predetermined array on the base to provide an illuminating display. Each illuminating device comprises a light source and a post which carries a pair of leads for supplying current to the light source, one lead being adapted to make electrical contact with a common layer of conductive material and another lead which is adapted to make electrical contact with one of the other conductive layers. The illuminating devices and the base are constructed so that the illuminating devices can be installed by pushing them into the base material to penetrate the conductive and insulating layers to a predetermined depth. A selective switch controls the supply of electrical current to the conductive layers for illuminating a predetermined array of illuminating devices.

Abstract: A discretionary interconnect which includes orthogonal arrays of conductors sandwiched between conductive planes and accessible through a number of selectively arranged vias for interconnection and interruption. Also disclosed is a process of personalizing an interconnect of this type by selectively connecting and disconnecting the conductors.

Abstract: A coupling plate with a plurality of electric coupling points comprises, in a preferred embodiment, a pair of plane plates (10, 12), between which there is provided an electrically insulating carrier layer (11), on which a pattern of electrically conducting areas (21-26) is provided. In the preferred embodiment, an electric coupling point is provided for each mechanical coupling stud (15) projecting from the upper side of the top plate (10). The studs (15) are hollow and flush with projections (19) on the lower plate (12) so that punched parts of the electrically conducting areas (20, 22, 24, 26) are just moved into the hollow coupling studs by means of the projections (19) on the lower plate (12), thus making the conducting areas accessible through cuts (16) in the coupling studs (15). The invention also concerns a method of producing such a plate and a board consisting of a plurality of interconnected plates of said type.