Abstract: Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.

Abstract: A multi-phase busbar for conducting electric energy includes: an insulating base layer made of an insulating material; a first conducting layer made of a sheet metal arranged on and adhesively bonded to the base layer; a first connecting pin mounted to the first conducting layer which extends in a direction with respect to the first conducting layer; a first insulating layer arranged on and adhesively bonded to the first conducting layer; a second conducting layer made of a sheet metal arranged on and adhesively bonded to the first insulating layer, the second conducting layer including a second connecting pin which extends in a direction parallel to the first connecting pin; and a second insulating layer arranged on and adhesively bonded to the second conducting layer. The second conducting layer and the first and second insulating layer each include at least one pinhole through which the first connecting pin projects.

Abstract: It is aimed to simplify the shape of a short-circuit means. A joint connector (A) includes a housing (10), a plurality of terminal fittings (35F, 35S, 35T) provided in the housing (10) and each formed such that a plurality of tabs (37F, 37D, 7R) are coupled by a terminal base portion (36), and a short-circuit module (40) provided in the housing (10) and formed by arranging a plurality of short-circuit plates (42) side by side in a length direction of the tabs (37F, 37D, 37R). The short-circuit plate (42) is formed with a plurality of conduction holes (45) for allowing the tabs (37F, 37D, 37R) to pass therethrough in a contact state and non-contact holes (44) for allowing the tabs (37F, 37D, 37R) to pass therethrough in a non-contact state, and an arrangement of the plurality of conduction holes (45) differs among the plurality of short-circuit plates (42).

Abstract: A connection assisting member, for connecting a first circuit board having one or more through-holes each of which has a first contact portion formed on an inner surface thereof and a second circuit board having one or more bendable second contact portions, includes a base plate, and one or more projections projecting on a surface of the base plate and having elasticity, when fitted in a corresponding through-hole of the first circuit board as catching a corresponding second contact portion of the second circuit board, each of the one or more projections elastically presses the corresponding second contact portion of the second circuit board against the inner surface of the corresponding through-hole to electrically connect the first contact portion and the corresponding second contact portion to each other.

Abstract: A micro-electro-mechanical systems (MEMS) terminal structure of board-to-board electrical connector and manufacturing method thereof are provided. The terminal of the terminal structure includes a side arm, a bent portion, and a flexible arm integrally formed as one component. The flexible arm includes a first portion and a second portion. The first portion and the side arm form an insertion space. The second portion and the side arm form a locking space. The second portion of the flexible arm has a contact portion. The insertion space is greater than the locking space. The terminal has curved and locking features to extend the moment arm of the terminal for improving the terminal flexibility. The terminal contacts a mating terminal through multiple points, thereby improving the contact stability and providing the locking function. Furthermore, by using the MEMS techniques for semiconductor industries, the terminal of micro board-to-board electrical connector can be manufactured.

Abstract: A method of manufacturing a printed circuit board is disclosed. A method of manufacturing a printed circuit board, which includes: forming at least one interlayer connector on a first carrier, stacking at least one insulation layer on the first carrier such that the interlayer connector is exposed, removing the first carrier, and forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector, can be used to increase the density of circuit patterns, as the method can provide electrical connection between circuit patterns and vias without using lands.

Abstract: An access control device (10) has an electronic/electric control unit (19) fed with electrical current via an electrically conductive fastener (28), such as the ones that also function to clamp the outdoor and indoor housings (15, 17) of the device (10) together against the opposed sides of a door (12) or the like.

Abstract: A demountable pellet is disclosed for use as an electrode contact assembly. The pellet comprises a base 1 upon which is mounted a plurality of electrodes 18, 19, 20 arranged in respective spaced parallel planes and having respective contacts 23, 24, 25 protruding from them. A closure 2 for the base 1 has a member 11, 12, 13 engaging at least one of the electrode contacts. In an unassembled condition of the pellet, with the closure 2 separate from the base 1 and each closure member disengaged from its respective electrode contact, the contacts 23, 24, 25 lie in respective spaced parallel planes. In the assembled condition of the pellet with each closure member engaging its respective electrode contact, at least one of the contacts 23, 24, 25 lies in a plane other than that in which it lay in the unassembled condition of the pellet.

Abstract: An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface.

Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.

Abstract: A method for making a contact begins by providing a sheet of material. A portion of the sheet is deep drawn to form a cavity having at least one side wall, the cavity extending away from a rim formed by a non-drawn portion of the sheet. At least one spring member is defined from the at least one side wall and is bent such that at least a portion of the at least one spring member extends beyond the rim.

Abstract: A method for making a contact begins by providing a sheet of material. A portion of the sheet is deep drawn to form a cavity having at least one sidewall, the cavity extending away from a rim formed by a non-drawn portion of the sheet. At least one spring member is defined from the at least one sidewall and is bent such that at least a portion of the at least one spring member extends beyond the rim.

Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.

Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.

Abstract: An automatic main distributing frame, which can easily maintain the size accuracy required to insert into a through hole of the conductive pin is provided. The main distributing frame includes a frame body, plural matrix switch boards accommodated in the frame body, each having matrix switch sections and input/output connectors on a rear section, a back wire board provided on a rear section of the frame body, having connectors connected to the input/output connectors on each rear section of the plural matrix switch boards, and plural robots, each positioned between a pair of two matrix switch board sections of the plural matrix switch boards, each having a hand section for inserting connection pins to the matrix switch sections of the two matrix switch boards.

Abstract: A connector for connecting conductors of a flexible circuit to conductive elements of a printed circuit comprising a one-piece, plastic housing defining at least one opening for access of the printed circuit conductive features to the connector for contact with conductors, of a flexible circuit located in the connector and biased for conductive contact with the printed circuit features by a contact biasing spring, the flexible circuit and spring being mounted to a sled located in the housing by flexible circuit and spring mounting posts of the sled, a resiliently biased detent engage openings in the housing to support the sled; an associated method is also provided.

Abstract: A wiring unit 1 includes a plurality of crimping terminals 2; and a plurality of insulating plates for holding said crimping terminals. The insulating plate 2 has a terminal groove 5 concaved from the surface, an accommodating portion 6 and a through-hole 7. The accommodating portion 6 is formed in concave from one of a pair of partition walls 9a and 9b constituting the terminal accommodating groove 5. The through-hole 7 passes through the insulating plate 2 and communicates with the accommodating portion 6. The crimping terminal 3 is composed of the electric-wire connecting portion 13 on which the electric wire is crimped and an electric-wire connecting portion 14. The insulating plates 2 are stacked while holding the crimping terminals 3. The electric contact portions 14 of the crimping terminals 3 held in the adjacent lower and upper insulating plates 2 are not superposed.

Abstract: An electronic package is provided. The electronic package includes a chip carrier having a first conductive layer which includes at least one signal track and at least one contact area, the contact area being electrically connected to the signal track and adapted for transmitting a high-frequency signal. The chip carrier further includes a reference structure having at least two conductive layers such that the signal track is electrically shielded by the reference structure. A semiconductor chip is positioned on the chip carrier and includes at least one terminal electrically interconnected to the at least one contact area.

Abstract: It is provided an automatic MDF control system comprising: a plurality of matrix boards provided with openings in locations where a plurality of first wires and second wires cross without electrical connections; a robot which inserts electrically conductive connecting pins into the openings and connects the first wires with the second wires where the pins are inserted; a path data conversion unit converting connection requests from an operating terminal into path data having a plurality of addresses of the openings; a robot command conversion unit receiving the path data and converting the path data into robot commands for controlling activity of the robot as a distance moved by the robot moving between the plurality of addresses being reduced by a selected sequence of the converted path data; and a robot control unit controlling the activity of the robot based on the robot commands.

Abstract: A disk drive test device for performing a test (e.g., power only self test, tests which use a serial interface) on at least one disk drive at a time. The test device includes an electrical connector which is configured so as to be able to provide the necessary electrical interconnections for executing a test on disk drives having different types of drive interface connectors (i.e., the same electrical connector may be used with at least 2 different types of drive interface connectors). There is no need to use an in-line adapter to electrically interconnect a disk drive having a first drive interface connector or to electrically interconnect a disk drive having a second drive interface connector. There is also is no need to change out the electrical connector when performing a test on disk drives which use this different types of drive interface connectors.

Abstract: A hermetic compressor and electrical connector therefor. A shell of the compressor defines an internal chamber and a motor positioned inside the shell within the chamber drives the compressor. The motor has a stator assembly including a winding. A hermetic terminal plug connects the winding to a power supply to energize the motor. The plug has an internal conductor pin electrically connected to a corresponding external conductor pin. The internal conductor pin protrudes into the internal chamber for connection to the winding and the external conductor pin extends away from the shell for connection to the power supply for energizing the motor. The compressor also includes a terminal block mounted on the stator assembly for supporting an end portion of the winding. The terminal block has a notch aligned with the internal conductor pin for receiving the internal conductor pin when the motor is positioned inside the shell.

Abstract: A communication main layout rack structure includes a first PC board, a second PC board, several insertion seats, several pairs of insertion pins, several bus lines, several mating insertion seat, and several connectors. A central portion of the first PC board is formed with multiple copper-plated insertion holes arranged in a square pattern, while upper and lower sections of the one side edge of the first PC board are respectively formed with an insertion seat soldering section. Similarly, a central portion of the second PC board is formed with multiple copper-plated insertion holes arranged in a square pattern, while front and rear sections of an upper side edge of the second PC board are respective formed with an insertion seat soldering section, the insertion seats being soldered to the insertion seat soldering sections of the front faces of the first and second PC boards, and the mating insertion seats being respectively connected with one end of the bus lines and inserted into the insertion seats.

Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.

Abstract: A printed circuit terminal includes a main terminal body and an integrally formed fixing portion that is coaxial with the terminal body for mounting the terminal to a printed circuit base member. A frusto-conical flange is integrally connected between the body and the fixing portion and has a peripheral surface located in radially outward relation to the body and the fixing portion. The flange includes two surface portions. The first surface portion is adapted to contact and extend from the base member for receiving solder deposited in electrical contact with the base member. A second surface portion is axially adjacent to the first portion and exposes a different surface material than the first portion in order to restrain solder adhesion to the second surface portion.

Abstract: The interconnection board includes a plurality of non-conductive insulation layers and through-holes running through the insulation layers. A plurality of conductive patterns are provided on each insulation layer, electrically insulated from each other, and exposed to the inside of one through-hole at the same axial position of the through-hole. The connection pin has a non-conductive stem and a connection pattern provided on the non-conductive stem. The connection pattern extends in the axial direction of the connection pin and electrically connects two conductive patterns provided on different insulation layers at the same circumferential position in the through-hole, by bringing the conductive patterns into contact at positions which are axially different and circumferentially the same.

Abstract: An automatic main distributing frame (MDF) apparatus for connecting and disconnecting an exchange and a user terminal includes a first-staged matrix board having a plurality of input/output lines, the input/output lines being disposed in a matrix pattern. The MDF apparatus also includes second-staged and third-staged matrix boards having a plurality of input/output lines, the input/output lines also being disposed in matrix patterns. The second-staged matrix board is disposed perpendicular to the first matrix board and the third-staged matrix board is disposed perpendicular to the second matrix board. A center board is disposed between the first-staged matrix board and the second-staged matrix board and between the second-staged matrix board and the third-staged matrix board. The center board, the first-staged matrix board, the second-staged matrix board, and the third-staged matrix board are mutually connected through connectors.

Abstract: Automatic distribution equipment for connecting and disconnecting lines includes a frame body, a plurality of matrix-switch-board units arranged in the frame body in a stack formation, and a robot provided in a side of the frame body. Each of the matrix-switch-board units has two wiring-pattern arrays which are respectively formed in opposite sides of each of the units so as to be electrically isolated from each other and to cross each other, wherein when a connection pin is inserted into one of through holes formed at cross points of the two wiring-pattern arrays, respective wiring patterns of the two wiring-pattern arrays are connected to each other. The robot moves between two of the matrix-switch-board units, and inserts-and-extracts the connection pin into-and-from a designated through hole to connect-and-disconnect designated lines.

Abstract: A ROM device with a 3-dimensional memory cell structure that allows a high packing density of memory cells in the ROM device. The ROM device includes a silicon substrate having a plurality of parallel trenches formed thereon. These trenches define mesa regions therebetween. Source/drain regions are then formed on the trenches and the mesa regions. Sidewall spacers are formed on lateral sides of selected trenches. A gate oxide layer is then formed over the silicon substrate. Gate layers are then formed on the gate oxide layers along a direction perpendicular to the trenches. These gate layers serve as word lines. The bit lines over the trenches and the mesa regions utilize channel areas between each neighboring pair of source/drain regions in the horizontal direction to define a plurality of horizontal memory cells at intersections with the word lines. Each horizontal memory cell can be programmed by ion implantation.

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Abstract: A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Abstract: In a pin-board matrix switch X- and Y-direction patterns are arranged in the X and Y directions to constitute a matrix. Crosspoint holes are formed at the crosspoints between the X- and Y-direction patterns. Each crosspoint hole has contacts formed therein. The contacts are connected to the patterns. A connecting pin has contact springs. The connecting pin is selectively inserted into the crosspoint holes to electrically connecting the contacts of the X-direction patterns and the Y-direction patterns which are adjacent to each other in the Z direction. Insulating members are arranged between the X- and Y-direction patterns. At least one pair of the X-direction patterns and the Y-direction patterns is constituted by first and second wiring layers arranged in the Z direction via insulating members.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract: The present invention provides a connecting configuration in wiring harness assembly or in a junction box used in the wiring harness assembly, wherein a plurality of individual primary wires and branch wires branched therefrom to form sub wiring harnesses are connected to each other per predetermined circuits by connecting means by way of electrically insulating members each made of a sheet or a thin plate covering the joint portions therebetween, which insulating members being piled up in one-on-another form, so that the entire wire connecting configuration can be accommodated in one casing or one box. Since the connecting configuration according to the present invention is constructed as such, minimization, weight saving and integration of a wiring harness assembly or a junction box used therein are all enabled, and alterations including replacement of or addition to the circuits are readily performed.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed. The interconnect board can have layers assigned to specific voltages, in a power-translation design.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract: Fault-tolerant power distribution system for back-mounted hardware in which a backplane arrangement delivers alternative sources of system power in a prioritized pattern to each of a plurality of fault-tolerant electronic cards via a plurality of system slots, each slot including a power port having electrical contacts in a common system pinout, and the cooperating system cards have electrical contacts in the same common system pinout. Any of the system cards can be installed in any system slot and will receive the system power in one of a plurality of fault-tolerant prioritizations.

Abstract: A method for altering an electrical connection in an electronic package including one or more semiconductor chips overlying, i.e., mounted directly onto, or mounted onto one or more modules which are mounted onto, a substrate such as a printed circuit card or printed circuit board, as well as the resulting electronic package, is disclosed. In accordance with a preferred embodiment of the inventive method, at least one plated, solder-filled hole in the substrate is drilled out to eliminate an unwanted electrical connection. A solder region, e.g., a solder ball, is inserted into the drilled out hole into contact with an electrically conductive member, e.g., an electrically conductive pin, extending from, for example, a module into the hole. A cylinder, including a central core of electrically conductive material, encircled by an annulus of electrically insulating material, is inserted into the hole.

Abstract: A wafer-like insert has a plurality of holes therein which correspond to pins of an electrical connector. The wafer includes contacts for making electrical connection to the pins, connector shell or electrical components. In such manner, the wafer can be used for a wide variety of purposes such as conditioning signals carried by the pins and grounding selected pin(s) to each other and/or the connector shell. The wafer can be installed in any common electrical connector pair without prior modification or preparation of the connectors and without impairing the normal fit or function of the mated connector pair.

Abstract: A printed circuit board upon which are mounted a number of electronic components is provided with a connector strip for electrically coupling the components to respective components on a second circuit board located underneath. The strip comprises a body portion and pins projecting thereform. The pins have a stepwise configuration with a first end portion extending through apertures in the upper circuit board and connected to a second connector strip on the second circuit board, a second end portion extending through the body portion, and a middle portion which abuts the surface of the upper circuit board and by which the strip is connected to the upper circuit board by means of a solder joint. Components on the upper circuit board are electrically coupled by means of tracks which are connected to the components at one end by a solder joint and at the other end by a solder joint, via pins, to the second connector strip and tracks on the lower circuit board.

Abstract: A PGA adaptor mounting hardware comprising a PGA adaptor which has a plurality of double-head fastening pins and contact pins with flush type contact terminals, and a printed circuit board which has apertures, a printed circuit with conductive points on a top edge thereof, and a transistor circuit on a bottom edge thereof with contact terminals aligned to and electrically connected to the conductive points of the printed circuit for mounting an IC. The printed circuit board is covered with a layer of tin paste over the apertures and the contact terminals of the printed circuit thereby, permitting the PGA adaptor to be connected thereto by inserting the double-head fastening pins into the apertures and, soldering the contact terminals of the contact pins to the conductive points of the printed circuit.

Abstract: A computer functional card connecting apparatus comprised of a base having two parallel channel frames at two opposite ends thereof at right angles, wherein the base has a step block longitudinally disposed at the top with pin holes formed thereon, an elongated groove longitudinally disposed on the bottom with vertical contact pins made thereon for connecting to a mother board, transverse contact pins on an inner side for electrically connecting a computer functional card that has been inserted in between the two parallel channel frames, and a circuit board set between the step block and the bottom groove for electrically connecting said transverse contact pins, the vertical contact pins and the pin holes.

Abstract: An electrical panel for particularly supporting and supplying electrical connections for a plurality of electrical components comprises a sandwich formed by a central conducting layer computer design to form a plurality of conducting paths which are laser cut from a sheet of cooper and a pair of covering plastic layers of insulating material. Mechanical anchoring points extend through the sandwich missing the conducting paths into an optional supporting steel sheet. Electrical connecting points comprise screw threaded pins which engage into female screw threads formed in the front insulating layer and into the conducting layer.

Abstract: A central circuit arrangement for motor vehicles for central connection of electrical components such as fuses, switchgear, cable harnesses, electronic control units for electrical consumers and similar, comprises a layered conductor packet consisting of flat printed circuit boards superimposed in various planes and mutually separated by insulating boards. In order to establish a large number of different printed circuit board circuits separately and selectively in accordance with the relevant requirements, an electric distributing board (10) is inserted between two neighboring insulating boards (9, 11). Pin strips (21) for making contact with the printed circuit boards (8, 12) adjacent to the insulating boards (9, 11) are mounted on the distributing board (10). A strip conductor (25) with a free connection (26) is associated with each pin (22) of each pin strip (21). A plurality of other separate strip conductors (27) with at least two connections (28) are provided on the distributing board (10).

Abstract: A method and apparatus for electrically connecting circuitry on a printed circuit board having a plurality of circuit regions, with each circuit region having components operatively associated with input and output signal lines that are electrically isolated from the signal lines of adjacent circuit regions. The input and output signal lines of a particular circuit region are arranged in a closely spaced pattern aligned with a corresponding pattern of traces on an adjacent circuit region. A plurality of connector members are selectively attached to the printed circuit board to provide signal communication among the regions. Each connector member has closely spaced conductive bars which are exposed to contact the signal lines. The conductive bars have a length and a pitch such that the bars place parallel trace patterns in electrical communication when pressed in place.

Abstract: A matrix switching device includes a matrix board and a connecting pin. X-conductor patterns are arranged in parallel with each other on one surface of the matrix board, and Y-conductor patterns are arranged in parallel with each other on the other surface. Both the patterns are arranged in a matrix form. At each crossing point of the both patterns, a through hole having conductive portions respectively connected to the X- and Y-conductor patterns and an intermediate isolation portion for interrupting conduction between the conductive portions is formed in the matrix board. The connecting pin includes conductive portions respectively electrically connected to the X- and Y-conductor patterns through the conductive portions of the through hole upon insertion of the connecting pin into the through hole.

Abstract: The present invention is an electrified bulletin board display assembly including a composite board and an illuminable push-pin for insertion therein. The board itself includes a pair of conducting layers spaced apart by an insulative layer and connected to an electrical power source. When inserted into the bulletin board, bi-terminals of the push-pin each respectively contacts one of the conductive layers. An additional layer is provided in the board to retain the push-pin in the assembly and ensure contact between the conductive layers and the bi-terminals. As constructed, the entire field of the bulletin board is capable of receiving and illuminating a number of illuminable push-pins randomly inserted therein.

Abstract: An apparatus and method for creating a stack assembly of print circuit boards and for providing electrical interconnection between the individual through-plated hole pads of the circuit boards is described. The preferred embodiment of the present invention is a device comprised of two parts: a slotted disk and a wire. The slotted disk is attached to the surface of the printed circuit board so as to cover a hole pad and form an electrical connection therewith. The covered holes of the printed circuit board are axially aligned between circuit boards and an electrically conducting wire is inserted through the slotted disks on the circuit boards to form an electrical connection therewith.