Abstract: An electronic-component carrier board includes carrier plates formed in a stack, and insulating layers each disposed between two adjacent ones of the carrier plates. Multiple conductive pins extend through the insulating layers and the carrier plates. Multiple conductive wires equal in length and width are provided. Each conductive wire is connected to one of the conductive pins, covered by one of the insulating layers, disposed between two adjacent ones of the carrier plates, and extends outwardly from the stack of the carrier plates. A wiring method for the electronic-component carrier board is also disclosed.

Abstract: A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.

Abstract: An electrical connector pin comprising a link segment for linking to the connector and an end segment that is free, the end segment having a cross-section that presents at least one curved portion curved about an axis parallel to a longitudinal direction of the end segment and the end segment having side edges forming electrical contact portions that can be moved towards each other causing the curved portion to deform elastically.

Abstract: The disclosure relates to a method for contacting a contact surface on a flexible circuit board with a metal contact outside the flexible circuit board, with the aid of a press-fit pin. An attachment piece having a sleeve for receiving the press-fit pin is a mechanically and electrically coupled to the flexible circuit board.

Abstract: A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool.

Abstract: A welding system component includes a circuit board for the welding system component. An interface has a main riser portion with a fastener passageway formed therethrough. The interface has an extension portion with a terminal passageway formed therethrough. The extension portion is electrically connected to the circuit board with a terminal disposed in the terminal passageway. The extension portion is spaced away from a surface of the circuit board. A capacitor is electrically connected to the main riser portion with a fastener disposed in the fastener passageway.

Abstract: Resonant frequency filtered arrays for discrete addressing of a matrix. Applications include, for example, but are not limited to, flat panel displays, transparent displays, charge-couple devices, electronic paper, printing, heated pixel arrays, chemical catalysis, accelerated polymerization, sensors, rapid prototyping, manufacturing, digital cameras, telescopes, image recording, microscopy, memory chips, selective high density radio signal routing, touch screens, index tables, robotic tactile sensors, acoustical mapping, radio frequency identification, sound filtering, audio recording, amplification, sound wave direction sensors, sound source identification, motion detection, and integrated circuits. The matrix can include a substrate and intersecting frequency filtered arrays of electrical conducting traces. Each of the electrically conducting traces is associated with a frequency of alternating current. A material is located between intersections between the frequency filtered arrays.

Abstract: The present invention relates to a female connector assembly, comprising a base part having one or more conductor channels, each conductor channel having a first and a second end. Each of the one or more conductor channels houses at least one bent resilient conductor having a first portion and a second portion, where the second portion is displaceable in a track defined in at least a part of the base part. The first portion extends through the second end of the conductor channel. Each conductor channel is adapted to receive a rod-shaped conductor from a male connector assembly so that the rod-shaped conductor is retained in that conductor channel by a biasing force provided by the bent resilient conductor of that conductor channel.

Abstract: A peripheral card having a Personal Computer (“PC”) card form factor and removably coupled externally to a host system is further partitioned into a mother card portion and a daughter card portion. The daughter card is removably coupled to the mother card. In the preferred embodiment, a low cost flash “floppy” is accomplished with the daughter card containing only flash EEPROM chips and being controlled by a memory controller residing on the mother card. Other aspects of the invention includes a comprehensive controller on the mother card able to control a predefined set of peripherals on daughter cards connectable to the mother card; relocation of some host resident hardware to the mother card to allow for a minimal host system; a mother card that can accommodate multiple daughter cards; daughter cards that also operates directly with hosts having embedded controllers; daughter cards carrying encoded data and information for decoding it; and daughter cards with security features.

Abstract: A method of fabricating and the structure of a micro-electromechanical switch (MEMS) device provided with self-aligned spacers or bumps is described. The spacers are designed to have an optimum size and to be positioned such that they act as a detent mechanism for the switch to minimize problems caused by stiction. The spacers are fabricated using standard semiconductor techniques typically used for the manufacture of CMOS devices. The present method of fabricating these spacers requires no added depositions, no extra lithography steps, and no additional etching.

Abstract: An electrical connector housing or automobile junction box is provided that forms internal circuits in a simplified way. The electrical connector housing includes at least one case which is to receive a plurality of circuit blocks, or layers, each of which includes at least one X-directional bus bar layer and at least one Y-directional bus bar layer superposed thereon. The X-directional and Y-directional bus bar layers contain strip-shaped bus bars laminated with insulative film. The strip-shaped bus bars are arranged in parallel at a given interval, respectively in an X direction and in a Y direction perpendicular thereto. The plurality of circuit blocks or layers are then superposed on one another with insulator plates interposed therebetween, such that the bus bars arranged in the X and Y directions form cross points. The cross points are electrically connected to circuits at desired cross points, for example by rivets or pins, so as to form branched circuits.

Abstract: A first printed wiring board (PWB, 102) has a first set of parallel printed wires (108) on one face and a second set of parallel printed wires (214) on the other face. The second set is generally orthogonal to the first set. The first set terminates in a first adaptor (110), which adapts to an interface (1034) having many parallel channels. The second set terminates in a second adaptor (112), which adapts to a second PWB (1036). Development of the second PWB is enhanced when any input or output on the second PWB can be connected to any channel of the interface. Thus, a hole is drilled through the first PWB at the intersection of the appropriate printed wires of the first and second sets, and is plated. The plated hole (416) may be drilled out (rendering it non-conductive) and effectively replated many times. Alternatively, the (inexpensive) first PWB may be replaced.

Abstract: It is provided an automatic MDF control system comprising: a plurality of matrix boards provided with openings in locations where a plurality of first wires and second wires cross without electrical connections; a robot which inserts electrically conductive connecting pins into the openings and connects the first wires with the second wires where the pins are inserted; a path data conversion unit converting connection requests from an operating terminal into path data having a plurality of addresses of the openings; a robot command conversion unit receiving the path data and converting the path data into robot commands for controlling activity of the robot as a distance moved by the robot moving between the plurality of addresses being reduced by a selected sequence of the converted path data; and a robot control unit controlling the activity of the robot based on the robot commands.

Abstract: An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first and second interconnection layers are oriented orthogonally to each other. The conductors can be interconnected to form at least two electrical planes, with the conductors of the electrical planes being substantially interdigitated on each interconnection layer, portions of each plane appearing on both layers. The interconnection medium advantageously is employed as a multichip module. A method of designing such an MCM includes providing arranged conductive regions in a spaced manner, cutting selected sections to form signal conductor paths, and then filling spaces between like power and ground conductors.

Abstract: A terminal structure and a universal low noise blockdown converter having a multiple number of terminals for receiving a radio wave signal transmitted from satellites and converting it to an intermediate-frequency signal. The terminal structure includes: a terminal joint module having a multiple number of cylindrical outer conductors each having a core conductor inside the cylinder and a plate-like attachment base on which the cylindrical outer conductors are put together, wherein the outer conductors and the attachment base are integrally formed of an identical material or different materials. The universal low noise blockdown converter includes the above-described terminal structure in such an arrangement that the attachment base is fixed to one end face of the converter body.

Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.

Abstract: A board adapter for electrically transmitting signals between an electrical card connector and a mother board, includes a plurality of signal traces formed on both faces of the board adapter for electrically connecting signal holes with corresponding conductive pads. The signal holes respectively receive the corresponding contacts of the card connector. The conductive pads electrically engage with corresponding contacts disposed within a receiving slot defined in a card edge connector when the board adapter is inserted therein and stabilizing means ensures proper engagement therebetween. The stabilizing means comprises a cutout defined on a bottom edge of the board adapter and a post formed in the receiving slot of the card edge connector. The engagement between the cutout and the post ensures that the conductive pads of the board adapter are properly aligned with the contacts of the card edge connector.

Abstract: The interconnection board includes a plurality of non-conductive insulation layers and through-holes running through the insulation layers. A plurality of conductive patterns are provided on each insulation layer, electrically insulated from each other, and exposed to the inside of one through-hole at the same axial position of the through-hole. The connection pin has a non-conductive stem and a connection pattern provided on the non-conductive stem. The connection pattern extends in the axial direction of the connection pin and electrically connects two conductive patterns provided on different insulation layers at the same circumferential position in the through-hole, by bringing the conductive patterns into contact at positions which are axially different and circumferentially the same.

Abstract: A board adapter for electrically connecting an electrical card connector to a mother board, comprises 68 signal holes, 100 conductive pads, a plurality of signal traces, a first grounding means, a transforming unit and a second grounding contact. The first grounding contact surrounds the signal holes and is electrically connected with a corresponding grounding contact of the electrical connector, for providing the signal holes and the electrical connector with grounding protection. The second grounding contact is alternately juxtaposed with every two of the signal traces for providing grounding protection. The conductive pads are electrically connected with either the signal traces or the grounding contacts. The transforming unit includes two power traces to separately bear two different strength voltage induced currents. When either of the traces bears a corresponding voltage induced current, the other trace can be transformed into a grounding trace to protect the bearing trace.

Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.

Abstract: A connection pin is used to electrically connect a first pattern and a corresponding second pattern of at least one set of patterns formed in a matrix board and crossing one over the other. The connection pin is inserted into a through-hole formed in the matrix board. The through-hole extends through the first and second patterns at an intersection of the first and second patterns. The connection pin includes a fitting portion, abutting portion, and electrical conductor between the fitting portion and abutting portion. The conductor generally extends along the through-hole and has a pair of resiliently deformable ends. One deformable end is mounted to the fitting portion and the other deformable end is mounted to the abutting portion. When the connection pin is inserted into the through-hole, the abutting portion abuts the extreme end of the through-hole. A further insertion of the connection pin causes the fitting and abutting portions to move toward each other.

Abstract: Automatic distribution equipment for connecting and disconnecting lines includes a frame body, a plurality of matrix-switch-board units arranged in the frame body in a stack formation, and a robot provided in a side of the frame body. Each of the matrix-switch-board units has two wiring-pattern arrays which are respectively formed in opposite sides of each of the units so as to be electrically isolated from each other and to cross each other, wherein when a connection pin is inserted into one of through holes formed at cross points of the two wiring-pattern arrays, respective wiring patterns of the two wiring-pattern arrays are connected to each other. The robot moves between two of the matrix-switch-board units, and inserts-and-extracts the connection pin into-and-from a designated through hole to connect-and-disconnect designated lines.

Abstract: In a pin-board matrix switch X- and Y-direction patterns are arranged in the X and Y directions to constitute a matrix. Crosspoint holes are formed at the crosspoints between the X- and Y-direction patterns. Each crosspoint hole has contacts formed therein. The contacts are connected to the patterns. A connecting pin has contact springs. The connecting pin is selectively inserted into the crosspoint holes to electrically connecting the contacts of the X-direction patterns and the Y-direction patterns which are adjacent to each other in the Z direction. Insulating members are arranged between the X- and Y-direction patterns. At least one pair of the X-direction patterns and the Y-direction patterns is constituted by first and second wiring layers arranged in the Z direction via insulating members.

Abstract: A switching matrix includes at least two parallel circuit boards each having plural conductive traces and multiple matrix holes therethrough arranged to permit traces on one board to be connected to traces on the second board. Connection is achieved by means of a flexible non-conductive circuit jumper pin having a resilient conductive sleeve arranged to extend between an aligned pair of holes in the two boards. The holes are conductively plated to define female contacts to radially compress the conductive sleeve. Circuit jumper pins may be moved between different matrix positions manually or by a pick and place mechanism controlled from a remote location. In one embodiment, serving as a telephone cross-connect switch, connections are made in pairs, therebeing four circuit boards and two conductive sleeves on each pin, each sleeve interconnecting a pair of traces on a respective pair of boards.

Abstract: A customizable circuit using a programmable interconnect and compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions rather than continuous wires. This segmentation is performed with an offset from line to line in each layer such that the ends of the segments in each layer form long diagonal lines having a pitch determined by the basic wire segment length. Uniform capacitance effects are achieved by alternating the layers of the wire segments. The terminal ends of the segments are positioned in a plane such that segments may be connected by short links to form the desired interconnect. The links which join the line segments customize the otherwise undedicated interconnect. Resistive links may be used to minimize undesirable transmission line effects. The segment ends may also be connected through electrically programmable elements. Carrier tape bonds the integrated circuit chips to the programmable interconnect.

Abstract: A circuit board assembly system for manufacturing a prototype printed circuit board having a matrix formed in it. A base board having a connection matrix that matches the matrix of the printed circuit board is hinged to a frame having tracks for receiving the printed circuit board, so that the printed circuit board is locatable in a fixed position in relation to the printed circuit board with their respective matrices matching. Component leads may be inserted into the connection matrix through the printed circuit board to form a circuit, which may be tested. The base board may be pivoted away from the printed circuit board to allow the leads to be soldered. The printed circuit board may then be removed from the base board. A cover that is latchable onto the printed circuit board may be used to prevent components from being accidentally removed from the printed circuit board.

Abstract: A high density electrical interconnection device provides a uniform complementary pattern of thieving lines on both X and Y interconnect layers of the high density device to provide for uniform plating of the copper conductors, as well as reducing both nonuniformity and the amount of contraction and expansion of the insulating substrate. The complementary line pattern of thieving lines is generated by computer-aided design techniques and also includes provisions for gaps in thieving lines in one layer so as to eliminate crossover coupling with another layer and provides for visual identification of the thieving lines by the use of an undulating pattern.

Abstract: A multilayered electrical interconnect circuit whereby interconnect lines, placed in channel regions throughout a rerouting substrate, function to reroute densely packaged electrical components via geometrically uniform spot links placed upon only the surface layer within each channel region. The interconnect circuit has closely spaced parallel X-and Y-lines orthogonal to one another, each X- and Y-line placed within horizontal and vertical channel regions, respectively, such that electrical connections between closely spaced large-scale integrated circuits or discrete electrical components can be rerouted with a combination of one or more X- and/or Y-lines.

Abstract: Mounting only electronic parts on a printed circuit board puts a limit on the mounting density. According to the invention, electronic parts are mounted on a flexible board. This flexible board is then mounted on a printed circuit board to thereby increase the mounting density.

Abstract: A matrix switching device includes a matrix board and a connecting pin. X-conductor patterns are arranged in parallel with each other on one surface of the matrix board, and Y-conductor patterns are arranged in parallel with each other on the other surface. Both the patterns are arranged in a matrix form. At each crossing point of the both patterns, a through hole having conductive portions respectively connected to the X- and Y-conductor patterns and an intermediate isolation portion for interrupting conduction between the conductive portions is formed in the matrix board. The connecting pin includes conductive portions respectively electrically connected to the X- and Y-conductor patterns through the conductive portions of the through hole upon insertion of the connecting pin into the through hole.

Abstract: The present invention relates to a test system for a protective relay. The test system comprises a test switch (1) and a test-plug handle (2). The invention comprises supplementing the system with a contact function which is activated when the handle is inserted into the test switch so that, before the testing of the relays in the protective device is initiated, a signal function can be obtained to indicate that testing is in progress. The contact function is brought about by arranging, on the upper and/or lower side(s) of the test switch, two semi-protected, uninsulated and parallel contact pins/slide bars (4, 5) from the front edge to the rear edge of the test switch. At the rear edge contact parts to ordinary conductors are arranged in order to forward the contact function. The contact pins are mounted in a guide structure (10, 11) formed with an inner guide profile adapted to guide two resilient tongues (13, 14) on the test-plug handle.