With Mating Connector Which Receives Panel Circuit Edge Patents (Class 439/59)
  • Patent number: 6625016
    Abstract: A cartridge interface retains and couples a first information device, such as PCMCIA type card, with an internal connector of a host computer used in a rugged environment. It may also retain a second information device, such as a memory drive, separate from the first information device. The host computer has a cartridge insertion slot that guides the cartridge and a connector of the PCMCIA card into engagement with the computer's internal connector. The PCMCIA card is retained on the cartridge in a manner that prevents translation of the card relative to the cartridge during removal from the host computer.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: September 23, 2003
    Assignee: Paravant Computer Systems, Inc.
    Inventors: William C. Glusing, Victor W. Wolynski, Walter L. Olson, Richard P. McNeight
  • Patent number: 6618942
    Abstract: A method for insertion of inserting printed circuit card into socket connectors which prevents sockets from getting contaminated or damaged during the insertion of a printed circuit card comprises the steps of: inserting a cam for moving a socket connector's contacts outwardly so that they will not make contact with a card's edge when it is inserted between the contacts of the sockets connector as it is inserted, and after the printed circuit card is inserted the printed circuit card moving the printed circuit card until it makes contact with a stop in the socket connector, and after the printed circuit card has contacted the stop in the socket connector, moving the cam to a closed position allowing the printed circuit card to be seated, and seating the printed circuit card by moving it to cause and allow for an amount of wipe to clean the connector's contacts without contaminating or damaging the socket connector's contacts during the insertion of said printed circuit card.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: September 16, 2003
    Assignee: International Business Machines Corporation
    Inventors: Brian S. Beaman, Scott J. Hadderman, Richard D. Wheeler
  • Patent number: 6612023
    Abstract: A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component lead. Solder is disposed on the pad and heated to a molten state so that surface tension and wetting effects form the molten solder into a solder mound having a U-shaped lateral cross section conforming to the U-shaped metalized pad. The solder mound has a first arm and a second arm, and a lateral aperture extending therebetween for receiving an extremity of the component lead, and registering the extremity of the component lead with respect to the pad.
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: September 2, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Guy Lichtenwalter, Norman D. Marschke
  • Patent number: 6585525
    Abstract: Memory modules, and related memory module sockets, can include a plurality of connector pins adjacent to a first edge of the memory module that are configured to conduct a plurality of first signals to or from the memory module via the first edge and a plurality of first conductors adjacent to a second edge of the memory module that are configured to conduct a plurality of second signals to or from the memory module via the second edge.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: July 1, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-sung Jung, Won-ki Song
  • Patent number: 6579107
    Abstract: A connector pin includes an electrically conductive rod having a first end that extends longitudinally from an edge of a circuit board. The rod includes a plug at an opposite end of the rod that is inserted into an electrical receptacle on the circuit board. The plug is orthogonal to a longitudinal axis of the rod. A clamping pivot arm is between the first end and the plug and is parallel to the plug. The clamping pivot arm terminates with a hook whose end points toward the plug. The connector pin is pivoted about the clamping pivot arm pivotally so that the plug is inserted into the receptacle on the circuit board. The edge of the circuit board has a notch therein and the clamping pivot arm engages the notch to prevent lateral movement of the connecting pin. The plug and the clamping pivot arm prevent longitudinal movement of the connecting pin.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: June 17, 2003
    Assignee: Osram Sylvania
    Inventor: John P. Sanroma
  • Patent number: 6554654
    Abstract: A multi-pin edge connector assembly for connecting a daughter board to a mother board, for example, comprises a plurality of vias with conductive surfaces that are formed in the daughter board adjacent a connection edge. A plurality of openings are also formed in the daughter board, with each opening extending from the connection edge to one of the vias. Electrically conductive pins are positioned in the openings, with each pin having a first end in electrical contact with one of the conductive surfaces and a second end that projects beyond the connection edge for electrically contacting conductive pads or surfaces on the mother board. A retainer is mounted to the daughter board for holding the pins in their respective openings.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: April 29, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: D. Joseph Stoddard, Joseph P. Miller, Mitchel Wright
  • Patent number: 6511332
    Abstract: A board-connecting connector (100) includes a connector housing (20) having a pair of side walls (25) formed on opposite sides thereof. A plurality of lock arms (22; 24) are formed on the side walls (25) of the connector housing (20). At least one terminal receiving chamber (26), into which a terminal (30) is insertable, is formed in the connector housing (20). A spacer member engageable with the connector housing has a plurality of engagement portions (14; 16) which are respectively engaged with the lock arms (22; 24). A plurality of slits (28; 29) are formed in the side walls (25) so as to partially separate the lock arms (22; 24) from the side walls (25). With this construction, each of the lock arms (22; 24) can be elastically bent or deformed independently of separate portions (25a) of the side walls (25).
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: January 28, 2003
    Assignee: Yazaki Corporation
    Inventor: Tatsuya Ishikawa
  • Patent number: 6510050
    Abstract: A substrate for packaging a storage or server system may include one or more sections of the substrate configured to hold a two-dimensional array of disk drives. Another section of this substrate may be configured to hold circuitry for accessing the array of disk drives. This circuitry may include one or more processors. The substrate also includes a first plurality of ribs positioned in the first access of the substrate. The first plurality of ribs separate the sections from one another. The section configured to hold the control circuitry may also be configured to hold one or more power supplies for supplying power to the array of disk drives and control circuitry. This section, as well as other sections, may be divided in two by one or more additional ribs in a transverse direction. The substrate may be configured to be mounted in a cage or rack and may include an edge connector at one edge of the substrate to provide electrical connectivity to a back plane in the cage or rack.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: January 21, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: Whay S. Lee, Nisha Talagala, Chia Y. Wu, Fay Chong, Jr., Randall D. Rettberg
  • Publication number: 20030013324
    Abstract: The present invention provides connectors having circuit protection. Specifically, the present invention provides a device that operates with existing or new connectors to provide overvoltage protection to same. The device includes a strip of conductive material along which voltage variable material (“VVM”) is applied. The strip also includes an exposed portion not having the VVM deposition. The VVM contacts a plurality of signal conductors of the connector. The exposed portion contacts at least one ground conductor of the connector. When an overvoltage condition Occurs along one of the signal conductors, the VVM switches from a high impedance to a low impedance state, allowing the transient threat to dissipate, at least in part, to one or more ground conductor.
    Type: Application
    Filed: July 10, 2002
    Publication date: January 16, 2003
    Inventors: Stephen J. Whitney, David Perry
  • Patent number: 6496381
    Abstract: A contact arrangement for an electrically contactable module that is arranged on a card-shaped carrier, having a first contact bank with a plurality of contact areas, of which at least one is disposed outside of a predefined region. A second contact bank is provided having at least one contact area within the predefined region, and the contact areas of the first contact bank that are arranged outside of the predefined region are in each case electrically connected to contact areas of the second contact bank. Consequently, for example, both chip cards according to ISO 7816 and multimedia card modules can be evaluated by a chip-card reader provided for evaluating ISO-7816 chip cards. At the same time, the ability of the MMC modules to be evaluated by an MMC-module reader provided for that purpose is retained.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: December 17, 2002
    Assignee: Robert Bosch GmbH
    Inventor: Klaus-Erwin Groeger
  • Patent number: 6490169
    Abstract: An electrically conductive circuit conductor 2 is disposed on an insulating resin substrate 1, an electrically conductive surface 3 of the circuit conductor is exposed from the resin substrate continuously in a longitudinal direction, and both side portions 4 of the conductive surface are covered and fixed by collar walls 5 of the resin substrate. A bus bar or an electrically conductive resin material is used as the circuit conductor 2. The bus bar 2 is insert-molded onto the resin substrate. The electrically conductive resin material is poured and solidified in a groove portion in the resin substrate. A contact terminal on a mating circuit side or electrical component side is brought into contact with the conductive surface of the circuit conductor 2. A second circuit board is laminated on the resin substrate, and an insertion hole for allowing the conductive surface of the circuit conductor 2 to be exposed is provided in the second circuit board, and the contact terminal is inserted in the insertion hole.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: December 3, 2002
    Assignee: Yazaki Corporation
    Inventor: Hiroshi Watanabe
  • Patent number: 6487086
    Abstract: A memory module (10) having a module bus line (15) that can be electrically connected to a main board bus line (22) by a contact terminal (12). Main board bus line (22) can be discontinuous at a module socket. Module bus line (15) can be configured on a front and back side of memory module (10) and electrically connected to the discontinued main board bus line (22) by contact terminals (12) configured on both sides of memory module (10). The front and back side module bus lines (15) can be electrically connected by a module bus through wiring (19′). Characteristic impedance matching between the main board and memory module (10) may be improved.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: November 26, 2002
    Assignee: NEC Corporation
    Inventor: Hiroaki Ikeda
  • Patent number: 6469255
    Abstract: There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boards is arranged so that each of the connection portions is situated on a plane and each of corresponding connection portions is connected with each other in the plane.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: October 22, 2002
    Assignee: Sony Corporation
    Inventors: Yoshio Watanabe, Toru Takebe, Mayumi Kosemura
  • Publication number: 20020146918
    Abstract: A mounting structure of a connector 6 for use with a circuit board 7 includes fixing parts 8 provided on one side of the connector 6 and fixed to the circuit board 7, terminals 25 contained in the connector and connected to the circuit board by soldering, a plurality of wiring boards 41 to 42 arranged adjacent to the circuit board,. and a pair of support walls 9 provided on the other side of the connector 6 and projected from the connector. The support walls 9 are abutted at their lower ends against the uppermost wiring board 41, enabling the connector to be supported by both the support walls 9 and the fixing parts 8. The fixing parts 8 and the support walls 9 are projected in directions intersecting at a right angle so that the support walls 9 may be abutted against the wiring board 41 in an engaging direction of a mating connector 37. The support walls 9 are projected longer than the terminals 25 toward the wiring board 41.
    Type: Application
    Filed: April 4, 2002
    Publication date: October 10, 2002
    Applicant: Yazaki Corporation
    Inventor: Hiroyuki Kondo
  • Patent number: 6452114
    Abstract: A plug-in circuit board assembly requires reduced insertion force during connection to a plurality of shorting contacts in a socket or receptacle. The connector portion of the circuit board assembly has a pair of end sections with beveled insertion edges that extend substantially perpendicular to the insertion direction of the circuit board. A shallow V-shaped cut-out with non-beveled insertion edges is located between the end sections. Electrically conductive fingers are carried by the connector portion of the circuit board assembly and extend toward the insertion edges of the end sections and V-shaped cut-out. The electrically conductive fingers adjoining the V-shaped cut-out are positioned to make contact with shorting contacts in the socket or receptacle, while the electrically conductive fingers of the beveled end sections are positioned to make contact with conventional (non-shorting) contacts in the socket or receptacle.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: September 17, 2002
    Assignee: Hubbell Incorporated
    Inventors: Theodore A. Schweitzer, Norman S. Saah, Paul H. Bock, Jr., Dmitry H. Levitan
  • Patent number: 6442037
    Abstract: The invention provides for an apparatus that secures one or more expansion boards to a motherboard. A single type of adjustable retention block can be used to engage and secure expansion boards of various sizes. The retention block secures an expansion board in a groove of the retention block along the edge of the expansion board. By this attachment, the retention block avoids contact with the electrical components of either the expansion board or the motherboard.
    Type: Grant
    Filed: September 30, 1998
    Date of Patent: August 27, 2002
    Assignee: Micron Technology, Inc.
    Inventor: Craig L. Boe
  • Patent number: 6437988
    Abstract: A card guide is provided for guiding an edge portion of at least one circuit board with respect to a computer chassis. The card guide includes flanges defining recesses. At least one of the recesses is configured to mount the card guide to the computer chassis. Each of the recesses is configured to receive the edge portion of a circuit board, and the flanges of the body are spaced from one another to accommodate the edge portion of a circuit board to guide the circuit board with respect to the computer chassis.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: August 20, 2002
    Assignee: Unisys Corporation
    Inventors: Mark R. Treiber, Terry W. Louth
  • Patent number: 6425766
    Abstract: A connector system including a circuit card and method of manufacturing same is provided. By way of example, the system includes a connector having an elongated housing with an elongated card-receiving slot. A plurality of signal terminals and ground terminals are mounted on the housing along the slot and have contact sections extending into the slot. A circuit card has an edge insertable into the slot, a ground plane facing a surface of the card at least near the edge and a plurality of signal contact pads and a plurality of ground contact pads along the edge for engaging the contact sections of the signal terminals and the ground terminals, respectively. The size or area of the signal contact pads is varied relative to the ground contact pads to vary the capacitance in the area of the terminal-to-circuit card interface and, thereby, vary the impedance of the system.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: July 30, 2002
    Assignee: Molex Incorporated
    Inventor: Augusto P. Panella
  • Patent number: 6421250
    Abstract: A multi in-line module and an electronic component socket for the multi in-line module are provided. One embodiment of a multi in-line memory module includes a printed circuit board having at least two protrusions formed along one edge of the printed circuit board. Each of the protrusions has first and second surfaces for blocks of contact pins. Accordingly, the module can include three or more pin blocks on separate surfaces of the protrusions. The module provides a large number of pins without being significantly larger than a conventional SIMM or DIMM. Alternatively, physical and electrical attachment of multiple circuit boards provides three or more independent pin blocks on the various surfaces of the printed circuit boards. A socket for a module includes dielectric protrusions with two or more gaps between the protrusions and contact pins on side surfaces of the protrusions that are in the gaps.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: July 16, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-ryeul Kim, Jung-joon Lee, Bok-moon Kang
  • Patent number: 6411506
    Abstract: A web server chassis having a plurality of web server processing cards coupled with a midplane is provided. A first network interface card may also be coupled with the midplane. The midplane may include printed circuitry operable to provide data communications between the plurality of web server processing cards and the first network interface card. A second network interface card may also be coupled with the midplane, the second network interface card operable to couple the plurality of web server processing cards with a private network. In a particular embodiment the first network interface card may be operable to couple the plurality of web server processing cards with a public network. A third network interface card may also be provided. The third network interface card may be operable to couple the plurality of web server processing cards with a management network.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: June 25, 2002
    Assignee: RLX Technologies, Inc.
    Inventors: Christopher G. Hipp, David M. Kirkeby
  • Patent number: 6407923
    Abstract: An ‘orthogonally stacked’ support and cooling architecture for RF signaling circuits includes a plurality of RF amplifier circuit cards mounted on edge-mountable RF printed circuit support and heat dissipation modules, that are affixed to a first side of a base plate, so that the RF circuit cards extend in a direction that is generally orthogonal to the base plate. Arranged on a second side of the base plate are RF distribution networks for the RF circuit cards. The RF signal distribution networks are RF-coupled to the RF printed circuit boards by blind-mating, square post type multi-pin connectors through the base plate. Orienting the RF distribution networks in a plane orthogonal to the RF circuit cards and having the heat exchangers extend into gaps between the modules serves to considerably reduce the size of the architecture.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: June 18, 2002
    Assignee: Spectrian Corporation
    Inventors: Kevin C. Gerlock, Klaas B. Bol
  • Patent number: 6392897
    Abstract: A circuit module includes a connector terminal (4A) provided on a front surface of a printed wiring board (2) and connected to a data pin (DQt) of a memory IC (3) through an interconnect line (5a). A conductive connector terminal (4c) corresponds to the connector terminal (4a) and is provided on a back surface of the printed wiring board (2). A through hole (16) extends between part of the front surface of the printed wiring board (2) where the connector terminal (4a) is formed and part of the back surface thereof where the conductive connector terminal (4c) is formed. A conductor fills the through hole (16), thereby suppressing skews resulting from a difference in interconnect line length on the circuit module and decreasing a stub capacitance to achieve the reduction in power consumption.
    Type: Grant
    Filed: August 10, 1998
    Date of Patent: May 21, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasunobu Nakase, Tsutomu Yoshimura, Yoshikazu Morooka, Naoya Watanabe
  • Patent number: 6392893
    Abstract: A method and apparatus relating to a support bracket (18) enabling hot-swapping of component trays (16) in component racks (10) is disclosed. A bracket (18) is provided for removably mounting a tray (16) in a component rack (10). The bracket (18) has two guide channels (20) extending substantially from a front end of the bracket (18) through to a back end. The guide channel (20) is adapted for sliding engagement with the component carrying tray (16). In addition, there is at least one stop guide (30) that projects from each of the front and back ends of the bracket (18). This stop guide (30) aids in positioning the bracket (18) during installation. On a backside of the bracket (18), there is a detent (32) that projects outward. The detent (32) serves as an aid in positioning and releasably holding the bracket (18) in place during installation.
    Type: Grant
    Filed: November 8, 2000
    Date of Patent: May 21, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: James M. Carney, Robert S. Antonuccio, Timothy M. Holland, Daniel D. Gonsalves, Joseph J. Montagna
  • Patent number: 6375486
    Abstract: A connector assembly comprises an edge card (4), a receptacle connector (5) and a retention mechanism (6). The edge card has an inserting portion (41) and an “L”-shaped fixing arm (42). The fixing arm has a vertical portion (420) and a downward horizontal portion (421). A gap (43) is defined between the vertical portion and the inserting portion. The receptacle connector has an insulative housing (51) defining a central slot (513), two sidewalls (512) and two external walls (516). The two sidewalls each define a recess (514) and a flute (515) defined on one bottom of the recess (514). The retention mechanism comprises a base (61) with a receiving cavity (65) therein and two connecting arms (62) extending forwardly form the base with a hook (621) on each of the connecting arm to connect with the flute firmly. The horizontal portion of the fixing arm inserts into the receiving cavity.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: April 23, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Hung-Chi Yu
  • Patent number: 6363450
    Abstract: In a computer system, an apparatus including a power supply system having a voltage regulator and a power supply for supplying an unregulated voltage to the voltage regulator. A memory connector is mounted on the motherboard. The memory connectors is configured to receive a memory module. A memory controller is mounted on the motherboard. A riser card having an edge portion configured to be received by the memory module is removably inserted into the memory connector. A riser card interface is coupled from the riser card to the power supply system and memory switch for enabling an interface-dependent voltage to be established by the voltage regulator and supplied to the memory controller. The interface-dependent voltage is supplied to the riser card through the memory connector and is maintained at a level whereby the memory connector is subjected to an electrical current less than a maximum prescribed current. A voltage modifying device is mounted on the riser card.
    Type: Grant
    Filed: March 17, 1999
    Date of Patent: March 26, 2002
    Assignee: Dell USA, L.P.
    Inventors: Steven J. Lash, Stephanus Saputro
  • Patent number: 6361327
    Abstract: An interconnect structure for connecting electrical components that includes a plurality of micromachined silicon cantilever beams. The cantilever beams are formed having a shape dictated by predetermined scaling rules that determine the mechanical and electrical properties of the cantilever beam. The cantilever beams are arranged in two generally parallel rows and are mounted to a dielectric material to form a recess between the rows. An electrical component may be inserted into the recess to create a contact force against the cantilever beams to place the component and the interconnect into electrical communication. Also, an electrical connector system may be constructed having a first electrical connector comprising a contact formed of metalized silicon and a base supporting the contact, and a second electrical connector mateable with the first electrical connector that comprises a contact formed of metalized silicon and a base supporting the contact.
    Type: Grant
    Filed: August 23, 1999
    Date of Patent: March 26, 2002
    Assignee: FCI Americas Technology, Inc.
    Inventors: Richard A. Elco, Timothy A. Lemke
  • Patent number: 6335867
    Abstract: Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: January 1, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Ishibashi, Takehisa Hayashi, Tsutomu Goto, Akira Yamagiwa, Tsuyoshi Watanabe
  • Patent number: 6328605
    Abstract: An electrical connector for electrical connection to a circuit board (12) and for receiving a module card (16) and an operating circuit card (14) comprises a dielectric housing (24) having adjacent card-receiving areas (26, 28), first electrical contacts (18, 20) mounted in the dielectric housing and having termination sections (18c, 20c) for electrical connection with conductive members of the circuit board and contact sections (18a, 20a) extending into one of the card-receiving areas (28) for electrical connection to conductive members of the module card (16) when inserted into the one of the card-receiving areas, and second electrical contacts (22) mounted in the dielectric housing and having contact portions (22b) extending into the one of the card-receiving areas (28) for electrical connection with conductive members of the module card (16) and extending into the other of the card-receiving areas (26) for electrical connection with conductive members on the operating circuit card (14) when inserted into
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: December 11, 2001
    Assignee: The Whitaker Corporation
    Inventors: Kevin E. Walker, David A. Trout, William E. Spink, Jr.
  • Publication number: 20010042329
    Abstract: Signs including electroluminescent lamps are described. In accordance with one embodiment of the present invention the electroluminescent system has an electroluminescent lamp releasably and fixedly mateable with a slide connector to provide electrical energy for the light system.. The electroluminescent lamp includes a substrate, a rear electrode, a dielectric layer, a phosphor layer, a conductive layer, and a front electrode. The lamp further includes a tab interconnect tab portion, which receives the leads from the rear electrode and front electrode, and is configured to be releasably and fixedly mated with the connector.
    Type: Application
    Filed: March 22, 2001
    Publication date: November 22, 2001
    Inventors: Matthew Murasko, Clarence H. Duttlinger
  • Patent number: 6312265
    Abstract: The present invention provides for an improved printed circuit board assembly. The connector is straddle mounted to an edge of a printed circuit board with first connector leads configured for abutment with a primary surface of the printed circuit board (PCB) and second connector leads configured for abutment with a secondary surface of the PCB. Holes are provided in the PCB between the first connector leads. The second connector leads are arranged to abut the PCB directly where the holes open on the secondary surface. Solder is deposited on only the primary surface of the PCB directly on the locations where bond formation is desired between the first connector leads and the PCB, that is, on first contact pads. Solder is deposited in the same process on the primary surface, directly above the locations where bond formation is desired between the second connector leads and the PCB, that is, directly above the second contact pads on the other surface of the PCB.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: November 6, 2001
    Assignee: Seagate Technology LLC
    Inventors: Arman Mohtar, Tiang Fee Yin
  • Patent number: 6302700
    Abstract: A circuit board defining a flange is used to interconnect conductors located on the flange with corresponding conductors of a conventional connector. The flange includes a key slot and two flange slots which promote alignment between the circuit board and the connector. The flange slots define a mouth with an angled edge which urge the connector into alignment with the flange slots.
    Type: Grant
    Filed: September 10, 1999
    Date of Patent: October 16, 2001
    Assignee: Tellabs Operations, Inc.
    Inventors: Surrinder S. Puri, John P. Dorth, Marc E. Krause
  • Patent number: 6299455
    Abstract: A stacked electrical card connector assembly comprises upper and lower headers, a number of terminals extending through the headers, upper and lower grounding plates respectively attached to the upper and lower headers, and a transition device attached to the headers and mounted to a PCB. Each grounding plate comprises a pair of grounding legs downwardly extending from a front edge thereof. The transition device includes male and female transition connectors connected with each other. The male transition connector defines two rows of passageways for extension of the terminals retained in the headers, and a pair of receiving holes respectively on opposite ends of each row of the passageways for extension of the grounding legs therethrough. The female transition connector comprises two rows of signal contacts for connecting with the terminals retained in the headers, and a pair of grounding contacts on each end of each row of the signal contacts for engaging the corresponding grounding leg.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: October 9, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Shun-Chi Dong
  • Patent number: 6296499
    Abstract: A signal connector assembly with a plug contact within a plug having a high resistive portion. When the plug of the assembly first makes contact with the electrical receptacles within a mating receptacle, the high resistive portion prevents a current surge. As the plug is further inserted into the receptacle, the energy passing from the plug to the receptacle is gradually increased. Eventually, the receptacle contacts within the receptacle pass the high resistive portion and make contact with the conductive portion of the plug contact, thereby permitting transmission of valid signals without the generation of spurious errors.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: October 2, 2001
    Assignee: The Whitaker Corporation
    Inventors: Henry Otto Hermann, Jr., Marjorie Kay Myers
  • Publication number: 20010021606
    Abstract: An IC card connector comprising a housing having plural connector terminals, guide frames disposed opposedly to each other at both side portions of the housing and having guide grooves in which an IC card to be connected to the connector terminals is inserted and held, an insertion port defined by the guide frames for insertion therein of the IC card, and shutter members for opening and closing the insertion port, wherein a thin-walled cutout recess is formed on the surface side of each of the shutter members for preventing abutment of the shutter member against an expanded portion formed on the surface or the back of the IC card when inserted into the insertion port.
    Type: Application
    Filed: March 6, 2001
    Publication date: September 13, 2001
    Applicant: Alps Electric Co., Ltd
    Inventors: Atsushi Uchiyama, Toru Wagatsuma
  • Patent number: 6285563
    Abstract: A support bracket, which can be used in a method of reinforcing a printed circuit board, secures the printed circuit board, such as a backplane having a plurality of electrical connectors that engage corresponding electrical connectors of daughter boards. The support bracket includes a cross member attachable to the printed circuit board in a direction substantially transverse to a direction of motion of the daughter boards. The support bracket also includes first and second end support members attached transversely to the cross member at corresponding ends of the cross member. The end support members are fixable to a support surface and are adapted to secure the support bracket in the direction of motion of the daughter boards.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: September 4, 2001
    Assignee: EMC Corporation
    Inventors: Erik Nelson, Edward Claprood, Paul T. Tirrell
  • Patent number: 6285432
    Abstract: A liquid crystal display (LCD) assembly (200) includes an LCD (100), a registration member (206) attached to the LCD and a connector (202). The connector defines a slot (208) sized to receive the edge (106) of the LCD and a channel (204) positioned to receive the registration member. In one embodiment, the registration member is an inactive electrical component placed on the surface of the LCD solely to provide registration for the connector. The electrical component is very inexpensive and greatly reduces the opportunity for misalignment.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: September 4, 2001
    Assignee: Ericsson Inc.
    Inventor: John Charles Phillips
  • Patent number: 6281449
    Abstract: A printed board (5) for mounting electronic component, a method for making the same, and an arrangement for connecting a conductive elements (8, 8′) to the printed board are provided. The printed board includes an insulating substrate (50), and at least one metal terminal (53, 54). The substrate is formed with at least one opening (51, 52) penetrating the substrate. The metal terminal is fixed to the substrate so as to bridge the opening, without projecting out of the substrate.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: August 28, 2001
    Assignee: Rohm Co., Ltd.
    Inventors: Satoshi Nakamura, Masaharu Tanaka
  • Patent number: 6265051
    Abstract: Disclosed are edge contacts for printed circuit boards comprising a copper lead coated with conductive ink comprising a binder and graphite powder, carbon black, and silver flakes. Also disclosed are printed circuit boards containing the contacts and methods for manufacturing the contacts and circuit boards.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: July 24, 2001
    Assignee: 3Com Corporation
    Inventor: Denis Jean
  • Patent number: 6247937
    Abstract: Provided is a system to reduce the force required for inserting a circuit board assembly including a plurality of circuit boards into the card edge connectors. A circuit board assembly includes a first circuit board, a second circuit board and a coupling part. The first circuit board includes printed circuit elements and a connecting part. In the same manner as the first circuit board, the second circuit board includes printed circuit elements and a connecting part. The front edge of the connecting parts are shifted from the front edge of the other connecting part by a distance “d” along the connecting or inserting direction of the circuit boards toward the card edge connectors, so that the distance between the front edge of the connecting part of the first circuit board and the first card edge connector differs from the distance between the front edge of the connecting part of the second circuit board and the second card edge connector.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: June 19, 2001
    Assignee: International Business Machines Corporation
    Inventors: Yohichi Miwa, Masaru Terada, Tomoaki Kimura
  • Patent number: 6247078
    Abstract: An interface includes an enclosure having a plurality of walls interconnected to form a parallelepiped having a space therein. The enclosure is positionable to occupy a plurality of slots located in a computer housing of a first type computer. The enclosure has a width corresponding essentially to a total width of the plurality of slots. The interface further includes a computer subsystem of a second type computer disposed within the space of the enclosure. The computer subsystem includes a circuit card, and a distribution card attached to, and electrically coupled with, the circuit card. The distribution card is connectable to a backplane of the first type computer located external to the enclosure and within the computer housing.
    Type: Grant
    Filed: February 4, 1998
    Date of Patent: June 12, 2001
    Assignee: International Business Machines Corporation
    Inventors: William S. Ebert, Robert Francis Lusch, Kevin Robert Qualters, Terry Leo Sobotta, John E. Swenson
  • Patent number: 6243249
    Abstract: An electronic assembly is provided that has a housing receiving a motherboard arranged, in use, to carry control circuit components, and a circuit board carrying a lightning strike protection circuit, said circuit board including a first electrical connector, and the assembly further including a flexible cable electrically connected to the motherboard, the cable including a second electrical connector arranged to cooperate with said first electrical connector to electrically connect the lightning strike protection circuit to the motherboard, said first and second connectors being accessible from outside of the housing. The assembly may be used in aerospace applications.
    Type: Grant
    Filed: May 14, 1999
    Date of Patent: June 5, 2001
    Assignee: Lucas Industries plc
    Inventors: Brian Frederick Farman, Steven John Webster
  • Patent number: 6239984
    Abstract: A backplane circuit board for an electronic chassis includes a bracket and an upper circuit board operatively connected to the bracket. A lower circuit board is also operatively connected to the bracket wherein the upper circuit board is offset from the lower circuit board and the upper circuit board is parallel to the lower circuit board.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: May 29, 2001
    Assignee: 3Com Corporation
    Inventors: Amir Koradia, Philip A. Ravlin, Douglas J. Pogatetz, Gerald A. Greco
  • Patent number: 6234807
    Abstract: A printed circuit board connector edge tab design has increased tab contact area with a large local capacitance at the connector interface. This serves to balance out the inductive effects of the connector and results in a lower overall channel impedance at the interface. The invention replaces the prior art plated pathway to the upper row of tabs with wider tabs on the lower row. The edges of the lower row tabs are spaced such that each of the connector pins destined for the upper row straddle two of the lower tabs as they travel upward. This design prevents the pins from contacting the fiberglass substrate of the board while it traverses the lower row of tabs. The absence of the prior art plated pathways allows each of the lower row tabs to be expanded into the space formerly occupied by the pathways. This design also allows the increased capacitive area of the edge tabs to be located in very close proximity to the connection area between the connector pins and the edge tabs.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: May 22, 2001
    Assignee: International Business Machines Corporation
    Inventors: Kamran Amini, Joseph Curtis Diepenbrock, Robert J. Evans, Mike L. Scollard, Marcel B. Tran
  • Patent number: 6227867
    Abstract: A connector assembly comprises a straddle connector including a dielectric housing having a front face forming an island section and a rear face opposite the island section. Upper and lower rows of terminals are embedded within the housing. Each terminal includes a connecting section extending to the island section and a tail section extending beyond the rear face. A retaining slot is defined between the upper and lower rows of tail sections. A PCB having upper and lower rows of golden fingers is inserted into the retaining slot. Each golden finger of one of the upper and lower rows is coated with solder paste. A row of holes is defined in the PCB adjacent to the golden fingers. Each hole is aligned with the extension of the corresponding terminal and has a solder drop disposed therein.
    Type: Grant
    Filed: February 3, 1999
    Date of Patent: May 8, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Spencer Chen, Craig Li
  • Patent number: 6163464
    Abstract: Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: December 19, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Ishibashi, Takehisa Hayashi, Tsutomu Goto, Akira Yamagiwa, Tsuyoshi Watanabe
  • Patent number: 6154373
    Abstract: Secondary backplane boards are secured to a main backplane board to provide interconnection paths in a direction transverse to interconnection paths provided on the main backplane board, so that current manufacturing capabilities of multi-layer backplane boards are not exceeded.
    Type: Grant
    Filed: March 24, 1999
    Date of Patent: November 28, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Andrew C. Durston, Liang Hwang, Hector F. Rodriguez
  • Patent number: 6144560
    Abstract: A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: November 7, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Walter L. Moden, Larry D. Kinsman
  • Patent number: 6135781
    Abstract: An interconnection providing multiple electrical interconnections at a fine pitch can be formed in a pluggable and unpluggable form using multiple connector channels and rows of contact elements in each of a plug and socket. The contacts may be a mixture of active and passive contacts. Furthermore, a contact support structure may provide improve spring characteristics in the contacts. The contacts may be formed in a number of configurations including vertical staggering, alternating or offset patterns, mulit-level tail exit designs, rotated contacts, staggered or nonalign retention features and dedicated power contacts. Anchors or permanent latches, separable latches, and polarization keys may also be utilized. Alternative embodiments may include straddlemount and attachment clip embodiments.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: October 24, 2000
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Richard A. Pope, Thomas M. Cherney, David S. Hardcastle
  • Patent number: 6128200
    Abstract: A butt-joint CPU mounting structure includes a connector having two opposite faces. Each face has a receiving slot disposed therein adapted to respectively and receivingly engage with a CPU module and an edge of a main board of a computer thereby connecting the CPU module to the main board. The receiving slots are arranged in alignment with each other whereby the CPU module is substantially coplanar with the main board. A CPU holder includes two support members each defining a channel for receiving opposite side flanges of the connector. Bolts are used to secure the support members to the side flanges of the connector. The CPU module is received between the two support members whereby opposite edges of the CPU module are engaged and supported by the support members. A connection member is connected between the two support members for strengthening the mechanical structure thereof. The support members are provided with bolt holes through which bolts extend for engaging with a housing of the computer.
    Type: Grant
    Filed: February 18, 1999
    Date of Patent: October 3, 2000
    Inventor: Ho-Kang Chu
  • Patent number: 6097883
    Abstract: A printed circuit card having first and second circuit units mounted thereon in connection to terminal pads adjacent two card edges, with the first and second circuit units being in connection to each other and to select pads of a first edge such that upon insertion of that edge into a given card socket, both circuit units are enabled, and the circuit units also being in connection to the pads of a second edge such that upon insertion of that edge into a second card socket, only the second circuit unit is enabled. In the preferred embodiment, the card is a memory module card having buffer and memory circuit units designed to cooperate with each other and with either of standard, buffered or unbuffered memory card sockets in a system board in accordance with insertion of a first or second pad edge in one of the card sockets to automatically provide, either combined circuit unit operation, or single circuit operation. The invention is also applicable to clocked register circuits and series pass devices.
    Type: Grant
    Filed: July 8, 1997
    Date of Patent: August 1, 2000
    Assignee: International Business Machines Corporation
    Inventors: Timothy Jay Dell, Mark William Kellogg, Bruce Gerard Hazelzet