Distinct Heat Sink Patents (Class 439/487)
  • Patent number: 10804627
    Abstract: A connector system includes a cage with an intermediate section. The cage support a connector and the resulting connector system includes an upper port and a lower port. A heat sink is provided in the intermediate section that is configured to cool a module inserted into the lower port. Apertures can allow air to flow through the connector system so as to allow for improved cooling by more directly cooling the inserted module. The heat sink can be urged into the lower port by a biasing element.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: October 13, 2020
    Assignee: Molex, LLC
    Inventor: Jerry D. Kachlic
  • Patent number: 10741953
    Abstract: An apparatus may include an actuator, a heat-rejecting medium, and a receptacle for receiving a pluggable module. The pluggable module may be operable to be inserted into the receptacle in a first direction. The actuator may be operable to be translated in the first direction by the insertion of the pluggable module into the receptacle. The heat-rejecting medium may be operable to be translated in a second, different direction by the actuator when the actuator is translated in the first direction. The translation of the heat-rejecting medium in the second direction may be operable to cause the heat-rejecting medium to become thermally coupled to the pluggable module when the pluggable module is inserted into the receptacle.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: August 11, 2020
    Assignee: Dell Products L.P.
    Inventors: Alex Huang, Juan M. Gonzalez
  • Patent number: 10700635
    Abstract: A solar cell module is discussed. The solar cell module includes a solar cell panel and an integrated type inverter positioned at a back surface of the solar cell panel. The integrated type inverter includes a circuit unit having a terminal connected to the solar cell panel and an inverter member having a DC-AC inverter electrically connected to the terminal, and a receiving unit receiving the terminal and the DC-AC inverter, the receiving unit having at least one open surface. One of the open surfaces of the receiving unit is covered by the solar cell panel.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: June 30, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Hyukjin Nam, Joonho Jeon
  • Patent number: 10483907
    Abstract: The present invention provides a building exterior cladding panel. The panel includes an upper overlap area, a lower overlap area, and a central part covered by at least one photovoltaic module. A perforation is located in the lower overlap area and traversed by an electrical cable connecting one of two electrical poles of the photovoltaic module to an electrical plug located on the reverse side of the panel in the lower overlap area. An opening is located in the upper overlap area, into which is inserted an electrical junction box connected to another electrical pole of the photovoltaic module by an electrical cable.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: November 19, 2019
    Assignee: ArcelorMittal
    Inventors: Renaud Vignal, Laurent Geron, Lionel Fourdrinier
  • Patent number: 10431934
    Abstract: A connector includes signal contacts and predetermined contacts maintained at predetermined voltage levels. Each contact has a horizontal portion, an intersecting portion extending along a direction intersecting with the horizontal portion and a coupling portion coupling the horizontal portion and the intersecting portion to each other. The contacts include a first contact group made up of the two predetermined contacts and one differential pair of the two signal contacts. In the first contact group, a size of the coupling portion of each of the predetermined contacts in the pitch direction is larger than another size of the coupling portion of each of the signal contacts in the pitch direction, and a size of the intersecting portion of each of the predetermined contacts in the pitch direction is larger than another size of the intersecting portion of each of the signal contacts in the pitch direction.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: October 1, 2019
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Kentaro Toda, Masamichi Sasaki
  • Patent number: 10282569
    Abstract: Various embodiments provide a dual purpose press-bar and heat sink for an integrated circuit card (ICC) reader. The dual purpose press-bar and heat sink provides two functions. First, the dual purpose press-bar and heat sink conducts and dissipates internal heat generated by a high data transfer ICC inserted in to the ICC reader. Second, the dual purpose press-bar and heat sink ensures that contact pads of the high data transfer ICC create reliable electrical connections with ICC contacts of the ICC reader. As such, the dual purpose press-bar and heat sink simultaneously dissipates heat from a high data transfer ICC and ensures that a high data transfer ICC maintains proper electrical connections with ICC contacts of an ICC reader.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: May 7, 2019
    Assignee: Dish Technologies L.L.C.
    Inventors: William Michael Beals, Jerome A. LaPalme
  • Patent number: 10199775
    Abstract: An electrical connector includes an insulative housing, upper and lower contacts disposed in the housing, a metallic shielding plate, and a metallic shield enclosing the housing. The insulative housing includes a first insulator with a first mating tongue thereof, and a second insulator with a second mating tongue thereof wherein the shielding plate is sandwiched between the first insulator and the second insulator. The shielding plate forms a cutout with side edges in two opposite lateral sides. The second insulator forms a pair of pressing parts extending toward the shielding plate with a hook at the end. When the shielding plate is assembled to the second insulator, the hook engages the side edge of the cutout so as to secure the shielding plate to the second insulator in the vertical direction.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: February 5, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jun Zhao, Jing-Jie Guo
  • Patent number: 9924615
    Abstract: A receptacle assembly includes a receptacle housing having a module cavity defined by a top wall having a plurality of apertures therethrough. The module cavity has a port at a front end of the receptacle housing configured to receive a pluggable module. A communication connector is positioned in the receptacle housing having a mating interface for mating with the pluggable module. A heat exchanger is received in the module cavity having a heat spreader positioned interior of the module cavity below the top wall. The heat spreader is configured to be in thermal communication with the pluggable module. The heat exchanger has a plurality of fin segments extending from the heat spreader. The fin segments are received in corresponding apertures in the top wall to pass through the top wall to an exterior of the module cavity for heat dissipation.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: March 20, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher
  • Patent number: 9834183
    Abstract: An electrical vehicle including a vehicle body, a passenger compartment, a chassis supporting the passenger compartment, a plurality of wheels and at least one electrical motor for driving the wheels. A battery compartment of the vehicle is configured to removably mount therein a plurality of more than two rechargeable batteries which are movable into position in the battery compartment by a battery conveyor system which has a battery access opening through which batteries are installed or removed, one by one, to and from the battery compartment. In the battery compartment, a connection mechanism effects the needed mechanical and electrical connections. An overall control system controls the conveyor system and the connection mechanism to enable rapid replacement of the removable batteries, whereby an electrical vehicle can be instantly driven, even after its batteries have been discharged by a replacement of the discharged batteries and the installation of freshly charged batteries.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: December 5, 2017
    Inventor: Max Moskowitz
  • Patent number: 9787008
    Abstract: A USB cable end connector and the method of making the same are disclosed. The cable end connector includes a first contact module, a second contact module, a central grounding unit sandwiched between the two contact modules, a shielding shell enclosing the first and the second contact modules; and a grounding means attached to the first and the second contact modules along a height direction of the connector. The grounding means includes an upper grounding pad and a lower grounding pad. The upper grounding pad and the lower grounding pad are assembled to a first and a second insulators of the contact modules along a height direction, respectively. The upper grounding pad is sandwiched between the first contact module and the shielding shell. The lower grounding pad is sandwiched between the second contact module and the shielding shell.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: October 10, 2017
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Ya-Juan Gou, Zhi-Qiang Rong, Li-Ii Liang, Mao-Jung Huang, Wang-I Yu
  • Patent number: 9668379
    Abstract: A heat spreader includes a front heat spreader having a pluggable module interface configured to be in thermal communication with the pluggable module and a mating interface having first plates spaced apart by first gaps. The heat spreader includes a rear heat spreader having a mating interface including second plates spaced apart by second gaps. The front heat spreader is coupled to the rear heat spreader with the first plates interleaved with the second plates in thermal communication with each other. The first plates are received in the second gaps and the second plates being received in the first gaps. The heat is transferred from the front heat spreader to a heat transfer end of the rear heat spreader for cooling the pluggable module.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: May 30, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher
  • Patent number: 9480141
    Abstract: A heat sinking rapid assembly semiconductor package comprising an electrically segmented conductive assembly post. The post is fabricated comprising at least two independent electrically conductive segments separated by an electrically isolating element. An electrical component, such as a semiconductor device, is assembled to an upper portion of the conductive post, wherein each contact of the component is in electrical communication with a respective conductive segment. The post can be mechanically pressed, threaded, or mechanically coupled using any other reasonable mechanical interface into a segmented via or plated-through hole of a printed circuit board (PCB). The electrical segments would be in electrical communication with conductive portions of the segmented via to form a complete electrical circuit between the PCB and the electrical component.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: October 25, 2016
    Inventor: Junis Hamadeh
  • Patent number: 9255703
    Abstract: An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: February 9, 2016
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Andrew S. Auyeung, Michael J. Craven, Huu Dang, Harvey Hum
  • Patent number: 9134054
    Abstract: A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom.
    Type: Grant
    Filed: January 5, 2011
    Date of Patent: September 15, 2015
    Assignee: NOVATRANS GROUP SA
    Inventors: John Connolly, John F. Roulston, Daniel Mandelik
  • Patent number: 9099815
    Abstract: A device connector that is to be connected to a device includes male terminals (21) to be connected to female terminals provided in the device and shield cables (90) are pulled out in a direction different from a connecting direction to the female terminals. An inner conductor (50) electrically conductively connects the male terminals (21) and the shield cables (90), and a fuse (30) is arranged in the inner conductor (50). A housing (10) made of resin includes an accommodation space (14) for accommodating the fuse (30) inside, and a heat radiating rubber portion (40) is disposed to fill up an air layer formed between the fuse (30) and the inner wall fuse mounting portion (18) of the accommodation space (14).
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: August 4, 2015
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Tomokazu Kashiwada, Hiroyuki Matsuoka
  • Patent number: 9042096
    Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: May 26, 2015
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Mark A. Thomas, Dennis Gammel, Shankar V. Achanta
  • Publication number: 20150132990
    Abstract: An optical-electrical connector (100) having an end for mating with an electrical connector and an opposite end coupling with an optical medium, includes a thermal conductive shell (10), a printed circuit board assembly (20) received in the thermal conductive shell, and an optical-electrical module (50). The printed circuit board assembly includes a printed circuit board (21) including a thermal conductive layer (214) thermal conductively connected with the metal shell. The optical-electrical module is mounted on the printed circuit board and is in contact with the thermal conductive layer, heat produced by the optical-electrical module being transmitted to the thermal conductive shell by the thermal conductive layer.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEI NONG CHOU, JUN-BIN HUANG, GANG PAUL CHEN, JIE ZHENG, YUAN-CHIEH LIN, AN-JEN YANG, JIM ZHAO, QING-MAN ZHU, SHUAI-HUI HUANG, LI-SHING HOU
  • Publication number: 20150132991
    Abstract: An electrical connector that includes a terminal adapted to mate with another terminal and at least one heat dissipating element that has opposing ends and an opening therebetween. At least one of the ends includes at least one printed circuit board engagement member configured to engage a printed circuit board for electrical current transfer. The opening receives the terminal such that heat dissipating element substantially surrounds and contacts the terminal.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 14, 2015
    Applicant: Amphenol Corporation
    Inventors: Paul M. Crozier, John K. Griffiths
  • Patent number: 9022800
    Abstract: An electrical connector includes an insulator base having a rear retaining portion and a front tongue portion, a first terminal module with a plurality of first terminals thereof, a second terminal module with a plurality of second terminals thereof and interlocked with the first terminal module, and a shielding shell retained to the insulator base. A heat dissipation metal plate is embedded in the insulator base, and the heat dissipation metal plate provides a contact ear extending out of the insulator base and contacting with the shielding shell for heat dissipating.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: May 5, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: An-Jen Yang, Terrance F. Little
  • Patent number: 9017093
    Abstract: An electric meter socket assembly for an electric meter includes a female electrical contact defining a slot for receiving a male electrical contact of an electric meter to electrically connect to the electric meter. In one example, the male contact guide is in thermal contact with the female electrical contact and is configured to facilitate insertion of the male electrical contact of the electrical meter into the slot defined by the female electrical contact. The male contact guide includes a plurality of heat sink fins configured to dissipate heat generated from resistive heating of the female electrical contact. In another example, an anti-rotation stop configured to inhibit rotation of the female electrical contact relative to a mounting member on which the female electrical contact is to be mounted.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: April 28, 2015
    Assignee: Cooper Technologies Company
    Inventors: Duan Earl Packard, III, Daniel Wayne Vosbrink
  • Patent number: 8998635
    Abstract: A junction box includes a cable connecting box, a cover covering the cable connecting box and a cable electrically connecting with the cable connecting box. The cable connecting box including an insulative box and a wire connecting module, the insulative box comprising a plurality of walls extending upwardly and a receiving cavity surround by the walls, the walls including a front wall defining a plurality of mounting holes for the cable passing through. The cover includes a plurality of separating walls extending downwardly from a peripheral of the cover to engage with the walls of the insulative box and a pretending wall being parallel to the separating wall and located in front of the front wall. The adding pretending wall provides a longer distance for the junction box to ensure a safe creepage distance for the user to use the junction box.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: April 7, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Xue-Yuan Xiao, Hong-Qiang Han, Zi-Qiang Zhu
  • Patent number: 8995133
    Abstract: An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: March 31, 2015
    Assignee: Deere & Company
    Inventors: Andrew D. Wieland, Kevin B. Larsen, John N. Oenick, Gregory K. Harmelink, Neal D. Clements
  • Publication number: 20150087181
    Abstract: An electrical connector having an active cooling system is described herein. The electrical connector can include a conductor having an electrically conductive pin, and a conductor receiver slidably coupled to the conductor. The conductor receiver can include a wall having an electrically conductive material forming a cavity into which the pin is received. The conductor receiver can also include an insulating sleeve mechanically coupled to the wall. The conductor receiver can further include a heat sink mechanically coupled to the insulating sleeve and a channel that collects heat absorbed by the heat sink. The heat collected by the channel can be vented outside the conductor receiver. Alternatively, the wall of the conductor receiver can be coupled to an insulator and have at least one aperture that vents heat from the cavity to the insulator.
    Type: Application
    Filed: December 4, 2014
    Publication date: March 26, 2015
    Inventors: Joseph Michael Manahan, Adam Ledgerwood
  • Patent number: 8979575
    Abstract: An electrical connector assembly for use with an electronic package, includes an electrical connector having a plurality of contacts, and an assistant heat sink mounted upon the electrical connector and having an opening to allow the electronic package connecting with the contacts.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: March 17, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chih-Pi Cheng, Andrew Cheng
  • Publication number: 20150060433
    Abstract: A heated platen having a heating element and an electrical contact assembly for the heating element is generally described. Various examples provide a dielectric plate including a heating element and a terminal disposed therein. An electrical connection assembly configured to connect the heating element to a power source is also provided. The electrical connection including an electrical connection plug, a conductive sleeve disposed within the electrical connection plug, and a connector pin having a bottom portion and a top portion, the bottom portion disposed within the sleeve, the top portion having a spring structure, the spring structure configured to maintain electric contact with the terminal throughout a range of temperatures.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 5, 2015
    Applicant: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Aaron P. Webb, Paul Forderhase, Paul E. Pergande
  • Publication number: 20150064962
    Abstract: A method of creating a sealed, un-mated electrical connector system using single insertion press-fit pins. Using single insertion press-fit pins allows for use of simple plastic parts for the connector shroud and a true position assurance comb in conjunction with single insertion press-fit pins. The result is a lower cost for the final connector assembly. Less plastic is needed for the combined shroud and true position assurance comb, because the true position assurance is provided in part by the shroud, and in part by the position assurance comb.
    Type: Application
    Filed: August 8, 2014
    Publication date: March 5, 2015
    Inventors: James D. Baer, Benjamin C. Lin, Timothy J. Trento
  • Patent number: 8905794
    Abstract: Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: December 9, 2014
    Assignee: Intel Corporation
    Inventors: Gaurav Chawla, Joshua D Heppner, Zhichao Zhang, David J. Llapitan, Vijaykumar Krithivasan
  • Patent number: 8905775
    Abstract: An retaining device of an electrical connector assembly for use with a heat dissipating device, includes a first retainer, a fixing lever, and a second retainer. The fixing lever has one end pivotally mounted to the first retainer and another end capable of locked by the first retainer. The second retainer is integral formed with an elastic plate. The first retainer and the second retainer are two separated members, and the fixing lever and the elastic plate are used for pressing two opposite ends of the heat dissipating device.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Publication number: 20140349514
    Abstract: An electrical connector includes an insulator base having a rear retaining portion and a front tongue portion, a first terminal module with a plurality of first terminals thereof, a second terminal module with a plurality of second terminals thereof and interlocked with the first terminal module, and a shielding shell retained to the insulator base. A heat dissipation metal plate is embedded in the insulator base, and the heat dissipation metal plate provides a contact ear extending out of the insulator base and contacting with the shielding shell for heat dissipating.
    Type: Application
    Filed: May 23, 2013
    Publication date: November 27, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: AN-JEN YANG, TERRANCE F. LITTLE
  • Patent number: 8885342
    Abstract: The present invention relates to a cage for thermal management and for housing an electronic module. The cage includes top, bottom and side walls joined to form an interior cavity. The side walls form an enclosure having a first panel. A thermally conductive pathway is disposed on the first panel. The enclosure receives an electronic device such as a transceiver module and a heat sink mounted on the first panel. The thermally conductive pathway is disposed between the electronic device and the heat sink so that heat from the electronic device is transmitted via the thermally conductive pathway to the heat sink.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: November 11, 2014
    Assignee: Methode Electronics, Inc.
    Inventors: Robert Skepnek, Alexandros Pirillis, Andrius Zernaitis
  • Patent number: 8879260
    Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: November 4, 2014
    Assignee: Qimonda AG
    Inventors: Sven Kalms, Christian Weiss
  • Patent number: 8830679
    Abstract: A receptacle including a shield housing and a heat sink. The shield housing has a first side configured to be connected to a printed circuit board. The housing has an aperture for insertion of a plug of a cable assembly. The heat sink is connected to the first side or an opposite second side of the shield housing. The heat sink has a lateral end section which extends along an exterior of a least one lateral side of the shield housing.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: September 9, 2014
    Assignee: FCI Americas Technology LLC
    Inventor: Michael Scholeno
  • Publication number: 20140199881
    Abstract: An electrical connector having an active cooling system is described herein. The electrical connector can include a conductor having an electrically conductive pin, and a conductor receiver slidably coupled to the conductor. The conductor receiver can include a wall having an electrically conductive material forming a cavity into which the pin is received. The conductor receiver can also include an insulating sleeve mechanically coupled to the wall. The conductor receiver can further include a heat sink mechanically coupled to the insulating sleeve and a channel that collects heat absorbed by the heat sink. The heat collected by the channel can be vented outside the conductor receiver. Alternatively, the wall of the conductor receiver can be coupled to an insulator and have at least one aperture that vents heat from the cavity to the insulator.
    Type: Application
    Filed: January 17, 2013
    Publication date: July 17, 2014
    Inventors: Joseph Michael Manahan, Adam Ledgerwood
  • Publication number: 20140170898
    Abstract: An apparatus that is a receptacle adapted for receiving a connector. The apparatus may further include a hinged heat sink included in the receptacle. The hinged heat sink adapted in an open position for insertion and removal of a cable. The hinged heat sink further adapted in a closed position to make thermal contact with a thermally active location of the connector wherein a thermal path is provided for a dissipation point on the outside of the electronic receptacle.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bret P. Elison, Phillip V. Mann, Arden L. Moore, Arvind K. Sinha
  • Publication number: 20140162490
    Abstract: A card connector for use with a card comprising electronic circuitry and a card reader device comprising electronic circuitry which can communicate with the card. The card connector is configured to receive the card when the card is inserted into the card reader. The card connector has a connector body and an attached cover. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the card reader device. The cover includes one or more retaining springs which engage the card to secure the card and draw heat from the card. The cover also has a lip or tongue and grounding tabs which provide electrostatic discharge protection.
    Type: Application
    Filed: November 22, 2013
    Publication date: June 12, 2014
    Inventors: Ronald L. Hodge, Tau Chuan Chen
  • Publication number: 20140154912
    Abstract: A receptacle assembly with improved EMI leakage reduction and construction is described. The assembly includes a housing in the form of a guide frame that has a hollow interior which accommodates the insertion of an electronic module therein. A heat sink is provided to dissipate heat generated during operation of a module and the heat sink has a base portion that defines a ceiling of the hollow interior. An opening in the top of the guide frame provides an attachment location for the heat sink. A separately formed base plate is inserted into the housing and it defines a bottom of the interior of the housing.
    Type: Application
    Filed: October 25, 2011
    Publication date: June 5, 2014
    Applicant: Molex Incorporated
    Inventor: Christopher D. Hirschy
  • Patent number: 8740639
    Abstract: A socket has top side pins that may form electrical connections to a central processing unit chip, and a bottom side ball grid array of discrete, electrically-conductive metal surfaces. Differently-keyed setoff apertures are formed through the socket that when disposed about corresponding standoffs projecting upward from a planar circuit board align the socket ball grid array surfaces with grid array pad connections on the circuit board. Retaining screws passing through the socket setoff apertures, when tightened into the planar board standoffs, bring a heatsink downward with compressive force against the socket top side. The socket responsively brings the ball grid array into compressive electrical contact connections with the grid array pad connections on the circuit board, and also compresses against the planar board. The resilient ring may thereby form a seal about the compressively-connected ball grid array and circuit board pads.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: June 3, 2014
    Assignee: International Business Machines Corporation
    Inventors: Jonathan K. Grice, Emil P. Parker, Shelby H. Williams
  • Publication number: 20140148046
    Abstract: A card connector includes a housing that houses a card provided with a terminal member, a connecting terminal and a cover member. The connecting member is attached to the housing that connects with the terminal member of the card. The cover member is connected to the housing and forms a card housing space between the housing, and is attached to a substrate.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 29, 2014
    Applicant: Molex Incorporated
    Inventors: Yuji Naito, Mitsuhiro Tomita, Hideo Nagasawa
  • Patent number: 8721359
    Abstract: A heat sink socket for cooling electronic devices has a heat conducting body having an upper surface for receiving an electrical component and a lower surface for engaging a supporting circuit board. An insulated terminal has an electrical insulating body supporting a first electrical terminal within the heat conducting body. The first electrical terminal connects an electrical contact of the electrical component to the circuit board. The heat sink socket may include a ground plane on the heat conducting body. The ground plane may have a second electrical terminal that connects an electrical contact of the electrical component to the circuit board.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: May 13, 2014
    Inventor: John O. Tate
  • Patent number: 8714997
    Abstract: A terminal connecting construction includes a substrate and a terminal. A heat-generating element is mounted on the substrate. A contact portion is provided in the terminal, and is contacted with the heat-generating element.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: May 6, 2014
    Assignee: Yazaki Corporation
    Inventor: Takayuki Ikeda
  • Publication number: 20140106605
    Abstract: A retention device (2) for positioning a heat sink (3) includes a base (21), a lever (22) and a pressing tab (23), the pressing tab (23) includes a first pushing portion (233) and a second pushing portion (232) for pressing the heat sink (3), the first pushing portion (233) includes an upper surface (2330) and a lower surface opposite (2331) to the upper surface (2330), the second pushing portion (232) includes a top surface (2320) and a bottom surface (2321) opposite to the top surface (2320), the distance between the upper surface (2330) and the lower surface (2331) is smaller than the distance between the top surface (2320) and the bottom surface (2321).
    Type: Application
    Filed: October 16, 2013
    Publication date: April 17, 2014
    Applicant: Hon Hai Precision Industry Co., Ltd.
    Inventor: CHENG-CHI YEH
  • Patent number: 8693200
    Abstract: A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: April 8, 2014
    Assignee: International Business Machines Corporation
    Inventors: Evan G. Colgan, Michael A. Gaynes, Jeffrey A. Zitz
  • Publication number: 20140080352
    Abstract: A structurally compact connector that dissipates heat quickly and efficiently is disclosed. The connector includes a housing having a plug receiving space. An elastic member is positioned on the housing, and is displaceable outward from the housing. A protrusion is positioned on an inner surface of the elastic member and extends into the plug receiving space. A thermally conductive element is disposed on an outer surface of the elastic member and is contactable with a heat sink positioned outside of the housing.
    Type: Application
    Filed: September 13, 2013
    Publication date: March 20, 2014
    Applicant: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Tim Xue, Jason Yang, Alex Cai, Tommy Yu
  • Patent number: 8641444
    Abstract: For an object of providing a connector which has improved heat radiating efficiency, the connector includes a terminal 2 including a wire connecting portion 21 which an electric wire is connected, and a connector housing 3 provided with a terminal receiving section 30 receiving the terminal 2. Heat radiating portions 45, 55 are provided at a position of the terminal receiving portion 30, at which the wire connecting portion 21 is covered. In the heat radiating portions 45, 55, a plurality of projections 49, 59 formed to project from the surface 4a, 5a of the terminal receiving section 30 is arranged at intervals to each other.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: February 4, 2014
    Assignee: Yazaki Corporation
    Inventors: Haruki Yoshida, Yoshiaki Ozaki
  • Publication number: 20130344714
    Abstract: A contact device that electrically connects a first substrate and a second substrate. The contact device includes: a contact that has electrical conductivity and elasticity, the contact including a first terminal that is contactable with a first pad provided on the first substrate and a second terminal that is contactable with a second pad provided on the second substrate, the first terminal and the second terminal being biased in a direction spreading a distance therebetween; and a sheet that has flexibility and heat dissipation, and holds the contact so that the first terminal is arranged opposite to one surface of the sheet and the second terminal is arranged opposite to another surface of the sheet.
    Type: Application
    Filed: June 19, 2013
    Publication date: December 26, 2013
    Applicants: FUJITSU LIMITED, FUJITSU COMPONENT LIMITED
    Inventors: Takahiro KONDO, Manabu SHIMIZU, Yasushi MASUDA, Satoshi OHSAWA, Yoshihiro MORITA, Akira TAMURA
  • Patent number: 8605439
    Abstract: An electronic device includes a circuit board, a connector fixed on the circuit board, and a heat sink mounted on the circuit board. The heat sink includes a securing portion. The securing portion defines a first cutout, a second cutout, and an arm located between the first and second cutouts. The arm resiliently urges the connector against the circuit board so as to firmly hold the connector between the heat sink and the circuit board.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: December 10, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Min-Li Li
  • Publication number: 20130323964
    Abstract: An electrical connector assembly for use with an electronic package, includes an electrical connector having a plurality of contacts, and an assistant heat sink mounted upon the electrical connector and having an opening to allow the electronic package connecting with the contacts.
    Type: Application
    Filed: May 14, 2013
    Publication date: December 5, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-PI CHENG, ANDREW CHENG
  • Publication number: 20130323963
    Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink. The EMI gasket includes electrically conductive spring fingers that are engaged with and electrically connected to the mounting side of the cage.
    Type: Application
    Filed: May 30, 2012
    Publication date: December 5, 2013
    Applicant: Tyco Electronics Corporation
    Inventors: Matthew David Morrison, Michael John Phillips, Michael Eugene Shirk
  • Patent number: 8591251
    Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: November 26, 2013
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Hsiao-Wen Lee, Chih-Hsuan Sun, Wei-Yu Yeh
  • Patent number: 8593813
    Abstract: A heat dissipating system adapted to dissipate heat generated from an IC package mounted onto a socket connector, comprises a heat dissipating device comprising a heat spreader embedded with at least one heat pipe and a supporting plate flexibly seated upon an upper face of the heat spreader, and a clip located upon the heat dissipating device for pressing the heat dissipating device downward toward the socket connector.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: November 26, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Darrell Lynn Wertz