Connected By Transversely Inserted Pin Patents (Class 439/45)
  • Patent number: 10790643
    Abstract: A multi-phase busbar for conducting electric energy includes: an insulating base layer made of an insulating material; a first conducting layer made of a sheet metal arranged on and adhesively bonded to the base layer; a first connecting pin mounted to the first conducting layer which extends in a direction with respect to the first conducting layer; a first insulating layer arranged on and adhesively bonded to the first conducting layer; a second conducting layer made of a sheet metal arranged on and adhesively bonded to the first insulating layer, the second conducting layer including a second connecting pin which extends in a direction parallel to the first connecting pin; and a second insulating layer arranged on and adhesively bonded to the second conducting layer. The second conducting layer and the first and second insulating layer each include at least one pinhole through which the first connecting pin projects.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: September 29, 2020
    Assignee: ABB SCHWEIZ AG
    Inventors: Rudi Velthuis, Andrej Krivda
  • Patent number: 10741964
    Abstract: It is aimed to simplify the shape of a short-circuit means. A joint connector (A) includes a housing (10), a plurality of terminal fittings (35F, 35S, 35T) provided in the housing (10) and each formed such that a plurality of tabs (37F, 37D, 7R) are coupled by a terminal base portion (36), and a short-circuit module (40) provided in the housing (10) and formed by arranging a plurality of short-circuit plates (42) side by side in a length direction of the tabs (37F, 37D, 37R). The short-circuit plate (42) is formed with a plurality of conduction holes (45) for allowing the tabs (37F, 37D, 37R) to pass therethrough in a contact state and non-contact holes (44) for allowing the tabs (37F, 37D, 37R) to pass therethrough in a non-contact state, and an arrangement of the plurality of conduction holes (45) differs among the plurality of short-circuit plates (42).
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: August 11, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hajime Matsui, Yasuo Omori
  • Patent number: 10630004
    Abstract: A connection assisting member, for connecting a first circuit board having one or more through-holes each of which has a first contact portion formed on an inner surface thereof and a second circuit board having one or more bendable second contact portions, includes a base plate, and one or more projections projecting on a surface of the base plate and having elasticity, when fitted in a corresponding through-hole of the first circuit board as catching a corresponding second contact portion of the second circuit board, each of the one or more projections elastically presses the corresponding second contact portion of the second circuit board against the inner surface of the corresponding through-hole to electrically connect the first contact portion and the corresponding second contact portion to each other.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: April 21, 2020
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu Hashiguchi
  • Patent number: 10418735
    Abstract: A micro-electro-mechanical systems (MEMS) terminal structure of board-to-board electrical connector and manufacturing method thereof are provided. The terminal of the terminal structure includes a side arm, a bent portion, and a flexible arm integrally formed as one component. The flexible arm includes a first portion and a second portion. The first portion and the side arm form an insertion space. The second portion and the side arm form a locking space. The second portion of the flexible arm has a contact portion. The insertion space is greater than the locking space. The terminal has curved and locking features to extend the moment arm of the terminal for improving the terminal flexibility. The terminal contacts a mating terminal through multiple points, thereby improving the contact stability and providing the locking function. Furthermore, by using the MEMS techniques for semiconductor industries, the terminal of micro board-to-board electrical connector can be manufactured.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 17, 2019
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Kuo-Ching Lee, Ta-Teh Meng, Cheng-Feng Yu
  • Patent number: 8024856
    Abstract: A method of manufacturing a printed circuit board is disclosed. A method of manufacturing a printed circuit board, which includes: forming at least one interlayer connector on a first carrier, stacking at least one insulation layer on the first carrier such that the interlayer connector is exposed, removing the first carrier, and forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector, can be used to increase the density of circuit patterns, as the method can provide electrical connection between circuit patterns and vias without using lands.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: September 27, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Jong-Jin Lee
  • Patent number: 8025537
    Abstract: An access control device (10) has an electronic/electric control unit (19) fed with electrical current via an electrically conductive fastener (28), such as the ones that also function to clamp the outdoor and indoor housings (15, 17) of the device (10) together against the opposed sides of a door (12) or the like.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: September 27, 2011
    Assignee: Kaba Ilco Corp.
    Inventor: Clark Edgar Craig
  • Patent number: 7821270
    Abstract: A demountable pellet is disclosed for use as an electrode contact assembly. The pellet comprises a base 1 upon which is mounted a plurality of electrodes 18, 19, 20 arranged in respective spaced parallel planes and having respective contacts 23, 24, 25 protruding from them. A closure 2 for the base 1 has a member 11, 12, 13 engaging at least one of the electrode contacts. In an unassembled condition of the pellet, with the closure 2 separate from the base 1 and each closure member disengaged from its respective electrode contact, the contacts 23, 24, 25 lie in respective spaced parallel planes. In the assembled condition of the pellet with each closure member engaging its respective electrode contact, at least one of the contacts 23, 24, 25 lies in a plane other than that in which it lay in the unassembled condition of the pellet.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: October 26, 2010
    Assignee: Ion Science Limited
    Inventors: Mark Julian Stockdale, Kara Michele Eagling
  • Patent number: 7791185
    Abstract: An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: September 7, 2010
    Assignee: Intel Corporation
    Inventor: Mengzhi Pang
  • Patent number: 7699616
    Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
    Type: Grant
    Filed: February 20, 2008
    Date of Patent: April 20, 2010
    Assignee: FormFactor, Inc.
    Inventors: Charles A. Miller, Benjamin N. Eldridge
  • Patent number: 7621756
    Abstract: A method for making a contact begins by providing a sheet of material. A portion of the sheet is deep drawn to form a cavity having at least one side wall, the cavity extending away from a rim formed by a non-drawn portion of the sheet. At least one spring member is defined from the at least one side wall and is bent such that at least a portion of the at least one spring member extends beyond the rim.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: November 24, 2009
    Assignee: Neoconix, Inc.
    Inventor: Larry E. Dittmann
  • Patent number: 7347698
    Abstract: A method for making a contact begins by providing a sheet of material. A portion of the sheet is deep drawn to form a cavity having at least one sidewall, the cavity extending away from a rim formed by a non-drawn portion of the sheet. At least one spring member is defined from the at least one sidewall and is bent such that at least a portion of the at least one spring member extends beyond the rim.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: March 25, 2008
    Assignee: Neoconix, Inc.
    Inventor: Larry E. Dittmann
  • Patent number: 7335057
    Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
    Type: Grant
    Filed: September 18, 2006
    Date of Patent: February 26, 2008
    Assignee: FormFactor, Inc.
    Inventors: Charles A. Miller, Benjamin N. Eldridge
  • Patent number: 7108546
    Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: September 19, 2006
    Assignee: FormFactor, Inc.
    Inventors: Charles A. Miller, Benjamin N. Eldridge
  • Patent number: 6597784
    Abstract: An automatic main distributing frame, which can easily maintain the size accuracy required to insert into a through hole of the conductive pin is provided. The main distributing frame includes a frame body, plural matrix switch boards accommodated in the frame body, each having matrix switch sections and input/output connectors on a rear section, a back wire board provided on a rear section of the frame body, having connectors connected to the input/output connectors on each rear section of the plural matrix switch boards, and plural robots, each positioned between a pair of two matrix switch board sections of the plural matrix switch boards, each having a hand section for inserting connection pins to the matrix switch sections of the two matrix switch boards.
    Type: Grant
    Filed: April 8, 1999
    Date of Patent: July 22, 2003
    Assignee: Fujitsu Limited
    Inventors: Eiichi Kakihara, Koji Honda
  • Publication number: 20030027449
    Abstract: A connector for connecting conductors of a flexible circuit to conductive elements of a printed circuit comprising a one-piece, plastic housing defining at least one opening for access of the printed circuit conductive features to the connector for contact with conductors, of a flexible circuit located in the connector and biased for conductive contact with the printed circuit features by a contact biasing spring, the flexible circuit and spring being mounted to a sled located in the housing by flexible circuit and spring mounting posts of the sled, a resiliently biased detent engage openings in the housing to support the sled; an associated method is also provided.
    Type: Application
    Filed: August 8, 2002
    Publication date: February 6, 2003
    Inventors: Joseph A Roberts, Jonathan F Roberts
  • Patent number: 6443738
    Abstract: A wiring unit 1 includes a plurality of crimping terminals 2; and a plurality of insulating plates for holding said crimping terminals. The insulating plate 2 has a terminal groove 5 concaved from the surface, an accommodating portion 6 and a through-hole 7. The accommodating portion 6 is formed in concave from one of a pair of partition walls 9a and 9b constituting the terminal accommodating groove 5. The through-hole 7 passes through the insulating plate 2 and communicates with the accommodating portion 6. The crimping terminal 3 is composed of the electric-wire connecting portion 13 on which the electric wire is crimped and an electric-wire connecting portion 14. The insulating plates 2 are stacked while holding the crimping terminals 3. The electric contact portions 14 of the crimping terminals 3 held in the adjacent lower and upper insulating plates 2 are not superposed.
    Type: Grant
    Filed: June 13, 2001
    Date of Patent: September 3, 2002
    Assignee: Yazaki Corporation
    Inventors: Makoto Yamanashi, Takao Murakami, Hiroyuki Suzuki
  • Publication number: 20020055277
    Abstract: An electronic package is provided. The electronic package includes a chip carrier having a first conductive layer which includes at least one signal track and at least one contact area, the contact area being electrically connected to the signal track and adapted for transmitting a high-frequency signal. The chip carrier further includes a reference structure having at least two conductive layers such that the signal track is electrically shielded by the reference structure. A semiconductor chip is positioned on the chip carrier and includes at least one terminal electrically interconnected to the at least one contact area.
    Type: Application
    Filed: October 23, 2001
    Publication date: May 9, 2002
    Applicant: International Business Machines Corporation
    Inventors: Stefano Oggioni, Roberto Ravanelli
  • Patent number: 6339733
    Abstract: It is provided an automatic MDF control system comprising: a plurality of matrix boards provided with openings in locations where a plurality of first wires and second wires cross without electrical connections; a robot which inserts electrically conductive connecting pins into the openings and connects the first wires with the second wires where the pins are inserted; a path data conversion unit converting connection requests from an operating terminal into path data having a plurality of addresses of the openings; a robot command conversion unit receiving the path data and converting the path data into robot commands for controlling activity of the robot as a distance moved by the robot moving between the plurality of addresses being reduced by a selected sequence of the converted path data; and a robot control unit controlling the activity of the robot based on the robot commands.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: January 15, 2002
    Assignee: Fujitsu Limited
    Inventors: Takashi Mizutani, Masaaki Muraai, Hitoshi Isobe, Atsuhiro Makino, Masahiro Ito
  • Patent number: 6327150
    Abstract: A disk drive test device for performing a test (e.g., power only self test, tests which use a serial interface) on at least one disk drive at a time. The test device includes an electrical connector which is configured so as to be able to provide the necessary electrical interconnections for executing a test on disk drives having different types of drive interface connectors (i.e., the same electrical connector may be used with at least 2 different types of drive interface connectors). There is no need to use an in-line adapter to electrically interconnect a disk drive having a first drive interface connector or to electrically interconnect a disk drive having a second drive interface connector. There is also is no need to change out the electrical connector when performing a test on disk drives which use this different types of drive interface connectors.
    Type: Grant
    Filed: February 10, 2000
    Date of Patent: December 4, 2001
    Assignee: Maxtor Corporation
    Inventors: Lloyd E. Levy, Duc Banh, Danilo Bueno
  • Patent number: 6300698
    Abstract: A hermetic compressor and electrical connector therefor. A shell of the compressor defines an internal chamber and a motor positioned inside the shell within the chamber drives the compressor. The motor has a stator assembly including a winding. A hermetic terminal plug connects the winding to a power supply to energize the motor. The plug has an internal conductor pin electrically connected to a corresponding external conductor pin. The internal conductor pin protrudes into the internal chamber for connection to the winding and the external conductor pin extends away from the shell for connection to the power supply for energizing the motor. The compressor also includes a terminal block mounted on the stator assembly for supporting an end portion of the winding. The terminal block has a notch aligned with the internal conductor pin for receiving the internal conductor pin when the motor is positioned inside the shell.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: October 9, 2001
    Assignee: Emerson Electric Co.
    Inventors: Vincent P. Fargo, J. Scott Rose, Kent L. White, John H. Hussey
  • Patent number: 6238220
    Abstract: A communication main layout rack structure includes a first PC board, a second PC board, several insertion seats, several pairs of insertion pins, several bus lines, several mating insertion seat, and several connectors. A central portion of the first PC board is formed with multiple copper-plated insertion holes arranged in a square pattern, while upper and lower sections of the one side edge of the first PC board are respectively formed with an insertion seat soldering section. Similarly, a central portion of the second PC board is formed with multiple copper-plated insertion holes arranged in a square pattern, while front and rear sections of an upper side edge of the second PC board are respective formed with an insertion seat soldering section, the insertion seats being soldered to the insertion seat soldering sections of the front faces of the first and second PC boards, and the mating insertion seats being respectively connected with one end of the bus lines and inserted into the insertion seats.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: May 29, 2001
    Assignee: Ching Feng Blinds Ind. Co., Ltd.
    Inventor: Pey-Son Hsu
  • Patent number: 6116912
    Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.
    Type: Grant
    Filed: September 15, 1998
    Date of Patent: September 12, 2000
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe
  • Patent number: 6049039
    Abstract: A printed circuit terminal includes a main terminal body and an integrally formed fixing portion that is coaxial with the terminal body for mounting the terminal to a printed circuit base member. A frusto-conical flange is integrally connected between the body and the fixing portion and has a peripheral surface located in radially outward relation to the body and the fixing portion. The flange includes two surface portions. The first surface portion is adapted to contact and extend from the base member for receiving solder deposited in electrical contact with the base member. A second surface portion is axially adjacent to the first portion and exposes a different surface material than the first portion in order to restrain solder adhesion to the second surface portion.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: April 11, 2000
    Assignee: Star Micronics Co., Ltd.
    Inventor: Isao Fushimi
  • Patent number: 5975913
    Abstract: The interconnection board includes a plurality of non-conductive insulation layers and through-holes running through the insulation layers. A plurality of conductive patterns are provided on each insulation layer, electrically insulated from each other, and exposed to the inside of one through-hole at the same axial position of the through-hole. The connection pin has a non-conductive stem and a connection pattern provided on the non-conductive stem. The connection pattern extends in the axial direction of the connection pin and electrically connects two conductive patterns provided on different insulation layers at the same circumferential position in the through-hole, by bringing the conductive patterns into contact at positions which are axially different and circumferentially the same.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: November 2, 1999
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Shigehito Wada, Hisashi Saitou, Kazutoshi Morishima
  • Patent number: 5870528
    Abstract: An automatic main distributing frame (MDF) apparatus for connecting and disconnecting an exchange and a user terminal includes a first-staged matrix board having a plurality of input/output lines, the input/output lines being disposed in a matrix pattern. The MDF apparatus also includes second-staged and third-staged matrix boards having a plurality of input/output lines, the input/output lines also being disposed in matrix patterns. The second-staged matrix board is disposed perpendicular to the first matrix board and the third-staged matrix board is disposed perpendicular to the second matrix board. A center board is disposed between the first-staged matrix board and the second-staged matrix board and between the second-staged matrix board and the third-staged matrix board. The center board, the first-staged matrix board, the second-staged matrix board, and the third-staged matrix board are mutually connected through connectors.
    Type: Grant
    Filed: November 25, 1996
    Date of Patent: February 9, 1999
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Haruyuki Fukuda
  • Patent number: 5790651
    Abstract: Automatic distribution equipment for connecting and disconnecting lines includes a frame body, a plurality of matrix-switch-board units arranged in the frame body in a stack formation, and a robot provided in a side of the frame body. Each of the matrix-switch-board units has two wiring-pattern arrays which are respectively formed in opposite sides of each of the units so as to be electrically isolated from each other and to cross each other, wherein when a connection pin is inserted into one of through holes formed at cross points of the two wiring-pattern arrays, respective wiring patterns of the two wiring-pattern arrays are connected to each other. The robot moves between two of the matrix-switch-board units, and inserts-and-extracts the connection pin into-and-from a designated through hole to connect-and-disconnect designated lines.
    Type: Grant
    Filed: June 12, 1996
    Date of Patent: August 4, 1998
    Assignee: Fujitsu Limited
    Inventors: Toshihiro Suzuki, Naoto Kaneko, Eiichi Kakihara, Koichi Shimamura, Yasunori Hachiyama, Hirofumi Oosawa, Hitoshi Isobe
  • Patent number: 5693552
    Abstract: A ROM device with a 3-dimensional memory cell structure that allows a high packing density of memory cells in the ROM device. The ROM device includes a silicon substrate having a plurality of parallel trenches formed thereon. These trenches define mesa regions therebetween. Source/drain regions are then formed on the trenches and the mesa regions. Sidewall spacers are formed on lateral sides of selected trenches. A gate oxide layer is then formed over the silicon substrate. Gate layers are then formed on the gate oxide layers along a direction perpendicular to the trenches. These gate layers serve as word lines. The bit lines over the trenches and the mesa regions utilize channel areas between each neighboring pair of source/drain regions in the horizontal direction to define a plurality of horizontal memory cells at intersections with the word lines. Each horizontal memory cell can be programmed by ion implantation.
    Type: Grant
    Filed: April 29, 1996
    Date of Patent: December 2, 1997
    Assignee: United Microelectronics Corporation
    Inventor: Chen-Chung Hsu
  • Patent number: 5635670
    Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.
    Type: Grant
    Filed: January 5, 1996
    Date of Patent: June 3, 1997
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Kubota, Norio Sakai, Shoichi Kawabata
  • Patent number: 5635669
    Abstract: A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 3, 1997
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Kubota, Norio Sakai, Shoichi Kawabata
  • Patent number: 5604328
    Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: February 18, 1997
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Kubota, Norio Sakai, Shoichi Kawabata
  • Patent number: 5544004
    Abstract: In a pin-board matrix switch X- and Y-direction patterns are arranged in the X and Y directions to constitute a matrix. Crosspoint holes are formed at the crosspoints between the X- and Y-direction patterns. Each crosspoint hole has contacts formed therein. The contacts are connected to the patterns. A connecting pin has contact springs. The connecting pin is selectively inserted into the crosspoint holes to electrically connecting the contacts of the X-direction patterns and the Y-direction patterns which are adjacent to each other in the Z direction. Insulating members are arranged between the X- and Y-direction patterns. At least one pair of the X-direction patterns and the Y-direction patterns is constituted by first and second wiring layers arranged in the Z direction via insulating members.
    Type: Grant
    Filed: October 11, 1994
    Date of Patent: August 6, 1996
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Shuichiro Inagaki, Tadashi Hirono, Shigefumi Hosokawa
  • Patent number: 5515241
    Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 7, 1996
    Assignee: Interconnect Systems, Inc.
    Inventor: William E. Werther
  • Patent number: 5513076
    Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: April 30, 1996
    Assignee: Interconnect Systems, Inc.
    Inventor: William E. Werther
  • Patent number: 5501605
    Abstract: The present invention provides a connecting configuration in wiring harness assembly or in a junction box used in the wiring harness assembly, wherein a plurality of individual primary wires and branch wires branched therefrom to form sub wiring harnesses are connected to each other per predetermined circuits by connecting means by way of electrically insulating members each made of a sheet or a thin plate covering the joint portions therebetween, which insulating members being piled up in one-on-another form, so that the entire wire connecting configuration can be accommodated in one casing or one box. Since the connecting configuration according to the present invention is constructed as such, minimization, weight saving and integration of a wiring harness assembly or a junction box used therein are all enabled, and alterations including replacement of or addition to the circuits are readily performed.
    Type: Grant
    Filed: May 26, 1994
    Date of Patent: March 26, 1996
    Assignee: Yazaki Corporation
    Inventors: Keiichi Ozaki, Sanae Kato, Yoshimi Masuda
  • Patent number: 5481435
    Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.
    Type: Grant
    Filed: July 22, 1994
    Date of Patent: January 2, 1996
    Assignee: Interconnect Systems, Inc.
    Inventor: William E. Werther
  • Patent number: 5481436
    Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed. The interconnect board can have layers assigned to specific voltages, in a power-translation design.
    Type: Grant
    Filed: October 18, 1994
    Date of Patent: January 2, 1996
    Assignee: Interconnect Systems, Inc.
    Inventor: William E. Werther
  • Patent number: 5479319
    Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.
    Type: Grant
    Filed: December 30, 1992
    Date of Patent: December 26, 1995
    Assignee: Interconnect Systems, Inc.
    Inventor: William E. Werther
  • Patent number: 5390081
    Abstract: Fault-tolerant power distribution system for back-mounted hardware in which a backplane arrangement delivers alternative sources of system power in a prioritized pattern to each of a plurality of fault-tolerant electronic cards via a plurality of system slots, each slot including a power port having electrical contacts in a common system pinout, and the cooperating system cards have electrical contacts in the same common system pinout. Any of the system cards can be installed in any system slot and will receive the system power in one of a plurality of fault-tolerant prioritizations.
    Type: Grant
    Filed: March 22, 1993
    Date of Patent: February 14, 1995
    Assignee: Stratus Computer, Inc.
    Inventor: Keith St. Pierre
  • Patent number: 5337219
    Abstract: A method for altering an electrical connection in an electronic package including one or more semiconductor chips overlying, i.e., mounted directly onto, or mounted onto one or more modules which are mounted onto, a substrate such as a printed circuit card or printed circuit board, as well as the resulting electronic package, is disclosed. In accordance with a preferred embodiment of the inventive method, at least one plated, solder-filled hole in the substrate is drilled out to eliminate an unwanted electrical connection. A solder region, e.g., a solder ball, is inserted into the drilled out hole into contact with an electrically conductive member, e.g., an electrically conductive pin, extending from, for example, a module into the hole. A cylinder, including a central core of electrically conductive material, encircled by an annulus of electrically insulating material, is inserted into the hole.
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: August 9, 1994
    Assignee: International Business Machines Corporation
    Inventors: Dennis C. Carr, Edward P. McLeskey, Frank H. Sarnacki
  • Patent number: 5290191
    Abstract: A wafer-like insert has a plurality of holes therein which correspond to pins of an electrical connector. The wafer includes contacts for making electrical connection to the pins, connector shell or electrical components. In such manner, the wafer can be used for a wide variety of purposes such as conditioning signals carried by the pins and grounding selected pin(s) to each other and/or the connector shell. The wafer can be installed in any common electrical connector pair without prior modification or preparation of the connectors and without impairing the normal fit or function of the mated connector pair.
    Type: Grant
    Filed: August 31, 1992
    Date of Patent: March 1, 1994
    Inventors: Kevin G. Foreman, Willie C. Kiser, Karin J. Lovett, Paul J. Miller
  • Patent number: 5268819
    Abstract: A printed circuit board upon which are mounted a number of electronic components is provided with a connector strip for electrically coupling the components to respective components on a second circuit board located underneath. The strip comprises a body portion and pins projecting thereform. The pins have a stepwise configuration with a first end portion extending through apertures in the upper circuit board and connected to a second connector strip on the second circuit board, a second end portion extending through the body portion, and a middle portion which abuts the surface of the upper circuit board and by which the strip is connected to the upper circuit board by means of a solder joint. Components on the upper circuit board are electrically coupled by means of tracks which are connected to the components at one end by a solder joint and at the other end by a solder joint, via pins, to the second connector strip and tracks on the lower circuit board.
    Type: Grant
    Filed: March 9, 1992
    Date of Patent: December 7, 1993
    Assignee: Nokia Mobile Phones Ltd.
    Inventor: Pekka S. Lonka
  • Patent number: 5257165
    Abstract: A PGA adaptor mounting hardware comprising a PGA adaptor which has a plurality of double-head fastening pins and contact pins with flush type contact terminals, and a printed circuit board which has apertures, a printed circuit with conductive points on a top edge thereof, and a transistor circuit on a bottom edge thereof with contact terminals aligned to and electrically connected to the conductive points of the printed circuit for mounting an IC. The printed circuit board is covered with a layer of tin paste over the apertures and the contact terminals of the printed circuit thereby, permitting the PGA adaptor to be connected thereto by inserting the double-head fastening pins into the apertures and, soldering the contact terminals of the contact pins to the conductive points of the printed circuit.
    Type: Grant
    Filed: February 13, 1992
    Date of Patent: October 26, 1993
    Assignee: Jaton Technology Co., Ltd.
    Inventor: Jung-Shan Chiang
  • Patent number: 5225968
    Abstract: A computer functional card connecting apparatus comprised of a base having two parallel channel frames at two opposite ends thereof at right angles, wherein the base has a step block longitudinally disposed at the top with pin holes formed thereon, an elongated groove longitudinally disposed on the bottom with vertical contact pins made thereon for connecting to a mother board, transverse contact pins on an inner side for electrically connecting a computer functional card that has been inserted in between the two parallel channel frames, and a circuit board set between the step block and the bottom groove for electrically connecting said transverse contact pins, the vertical contact pins and the pin holes.
    Type: Grant
    Filed: March 10, 1992
    Date of Patent: July 6, 1993
    Inventor: Hsi K. Ma
  • Patent number: 5044966
    Abstract: An electrical panel for particularly supporting and supplying electrical connections for a plurality of electrical components comprises a sandwich formed by a central conducting layer computer design to form a plurality of conducting paths which are laser cut from a sheet of cooper and a pair of covering plastic layers of insulating material. Mechanical anchoring points extend through the sandwich missing the conducting paths into an optional supporting steel sheet. Electrical connecting points comprise screw threaded pins which engage into female screw threads formed in the front insulating layer and into the conducting layer.
    Type: Grant
    Filed: May 23, 1989
    Date of Patent: September 3, 1991
    Inventor: Peter Friesen
  • Patent number: 5040996
    Abstract: A central circuit arrangement for motor vehicles for central connection of electrical components such as fuses, switchgear, cable harnesses, electronic control units for electrical consumers and similar, comprises a layered conductor packet consisting of flat printed circuit boards superimposed in various planes and mutually separated by insulating boards. In order to establish a large number of different printed circuit board circuits separately and selectively in accordance with the relevant requirements, an electric distributing board (10) is inserted between two neighboring insulating boards (9, 11). Pin strips (21) for making contact with the printed circuit boards (8, 12) adjacent to the insulating boards (9, 11) are mounted on the distributing board (10). A strip conductor (25) with a free connection (26) is associated with each pin (22) of each pin strip (21). A plurality of other separate strip conductors (27) with at least two connections (28) are provided on the distributing board (10).
    Type: Grant
    Filed: July 2, 1990
    Date of Patent: August 20, 1991
    Assignee: Franz Kirsten Elektrotechnische Spezialfabrik
    Inventors: Ulrich Kobold, Heinz J. Kuhn, Karl F. Butzbach, Manfred Hill
  • Patent number: 5031073
    Abstract: A method and apparatus for electrically connecting circuitry on a printed circuit board having a plurality of circuit regions, with each circuit region having components operatively associated with input and output signal lines that are electrically isolated from the signal lines of adjacent circuit regions. The input and output signal lines of a particular circuit region are arranged in a closely spaced pattern aligned with a corresponding pattern of traces on an adjacent circuit region. A plurality of connector members are selectively attached to the printed circuit board to provide signal communication among the regions. Each connector member has closely spaced conductive bars which are exposed to contact the signal lines. The conductive bars have a length and a pitch such that the bars place parallel trace patterns in electrical communication when pressed in place.
    Type: Grant
    Filed: May 2, 1990
    Date of Patent: July 9, 1991
    Assignee: Hewlett-Packard Company
    Inventor: Cheng-Cheng Chang
  • Patent number: 5017145
    Abstract: A matrix switching device includes a matrix board and a connecting pin. X-conductor patterns are arranged in parallel with each other on one surface of the matrix board, and Y-conductor patterns are arranged in parallel with each other on the other surface. Both the patterns are arranged in a matrix form. At each crossing point of the both patterns, a through hole having conductive portions respectively connected to the X- and Y-conductor patterns and an intermediate isolation portion for interrupting conduction between the conductive portions is formed in the matrix board. The connecting pin includes conductive portions respectively electrically connected to the X- and Y-conductor patterns through the conductive portions of the through hole upon insertion of the connecting pin into the through hole.
    Type: Grant
    Filed: April 24, 1989
    Date of Patent: May 21, 1991
    Assignee: Nippon Telegraph & Telephone Corporation
    Inventors: Tsuneo Kanai, Shigefumi Hosokawa, Yasuo Kumakura, Shigeru Umemura, Shuichiro Inagaki
  • Patent number: 5010463
    Abstract: The present invention is an electrified bulletin board display assembly including a composite board and an illuminable push-pin for insertion therein. The board itself includes a pair of conducting layers spaced apart by an insulative layer and connected to an electrical power source. When inserted into the bulletin board, bi-terminals of the push-pin each respectively contacts one of the conductive layers. An additional layer is provided in the board to retain the push-pin in the assembly and ensure contact between the conductive layers and the bi-terminals. As constructed, the entire field of the bulletin board is capable of receiving and illuminating a number of illuminable push-pins randomly inserted therein.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: April 23, 1991
    Inventor: David L. Ross
  • Patent number: 4859188
    Abstract: An apparatus and method for creating a stack assembly of print circuit boards and for providing electrical interconnection between the individual through-plated hole pads of the circuit boards is described. The preferred embodiment of the present invention is a device comprised of two parts: a slotted disk and a wire. The slotted disk is attached to the surface of the printed circuit board so as to cover a hole pad and form an electrical connection therewith. The covered holes of the printed circuit board are axially aligned between circuit boards and an electrically conducting wire is inserted through the slotted disks on the circuit boards to form an electrical connection therewith.
    Type: Grant
    Filed: February 3, 1989
    Date of Patent: August 22, 1989
    Assignee: Cray Research, Inc.
    Inventor: Eugene F. Neumann
  • Patent number: 4830620
    Abstract: An electrical connector comprises four conductor elements each having a surface portion which is spaced from, but presented towards, a first axis. The surface portions are equiangularly distributed about the first axis and are substantially equidistant from the first axis. Each conductor element extends at least partly between first and second planes which are perpendicular to the first axis. A rod structure has a central axis, the rod structure comprises four elongate bodies of conductive material which are supported in mutually electrically insulated relationship. The bodies of conductive material are substantially parallel to each other and substantially equiangularly distributed about the central axis of the rod structure and substantially equidistant therefrom.
    Type: Grant
    Filed: October 15, 1987
    Date of Patent: May 16, 1989
    Inventors: Daniel W. Marks, Richard Schmachtenberg, III