Abstract: A socket for an electric component includes: a socket main body having a receiving portion which receives an electric component such as an IC package; a socket cover supported to be capable of turning by a first turning shaft provided in a vicinity of one side end of the socket main body to turn to thereby open or close the housing portion; and a radiating member mounted to the socket cover and is in contact with the electric component received in the receiving portion to radiate heat from the electric component in a state of the socket cover being closed. The socket cover has an opening portion formed in a position corresponding to the receiving portion of the socket main body in the closed state, and the radiating member is supported to be capable of turning by a second turning shaft parallel to the first turning shaft in the opening of the socket cover.

Abstract: An electrical connector assembly is provided for connecting an IC chip (2) to a printed circuit board (3). The electrical connector assembly includes a housing (1) engaging with the IC chip, a heat sink (6), a loading plate (4) and a number of first connecting portions (5). The loading plate is located between the heat sink and the housing and has a number of spring plates (41) extending toward the IC chip. The first connecting portions are provided for connecting the heat sink to the printed circuit board.

Abstract: In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage.

Abstract: An arrangement between a power semiconductor module and a printed circuit board is disclosed, A printed circuit board includes strip conductors, and a power semiconductor module includes a module housing and power terminals. The power terminals extend to the exterior of the module housing and into contact with the strip conductors. A heat sink is disposed on a side of the power semiconductor module opposite the circuit board. A deformable means is disposed between the module housing and the circuit board and is configured to relieve a contact pressure load on the power terminals. A contact-pressure element is disposed on a side of the circuit board opposite the power semiconductor module. The contact-pressure element is integral with a first housing part of an arrangement housing, and the heat sink is integral with a second housing part of the arrangement housing. The two housing parts enclose the circuit board.

Abstract: Techniques for a land grid array (LGA) socket loading mechanism for mobile platforms are described. An apparatus includes a LGA socket mounted to a printed circuit board, and an LGA package seated in the LGA socket. The LGA package includes an LGA package substrate and a semiconductor die mounted on the LGA package substrate, and a heat pipe attached to the semiconductor die, wherein the heat pipe is to apply a compressive load to the semiconductor die. The heat pipe includes at least two leaf springs to apply a compressive load to the LGA package substrate. Other embodiments are described and claimed.

Abstract: A heat transfer member which is capable of enhancing efficiency of heat dissipation, and a connector including the heat transfer member. On the surface of an elastic body arranged between an LED and a heat sink, a heat conduction metal thin film that transfers heat generated in the LED to the heat sink is formed. The member may also include an electrical conduction metal film, whereby the member may serve as both a heat transfer member and as an electrical connector.

Abstract: An electrical connector assembly for mounting on a circuit board includes a pressing frame, a base, and a pressing pole. The base and the pressing frame may be mounted on two opposite surfaces the circuit board so that a pivoting portion and protruding pieces of the base respectively pass through the circuit board. The pressing frame is mounted on the pivoting portion. The pressing pole mounts to the protruding pieces and can be translated so as to urge the pressing frame toward a closed position. A receptacle connector may be mounted between the pivoting portion and the protruding pieces and secured by the pressing frame. A radiator may be mounted over on the receptacle connector. A plurality of fastener may extend between the radiator and the base so as to secure the radiator in position.

Abstract: A socket for an electric component includes: a socket main body having a receiving portion which receives an electric component such as an IC package; a socket cover supported to be capable of turning by a first turning shaft provided in a vicinity of one side end of the socket main body to turn to thereby open or close the housing portion; and a radiating member mounted to the socket cover and is in contact with the electric component received in the receiving portion to radiate heat from the electric component in a state of the socket cover being closed. The socket cover has an opening portion formed in a position corresponding to the receiving portion of the socket main body in the closed state, and the radiating member is supported to be capable of turning by a second turning shaft parallel to the first turning shaft in the opening of the socket cover.

Abstract: A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.

Abstract: An active jack, which is a powered device, is installed as the network connection at a workstation which provides the capability to determine the physical location of a destination device, such as a VOIP phone, in real time. Uninterruptible power supplies may be used to provide power to network components, for example during an emergency. Power-and-data deployments are shown for powering network components and destination devices.

Abstract: A connector with a heat sink to prevented a card from being damaged due to friction when the card is inserted or removed includes a frame provided with two guide arms and two elastic members, each guide arm containing two chutes, each chute containing an upper and a lower limit zones; a pressurizing-down mechanism connected to the frame, a leading post received in the chute being disposed on each side arm, and a heat sink being provided on top; card insertion driving the pressurizing-down mechanism to move with its leading post in the chute for the heat sink to contact the card to conduct the heat generated from the card; and the elastic member moving the pressurizing-down mechanism into the upper limit zone to remove the card.

Abstract: Provided is a connector for connection to a module board including an eject mechanism selectively ejecting a module from a module accommodating section. The eject mechanism includes a locking member that has a locking nib engageable with a recess of a case of the module. The locking member is rotatably supported by a sidewall section of a guide rail member, and thus can stay in an opening of the sidewall section. An eject button of the connector for connection to a module board has an operation section provided with a flange. The flange is pressed against the inner peripheral surface of a housing of an electronic device by a biasing force of coil springs all the time except for when the operation section is pushed in.

Abstract: An electrical connector with a heat dissipating device adapted to physically in contact with an electrical package disposed on a socket connector comprises a load plate having a substantially rectangular configuration defining a central opening having a first length and a first width and a heat plate having longitudinal sides and traversal ends. A heat plate has a heat pipe attached thereon and arranged such that the heat plate is disposed under the load plate, while the heat pipe is arranged above the load plate when rotated.

Abstract: An electrical connector assembly, for electrically interconnecting an IC package with a printed circuit board, includes a printed circuit board, an electrical connector mounted on the printed circuit board, an IC package mounted in the electrical connector, a heat sink seated on the electrical connector, a backboard located under the printed circuit board and a plurality of first and second elements. The electrical includes an insulative base and a load plate mounted on the insulative base, and the load plate defines a plurality of first holes. The heat sink defines a plurality of second holes, while the printed circuit board defines a plurality of third holes, and the backboard defines a plurality of fourth holes. The first elements are inserted through the first, the third and the fourth holes to fasten the IC package, the electrical connector, the printed circuit board and the backboard together.

Abstract: A receptacle assembly includes a guide frame, a heat sink and a conductive gasket. The guide frame includes a top wall and defines an interior chamber that is configured to receive a mating connector. The top wall defines an opening that provides access to the interior chamber. The heat sink is held in the interior chamber such that at least an upper portion of the heat sink produces through the opening and a lower portion of the heat sink engages the mating connector when the mating connector is loaded in the interior chamber. The conductive gasket is held in the interior chamber between the guide frame and the heat sink. The gasket is configured to be compressed between the guide frame and the heat sink when the mating connector is loaded into the interior chamber such that the gasket provides a conductive path between the heat sink and the guide frame.

Abstract: A connector assembly is suitable for use with various types of connector chip modules, and includes a heat sink detachably connected to a top of a cover of the connector assembly via a heat-sink fastening member, so that heat produced by the connector chip module on the connector assembly during the operation thereof can be effectively dissipated into ambient environment via the heat sink. Therefore, the connector assembly can be widely applied to all kinds of connector chips.

Abstract: An electrical connector assembly for mounting on a circuit board includes a pressing frame, a base, and a pressing pole. The base and the pressing frame may be mounted on two opposite surfaces the circuit board so that a pivoting portion and protruding pieces of the base respectively pass through the circuit board. The pressing frame is mounted on the pivoting portion. The pressing pole mounts to the protruding pieces and can be translated so as to urge the pressing frame toward a closed position. A receptacle connector may be mounted between the pivoting portion and the protruding pieces and secured by the pressing frame. A radiator may be mounted over on the receptacle connector. A plurality of fastener may extend between the radiator and the base so as to secure the radiator in position.

Abstract: The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.

Abstract: A card slot according to the present invention is provided with a slot body, a heat sink, a first support and a second support. The slot body is configured to internally store an IC card. The heat sink is provided with a heat sink body and a first spring. The first spring is attached to the substantial center of an upper surface of the heat sink body, and supports the heat sink body. Also, the first spring is lowered with insertion of the IC card inside the slot, and presses the heat sink body downward. The first support is provided with two first leg sections, a first linking section and a first pressing spring. The two first leg sections are arranged facing positions sandwiching the heat sink body close to one end side of the slot body. The first linking section links fellow upper end vicinities of the two first leg sections.

Abstract: A universal mounting supports high intensity LEDs in a lighting fixture with heat removal and electrical connection facilities. A holder includes a peripheral sidewall defining a cavity for accepting a printed circuit board assembly. A support member supports the printed circuit board assembly along the peripheral sidewall. Electrical contact elements are provided the printed circuit board. A thermal conduction member is in thermal communication with the printed circuit board assembly. The receptacle portion removably engages with the holder portion. A plurality of contact sockets conductively engages the electrical contact elements of the holder portion to interconnect the contact elements to external wires. An aperture in the receptacle portion accepts the thermal conduction member, wherein the thermal conduction member passes through the aperture and into a space for dissipating heat from the printed circuit board.

Abstract: An electrical connector assembly is provided that includes a guide frame having an internal compartment configured to receive an electrical component. The guide frame extends a length between a plug end portion having a plug opening and a rear end portion opposite the plug end portion. The guide frame includes a first wall that extends between the rear end portion and the plug end portion. The first wall includes a heat sink retention area that is configured to receive a heat sink. The rear end portion includes a rear wall. A clip is configured to be mounted on the guide frame. The clip is configured to extend over and engage at least a portion of the heat sink when the heat sink is received by the heat sink retention area. The clip is configured to engage the rear wall of the guide frame and extend along at least a portion of the first wall of the guide frame.

Abstract: An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A heat transfer member which is capable of enhancing efficiency of heat dissipation, and a connector including the heat transfer member. On the surface of an elastic body arranged between an LED and a heat sink, a heat conduction metal thin film that transfers heat generated in the LED to the heat sink is formed.

Abstract: An IC socket comprises an insulative housing having a plurality of periphery walls and a cover pivotally assembled to one end of the insulative housing and adapted to be locked to the insulative housing at the other end. The cover includes a plurality of peripheral edges. The cover also has a plurality of spring arms upwardly extending therefrom and disposed at the edges.

Abstract: A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.

Abstract: An electrical connector (1) for electrically connecting an electrical chip to a printed circuit board includes a base (3), a number of contacts, a stiffener (4) partially surrounding the base, a metal clip (5) pivotally assembled to one end of the stiffener, and a lever (6) pivotally assembled to opposite the other end of the stiffener. The base has a number of contact receiving passageways, and includes a mounting surface (314) for arranging the electrical chip and opposite connecting surface (315) for positioning to the printed circuit board. The contacts are received in the contact receiving passageways of the main body. The base defines a plurality of through slots (310) extending from mounting surface to the connecting surface thereof for transferring heat produced by the electrical chip outwardly.

Abstract: Electrical connectors can include thermally conductive material in regions proximate contacts residing therein to sink heat away from the contacts. The thermally-conductive materials can be provided in the housing structure of the connectors. The thermally-conductive material can also be provided as a thermally-conductive member distinct from the housing.

Abstract: A fastener used in a blade server to secure a thermal module and a motherboard to a metal face panel, including a cushion member set between the metal face panel and the motherboard, an elastically compressible and electrically insulative spacer member set between the motherboard and the thermal module, a lock member fastened to the cushion member and the spacer member to lock the motherboard to the metal face panel, a locating member fastening the thermal module to the spacer member, and a spring member mounted on the locating member to keep the thermal module in close contact with a chip at the motherboard. The spacer member automatically adjusts the tightness between the thermal module and the chip at the motherboard, and isolates the digital grounding loop formed in the locating member and the thermal module from the analog grounding loop formed in the lock member and the metal face panel.

Abstract: Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

Abstract: A socket activation assembly is configured to close over a component and drive a gear during closure that activates a socket to engage the component.

Abstract: Provided is an electrical connector for electrically connecting a plug assembly to a PCB. The electrical connector has a base mounted to the PCB, which has an upper surface and a lower surface opposite to the upper surface, a plurality of conductive contacts received in the base with partly extending above the upper surface, and a cover mounted on the upper surface of the base and having peripheral walls, a first and second surface. The base defines a plurality of incontinous standoffs extending from the upper surface of the base.

Abstract: An electrical system as described herein is suitable for use in an electric or hybrid vehicle. The electrical system includes electrical devices, such as power transistors, coupled to an electrically and thermally conductive bus bar. The respective nodes of the electrical devices are coupled to the bus bar such that the bus bar carries a combined signal generated by the electrical devices. The bus bar is also thermally coupled to a conduction heat transfer system, such as a liquid cooled cold plate. Thus, the bus bar functions as both an electrical conduit and a conduction-based heat sink for the electrical system.

Abstract: A central processing unit (CPU) assembly is disclosed having: a CPU; a socket removably receiving the CPU; a heat sink removably attaching atop the CPU; and a fastening device removably fastening the heat sink, the CPU, and the socket together. The fastening device is characterized by consisting: an elongated resilient body upon which a contacting surface is disposed for contacting the heat sink and pressing the heat sink against the CPU; two lever bars extending from opposite ends of the resilient body for exerting forces on the fastening device so as to fasten or remove the fastening device; and two latching arms extending from the ends of the resilient body for engaging the fastening device with the socket in an engage position, the latching arms in the engage position exerting an inward resilient force upon the socket at opposite sides thereof.

Abstract: An electrical connector (1) for electrically connecting an electrical chip to a printed circuit board includes a base (3), a number of contacts, a stiffener (4) partially surrounding the base, a metal clip (5) pivotally assembled to one end of the stiffener, and a lever (6) pivotally assembled to opposite the other end of the stiffener. The base has a number of contact receiving passageways, and includes a mounting surface (314) for arranging the electrical chip and opposite connecting surface (315) for positioning to the printed circuit board. The contacts are received in the contact receiving passageways of the main body. The base defines a plurality of through slots (310) extending from mounting surface to the connecting surface thereof for transferring heat produced by the electrical chip outwardly.

Abstract: A preferred embodiment of an electrical connector includes an electrical conductor for transmitting electrical power, and a housing. The electrical conductor is mounted in the housing so that the housing and the electrical conductor define a channel for circulating airflow through the housing and along a surface of the electrical conductor.

Abstract: An electrical connector assembly (100) includes an electrical connector (2) with a first plurality of holes (230) thereon, a heat sink (3) mounted onto the electrical connector and including a second plurality of holes (300) thereon, a substrate (4) mounted onto the electrical connector and including a third plurality of holes (400) thereon. The second plurality of holes and the third plurality of holes are aligned with and in communication with the first plurality of holes. A plurality of pin-like elements (1) is respectively insertable into the first plurality of holes, the second plurality of holes and the third plurality of holes so as to hold the heat sink, the electrical connector and the substrate together. Since the substrate is needed to define a single group of holes in correspondence with the pin-like elements, much more room is available on the substrate for active and passive electronic elements to be equipped therewith.

Abstract: A photovoltaic connection system for maximum current output and heat dissipation properties. The connection system includes a connection box with improved heat transfer capability to permit higher current output capacity. Diodes are surface-mounted on a printed circuit board inside of the connection box. An optional metal plate may be mounted inside the cover plate of the connection box as a heat sink for dissipating heat from the diodes. The metal in the plate has good thermal transfer characteristics, e.g., copper or aluminum.

Abstract: A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaining body (26) clasping two adjacent fins having a space therebetween. A screw (22) is extended through the fan and into the space of the two adjacent fins. The retaining body includes a pair of opposite lateral walls (260) clamping opposite sides of the two adjacent fins, for preventing the two adjacent fins from being over expanded outwardly during the insertion of the screw into the space.

Abstract: A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires (20) therein. The heat dissipation device includes a heat sink assembly. A wire fixture (60) is mounted on the heat sink assembly and configured for fixing the wires thereto. The wire fixture includes a mounting plate (62) positioned on the heat sink assembly. A bridge (624) projects from the mounting plate to form a receiving room (625) below the bridge. The wires are securely bound together via the wire fixture so as not to be loosened by vibration.

Abstract: The present invention relates to electrical connectors, and, in particular, to power connectors and to improved contact structures and methods related thereto.

Abstract: In a heat radiator plate, a mounting bracket extending from a peripheral edge portion of the heat radiator plate, an auxiliary heat radiator plate portion extending along the mounting bracket and positioned between the mounting bracket 39 and a body through a gap and a radiant heat radiator portion formed on a top end of the auxiliary heat radiator plate portion and opposing to the body through the gap are provided. Heat generated by a circuit construction body is conducted from the heat radiator plate, the auxiliary heat radiator plate portion and the radiant heat radiator portion to the gap and radiated to the body through the gap. The heat radiation characteristics of the connector box are improved.

Abstract: A system for coupling a heat sink to an electrical device independently of a clamping member that is used to place a coupling force between the electrical device and a substrate to which the electrical device is to be electrically connected. The system includes a clamping member adapted to push the electrical device against the substrate, to assist in electrical connection between the electrical device and the substrate, the clamping member defining a through-hole leading to the electrical device. There is also a heat-conducting member in the clamping member through-hole and adapted to thermally contact the electrical device to conduct heat away from the electrical device. A heat sink is in thermal contact with the heat-conducting member, to dissipate heat from the electrical device.

Abstract: Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heat sink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heat sink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heat sink, counter directional to the bias from the load spring.

Abstract: In a state wherein front ends of latch members 18A and 18B are apart from each other so that the upper surface of an alignment plate/positioning member 24 is outside, a pressing section 12PU of a heat sink member 12 is brought into contact with the periphery of a semiconductor device 22.

Abstract: A holder of optical transmission lines encompasses an insulating base body defined by a mounting face to mount an optical device chip, an opposing face opposing to the mounting face and side faces which connect between the mounting face and the opposing face, one of side faces is assigned as an interconnection face, and provided with through-holes penetrating between the mounting face and the opposing face so as to hold optical transmission lines, the through-holes define openings on the mounting face; electric interconnections extending from respective vicinities of the opening on the mounting face on to the interconnection face; and heat conduction passages assigned alternately with the electric interconnections, extending from the mounting face on to the interconnection face, each of the heat conduction passages is longer than the electric interconnections on the interconnection face.

Abstract: A lighting assembly includes a circuit board having light emitting diodes, a heat conductive plate, a soldering plate removably connected to the circuit board and having multiple LED holes to correspond to the LEDs on the circuit board and a fixing plate securely connected to the circuit board after the soldering plate is removed from engagement with the circuit board. A cover has multiple positioning holes to allow extension of threaded bolts through the positioning holes, the fixing holes, the circuit board and into the heat conductive plate to secure engagement among the heat conductive plate, the circuit board, the fixing plate, the transparent plate and the cover.

Abstract: The present invention relates to electrical connectors, and, in particular, to power connectors and to improved contact structures and methods related thereto.

Abstract: An electrically insulated body carries one of more jaw members which are mountable over threaded terminals in a meter socket to provide a bypass connection between line and load socket terminals to enable a watthour meter to be removed and reinstalled relative to the socket. In another aspect, the jaw members are coupled to an electrically conductive member. A handle extends from the conductive member.

Abstract: A light source device for a medical endoscope system comprises a lamp unit including a xenon lamp and a heat sink, with fins, certain ones of which form electrodes, a lamp housing into which the lamp unit is removably which is provided with first power electrodes and discharge electrodes of a static discharge circuit. These first power electrodes and discharge electrodes are biased in a direction of removal of the lamp unit. The first power electrodes are brought into contact with the heat sink electrodes and thrust back by the heat sink when the lamp unit is set in the lamp housing. The discharge electrodes are thrust back away from the discharge circuit by the heat sink on the way of insertion of the lamp unit into the lamp housing and allowed to return to electric coupling to the discharge circuit ground on the way of removal of the lamp unit from the lamp housing.