Abstract: Various devices for mounting circuit devices and methods of making the same are provided. In aspect, a device is provided that includes a member for holding an integrated circuit. The member contains a first plurality of carbon nanotubes to enhance the thermal conductivity thereof. At least one conductor member projects from the member. In another aspect, a method of fabricating an interface for an electronic component is provided that includes forming a member containing a first plurality of carbon nanotubes and forming at least one conductor on the member.

Abstract: An electrical connector (100) includes an insulative housing (1) and a number of electrical contacts (2). The insulative housing includes a base (10) having a pair of side walls (13), a slot (15) formed between the two side walls, and a number of passageways (19) and recesses (17) both defined on the side walls. Each side wall has an outer face (132) and each recess extends from a corresponding passageway to the outer face. The electrical contacts are received in the passageways of the insulative housing.

Abstract: An electrically powered cooling unit (130), such as a fan unit, is mountable on a support structure (110) within a housing (140), for example a computer housing. The support structure (110) can mount one or more electrically powered cooling units (130). Each cooling unit (130) includes an electrical connector (400) fixed relative to the cooling unit and cooperable with a connector of the support structure, so that offering the cooling unit up to its mounting position completes the electrical connections between the cooling unit and the support structure. In alternative embodiments, a single structure is used both to physically support and electrically connect the cooling unit (130) to the support structure (110).

Abstract: A ventilation system is described for electrical wiring arrangements of electrical circuits comprising a plurality of electrical connection terminals arranged within an insulating element; the ventilation system comprising a plurality of electrical ventilation cables connected to the respective electrical terminals of the electrical circuit; a plurality of connection chambers each produced in the body of the insulating element in such a manner as to accommodate therein the connection between the electrical ventilation cable and the corresponding terminal while maintaining the connection insulated from the outside; and at least one communication duct between the connection chambers produced in the body of the insulating element and designed so as to permit the passage of air between the connection chambers and through the electrical ventilation cables.

Abstract: An electrical connector useful for both high-current and low-current applications including a first and a second conductive terminals, in which the terminals are interconnected by a plurality of substantially rigid and elongated conductive strips and apertures or gaps are disposed between at least some of the adjacent conductive strips. The connector provides enhanced heat dissipation characteristics and is particularly useful for high current applications such as for connecting batteries, accumulators, super-capacitors and the like storage power units for electric vehicle and other applications.

Abstract: With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. The leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.

Abstract: Contact pin temperature of a semiconductor package is reduced by forcing air into a region between a circuit board and a socket body. A sealant around the perimeter of the socket body at least in part seals the socket body with the circuit board, allowing the forced gas to flow through cavities containing the contacts, thereby cooling the contacts and the package pins. The contact-pin temperature may be reduced, allowing power pins to carry more current. Accordingly, microprocessors and processing systems may be operated at higher data rates without reducing reliability or increasing contact-pin oxidation.

Abstract: A composite board is fixed by solder to an electrode land formed on a circuit board having an electric wiring. The composite board and another metal plate are bonded by using an electric welding method or the like. By bonding a metal plate of a low resistance or a non-metal plate to the composite board, heat of high temperature or a large current which is generated upon electric wiring can be made difficult to be transferred to a lower portion of the composite board. A structure of a terminal member in which it is possible to prevent the solder under the composite board from being diffused, the solder is not scattered to the periphery, and a short-circuit is not caused is obtained. The terminal member to form the circuit board which is more mechanically and electrically stable is provided.

Abstract: An electrical connector (100) includes an insulative housing (1) and a number of electrical contacts (2). The insulative housing includes a base (10) having a pair of side walls (13), a slot (15) formed between the two side walls, and a number of passageways (19) and recesses (17) both defined on the side walls. Each side wall has an outer face (132) and each recess extends from a corresponding passageway to the outer face. The electrical contacts are received in the passageways of the insulative housing.

Abstract: The object of the invention is a device supporting a power light-emitting diode for an automobile signalling or lighting system, comprising an insulating support and means of electrical connection to the electrodes of the diode. The electrical connection means comprise, on the insulating support, electrical connection lugs; the body of the light emitting diode is fixed to an area of a heat-radiating element; this heat-radiating element is attached to the insulating support, and the electrodes of the diode are insulated from the heat-radiating element and electrically connected to the connecting lugs of the insulating support by tongues insulated from the radiating element after the breakage of temporary fasteners.

Abstract: A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.

Abstract: The heat-dissipating module includes at least one heat-dissipating device and a terminal mounted and fixed on one side of the heat-dissipating device and electrically connected with the heat-dissipating device. As the heat-dissipating module is inserted into a frame of the system, the terminal will be received by a receptacle inside the system such that the heat-dissipating module can be electrically connected to the system. The heat-dissipating module can be easily dissembled and replaced in a system without turning off the system and can provide the best heat-dissipating efficiency in a limited space of the system without being affected by the inside height or thickness of the system.

Abstract: A fan holder (30), for mounting a fan (10) having an electrical connector (16) to a computer chassis (50), includes a base (32) for mounting to a body (12) of the fan, a pair of arms (38) extending from opposite sides of the base for embracing the body of the fan, and a socket (44) integrally formed on one of the opposite sides of the base. Each of the arms forms a protrusion (41) for being slidingly received in a slot (41) of a corresponding latch (54) of the computer chassis. The socket defines a groove (46) for receiving a locating plate (20) of the connector thereby combining the connector to the fan holder. When the combined fan and fan holder is detached from the computer chassis, the connector is simultaneously drawn out from a corresponding receptacle (56) of the computer chassis.

Abstract: Contact pin temperature of a semiconductor package is reduced by forcing air into a region between a circuit board and a socket body. A sealant around the perimeter of the socket body at least in part seals the socket body with the circuit board, allowing the forced gas to flow through cavities containing the contacts, thereby cooling the contacts and the package pins. The contact-pin temperature may be reduced, allowing power pins to carry more current. Accordingly, microprocessors and processing systems may be operated at higher data rates without reducing reliability or increasing contact-pin oxidation.

Abstract: A connector of the present invention is provided with a ventilation means that permits air to pass through along an electronic module with respect to a housing means holding said electronic module. The housing means includes a main body mounting thereon contacts to be connected with conductive pads provided at a front end of the electronic module and a pair of arms, projected from opposite ends of the main body, to hold the electronic module at opposite ends thereof. The ventilation means is provided at the main body and/or the pair of arms. The ventilation means thus formed can permit the electronic module to be cooled efficiently.

Abstract: The invention relates to a contact carrier for a plug connector, in particular for a PCB plug connector. The contact carrier comprises a carrier body formed of a plastic material, and a plurality of contacts which are accommodated in the carrier body. Each of the contacts have two plug-in portions and one transition portion located between the two plug-in portions. The transition portions are exposed at least in part and the carrier body is provided with thermally conductive webs which are located between the transition portions and adjoin the latter.

Abstract: A waterproof and heat-dissipating structure of an electronic apparatus including a circuit board, an input element and an output element is disclosed. The structure includes an aluminum-wrapped housing having at least four adjoining surfaces for defining a space, a first opening end and a second opening end, wherein the space is used for accommodating the circuit board, a first lateral plate fixed to the aluminum-wrapped housing, covering the first opening end and having a first hole for fixing the input element therein, and a second lateral plate fixed to the aluminum-wrapped housing, covering the second opening end and having a second hole for fixing the output element therein.

Abstract: A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and connected to the connector assemblies. A third mezzanine card is mounted to the host card and over at least a portion of the component field of the first and second mezzanine cards. A cooling path is provided between the third mezzanine card and the host card and mechanical interference is prevented between the third mezzanine card and the component field due to the profile of the conduction-cooling path. The conduction-cooling path may also be located on the third mezzanine card or on both the host card and the third mezzanine card. The third mezzanine card is connected to the connector assemblies outside of the connector area of the other mezzanine cards.

Abstract: There is provided a heatsink assembly. The heatsink assembly comprises: a processor mounted onto a circuit board; a heatsink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heatsink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heatsink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heatsink, counter directional to the bias from the load spring.

Abstract: A heat sink assembly includes a CPU mounted on a socket connector (1) and a retention module (5). The retention module comprises a pair of metal frames (50), a pair of retaining claps (56) and a pair of stop bars (54) assembled together with the metal frames. Each frame defines a bottom wall (51), a first side wall (52) and a pair of second side walls (54). Each retaining clip has a hook (56c) formed at a top of the retaining clip for hooking a corresponding stop bar, and a clamping portion (56e) formed at a bottom of the retaining clip. The clamping portion and a free end of the hook together clamp a side portion (41a) of a heat sink assembled to the socket connector.

Abstract: A fan holder (30), for mounting a fan (10) having an electrical connector (16) to a computer chassis (50), includes a base (32) for mounting to a body (12) of the fan, a pair of arms (38) extending from opposite sides of the base for embracing the body of the fan, and a socket (44) integrally formed on one of the opposite sides of the base. Each of the arms forms a protrusion (41) for being slidingly received in a slot (41) of a corresponding latch (54) of the computer chassis. The socket defines a groove (46) for receiving a locating plate (20) of the connector thereby combining the connector to the fan holder. When the combined fan and fan holder is detached from the computer chassis, the connector is simultaneously drawn out from a corresponding receptacle (56) of the computer chassis.

Abstract: An electrical coupler comprises an inner connector having upper and lower ends, an insulative outer connector element circumscribing the inner connector, and a thermally conductive flange disposed over the upper end of the inner connector and the outer connector for conducting heat from the electrical conductor. The electrical conductor may be utilized in a substrate support for semiconductor wafer processing. The substrate support comprises a chuck body having an electrode embedded therein, and an upper male connector coupled to the electrode and protruding from said chuck body. A cooling plate having the electrical coupler is positioned proximate to the chuck body. The upper male connector is inserted in the electrical coupler, and a power source coupled to the lower portion of the electrical coupler chucks and biases a wafer to an upper surface of said chuck. The thermally conductive flange conducts and transfers heat generated from the upper male connector and electrical coupler to the cooling plate.

Abstract: A retention device (6) includes a main frame (60), a front and a rear foldable plates (61, 62) assembled to the main frame, a spring clip (65) and an actuating lever (66). The main frame is arranged for surrounding a package upon a socket (not shown). The spring clip is pivotably assembled to the rear foldable plate. The actuating lever is pivotably assembled to the front foldable plate. The actuating lever is rotated to lock the spring clip thereby the spring clip retaining a heat sink module (5) upon the package and the socket.

Abstract: A coaxial heat sink connector for providing a thermal path from the conductors associated with a coaxial cable connector to a heat sink includes a center conductor, an outer conductor, an insulative layer, TNC connector(s) and a thermal element. The outer conductor is positioned around the center conductor and the insulation layer is positioned between. The insulation layer has high thermal conductivity to provide substantial heat transfer between the center and outer conductors. TNC connector(s) are positioned at the end(s) of the connector and electrically coupled to the center and outer conductors. The thermal element is coupled to the outer conductor to conduct heat from the outer conductor to the heat sink. Heat sink connector providing transfer paths for bolted together RF components as well as individual RF power components.

Abstract: A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.

Abstract: An electrical connector assembly includes a CPU mounted socket connector (1) and a retention module (5). The retention module comprises a pair of metal frames (50), a pair of retaining clips (56) and a pair of stop bars (54) assembled together with the metal frames. Each frame defines a bottom wall (51), a first side wall (52) and a pair of second side walls (54). Each retaining clip has a hook (56c) at a top thereof for hooking a corresponding stop bar, and a clamping portion (56e) at a bottom thereof. The clamping portion and a free end of the hook together clamp a side portion (41a) of a heat sink assembled to the socket connector.

Abstract: An electromagnetic induction-type connector for feeding electric power or a signal by a mutual induction action, includes a first connector, including a first core member which has a primary-side core and a primary-side coil, a second connector, including a second core member which has a secondary-side core and a secondary-side coil, the second core member producing an induction electromotive force in accordance with the first core member, and at least one of a first metal case and a second metal case. The first metal case is directly contacted with the first core member, and includes a receiving portion receiving a circuit board to which the primary-side coil is electrically connected and includes a contact portion contacting with a connector mounting portion.

Abstract: The heat-dissipating module includes at least one heat-dissipating device and a terminal mounted and fixed on one side of the heat-dissipating device and electrically connected with the heat-dissipating device. As the heat-dissipating module is inserted into a frame of the system, the terminal will be received by a receptacle inside the system such that the heat-dissipating module can be electrically connected to the system. The heat-dissipating module can be easily dissembled and replaced in a system without turning off the system and can provide the best heat-dissipating efficiency in a limited space of the system without being affected by the inside height or thickness of the system.

Abstract: The heat-dissipating module includes at least one heat-dissipating device and a terminal mounted and fixed on one side of the heat-dissipating device and electrically connected with the heat-dissipating device. As the heat-dissipating module is inserted into a frame of the system, the terminal will be received by a receptacle inside the system such that the heat-dissipating module can be electrically connected to the system. The heat-dissipating module can be easily dissembled and replaced in a system without turning off the system and can provide the best heat-dissipating efficiency in a limited space of the system without being affected by the inside height or thickness of the system.

Abstract: A backpane which receives a plurality of printed circuit boards and the backpane has air holes to allow ventilation.

Abstract: A socket comprises a socket body having a bottom surface at which the socket can be mounted to a motherboard, a top surface, and several side surfaces. The top surface has an array of electrical contacts at which a package containing a microprocessor can be coupled to the socket. One or more of the side surfaces have a slot, which includes an electrical interface at which a circuit card containing cache memory for use by the microprocessor can be removably inserted into the socket body parallel to the motherboard.

Abstract: In the case of an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, it is provided that the support plate is in heat-conducting connection with at least a part of the leadframe. In this case, the leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.

Abstract: The present invention provides an electrical and fluid interconnect for providing electrical connection between one or more circuits or electrical devices and a mateable circuit board or substrate, and for providing fluid coupling of a cooling fluid to permit fluid flow in relation to the electrical circuits or devices when mated to the circuit board or substrate. The fluid connector has a valve which in the absence of mating pressure is in a closed or off position. When mated to a fluid connector which is part of or coupled to the latch assembly, the valve is opened to permit fluid to flow.

Abstract: An electrical connector is constructed including heat-spreading devices in order to reduce hotspots within the connector and to efficiently dissipate heat to the surrounding atmosphere, thus increasing the current carrying capability of the connector.

Abstract: The present invention provides a system to mount a group of fans on the system board of a computer server. The mounting system allows for the fans to be installed or removed as a group or as individual components without the use of tools. The fans are preferably hot-pluggable, or capable of being installed or removed without having to turn off the server. Therefore, an entire group of fans can be removed from a server without using any tools or having to power down the system. The fans can also be removed and installed as individual units, without effecting the other fans in the group.

Abstract: An electrical connector is constructed including heat-spreading devices in order to reduce hotspots within the connector and to efficiently dissipate heat to the surrounding atmosphere, thus increasing the current carrying capability of the connector.

Abstract: The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.

Abstract: A Central Processing Unit (CPU) socket having a circuit protection mechanism electrically couples a CPU to a Printed Circuit Board (PCB). The heat sink fastener matches the supports positioned on two opposing sides of the main body for mounting the heat sink on the CPU socket tightly. The protection component protrudes the main body and covers the corresponding PCB trace under the supports to protect the PCB trace from damaged by the heat sink fastener as mounting or dismounting the heat sink on the CPU socket.

Abstract: A flip-chip module is interconnected to a PCB or circuit card through a peripheral LGA interposer connector. The flip-chip is mounted on the same surface of the module substrate as the peripheral array of LGA interconnection pads and projects into a central opening of the interposer. An opening in the upper stiffener of the PCB or circuit card permits the peripheral array of LGA interconnection pads to make contact with corresponding LGA PCB or circuit card pads. A first heat sink is arranged to thermally contact the entire surface of the substrate opposing the surface upon which the flip-chip is mounted. An opening in the PCB or circuit card and lower stiffener allows a second heat sink to make thermal contact with the surface of the flip-chip.

Abstract: A heat sink fastener is applied to fasten a heat sink contacted with an electrical element mounted on a substrate. The heat sink fastener has a pillar integrally formed by an upper segment and a lower segment that further has an arrowhead hook, a coil spring winded around the pillar, and a cannular column with two openings for receiving the pillar. A step is formed around the first opening defined at one end of the column, and the second opening is defined at the other end of the column to allow the lower segment and the hook to pass through. When heat sink fastener is applied to fasten the heat sink to the substrate, the column is pressed downward to the heat sink, and the hook is inserted through the heat sink and the substrate to be tightly and upwardly pressed against the bottom of the substrate.

Abstract: A plug-and-socket connection for water-cooled, current-bearing lines, in particular, to bipolar, high-frequency current conductors for the induction heating of tools is provided. The plug-and-socket connection allows both the electric circuit for the power supply and the circuit for the cooling water to be rapidly and easily closed by hand, or to be interrupted, for example, for maintenance work. The plug-and-socket connection includes a female element and a male element which contain chambers and ducts opening into the chambers that supply the cooling water. The ducts come into contact with one another when the plug-and-socket connection is in the interconnected position. The chambers are in direct contact with the water tubes, which are provided for supplying the cooling water. The backflow of cooling water occurs via a direct connection between a water tube which supplies the male element with cooling water and another water tube which conveys the cooling water away from the female element.

Abstract: The heat-dissipating module includes at least one heat-dissipating device and a terminal mounted and fixed on one side of the heat-dissipating device and electrically connected with the heat-dissipating device. As the heat-dissipating module is inserted into a frame of the system, the terminal will be received by a receptacle inside the system such that the heat-dissipating module can be electrically connected to the system. The heat-dissipating module can be easily dissembled and replaced in a system without turning off the system and can provide the best heat-dissipating efficiency in a limited space of the system without being affected by the inside height or thickness of the system.

Abstract: A telecommunications customer service terminal provides an input connection to an input telecommunications line and a plurality of output connections to a plurality of telephones. A housing having a metal base is positioned in a vertical plane. A plurality of cooling fins on the metal base extend outward a first distance. A plurality of mounting legs on the metal base extend outward a second distance that is greater than the first distance. A laminar flow of air passes between a mounting wall and the metal base. A first cover is secured to the metal base to form a sealed first compartment. A second removable cover is secured to the metal base to form an unsealed second compartment. A connection board is mounted within the second compartment. An electronic board is mounted within the first compartment in thermal contact with the metal base.

Abstract: In a pump, particularly for cooling water, with an impeller wheel (2) that is supported so that it can rotate in a pump chamber (6), an excitation device (12) for driving the impeller wheel (12) to rotate, and a control circuit (19) for the excitation device (12), the control circuit (19) and the excitation device (12) are thermally separated from one another by the pump chamber (6). The waste heat of the excitation device (12) is removed by the fluid circulating in the pump chamber (6) to the extent that the control circuit (19) is prevented from overheating.

Abstract: A land grid array (LGA) cooling assembly and method of a cooling member assembly are provided. The LGA assembly includes a card, a module electrically connected to the card, a plurality of load posts operably attached to the card, a load frame operably attached to the load posts, and a cooling member operably attached to the load frame to allow removal of the cooling member from the assembly without disrupting the electrical connection between the module and the card. The method of assembling a land grid array cooling member assembly includes electrically connecting a module and a card, operably connecting a load frame to the card, and removably attaching a cooling member the load frame without affecting the electrical connection between the module and the card.

Abstract: The invention relates to a contact carrier for a plug connector, in particular for a PCB plug connector. The contact carrier comprises a carrier body which is made of plastics, and a plurality of contacts which are accommodated in the carrier body and each have two plug-in portions and one transition portion located between the two plug-in portions. The transition portions are exposed at least in part and the carrier body is provided with thermally conductive webs which are located between the transition portions and adjoin the latter.

Abstract: A wireless detection system for monitoring a predetermined area for an emergency situation. The wireless smoke detection system includes a plurality of detector units strategically positioned throughout the monitored area. Each of the plurality of detector units include a detector for sensing one of a characteristic and condition within a section of the monitored area and generating a signal indicative of the monitored. A signal processor is connected within each detector unit for analyzing the signal generated by the detector and upon determining if the signal is above a predetermined level generating an emergency signal. A transmitter is provided for transmitting the emergency signal to a plurality of receiver units strategically positioned about the monitoring area. Each receiver unit includes an alarm for generating an alarm signal and thereby alert persons to the emergency situation at a position within the monitored area.

Abstract: A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.

Abstract: A clip assembly (40) for mounting a heat sink (30) to an electronic device (20) retained on a socket connector (10) includes a clip (50) and a fastener (60). The clip has an elongate spring portion (52) engaging a surface of the heat sink and two legs (54) extending from the spring portion for engaging with catches (12) of the socket connector, thereby securing the heat sink to the electronic device. The fastener includes a pair of latches (62) and a resilient connecting section (66) connected between the latches. Each latch has a protrusion (64) extending from a distal end thereof, each protrusion extending towards the opposite protrusion. The heat sink forms a plurality of fins (34) defining a slot (36) therebetween for receiving the clip and the fastener. The latches are configured to engage with grooves (38) defined in fins on opposite sides of the slot of the heat sink, thereby securely attaching the clip to the heat sink and effectively eliminating relative movement between the clip and the heat sink.

Abstract: A connector for module that connects a module to a printed circuit board in a position wherein the board plane of the module is approximately parallel to the printed circuit board.